CN109631636A

CN109631636A - The production method and electronic equipment of a kind of thin type heat pipe, thin type heat pipe

Info

Publication number: CN109631636A
Application number: CN201811527567.9A
Authority: CN
Inventors: 张军; 刘用鹿; 靳林芳; 袁志; 杨果
Original assignee: Huawei Technologies Co Ltd
Current assignee: Honor Device Co Ltd
Priority date: 2018-12-13
Filing date: 2018-12-13
Publication date: 2019-04-16
Anticipated expiration: 2038-12-13
Also published as: WO2020119436A1; CN109631636B; CN113686186A

Abstract

This application provides a kind of thin type heat pipe, the production method of thin type heat pipe and electronic equipments.Wherein, which includes the tube body with cavity, and tube body both ends include convergent part, and the cavity cross-sectional area of convergent part is gradually reduced to the direction far from body central, and closed sealing is formed in tube body end；Capillary structure and working medium are provided in cavity.Thus, the entire tubular body of thin type heat pipe all has cavity, compared with other are with the heat pipe of draw structure, when tube length is identical, cavity volume is bigger, length is longer, more capillary structures and working medium can be accommodated, and the cycling distance of working medium is longer, be conducive to the condensation effect for improving working medium, the capacity of heat transmission for improving heat pipe, keeps thin type heat pipe heat dissipation performance more preferable.When the thin type heat pipe of the application is applied in the chip cooling design of the electronic products such as mobile phone, tablet computer, it can be effectively reduced chip temperature, chip avoided to occur reducing frequency phenomenon at high temperature, chip performance is made to be not fully exerted.

Description

The production method and electronic equipment of a kind of thin type heat pipe, thin type heat pipe

Technical field

This application involves hot pipe technique field more particularly to a kind of thin type heat pipes, the production method of thin type heat pipe and electronics Equipment.

Background technique

In recent years, the chip performance of the mobile consumption electronic product such as mobile phone, tablet computer rapidly improves, mobile consumer electronics The chip operational capability of product can control the complicated calculations of large-scale 3D game, image processing or even field of neural networks. All kinds of chips are handling complex calculation or are continuing to generate amount of heat when high load is run, and mentioning with chip computing capability Height, the heat that chip generates is also more, if heat can not be spread out in time, it will lead to the DIE Temperature mistake of chip There is phenomena such as frequency reducing in height, limits the performance of chip performance.

In order to guarantee the usage experience of user, the electronic products such as mobile phone, plate usually have more frivolous fuselage, fuselage It is frivolous to cause fuselage interior space limited, it is unfavorable for radiating.In order to improve the heat-sinking capability of electronic product, some manufacturers are by heat pipe The phases such as (heat pipe, HP), vacuum soaking plate (vapor chamber, VC), loop circuit heat pipe (loop heat pipe, LHP) Become heat dissipation technology to apply in the electronic products such as mobile phone, plate.

Wherein, the phase change radiator structures such as heat pipe or soaking plate are real by the vaporization of the working medium of inner passage and condensation process Existing thermal cycle, takes away heat.But heat pipe used at present is to vacuumize and sealing needs to carry out draw operation, thus Heat pipe both ends form the draw region of certain length, and draw region can not form channel, cannot fill working medium, thus heating conduction Difference, and the electronic equipment internal space of " an inch of land is an inch of gold " can be occupied.The volume of soaking plate is big, weight is big, is unfavorable for electronics and sets Standby loss of weight, and welding procedure sealing is generallyd use around soaking plate, current the smallest weld ddge width are 2.5mm, at weld ddge without Method forms channel, and heating conduction is poor；The long hem width degree of the soaking plate applied on mobile phone at present is about 12mm or so, and two sides weld ddge Width just reaches 5mm, has seriously affected heat dissipation performance.

Summary of the invention

This application provides a kind of thin type heat pipe, the production method of thin type heat pipe and electronic equipments, to solve the prior art The problem of middle phase change radiator structure heat dissipation performance difference.

In a first aspect, this application provides a kind of thin type heat pipes, comprising: the tube body with cavity, tube body both ends include receiving Portion is held back, the cavity cross-sectional area of convergent part is gradually reduced to the direction far from body central, and closed envelope is formed in tube body end Mouthful；Capillary structure and working medium are provided in cavity.

According to the thin type heat pipe of above-mentioned offer, entire tubular body all has cavity, with other heat with draw structure Pipe is compared, and when tube length is identical, the cavity volume of the thin type heat pipe of the application is bigger, and length is longer, it may be possible to accommodate More capillary structures and working medium, and the cycling distance of condensation and the vaporization of working medium is longer, is conducive to the condensation for improving working medium Effect improves the capacity of heat transmission of heat pipe, and therefore, thin type heat pipe heat dissipation performance provided by the present application is more preferable.It is slim as the application When heat pipe is applied in the chip cooling design of the electronic products such as mobile phone, tablet computer, it can be effectively reduced chip temperature, avoid There is reducing frequency phenomenon at high temperature in chip, and chip performance is made to be not fully exerted.

In a kind of possible mode, capillary structure includes tow medium, and tow medium is arranged along tube body axis direction, will Cavity separates into multiple cavities.

Tow medium separates cavity at multiple cavities as a result, and cavity has drainage to working medium, and thin type heat pipe makes Used time, working medium absorb heat in the evaporator section of heat pipe and are vaporized into steam, and steam acts on lower edge in the partial high pressure that vaporization generates Cavity is flowed to the condensation segment of heat pipe；In condensation segment, working medium release heat simultaneously condenses into liquid, in the capillarity of tow medium Lower return evaporator section realizes phase transformation circulation.Since the thin type heat pipe both ends of the application also have cavity, tow in convergent part The other end to tube body can be arranged in medium from one end of tube body, and entire tube body can be penetrated through by being formed by cavity, thus sufficiently Using tube length, thus working medium condensation segment condensation apart from longer, condense more abundant, be conducive to improve dissipating for thin type heat pipe Hot property.

In a kind of possible mode, capillary structure further includes grid medium, and the inner wall of tube body, silk is arranged in grid medium Shu Jiezhi is fitted on grid medium.

It can be acted synergistically by grid medium with tow medium as a result, wicking capacity can be improved, also, due to net The inner wall of tube body is arranged in lattice medium, when working medium is attracted on grid medium, can come into full contact with tube body, be conducive to work Matter more fully absorbs the heat that tube body is obtained from heat source in evaporator section, and more thoroughly distributes heat from tube body in condensation segment It goes out, thus, improve the heat dissipation performance of thin type heat pipe.

