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CN109473498A - Integrated backboard of a kind of encapsulation and preparation method thereof - Google Patents

Integrated backboard of a kind of encapsulation and preparation method thereof Download PDF

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Publication number
CN109473498A
CN109473498A CN201811360015.3A CN201811360015A CN109473498A CN 109473498 A CN109473498 A CN 109473498A CN 201811360015 A CN201811360015 A CN 201811360015A CN 109473498 A CN109473498 A CN 109473498A
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China
Prior art keywords
parts
layer
backboard
mixture
ultraviolet absorber
Prior art date
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Granted
Application number
CN201811360015.3A
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Chinese (zh)
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CN109473498B (en
Inventor
韩晓航
陈洪野
赵正柏
夏修旸
吴小平
宇野敬
宇野敬一
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Zhejiang Saiwu Application Technology Co ltd
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Suzhou Competition Application Technology Ltd By Share Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/0481—Encapsulation of modules characterised by the composition of the encapsulation material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
    • H01L31/042—PV modules or arrays of single PV cells
    • H01L31/048—Encapsulation of modules
    • H01L31/049—Protective back sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E10/00—Energy generation through renewable energy sources
    • Y02E10/50—Photovoltaic [PV] energy

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  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Laminated Bodies (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present invention provides integrated backboards of a kind of encapsulation and preparation method thereof.Encapsulation integration backboard of the invention, including the weathering layer, casing play and articulamentum set gradually from top to bottom, the weathering layer is weatherable materials layer, and the casing play is modified polyolefine material layer, and the articulamentum is TPO particulate material layer.Encapsulation integration backboard of the invention has good block-water performance, good with the bonding force of solar battery sheet, and long-time service does not generate light-heat aging phenomenon, and corrosion-free, good weatherability is used for a long time without xanthochromia；The preparation method of the integrated backboard of encapsulation of the invention, using three-layer co-extruded or lamination technique, one-pass molding does not need coating drying course, processing cost is relatively low without using glue because organic solvent pollution may be not present.

Description

Integrated backboard of a kind of encapsulation and preparation method thereof
Technical field
The invention belongs to encapsulating material technical field, it is related to a kind of integrated backboard of encapsulation and preparation method thereof.
Background technique
Conventional solar battery list glass modular construction is glass/glue film/cell piece/glue film/photovoltaic back, photovoltaic back Be encapsulating material in photovoltaic module and its important, play a supporting role to cell piece, at the same directly with external environment large area Contact, excellent insulating properties, barrier property and weatherability are an important factor for guarantee photovoltaic module can use steadily in the long term, but Be in the prior art, certain functions of lower layer's glue film and backboard be it is duplicate, on the one hand increase to a certain extent component at This, on the other hand makes preparation process more complicated.
CN202977464U discloses a kind of composite back plate used for solar batteries of high-barrier steam, and the composite back plate is Layer structure, is followed successively by weathering layer, high-obstruction and adhesive layer from top to bottom, and the high-obstruction is PET film, the PET Film coated on one SiO2Layer, plating one side are bonded with weathering layer.The backboard uses SiO2The PET film of coated on one is as high resistant Interlayer, plating SiO2It is bonded on one side with weathering layer.And adhesive layer directlys adopt cross-linking type EVA；It directly seals electricity when lamination Pond piece, it is easy to use, and water vapor barrier property is good, can achieve the purpose that extend component service life.But the composite back plate uses For PET as casing play, block-water performance is insufficient, need to additionally coat water blocking layer, and PET material itself to reach higher block-water performance Anti-hydrolytic performance is poor；Using EVA as adhesive layer, solar cell module in use, will receive light, heat, moisture Etc. the test of various environment, and the EVA to seal will due to the influence of adverse circumstances gradually aging, wherein moisture is deposited It is influenced greatly on EVA aging action；Because it not only can make various auxiliary agents be lost because hydrolyzing the effects of, and will cause EVA itself hydrolysis, the acetic acid generated after hydrolysis can also have the metal parts such as welding of accelerated ageing process, corrosion cell piece Effect, the service life of serious curtailment component, so, EVA can generate acidic materials during light-heat aging, have to product Corrosivity need to carry out extra process.
CN107749428A discloses a kind of composite package integrated function solar cell backboard, the photovoltaic back It is followed successively by weathering layer from outside to inside, adhesive layer, pet layer, adhesive layer, functional layer, the functional layer includes integrally formed milky white Layer and hyaline layer, wherein milky white layer is single or multi-layer structure, overall thickness is 20~200 μm, including modified inorganic filler 3~20 Part, 70~92 parts of modified resin, 0.3~9 part of ultraviolet absorber and 0.3~8 part of antioxidant, hyaline layer is bonded with cell piece, is adopted With single or multi-layer structure, overall thickness is 200~800 μm, including 90~98 parts of modified resin, 0.3~9 part of ultraviolet absorber with And 0.3~8 part of antioxidant.The invention can substitute traditional glue film using integrated function layer, not only have high durable, height anti- There is gain effect to component power while penetrating, high insulation, low water permeability energy, while protecting 25 years service life of component.But It is that the solar cell backboard uses coating processes in processing, and the product of production need to use adhesive, not environmentally friendly enough.
