CN109421374B - Piezoelectric ink-jet printing chip and packaging structure for packaging piezoelectric ink-jet printing chip - Google Patents
Piezoelectric ink-jet printing chip and packaging structure for packaging piezoelectric ink-jet printing chip Download PDFInfo
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- CN109421374B CN109421374B CN201710765601.5A CN201710765601A CN109421374B CN 109421374 B CN109421374 B CN 109421374B CN 201710765601 A CN201710765601 A CN 201710765601A CN 109421374 B CN109421374 B CN 109421374B
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- 238000007641 inkjet printing Methods 0.000 title claims abstract description 66
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 19
- 239000000853 adhesive Substances 0.000 claims description 24
- 230000001070 adhesive effect Effects 0.000 claims description 24
- 238000007789 sealing Methods 0.000 claims description 13
- 239000010409 thin film Substances 0.000 claims description 7
- 239000010408 film Substances 0.000 claims description 4
- 239000007767 bonding agent Substances 0.000 claims description 3
- 238000012858 packaging process Methods 0.000 abstract description 4
- 239000007921 spray Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 8
- 238000007639 printing Methods 0.000 description 7
- 239000007769 metal material Substances 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000006850 spacer group Chemical group 0.000 description 2
- 238000010146 3D printing Methods 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002508 contact lithography Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920006332 epoxy adhesive Polymers 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
- B41J2/01—Ink jet
- B41J2/135—Nozzles
- B41J2/14—Structure thereof only for on-demand ink jet heads
- B41J2/14201—Structure of print heads with piezoelectric elements
- B41J2/14209—Structure of print heads with piezoelectric elements of finger type, chamber walls consisting integrally of piezoelectric material
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
The present invention provides a piezoelectric ink-jet printing chip, which comprises: the orifice layer is provided with a single row of orifices; the ink pressure cavity structure layer is arranged on the jet orifice layer and comprises a plurality of ink tank structures, the ink tank structures are uniformly distributed on two sides of the single-row jet orifice, and each ink tank structure is communicated with the corresponding jet orifice; and the piezoelectric driving electrode layer comprises a piezoelectric film layer arranged on the ink pressure cavity structure layer and a driving electrode arranged on the piezoelectric film layer. The invention also provides a packaging structure for packaging the piezoelectric ink-jet printing chip. In the invention, the piezoelectric ink-jet printing chip has a structure of single-row spray holes and double-row pressure cavities, and the density of the spray holes is doubled on the basis of not changing the width of the pressure cavities. In addition, the packaging structure for packaging the piezoelectric ink-jet printing chip can reduce the packaging process steps, improve the reliability and reduce the production cost.
Description
Technical Field
The invention belongs to the technical field of printing, and particularly relates to a piezoelectric ink-jet printing chip and a packaging structure for packaging the piezoelectric ink-jet printing chip.
Background
Inkjet printheads may be classified into piezoelectric inkjet printheads and thermal bubble inkjet printheads according to the mechanism of ejection of ink droplets. The piezoelectric ink jet printhead distributes ink supplied from the ink tank to the ink pressure chambers. The top of the ink pressure cavity is processed by piezoelectric ceramics, and the piezoelectric ceramics deform under the action of inverse piezoelectric effect to cause the volume of the ink cavity to change, so that the ink is ejected out through the jet orifice. The thermal foaming ink-jet printing head heats ink to generate bubbles, and the ink is extruded from the jet orifice to form ink drops. Because the ink-jet printing is a non-contact printing mode, the color printing can be realized, and the ink-jet printing ink is widely applied to printed circuits, biological printing, digital printing, 3D printing, solar cell printing and the like. With the development of advanced technology in society, new challenges are presented to inkjet printing chips in order to meet the demands of high resolution and fast printing.
In order to eject ink drops from the orifices, the conventional piezoelectric ink jet printing chip needs enough area of the ink pressure chamber to generate enough deformation. The piezoelectric ink-jet printing chip provided by the prior art comprises a row of pressure cavities corresponding to a row of jet holes, and the structure has the defect that the density of the jet holes is difficult to improve due to the restriction of the width of the pressure cavities. The prior art also provides a piezoelectric inkjet printing chip, which includes multiple rows of nozzles and multiple rows of pressure chambers, but the size of a single chip is small, and in order to realize a printing width with a large size (about 30 mm), multiple chips need to be spliced, which increases the cost.
