CN109309041B - Substrate processing apparatus and method for adjusting substrate processing apparatus - Google Patents
Substrate processing apparatus and method for adjusting substrate processing apparatus Download PDFInfo
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- CN109309041B CN109309041B CN201811076067.8A CN201811076067A CN109309041B CN 109309041 B CN109309041 B CN 109309041B CN 201811076067 A CN201811076067 A CN 201811076067A CN 109309041 B CN109309041 B CN 109309041B
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- 239000000758 substrate Substances 0.000 title claims abstract description 158
- 238000012545 processing Methods 0.000 title claims abstract description 60
- 238000000034 method Methods 0.000 title claims abstract description 31
- 125000006850 spacer group Chemical group 0.000 claims description 11
- 238000012546 transfer Methods 0.000 claims description 11
- 239000011521 glass Substances 0.000 claims description 8
- 238000004519 manufacturing process Methods 0.000 claims description 7
- 239000000919 ceramic Substances 0.000 description 3
- 230000004075 alteration Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by supporting substrates others than wafers, e.g. chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present application provides a substrate processing apparatus and an adjustment method of the substrate processing apparatus, the substrate processing apparatus includes: a substrate mounting table on which a substrate to be processed by the substrate processing apparatus is mounted; a lift pin vertically inserted through the substrate mounting table and configured to be freely lifted and lowered so as to protrude and retract from a surface of the substrate mounting table; and an auxiliary component unit arranged on the substrate carrying platform and used for connecting a tenon receptor and the substrate carrying platform frame in a matching way.
Description
Technical Field
The present invention relates to the field of display, and more particularly, to a substrate processing apparatus and an adjustment method for the substrate processing apparatus.
Background
In the manufacturing process of a liquid crystal display device, a glass substrate or a semiconductor chip as a substrate to be processed is subjected to various processes such as dry etching, sputtering, and chemical vapor deposition. For example, such a process is performed in a state where a substrate is mounted on a substrate mounting table provided in a chamber, and the substrate is loaded and unloaded on and from the substrate mounting table by raising and lowering a plurality of lift pins provided in the substrate mounting table. That is, when the substrate is loaded, the lift pins are protruded from the surface of the table main body, and the substrate placed on the transfer arm is moved onto the pins to lower the lift pins. When the substrate is unloaded, the lift pins are raised from the state where the substrate is placed on the mounting table body, and the substrate is moved to the transfer arm in this state where the substrate is lifted from the surface of the mounting table body.
In such a substrate mounting table, since the plurality of lift pins provided are lifted and lowered in the mounting table main body, if a trouble such as the conveyance arm contacting the lift pins occurs in a state where the lift pins are protruded from the mounting table main body, the substrate mounting table itself may be damaged.
The height of a sucking button (rest button) matched with a frame (shadow frame) by a receptor (susceptor) on the substrate carrying platform is not enough, so that the position of the frame (shadow frame) is shifted during the action, membrane deflection is caused to bend (arching) and substrate glass is broken in the machine, the chamber (chamber) needs to be heated and cooled, the normal operation time is lost for 5 days, the output is influenced, and the repair times and cost of the receptor (susceptor) and the frame (shadow frame) are increased.
Therefore, it is a primary objective of the present invention to provide a substrate processing apparatus and an adjustment method thereof to further optimize the above mentioned problems.
Disclosure of Invention
In order to solve the above-described problems, an object of the present invention is to provide a substrate processing apparatus including: a substrate mounting table on which a substrate to be processed by the substrate processing apparatus is mounted; a lift pin vertically inserted through the substrate mounting table and configured to be freely lifted and lowered so as to protrude and retract from a surface of the substrate mounting table; the auxiliary component unit is arranged on the substrate carrying table and is used for clamping and tenon connection of a receptor and the substrate carrying table frame; wherein the auxiliary member unit further comprises a base spacer for adjusting the height of the auxiliary member unit; the height of the base spacer is 0.001-0.002 m; the height of the protruding part of the auxiliary component unit body is 0.005-0.0055 m, the protruding part is in a circular truncated cone shape, and the auxiliary component unit enables the tenon-and-socket receptor to be in fit connection with the substrate carrying table frame through the protruding part; the shape of the pedestal spacer is the same as the shape of the projection of the auxiliary member unit in the lift pin movement direction.
