CN109586161B - TO packaging-based semiconductor laser and packaging method thereof - Google Patents

Abstract

The invention belongs TO the technical field of laser manufacturing, and aims TO provide a TO packaging-based semiconductor laser and a packaging method thereof. During packaging, the focusing assembly is firstly inserted into the mounting groove from the axial direction and is circumferentially limited on the base cylinder, then the TO packaging assembly is inserted into the positioning cylinder of the focusing assembly and is circumferentially limited on the positioning cylinder, and finally the packaged cylinder is sleeved on the inserting part of the base cylinder from the axial direction and is spirally connected with the inserting part of the base cylinder, so that the focusing assembly and the light-emitting assembly are packaged in the mounting groove of the base cylinder.

Description

TO packaging-based semiconductor laser and packaging method thereof

Technical Field

The invention belongs TO the technical field of laser manufacturing, and particularly relates TO a TO packaging-based semiconductor laser and a packaging method thereof.

Background

With the continuous development of technology, the packaging technology of semiconductor lasers includes butterfly package, TO package, and the like. Among them, the TO (Transistor Outline, which is defined as a Transistor package at the earliest time) package refers TO a coaxial package, and belongs TO a totally enclosed package, and is widely used in the package of optoelectronic devices such as laser diodes due TO its advantages of simple manufacturing process, low production cost, convenience in flexible use, and the like. However, the conventional TO packaged semiconductor laser is often complex in manufacturing process and has high requirement on professional skills of a manufacturer. In addition, when the device is repaired, the material reuse rate is low, the interchangeability of the original parts is poor, so that the reliability of the product is reduced, the use cost is high, and the after-sale maintenance is difficult.

Disclosure of Invention

The invention aims TO provide a TO packaging-based semiconductor laser, which is used for solving the technical problems of low material reutilization rate of the TO packaging semiconductor laser, low final reliability and high use cost caused by poor interchangeability of original parts in the prior art.

In order to solve the technical problems, the invention adopts the technical scheme that: the TO-package-based semiconductor laser comprises a base barrel, wherein the base barrel comprises a plug-in part and a coupling part; in the axial direction of the base cylinder, the insertion part is provided with an installation groove, and the coupling part is provided with a light outlet communicated with the installation groove; the TO packaging-based semiconductor laser also comprises an optical fiber inserted in the light outlet hole and an optical coupling assembly detachably inserted in the mounting groove;

the optical coupling assembly comprises a focusing assembly which is inserted into the mounting groove from the axial direction and can be circumferentially limited on the base cylinder and a TO packaging assembly which can be circumferentially limited on the focusing assembly, and the TO packaging assembly comprises a light emitting assembly which can couple emitted light beams TO the optical fiber from the light outlet hole TO output the light beams after being focused by the focusing assembly;

the optical coupling assembly further comprises a packaging rear barrel which is sleeved on the plug-in part from the axial direction, and the inner side wall of the packaging rear barrel is in spiral connection with the plug-in part of the base barrel so as to fixedly install the focusing assembly and the light-emitting assembly in the installation groove in a closed manner at one time.

Further, the focusing assembly comprises a positioning cylinder, a lens assembly and a lens locking ring; in the axial direction, the positioning cylinder is sequentially provided with a first mounting hole for mounting the light-emitting assembly, a second mounting hole for mounting the lens assembly and a threaded hole for spirally connecting one end of the lens locking ring so that the lens assembly can be fixed in the second mounting hole by the lens locking ring.

Furthermore, a limiting convex rib used for preventing the lens assembly from moving towards the light-emitting assembly is convexly arranged between the first mounting hole and the second mounting hole of the positioning cylinder.

Furthermore, the lens assembly comprises a focusing lens and a lens barrel which is abutted against the limiting convex rib by the lens locking ring and is used for protecting the focusing lens.

Further, the TO package-based semiconductor laser further comprises an elastic member located in the mounting groove, one end of the elastic member abuts against the other end of the lens locking ring, and the other end of the elastic member abuts against the bottom of the mounting groove.