In addition, in the chip packaging process of the piezoelectric inkjet printhead in the prior art, in order to realize the connection of the chip driving structure to the driving signal, a plurality of electrodes on the chip and the driving circuit board need to be electrically connected with each other, but the connection mode is complex and the cost is high.
Disclosure of Invention
In order to solve the problems of the prior art, an object of the present invention is to provide a piezoelectric inkjet printing chip and a package structure for packaging the piezoelectric inkjet printing chip.
According to an aspect of the present invention, there is provided a piezoelectric inkjet printing chip including: the orifice layer is provided with a single row of orifices; the ink pressure cavity structure layer is arranged on the jet orifice layer and comprises a plurality of ink tank structures, the ink tank structures are uniformly distributed on two sides of the single-row jet orifice, and each ink tank structure is communicated with the corresponding jet orifice; and the piezoelectric driving electrode layer comprises a piezoelectric film layer arranged on the ink pressure cavity structure layer and a driving electrode arranged on the piezoelectric film layer.
Further, the interval between the orifice is 25um to 500um, the diameter of orifice is 5um to 100 um.
Furthermore, the orifice layer and the ink pressure cavity structure layer are integrally manufactured by a single-piece SOI structure; or the orifice layer and the ink pressure cavity structure layer are respectively and independently formed and are bonded through a bonding agent.
Furthermore, the piezoelectric driving electrode layer and the ink pressure cavity structure layer are bonded through an adhesive.
According to another aspect of the present invention, there is also provided a package structure for packaging the piezoelectric inkjet printing chip, the package structure including: the flexible circuit board comprises at least two flexible circuit boards, electrodes are distributed at two ends of each flexible circuit board, one electrode at the two ends is used for being connected with the driving electrode, and the other electrode at the two ends is used for being connected with an external driving circuit board; a gasket having a first opening corresponding to an ink tank of the piezoelectric inkjet printing chip and a second opening for passing the flexible circuit board; the ink box comprises a box body, a third opening, a fourth opening, an ink supply manifold, an ink inlet and an ink outlet, wherein the third opening and the fourth opening are arranged in the box body and respectively correspond to the first opening and the second opening; and the cover plate is positioned on the piezoelectric ink-jet printing chip and used for sealing and protecting the piezoelectric ink-jet printing chip.
Further, the electrode at one of the two ends is used for being connected with the driving electrode through anisotropic conductive adhesive.
Further, the gasket is adhered to an ink tank of the piezoelectric inkjet printing chip through an adhesive, and the gasket and the ink tank form a sealing structure.
Further, the cartridge body is adhered to the gasket by an adhesive to seal the first opening and the third opening and to seal the second opening and the fourth opening.
Further, the ink cartridge further comprises an ink pipe joint with threads, wherein the ink pipe joint is connected with the ink inlet, so that an external ink pipe flows into the cartridge body through the ink pipe joint and the ink inlet, and ink in the cartridge body flows out through the ink outlet.
Further, the cover sheet is adhered to a surface of the nozzle hole layer opposite to the surface provided with the nozzle holes by an adhesive.
The invention has the beneficial effects that: in the invention, the piezoelectric ink-jet printing chip has a structure of single-row spray holes and double-row pressure cavities, and the density of the spray holes is doubled on the basis of not changing the width of the pressure cavities. In addition, in the packaging process of the piezoelectric ink-jet printing chip, the flexible circuit board is electrically connected with the electrode of the ink-jet printing chip by using the anisotropic conductive adhesive, and the piezoelectric ink-jet printing chip is in liquid connection by using the adhesive and the multilayer structural member.
