CN109307957A - A kind of case chip and packaging method - Google Patents
A kind of case chip and packaging method Download PDFInfo
- Publication number
- CN109307957A CN109307957A CN201710624029.0A CN201710624029A CN109307957A CN 109307957 A CN109307957 A CN 109307957A CN 201710624029 A CN201710624029 A CN 201710624029A CN 109307957 A CN109307957 A CN 109307957A
- Authority
- CN
- China
- Prior art keywords
- area
- case chip
- lead
- substrate
- display area
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 94
- 238000010276 construction Methods 0.000 claims description 13
- 238000006748 scratching Methods 0.000 abstract description 21
- 230000002393 scratching effect Effects 0.000 abstract description 21
- 230000002159 abnormal effect Effects 0.000 abstract description 8
- 238000005538 encapsulation Methods 0.000 description 7
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 238000005520 cutting process Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003760 hair shine Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1345—Conductors connecting electrodes to cell terminals
- G02F1/13452—Conductors connecting driver circuitry and terminals of panels
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
Landscapes
- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Electroluminescent Light Sources (AREA)
- Packages (AREA)
Abstract
This application discloses a kind of case chip and packaging method, which includes: first area and second area, in which: the first area is corresponding with the effective display area of substrate, for encapsulating the effective display area；The second area is corresponding with the noneffective display area of the substrate, and for encapsulating the noneffective display area, the noneffective display area includes lead district, and the second area is not in contact with the lead in the lead district.By the way that part corresponding with substrate lead district in case chip is arranged to the structure not being in contact with the lead in lead district, the lead of substrate lead district can be made not to be in contact with case chip, in this way, at the corresponding case chip part of noneffective display area where removing lead district, it is possible to prevente effectively from scratching lead, and then avoid the display of display screen caused by as scratching lead abnormal, the lower problem of product yield.
Description
Technical field
This application involves display screen encapsulation field more particularly to a kind of case chip and packaging methods.
Background technique
Substrate is a basic element of character of display screen, may include effective display area and noneffective display area.In general,
In the batch production of display screen, influence in order to avoid external environment to display screen, can be used case chip to big plate base into
Row encapsulation, and big plate base is cut after packaging to obtain multiple substrates, wherein each substrate can correspond to one and show
Display screen.
After cutting obtains multiple substrates, for each substrate, it includes effective display area and non-effective aobvious
Show that area is packaged with case chip.However, in practical applications, it usually needs the corresponding case chip portion of removal noneffective display area
Point, and after removing the partial encapsulation piece, driving chip can be connect with the lead of lead district in noneffective display area, to drive
Dynamic display screen shines.
But after reality is packaged big plate base, between substrate and case chip it is close contact, that is,
It says, lead case chip corresponding with the effective display area part of substrate lead district is to be in close contact, in this way, effectively aobvious in removal
When showing the corresponding case chip part in area, lead can be inevitably scraped, lead short circuit or open circuit are caused, and then cause to show screen display
Show exception, the yield of product is lower.
Summary of the invention
The embodiment of the present application provides a kind of case chip and packaging method, for solving in the prior art, by substrate
When the corresponding case chip part of noneffective display area removes, it is easy to scratch the lead in noneffective display area, lead is caused to open a way
Or short circuit, and then cause display screen display abnormal, the lower problem of product yield.
The embodiment of the present application provides a kind of case chip, comprising: first area and second area, in which:
The first area is corresponding with the effective display area of substrate, for encapsulating the effective display area；
The second area is corresponding with the noneffective display area of the substrate, for encapsulating the noneffective display area, institute
Stating noneffective display area includes lead district, and the second area is not in contact with the lead in the lead district.
Preferably, position corresponding with the lead district hollows out in the second area so that the case chip not with institute
The lead stated in lead district is in contact.
Preferably, it is arranged fluted in the second area, the position of the groove is opposite with the position of the lead district
It answers, so that the case chip of the groove is not in contact with the lead in the lead district.
Preferably, the opening shape of the groove is determined according to the shape of the lead district.
Preferably, the cross-sectional shape of the groove is rectangle, trapezoidal or arch.
Preferably, the depth of the groove is 0.2mm to 0.35mm.
Preferably, the second area further include: corresponding with the position in area non-lead in the noneffective display area
Support construction.
Preferably, the cross-sectional shape of the support construction is rectangle, trapezoidal, oval or round.