Summary of the invention
In view of the deficiencies of the prior art, one of the objects of the present invention is to provide a kind of integrated backboard of encapsulation, have good Good block-water performance, it is good with the bonding force of solar battery sheet, it is corrosion-free to cell piece, adhesive is not used, the feature of environmental protection is good, easily Recycling, good weatherability are used for a long time without xanthochromia.
To achieve this purpose, the present invention adopts the following technical scheme:
A kind of integrated backboard of encapsulation, it is described resistance to including the weathering layer, casing play and articulamentum set gradually from top to bottom Time layer is weatherable materials layer, and the casing play is modified polyolefine material layer, and the articulamentum is TPO particulate material layer.
Encapsulation integration backboard of the invention, casing play substitute PET, material water preventing ability itself using modified polyolefine material Can be excellent, anti-hydrolytic performance is also superior to PET material；Articulamentum substitutes EVA material using TPO particulate material, will not be due to photo-thermal Aging generates acidic materials and corrosion cell flake products.Encapsulation integration backboard of the invention has good block-water performance, with The bonding force of solar battery sheet is good, corrosion-free, good weatherability, is used for a long time without xanthochromia；Without using adhesive, therefore it is not present Organic contamination, the feature of environmental protection are good.
In the present invention, the modified polyolefine material layer is made of modified polyolefine material, by weight, the modification Polyolefine material includes following components:
Specifically, by weight, the modified polyolefine material includes following components:
70~100 parts of improved polyalkene, for example, improved polyalkene parts by weight be 70 parts, 71 parts, 72 parts, 73 parts, 74 parts, 75 parts, 76 parts, 77 parts, 78 parts, 79 parts, 80 parts, 81 parts, 82 parts, 83 parts, 84 parts, 85 parts, 86 parts, 87 parts, 88 parts, 89 parts, 90 Part, 91 parts, 92 parts, 93 parts, 94 parts, 95 parts, 96 parts, 97 parts, 98 parts, 99 parts, 100 parts.
0~30 part of toughener, such as the parts by weight of toughener are 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 parts, 9 Part, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 Part, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts.
0.1~0.3 part of ultraviolet absorber, such as the parts by weight of ultraviolet absorber are 0.1 part, 0.15 part, 0.2 part, 0.25 Part, 0.3 part.
0.3~0.8 part of antioxidant, for example, antioxidant parts by weight be 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part.
In the present invention, the TPO particulate material layer is made of TPO particulate material, by weight, the TPO particle material Material includes following components:
Specifically, by weight, the TPO particulate material includes following components:
60~100 parts of POE resin, for example, POE resin parts by weight be 60 parts, 61 parts, 62 parts, 63 parts, 64 parts, 65 parts, 66 parts, 67 parts, 68 parts, 69 parts, 70 parts, 71 parts, 72 parts, 73 parts, 74 parts, 75 parts, 76 parts, 77 parts, 78 parts, 79 parts, 80 parts, 81 Part, 82 parts, 83 parts, 84 parts, 85 parts, 86 parts, 87 parts, 88 parts, 89 parts, 90 parts, 91 parts, 92 parts, 93 parts, 94 parts, 95 parts, 96 Part, 97 parts, 98 parts, 99 parts, 100 parts.
0~40 part of OBC resin, such as the parts by weight of OBC resin are 0 part, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 Part, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 Part, 40 parts.
0.05~0.2 part of peroxide cross-linking agent, for example, peroxide cross-linking agent parts by weight be 0.05 part, 0.06 part, 0.07 part, 0.08 part, 0.09 part, 0.1 part, 0.11 part, 0.12 part, 0.13 part, 0.14 part, 0.15 part, 0.16 part, 0.17 part, 0.18 part, 0.19 part, 0.2 part.
1~3 part of silane coupling agent, for example, silane coupling agent parts by weight be 1 part, 1.1 parts, 1.2 parts, 1.3 parts, 1.4 parts, 1.5 parts, 1.6 parts, 1.7 parts, 1.8 parts, 1.9 parts, 2 parts, 2.1 parts, 2.2 parts, 2.3 parts, 2.4 parts, 2.5 parts, 2.6 parts, 2.7 parts, 2.8 parts, 2.9 parts, 3 parts.
0.1~0.5 part of ultraviolet absorber, such as the parts by weight of ultraviolet absorber are 0.1 part, 0.15 part, 0.2 part, 0.25 Part, 0.3 part, 0.35 part, 0.4 part, 0.45 part, 0.5 part.
0.3~0.8 part of light stabilizer, for example, light stabilizer parts by weight be 0.3 part, 0.35 part, 0.4 part, 0.45 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part.
0.05~0.3 part of antioxidant, for example, antioxidant parts by weight be 0.05 part, 0.06 part, 0.07 part, 0.08 part, 0.09 part, 0.1 part, 0.11 part, 0.12 part, 0.13 part, 0.14 part, 0.15 part, 0.16 part, 0.17 part, 0.18 part, 0.19 part, 0.2 part, 0.21 part, 0.22 part, 0.23 part, 0.24 part, 0.25 part, 0.26 part, 0.27 part, 0.28 part, 0.29 part, 0.3 part.
In the present invention, the weathering layer is made of weatherable materials, and by weight, the weatherable materials include with the following group Point:
Specifically, by weight, the weatherable materials include following components:
20~40 parts of modified poly ethylene, for example, modified poly ethylene parts by weight be 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts, 31 parts, 32 parts, 33 parts, 34 parts, 35 parts, 36 parts, 37 parts, 38 parts, 39 parts, 40 Part.