Furthermore, in the one side that is close to the mounting groove open end, at least one spacing groove has been seted up around the central axis on the inside wall of base section of thick bamboo, be equipped with at least one spacing arch around protruding on the lateral wall of location section of thick bamboo, spacing arch with the spacing groove one-to-one just can be spacing in corresponding the spacing inslot.

Further, the TO encapsulation subassembly still includes the TO base, the TO base includes the pedestal, in keeping away from one side of screw hole, the location section of thick bamboo still seted up along the axis direction with first mounting hole communicates with each other and is used for installing the spacing hole of pedestal.

Furthermore, at least one groove is formed in the peripheral wall of the base body, at least one rotation stopping protrusion is arranged on the hole wall of the limiting hole in a protruding mode, and the rotation stopping protrusion corresponds to the groove in a one-to-one mode and can be limited in the corresponding groove.

Furthermore, the optical coupling assembly further comprises a packaging front barrel sleeved at the coupling end of the base barrel and enclosing a sealed optical coupling space together with the base barrel.

Compared with the prior art, the TO packaging-based semiconductor laser has the beneficial effects that:

the TO-packaging-based semiconductor laser comprises a base cylinder and an optical coupling assembly, wherein in the axial direction of the base cylinder, a mounting groove is formed in a plugging part of the base cylinder, and a light outlet hole which is communicated with the mounting groove and is plugged with an optical fiber is formed in the coupling part; the optical coupling assembly comprises a focusing assembly which is inserted TO the mounting groove from the axial direction and can be circumferentially limited on the base cylinder, a TO packaging assembly which can be circumferentially limited on the focusing assembly and comprises a light emitting assembly and a packaging rear cylinder, wherein light beams emitted by the light emitting assembly can be coupled TO the optical fiber from the light emitting hole after being focused by the focusing assembly and output, and the packaging rear cylinder sleeves the insertion part of the base cylinder from the axial direction and is spirally connected with the insertion part of the base cylinder by the inner side wall, so that the focusing assembly and the light emitting assembly are fixedly mounted in the mounting groove of the base cylinder in a closed manner by an integrated thread sealing technology, and when a certain part such as the TO packaging assembly, the focusing assembly and the like is damaged, the optical coupling assembly can be timely dismounted and replaced, therefore, the material reutilization rate is high, the rejection rate is low, the interchangeability of product parts is high, the use cost is low, and the packaging technology is, shortening the manufacturing process and improving the production efficiency.

The invention also aims TO provide a packaging method for solving the technical problems that the manufacturing process of the TO packaged semiconductor laser is complex and the requirement on the professional skill of a producer is high in the prior art.

In order to solve the technical problems, the invention adopts the technical scheme that: a packaging method is provided, wherein the packaging method is the packaging method of the semiconductor laser based on the TO package, and the packaging method comprises the following steps:

s10: assembling the focusing assembly;

s20: inserting the focusing assembly into the mounting groove of the base cylinder along the axial direction of the base cylinder, then inserting the light-emitting assembly into the first mounting hole of the positioning cylinder, and finally inserting the rest parts of the TO packaging assembly into the positioning cylinder;

s30: along the axial direction of the base cylinder, the packaged cylinder is sleeved on the outer side wall of the base cylinder in a spiral connection manner so that the focusing assembly and the light-emitting assembly can be fixedly installed in the installation groove in a one-off closed manner;

s40: the optical fiber is installed.

Compared with the prior art, the packaging method of the TO-packaged semiconductor laser has the beneficial effects that:

according to the packaging method, the components are assembled step by step and are mutually sleeved, finally the packaged barrel is spirally connected and sleeved on the outer side wall of the base barrel, and the focusing component and the light-emitting component are fixedly installed in the installation groove in a closed manner.