Another object of the present application is a substrate processing apparatus comprising: a substrate mounting table on which a substrate to be processed by the substrate processing apparatus is mounted; a lift pin vertically inserted through the substrate mounting table and configured to be freely lifted and lowered so as to protrude and retract from a surface of the substrate mounting table; the auxiliary component unit is arranged on the substrate carrying table and is used for clamping and tenon connection of a receptor and the substrate carrying table frame; wherein the height of the protruding part of the auxiliary member unit body is 0.005-0.0055 m.
Another object of the present invention is to provide a method of adjusting a substrate processing apparatus, including: providing a substrate carrying table for carrying a substrate to be processed by a substrate processing apparatus; vertically inserted into the substrate mounting table through a lift pin, and configured to be freely lifted and lowered so as to protrude and retract with respect to the surface of the substrate mounting table; and adjusting an auxiliary component unit arranged on the substrate carrying table for clamping and tenon connection of a receptor and the substrate carrying table frame; wherein the auxiliary member unit further comprises a base spacer for adjusting the height of the auxiliary member unit; the height of the base spacer is 0.001-0.002 m; the height of the protruding part of the auxiliary component unit body is 0.005-0.0055 m, the protruding part is in a circular truncated cone shape, and the auxiliary component unit enables the tenon-and-socket receptor to be in fit connection with the substrate carrying table frame through the protruding part; the shape of the pedestal spacer is the same as the shape of the projection of the auxiliary member unit in the lift pin movement direction.
The purpose of the application and the technical problem to be solved are realized by adopting the following technical scheme.
In an embodiment of the present invention, the auxiliary member unit further includes a base spacer for adjusting a height of the auxiliary member unit.
In one embodiment of the present application, the height of the pedestal spacer is 0.001-0.002 m.
In an embodiment of the present application, the apparatus further includes a normal pressure transfer chamber for transferring a normal pressure atmosphere of the substrate; and a vacuum processing chamber connected to the atmospheric transfer chamber through a load lock chamber and configured to perform vacuum processing on the substrate.
In an embodiment of the present application, the substrate is a glass substrate for manufacturing a display.
In an embodiment of the present invention, in the adjusting method of the substrate processing apparatus, the auxiliary member unit further includes a pedestal spacer for adjusting a height of the auxiliary member unit.
In an embodiment of the present application, in the method for adjusting a substrate processing apparatus, the height of the pedestal spacer is 0.001 to 0.002 m.
In an embodiment of the present application, in the adjusting method of the substrate processing apparatus, the substrate is a glass substrate for manufacturing a display; the height of the protruding part of the auxiliary member unit body is 0.005 to 0.0055 m.
The application improves the service time of the machine, improves the actual working time of the cavity, reduces the material consumption overhaul cost, and thus enhances the product competitiveness.
Drawings
Fig. 1 is a schematic view of a substrate processing apparatus according to an embodiment of the present application.
Fig. 2 is a schematic view of an auxiliary member unit according to an embodiment of the present application.
Fig. 3a is a schematic view of an auxiliary member unit having a pedestal spacer according to an embodiment of the present application.
FIG. 3b is a schematic view of a pedestal spacer according to an embodiment of the present application.
Fig. 4 is a flowchart illustrating a method of adjusting a substrate processing apparatus according to an embodiment of the present disclosure.
Detailed Description
The following description of the various embodiments refers to the accompanying drawings, which illustrate specific embodiments that can be used to practice the present application. In the present application, directional terms such as "up", "down", "front", "back", "left", "right", "inner", "outer", "side", and the like are merely referring to the directions of the attached drawings. Accordingly, the directional terminology is used for purposes of illustration and understanding, and is in no way limiting.