Drawings
The above and other aspects, features and advantages of embodiments of the present invention will become more apparent from the following description taken in conjunction with the accompanying drawings, in which:
FIG. 1 is an exploded view of a piezoelectric inkjet printing chip according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a piezoelectric drive electrode layer of a piezoelectric inkjet printing chip according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of an ink pressure chamber structural layer of a piezoelectric inkjet printing chip according to an embodiment of the present invention;
FIG. 4 is a schematic structural diagram of an orifice layer of a piezoelectric inkjet printing chip according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a packaging structure for packaging a piezoelectric inkjet printing chip according to an embodiment of the present invention;
FIG. 6 is a schematic diagram of a structure of a pad of a package structure according to an embodiment of the invention;
FIG. 7 is a schematic diagram of an ink cartridge with a package structure according to an embodiment of the invention;
fig. 8 is a schematic structural diagram of a cover sheet of a package structure according to an embodiment of the present invention.
Detailed Description
Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the specific embodiments set forth herein. Rather, these embodiments are provided to explain the principles of the invention and its practical application to thereby enable others skilled in the art to understand the invention for various embodiments and with various modifications as are suited to the particular use contemplated.
In the drawings, the thickness of layers and regions are exaggerated for clarity. Like numbers refer to like elements throughout.
Fig. 1 is an exploded view of a piezoelectric inkjet printing chip according to an embodiment of the present invention.
Referring to fig. 1, a piezoelectric inkjet printing chip 100 according to an embodiment of the present invention includes: a piezoelectric driving electrode layer 110, an ink pressure chamber structure layer 120, and an orifice layer 130.
Referring to fig. 1 and 2 together, the piezoelectric driving electrode layer 110 includes a piezoelectric thin film layer 111, a positive electrode 113 on the piezoelectric thin film layer 111, and a negative electrode 112 corresponding to the vicinity of the positive electrode 113. The number of the positive electrodes 113 and the negative electrodes 112 is plural, specifically, plural positive electrodes 113 are arranged in an array, one negative electrode 112 is disposed between the positive electrodes 113 and outside the outermost positive electrode 113, and the plural negative electrodes 112 are connected by a common negative electrode 114. The piezoelectric thin film layer 111 is disposed above the ink pressure chamber structure layer 120, and the positive electrode 113 corresponds to the ink pressure chamber structure layer 120, and has a shape similar to the ink pressure chamber structure layer 120, and the axes thereof coincide.
The positive electrode 113, the negative electrode 112, and the common negative electrode 114 are deposited on the piezoelectric thin film layer 111 by sputtering, and constitute the piezoelectric driving electrode layer 110 with the piezoelectric thin film layer 111. The entire piezoelectric driving electrode layer 110 and the ink pressure chamber structure layer 120 are bonded by an adhesive (or called bonding agent). The adhesive is an epoxy adhesive, but the present invention is not limited thereto.
Referring to fig. 1 and 3 together, the ink pressure chamber structure layer 120 includes an ink tank structure 121, and the ink tank structure 121 has a rectangular shape. Specifically, the plurality of ink tank structures 121 are divided into two groups, the two groups of ink tank structures 121 are connected back to back, and each ink tank structure 121 in the first group of ink tank structures is located between corresponding adjacent two ink tank structures 121 in the second group of ink tank structures.
Referring to fig. 1 and 4 together, the nozzle hole layer 130 has nozzle holes 131 arranged in a single row. The ink pressure chamber structure layer 120 is disposed on the orifice layer 130, the plurality of ink tank structures 121 are uniformly distributed on two sides of the single-row orifice 131, and each ink tank structure 121 is communicated with the corresponding orifice 131, so that the ink flowing in through the ink inlet flows through the ink tank structure 121 and enters the orifice 131. In addition, the interval between the nozzle holes 131 is 25um to 500um, and the diameter of the nozzle holes 131 is 5um to 100um, but the present invention is not limited thereto.
In this embodiment, the orifice layer 130 and the ink pressure chamber structure layer 120 may be integrally formed by a single SOI structure (Silicon-On-Insulator, Silicon On an insulating substrate) to be referred to as a chamber structure layer; or the orifice layer 130 and the ink pressure chamber structure layer 120 are formed separately, and the orifice layer 130 and the ink pressure chamber structure layer 120 are bonded by an adhesive.