Drawings

To more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic perspective view of a TO package-based semiconductor laser according TO an embodiment of the present invention;

fig. 2 is a perspective cross-sectional view of a body structure of a TO package based semiconductor laser in an embodiment of the present invention;

fig. 3 is a perspective exploded view of the body structure of a TO package based semiconductor laser in an embodiment of the present invention;

FIG. 4 is a schematic perspective view of the TO base of FIG. 2;

FIG. 5 is a schematic perspective view of the TO locator cylinder of FIG. 2;

FIG. 6 is a perspective cross-sectional view of the TO locator cylinder of FIG. 5;

FIG. 7 is a schematic perspective view of the base cartridge of FIG. 2;

FIG. 8 is a perspective cross-sectional view of the base cartridge of FIG. 7;

FIG. 9 is a schematic perspective view of the package front barrel of FIG. 2;

fig. 10 is a perspective sectional view of the package front barrel of fig. 9.

Wherein the reference numbers in the drawings are as follows:

100-base cylinder, 110-plug part, 111-limit groove, 112-mounting groove, 120-coupling part, 121-light-emitting hole and 122-support bar;

200-optical coupling component, 210-positioning barrel, 211-limiting hole, 2111-rotation stopping protrusion, 212-first mounting hole, 213-limiting convex rib, 214-second mounting hole, 215-threaded hole and 216-limiting protrusion;

220-lens assembly, 221-focusing lens, 222-lens barrel; 230-a lens locking ring;

240-TO packaging assemblies, 241-light emitting assemblies, 2411-TO pipe caps, 2412-light emitting units, 242-TO bases, 2421-base bodies, 24211-grooves, 2422-supporting bumps and 243-connecting pins;

250-packaging rear cylinder, 260-packaging front cylinder, 261-stepped hole, 262-connecting hole and 263-fixing hole;

300-spring, 400-optical transmission component, 410-optical fiber.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly understood, the present invention is further described in detail below with reference to the specific drawings and specific embodiments. In the drawings of the embodiments of the present invention, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions. It should be understood that the following description of specific embodiments is intended to illustrate and not to limit the invention.

It will be understood that when an element is referred to as being "fixed to" or "mounted to" or "provided on" or "connected to" another element, it can be directly or indirectly located on the other element. For example, when an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "length," "width," "upper," "lower," "left," "right," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like, refer to an orientation or position based on the orientation or position shown in the drawings, are for convenience of description only, and are not to be construed as limiting the present disclosure.

Furthermore, the terms "first" and "second" are used for convenience of description only and are not to be construed as indicating or implying relative importance or implying any number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise. In general, the specific meanings of the above terms will be understood by those of ordinary skill in the art as appropriate.

The following describes in detail an implementation of a TO package based semiconductor laser and a packaging method thereof according TO the present invention with reference TO fig. 1 TO 10.

The TO-package-based semiconductor laser is mainly applied TO medical treatment, electronic information technology, laser semiconductor, image display, and the like, and can be applied TO other suitable fields. In addition, the light source of the semiconductor laser mainly uses visible light, and the optical fiber 410 mainly uses a single mode optical fiber, but actually, the light source may also be ultraviolet light or near infrared light, and the optical fiber 410 may also be in other suitable forms.

Generally, compared with the prior art, the semiconductor laser based on the TO packaging is further integrated with a threaded connection packaging technology on the basis of the TO packaging technology, timely replacement of a TO packaging assembly and other parts is effectively guaranteed, if a certain part is damaged, the laser can be timely disassembled TO replace a new part for installation so as TO continue TO use, so that interchangeability of materials is high, the product rejection rate is low, and during production, manufacturing and later maintenance, requirements for professional skills of people are low, production processes are reduced, the manufacturing process is simpler and easier, and the production efficiency is higher.

As shown in fig. 2, 7 and 8, the TO package-based semiconductor laser includes a base can 100, and the base can 100 includes a plug portion 110 and a coupling portion 120. In the axial direction of the base cylinder 100, the insertion part 110 is provided with a mounting groove 112, and the coupling part 120 is provided with a light emitting hole 121 communicating with the mounting groove 112. In the embodiment, the cross section of the slot of the mounting slot 112 is circular, and the center line of the mounting slot 112, the center line of the light emitting hole 121 and the center line of the base cylinder 100 are located on the same straight line, which is beneficial to ensuring the simple and compact structure of the semiconductor laser and facilitating the light beam coupling.