In a kind of possible mode, tube body includes multiple holly strips, and holly strip separates cavity at multiple cavities.

Wherein, cavity has drainage to working medium, and working medium can be promoted to form phase transformation in cavity and recycled, also, every Part can increase the contact area of working medium and tube body, be conducive to more to fully absorb tube body in evaporator section in working medium and obtain from heat source Heat, and heat is more thoroughly distributed from tube body in condensation segment, thus, improve the heat dissipation performance of thin type heat pipe.

In a kind of possible mode, capillary structure includes tow medium, and tow medium is arranged in cavity.

The cavity that tow is arranged as a result, forms capillary channel, and the cavity for being not provided with tow forms steam channel, thus, Capillary channel is used for the reflux of liquid refrigerant, and steam channel is used for the transmission of gaseous working medium, so that working medium is formed stable phase transformation and follow Ring is conducive to the heat dissipation performance for improving thin type heat pipe.

In a kind of possible mode, capillary structure includes grid medium, and grid medium is arranged by holly strip support in pipe The inner wall of body.

Grid medium is close to the inner wall of tube body under the support of holly strip as a result, when working medium is attracted on grid medium When, it can be come into full contact with tube body, thus, be conducive to working medium in evaporator section and more fully absorb the heat that tube body is obtained from heat source, And more thoroughly distribute heat from tube body in condensation segment, thus, improve the heat dissipation performance of thin type heat pipe.

In a kind of possible mode, convergent part is wedge structure.

Wherein, wedge structure can clamp tube body both ends by simple Wedge gripping and be formed, and processing cost is low, structure letter Single, the production cost as a result, using the electronic product of the thin type heat pipe of the application is lower.

In a kind of possible mode, sealing passes through welding and sealing.

It is located at the end of tube body due to sealing, seal region very little therefore can be reliable close by sealing using welding manner Envelope, and apparent influence (such as deformation, weld defect etc.) will not be generated on the structure of thin type heat pipe.As a result, with existing heat Seal of tube mode is compared, the cavity sealing area of the thin type heat pipe of the application is smaller, sealing means are simpler, sealing reliability more Height advantageously reduces the processing cost of heat pipe.

In a kind of possible mode, capillary structure extends to another end closure of tube body from an end closure of tube body.

All there is capillary structure as a result, the length of tube body obtains most adequately utilizing, working medium in the entire cavity of tube body Condensation and vaporization cycling distance longest, in the case where tube length is certain, the condensation effect of working medium is best, heat pipe it is thermally conductive Ability is most strong.

In a kind of possible mode, sealing includes flat shape sealing, tilted mouth shape sealing, stairstepping sealing and/or curve Shape sealing in any one or a few.

Sealing can be processed to various shape according to the space structure and design requirement of electronic product as a result, thus, make The spatial compatibility of thin type heat pipe is stronger, and application is more flexible.

Second aspect, this application provides a kind of production methods of thin type heat pipe, comprising the following steps: in the cavity of tube body Arrange capillary structure.Tube body one end is pressed using jig, forms convergent part, the cavity cross-sectional area of convergent part is to far from body central Direction be gradually reduced, and closed sealing is formed in tube body end.Cavity is vacuumized from the tube body other end and injects working medium. The tube body other end is pressed using jig, forms convergent part.Tube body is pressed into flat pattern using stamping tool.Sealing is passed through into weldering Connect sealing.

The production method of thin type heat pipe provided by the present application as a result, process flow is simple, production yield is high.Also, it uses The thin type heat pipe of the present processes production, the cavity of tube body extend to the end of tube body, and cavity length is longer, working medium The cycling distance of condensation and vaporization is longer, and the effective heat dissipation region that can be contacted with heat source is bigger, is conducive to improve the cold of working medium Solidifying effect, in addition, the volume of cavity is bigger, it may be possible to accommodate more capillary structures and working medium, be conducive to improve heat pipe The capacity of heat transmission, therefore, the thin type heat pipe heat dissipation performance made using the present processes are more preferable.When the thin type heat pipe be mobile phone, When in the chip cooling design of the electronic products such as tablet computer, it can be effectively reduced chip temperature, chip avoided to go out at high temperature Existing reducing frequency phenomenon, makes chip performance be not fully exerted.

In a kind of possible mode, capillary structure includes tow medium, and tow medium is arranged along tube body axis direction, silk Shu Jiezhi separates cavity at multiple cavities after tube body is pressed into flat pattern.

Tow medium separates cavity at multiple cavities after tube body is pressed into flat pattern as a result, and thin type heat pipe makes Used time, working medium is absorbed in the evaporator section of heat pipe heat and to be vaporized, along cavity to heat pipe under the local pressure effect that vaporization generates Condensation segment flowing；In condensation segment, working medium release heat simultaneously condenses into liquid, evaporation is returned under the capillarity of tow medium Section realizes phase transformation circulation.Since the convergent part at the thin type heat pipe both ends of the application also has cavity, tow medium can be from heat pipe One end be extended the other end of heat pipe, make full use of heat pipe length, thus working medium condensation segment condensation apart from longer, It is condensed into the heat dissipation performance for being sufficiently conducive to improve thin type heat pipe.

In a kind of possible mode, capillary structure further includes grid medium, and the inner wall of tube body, silk is arranged in grid medium Shu Jiezhi is fitted on grid medium after tube body is pressed into flat pattern.

It can be acted synergistically by grid medium with tow medium as a result, wicking capacity can be improved, also, grid is situated between Matter can be tightly attached to the inner wall of tube body after tube body is pressed into flat pattern, when working medium is attracted on grid medium, Ke Yiyu Tube body comes into full contact with, and is conducive to working medium in evaporator section and more fully absorbs the heat that tube body is obtained from heat source, and incites somebody to action in condensation segment Heat is more thoroughly distributed from tube body, thus, improve the heat dissipation performance of thin type heat pipe.

In a kind of possible mode, tube body includes multiple holly strips, and holly strip will after tube body is pressed into flat pattern Cavity separates into multiple cavities.

In a kind of possible mode, capillary structure includes tow medium, and tow medium is arranged between holly strip, so that After tube body is pressed into flat pattern, tow medium is located in cavity.

As a result, after tube body is pressed into flat pattern, tow is fixed in the cavity of holly strip formation, and it is logical to form capillary Road does not arrange that the cavity of tow forms steam channel, thus, capillary channel and steam channel are well defined, at heat pipe both ends Convergent part connection, so that working medium is formed stable phase transformation circulation, be conducive to the heat dissipation performance for improving thin type heat pipe.