Preferably, the case chip further include: the third region between the first area and the second area,
Wherein:
It is in hanging shape between the third region and the substrate, the thickness in the third region is less than the case chip
The half of thickness.
The embodiment of the present application also provides a kind of packaging method of case chip based on above-mentioned record, comprising:
Substrate is pressure bonded on the case chip, so that the firstth area of the effective display area of the substrate and the case chip
Domain is corresponding, and the noneffective display area of the substrate is corresponding with the second area of the case chip；
The second area of the case chip is removed.
The embodiment of the present application use at least one above-mentioned technical solution can reach it is following the utility model has the advantages that
Case chip provided by the embodiments of the present application, comprising: first area and second area, in which: the first area with
The effective display area of substrate is corresponding, for encapsulating the effective display area；The second area and the non-effective of the substrate are shown
Show that area is corresponding, for encapsulating the noneffective display area, the noneffective display area includes lead district, the second area not with
Lead in the lead district is in contact.By by part corresponding with substrate lead district in case chip be arranged to not with lead district
In the structure that is in contact of lead, the lead of substrate lead district can be made not to be in contact with case chip, in this way, in removal lead
When the corresponding case chip part of noneffective display area where area, it is possible to prevente effectively from scratching lead, and then avoid due to scratching
The display of display screen caused by lead is abnormal, the lower problem of product yield.
Detailed description of the invention
The drawings described herein are used to provide a further understanding of the present application, constitutes part of this application, this Shen
Illustrative embodiments and their description please are not constituted an undue limitation on the present application for explaining the application.In the accompanying drawings:
Fig. 1 is a kind of schematic diagram of case chip used in the prior art；
Fig. 2 is a kind of top view of case chip provided by the embodiments of the present application；
Fig. 3 is a kind of main view of case chip provided by the embodiments of the present application；
Fig. 4 is the top view of another case chip provided by the embodiments of the present application；
Fig. 5 is a kind of side view of case chip provided by the embodiments of the present application；
Fig. 6 is the main view of another case chip provided by the embodiments of the present application；
Fig. 7 is a kind of flow diagram of packaging method provided by the embodiments of the present application.
Specific embodiment
In the prior art, it after being packaged using case chip to substrate, is in close contact between substrate meeting and case chip,
That is the corresponding case chip part of the lead of substrate lead district is in close contact, in this way, having by non-where lead district
It when the corresponding case chip part in effect viewing area removes, is easy to scratch lead, causes lead open circuit or short-circuit, and then lead to display screen
Display is abnormal.
As shown in Figure 1, being a kind of schematic diagram of the case chip in the prior art used.
In Fig. 1,11 represent the noneffective display area of substrate, and 12 represent the case chip for encapsulating noneffective display area 11,
It is the case chip part for needing to remove, 13 represent the lead of lead district in noneffective display area 11.In use case chip 12 to base
After the noneffective display area 11 of plate is packaged, lead 13 and case chip 12 are in close contact.In this way, being removed by case chip 12
When, it is easy to damage lead 13 is scratched, leads to the open circuit of lead 13 or short circuit, and then influence the normal display of display screen.
To solve the above-mentioned problems, the embodiment of the present application provides a kind of case chip and packaging method, wherein the case chip
It include: first area and second area, in which: the first area is corresponding with the effective display area of substrate, described for encapsulating
Effective display area；The second area is corresponding with the noneffective display area of the substrate, for encapsulating the noneffective display area,
The noneffective display area includes lead district, and the second area is not in contact with the lead in the lead district.
The embodiment of the present application, by the way that part corresponding with substrate lead district in case chip to be arranged to not and in lead district
The structure that lead is in contact can make the lead of substrate lead district not be in contact with case chip, in this way, in removal lead district institute
Noneffective display area corresponding case chip part when, it is possible to prevente effectively from scratching lead, and then avoid due to scratching lead
Caused display screen display is abnormal, the lower problem of product yield.
Technical scheme is clearly and completely retouched below with reference to the application specific embodiment and corresponding attached drawing
It states.Obviously, the described embodiments are only a part but not all of the embodiments of the present application.Based in the application
Embodiment, every other embodiment obtained by those of ordinary skill in the art without making creative efforts,
It shall fall in the protection scope of this application.
Below in conjunction with attached drawing, the technical scheme provided by various embodiments of the present application will be described in detail.
Fig. 2 is a kind of top view of case chip provided by the embodiments of the present application.The case chip can be used for package substrate.