As shown in fig. 2, the TO package-based semiconductor laser further includes an optical fiber 410 inserted into the light exit hole 121 and an optical coupling module 200 detachably inserted into the mounting groove 112. As further shown in FIG. 2, the optical coupling assembly 200 includes a focusing assembly (not shown), a TO package assembly 240, and a package rear can 250. Wherein, the focusing assembly is inserted into the mounting groove 112 of the base cylinder 100 from the axial direction and can be circumferentially limited on the base cylinder 100, that is, after the focusing assembly is inserted into the mounting groove 112 from the opening end of the mounting groove 112, it cannot rotate relative to the base cylinder 100. The TO encapsulation assembly 240 can be circumferentially retained on the focusing assembly, and it can be understood that the TO encapsulation assembly 240 cannot rotate relative TO the focusing assembly after being connected with the focusing assembly. The rear packaging cylinder 250 axially sleeves the socket 110 of the base cylinder 100, and specifically, the rear packaging cylinder 250 is sleeved by spirally connecting the inner sidewall thereof with the socket 110 of the base cylinder 100.

As further shown in fig. 2, the TO package assembly 240 includes a light emitting element 241, and in operation, a light beam emitted from the light emitting element 241 can be focused by the focusing element and then coupled TO the optical fiber 410 from the light exit hole 121 TO output a laser beam through the optical fiber 410. As can be understood from the above, when the package is produced, the focusing assembly is usually inserted into the mounting groove 112 of the base cylinder 100, then the TO package assembly 240 is inserted onto the focusing assembly, and finally the packaged cylinder 250 is axially sleeved on the insertion part 110 of the base cylinder 100 TO limit the movement of the focusing assembly and the light emitting assembly 241 in the axial direction, so as TO fixedly mount the focusing assembly and the light emitting assembly 241 in the mounting groove 112 in a closed manner at one time. Obviously, the production packaging process is simple, the requirement on professional technology of production workers is low, and the efficiency is high. In addition, since the post-package barrel 250 is screwed TO the base barrel 100, when the components in the mounting groove 112 are damaged or the TO package assembly 240 needs TO be replaced, the post-package barrel 250 can be directly screwed off TO directly replace the internal components. Therefore, the interchangeability of the materials is high, the materials are saved, and the rejection rate of the whole product is low.

Further, as one embodiment of the TO package based semiconductor laser provided by the present invention, as shown in fig. 2, the focusing assembly includes a positioning cylinder 210, a lens assembly 220, and a lens locking ring 230. As shown in fig. 2, 5 and 6, the positioning cylinder 210 has a first mounting hole 212, a second mounting hole 214 and a threaded hole 215 formed therein in order along the axial direction. To simplify the structure, facilitate the installation, and facilitate the coupling of the light beams, the center lines of the first mounting hole 212, the second mounting hole 214, and the threaded hole 215 are generally aligned with the center line of the positioning cylinder 210, and further aligned with the center line of the base cylinder 100.

It should be noted that the first mounting hole 212 is mainly used for mounting the light emitting component 241 of the TO package assembly 240, specifically, in this embodiment, as shown in fig. 2 and fig. 3, the light emitting component 241 includes a TO cap 2411 and a light emitting unit 2412, wherein the TO cap 2411 is adapted TO the first mounting hole 212 and is limited in the first mounting hole 212, and the light emitting unit 2412 is located in a sealed space formed by the TO cap 2411 and is protected by the TO cap 2411, so as TO ensure smooth transmission of optical signals. The second mounting hole 214 is used for mounting the lens assembly 220, and the threaded hole 215 is used for screwing with one end of the lens locking ring 230, so that the lens assembly 220 is fixed in the second mounting hole 214 through the lens locking ring 230, and the lens assembly 220 is prevented from moving towards the light exit hole 121, therefore, it can be understood that the focusing assembly is formed by assembling and fixing the lens assembly 220 through the positioning cylinder 210 and the lens locking ring 230.