In a kind of possible mode, capillary structure includes grid medium, and the opposite side of holly strip is arranged in grid medium, So that after tube body is pressed into flat pattern, holly strip by grid dielectric support tube body inner wall.

Grid medium is close to the inner wall of tube body under the support of holly strip as a result, when working medium is attracted on grid medium When, it can be come into full contact with tube body, thus, be conducive to more fully absorb the heat that tube body is obtained from heat source in evaporator section in working medium Amount, and more thoroughly distribute heat from tube body in condensation segment, thus, improve the heat dissipation performance of thin type heat pipe.

The third aspect, this application provides a kind of electronic equipment, which includes thin type heat pipe provided by the present application, The chip cooling that the thin type heat pipe is used for as electronic product.

Wherein, thin type heat pipe can be fitted in the System on Chip/SoC (System on a Chip, SoC) of electronic equipment, modulation On the biggish chip of the calorific values such as demodulator chip (modem) and Wi-Fi chip.Due to leading for thin type heat pipe provided by the present application Thermal effect is more preferable, therefore will can more efficiently take away the heat of chip generation, the temperature of chip is reduced, so as to guarantee core Piece reducing frequency phenomenon will not occur because temperature is excessively high, obtain the performance of chip in the case where long-time high load is run To substantially stabilized performance, and then the overall performance of electronic equipment is improved, promotes user experience.

Detailed description of the invention

Fig. 1 shows a kind of electronic equipment internal structural schematic diagram using heat pipe heat radiation technology；

Fig. 2 shows a kind of electronic equipment internal structural schematic diagrams using soaking plate heat dissipation technology；

Fig. 3 is a kind of structural schematic diagram of thin type heat pipe provided by the present application；

Fig. 4 is the tubular form schematic diagram of the thin type heat pipe shown in the application；

Fig. 5 is the application scenarios schematic diagram of thin type heat pipe provided by the present application；

Fig. 6 is that the phase transformation of working medium provided by the present application recycles schematic diagram；

Fig. 7 is a kind of schematic diagram of capillary structure provided by the present application；

Fig. 8 is the thermal cycle schematic diagram of the thin type heat pipe comprising tow medium；

Fig. 9 is the schematic diagram of another capillary structure provided by the present application；

Figure 10 is a kind of pipe structure schematic diagram provided by the present application；

Figure 11 is another pipe structure schematic diagram provided by the present application；

Figure 12 is another pipe structure schematic diagram provided by the present application；

Figure 13 is the schematic diagram of another capillary structure provided by the present application；

Figure 14 is the schematic diagram of another capillary structure provided by the present application；

Figure 15 is the schematic diagram of another capillary structure provided by the present application；

Figure 16 is the schematic diagram of another capillary structure provided by the present application；

Figure 17 is the enclosuring structure schematic diagram of thin type heat pipe provided by the present application；

Figure 18 is the schematic shapes of the convergent part of thin type heat pipe provided by the present application；

Figure 19 is a kind of flow chart of the production method of thin type heat pipe provided by the present application；

Figure 20 is a kind of operation chart of the production method of thin type heat pipe provided by the present application；

Figure 21 is a kind of method for arranging schematic diagram of capillary structure provided by the present application；

Figure 22 is the method for arranging schematic diagram of another capillary structure provided by the present application；

Figure 23 is a kind of schematic diagram of the production method of tube body provided by the present application；

Figure 24 is the method for arranging schematic diagram of another capillary structure provided by the present application；

Figure 25 is the method for arranging schematic diagram of another capillary structure provided by the present application；

Figure 26 is the method for arranging schematic diagram of another capillary structure provided by the present application；

Figure 27 is the method for arranging schematic diagram of another capillary structure provided by the present application；

Figure 28 is the structural schematic diagram of a kind of electronic equipment provided by the present application.

It illustrates:

Wherein, 10- tube body, 11- convergent part, 12- holly strip, 13- sealing, 20- cavity, 21- cavity, 211- capillary are logical Road, 212- steam channel, 30- capillary structure, 31- tow medium, 32- grid medium, 40- working medium, 50- mainboard, 60- chip, 100- thin type heat pipe.

Specific embodiment

Before the technical solution explanation to the embodiment of the present application, first in conjunction with attached drawing to the technology field of the embodiment of the present application Scape is illustrated.

In order to improve the heat-sinking capability of the electronic products such as mobile phone, tablet computer, the inside chip for reducing electronic product is being located Temperature when managing complex calculation or continuing high load operation, some manufacturers are by heat pipe (heat pipe, HP), vacuum soaking plate The phase-change heats technical applications such as (vapor chamber, VC), loop circuit heat pipe (loop heat pipe, LHP) are in electronic product In.

Fig. 1 shows a kind of electronic equipment internal structural schematic diagram using heat pipe heat radiation technology.As shown in Figure 1, in electricity It is provided with heat pipe above the System on Chip/SoC (System on a Chip, SoC) of sub- equipment mainboard, which passes through inner passage The vaporization of working medium and condensation process realize thermal cycle, radiate for SoC.But the current heat pipe used is incited somebody to action in production Inner passage vacuumizes and sealing needs to carry out draw operation, to form certain length at heat pipe both ends, (every end is close to 10mm) Draw region, due to that can not form channel, heating conduction is poor in draw region, and therefore, the draw region of chip and heat pipe should It takes and evades layout designs, avoid contact with；Also, such as the electronic equipments such as mobile phone, tablet computer usually chase after in fuselage design Ask frivolous, fuselage interior space is extremely limited, and therefore, draw region is meaningless to occupy fuselage space, also frivolous with fuselage Design direction contradicts；In addition, there is heat pipe the length of the effective coverage of inner passage to reduce due to the presence in draw region, Also the heat dissipation performance of heat pipe is influenced.

Fig. 2 shows a kind of electronic equipment internal structural schematic diagrams using soaking plate heat dissipation technology.As shown in Fig. 2, electric The region SoC of sub- equipment mainboard is covered with soaking plate, similar to heat pipe principle shown in FIG. 1, and soaking plate passes through internal work The vaporization of matter and condensation process realize thermal cycle, radiate for SoC.But current soaking plate can be formed in sealing in surrounding Width is not less than the sealing edge of 2.5mm, and the region where sealing edge can not form channel, so that meaningless occupy fuselage sky Between, it is contradicted with the thin design direction of fuselage；Due to the presence of sealing edge, effective heat dissipation area of soaking plate becomes smaller, and influences The heat dissipation performance of soaking plate；In addition, it is larger due to being measured in soaking plate, it will lead to electronic equipment and become weight, influence user and use body It tests.