50~70 parts of modified polypropene, for example, modified polypropene parts by weight be 50 parts, 51 parts, 52 parts, 53 parts, 54 parts, 55 parts, 56 parts, 57 parts, 58 parts, 59 parts, 60 parts, 61 parts, 62 parts, 63 parts, 64 parts, 65 parts, 66 parts, 67 parts, 68 parts, 69 parts, 70 Part.
0.2~0.5 part of antioxidant, for example, antioxidant parts by weight be 0.2 part, 0.25 part, 0.3 part, 0.35 part, 0.4 part, 0.45 part, 0.5 part.
0.3~0.8 part of ultraviolet absorber, such as the parts by weight of ultraviolet absorber are 0.3 part, 0.35 part, 0.4 part, 0.45 Part, 0.5 part, 0.55 part, 0.6 part, 0.65 part, 0.7 part, 0.75 part, 0.8 part.
10~30 parts of titanium dioxide, such as the parts by weight of titanium dioxide are 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 Part, 17 parts, 18 parts, 19 parts, 20 parts, 21 parts, 22 parts, 23 parts, 24 parts, 25 parts, 26 parts, 27 parts, 28 parts, 29 parts, 30 parts.
In the present invention, the articulamentum further includes titanium dioxide.
Preferably, the articulamentum, by weight, including following components:
80~100 parts of TPO particulate material
0~20 part of titanium dioxide.
Specifically, the articulamentum, by weight, including following components:
80~100 parts of TPO particulate material, such as the parts by weight of TPO particulate material are 80 parts, 81 parts, 82 parts, 83 parts, 84 Part, 85 parts, 86 parts, 87 parts, 88 parts, 89 parts, 90 parts, 91 parts, 92 parts, 93 parts, 94 parts, 95 parts, 96 parts, 97 parts, 98 parts, 99 Part, 100 parts.
0~20 part of titanium dioxide, such as the parts by weight of titanium dioxide are 0 part, 1 part, 2 parts, 3 parts, 4 parts, 5 parts, 6 parts, 7 parts, 8 Part, 9 parts, 10 parts, 11 parts, 12 parts, 13 parts, 14 parts, 15 parts, 16 parts, 17 parts, 18 parts, 19 parts, 20 parts.
The ultraviolet absorber is to Benzophenone class ultraviolet absorber, benzotriazole ultraviolet absorber, salicylic acid esters One of ultraviolet absorber, group-substituted acrylonitrile ultraviolet absorber and triazines ultraviolet absorber or at least two mixing Object, such as the mixture are the mixture to Benzophenone class ultraviolet absorber and benzotriazole ultraviolet absorber, to benzene first The mixture of ketone ultraviolet absorber and salicylate type ultraviolet absorbent, to Benzophenone class ultraviolet absorber and substituted acrylonitrile The mixture of class ultraviolet absorber, to the mixture of Benzophenone class ultraviolet absorber and triazines ultraviolet absorber, benzotriazole The mixture of class ultraviolet absorber and salicylate type ultraviolet absorbent, benzotriazole ultraviolet absorber and group-substituted acrylonitrile The mixture of ultraviolet absorber, the mixture of benzotriazole ultraviolet absorber and triazines ultraviolet absorber, salicylic acid esters The mixture of ultraviolet absorber and group-substituted acrylonitrile ultraviolet absorber, salicylate type ultraviolet absorbent and the ultraviolet suction of triazines Receive the mixture of agent, the mixture of group-substituted acrylonitrile ultraviolet absorber and triazines ultraviolet absorber；The mixture may be used also Think the mixture to Benzophenone class ultraviolet absorber, benzotriazole ultraviolet absorber and salicylate type ultraviolet absorbent, It is right to the mixture of Benzophenone class ultraviolet absorber, benzotriazole ultraviolet absorber and group-substituted acrylonitrile ultraviolet absorber The mixture of Benzophenone class ultraviolet absorber, benzotriazole ultraviolet absorber and triazines ultraviolet absorber, to Benzophenone class The mixture of ultraviolet absorber, salicylate type ultraviolet absorbent and group-substituted acrylonitrile ultraviolet absorber is purple to Benzophenone class The mixture of outer absorbent, salicylate type ultraviolet absorbent and triazines ultraviolet absorber, to Benzophenone class ultraviolet absorber, The mixture of group-substituted acrylonitrile ultraviolet absorber and triazines ultraviolet absorber, benzotriazole ultraviolet absorber, salicylic acid The mixture of esters ultraviolet absorber and group-substituted acrylonitrile ultraviolet absorber, benzotriazole ultraviolet absorber, salicylate The mixture of class ultraviolet absorber and triazines ultraviolet absorber, benzotriazole ultraviolet absorber, group-substituted acrylonitrile are ultraviolet The mixture of absorbent and triazines ultraviolet absorber, salicylate type ultraviolet absorbent, group-substituted acrylonitrile ultraviolet absorber With the mixture of triazines ultraviolet absorber；The mixture may be to Benzophenone class ultraviolet absorber, benzotriazole The mixture of ultraviolet absorber, salicylate type ultraviolet absorbent and group-substituted acrylonitrile ultraviolet absorber is purple to Benzophenone class Outer absorbent, benzotriazole ultraviolet absorber, salicylate type ultraviolet absorbent and triazines ultraviolet absorber mixture, Benzotriazole ultraviolet absorber, salicylate type ultraviolet absorbent, group-substituted acrylonitrile ultraviolet absorber and triazines are ultraviolet The mixture of absorbent；The mixture can also be for Benzophenone class ultraviolet absorber, benzotriazole ultraviolet absorber, bigcatkin willow The mixture of esters of gallic acid ultraviolet absorber, group-substituted acrylonitrile ultraviolet absorber and triazines ultraviolet absorber.