Further, as a specific embodiment of the TO package based semiconductor laser provided by the present invention, as shown in fig. 2 and fig. 6, the positioning barrel 210 is convexly provided with a limiting rib 213 between the first mounting hole 212 and the second mounting hole 214, specifically in this embodiment, the size of the first mounting hole 212 is larger than that of the second mounting hole 214. The limiting rib 213 is mainly used to prevent the lens assembly 220 from moving toward the light emitting assembly 241. That is, the lens assembly 220 is clamped from both sides by the retaining ribs 213 and the lens locking ring 230 and retained in the second mounting hole 214.

Generally, as shown in fig. 2 and 3, the lens assembly 220 includes a focusing lens 221 and a lens barrel 222, wherein the lens barrel 222 is pressed against the position-limiting rib 213 by a lens locking ring 230, and the focusing lens 221 is mounted in the lens barrel 222 to protect the focusing lens 221. Specifically, in the present embodiment, the focusing lens 221 is an aspheric lens, wherein the aspheric surface side of the focusing lens 221 faces the light exit hole 121, and the planar side faces the light emitting element 241.

Further, as a specific embodiment of the TO package based semiconductor laser provided by the present invention, as shown in fig. 2 and 3, in order TO improve the safety of the focusing lens 221 when mounted, the TO package based semiconductor laser further includes an elastic member 300. As shown in fig. 2, the elastic member 300 is located in the mounting groove 112, and one end of the elastic member 300 abuts against the other end of the lens locking ring 230 and the other end abuts against the groove bottom of the mounting groove 112. Preferably, the elastic member 300 is an elastic washer. It is understood that in the present embodiment, the optical coupling assembly 200 is specifically formed by fixedly mounting the TO package assembly 240 and the focusing assembly in the mounting groove 112 of the base cylinder 100 by the package rear cylinder 250 and the elastic washer.

Further, as a specific embodiment of the TO package based semiconductor laser provided by the present invention, as shown in fig. 7 and 8, at least one limiting groove 111 is formed on the inner side wall of the base cylinder 100 around the central axis at a side close TO the opening end of the mounting groove 112. That is, the limiting grooves 111 are formed on the wall of the opening end of the mounting groove 112, and each limiting groove 111 is communicated with the mounting groove 112. Correspondingly, as shown in fig. 5 and 6, at least one limiting protrusion 216 is convexly arranged on the outer side wall of the positioning cylinder 210, wherein the limiting protrusions 216 correspond to the limiting grooves 111 one to one. Thus, when the assembled focusing assembly is inserted into the mounting groove 112 of the base cylinder 100, the position-limiting protrusion 216 of the positioning cylinder 210 is just located in the position-limiting groove 111 corresponding to the base cylinder 100, so that it is ensured that the focusing assembly inserted into the mounting groove 112 is not rotated in the base cylinder 100 and is limited in the corresponding position.

It should be noted that, in this embodiment, 4 limiting protrusions 216 are uniformly protruded on the positioning cylinder 210 around the center line of the positioning cylinder 210; correspondingly, around the central line of the base cylinder 100, 8 limiting grooves 111 are uniformly formed in the base cylinder 100, so that the focusing assembly can be conveniently inserted into the mounting groove 112 of the base cylinder 100 from a plurality of angles, and alignment and packaging are facilitated.

Further, as an embodiment of the TO package based semiconductor laser provided by the present invention, as shown in fig. 4, the TO package assembly 240 further includes a TO submount 242. As shown in fig. 3 and 4, the TO base 242 includes a seat 2421 and a support protrusion 2422 protruded from the axial direction of the seat 2421. Generally, as shown in fig. 3, the supporting protrusions 2422 are used for supporting the light emitting units 2412 of the light emitting device 241. Generally, as shown in fig. 1 TO 3, the TO package assembly 240 further includes a connecting pin 243, wherein the connecting pin 243 is plugged on the base 2421 TO power the light emitting unit 2412 supported on the supporting bump 2422. It will be appreciated that the TO base 242, connector pins 243, TO cap 2411 and light emitting unit 2412 will collectively comprise the TO package assembly 240. When packaged, typically, one end of the connector pins 243 is located inside the laser and the other end extends outside the packaged barrel 250 for connection to an external power source.