In the embodiments of the present application, in order to assist in explaining the adjustment method of the substrate processing apparatus of the present application, it will be assumed that the adjustment method of the substrate processing apparatus of the present invention is performed by a substrate processing apparatus. It should be understood, however, that the devices and/or methods may vary and need not work exactly in conjunction with one another as described below, all of which are within the scope of the present embodiments. It is understood that, in some embodiments, the tuning method of the substrate processing apparatus of the present application may be implemented in a substrate processing apparatus. It should be emphasized that, unless otherwise specified, the method of tuning the substrate processing apparatus of the present invention need not be performed in the exact order shown; and similar multiple flows (blocks) may be executed in parallel, rather than in sequence; therefore, elements of the adjustment method of the substrate processing apparatus of the present application are referred to as "flows" herein instead of "steps". It should also be understood that the adjustment method of the substrate processing apparatus can also be implemented on a variation of the substrate processing apparatus. However, the method may also be implemented in a similar system having similar components to the system, but arranged in a different configuration.
The drawings and description are to be regarded as illustrative in nature, and not as restrictive. In the drawings, elements having similar structures are denoted by the same reference numerals. In addition, the size and thickness of each component shown in the drawings are arbitrarily illustrated for understanding and ease of description, but the present application is not limited thereto.
In the drawings, the thickness of layers, films, panels, regions, etc. are exaggerated for clarity. In the drawings, the thickness of some layers and regions are exaggerated for understanding and convenience of description. It will be understood that when an element such as a layer, film, region or substrate is referred to as being "on" another element, it can be directly on the other element or intervening elements may also be present.
In addition, in the description, unless explicitly described to the contrary, the word "comprise" will be understood to mean that the recited components are included, but not to exclude any other components. Further, in the specification, "on.
To further illustrate the technical means and effects adopted by the present application to achieve the predetermined objects, the following detailed description will be given for a substrate processing apparatus and an adjustment method of the substrate processing apparatus according to the present application with reference to the accompanying drawings and specific embodiments, and the detailed description thereof will be made below.
Fig. 1 is a schematic view of a substrate processing apparatus according to an embodiment of the present application, fig. 2 is a schematic view of an auxiliary member unit according to an embodiment of the present application, fig. 3a is a schematic view of an auxiliary member unit having a pedestal spacer according to an embodiment of the present application, and fig. 3b is a schematic view of a pedestal spacer according to an embodiment of the present application. Referring to fig. 1 and 2, in an embodiment of the present application, a substrate processing apparatus 10 includes: a substrate mounting table 100 on which a substrate to be processed by the substrate processing apparatus 10 is mounted; a lift pin (not shown) vertically inserted through the substrate mounting table 100 and configured to be freely lifted and lowered to protrude and retract from the surface of the substrate mounting table 100; and an auxiliary member unit 120 disposed on the substrate stage 100 for engaging a susceptor (not shown) with the frame 110 of the substrate stage 100.
Referring to fig. 1, fig. 2, fig. 3a and fig. 3b, in an embodiment of the present application, the auxiliary component unit 120 further includes a base spacer 130 for adjusting a height of the auxiliary component unit 120.
Referring to fig. 2, fig. 3a and fig. 3b, in an embodiment of the present application, the height d2 of the pedestal spacer 130 is 0.001-0.002 m.
In an embodiment of the present application, the apparatus further includes a normal pressure transfer chamber (not shown) for transferring a normal pressure atmosphere of the substrate; and a vacuum processing chamber connected to the atmospheric transfer chamber through a load lock chamber and configured to perform vacuum processing on the substrate.
In an embodiment of the present application, the substrate is a glass substrate for manufacturing a display.
In an embodiment of the present application, a ceramic slot is additionally installed below the frame 110 of the substrate stage 100 to make the susceptor better fit with the frame 110.