To solve the above-mentioned problems, this application provides a kind of thin type heat pipes.Fig. 3 is a kind of thin-type heat provided by the present application The structural schematic diagram of pipe.As shown in figure 3, the thin type heat pipe includes: the tube body 10 with cavity 20,10 both ends of tube body include convergence 20 sectional area of cavity in portion 11, convergent part 11 is gradually reduced to the direction far from 10 center of tube body, and is formed in 10 end of tube body Closed sealing 13；Capillary structure 30 and working medium 40 are provided in cavity 20.

Wherein, tube body 10 is metal material, such as copper, aluminium, carbon steel, stainless steel, steel alloy etc., and tube body 10 preferably can be Pancake tube body 10 is formed after being flattened by round tube body 10, and thickness is smaller, bigger with the contact area of chip, to have Conducive to the thickness for improving chip cooling effect and reduction electronic equipment.In addition, tube body 10 is also possible to round tube body 10, Huo Zheqi His anisotropic tube body 10, such as: ellipse, square, rectangle, corrugated tube body 10 etc., tube body 10 of the application to thin type heat pipe Shape is not specifically limited.

It is moved closer in the wall surface of the convergent part 11 of tube body 10, tube body 10 along far from 10 center position of tube body, makes tube body 10 20 sectional area of cavity in convergent part 11 along being gradually reduced far from 10 center position of tube body, until contacting to be formed in 10 end of tube body The sealing 13 of sealing, the sealing 13 can be sealed by welding procedure, such as: gas welding, arc welding are (such as: argon gas protection Weldering), electric resistance welding, the techniques such as laser welding and induction welding, keep the cavity 20 of tube body 10 closed, seal the working medium in cavity 20 up for safekeeping. Further, the both ends that the jig pressing tube body 10 with wedge-shaped clamping opening can be used in the convergent part 11 of tube body 10 are formed, thus Make convergent part 11 that wedge-type shape be presented, in addition, can make the sealing 13 of 10 end of tube body that linear type be presented by jig pressing Structure is conducive to seal sealing 13 by welding procedure, improves the sealing effect of sealing 13, guarantees that cavity 20 is closed Reliability.

In addition, the working medium 40 in cavity 20 is the liquid with good fluidity in unmanaged situation, it can after heat absorption Steam is vaporized by liquid condition, chip is taken away by the phase transformation between liquid and steam and the circulation in cavity 20 and is produced Raw heat, to be chip cooling.In the application, working medium 40 for example can be freon, ammonia, acetone, methanol, ethyl alcohol, heptan The composition of the substances such as alkane and water and above-mentioned substance.

In addition, capillary structure 30 can be tow medium 31 or grid medium 32, working medium 40 can be made in capillary structure Adsorption capacity and surface tension are generated on 30, move working medium 40 in the case where not by any external force along capillary structure 30, from And promote flowing of the working medium 40 in cavity 20.

In addition, as shown in figure 4, being the tubular form schematic diagram of the thin type heat pipe shown in the application.According in electronic equipment Layout of the chip on mainboard 50, waveform tube body of heat pipe 10 can be straight tube, be also possible to the bend pipe of various forms, the application couple The shape of thin type heat pipe tube body 10 is not specifically limited.

Fig. 5 is the application scenarios schematic diagram of thin type heat pipe provided by the present application.

As shown in figure 5, thin type heat pipe gland is on the mainboard 50 of electronic equipment, and with SoC, Wi-Fi core on mainboard 50 The main euthermic chip 60 such as piece, modem chip and power management chip contacts, wherein can be in thin type heat pipe and chip The heat-conducting mediums such as graphene patch or heat-conducting silicone grease are arranged in 60 contact surface, fill the seam between thin type heat pipe and chip 60 Gap, to improve heat-conducting effect.Thin type heat pipe becomes evaporation including convergent part 11 in one end close to chip 60 as a result, Section；In one end far from chip 60, including convergent part 11, condensation segment is formed, by working medium in evaporator section and condensation segment Phase transformation circulation, radiates for chip 60.

Fig. 6 is that the phase transformation of working medium provided by the present application recycles schematic diagram.As shown in fig. 6, when electronic equipment operation, chip The heat of generation is absorbed by the working medium that tube body 10 is evaporated section, is increased the temperature of working medium and is vaporized into steam, working medium is in vapour That changes makes in a flash evaporator section generate local hyperbar, and steam is driven to flow rapidly to condensation segment, due to condensation segment temperature compared with Low, steam discharges heat in condensation segment and condenses into liquid, the heat that working medium releases by condensation segment the outwardly spoke of tube body 10 It is shot out, meanwhile, while the working medium of liquid returns to evaporator section by the capillary flow of capillary structure 30, realizes working medium Phase transformation circulation.

From the above technical scheme, thin type heat pipe provided by the present application, entire tubular body all has cavity, with other Heat pipe with draw structure is compared, and when tube length is identical, the cavity product of the thin type heat pipe of the application is bigger, and length is more It is long, it may be possible to accommodate more capillary structures and working medium, and the cycling distance of condensation and the vaporization of working medium is longer, is conducive to The condensation effect for improving working medium, improves the capacity of heat transmission of heat pipe, therefore, thin type heat pipe heat dissipation performance provided by the present application is more preferable. When the thin type heat pipe of the application is applied in the chip cooling design of the electronic products such as mobile phone, tablet computer, can effectively drop Low chip temperature, avoids chip from occurring reducing frequency phenomenon at high temperature, and chip performance is made to be not fully exerted.

Further as shown in fig. 6, capillary structure 30 can be from an end closure 13 of tube body 10 in a kind of possible mode Extend to another end closure 13 of tube body.To all have capillary structure 30, the length of tube body 10 in the entire cavity 20 of tube body 10 Degree is fully utilized, and the cycling distance of condensation and the vaporization of working medium 40 is longer, in the case where 10 length of tube body is certain, work The condensation effect of matter 40 is good, and the capacity of heat transmission of heat pipe is strong.

Fig. 7 is a kind of schematic diagram of capillary structure provided by the present application.