The case chip is as described below.
In Fig. 2, the case chip may include first area 21 and second area 22, and the substrate may include effectively
Viewing area 11 and noneffective display area 12, wherein second area 22 is the case chip part for needing to remove.
First area 21 can be corresponding with the effective display area 11 of the substrate, and for encapsulating effective display area 11,
Wherein, in Fig. 2,111 represent the display area in effective display area 11,211 represent first area 21 to effective display area 11 into
The groove formed after row encapsulation；Second area 22 can be corresponding with the noneffective display area 12 of the substrate, and non-for encapsulating
Effective display area 12, wherein in Fig. 2, noneffective display area 12 may include lead district and non-lead area, and lead 121 can be with
In the lead district.
In the embodiment of the present application, fluted 221 can be set in second area 22, wherein the position of groove 221 can be with
The position of lead district described in noneffective display area 12 is corresponding, in this way, the case chip at groove 221 and the lead district
Between can be in hanging shape, the lead 121 of the lead district is not in contact with the case chip at groove 221.
In order to make it easy to understand, may refer to Fig. 3.Fig. 3 is a kind of main view of case chip provided by the embodiments of the present application.Institute
Stating main view can be main view of the case chip shown in Fig. 2 at second area 22.
As shown in figure 3, fluted 221 are arranged in second area 22, the position of groove 221 and the noneffective display area of substrate
The position of lead district is corresponding in 12, in this way, can make the lead 121 of the lead district not with the envelope at groove 221
Load contacts with each other.
Since the lead 121 in the lead district is not in contact with the case chip at groove 221, will be non-
When the corresponding case chip part (i.e. second area 22) in effective display area 12 removes, it is possible to prevente effectively from scratching lead 121, in turn
The open circuit of lead 121 or short circuit are avoided, guarantees the normal display of display screen, improves the yield of product.
In another embodiment provided by the present application, the opening shape of groove 221 can be according to the shape of the lead district
It determines.For example, the opening shape of groove 221 is also possible to trapezoidal when the shape of the lead district is trapezoidal.In addition to this,
Groove 221 needs to cover the lead district, in this way, the case chip that can be effectively ensured at groove 221 not with the lead district
Lead 121 is in contact.
The shape of the cross section of groove 221 can be rectangle, be also possible to trapezoidal, can also be arch, as long as guaranteeing recessed
The case chip at slot 221 is not in contact with the lead 121 of the lead district.
The depth of groove 221 can be in 0.2mm between 0.35mm, and in practical applications, not influencing, display screen is normal
In the case where display, the actual (real) thickness of groove 221 can be determined according to the thickness of the case chip.In the embodiment of the present application, make
For a kind of preferred mode, the thickness of groove 221 can be the half of the case chip thickness.In this way, can be effectively ensured recessed
The lead 121 of case chip and the lead district at slot 221 is not in contact with each other.
In another embodiment provided by the present application, in second area 22 can also include: in noneffective display area 12
The corresponding support construction in the position in non-lead area.It, can be in this way, in the case where being arranged fluted 221 in second area 22
The intensity for increasing second area 22, avoiding second area 22 that fracture occurs in tableting processes, (groove 221 is arranged in second area 22
Afterwards, the intensity of second area 22 can be reduced).Wherein, the support construction can correspond to a part of region in the non-lead area,
The whole region that the non-lead area can also be corresponded to, is not specifically limited here.
As shown in Fig. 2, 222 represent the support construction for including in second area 22,222 corresponding positions can be non-effective
A part of region in non-lead area in viewing area 12.In Fig. 2, second area 22 may include two support constructions 222, two branch
Support structure 222 respectively corresponds the two sides of the lead district where lead 121.
The shape of the cross section of support construction 22 can be rectangle (in Fig. 2 for rectangle), be also possible to trapezoidal, can also be
The other shapes such as ellipse or circle as long as the supporting role to second area 22 can be played, and then increase second area 22
Intensity, the embodiment of the present application is not specifically limited the cross-sectional shape of support construction 22.
In another embodiment provided by the present application, the case chip can also include: third region 23, wherein third
It region 23 can be between first area 21 and the second area 22.
In the embodiment of the present application, the purpose in third region 23 be can be for the ease of removing second area 22, specifically,
When removing second area 22, can be cut along third region 23, in this way, removing second area 22 with can be convenient.