Fig. 5 is a schematic structural diagram of a packaging structure for packaging a piezoelectric inkjet printing chip according to an embodiment of the present invention.
Referring to fig. 5, the package structure for packaging the piezoelectric inkjet printing chip 100 includes: two rows of electrodes are distributed at two ends of the flexible circuit board 200, the electrodes at one end are used for being connected with the driving positive electrode 113 and the driving negative electrode 112 of the piezoelectric ink-jet printing chip 100, and the electrodes at the other end are used for being connected with an external driving circuit board; a spacer 210 having two first openings 211 corresponding to the ink tanks of the piezoelectric inkjet printing chip 110 and one second opening 212 in the middle for the flexible circuit board 200 to pass through; an ink cartridge 220 including a cartridge body, third and fourth openings 223 and 224 provided in the cartridge body corresponding to the first and second openings 211 and 212, respectively, and an ink supply manifold, an ink inlet port, and an ink outlet port in the cartridge body; and the cover plate 230 is positioned on the piezoelectric inkjet printing chip 100 and used for sealing and protecting the piezoelectric inkjet printing chip 100.
As shown in fig. 5, the flexible circuit board 200 has electrodes at two ends corresponding to the driving positive electrode 113 and the driving negative electrode 112 of the piezoelectric inkjet printing chip 100, and can be connected to the driving positive electrode 113 and the driving negative electrode 112 of the piezoelectric inkjet printing chip 100 through an anisotropic conductive adhesive, so as to transmit a driving signal to the driving positive electrode 113 and the driving negative electrode 112 through the flexible circuit board 200.
As shown in fig. 5, the flexible circuit board 200 is electrically connected to the piezoelectric inkjet printing chip 100. The method is as follows. An anisotropic conductive adhesive is pasted on the electrode of the piezoelectric inkjet printing chip 100, and then thermocompression bonding is performed on a thermocompression bonding machine, so that the electrode on the flexible circuit board 200 is connected and conducted with the driving positive electrode 113 and the driving negative electrode 112 of the piezoelectric inkjet printing chip 100, and the flexible circuit board 200 is electrically connected with the piezoelectric inkjet printing chip 100.
Referring to fig. 5 and 6 together, the gasket 210 may be made of a metal material by machining, and is adhered to the upper side of the ink tank of the piezoelectric inkjet printing chip 100 by an adhesive, and forms a sealing structure with the ink tank so that ink cannot flow onto the driving positive electrode 113.
The implementation method comprises the following steps: the glued spacer 210 is reversed on the welded piezoelectric inkjet printing chip 100, and after the piezoelectric inkjet printing chip is cured, the sealing performance of the piezoelectric inkjet printing chip can be detected after the curing is completed. Thus, a sealing structure is formed, and ink can pass through the ink inlet without diffusing between the flexible circuit board 200 and the electrode of the piezoelectric ink-jet printing chip 100, so that the use performance of the nozzle is influenced. And (5) confirming that the sealing is complete, and starting the next step of dispensing.
Referring to fig. 5 and 7 together, the ink cartridge 220 is made of a metal material and is bonded above the gasket 210 by an adhesive, and the adhesive causes the third opening 223 in the ink cartridge 220 and the corresponding first opening 211 of the gasket 210 to form a sealing structure, so that ink can only pass through the third opening 223 and cannot flow to a place other than the third opening 223. The ink supply manifolds in the ink cartridge 220 are designed so that the ink flows into the underlying ink tank through the ink inlet 221 with the same flow resistance. The ink inlet 221 and the ink outlet 222 in the ink cartridge 220 have the same aperture, and an ink tube connector 240 including a screw thread is installed, so that an external ink tube flows into the ink cartridge through the ink tube connector 240 and the ink inlet 221, and then flows out through the ink outlet 222 to form a circulation. The fourth opening 224 is used to pass the flexible circuit board 200.
The implementation mode is as follows: the glued ink cartridge 220 is reversed over the cured gasket 210 such that the third opening 223 in the ink cartridge 220 and the corresponding first opening 211 of the gasket 210 form a sealed structure through which ink can only pass and cannot flow beyond the openings. And after the curing is finished, detecting the sealing performance of the adhesive, and starting the next step of dispensing after the sealing is confirmed to be complete.