The antioxidant is for one of phenol system antioxidant, phosphite ester system antioxidant and suffocated amine antioxidant or at least Two kinds of mixture.Such as the mixture is the mixture of phenol system antioxidant and phosphite ester system antioxidant, phenol system antioxidant With the mixture of suffocated amine antioxidant, the mixture of phosphite ester system antioxidant and suffocated amine antioxidant, the mixture It can also be phenol system antioxidant, the mixture of phosphite ester system antioxidant and suffocated amine antioxidant.
The light stabilizer be bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate, poly-succinic (hydroxyl -2 4-, 2,6,6- tetramethyl-1- piperidine ethanol) ester, it is poly- [6- [(1,1,3,3- tetramethyl butyl)-imino group] triazine-2-1,3,5-, 4- diyl] [2- (2,2,6,6- tetramethyl-piperidyl)-nitrogen base]-inferior hexyl-[4- (2,2,6,6- tetramethyl-piperidyl)-ammonia Base] } one of or at least two mixture.
The modified poly ethylene is high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene and supra polymer One of weight northylen or at least two mixture, such as the mixture be high density polyethylene (HDPE), low density polyethylene (LDPE) Mixture, the mixture of high density polyethylene (HDPE) and linear low density polyethylene, high density polyethylene (HDPE) and superhigh molecular weight polyethylene The mixture of alkene, the mixture of low density polyethylene (LDPE), linear low density polyethylene, low density polyethylene (LDPE) and superhigh molecular weight polyethylene The mixture of the mixture of alkene, linear low density polyethylene and ultra-high molecular weight polyethylene；The mixture can also be high density The mixture of polyethylene, low density polyethylene (LDPE) and linear low density polyethylene, high density polyethylene (HDPE), low density polyethylene (LDPE) and superelevation The mixture of molecular weight polyethylene, the mixture of low density polyethylene (LDPE), linear low density polyethylene and ultra-high molecular weight polyethylene； The mixture can also be high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene and ultra-high molecular weight polyethylene Mixture.
The modified polypropene is one of homopolypropylene, copolymer polypropylene and random polypropylene or at least two Mixture, such as the mixture of the mixture homopolypropylene and copolymer polypropylene, homopolypropylene and random polypropylene The mixture of mixture, copolymer polypropylene and random polypropylene；The mixture can also for homopolypropylene, copolymer polypropylene and The mixture of random polypropylene.Wherein, homopolypropylene provides material stiffness, hardness and heat resistance, while preventing from being laminated There is woven design, toughness needed for copolymer polypropylene and random polypropylene cooperation provide material in weathering layer in journey, and three kinds of materials can be protected Demonstrate,prove excellent water vapor barrier property.
The improved polyalkene is one of modified polypropene, modified poly ethylene, polyester, nylon and polyethers or at least two The mixture of kind.
The weathering layer with a thickness of 20~80 μm, such as weathering layer with a thickness of 20 μm, 25 μm, 30 μm, 35 μm, 40 μ m、45μm、50μm、55μm、60μm、65μm、70μm、75μm、80μm。
Preferably, the casing play with a thickness of 150~400 μm, such as casing play with a thickness of 150 μm, 160 μm, 170 μm、180μm、190μm、200μm、210μm、220μm、230μm、240μm、250μm、260μm、270μm、280μm、290μm、 300μm、310μm、320μm、330μm、340μm、350μm、360μm、370μm、380μm、390μm、400μm。
Preferably, the articulamentum with a thickness of 200~600 μm, such as articulamentum with a thickness of 200 μm, 210 μm, 220 μm、230μm、240μm、250μm、260μm、270μm、280μm、290μm、300μm、310μm、320μm、330μm、340μm、 350μm、360μm、370μm、380μm、390μm、400μm、500μm、510μm、520μm、530μm、540μm、550μm、560μ m、570μm、580μm、590μm、600μm。
The second object of the present invention is to provide a kind of preparation method for encapsulating integrated backboard, using three-layer co-extruded or leaching Membrane process, one-pass molding do not need coating drying course, processing cost without using glue because organic solvent pollution may be not present Relatively low, the preparation method includes the following steps: for weatherable materials, modified polyolefine material and TPO particulate material to be put into In extruder, after heating melting, the envelope of the weathering layer, casing play and the articulamentum that are set gradually from top to bottom after three-layer co-extruded Fill integrated backboard；Or
The preparation method includes the following steps: for weatherable materials, modified polyolefine material to be put into extruder, and heating is molten Melt, film extrusion；Simultaneously TPO particulate material is put into extruder, heating melting, lamination in the skeleton level squeezed out, Then cooling and shaping obtains encapsulating integrated backboard.
