CN109686677A - A kind of semiconductor processing equipment - Google Patents
A kind of semiconductor processing equipment Download PDFInfo
- Publication number
- CN109686677A CN109686677A CN201710980156.4A CN201710980156A CN109686677A CN 109686677 A CN109686677 A CN 109686677A CN 201710980156 A CN201710980156 A CN 201710980156A CN 109686677 A CN109686677 A CN 109686677A
- Authority
- CN
- China
- Prior art keywords
- offset
- processing equipment
- semiconductor processing
- wafer
- displacement
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67745—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber characterized by movements or sequence of movements of transfer devices
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention provides a kind of semiconductor processing equipment, comprising: transmission cavity, the transmission arm equipped with displacement governor and for transmitting wafer, displacement governor are connected with transmission arm, for adjusting the position of transmission arm；Process cavity is equipped with displacement sensor and technique component, wherein technique component is used to carry the wafer that transmission arm is sent into, and wafer is driven to rotate, and displacement sensor is used for the offset of detection process component；Recording controller regulates and controls displacement governor for receiving the offset of displacement sensor transmission, and according to offset；The wafer quality of preparation can be improved in the present invention；Staff can find the problem in time reduces crash rate；The continuous increase due to offset is avoided to cause the damage of board component；Reduce the problem of board as caused by technique component positional shift shuts down investigation rate and reduces maintenance time and reduce maintenance difficulty.
Description
Technical field
The present invention relates to field of semiconductor processing, more particularly to a kind of semiconductor processing equipment.
Background technique
The most widely used manufacturing technology includes physical gas phase deposition technology in semiconductive thin film manufacturing process
(Physical Vapor Deposition, PVD) and chemical vapour deposition technique (Chemical Vapor Deposition,
CVD), semiconductive thin film manufacturing process is chemically reacted or is deposited generation film on the surface of a substrate and semiconductor is fast
Fast high-temperature thermal annealing technique (Rapid Thermal Process, RTP).
Existing one kind partly leads process equipment as shown in Figure 1, the equipment is mainly made of transmission cavity 101 and process cavity 102.
There is the technique component 103 for driving wafer rotation, which promotes wafer in reaction chamber 102 in its process cavity 102
Thermally equivalent is to form good film.But since its technique component 103 is to drive wafer rotation by mechanical drive mode,
Therefore the offset of position can occur for technique component, and this offset will lead to the wafer and be located at work that following transfer cavities 101 are transmitted
Technique component 103 in skill chamber 102 generates offset.
Fig. 2 show a kind of existing semiconducter process flow chart.After equipment starts production, wafer be according to batch
Secondary carry out volume production after the completion of each batch, will do it sampling observation with testing product quality.If the product of sampling observation does not have quality problems
Continue to produce, stops producing if the product inspected by random samples is there are quality problems, investigate the cause, then board is repaired.
Therefore, existing semiconductor processing equipment has the disadvantages that the offset of position can occur for wafer and technique component, should
Offset is so that wafer thickness is uneven and generation micro dust particle is to influence wafer quality；Staff cannot find the problem in time and make
At the promotion of crash rate；The continuous increase of offset causes board components damage；Staff investigates the cause that time-consuming waste machine
Platform effective rate of utilization；And difficulty big problem when board being caused to repair.
Based on the above, high quality wafer and the semiconductor processing equipment with high efficiency can be prepared by providing one kind
It is necessary.
Summary of the invention
In view of the foregoing deficiencies of prior art, the purpose of the present invention is to provide a kind of semiconductor processing equipments, use
In solving, wafer thickness prepared in the prior art is uneven and generation micro dust particle is to influence wafer quality；Staff is not
It can find the problem in time and cause the promotion of crash rate；The continuous increase of offset causes board components damage；Staff's investigation
Reason time-consuming waste board effective rate of utilization；And difficulty big problem when board being caused to repair.
In order to achieve the above objects and other related objects, the present invention provides a kind of semiconductor processing equipment, comprising:
Transmission cavity, the transmission cavity are equipped with displacement governor and the transmission arm for transmitting wafer, and the displacement is adjusted
Device is connected with the transmission arm, for adjusting the position of the transmission arm；
Process cavity, the process cavity are equipped with displacement sensor and technique component, wherein the technique component is for carrying institute
The wafer that transmission arm is sent into is stated, and the wafer is driven to rotate, institute's displacement sensors are for detecting the technique component
Offset；
Recording controller, the recording controller are used to receive the offset of institute's displacement sensors transmission, and root
Regulate and control the displacement governor according to the offset.