As shown in fig. 2, 5 and 6, on the side away from the threaded hole 215 of the positioning cylinder 210, the positioning cylinder 210 is further provided with a limiting hole 211 communicated with the first mounting hole 212 along the axial direction. The size of the limiting hole 211 is larger than that of the first mounting hole 212, and generally, the center line of the limiting hole 211 is located on the same straight line with the center lines of the first mounting hole 212, the limiting rib 213, the second mounting hole 214 and the threaded hole 215. In the present embodiment, the seat 2421 is adapted to the position-limiting hole 211. During packaging, as shown in fig. 2, the seat 2421 can be just accommodated in the limiting hole 211 and cannot move toward the light exit hole 121.

Further, as a specific embodiment of the TO package based semiconductor laser provided by the present invention, as shown in fig. 4, at least one groove 24211 is formed on the outer circumferential wall of the seat 2421 around the center line of the seat 2421, correspondingly, the hole wall of the limiting hole 211 of the positioning cylinder 210 is convexly provided on at least one rotation stopping protrusion 2111 around the center line of the positioning cylinder 210. The rotation-stopping protrusions 2111 correspond TO the grooves 24211 one TO one, that is, when the seat body 2421 is located in the limiting hole 211 of the positioning cylinder 210 during packaging, the rotation-stopping protrusions 2111 of the positioning cylinder 210 are just located in the grooves 24211 corresponding TO the seat body 2421, so that the TO base 242 in the TO package assembly 240 is limited in the limiting hole 211 and cannot rotate in the limiting hole 211.

Further, as an embodiment of the TO package based semiconductor laser provided by the present invention, as shown in fig. 1, 2, 9 and 10, TO facilitate beam coupling, the optical coupling assembly 200 further includes a package front barrel 260. The front packaging barrel 260 is sleeved on the coupling end of the base barrel 100 and encloses a sealed optical coupling space together with the base barrel 100.

Specifically, in the present embodiment, as shown in fig. 10, the front packaging barrel 260 is sequentially provided with a stepped hole 261, a connecting hole 262 and a fixing hole 263 along the axial direction, and since the portion of the coupling portion 120 of the base barrel 100 connected to the inserting portion 110 is composed of a plurality of steps, each step is accommodated in the stepped hole 261. In addition, as shown in fig. 3, the coupling part 120 of the base cylinder 100 is further protruded with a supporting bar 122 for supporting the optical fiber 410 in the axial direction.

As shown in fig. 1 and 2, the TO package-based semiconductor laser further includes an optical transmission module 400, wherein the optical transmission module 400 includes an optical fiber 410 and is inserted into the fixing hole 263 of the package front barrel 260. As shown in fig. 2, the optical fiber 410 extends from the fixing hole 263 into the connection hole 262 to be opposite to the light exit hole 121 of the base cartridge 100. Generally, to improve the optical coupling efficiency and quality, the center lines of the base cylinder 100, the positioning cylinder 210, the rear packaging cylinder 250, and the front packaging cylinder 260 are located on the same straight line and on the same straight line with the optical axis of the focused light beam. It is understood that, during packaging, after the rear packaging barrel 250 is screwed on, the front packaging barrel 260 is screwed on, and the optical transmission assembly 400 is installed in the fixing hole 263 of the front packaging barrel 260.

The invention also provides a packaging method, which is the packaging method of the TO packaging-based semiconductor laser, wherein the packaging method comprises the following steps:

s10: assembling the focusing assembly.

In this embodiment, the focusing assembly includes a lens assembly 220, a positioning cylinder 210, and a lens locking ring 230. Specifically, during packaging, the lens assembly 220 is first placed in the second mounting hole 214 of the positioning cylinder 210 along the axial direction of the positioning cylinder 210, and then one end of the lens locking ring 230 is screwed into the threaded hole 215 of the positioning cylinder 210 until the lens assembly 220 abuts against the limiting rib 213 of the positioning cylinder 210 and cannot move axially by screwing the lens locking ring 230.

