CN109571783A - Spray structure, work piece cut system and the spraying method of cutting line - Google Patents
Spray structure, work piece cut system and the spraying method of cutting line Download PDFInfo
- Publication number
- CN109571783A CN109571783A CN201811612205.XA CN201811612205A CN109571783A CN 109571783 A CN109571783 A CN 109571783A CN 201811612205 A CN201811612205 A CN 201811612205A CN 109571783 A CN109571783 A CN 109571783A
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- China
- Prior art keywords
- cutting line
- line
- cutting
- workpiece
- wire casing
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/04—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools
- B28D5/045—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by tools other than rotary type, e.g. reciprocating tools by cutting with wires or closed-loop blades
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The present invention provides a kind of spray structure of cutting line, work piece cut system and spraying method, wherein, the spray structure of cutting line is applied to work piece cut system, the work piece cut system includes: cutting structure, including two line rollers and the cutting line being wrapped on the line roller, the line roller includes wire casing, and the cutting line is wrapped in the wire casing；Workpiece supply structure is fed for carrying workpiece and controlling the workpiece to the direction close to the cutting line；The spray structure includes: first nozzle structural, and the first nozzle structural includes first jet, for the wire casing and cutting line spray lapping liquid to the line roller, to clean the wire casing and the cutting line；Second nozzle structure, the second nozzle structure includes second nozzle, for spraying lapping liquid to the cutting line of neighbouring workpiece.The spray structure of cutting line according to an embodiment of the present invention enhances cleaning ability, improves cutting efficiency.
Description
Technical field
The present invention relates to semiconductor processing technology field, in particular to a kind of spray structure of cutting line, work piece cut system
System and spraying method.
Background technique
As the bore of ingot tends to heavy caliber, the width of the graph thinning of cutting line, multiple wire casings on line roller also becomes smaller,
The amount for cutting the cutting bits generated when wire cutting increases, and cutting bits are adhered on line and bring into the wire casing of line roller, with cutting
The cutting bits that carry out gradually increase, a large amount of cutting bits make cutting line that wire jumper (Wire jump) occur on the way in processing or cut
Line stick to each other (Wire Pairing), and cause to break, cutting efficiency is influenced, and be adhered to the cutting on cutting line
Bits, influence the processing quality of crystal column surface.Especially when cutting using diamond wire (Diamond wire), water-soluble oil is used
When as lapping liquid, it is made of since the component of water-soluble oil is most of moisture, the cutting fraction defective of crystal column surface can be aggravated, because
And the lubricant effect and cleaning effect of lapping liquid are also most important.
Summary of the invention
In view of this, the present invention provides a kind of spray structure of cutting line, there are two nozzle arrangements for setting, by two nozzles
Structure setting is in different positions, respectively to the wire casing on line roller and the cutting line being mounted in wire casing and close to the cutting of workpiece
Line is sprayed, and to clean the bits of the cutting on wire casing and cutting line, improves the effect of cutting.
The present invention also provides a kind of work piece cut systems of spray structure with above-mentioned cutting line.
In addition, the invention also provides a kind of spraying methods of cutting line.
In order to solve the above technical problems, the invention adopts the following technical scheme:
The spray structure of the cutting line of embodiment according to a first aspect of the present invention is applied to work piece cut system, the work
Part diced system includes:
Structure is cut, including two line rollers and the cutting line being wrapped on the line roller, the line roller includes wire casing, described
Cutting line is wrapped in the wire casing；
Workpiece supply structure is fed for carrying workpiece and controlling the workpiece to the direction close to the cutting line；
The spray structure includes:
First nozzle structural, the first nozzle structural include first jet, for wire casing to the line roller and described
Cutting line sprays lapping liquid, to clean the wire casing and the cutting line；
Second nozzle structure, the second nozzle structure includes second nozzle, for the cutting line to neighbouring workpiece
Spray lapping liquid.
Preferably, the first jet of the first nozzle structural is in horn-like.
Preferably, the open end of the horn-like first jet is arranged towards the line roller.
Preferably, the open end of the second nozzle is towards the workpiece setting, and spray direction and the cutting are linear
At there is angle.