As shown in fig. 7, in one embodiment, capillary structure 30 includes tow medium 31, and tow medium 31 is along tube body 10 Axis direction setting, cavity 20 is separated into multiple cavities 21.Wherein, tow medium 31 can have porous structure, make working medium It is shuttled in porous structure by the capillarity of tow medium 31, realizes flowing.One or more can be set in cavity 20 Root tow medium 31, thus by the partition of cavity 20 at the cavity 21 of different number, for example, if a tow is arranged in cavity 20 Medium 31 can separate cavity 20 into two cavities 21, can be cavity if two tow media 31 are arranged in cavity 20 20 separate into three cavities 21, and so on.

Fig. 8 is the thermal cycle schematic diagram of the thin type heat pipe comprising tow medium.As shown in figure 8, in evaporator section, working medium vaporization After steam, part it is anticyclonic drive it is lower enter cavity 21, and under the drainage of cavity 21, along cavity 21 to condensation Section flowing rapidly；In condensation segment, working medium release heat condenses into liquid, and steaming is flowed back under the capillarity of tow medium 31 Section is sent out, realizes the phase transformation circulation of working medium.

Each cavity 21 tow medium 31 adjacent thereto forms independent circulation loop as a result, makes the steam of working medium Flow it is more stable and uniform, be conducive to improve thin type heat pipe heat-sinking capability.Also, tow medium 31 is capable of the structure of opposite heat tube It plays a supporting role, to improve the intensity of thin type heat pipe.In addition, since the thin type heat pipe both ends of the application are in convergent part 11 With cavity 20, therefore the other end to tube body 10 can be arranged in tow medium 31 from one end of tube body 10, be formed by cavity 21 can penetrate through entire tube body 10, to make full use of the length resource of tube body 10, therefore working medium is in the condensation distance of condensation segment Longer, condensation is more abundant, is conducive to the heat dissipation performance for improving thin type heat pipe.

Fig. 9 is the schematic diagram of another capillary structure provided by the present application.

As shown in figure 9, in one embodiment, capillary structure 30 further includes that grid is situated between in the structure basis shown in Fig. 8 The inner wall of tube body 10 is arranged in matter 32, grid medium 32, and tow medium 31 is fitted on grid medium 32.Grid medium 32 can be with It is made of single layer mesh piece or multi-layer net piece, when grid medium 32 is made of multi-layer net piece, far from 10 inner wall of tube body The grid of mesh flake can be smaller, provides stronger wicking capacity, and the grid close to the mesh flake of 10 inner wall of tube body can be larger, Smaller flow resistance is provided, working medium is promoted to flow back from condensation segment to evaporator section.Further as shown in figure 9, working as capillary structure 30 Including tow medium 31 and when grid medium 32, there can be following several layout designs:

As shown in the layout (a) of Fig. 9, capillary structure 30 is made of a tow medium 31 and a piece of grid medium 32.Its In, the inner wall of tube body 10 is arranged in grid medium 32, and 31 side of tow medium is contacted with grid medium 32, the other side and tube body 10 Inner wall contact, by cavity 20 separate at two cavities 21, tow medium 31 is preferably provided at the center of cavity 20, makes two chambers The cross-sectional sizes in road 21 are equal, and the phase transformation cyclic process for being conducive to working medium uniformly carries out in cavity 20, improve thin type heat pipe Heat dissipation performance.

As shown in the layout (b) of Fig. 9, capillary structure 30 is made of a tow medium 31 and two panels grid medium 32.Its In, two panels grid medium 32 is symmetrical and is oppositely disposed at the inner wall of tube body 10, and tow medium 31 is arranged in two panels grid medium In cavity 20 among 32, and contacted respectively with two panels grid medium 32.The working medium of steam form is condensed in condensation segment as a result, Afterwards, evaporator section can be flowed back by the capillarity of grid medium 32 in the position close to tube body 10, in separate tube body 10 Position can flow back into evaporator section by the capillarity of tow medium 31, so as to accelerate the back-flow velocity of working medium, in turn Improve the heat dissipation performance of thin type heat pipe.

As shown in the layout (c) of Fig. 9, capillary structure 30 is made of multi-filament Shu Jiezhi 31 and a piece of grid medium 32.With The structure of layout (a) is compared, tow medium 31 and cavity 21 it is more, capillarity is stronger, and the back-flow velocity of working medium is more Fastly, so that the heat dissipation performance of thin type heat pipe is stronger.

As shown in the layout (d) of Fig. 9, capillary structure 30 is made of multi-filament Shu Jiezhi 31 and two panels grid medium 32.With The structure of layout (b) is compared, tow medium 31 and cavity 21 it is more, the distribution of capillary structure 30 more crypto set is uniform, Capillarity is stronger, the back-flow velocity of working medium faster, so that the heat dissipation performance of thin type heat pipe is stronger.

It can be acted synergistically with tow medium 31 by grid medium 32 as a result, can be improved wicking capacity, also, by In grid medium 32, the inner wall of tube body 10 is set, it, can be abundant with tube body 10 when working medium is attracted on grid medium 32 Contact, be conducive to working medium evaporator section more fully absorb chip generation heat, and condensation segment by heat more thoroughly from Tube body 10 distributes, thus, improve the heat dissipation performance of thin type heat pipe.

Figure 10 is a kind of pipe structure schematic diagram provided by the present application.

As shown in Figure 10, in one embodiment, the inner wall of tube body 10 includes multiple holly strips 12, and holly strip 12 is by cavity 20 partitions are at multiple cavities 21.Wherein, holly strip 12 can be structure as a whole with tube body 10, extend along 10 axis direction of tube body, Holly strip 12 can be provided only on the middle section region between the evaporator section and condensation segment of tube body 10, in the evaporator section of tube body 10 and cold Solidifying section is not provided with holly strip 12, so that cavity 21 be made to be interconnected in the evaporator section and condensation segment of tube body 10, improves the stream of working medium Dynamic property, and then improve the phase transformation cycle efficieny of working medium.In addition, further as shown in Figure 10, when thin type heat pipe uses pancake pipe When body 10, width direction of the holly strip 12 along 10 section of tube body is set side by side, to separating cavity 20 at multiple along tube body 10 The width direction in section cavity 21 arranged side by side；In addition, the holly strip 12 being set side by side can play a supporting role to tube body 10, prevent Only tube body 10 generates deformation when by external force.

Figure 11 is another pipe structure schematic diagram provided by the present application.

As shown in figure 11, in one embodiment, slim in order to mitigate on the basis of 10 structure of tube body shown in Figure 11 Intermittent configuration can be set into the weight of heat pipe, holly strip 12, to achieve the purpose that mitigate thin type heat pipe weight.

Figure 12 is another pipe structure schematic diagram provided by the present application.