Wherein, when extrusion, the weatherable materials, the temperature of the modified polyolefine material are 180~240 DEG C, such as institute State weatherable materials, the temperature of the modified polyolefine material is 180 DEG C, 190 DEG C, 200 DEG C, 210 DEG C, 220 DEG C, 230 DEG C, 240 ℃；The temperature of the TPO particulate material is 120~180 DEG C, such as the temperature of TPO particulate material is 120 DEG C, 130 DEG C, 140 ℃、150℃、160℃、170℃、180℃。
Preferably, further include the steps that the articulamentum is quickly cooled down after the three-layer co-extruded technique.Due to articulamentum phase Lower to casing play and weathering layer melting temperature, articulamentum need to be rapidly cooled with steel rider face contact, prevent roll banding.It produces It after product go out die head, is quickly cooled down after two rubber rollers are formed through steel rider, wherein the temperature of rubber rollers is 10~15 DEG C, steel rider Temperature is 5~10 DEG C.
Compared with prior art, the invention has the benefit that
(1) encapsulation integration backboard of the invention, carcass middle layer layer substitute PET, material using modified polyolefine material Block-water performance itself is excellent, wherein its water vapor transmittance of the PET film of 230 μ m thicks is generally in 2.2g/m2Day or more, and Its water vapor transmittance of the polyolefin film of 230 μ m thicks is in 0.9g/m2Within day, anti-hydrolytic performance is also superior to PET material； Innermost layer articulamentum substitutes EVA using TPO particulate material, will not produce since light-heat aging generates acidic materials corrosion cell piece Product；The integrated backboard of encapsulation of the invention and solar battery sheet have excellent bonding force, and bonding force is greater than 60N/cm； Effective insulation thickness that 1000v system voltage component DTI test encapsulates integrated backboard is greater than 150 μm, 1500v system voltage group Effective insulation thickness that part DTI test encapsulates integrated backboard is greater than 300 μm, meets the requirement of IEC61730-1 second part； The good weatherability for encapsulating integrated backboard, is used for a long time without xanthochromia.
(2) preparation method of the integrated backboard of encapsulation of the invention, using three-layer co-extruded or lamination technique, one-pass molding, Without using glue because organic solvent pollution may be not present, coating drying course is not needed, processing cost is relatively low.
Specific embodiment
The technical scheme of the invention is further explained by means of specific implementation.
Unless specific instructions, various raw materials of the invention are commercially available buys, or is prepared according to the conventional method of this field It obtains.
The preparation method that the present invention encapsulates integrated backboard includes the following steps: weatherable materials, modified polyolefine material It is put into extruder with TPO particulate material, heating melting, weathering layer, the bone set gradually from top to bottom after three-layer co-extruded The encapsulation integration backboard of rack-layer and articulamentum；Or
The preparation method includes the following steps: for weatherable materials, modified polyolefine material to be put into extruder, and heating is molten Melt, film extrusion；Simultaneously TPO particulate material is put into extruder, heating melting, lamination in the skeleton level squeezed out, Then cooling and shaping obtains encapsulating integrated backboard.
Embodiment 1
The encapsulation integration backboard of the present embodiment, including the weathering layer, casing play and articulamentum set gradually from outside to inside, Wherein, each layer composition is as follows:
Articulamentum includes: 95 parts of TPO particulate material by weight, and 5 parts of titanium dioxide, with a thickness of 350 μm；
Casing play includes: 90 parts of modified polypropene by weight, and 10 parts of toughener, to Benzophenone class ultraviolet absorber 0.1 part, 0.5 part of phosphite ester system antioxidant, with a thickness of 150 μm；
Weathering layer includes: 50 parts of homopolypropylene by weight, and 40 parts of linear low density polyethylene, 15 parts of titanium dioxide, 0.5 part of group-substituted acrylonitrile ultraviolet absorber, 0.2 part of phosphite ester system antioxidant, with a thickness of 50 μm；
Wherein, TPO particulate material includes following components:
Wherein, ultraviolet absorber is 0.3 part to Benzophenone class ultraviolet absorber, 0.1 part of benzotriazole ultraviolet absorber With the mixture of 0.1 part of salicylate type ultraviolet absorbent；Light stabilizer is poly-succinic (4- hydroxyl -2,2,6,6- tetramethyl - 1- piperidine ethanol) ester.
The embodiment is that 1000V backboard standard prepares sample, while articulamentum addition titanium dioxide to be to promote product reflectivity, Test the performance of backboard made from the present embodiment, wherein bonding force test method is carried out referring to ASTM D903 standard, DTI The effective insulation thickness of testing backboard is carried out referring to IEC61730-1 standard.
The present embodiment bonding force obtained for encapsulating integrated backboard and cell piece is greater than 50N/cm, the upper layer with cell piece (wherein, the essential structure of existing conventional solar cell module is followed successively by glass+upper layer EVA to the bonding force of EVA from top to bottom + cell piece+lower layer's EVA+ backboard, when extrusion are by lower layer EVA and extrusion molding of backboard, as a whole, the application Above-mentioned lower layer EVA and backboard are replaced with into the integrated backboard with weathering layer, casing play and articulamentum, referring herein to bonding Power refers to the cohesive force size of integrated backboard Yu component upper layer EVA) it is greater than 100N/cm, DTI test encapsulates integrated backboard Effective insulation thickness be greater than 150 μm, water vapor transmittance 1.3g/m2Day, without obvious woven design and pit after lamination.