Referring to fig. 5 and 8 together, the cover sheet 230 may have a thickness of 0.1mm, and is made of a metal material, and the back surface of the gasket 210 is adhered to the back surface of the gasket 210 by an adhesive so as to be positioned on the piezoelectric inkjet printing chip 100 to seal and protect the piezoelectric inkjet printing chip 100.
The implementation mode is as follows: the cover sheet 230 is coated with a glue on the solid side on the front side thereof, around the periphery of the opening 231 of the cover sheet 230 (which exposes the orifices 131, etc.), and then adhered to the back side of the previously cured gasket 210 for sealing and protecting the piezoelectric inkjet printing chip 100.
In summary, according to the embodiments of the present invention, the piezoelectric inkjet printing chip has a structure with a single row of nozzles and a double row of pressure chambers, and the nozzle density is doubled without changing the width of the pressure chambers. In addition, in the packaging process of the piezoelectric ink-jet printing chip, the flexible circuit board is electrically connected with the electrode of the ink-jet printing chip by using the anisotropic conductive adhesive, and the piezoelectric ink-jet printing chip is in liquid connection by using the adhesive and the multilayer structural member.
While the invention has been shown and described with reference to certain embodiments, those skilled in the art will understand that: various changes in form and details may be made therein without departing from the spirit and scope of the invention as defined by the appended claims and their equivalents.
Claims (7)
1. A packaging structure for packaging a piezoelectric inkjet printing chip, the piezoelectric inkjet printing chip comprising:
the orifice layer is provided with a single row of orifices;
the ink pressure cavity structure layer is arranged on the jet orifice layer and comprises a plurality of rectangular ink tank structures, the ink tank structures are divided into two groups, the two groups of ink tank structures are uniformly distributed on two sides of the single-row jet orifice and are connected back to back, each ink tank structure in the first group of ink tank structures is positioned between two corresponding adjacent ink tank structures in the second group of ink tank structures, and each ink tank structure is communicated with the corresponding jet orifice;
the piezoelectric driving electrode layer comprises a piezoelectric film layer arranged on the ink pressure cavity structure layer and a driving electrode arranged on the piezoelectric film layer;
the piezoelectric driving electrode layer comprises a piezoelectric thin film layer, a positive electrode positioned on the piezoelectric thin film layer and a negative electrode corresponding to the vicinity of the positive electrode; the plurality of positive electrodes are arranged in an array corresponding to the ink pressure cavity structure layer, one negative electrode is arranged between the positive electrodes and on the outer side of the outermost positive electrode, and the plurality of negative electrodes are connected through a common negative electrode;
the package structure includes:
the flexible circuit board comprises at least two flexible circuit boards, electrodes are distributed at two ends of each flexible circuit board, one electrode at the two ends is used for being connected with the driving electrode, and the other electrode at the two ends is used for being connected with an external driving circuit board;
the gasket is provided with a first opening corresponding to the ink tank of the piezoelectric ink-jet printing chip and a second opening for enabling the flexible circuit board to pass through, the gasket is bonded on the ink tank of the piezoelectric ink-jet printing chip through an adhesive, and the gasket and the ink tank form a sealing structure;
the ink box comprises a box body, a third opening, a fourth opening, an ink supply manifold, an ink inlet and an ink outlet, wherein the third opening and the fourth opening are arranged in the box body and respectively correspond to the first opening and the second opening, the ink supply manifold, the ink inlet and the ink outlet are positioned in the box body, the fourth opening is used for enabling a flexible circuit board to pass through, the box body is bonded on the gasket through an adhesive, so that the first opening and the third opening are sealed, the second opening and the fourth opening are sealed, and ink can only pass through the third opening and cannot flow to places except the third opening;
and the cover plate is positioned on the piezoelectric ink-jet printing chip and used for sealing and protecting the piezoelectric ink-jet printing chip.