In one embodiment, if thin type heat pipe is bend pipe, thin type heat pipe needs to carry out tube body 10 in production It bends to form bending section, then, if being provided with holly strip 12 in bending section, may be led during 10 bending of tube body The deformation of holly strip 12 is caused, so that 10 structural failure of deformation and tube body of cavity 21 is caused, therefore, as shown in figure 12, holly strip 12 are positioned only at the flat segments of tube body 10, thus, when bending to tube body 10, do not interfere with the structure shape of holly strip 12 State prevents holly strip 12 to be deformed, simultaneously, moreover it is possible to achieve the purpose that mitigate thin type heat pipe weight.

In some embodiments, when tube body 10 includes holly strip 12, thin type heat pipe provided by the present application can also include Several capillary structures 30 below.

Figure 13 is the schematic diagram of another capillary structure provided by the present application.

As shown in figure 13, in one embodiment, tube body 10 includes the holly strip 12 of two parallel intervals setting, by cavity 20 partitions are at three cavities 21.Capillary structure 30 includes a tow medium 31, which is arranged in two holly strips In cavity 21 between 12, the cavity 21 between two holly strips 12 is logical since the presence of tow medium 31 forms capillary as a result, Road 211, other two cavity 21 form 21 steam channel 212 of cavity.So, when in use, working medium is in heat pipe for thin type heat pipe Evaporator section absorbs heat and vaporizes, and under the local pressure effect that vaporization generates, is extruded in 21 steam channel 212 of cavity, And the condensation segment of heat pipe is flowed to by 21 steam channel 212 of cavity；In condensation segment, working medium release heat simultaneously condenses into liquid, Enter capillary channel 211 under the capillarity of tow medium 31, and evaporator section is returned to by capillary channel 211, realizes that phase transformation follows Ring.To which definitely, phase transformation circulation is more stable in the path of phase-change circulation of working medium, is conducive to the heat dissipation for improving thin type heat pipe Performance.

Figure 14 is the schematic diagram of another capillary structure provided by the present application.

As shown in figure 14, in one embodiment, tube body 10 includes the holly strip 12 of more than two parallel interval setting, will Cavity 20 separates into more than three cavity 21.Capillary structure 30 includes multi-filament Shu Jiezhi 31, these 31 compartment of terrain of tow medium It is arranged in the cavity 21 of the formation of holly strip 12, forms capillary channel 211 and the alternately arranged knot of 21 steam channel of cavity 212 Structure.So, when in use, working medium absorbs heat in the evaporator section of heat pipe and vaporizes thin type heat pipe, in the part pressure that vaporization generates It under power effect, is expressed in multiple 21 steam channels 212 of cavity by dispersion, and heat pipe is flowed to by 21 steam channel 212 of cavity Condensation segment；In condensation segment, working medium release heat simultaneously condenses into liquid, and is adsorbed by the tow medium 31 nearest apart from working medium, And entered under the capillarity of tow medium 31 in the capillary channel 211 nearest apart from working medium, it is returned by capillary channel 211 Evaporator section is returned, realizes phase transformation circulation.To which working medium generates the circuit of multiple phase transformation circulations, phase transformation cycle efficieny in cavity 20 Higher, especially when tube body 10 is in pancake and larger 20 section of cavity, this multiphase that can generate becomes circulation loop The design of capillary structure 30 can make distribution of the working medium in cavity 20 more uniform, and phase transformation circulation is more stable, to be conducive to Improve the heat dissipation performance of thin type heat pipe.

Figure 15 is the schematic diagram of another capillary structure provided by the present application.

As shown in figure 15, in one embodiment, tube body 10 includes the holly strip 12 of multiple parallel intervals setting, by cavity At multiple cavities 21, capillary structure 30 includes grid medium 32 for 20 partitions, and grid medium 32 is arranged by the support of holly strip 12 in pipe The inner wall of body 10.So, when in use, working medium is attracted on grid medium 32 thin type heat pipe, is come into full contact with tube body 10, from And in evaporator section, working medium can efficiently absorb the heat of chip generation, after working medium absorbs heat vaporization, in the office that vaporization generates It under the effect of portion's pressure, is expressed in each cavity 21 by dispersion, and flows to the condensation segment of heat pipe by cavity 21；In condensation segment, Working medium release heat simultaneously condenses into liquid, and is adsorbed by grid medium 32, and flow back under the capillarity of grid medium 32 Evaporator section realizes phase transformation circulation.

Figure 16 is the schematic diagram of another capillary structure provided by the present application.

It as shown in figure 16, in one embodiment, further include tow on the basis of the structure shown in Figure 15 of capillary structure 30 Medium 31, tow medium 31 are spaced apart and arranged in the cavity 21 of the formation of holly strip 12, form capillary channel 211 and cavity 21 steams The alternately arranged structure in vapour channel 212.Capillary as a result, compared with the capillary structure 30 shown in Figure 14 and Figure 15, shown in Figure 16 The capillarity of structure 30 is stronger, and thin type heat pipe is made to have better heat dissipation performance.

It should be added that the capillary structure shown in the application Fig. 7, Fig. 9, Figure 13-Figure 16 is only that the application can The section Example of realization, rather than whole embodiments, those skilled in the art can be in the capillary structures shown in the application Under technology inspires, according to factors such as the tube body size of thin-walled heat pipe, the calorific value size and cost of chip, reasonably selects tow and be situated between The quantity and layout type of matter and grid medium, protection scope of the design that can be applied here without departing from the application.

Figure 17 is the enclosuring structure schematic diagram of thin type heat pipe provided by the present application.

As shown in figure 17, in some embodiments, sealing 13 can be according to the space structure and design requirement of electronic product It is processed to various shape, such as flat shape sealing (a structure of Figure 17), tilted mouth shape sealing (the b structure of Fig. 7), stairstepping envelope Mouth (the c structure of Figure 17) and curved shape sealing (d structure of Figure 17) etc..To make the spatial compatibility of thin type heat pipe more By force, application is more flexible.

Figure 18 is the schematic shapes of the convergent part of thin type heat pipe provided by the present application.

As shown in figure 18, in some embodiments, convergent part 11 can also include arcuate structure in addition to wedge structure (a structure of Figure 18) or domatic structure (the b structure of Figure 18) etc., design and the design for being capable of forming the convergent part 11 of cavity 20 are equal Without departing from the protection scope of the application.

Present invention also provides a kind of production method of thin type heat pipe, this method is thin shown in above-described embodiment for making Type heat pipe.

Figure 19 is a kind of flow chart of the production method of thin type heat pipe provided by the present application.