Preferably, the adjusting direction of the transmission arm includes X-direction and the Y-direction vertical with the X-direction, the X
Direction and the Y-direction are located at same level.It is located at it so that the transmission arm can freely be debugged in same level
The wafer position of top.
Preferably, the position adjustable range of the transmission arm is on the horizontal plane that the X-direction and the Y-direction are constituted
Maximum displacement value be less than 2mm.The adjustable range is enough to compensate the offset of the technique component.
Preferably, the process cavity is additionally provided with heating device, and the heating device is located above the technique component.
Preferably, the heating device area is N times of the technique component area, N > 1.Existed with meeting technique component
When with micro offset, the heating device can still cover the wafer being positioned above, so that wafer is heated evenly.
Preferably, the center of institute's displacement sensors, the technique component, the heating device and the process cavity is located at
On straight line.
Preferably, the technique component drives the wafer to rotate using magnetic suspension mode.Which has mechanical wear
It is small, low energy consumption, noise is small, the service life is long, without lubrication, without oily pollution the advantages that.
Preferably, the recording controller has display.The display can intuitively show the flat of the offset
Face displacement coordinate facilitates debugging of the staff to board.
Preferably, the offset is changed into digital value and is sent to the recording controller by institute's displacement sensors.
Preferably, the semiconductor processing equipment further includes warning device, and the warning device is connected to the data control
Device processed.The warning device can remind staff's unit exception in time, to take corresponding measure to reduce loss in time, improve and produce
Quality.
Preferably, the warning device includes combined aural and visual alarm, and the combined aural and visual alarm is according to the difference of the offset
Color and sound with different light.The combined aural and visual alarm can be simultaneously emitted by sound and light reminds staff, have and compare
Intuitive effect.
Preferably, when the offset is greater than preset value, the recording controller starts the combined aural and visual alarm.
Preferably, when the offset is in the first range, the displacement governor automatically adjusts the transmission arm
Corresponding position；When the offset is in the second range, the displacement governor promotes the transmission arm to stop working；It is described
The lower limit value of second range is greater than the upper limit value of first range.When the offset is in the first range, positioned at the biography
Send the wafer above arm that can adjust, therefore, the crystal circle center and the technique with the adjust automatically of the transmission arm
Component center is overlapped and is located in the effective range of the heating device.When the offset is in the second range, the transmission
After wafer above arm is with the transmission arm adjust automatically, the wafer position exceeds the heating device effective range,
So that the wafer uneven heating is even；The position of the technique component exceeds its operational envelope.Therefore, the biography need to be stopped
Send the work of arm.
As described above, semiconductor processing equipment of the invention, has the advantages that the present invention installs in process cavity
Offset is converted to digital value and is sent to data control by displacement sensor by displacement sensor characterization processes component drift amount
Device processed is shown on the display of recording controller simultaneously, and the digital value received transmission is sent to be located at and be passed by recording controller
The displacement governor on arm is sent to adjust or stop the work of transmission arm, and starts warning device simultaneously, to warn work
Make personnel and takes corresponding measure in time.Above-mentioned semiconductor processing equipment can prepare wafer in homogeneous thickness and reduce micro- in process cavity
Grit is to improve wafer quality；Staff can find the problem in time reduces crash rate；It avoids continuous due to offset
Increase the damage for causing board component；It is effective to reduce the long raising board of the board downtime as caused by technique component positional shift
Utilization rate；And the problem of reducing maintenance difficulty.
Detailed description of the invention
Fig. 1 is shown as a kind of structural schematic diagram of semiconductor processing equipment in the prior art.
Fig. 2 is shown as a kind of semiconducter process flow diagram in the prior art.
Fig. 3 is shown as the structural schematic diagram of semiconductor processing equipment of the invention.
Fig. 4 is shown as the part-structure side view of semiconductor processing equipment of the invention.
Fig. 5 is shown as semiconducter process flow diagram of the invention.