S20: in the axial direction of the base cylinder 100, the focusing assembly is inserted into the mounting groove 112 of the base cylinder 100, then the light emitting assembly 241 is inserted into the first mounting hole 212 of the positioning cylinder 210, and finally the rest of the TO package assembly 240 is inserted into the positioning cylinder 210.

Specifically, in the present embodiment, the elastic washer is placed in the mounting groove 112 of the base cylinder 100 along the axial direction of the base cylinder 100, and then the focusing assembly is inserted into the mounting groove 112 of the base cylinder 100 until the lens locking ring 230 of the focusing assembly pushes the elastic washer into abutment with the mounting groove 112 of the base cylinder 100, and in addition, it is required to ensure that each limit protrusion 216 of the positioning cylinder 210 is correspondingly disposed in the limit groove 111 of the base cylinder 100 to prevent the focusing assembly from rotating in the mounting groove 112;

then, the light emitting element 241 of the TO package assembly 240 is inserted into the first mounting hole 212 of the positioning cylinder 210 along the axial direction of the base cylinder 100; finally, the TO base 242 of the TO package assembly 240 is inserted into the limiting hole 211 of the positioning cylinder 210, and at this time, it is required TO ensure that each rotation stopping protrusion 2111 of the positioning cylinder 210 is correspondingly accommodated in the groove 24211 of the TO base 242, so that the TO base 242 cannot rotate.

S30: the rear packaging cylinder 250 is spirally connected to the outer side wall of the base cylinder 100 along the axial direction of the base cylinder 100 so that the focusing assembly and the light emitting assembly 241 can be fixedly installed in the installation groove 112 in a one-off closed manner.

Specifically, in the present embodiment, the rear packaging barrel 250 is screwed on the outer sidewall of the inserting part 110 of the base barrel 100 along the axial direction of the base barrel 100, so that the rear packaging barrel 250 is sleeved on the base barrel 100, and screwed TO the bottom plate (not shown) of the rear packaging barrel 250 TO tightly fix the TO base 242 of the TO packaging assembly 240 in the limiting hole 211, wherein during the screwing process, the connecting pins 243 of the TO packaging assembly 240 may pass through the avoiding holes (not shown) of the bottom plate (not shown) of the rear packaging barrel 250 and extend out of the rear packaging barrel 250.

S40: the optical fiber 410 is installed.

Specifically, in the present embodiment, the front packaging barrel 260 is screwed onto the outer sidewall of the coupling portion 120 of the base barrel 100 at the opposite side of the rear packaging barrel 250 until the front packaging barrel 260 and the rear packaging barrel 250 are seamlessly butted, and then the optical transmission assembly 400 is inserted into the fixing hole 263 of the front packaging barrel 260 until the fiber end of the optical fiber 410 passes through the connecting hole 262 of the front packaging barrel 260 to the stepped hole 261.

As is apparent from the above description, the packaging method mainly comprises the steps of inserting the focusing assembly into the base cylinder 100, then inserting the TO packaging assembly 240 onto the focusing assembly, and finally sleeving the packaged cylinder 250 onto the outer side wall of the base cylinder 100, so that the focusing assembly and the light emitting assembly 241 can be fixedly mounted in the mounting groove 112 of the base cylinder 100 at one time in a layer-by-layer insertion manner, obviously, the production processes are greatly reduced, the packaging process is simplified, the production efficiency is higher, in addition, the packaging skill of a producer is reduced, and the subsequent maintenance, disassembly and assembly are facilitated.

The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention. Various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the claims of the present invention.