Figure 20 is a kind of operation chart of the production method of thin type heat pipe provided by the present application.

As illustrated in figures 19 and 20, method includes the following steps:

Step A arranges capillary structure 30 in the cavity 20 of tube body 10.Capillary structure 30 can be from an end of tube body 10 It is arranged into another end of tube body 10, after the closing of tube body 10 forms cavity 20, any position of the working medium in cavity 20 is all Flowing can be generated by capillarity.

Step B presses 10 one end of tube body using jig, forms convergent part 11, and 20 sectional area of cavity of convergent part 11 is to remote Direction from 10 center of tube body is gradually reduced, and closed sealing 13 is formed in 10 end of tube body.Specifically, jig for example can be with With wedge-shaped clamping opening, arc clamping opening or domatic clamping opening etc., thus being capable of the formation of tube body 10 using jig pressing 10 one end of tube body The convergent part 11 of wedge shape, arc or domatic, and the sealing 13 of sealing is formed in 10 end of tube body.

Cavity 20 is vacuumized from 10 other end of tube body and injects working medium by step C.Specifically, using vaccum-pumping equipment from The other end that tube body 10 is not pressed carries out the cavity 20 of tube body 10 to vacuumize operation, and infuses into the cavity of vacuum state 20 Enter working medium.

Step D presses 10 other end of tube body using jig, forms convergent part 11.

Tube body 10 is pressed into flat pattern using stamping tool by step E.

Sealing 13 is passed through welding and sealing by step F.Specifically, seal 13 welding can be used gas welding, arc welding (such as: Argon gas protection weldering), electric resistance welding, the techniques such as laser welding and induction welding.Due to pressing 13 structure of sealing to be formed by jig Simply, 13 length of sealing are smaller, therefore, can obtain good sealing effect by welding method sealing sealing 13, guarantee empty The closed reliability of chamber 20.

Wherein, tube body 10 can be thin-wall metal round tube, such as copper, aluminium, carbon steel, stainless steel, steel alloy etc.；Working medium is for example It can be the composition of the substances such as freon, ammonia, acetone, methanol, ethyl alcohol, heptane and water and above-mentioned substance；Capillary structure 30 It can be tow medium 31 or grid medium 32, working medium can be made to generate adsorption capacity and surface tension on capillary structure 30.

From the above technical scheme, the production method of thin type heat pipe provided by the present application, process flow is simple, production is good Rate is high.Also, the thin type heat pipe made using the present processes, the cavity of tube body extend to the end of tube body, tube body Cavity is compared with other are with the heat pipe of draw structure, and when tube length is identical, the cavity product of the thin type heat pipe of the application is more Greatly, length is longer, it may be possible to accommodate more capillary structures and working medium, and the cycling distance of condensation and the vaporization of working medium is more It is long, be conducive to the condensation effect for improving working medium, improve the capacity of heat transmission of heat pipe, therefore, thin type heat pipe heat dissipation provided by the present application Performance is more preferable.When the thin type heat pipe of the application is applied in the chip cooling design of the electronic products such as mobile phone, tablet computer, energy Chip temperature is enough effectively reduced, chip is avoided to occur reducing frequency phenomenon at high temperature, chip performance is made to be not fully exerted.

Figure 21 is a kind of method for arranging schematic diagram of capillary structure provided by the present application.

As shown in figure 21, in one embodiment, capillary structure 30 includes at least one tow medium 31, and along tube body Tow medium 31 can be concentrated in step and compartment of terrain is fixed on 10 side inner wall of tube body by the setting of 10 axis directions On, so that capillary structure 30 is in contact with the opposite side inner wall of tube body 10 when tube body 10 is after step E is pressed into flat pattern, it will Cavity 20 separates into multiple cavities 21.

Figure 22 is the method for arranging schematic diagram of another capillary structure provided by the present application.

As shown in figure 22, in one embodiment, capillary structure 30 further includes grid in the structure basis shown in Figure 21 Medium 32, the grid medium 32 are fixed on the inner wall of tube body 10, opposite with the fixed position of tow medium 31, to work as tube body 10 After step E is pressed into flat pattern, tow medium 31 can be fitted on grid medium 32.

Figure 23 is a kind of schematic diagram of the production method of tube body provided by the present application.

As shown in figure 23, in one embodiment, tube body 10 includes multiple holly strips 12, and holly strip 12 can be by following Step is formed:

Firstly, the hollow circular-tube before step A, by way of machining to solid circular pipe or with certain wall thickness It is removed processing, for example, drilling, milling etc., obtain the tube body 10 with thin-walled, and at the tube wall interval of 10 side of tube body Ground forms multiple holly strips 12 extended to 10 axis direction of tube body.Then, flat by the way that tube body 10 to be pressed into step E Shape contacts raised structures end with the tube wall of opposite side, to separating cavity 20 at multiple cavities 21.

In some embodiments, when tube body 10 includes holly strip 12, capillary structure 30 can also include following arrangement side Method.

Figure 24 is the method for arranging schematic diagram of another capillary structure provided by the present application.

In one embodiment, tube body 10 by machining mode formed two to 10 axis direction of tube body extend every Part 12, capillary structure 30 include a tow medium 31, which is fixed between two holly strips 12, to work as After step E is pressed into flat pattern, tow medium 31 is located in the cavity 21 of the formation of holly strip 12 tube body 10.

Figure 25 is the method for arranging schematic diagram of another capillary structure provided by the present application.

In one embodiment, the forming quantity by way of machining of tube body 10 is more than two to 10 axle center side of tube body To the holly strip 12 of extension, capillary structure 30 includes multi-filament Shu Jiezhi 31, and 31 compartment of terrain of tow medium is fixed on holly strip 12 Between, so that tow medium 31 is spaced apart and arranged in the formation of holly strip 12 when tube body 10 is after step E is pressed into flat pattern In cavity 21, capillary channel 211 and the alternately arranged structure of 21 steam channel of cavity 212 are formed.

Figure 26 is the method for arranging schematic diagram of another capillary structure provided by the present application.

In one embodiment, the forming quantity by way of machining of tube body 10 is more than two to 10 axle center side of tube body To the holly strip 12 of extension, capillary structure 30 includes grid medium 32, and grid medium 32 is fixed on the opposite side of holly strip 12, from And when tube body 10 is after step E is pressed into flat pattern, grid medium 32 is supported on the inner wall of tube body 10 by holly strip 12.

Figure 27 is the method for arranging schematic diagram of another capillary structure provided by the present application.