The work piece cut system of embodiment according to a second aspect of the present invention, comprising:
Structure, including two line rollers are cut, the line roller is equipped with wire casing, is wound in the wire casing for cutting workpiece
Cutting line；
Workpiece moving structure, for carry workpiece and control the workpiece vertically to close to the cutting line direction into
It gives；And
Spray structure as described above.
Preferably, the spray structure is two groups, and spray structure described in two groups is separately positioned on the two sides of the workpiece.
Preferably, copper wire or resin-diamond line that the cutting line is copper wire, is electroplate with nickel.
The spraying method of the cutting line of embodiment according to a third aspect of the present invention, applied to cutting as described in above-described embodiment
The spray structure of secant, this method comprises:
Spray lapping liquid to the wire casing of the line roller and the cutting line that is wrapped in the wire casing, with clean the wire casing and
The cutting line；
Lapping liquid is sprayed to the cutting line of neighbouring workpiece.
Preferably, lapping liquid is sprayed to the wire casing and the cutting line from the open end of first jet to external diffusion
On.
Preferably, silicon carbide and additive are contained in the lapping liquid, the additive is polyethylene glycol, diethylene glycol (DEG) and does not have
One of propyl galate is a variety of.
Above-mentioned technical proposal of the invention one of at least has the advantages that:
The spray structure of cutting line according to an embodiment of the present invention, can on line roller wire casing and cutting line it is effectively clear
It washes, avoids cutting bits and be adhered in cutting line and wire casing, stick to each other between wire jumper or cutting line occurs in process
And the phenomenon that leading to broken string, cleaning ability is enhanced, cutting efficiency is improved.
Detailed description of the invention
Fig. 1 is the arragement construction schematic diagram of the spray structure of the cutting line of the embodiment of the present invention:
Fig. 2 is the spray state diagram of the second nozzle structure of the embodiment of the present invention；
Fig. 3 is the surface enlarged drawing of the wafer cut using the spray structure of traditional cutting line；
Fig. 4 is the surface enlarged drawing of the wafer cut using the spray structure of cutting line of the invention.
Appended drawing reference:
First nozzle structural 10；First jet 11；
Second nozzle structure 20；Second nozzle 21；
Cut structure 30；Line roller 31；Cutting line 32；
Workpiece supply structure 40；
Workpiece 50.
Specific embodiment
In order to make the object, technical scheme and advantages of the embodiment of the invention clearer, below in conjunction with the embodiment of the present invention
Attached drawing, the technical solution of the embodiment of the present invention is clearly and completely described.Obviously, described embodiment is this hair
Bright a part of the embodiment, instead of all the embodiments.Based on described the embodiment of the present invention, ordinary skill
Personnel's every other embodiment obtained, shall fall within the protection scope of the present invention.
The spray structure of cutting line according to an embodiment of the present invention is specifically described in conjunction with attached drawing first below.
As shown in Figure 1 to Figure 2, the spray structure of cutting line according to an embodiment of the present invention is applied to work piece cut system,
Work piece cut system includes cutting structure 30 and Workpiece supply structure 40.
Specifically, cutting structure 30 includes two line rollers 31 and winds the cutting line 32 on online roller 31, and line roller 31 includes
Wire casing (not shown), cutting line 32 are wrapped in wire casing, Workpiece supply structure 40 for carry workpiece 50 and control workpiece 50 to
It is fed close to the direction of cutting line 32, spray structure includes first nozzle structural 10 and second nozzle structure 20, first jet knot
Structure 10 includes first jet 11, for the wire casing and the spray lapping liquid of cutting line 32 to line roller 31, to clean wire casing and cutting line
32, second nozzle structure 20 includes second nozzle 21, for spraying lapping liquid to the cutting line 32 of neighbouring workpiece 50.
That is, 11 structure 10 of first jet can be set in the side of the line roller 31 of cutting structure 30, for spraying
Wire casing and cutting line 32, the cutting bits that the cutting in wire casing is considered to be worth doing and is adhered on cutting line 32 clean up, avoid cutting
Bits are adhered in cutting line 32 and wire casing, and stick to each other between wire jumper or cutting line 32 occurs in process and causes to break
The phenomenon that, the cutting line 32 at workpiece 50 is cleaned and sprayed by second nozzle structure 20, passes through different location
Two spray structures to the spray of cutting line 32, strengthen the cleaning dynamics to cutting line 32, it is ensured that cut on 50 surface of workpiece
Cut quality.