Component label instructions
101,201 transmission cavity
102,202 process cavity
103,203 technique component
204 cavity doors
205 transmission arms
206 displacement governors
207 wafers
208 heating devices
209 displacement sensors
210 recording controllers
211 displays
212 warning devices
Specific embodiment
Illustrate embodiments of the present invention below by way of specific specific example, those skilled in the art can be by this specification
Other advantages and efficacy of the present invention can be easily understood for disclosed content.The present invention can also pass through in addition different specific realities
The mode of applying is embodied or practiced, the various details in this specification can also based on different viewpoints and application, without departing from
Various modifications or alterations are carried out under spirit of the invention.
Please refer to Fig. 3-Fig. 5.It should be noted that diagram provided in the present embodiment only illustrates this hair in a schematic way
Bright basic conception, only shown in schema then with related component in the present invention rather than component count when according to actual implementation,
Shape and size are drawn, when actual implementation kenel, quantity and the ratio of each component can arbitrarily change for one kind, and its component
Being laid out kenel may also be increasingly complex.
As shown in figure 3, the present invention provides a kind of semiconductor processing equipment, comprising: transmission cavity 201, process cavity 202 and data
Controller 210, in which: the transmission cavity 201 is equipped with displacement governor 206 and the transmission arm 205 for transmitting wafer 207,
The displacement governor 206 is connected with the transmission arm 205, for adjusting the position of the transmission arm 205；The technique
Chamber 202 is equipped with displacement sensor 209 and technique component 203, wherein the technique component 203 is for carrying the transmission arm
205 wafers 207 being sent into, and the wafer 207 is driven to rotate, institute's displacement sensors 209 are for detecting the technique
The offset of component 203；There is cavity door 204, the transmission arm 205 between the transmission cavity 201 and the process cavity 202
The technique component wafer 207 being positioned above being sent to through the cavity door 204 in the process cavity 202
In 203；The recording controller 210 is used to receive the offset of the transmission of institute's displacement sensors 209, and according to described inclined
Shifting amount regulates and controls the displacement governor 206.
As an example, the adjusting direction of the transmission arm 205 includes X-direction and the Y-direction vertical with the X-direction,
The X-direction and the Y-direction are located at same level.So that the transmission arm 205 can freely be adjusted in same level
Try the position for the wafer 207 being positioned above.
As an example, the process cavity 202 is installed with heating device 208, the heating device 208 is located at the technique groups
203 top of part.As shown in figure 4, being shown as the part-structure side view of semiconductor processing equipment of the invention.
As an example, the area of the heating device 208 is N times of 203 area of technique component, N > 1.This implementation
In example, the area of the heating device 208 is 2 times of 203 area of technique component.The area of the heating device 208 can
It effectively covers the technique component 203 and its range that the offset is covered, is located on the technique component 203 with meeting
The wafer 207 of side still can receive enough heats in the offset ranges, so that the wafer 207 is heated equal
It is even, ensure the quality of the wafer 207.
As an example, the horizontal plane that the position adjustable range of the transmission arm is constituted in the X-direction and the Y-direction
On maximum displacement value be less than 2mm.The adjustable range is enough to compensate the offset of the technique component 203.
As an example, the offset ranges are divided into not homotype according to the quality of the wafer 207 produced
It encloses, the recording controller 210 will implement different instruction according to the different offset ranges grades, start the displacement and adjust
Device 206 and the warning device 212.
As an example, the displacement governor 206 automatically adjusts the transmission hand when the offset is in the first range
The corresponding position of arm 205；When the offset is in the second range, the displacement governor 206 promotes the transmission arm 205
It stops working；The lower limit value of second range is greater than the upper limit value of first range.In the present embodiment, the offset
First range is the value of the offset in the region for being less than 2mm, and the second range of the offset is the value of the offset
In the region for being more than or equal to 2mm.When the offset is in the first range, positioned at the crystalline substance transmitted above arm 205
Circle 207 can adjust, therefore, the center of the wafer 207 and the technique component with the adjust automatically of the transmission arm 205
203 center is overlapped and is located in the effective range of the heating device 208, so that the wafer 207 is heated evenly, the work
Without micro dust particle in skill chamber 202, to improve the quality of the wafer 207, preparation meets the wafer 207 of quality requirement；
When the offset is in the second range, the wafer 207 of 205 top of transmission arm with the transmission arm 205 oneself
After dynamic adjustment, the position of the wafer 207 exceeds 208 effective range of heating device, so that 207 uneven heating of the wafer
Even, the position of the technique component 203 exceeds its operational envelope, may cause the damage of board component, therefore, needs to stop
The work of the transmission arm 205.