Claims (8)

1. The TO packaging-based semiconductor laser is characterized by comprising a base barrel, wherein the base barrel comprises a plug-in part and a coupling part; in the axial direction of the base cylinder, the insertion part is provided with an installation groove, and the coupling part is provided with a light outlet communicated with the installation groove; the TO packaging-based semiconductor laser also comprises an optical fiber inserted in the light outlet hole and an optical coupling assembly detachably inserted in the mounting groove;

the optical coupling assembly comprises a focusing assembly which is inserted into the mounting groove from the axial direction and can be circumferentially limited on the base cylinder and a TO packaging assembly which can be circumferentially limited on the focusing assembly, and the TO packaging assembly comprises a light emitting assembly which can couple emitted light beams TO the optical fiber from the light outlet hole TO output the light beams after being focused by the focusing assembly;

the optical coupling assembly also comprises a packaging rear cylinder which is sleeved on the plug part from the axial direction, and the inner side wall of the packaging rear cylinder is in threaded connection with the plug part of the base cylinder so as to fixedly install the focusing assembly and the light-emitting assembly in the installation groove in a closed manner at one time;

the focusing assembly comprises a positioning cylinder, a lens assembly and a lens locking ring; in the axial direction, the positioning cylinder is sequentially provided with a limiting hole for mounting the TO packaging assembly, a first mounting hole for mounting the light emitting assembly, a second mounting hole for mounting the lens assembly and a threaded hole for spirally connecting one end of the lens locking ring so that the lens assembly can be fixed in the second mounting hole by the lens locking ring;

the TO-package-based semiconductor laser device further comprises an elastic piece, wherein the elastic piece is positioned in the mounting groove, one end of the elastic piece is abutted against the other end of the lens locking ring, the other end of the lens locking ring is abutted against the bottom of the mounting groove, and the positioning cylinder and the lens locking ring are clamped and arranged between the packaging rear cylinder and the elastic piece.

2. The TO package based semiconductor laser of claim 1, wherein said positioning barrel is embossed with a limiting rib between said first mounting hole and said second mounting hole TO prevent said lens assembly from moving towards said light emitting assembly.

3. The TO package based semiconductor laser of claim 2, wherein said lens assembly comprises a focusing lens and a barrel abutted against said limiting rib by said lens locking ring for protecting said focusing lens.

4. The TO package based semiconductor laser as claimed in claim 1, wherein at least one limiting groove is formed on the inner sidewall of the base cylinder around the central axis at a side close TO the opening end of the mounting groove, at least one limiting protrusion is formed on the outer sidewall of the positioning cylinder around the protrusion, and the limiting protrusions are in one-TO-one correspondence with the limiting grooves and can be limited in the corresponding limiting grooves.

5. The TO package based semiconductor laser as claimed in claim 1, wherein the TO package assembly further comprises a TO base, the TO base comprises a base body, and a side away from the threaded hole, the positioning cylinder further defines a limiting hole along an axial direction, the limiting hole is communicated with the first mounting hole, and the limiting hole is used for mounting the base body.

6. A TO package based semiconductor laser as claimed in claim 5 wherein the peripheral wall of the base has at least one recess, the wall of the limiting hole has at least one rotation-stopping protrusion protruding therefrom, the rotation-stopping protrusions are in one-TO-one correspondence with the recesses and can be positioned in the corresponding recesses.

7. A TO package based semiconductor laser as claimed in any one of claims 1 TO 6 wherein said optical coupling assembly further comprises a front package barrel sleeved at said coupling end of said base barrel and enclosing a hermetically sealed optical coupling space together with said base barrel.

8. A packaging method for a TO package based semiconductor laser according TO any one of claims 1 TO 7, wherein the packaging method comprises the steps of:

s10: assembling the focusing assembly;

s20: inserting the focusing assembly into the mounting groove of the base cylinder along the axial direction of the base cylinder, then inserting the light-emitting assembly into the first mounting hole of the positioning cylinder, and finally inserting the rest parts of the TO packaging assembly into the positioning cylinder;

s30: along the axial direction of the base cylinder, the packaged cylinder is sleeved on the outer side wall of the base cylinder in a spiral connection manner so that the focusing assembly and the light-emitting assembly can be fixedly installed in the installation groove in a one-off closed manner;

s40: the optical fiber is installed.

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