The spray structure of cutting line according to an embodiment of the present invention as a result, can effectively clean cutting line 32 and wire casing
Interior cutting bits ensure that the cut quality of workpiece 50, improve and cut the phenomenon that avoiding 32 wire jumper of cutting line, adhesion or break
Cut efficiency.
According to one embodiment of present invention, the first jet 11 of first nozzle structural 10 is in horn-like.That is, adopting
With horn-like first jet 11, make lapping liquid fan-shaped distribution when spraying in nozzle, liquid approach is misty, keeps drop natural
Be splashed on cutting line 32, reduce the impact force of liquid, avoid the damage of cutting line 32.
Preferably, the open end of horn-like first jet 11 is arranged towards line roller 31.That is, by first jet 11
The area of open end be overlapped the outer surface of online roller 31 as far as possible, and then the effect of spray can be improved.
According to another embodiment of the invention, the open end of second nozzle 21 is arranged towards workpiece 50, and sprays direction
Angle is formed with cutting line 32.
In other words, second nozzle 21 is arranged towards workpiece 50, and the relatively direction of cutting line 32 makes second nozzle 21
Cutting line 32 can be effectively sprayed, meanwhile, the lapping liquid sprayed can be made close to workpiece 50, to soak as far as possible convenient for lapping liquid
Enter the cut surface of workpiece 50, improves the cut quality of cutting line 32.
By taking the cutting of crystal bar as an example, after spraying cutting line using the spray structure of traditional cutting line, the wafer of cutting
Surface partial enlarged view, as shown in figure 3, crystal column surface out-of-flatness, cut quality is poor, and uses cutting line of the invention
The crystal column surface enlarged drawing that spray structure obtains, as shown in figure 4, crystal column surface is opposed flattened, smooth, cut quality is preferable.
It can be seen that the spray structure of cutting line according to an embodiment of the present invention, can effectively clean 31 wire casing of line roller
Interior cutting bits, enhance the cleaning dynamics to cutting line 32, avoid 32 wire jumper of cutting line, stick to each other or broken string, improve
The cut quality of workpiece 50.
The work piece cut system of embodiment according to a second aspect of the present invention, including cutting structure 30, workpiece moving structure and
The spray structure of cutting line.
Specifically, cutting structure 30 includes two line rollers 31, and line roller 31 is equipped with wire casing, is wound in wire casing for cutting
The cutting line 32 of workpiece 50, workpiece moving structure are used to carry workpiece 50 and control workpiece 50 vertically to the side close to cutting line 32
To feeding and the spray structure of the cutting line of above-described embodiment.
That is, first nozzle structural 10 to be arranged in the side of the line roller 31 of cutting structure 30, for spraying wire casing
And cutting line 32, the cutting bits that the cutting in wire casing is considered to be worth doing and is adhered on cutting line 32 clean up, and avoid cutting bits viscous
It is attached in cutting line 32 and wire casing, stick to each other between wire jumper or cutting line 32 occurs in process and causes to break, the
Two nozzle arrangements 20, which can be set, to be sprayed and is cleaned to cutting line 32 in the top of the cutting line 32 at workpiece 50, is led to
Spray of two spray structures to cutting line 32 for crossing different location, strengthens work piece cut system to the cleaning force of cutting line 32
Degree, it is ensured that the cutting quality on 50 surface of workpiece.
Preferably, the spray structure of cutting line is two groups, and two groups of spray structures are separately positioned on the two sides of workpiece 50.Also
It is to say, by being respectively arranged with the spray structure of cutting line in the two sides of workpiece moving structure, may be implemented to 50 two sides of workpiece
Cutting line 32 cleaned and sprayed, when parallel when being wound with more spaced cutting lines 32 on line roller 31, first
Multiple first jets 11 have can be set in nozzle arrangements 10, and multiple second nozzles 21 can be set in the second spray structure, so that often
A piece cutting line 32 and wire casing adequately can be sprayed and be cleaned, and improve the quality per a piece of cutting products.