As an example, the technique component 203 drives the wafer 207 to rotate using magnetic suspension mode.Which has
Mechanical wear is small, low energy consumption, noise is small, the service life is long, without lubrication, without oily pollution the advantages that.In the present embodiment, the technique groups
Part 203 includes edge ring, support cylinder and magnetic suspension rotor.The edge ring is located at 203 upper surface of technique component and tool
There is recess, the recess loads the wafer 207 into the edge ring.The magnetic suspension rotor drives the support cylinder
And edge ring rotation, therefore, the technique component 203 can load the wafer 207 and equably be rotated with constant speed.By institute
Stating wafer 207 cannot be installed in the technique component 203 using fixed device, and the technique component 203 is carried out for a long time
When rotation, offset can be generated, the offset is unfavorable for the quality of the wafer 207.
As an example, institute's displacement sensors 206, the technique component 203, the heating device 208 and the technique
The center of chamber 202 is located in a straight line.
Specifically, institute's displacement sensors 209 can be set in the 203 central lower position of technique component or the work
202 side wall of skill chamber.In the present embodiment, institute's displacement sensors 209 are located at the 203 central lower position of technique component.It is described
Displacement sensor 209 is non-contact displacement transducer, it is preferable that institute's displacement sensors 209 use photo-electric displacement sensing
Device, according to measurand stop luminous flux number come the displacement or geometric dimension of measurement object.
As an example, the recording controller 210 has display 211.Institute's displacement sensors 209 are connected to the number
According to controller 210.The display 211 can show the offset data of the offset.
It is sent to as an example, the offset of the technique component 203 is changed into digital value by institute's displacement sensors 209
In recording controller 210.
In the present embodiment, the display 211 can intuitively show that the offset data in-plane displancement of the offset is sat
Mark, facilitates debugging of the staff to board.The installation position of the recording controller 210 is not construed as limiting.The display 211
It is installed in the position for facilitating staff to check, specific location is with no restriction.
As an example, the semiconductor processing equipment further includes warning device 212, the warning device 212 is connected to institute
State recording controller 210.The warning device 212 can remind staff's unit exception in time, accordingly arrange to take in time
It applies reduction loss and improves product quality.
As an example, the warning device 212 includes any one in combined aural and visual alarm, sound alarm subsystem and light crossing-signal
Kind.In the present embodiment, the warning device 212 preferably uses combined aural and visual alarm, and the combined aural and visual alarm is according to the offset
Difference there is different alarm signals, such as the light and different volume, frequency, the sound (2) of sound effect of (1) different colours are different
The light of color and identical volume, frequency, sound effect sound (3) same color light and different volumes, frequency, sound effect sound.
The combined aural and visual alarm can be simultaneously emitted by sound and light reminds staff, have more intuitive effect.
As an example, the recording controller 210 starts the sound-light alarm when the offset is greater than preset value
Device.In the present embodiment, the preset value is 0, i.e., when lower limit value of the offset in first range, the data control
Device 210 processed starts the combined aural and visual alarm, plays the role of pre- prompting.Those skilled in the art can also be according to actual production need
Ask the change preset value to the lower limit value of second range, i.e., the described offset is in second range, the acousto-optic
Alarm is just applied, to play the role of warning.In embodiment, the combined aural and visual alarm is in first range and described second
Different light and alternative sounds are issued in range, specific acousto-optic type is with no restriction.
As shown in figure 5, being shown as semiconducter process flow diagram of the invention.In production process, when described half
When conductor process equipment is started to work, institute's displacement sensors 209 detect the offset of the technique component 203 first,
And the offset is converted into digital value and is transferred to the recording controller 210, the recording controller 210 is by the offset
Quantization is divided into first range and second range.
When the offset ranges are first range, the recording controller 210 starts the warning device
212, and enter warning device program 1 or the recording controller 210 and directly initiate the displacement governor 206, described in adjusting
Arm 205 is transmitted, continues to produce.
When the offset ranges are second range, the recording controller 210 starts the warning device
212, and enter warning device program 2, meanwhile, start the displacement governor 206, stop the work of the transmission arm 205,
The technical staff carries out board maintenance according to the data that the recording controller 210 is transferred to the display 211.