For the ease of cutting along third region 23, third region 23 be can be set between the substrate in hanging
Shape, in addition, the ratio that the thickness in third region 23 can also be arranged is relatively thin, in this way, can relatively easily to third region 23 into
Row cutting.As a kind of preferably mode, the thickness in third region 23 can be less than the half of the thickness of the case chip.
In the embodiment of the present application, third region 23 in addition to convenient for except removing second area 22, can also play hold it is excessive
Packaging plastic out avoids packaging plastic from being spilled over to the effect of the substrate lead district.Specifically, in the use case chip to described
When substrate is packaged, the case chip for being coated with packaging plastic can be placed in below the substrate, and by the substrate under
It is up pressed together on the case chip.In general, in order to guarantee that packaging effect, packaging plastic can be paved with entire glue application region, in this way, pressing
According to the above method by after the substrate and case chip pressing, packaging plastic can inevitably overflow glue application region, due to this Shen
In please implementing, the case chip includes third region 23, and is hanging shape between third region 23 and the substrate, therefore, is overflow
Packaging plastic out can be flowed into third region 23, in this way, it is possible to prevente effectively from packaging plastic is spilled over to the lead of the substrate
Area.
It should be noted that in practical applications, the groove 221 being arranged in the second area 22 can be with third region
23 collectively form the biggish groove of area, and the depth of groove 221 can be identical as the depth in third region 23.In this way,
If third region 23 is not enough to hold the packaging plastic of spilling, the packaging plastic of spilling can be flowed into groove 221, avoid encapsulating
Glue is spilled over to the lead district of the substrate.
Case chip provided by the embodiments of the present application, it is recessed by the way that part corresponding with substrate lead district in case chip to be arranged to
Slot can make the lead of substrate lead district not be in contact with case chip, in this way, the non-effective display where removing lead district
When the corresponding case chip part in area, it is possible to prevente effectively from scratching lead, and then avoid showing screen display caused by as scratching lead
Show exception, the lower problem of product yield.
Fig. 4 is the top view of another case chip provided by the embodiments of the present application.The case chip is as described below.It needs
Bright, the difference of case chip shown in Fig. 4 and case chip shown in Fig. 2 is: case chip shown in Fig. 4 can be used for more
A substrate is packaged.Wherein, for a substrate, case chip shown in Fig. 4 can be with case chip shown in Fig. 2
It is identical.
As shown in figure 4, including eight substrates in Fig. 4, eight substrates can be divided to two rows, and every row is arranged in array fashion,
Between two neighbouring substrates, the effective display area 41 of a substrate and the noneffective display area 42 of another substrate are adjacent,
Wherein, each substrate can be used case chip shown in Fig. 2 and be packaged.
In Fig. 4, for one of substrate, the case chip for being packaged to the substrate may include encapsulation
Region 43 (first area 21 that can correspond to case chip shown in Fig. 2) and clipping region 44 (can correspond to shown in Fig. 2
The second area 22 of case chip and third region 23).Wherein, clipping region 44 can be the case chip part for needing to remove,
Clipping region 44 may include groove 441 and support construction 442.In Fig. 4, the opening shape of groove 441 is " work " word row, branch
The cross section of support structure 442 is rectangle.
Groove 441 covers lead district (being not shown in Fig. 4, may refer to Fig. 2) in noneffective display area 42, in this way, can be with
It avoids the lead of the lead district from contacting with the case chip, and then avoids scratching when removing clipping region 44 to lead；
Support construction 442 can play support clipping region 44, and then increase the purpose of the intensity of clipping region 44, avoid clipping region
44 are broken during tabletting.In addition to this, groove 441 can be also used for holding the packaging plastic of spilling, and packaging plastic is avoided to overflow
Out to the lead district.
In technical solution provided by the embodiments of the present application, Fig. 2, Fig. 3 or case chip shown in Fig. 4 will need to remove
The removal of case chip part after, driving chip and the lead of lead district can be connected, in this way, driving chip can drive display
Screen display.It is illustrated by taking case chip shown in Fig. 2 as an example below.
Fig. 5 is a kind of side view of case chip provided by the embodiments of the present application.The side view can be envelope shown in Fig. 2
The side view of load.The case chip may include first area 21 and second area 22, and the case chip is for encapsulating base
Plate 52.