Further, copper wire or resin-diamond line that cutting line 32 is copper wire, is electroplate with nickel.The cutting line 32 of the material
With preferable cutting effect, and advantage of lower cost.
Work piece cut system according to an embodiment of the present invention, including the spray structure according to the cutting line of above-described embodiment,
Since the spray structure of cutting line according to the above embodiment of the present invention has above-mentioned technique effect, it is real according to the present invention
The work piece cut system for applying example also has corresponding technical effect, can effectively clean the cutting in cutting line 32 and wire casing
Bits ensure that the cut quality of workpiece 50, improve cutting efficiency the phenomenon that avoiding 32 wire jumper of cutting line, adhesion or break.
The other structures of work piece cut system according to an embodiment of the present invention and operation are to those skilled in the art
All it is to be understood that and easy to accomplish, therefore is not described in detail.
The spraying method of the cutting line of embodiment according to a third aspect of the present invention, the cutting line applied to such as above-described embodiment
Spray structure, method includes the following steps:
Step 1, lapping liquid is sprayed to the wire casing of line roller 31 and the cutting line 32 being wrapped in wire casing, to clean wire casing and cut
Secant 32；
Step 2, lapping liquid is sprayed to the cutting line 32 of neighbouring workpiece 50.
That is, can generate many cutting bits when cutting line 32 cuts workpiece 50, cutting bits can accumulate online roller
In 31 cutting groove, by the cleaning in one position to wire casing and cutting line 32, while to cutting on another position
The cleaning that line is 32 2 times can excessively make 32 adhesion of cutting line or wire jumper influence cut quality and cutting efficiency to avoid cutting bits.
Preferably, lapping liquid is sprayed on wire casing and cutting line 32 from the open end of first jet 11 to external diffusion.?
That is making lapping liquid fan-shaped distribution when spraying in nozzle, liquid approach is misty, and drop is made naturally to be splashed to cutting line
On 32, the impact force of liquid is reduced, avoids the damage of cutting line 32.
Preferably, silicon carbide and additive are contained in lapping liquid, additive is polyethylene glycol, diethylene glycol (DEG) and gallic acid third
One of ester is a variety of.The group, which distributes lapping liquid, has preferable lubricity and cleaning ability, is more advantageous to wire casing and cuts
The cleaning of secant 32 improves the quality that workpiece 50 is cut.
The spraying method of cutting line according to an embodiment of the present invention as a result, can effectively clean cutting line 32 and wire casing
Interior cutting bits ensure that the cut quality of workpiece 50, improve and cut the phenomenon that avoiding 32 wire jumper of cutting line, adhesion or break
Cut efficiency.
Unless otherwise defined, technical term or scientific term used in the present invention are should be in fields of the present invention
The ordinary meaning that personage with general technical ability is understood." first ", " second " used in the present invention and similar word
It is not offered as any sequence, quantity or importance, and is used only to distinguish different component parts.Equally, "one" or
The similar word such as " one " does not indicate that quantity limits yet, but indicates that there are at least one." connection " or " connected " etc. are similar
Word is not limited to physics or mechanical connection, but may include electrical connection, it is either direct or between
It connects."upper", "lower", "left", "right" etc. are only used for indicating relative positional relationship, when the absolute position for being described object changes
Afterwards, then the relative positional relationship also correspondingly changes.
The above is a preferred embodiment of the present invention, it is noted that for those skilled in the art
For, without departing from the principles of the present invention, it can also make several improvements and retouch, these improvements and modifications
It should be regarded as protection scope of the present invention.
Claims (10)
1. a kind of spray structure of cutting line, which is characterized in that be applied to work piece cut system, the work piece cut system packet
It includes:
Structure is cut, including two line rollers and the cutting line being wrapped on the line roller, the line roller includes wire casing, the cutting
Line is wrapped in the wire casing；
Workpiece supply structure is fed for carrying workpiece and controlling the workpiece to the direction close to the cutting line；
The spray structure includes:
First nozzle structural, the first nozzle structural include first jet, for the line roller wire casing and the cutting
Line sprays lapping liquid, to clean the wire casing and the cutting line；
Second nozzle structure, the second nozzle structure includes second nozzle, for spraying to the cutting line of neighbouring workpiece
Lapping liquid.