2. The package structure of claim 1, wherein the electrode at one of the two ends is connected to the driving electrode through an anisotropic conductive adhesive.
3. The package structure according to claim 1 or 2, wherein the ink cartridge further comprises an ink tube connector having threads, the ink tube connector being connected to the ink inlet such that an external ink tube flows into the cartridge body through the ink tube connector and the ink inlet, and ink in the cartridge body flows out through the ink outlet.
4. The package structure according to claim 1, wherein the cover sheet is adhered to the surface of the nozzle hole layer on which the nozzle hole is provided by an adhesive.
5. The package structure of claim 1, wherein the spacing between the nozzles is 25um to 500um, and the diameter of the nozzles is 5um to 100 um.
6. The package structure of claim 1, wherein the orifice layer and the ink pressure chamber structure layer are integrally fabricated from a monolithic SOI structure; or the orifice layer and the ink pressure cavity structure layer are respectively and independently formed and are bonded through a bonding agent.
7. The package structure of claim 1, wherein the piezoelectric driving electrode layer and the ink pressure chamber structure layer are bonded by an adhesive.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710765601.5A CN109421374B (en) | 2017-08-30 | 2017-08-30 | Piezoelectric ink-jet printing chip and packaging structure for packaging piezoelectric ink-jet printing chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710765601.5A CN109421374B (en) | 2017-08-30 | 2017-08-30 | Piezoelectric ink-jet printing chip and packaging structure for packaging piezoelectric ink-jet printing chip |
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| CN109421374A CN109421374A (en) | 2019-03-05 |
| CN109421374B true CN109421374B (en) | 2021-02-09 |
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| CN111016432A (en) * | 2019-12-19 | 2020-04-17 | 西安增材制造国家研究院有限公司 | Piezoelectric type printing head and manufacturing method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| EP0095911B1 (en) * | 1982-05-28 | 1989-01-18 | Xerox Corporation | Pressure pulse droplet ejector and array |
| JP4069356B2 (en) * | 2001-03-29 | 2008-04-02 | ブラザー工業株式会社 | Piezoelectric transducer and liquid droplet ejecting apparatus using the same |
| JP4529813B2 (en) * | 2005-06-23 | 2010-08-25 | セイコーエプソン株式会社 | Liquid ejector |
| JP2007090686A (en) * | 2005-09-29 | 2007-04-12 | Konica Minolta Holdings Inc | Line head and inkjet printing apparatus |
| CN100569523C (en) * | 2005-09-30 | 2009-12-16 | 研能科技股份有限公司 | Ink gun encapsulating structure and method for packing thereof |
| JP4643625B2 (en) * | 2007-09-25 | 2011-03-02 | 株式会社東芝 | Droplet ejecting head |
| JP5413573B2 (en) * | 2009-02-03 | 2014-02-12 | セイコーエプソン株式会社 | Liquid ejecting head unit and liquid ejecting apparatus |
| US9346269B2 (en) * | 2014-03-17 | 2016-05-24 | Seiko Epson Corporation | Flow path structure, liquid ejecting head, and liquid ejecting apparatus |
| JP6397567B2 (en) * | 2014-05-30 | 2018-09-26 | ヒューレット−パッカード デベロップメント カンパニー エル．ピー．Ｈｅｗｌｅｔｔ‐Ｐａｃｋａｒｄ Ｄｅｖｅｌｏｐｍｅｎｔ Ｃｏｍｐａｎｙ， Ｌ．Ｐ． | Printhead assembly module |
| JP2016060077A (en) * | 2014-09-17 | 2016-04-25 | セイコーエプソン株式会社 | Liquid layer distribution conversion member, liquid injection head, liquid injection device and liquid layer distribution conversion method |
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Address after: 310000, 1st Floor, Building 18, No. 260, 6th Street, Baiyang Street, Qiantang District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Ruierfa Technology Co.,Ltd. Country or region after: China Address before: No.1106, 11 / F, block a, haochehui Plaza, no.1-72, Lane 2855, Huqingping highway, Qingpu District, Shanghai, 201799 Patentee before: Shanghai Riefa Digital Technology Co.,Ltd. Country or region before: China |