Embodiment 2
The encapsulation integration backboard of the present embodiment, including the weathering layer, casing play and articulamentum set gradually from outside to inside, Wherein, each layer composition is as follows:
Articulamentum includes: 100 parts of TPO particulate material by weight, with a thickness of 350 μm；
Casing play includes: 70 parts of modified polypropene by weight, and 30 parts of toughener, salicylate type ultraviolet absorbent 0.1 part, 0.5 part of phosphite ester system antioxidant, with a thickness of 150 μm；
Weathering layer includes: 50 parts of modified polypropene by weight, and 30 parts of modified poly ethylene, 20 parts of titanium dioxide, triazines 0.6 part of ultraviolet absorber, 0.2 part of phosphite ester system antioxidant, with a thickness of 50 μm；
Wherein, TPO particulate material includes following components:
Wherein, light stabilizer is bis- (2,2,6,6- tetramethyl -4- piperidyl) sebacates.
The embodiment is that 1000V backboard standard prepares sample, is not added with titanium dioxide, tests backboard made from the present embodiment Performance, is greater than 60N/cm with the bonding force of cell piece, is greater than 120N/cm with the bonding force of the upper layer EVA of cell piece, DTI is surveyed Effective insulation thickness that examination encapsulates integrated backboard is greater than 150 μm, water vapor transmittance 1.1g/m2Day, without obvious cloth after lamination Line and pit.
Embodiment 3
The encapsulation integration backboard of the present embodiment, including the weathering layer, casing play and articulamentum set gradually from outside to inside, Wherein, each layer composition is as follows:
Articulamentum includes: 85 parts of TPO particulate material by weight, and 15 parts of titanium dioxide, with a thickness of 350 μm；
Casing play includes: 70 parts of modified polypropene by weight, and 30 parts of toughener, benzotriazole ultraviolet absorber 0.3 part, 0.5 part of phenol system antioxidant, with a thickness of 300 μm；
Weathering layer includes: 50 parts of modified polypropene by weight, and 20 parts of linear low density polyethylene, 30 parts of titanium dioxide, To 0.3 part of Benzophenone class ultraviolet absorber, 0.2 part of phenol system antioxidant, 0.2 part of phosphite ester system antioxidant, with a thickness of 50 μm；
Wherein, TPO particulate material includes following components:
Wherein, antioxidant is 0.1 part of phenol system antioxidant, 0.1 part of phosphite ester system antioxidant and 0.1 part of hindered amines antioxygen The mixture of agent；Light stabilizer is 0.3 part of bis(2,2,6,6-tetramethyl-4-piperidyl)sebacate and 0.5 part of poly-succinic The mixture of (4- hydroxyl -2,2,6,6- tetramethyl -1- piperidine ethanol) ester.
The embodiment is that 1500V backboard standard prepares sample, while articulamentum addition titanium dioxide to be to promote product reflectivity, The performance for testing backboard made from the present embodiment is greater than 50N/cm with the bonding force of cell piece, with the upper layer EVA's of cell piece Bonding force is greater than 100N/cm, and effective insulation thickness that DTI test encapsulates integrated backboard is greater than 300 μm, water vapor transmittance 0.8g/m2Day, without obvious woven design and pit after lamination.
Embodiment 4
The encapsulation integration backboard of the present embodiment, including the weathering layer, casing play and articulamentum set gradually from outside to inside, Wherein, each layer composition is as follows:
Articulamentum includes: 100 parts of TPO particulate material by weight, with a thickness of 350 μm；
Casing play includes: 80 parts of modified polypropene by weight, and 20 parts of toughener, salicylate type ultraviolet absorbent 0.2 part, 0.4 part of suffocated amine antioxidant, with a thickness of 300 μm；
Weathering layer includes: 50 parts of random polypropylene by weight, 40 parts of low density polyethylene (LDPE), 20 parts of titanium dioxide, is replaced 0.3 part of vinyl cyanide ultraviolet absorber, 0.5 part of phosphite ester system antioxidant, with a thickness of 50 μm；
Wherein, TPO particulate material includes following components:
Wherein, light stabilizer is poly- { [6- [(1,1,3,3- tetramethyl butyl)-imino group] -1,3,5-triazines -2,4- bis- Base] [2- (2,2,6,6- tetramethyl-piperidyl)-nitrogen base]-inferior hexyl-[4- (2,2,6,6- tetramethyl-piperidyl)-amino] }.
The embodiment is that 1500V backboard standard prepares sample, is not added with titanium dioxide, tests backboard made from the present embodiment Performance, is greater than 60N/cm with the bonding force of cell piece, is greater than 120N/cm with the bonding force of the upper layer EVA of cell piece, DTI is surveyed Effective insulation thickness that examination encapsulates integrated backboard is greater than 300 μm, water vapor transmittance 0.6g/m2Day, without obvious cloth after lamination Line and pit.