2. the spray structure of cutting line according to claim 1, which is characterized in that the first spray of the first nozzle structural
Mouth is in horn-like.
3. the spray structure of cutting line according to claim 2, which is characterized in that the horn-like first jet is opened
Mouth end is arranged towards the line roller.
4. the spray structure of cutting line according to claim 1, which is characterized in that the open end direction of the second nozzle
The workpiece setting, and spray direction and be formed with angle with the cutting line.
5. a kind of work piece cut system characterized by comprising
Structure, including two line rollers are cut, the line roller is equipped with wire casing, is wound in the wire casing for cutting cutting for workpiece
Secant；
Workpiece moving structure is vertically fed to the direction close to the cutting line for carrying workpiece and controlling the workpiece；With
And
The spray structure of cutting line as described in claim any one of 1-4.
6. work piece cut system according to claim 5, which is characterized in that the spray structure is two groups, described in two groups
Spray structure is separately positioned on the two sides of the workpiece.
7. work piece cut system according to claim 5, which is characterized in that the cutting line is copper wire, is electroplate with nickel
Copper wire or resin-diamond line.
8. a kind of spraying method of cutting line, which is characterized in that applied to cutting line according to any one of claims 1-4
Spray structure, this method comprises:
Lapping liquid is sprayed to the wire casing of the line roller and the cutting line that is wrapped in the wire casing, to clean the wire casing and described
Cutting line；
Lapping liquid is sprayed to the cutting line of neighbouring workpiece.
9. the spraying method of cutting line according to claim 8, which is characterized in that by lapping liquid from the opening of first jet
It holds and is sprayed on the wire casing and the cutting line to external diffusion.
10. the spraying method of cutting line according to claim 8, which is characterized in that contain silicon carbide in the lapping liquid
And additive, the additive are one of polyethylene glycol, diethylene glycol (DEG) and propylgallate or a variety of.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811612205.XA CN109571783A (en) | 2018-12-27 | 2018-12-27 | Spray structure, work piece cut system and the spraying method of cutting line |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811612205.XA CN109571783A (en) | 2018-12-27 | 2018-12-27 | Spray structure, work piece cut system and the spraying method of cutting line |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109571783A true CN109571783A (en) | 2019-04-05 |
Family
ID=65933050
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811612205.XA Withdrawn CN109571783A (en) | 2018-12-27 | 2018-12-27 | Spray structure, work piece cut system and the spraying method of cutting line |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109571783A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1170456A (en) * | 1997-08-29 | 1999-03-16 | Tokyo Seimitsu Co Ltd | Wire cleaning device for fixed abrasive grain wire saw |
| CN103240805A (en) * | 2012-02-09 | 2013-08-14 | 硅电子股份公司 | Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece |
| CN203527673U (en) * | 2013-11-15 | 2014-04-09 | 英利能源（中国）有限公司 | Silicon block slicer |
| CN105216131A (en) * | 2014-06-11 | 2016-01-06 | 应用材料瑞士有限责任公司 | Chip cleaning system, silk saw and the method for the wafer in clean silk saw |
| CN108407118A (en) * | 2018-05-04 | 2018-08-17 | 江苏聚成金刚石科技有限公司 | A kind of diamond cutting line slicing machine |
-
2018
- 2018-12-27 CN CN201811612205.XA patent/CN109571783A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH1170456A (en) * | 1997-08-29 | 1999-03-16 | Tokyo Seimitsu Co Ltd | Wire cleaning device for fixed abrasive grain wire saw |
| CN103240805A (en) * | 2012-02-09 | 2013-08-14 | 硅电子股份公司 | Apparatus and method for simultaneously slicing a multiplicity of slices from a workpiece |
| CN203527673U (en) * | 2013-11-15 | 2014-04-09 | 英利能源（中国）有限公司 | Silicon block slicer |
| CN105216131A (en) * | 2014-06-11 | 2016-01-06 | 应用材料瑞士有限责任公司 | Chip cleaning system, silk saw and the method for the wafer in clean silk saw |
| CN108407118A (en) * | 2018-05-04 | 2018-08-17 | 江苏聚成金刚石科技有限公司 | A kind of diamond cutting line slicing machine |
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| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20190405 |
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| WW01 | Invention patent application withdrawn after publication |