In Fig. 5, second area 22 is the case chip part for needing to remove, can be with the noneffective display area of counterpart substrate 52
(not marked in Fig. 5, reference can be made to Fig. 2).It, can be by driving chip 51 and the non-effective display after removing second area 22
The lead connection of lead district in area, in this way, driving chip 51 can drive display screen normally to show.
Case chip provided by the embodiments of the present application, it is recessed by the way that part corresponding with substrate lead district in case chip to be arranged to
Slot can make the lead of substrate lead district not be in contact with case chip, in this way, the non-effective display where removing lead district
When the corresponding case chip part in area, it is possible to prevente effectively from scratching lead, and then avoid showing screen display caused by as scratching lead
Show exception, the lower problem of product yield.
Fig. 6 is the main view of another case chip provided by the embodiments of the present application.The case chip is as described below.
In Fig. 6, be packaged with the second area 62 of case chip on the noneffective display area 12 of substrate, in second area 62 with draw
The corresponding position in line area hollows out, in this way, the lead 121 of the lead district can be made not to be in contact with the second area, i.e.,
It does not contact with each other with the case chip.
Since the lead 121 in the lead district is not in contact with the case chip, by noneffective display area 12
When corresponding case chip part (i.e. second area 62) removes, it is possible to prevente effectively from scratching lead 121, and then lead 121 is avoided
Open circuit or short circuit, guarantee the normal display of display screen, improve the yield of product.
In practical applications, the opening shape of area of knockout can be according to the shape of the lead district in the second area
It determines, the cross-sectional shape of area of knockout can be rectangle, trapezoidal or arch, be not specifically limited here.
In addition, in the embodiment of the present application, after position corresponding with the lead district in the second area is hollowed out,
The support construction in embodiment documented by Fig. 2 can be set in the second region, description is not repeated herein.
For the ease of removing the second area, can also be arranged in embodiment documented by Fig. 2 in the case chip
The third region, be also not repeated to describe here.
Case chip provided by the embodiments of the present application can by hollowing out part corresponding with substrate lead district in case chip
Effectively to avoid the lead in lead district from being in contact with case chip, in this way, the noneffective display area pair where removing lead district
When the case chip part answered, it is possible to prevente effectively from scratching lead, and then it is different to avoid display screen caused by as scratching lead from showing
Often, the lower problem of product yield.
Case chip provided by the embodiments of the present application, comprising: first area and second area, in which: the first area with
The effective display area of substrate is corresponding, for encapsulating the effective display area；The second area and the non-effective of the substrate are shown
Show that area is corresponding, for encapsulating the noneffective display area, the noneffective display area includes lead district, the second area not with
Lead in the lead district is in contact.By by part corresponding with substrate lead district in case chip be arranged to not with lead district
In the structure that is in contact of lead, the lead of substrate lead district can be made not to be in contact with case chip, in this way, in removal lead
When the corresponding case chip part of noneffective display area where area, it is possible to prevente effectively from scratching lead, and then avoid due to scratching
The display of display screen caused by lead is abnormal, the lower problem of product yield.
Fig. 7 is a kind of flow diagram of packaging method provided by the embodiments of the present application.The packaging method can be base
In the packaging method of the case chip of above-mentioned record, the packaging method is as described below.
Step 701: substrate being pressure bonded on the case chip, so that the effective display area of the substrate and the case chip
First area it is corresponding, the noneffective display area of the substrate is corresponding with the second area of the case chip.
In step 701, when the case chip based on above-mentioned record is packaged substrate, it can will be coated with encapsulation
The case chip of glue is placed in below the substrate, and the substrate is pressed together on from the bottom up on the case chip；Also or
The case chip is pressed on the substrate from top to bottom.It is described after the substrate is pressure bonded on the case chip
The effective display area of substrate can be corresponding with the first area of the case chip, and the noneffective display area of the substrate can be with institute
The second area for stating case chip is corresponding.
In the embodiment of the present application, after the substrate is pressure bonded on the case chip, in the lead district of the substrate
Lead is not in contact with the second area, i.e., the lead in the lead district of the described substrate is not in contact with the case chip.
Specifically, based on the case chip of above-mentioned record, in the second area of the case chip with the lead
The corresponding position in area hollows out, alternatively, fluted, the position of the position of the groove and the lead district is arranged in the second area
Set corresponding, therefore, after the substrate is pressure bonded to the case chip, the lead in the substrate can not be with the encapsulation
Piece is in contact.
Step 702: the second area of the case chip is removed.