In one embodiment, capillary structure 30 further includes grid medium on the basis of the arrangement shown in Figure 25 32, grid medium 32 is fixed on the opposite side of holly strip 12, thus when tube body 10 is after step E is pressed into flat pattern, partition Grid medium 32 is supported on the inner wall of tube body 10 by piece 12, and grid medium 32 is made to be in contact with tow medium 31.

It should be added that the method for arranging of the capillary structure shown in the application Figure 21, Figure 22, Figure 24-Figure 26 is only It is only the achievable section Example of the application, rather than whole embodiments, those skilled in the art can show in the application Capillary structure method for arranging technology inspire under, according to the tube body size of thin-walled heat pipe, the calorific value size and cost of chip Etc. factors, reasonably select the quantity and other method for arranging of tow medium and grid medium, the design that can be applied here is equal Without departing from the protection scope of the application.

Present invention also provides a kind of electronic equipment.

As shown in figure 28, which includes thin type heat pipe 100 provided by the present application, and the thin type heat pipe 100 is for being The chip 60 of electronic product radiates.

Wherein, the electronic equipment specifically can be mobile phone, tablet computer, portable notebook computer, desktop personal computer, Mobile workstation, desk-top workstation, server apparatus, computer motherboard, display card etc. use heat pipe heat radiation technology as chip The hardware device of heat dissipation.Thin type heat pipe 100 can be fitted in electronic equipment System on Chip/SoC (System on a Chip, SoC), On the biggish chip 60 of the calorific values such as modem chip (modem) and Wi-Fi chip.

Furthermore it is possible to which the layout type according to chip 60 on the mainboard 50 of electronic equipment, thin type heat pipe 100 is bent to Corresponding shape, and gland is above chip 60, and the heat-conducting mediums such as graphene patch or heat-conducting silicone grease can be used, and fills Gap between thin type heat pipe 100 and chip 60, to improve heat-conducting effect.

From the above technical scheme, electronic equipment provided by the embodiments of the present application, due to the heat-conducting effect of thin type heat pipe More preferably, therefore the heat that chip generates will can be more efficiently taken away, and the temperature of chip will be reduced, so as to guarantee chip in length In the case that time high load is run, reducing frequency phenomenon will not occur because temperature is excessively high, obtain the performance of chip sufficiently Stable performance promotes user experience so that the overall performance of electronic equipment is improved.

It should be noted that, in this document, the terms "include", "comprise" or its any other variant are intended to non-row His property includes, so that the process, method, article or equipment for including a series of elements not only includes those elements, and And further include other elements that are not explicitly listed, or further include for this process, method, article or equipment institute it is intrinsic Element.

Those skilled in the art will readily occur to its of the application after considering specification and practicing application disclosed herein Its embodiment.This application is intended to cover any variations, uses, or adaptations of the application, these modifications, purposes or Person's adaptive change follows the general principle of the application and including the undocumented common knowledge in the art of the application Or conventional techniques.The description and examples are only to be considered as illustrative, and the true scope and spirit of the application are by following Claim is pointed out.

It should be understood that the application is not limited to the precise structure that has been described above and shown in the drawings, and And various modifications and changes may be made without departing from the scope thereof.Scope of the present application is only limited by the accompanying claims.

Claims

1. a kind of thin type heat pipe characterized by comprising the tube body with cavity, the tube body both ends include convergent part, described The cavity cross-sectional area of convergent part is gradually reduced to far from the direction of the body central, and is formed in the tube body end closed Sealing；Capillary structure and working medium are provided in the cavity.

2. thin type heat pipe according to claim 1, which is characterized in that the capillary structure includes tow medium, the silk Shu Jiezhi is arranged along the tube body axis direction, and the cavity is separated into multiple cavities.

3. thin type heat pipe according to claim 2, which is characterized in that the capillary structure further includes grid medium, described The inner wall of the tube body is arranged in grid medium, and the tow medium is fitted on the grid medium.

4. thin type heat pipe according to claim 1, which is characterized in that the tube body includes multiple holly strips, the partition Piece separates the cavity at multiple cavities.

5. thin type heat pipe according to claim 4, which is characterized in that the capillary structure includes tow medium, the silk Shu Jiezhi is arranged in the cavity.

6. thin type heat pipe according to claim 4, which is characterized in that the capillary structure includes grid medium, the net The inner wall of the tube body is arranged in by holly strip support for lattice medium.

7. thin type heat pipe according to claim 1, which is characterized in that the convergent part is wedge structure.

8. thin type heat pipe according to claim 1-7, which is characterized in that the capillary structure is from the tube body One end closure extends to another end closure of the tube body.

9. thin type heat pipe according to claim 1-7, which is characterized in that it is described sealing include flat shape sealing, Tilted mouth shape sealing, stairstepping sealing and/or curved shape sealing in any one or a few.

10. a kind of production method of thin type heat pipe, which comprises the following steps:

In the arrangement of cavities capillary structure of tube body；

Described tube body one end is pressed using jig, forms convergent part, the cavity cross-sectional area of the convergent part is to far from the tube body The direction at center is gradually reduced, and forms closed sealing in the tube body end；

The cavity is vacuumized from the tube body other end and injects working medium；

The tube body other end is pressed using jig, forms the convergent part；

The tube body is pressed into flat pattern using stamping tool；

The sealing is passed through into welding and sealing.

11. according to the method described in claim 10, it is characterized in that, the capillary structure includes tow medium, the tow Medium is arranged along the tube body axis direction, the tow medium after the tube body is pressed into flat pattern by the cavity every It is broken into multiple cavities.

12. according to the method for claim 11, which is characterized in that the capillary structure further includes grid medium, the net The inner wall of the tube body is arranged in lattice medium, and the tow medium is fitted in the net after the tube body is pressed into flat pattern On lattice medium.

13. according to the method described in claim 10, it is characterized by further comprising:

The tube body includes multiple holly strips, and the holly strip separates cavity at more after the tube body is pressed into flat pattern A cavity.

14. according to the method for claim 13, which is characterized in that the capillary structure includes tow medium, the tow Medium is arranged between the holly strip, so that the tow medium is located at the chamber after the tube body is pressed into flat pattern In road.

15. according to the method for claim 13, which is characterized in that the capillary structure includes grid medium, the grid The opposite side of the holly strip is arranged in medium, so that after the tube body is pressed into flat pattern, the holly strip is by the net Inner wall of the lattice dielectric support in the tube body.

16. a kind of electronic equipment, which is characterized in that including the described in any item thin type heat pipes of claim 1-9, the thin-type heat Pipe is for the chip cooling for the electronic equipment.