Comparative example 1
The encapsulation integration backboard of this comparative example, including the weathering layer, casing play and articulamentum set gradually from outside to inside, Wherein, each layer composition is as follows:
Articulamentum includes: 100 parts of EVA particle by weight, with a thickness of 350 μm；
Casing play includes: 70 parts of modified polypropene by weight, and 30 parts of toughener, salicylate type ultraviolet absorbent 0.1 part, 0.5 part of phosphite ester system antioxidant, with a thickness of 150 μm；
Weathering layer includes: 60 parts of modified polypropene by weight, and 40 parts of modified poly ethylene, triazines ultraviolet absorber 0.6 part, 0.2 part of phosphite ester system antioxidant, with a thickness of 50 μm；
The comparative example is that 1000V backboard standard prepares sample, is not added with titanium dioxide, tests backboard made from this comparative example Performance, is greater than 60N/cm with the bonding force of cell piece, is greater than 120N/cm with the bonding force of the upper layer EVA of cell piece, DTI is surveyed Effective insulation thickness that examination encapsulates integrated backboard is greater than 150 μm, water vapor transmittance 1.3g/m2Day, block-water performance have a little Decline, without obvious woven design and pit after lamination；To the resistance to of backboard made from this comparative example and integrated backboard made from embodiment 2 The yellowing resistance for waiting layer can be carried out test, as shown in table 1.It, can be with by table 1 without obvious Yellowing as △ b < 3, △ Y < 5 Find out, the △ b < 2.5 of the weathering layer of the integrated backboard of the application, △ Y < 4.5, without obvious Yellowing, and comparative example 1 Backboard is since EVA ageing-resistant performance is poor, and obvious yellowing phenomenon occurs in sample after UV accelerated ageing 300kwh.
Table 1
Comparative example 2
The encapsulation integration backboard of this comparative example, including the weathering layer, casing play and articulamentum set gradually from outside to inside, Wherein, each layer composition is as follows:
Articulamentum includes: 100 parts of TPO particulate material by weight, with a thickness of 350 μm；
Casing play includes: 60 parts of modified polypropene by weight, and 20 parts of PET resin, 20 parts of toughener, ultraviolet absorber 0.3 part, 0.2 part of antioxidant, with a thickness of 150 μm；
Weathering layer includes: 25 parts of modified polypropene by weight, and 55 parts of modified poly ethylene, 20 parts of titanium dioxide, ultraviolet suction 0.3 part of agent of receipts, 0.4 part of antioxidant, with a thickness of 50 μm；
The comparative example is that 1000V backboard standard prepares sample, the performance of backboard made from this comparative example is tested, with battery The bonding force of piece is greater than 60N/cm, is greater than 120N/cm, DTI test encapsulation integration back with the bonding force of the upper layer EVA of cell piece Effective insulation thickness of plate is greater than 150 μm, water vapor transmittance 2g/m2Day, water-resisting ability are decreased obviously, without obvious after lamination Woven design and pit.
Comparative example 3
The encapsulation integration backboard of this comparative example, including the weathering layer, casing play and articulamentum set gradually from outside to inside, Wherein, each layer composition is as follows:
Articulamentum includes: 100 parts of TPO particulate material by weight, with a thickness of 350 μm；
Casing play includes: 40 parts of copolymer polypropylene by weight, 30 parts of random polypropylene, 30 parts of modified poly ethylene, purple 0.1 part of outer absorbent, 0.5 part of antioxidant, with a thickness of 300 μm；
Weathering layer includes: 30 parts of polypropylene by weight, and 70 parts of polyethylene, 0.6 part of ultraviolet absorber, antioxidant 0.3 Part, with a thickness of 50 μm；
The comparative example is that 1500V backboard standard prepares sample, the performance of backboard made from this comparative example is tested, with battery The bonding force of piece is greater than 60N/cm, is greater than 120N/cm, DTI test encapsulation integration back with the bonding force of the upper layer EVA of cell piece Effective insulation thickness of plate is unable to satisfy component requirement, water vapor transmittance 0.6g/m less than 300 μm2Day, after lamination There is slight woven design.
Comparative example 4
The encapsulation integration backboard of this comparative example, including the weathering layer, casing play and articulamentum set gradually from outside to inside, Wherein, each layer composition is as follows:
Articulamentum includes: 100 parts of TPO particulate material by weight, with a thickness of 350 μm；
Casing play includes: 90 parts of modified polypropene by weight, 10 parts of modified poly ethylene, 0.1 part of ultraviolet absorber, is resisted 0.2 part of oxygen agent, with a thickness of 300 μm；
Weathering layer includes: 70 parts of modified poly ethylene by weight, and 30 parts of titanium dioxide, 0.4 part of ultraviolet absorber, antioxidant 0.25 part, with a thickness of 50 μm；
The comparative example is that 1500V backboard standard prepares sample, the performance of backboard made from this comparative example is tested, with battery The bonding force of piece is greater than 60N/cm, is greater than 120N/cm, DTI test encapsulation integration back with the bonding force of the upper layer EVA of cell piece Effective insulation thickness of plate is greater than 300 μm, water vapor transmittance 0.65g/m2Day, there is obvious deformation in weathering layer after lamination, and There is obvious woven design, appearance is unqualified.
Comparative example 5
Patent CN 204271104U is common application type backboard, and patent CN 103038060A is common application type integration Backboard, the two require to use glue, can not one-pass molding, processing cost increases, while using fluorine resin as weathering layer, nothing Method recycling.
Detailed process equipment and process flow of the invention that the present invention is explained by the above embodiments, but the present invention is not It is confined to above-mentioned detailed process equipment and process flow, that is, does not mean that the present invention must rely on above-mentioned detailed process equipment and work Skill process could be implemented.It should be clear to those skilled in the art, any improvement in the present invention, to product of the present invention The equivalence replacement of each raw material and addition, the selection of concrete mode of auxiliary element etc., all fall within protection scope of the present invention and public affairs Within the scope of opening.