Referring to fig. 1, fig. 2, fig. 3a and fig. 3b, in an embodiment of the present application, a substrate processing apparatus 10 includes: a substrate mounting table 100 on which a substrate to be processed by the substrate processing apparatus 10 is mounted; a lift pin (not shown) vertically inserted through the substrate mounting table 100 and configured to be freely lifted and lowered to protrude and retract from the surface of the substrate mounting table 100; and an auxiliary member unit 120 disposed on the substrate stage 100 for engaging a susceptor (not shown) with the frame 110 of the substrate stage 100; wherein the height d1 of the protruding part of the body of the auxiliary member unit 120 is 0.005-0.0055 m; however, the height d1 of the protruding portion of the main body of the auxiliary member unit 120 is originally 4 mm, and the height d1 of the protruding portion of the main body of the auxiliary member unit 120 is 0.005-0.0055 m through continuous experiments and tests.
Referring to fig. 1, fig. 2, fig. 3a and fig. 3b, in an embodiment of the present application, the auxiliary component unit 120 further includes a base spacer 130 for adjusting a height of the auxiliary component unit 120.
Referring to fig. 2, fig. 3a and fig. 3b, in an embodiment of the present application, the height d2 of the pedestal spacer 130 is 0.001-0.002 m.
In an embodiment of the present application, the apparatus further includes a normal pressure transfer chamber (not shown) for transferring a normal pressure atmosphere of the substrate; and a vacuum processing chamber connected to the atmospheric transfer chamber through a load lock chamber and configured to perform vacuum processing on the substrate.
In an embodiment of the present application, the substrate is a glass substrate for manufacturing a display.
In an embodiment of the present application, a ceramic slot is additionally installed below the frame 110 of the substrate stage 100, so that the sensor is better engaged with the frame 110.
Fig. 4 is a flowchart illustrating a method of adjusting a substrate processing apparatus according to an embodiment of the present disclosure. In an embodiment of the present application, referring to fig. 1, fig. 2, fig. 3a, fig. 3b and fig. 4, a method for adjusting a substrate processing apparatus 10 includes: providing a substrate mounting table 100 for mounting a substrate to be processed by a substrate processing apparatus 10; vertically inserted through the substrate mounting table 100 via a lift pin, and configured to be freely lifted and lowered to protrude and retract from the surface of the substrate mounting table 100; and an auxiliary member unit 120 is adjusted and disposed on the substrate stage 100 for engaging a susceptor with the frame 110 of the substrate stage 100.
Referring to fig. 1, 2, 3a and 3b, in an embodiment of the present disclosure, in the adjusting method of the substrate processing apparatus, the auxiliary member unit 120 further includes a pedestal spacer 130 for adjusting a height of the auxiliary member unit 120.
Referring to fig. 2, 3a and 3b, in an embodiment of the present disclosure, in the method for adjusting a substrate processing apparatus, a height d2 of the pedestal spacer 130 is 0.001 to 0.002 m.
In an embodiment of the present application, in the adjusting method of the substrate processing apparatus, the substrate is a glass substrate for manufacturing a display; the height of the protruding part of the body of the auxiliary member unit 120 is 0.005-0.0055 m.
In an embodiment of the present application, in the adjusting method of the substrate processing apparatus, a ceramic card slot is additionally installed below the frame 110 of the substrate stage 100, so that the susceptor is better matched with the frame 110.
Referring to fig. 4, in the process S511, a substrate mounting table for mounting a substrate to be processed by a substrate processing apparatus is provided.
Referring to fig. 4, in a process S512, the substrate is vertically inserted into the substrate stage through a lift pin, and is configured to be freely lifted and lowered to protrude and retract from and into the surface of the substrate stage.
Referring to fig. 4, in the process S513, an auxiliary member unit is adjusted to be disposed on the substrate stage for engaging a susceptor with the substrate stage frame.