In conclusion semiconductor processing equipment of the invention, installs displacement sensor in process cavity, pass through displacement sensing
Offset is converted to digital value and is sent to recording controller while being shown in recording controller by device characterization processes component drift amount
On display, the digital value received transmission is issued the displacement governor being located on transmission arm to adjust by recording controller
Or stop the work of transmission arm, and start warning device simultaneously, to warn staff to take corresponding measure in time.Above-mentioned half
Conductor process equipment can prepare wafer in homogeneous thickness and reduce micro dust particle in process cavity to improve wafer quality；Work people
Member can find the problem in time and reduce crash rate；The continuous increase due to offset is avoided to cause the damage of board component；Reduce by
Board downtime caused by technique component positional shift is long to improve board effective rate of utilization；And reduce asking for maintenance difficulty
Topic, so, the present invention effectively overcomes various shortcoming in the prior art and has high industrial utilization value.
The above-described embodiments merely illustrate the principles and effects of the present invention, and is not intended to limit the present invention.It is any ripe
The personage for knowing this technology all without departing from the spirit and scope of the present invention, carries out modifications and changes to above-described embodiment.Cause
This, institute is complete without departing from the spirit and technical ideas disclosed in the present invention by those of ordinary skill in the art such as
At all equivalent modifications or change, should be covered by the claims of the present invention.
Claims (13)
1. a kind of semiconductor processing equipment characterized by comprising
Transmission cavity, the transmission cavity be equipped with displacement governor and the transmission arm for transmitting wafer, the displacement governor with
The transmission arm is connected, for adjusting the position of the transmission arm；
Process cavity, the process cavity are equipped with displacement sensor and technique component, wherein the technique component is for carrying the biography
The wafer for sending arm to be sent into, and the wafer is driven to rotate, institute's displacement sensors are used to detect the offset of the technique component
Amount；
Recording controller, the recording controller are used to receive the offset of institute's displacement sensors transmission, and according to institute
It states offset and regulates and controls the displacement governor.
2. semiconductor processing equipment according to claim 1, it is characterised in that: the adjusting direction of the transmission arm includes
X-direction and the Y-direction vertical with the X-direction, the X-direction and the Y-direction are located at same level.
3. semiconductor processing equipment according to claim 2, it is characterised in that: the position adjustable range of the transmission arm
Maximum displacement value on the horizontal plane that the X-direction and the Y-direction are constituted is less than 2mm.
4. semiconductor processing equipment according to claim 1, it is characterised in that: the process cavity is additionally provided with heating device,
The heating device is located above the technique component.
5. semiconductor processing equipment according to claim 4, it is characterised in that: the heating device area is the technique
N times of component area, N > 1.
6. semiconductor processing equipment according to claim 5, it is characterised in that: institute's displacement sensors, the technique groups
The center of part, the heating device and the process cavity is located in a straight line.
7. semiconductor processing equipment according to claim 1, it is characterised in that: the technique component uses magnetic suspension mode
The wafer is driven to rotate.
8. semiconductor processing equipment according to claim 1, it is characterised in that: the recording controller has display.
9. semiconductor processing equipment according to claim 1, it is characterised in that: institute's displacement sensors are by the offset
It is changed into digital value and is sent to the recording controller.
10. semiconductor processing equipment according to claim 1, it is characterised in that: the semiconductor processing equipment further includes
Warning device, the warning device are connected to the recording controller.
11. semiconductor processing equipment according to claim 10, it is characterised in that: the warning device includes sound-light alarm
Device.
12. semiconductor processing equipment according to claim 11, it is characterised in that: when the offset is greater than preset value
When, the recording controller starts the combined aural and visual alarm.