Claims (10)

1. a kind of integrated backboard of encapsulation, including the weathering layer, casing play and articulamentum set gradually from top to bottom, feature exists In the weathering layer is weatherable materials layer, and the casing play is modified polyolefine material layer, and the articulamentum is TPO particle material The bed of material.
2. the integrated backboard of encapsulation according to claim 1, which is characterized in that the modified polyolefine material layer is by being modified Polyolefine material composition, by weight, the modified polyolefine material includes following components:
3. the integrated backboard of encapsulation according to claim 1 or 2, which is characterized in that the TPO particulate material layer is by TPO Particulate material composition, by weight, the TPO particulate material includes following components:
4. encapsulation integration backboard described according to claim 1~one of 3, which is characterized in that the weathering layer is by weather-proof material Material composition, by weight, the weatherable materials include following components:
5. the integrated backboard of encapsulation according to any one of claims 1 to 4, which is characterized in that the articulamentum further includes Titanium dioxide；
Preferably, the articulamentum, by weight, including following components:
80~100 parts of TPO particulate material
0~20 part of titanium dioxide.
6. the integrated backboards of described in any item encapsulation according to claim 1~5, which is characterized in that the ultraviolet absorber is It is purple to Benzophenone class ultraviolet absorber, benzotriazole ultraviolet absorber, salicylate type ultraviolet absorbent, group-substituted acrylonitrile One of outer absorbent and triazines ultraviolet absorber or at least two mixture；
Preferably, the antioxidant be one of phenol system antioxidant, phosphite ester system antioxidant and suffocated amine antioxidant or At least two mixture；
Preferably, the light stabilizer is bis- (2,2,6,6- tetramethyl -4- piperidyl) sebacates, poly-succinic (4- hydroxyl - 2,2,6,6- tetramethyl -1- piperidine ethanol) ester, poly- { [6- [(1,1,3,3- tetramethyl butyl)-imino group] -1,3,5- triazine - 2,4- diyl] [2- (2,2,6,6- tetramethyl-piperidyl)-nitrogen base]-inferior hexyl-[4- (2,2,6,6- tetramethyl-piperidyl)-ammonia Base] } one of or at least two mixture.
7. the integrated backboards of described in any item encapsulation according to claim 1~6, which is characterized in that the modified poly ethylene is One of high density polyethylene (HDPE), low density polyethylene (LDPE), linear low density polyethylene and ultra-high molecular weight polyethylene or at least two The mixture of kind；
Preferably, the modified polypropene is one of homopolypropylene, copolymer polypropylene and random polypropylene or at least two The mixture of kind；
Preferably, the improved polyalkene is one of modified polypropene, modified poly ethylene, polyester, nylon and polyethers or extremely Few two kinds of mixture.
8. the integrated backboard of described in any item encapsulation according to claim 1~7, which is characterized in that the thickness of the weathering layer It is 20~80 μm；
Preferably, the casing play with a thickness of 150~400 μm；
Preferably, the articulamentum with a thickness of 200~600 μm.
9. the preparation method according to claim 1-8 for encapsulating integrated backboard, which is characterized in that the preparation Method includes the following steps: for weatherable materials, modified polyolefine material and TPO particulate material to be put into extruder, heating melting, The encapsulation integration backboard of weathering layer, casing play and the articulamentum set gradually from top to bottom after three-layer co-extruded；Or
The preparation method includes the following steps: for weatherable materials, modified polyolefine material to be put into extruder, heating melting, Film extrusion；TPO particulate material is put into extruder simultaneously, heating melting, lamination is in the skeleton level squeezed out, then Cooling and shaping obtains encapsulating integrated backboard.
10. preparation method according to claim 9, which is characterized in that when extrusion, the weatherable materials, the modification are poly- The temperature of olefin material is 180~240 DEG C, and the temperature of the TPO particulate material is 120~180 DEG C；
Preferably, further include the steps that the articulamentum is quickly cooled down after the three-layer co-extruded technique.
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CN113321904A (en) * 2021-06-09 2021-08-31 上海朗亿功能材料有限公司 Modified PET resin material, solar cell back panel film and application of ultraviolet absorber
CN115820146A (en) * 2021-12-31 2023-03-21 浙江中聚材料有限公司 High-barrier photovoltaic back plate and preparation method and application thereof

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CN103280479A (en) * 2013-05-23 2013-09-04 常州回天新材料有限公司 Novel fluoride-free multilayer coextrusion solar cell back plate and preparation method thereof
CN106601851A (en) * 2015-10-19 2017-04-26 中天光伏材料有限公司 Environment-friendly type photovoltaic backboard and manufacturing method thereof

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CN102850947A (en) * 2012-09-14 2013-01-02 宁波威克丽特功能塑料有限公司 Adhesive POE solar battery packaging film and preparation method thereof
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CN110861376A (en) * 2019-12-02 2020-03-06 上海紫江彩印包装有限公司 Polyolefin film for transparent back plate film and preparation method thereof
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CN115820146A (en) * 2021-12-31 2023-03-21 浙江中聚材料有限公司 High-barrier photovoltaic back plate and preparation method and application thereof

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