It in a step 702, can be by described in the case chip after the substrate is pressure bonded to the case chip
The removal of two regions.
In the embodiment of the present application, since the lead in the substrate is not in contact with the second area, by institute
When stating second area removal, it is possible to prevente effectively from scratching the lead in damage lead district, and then avoid causing due to scratching lead
Display screen show abnormal, effectively improve product yield.
Packaging method provided by the embodiments of the present application can be packaged substrate based on the case chip of above-mentioned record, tool
Body includes: that substrate is pressure bonded on the case chip, so that the firstth area of the effective display area of the substrate and the case chip
Domain is corresponding, and the noneffective display area of the substrate is corresponding with the second area of the case chip；By the secondth area of the case chip
Domain removal.It is arranged to not to be in contact with the lead in lead district due to part corresponding with substrate lead district in the case chip
Structure can make the lead of substrate lead district not be in contact with case chip, therefore, non-effective aobvious where removing lead district
When showing the corresponding case chip part in area, it is possible to prevente effectively from scratching lead, and then display screen caused by as scratching lead is avoided
Display is abnormal, the lower problem of product yield.
It will be understood by those skilled in the art that although the preferred embodiment of the application has been described, but skill in the art
Art personnel once know basic creative concept, then additional changes and modifications may be made to these embodiments.So appended
Claim is intended to be construed to include preferred embodiment and all change and modification for falling into the application range.
Obviously, those skilled in the art can carry out various modification and variations without departing from the model of the application to the application
It encloses.In this way, if these modifications and variations of the application belong within the scope of the claim of this application and its equivalent technologies, then
The application is also intended to include these modifications and variations.
Claims (10)
1. a kind of case chip, which is characterized in that the case chip includes first area and second area, in which:
The first area is corresponding with the effective display area of substrate, for encapsulating the effective display area；
The second area is corresponding with the noneffective display area of the substrate, described non-for encapsulating the noneffective display area
Effective display area includes lead district, and the second area is not in contact with the lead in the lead district.
2. case chip as described in claim 1, which is characterized in that
Position corresponding with the lead district hollows out in the second area, so that the case chip is not and in the lead district
Lead is in contact.
3. case chip as described in claim 1, which is characterized in that
It is arranged fluted in the second area, the position of the groove is corresponding with the position of the lead district, so that described
The case chip of groove is not in contact with the lead in the lead district.
4. case chip as claimed in claim 3, which is characterized in that
The opening shape of the groove is determined according to the shape of the lead district.
5. case chip as claimed in claim 4, which is characterized in that
The cross-sectional shape of the groove is rectangle, trapezoidal or arch.
6. case chip as claimed in claim 5, which is characterized in that
The depth of the groove is 0.2mm to 0.35mm.
7. such as case chip as claimed in any one of claims 1 to 6, which is characterized in that
The second area further include: support construction corresponding with the position in area non-lead in the noneffective display area.
8. case chip as claimed in claim 7, which is characterized in that
The cross-sectional shape of the support construction is rectangle, trapezoidal, oval or round.
9. case chip as described in claim 1, which is characterized in that the case chip further include: be located at the first area with
Third region between the second area, in which:
It is in hanging shape between the third region and the substrate, the thickness in the third region is less than the thickness of the case chip
Half.