13. semiconductor processing equipment according to claim 1, it is characterised in that: when the offset is in the first range,
The displacement governor automatically adjusts the corresponding position of the transmission arm；When the offset is in the second range, institute's rheme
Moving adjuster promotes the transmission arm to stop working；The lower limit value of second range is greater than the upper limit of first range
Value.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710980156.4A CN109686677A (en) | 2017-10-19 | 2017-10-19 | A kind of semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710980156.4A CN109686677A (en) | 2017-10-19 | 2017-10-19 | A kind of semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109686677A true CN109686677A (en) | 2019-04-26 |
Family
ID=66183056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710980156.4A Pending CN109686677A (en) | 2017-10-19 | 2017-10-19 | A kind of semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109686677A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216636A (en) * | 2020-08-27 | 2021-01-12 | 西安奕斯伟硅片技术有限公司 | Wafer epitaxial reaction equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070004058A1 (en) * | 2005-07-04 | 2007-01-04 | Heok-Jae Lee | Semiconductor manufacturing device with transfer robot |
| CN102210017A (en) * | 2008-11-06 | 2011-10-05 | 应用材料股份有限公司 | Rapid thermal processing chamber with micro-positioning system |
| CN103208449A (en) * | 2012-01-13 | 2013-07-17 | 旺宏电子股份有限公司 | Device, method and system for aligning wafer on support seat |
| CN104505353A (en) * | 2014-12-22 | 2015-04-08 | 杭州立昂微电子股份有限公司 | Device and method for monitoring dislocation of loaded wafer of flat plate type epitaxial furnace |
-
2017
- 2017-10-19 CN CN201710980156.4A patent/CN109686677A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20070004058A1 (en) * | 2005-07-04 | 2007-01-04 | Heok-Jae Lee | Semiconductor manufacturing device with transfer robot |
| CN102210017A (en) * | 2008-11-06 | 2011-10-05 | 应用材料股份有限公司 | Rapid thermal processing chamber with micro-positioning system |
| CN103208449A (en) * | 2012-01-13 | 2013-07-17 | 旺宏电子股份有限公司 | Device, method and system for aligning wafer on support seat |
| CN104505353A (en) * | 2014-12-22 | 2015-04-08 | 杭州立昂微电子股份有限公司 | Device and method for monitoring dislocation of loaded wafer of flat plate type epitaxial furnace |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112216636A (en) * | 2020-08-27 | 2021-01-12 | 西安奕斯伟硅片技术有限公司 | Wafer epitaxial reaction equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TW556282B (en) | CMP process involving frequency analysis-based monitoring | |
| TWI390635B (en) | Temperature uniformity measurements during rapid thermal processing | |
| US20120315826A1 (en) | Device and Method for Measuring Physical Parameters of Slurry and Chemical Mechanical Polishing Apparatus Comprising the Device | |
| CN104505353A (en) | Device and method for monitoring dislocation of loaded wafer of flat plate type epitaxial furnace | |
| CN103091521A (en) | Method of probe and lead foot automatic aiming and probe station testing system thereof | |
| KR20150026930A (en) | Apparatus and method for double-side polishing of work | |
| TWI541510B (en) | Can improve the detection efficiency of the point measurement method | |
| CN109321887B (en) | Device and method for monitoring and preparing large-size uniform film by utilizing multipoint reflectivity | |
| WO2023072180A1 (en) | Semiconductor processing device and method for monitoring wafer position status | |
| CN109686677A (en) | A kind of semiconductor processing equipment | |
| CN112458407B (en) | Crystal oscillator measurement system, crystal oscillator measurement method and crystal oscillator measurement device | |
| CN105655278A (en) | Wafer dimension online adjustable prealignment apparatus | |
| CN208674076U (en) | Cassette pedestal and furnace tube apparatus | |
| KR101949159B1 (en) | Scribe apparatus and apparatus for cutting panel and method for scribing panel | |
| CN204271041U (en) | Wafer detecting apparatus | |
| CN104979228A (en) | Film thickness control method and semiconductor processing device | |
| CN103972139B (en) | It is a kind of to improve the calibration method of wafer spike annealing homogeneity | |
| CN204286373U (en) | Pcb board warpage automatic testing equipment | |
| US6449530B1 (en) | Semiconductor wafer carrier, semiconductor wafer carrier automatic transfer system and method for producing a semiconductor device | |
| CN209486011U (en) | A kind of x-ray detection platform | |
| CN208902048U (en) | A kind of vision-based detection integration module | |
| CN207832111U (en) | A kind of Bending Deformation detection device | |
| CN206540535U (en) | A kind of detecting device for smoothness | |
| CN204303761U (en) | A kind of slide glass dislocation monitoring device of flat epitaxial furnace | |
| CN104655042B (en) | Contact-type surface profile meter with function of realizing sample temperature change |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20190426 |
|
| WD01 | Invention patent application deemed withdrawn after publication |