The application improves the service time of the machine, improves the actual working time of the cavity, reduces the material consumption overhaul cost, and thus enhances the product competitiveness.
The terms "in some embodiments" and "in various embodiments" are used repeatedly. The terms generally do not refer to the same embodiment; it may also refer to the same embodiment. The terms "comprising," "having," and "including" are synonymous, unless the context dictates otherwise.
Although the present application has been described with reference to specific embodiments, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the application, and all changes, substitutions and alterations that fall within the spirit and scope of the application are to be understood as being covered by the following claims.
Claims (4)
1. A substrate processing apparatus, comprising:
a substrate mounting table on which a substrate to be processed by the substrate processing apparatus is mounted;
a lift pin vertically inserted through the substrate mounting table and configured to be freely lifted and lowered so as to protrude and retract from a surface of the substrate mounting table; and
an auxiliary component unit arranged on the substrate carrying platform and used for connecting a tenon receptor and the substrate carrying platform frame in a matching way;
wherein the auxiliary member unit further comprises a base spacer for adjusting the height of the auxiliary member unit; the height of the base spacer is 0.001-0.002 m;
the height of the protruding part of the auxiliary component unit body is 0.005-0.0055 m, the protruding part is in a circular truncated cone shape, and the auxiliary component unit enables the tenon-and-socket receptor to be in fit connection with the substrate carrying table frame through the protruding part;
the shape of the pedestal spacer is the same as the shape of the projection of the auxiliary member unit in the lift pin movement direction.
2. The substrate processing apparatus of claim 1, further comprising an atmospheric pressure transfer chamber that transfers an atmospheric pressure atmosphere of the substrate; and a vacuum processing chamber connected to the atmospheric transfer chamber through a load lock chamber and configured to perform vacuum processing on the substrate.
3. The substrate processing apparatus according to claim 1, wherein the substrate is a glass substrate for display manufacturing.
4. A method for adjusting a substrate processing apparatus, comprising:
providing a substrate carrying table for carrying a substrate to be processed by a substrate processing apparatus;
vertically inserted into the substrate mounting table through a lift pin, and configured to be freely lifted and lowered so as to protrude and retract with respect to the surface of the substrate mounting table; and
by adjusting an auxiliary component unit, the auxiliary component unit is arranged on the substrate carrying table and is used for clamping and tenon connection of a receptor and the substrate carrying table frame;
wherein the auxiliary member unit further comprises a base spacer for adjusting the height of the auxiliary member unit; the height of the base spacer is 0.001-0.002 m;
the height of the protruding part of the auxiliary component unit body is 0.005-0.0055 m, the protruding part is in a circular truncated cone shape, and the auxiliary component unit enables the tenon-and-socket receptor to be in fit connection with the substrate carrying table frame through the protruding part;
the shape of the pedestal spacer is the same as the shape of the projection of the auxiliary member unit in the lift pin movement direction.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811076067.8A CN109309041B (en) | 2018-09-14 | 2018-09-14 | Substrate processing apparatus and method for adjusting substrate processing apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811076067.8A CN109309041B (en) | 2018-09-14 | 2018-09-14 | Substrate processing apparatus and method for adjusting substrate processing apparatus |
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| CN109309041A CN109309041A (en) | 2019-02-05 |
| CN109309041B true CN109309041B (en) | 2020-12-11 |
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| JP4795899B2 (en) * | 2006-08-31 | 2011-10-19 | 東京エレクトロン株式会社 | Substrate mounting mechanism and substrate delivery method |
| JP5069382B1 (en) * | 2012-04-26 | 2012-11-07 | 中外炉工業株式会社 | Surface plate unit |
| KR101539674B1 (en) * | 2014-03-07 | 2015-08-06 | 심경식 | Substrate lift pin and substrate treatment apparatus |
| JP6650841B2 (en) * | 2016-06-27 | 2020-02-19 | 東京エレクトロン株式会社 | Substrate lifting mechanism, substrate mounting table and substrate processing device |
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