10. a kind of packaging method based on case chip as described in any one of claim 1 to 9 characterized by comprising
Substrate is pressure bonded on the case chip, so that the first area pair of the effective display area of the substrate and the case chip
It answers, the noneffective display area of the substrate is corresponding with the second area of the case chip；
The second area of the case chip is removed.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710624029.0A CN109307957A (en) | 2017-07-27 | 2017-07-27 | A kind of case chip and packaging method |
| PCT/CN2018/083846 WO2019019715A1 (en) | 2017-07-27 | 2018-04-20 | Encapsulating sheet and encapsulating method |
| TW107125483A TWI663694B (en) | 2017-07-27 | 2018-07-24 | Packaging sheet and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710624029.0A CN109307957A (en) | 2017-07-27 | 2017-07-27 | A kind of case chip and packaging method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109307957A true CN109307957A (en) | 2019-02-05 |
Family
ID=65033936
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710624029.0A Pending CN109307957A (en) | 2017-07-27 | 2017-07-27 | A kind of case chip and packaging method |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN109307957A (en) |
| TW (1) | TWI663694B (en) |
| WO (1) | WO2019019715A1 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109870839A (en) * | 2019-04-03 | 2019-06-11 | 友达光电（昆山）有限公司 | display panel |
| CN110444117A (en) * | 2019-07-24 | 2019-11-12 | 昆山维信诺科技有限公司 | The preparation method of package substrate and display panel |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244088A (en) * | 2011-06-29 | 2011-11-16 | 昆山工研院新型平板显示技术中心有限公司 | OLED (organic light emitting devices) screen body capable of preventing lead corrosion and OLED screen body packaging method |
| CN104749831A (en) * | 2013-12-30 | 2015-07-01 | 三星显示有限公司 | Display device |
| CN206059442U (en) * | 2016-09-28 | 2017-03-29 | 九江维信诺科技有限公司 | A kind of case chip |
| CN106773213A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN207676089U (en) * | 2017-07-27 | 2018-07-31 | 昆山维信诺科技有限公司 | A kind of case chip |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4836651A (en) * | 1987-12-03 | 1989-06-06 | Anderson Richard A | Flexible circuit interconnection for a matrix addressed liquid crystal panel |
| US7102703B1 (en) * | 1999-02-24 | 2006-09-05 | National Semiconductor Corporation | Liquid crystal display assembly for reducing optical defects |
| JP3690378B2 (en) * | 2002-07-26 | 2005-08-31 | 株式会社 日立ディスプレイズ | Display device |
| JP5182781B2 (en) * | 2006-10-26 | 2013-04-17 | ルネサスエレクトロニクス株式会社 | Display device and data driver |
| CN101162314B (en) * | 2007-08-16 | 2011-08-10 | 昆山维信诺显示技术有限公司 | Display device and method for manufacturing mask plate and display device |
| KR101020992B1 (en) * | 2009-03-02 | 2011-03-09 | 엘지이노텍 주식회사 | Light emitting module and light unit having same |
| US20110254758A1 (en) * | 2010-04-19 | 2011-10-20 | Qualcomm Mems Technologies, Inc. | Flex Design and Attach Method for Reducing Display Panel Periphery |
| CN102082163B (en) * | 2010-09-16 | 2015-11-25 | 昆山维信诺科技有限公司 | A kind of organic electroluminescence device, preparation method, display module and application thereof |
| CN104035253A (en) * | 2014-05-26 | 2014-09-10 | 京东方科技集团股份有限公司 | Array substrate, preparation method of array substrate and display panel |
-
2017
- 2017-07-27 CN CN201710624029.0A patent/CN109307957A/en active Pending
-
2018
- 2018-04-20 WO PCT/CN2018/083846 patent/WO2019019715A1/en active Application Filing
- 2018-07-24 TW TW107125483A patent/TWI663694B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244088A (en) * | 2011-06-29 | 2011-11-16 | 昆山工研院新型平板显示技术中心有限公司 | OLED (organic light emitting devices) screen body capable of preventing lead corrosion and OLED screen body packaging method |
| CN104749831A (en) * | 2013-12-30 | 2015-07-01 | 三星显示有限公司 | Display device |
| CN206059442U (en) * | 2016-09-28 | 2017-03-29 | 九江维信诺科技有限公司 | A kind of case chip |
| CN106773213A (en) * | 2017-01-03 | 2017-05-31 | 京东方科技集团股份有限公司 | A kind of display panel and preparation method thereof, display device |
| CN207676089U (en) * | 2017-07-27 | 2018-07-31 | 昆山维信诺科技有限公司 | A kind of case chip |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109870839A (en) * | 2019-04-03 | 2019-06-11 | 友达光电（昆山）有限公司 | display panel |
| CN109870839B (en) * | 2019-04-03 | 2021-03-12 | 友达光电（昆山）有限公司 | display panel |
| US11314111B2 (en) | 2019-04-03 | 2022-04-26 | AU Optronics (Kunshan) Co., Ltd. | Display panel |
| CN110444117A (en) * | 2019-07-24 | 2019-11-12 | 昆山维信诺科技有限公司 | The preparation method of package substrate and display panel |
| CN110444117B (en) * | 2019-07-24 | 2021-09-28 | 苏州清越光电科技股份有限公司 | Preparation method of packaging substrate and display panel |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2019019715A1 (en) | 2019-01-31 |
| TWI663694B (en) | 2019-06-21 |
| TW201839926A (en) | 2018-11-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207676089U (en) | A kind of case chip | |
| CN109307957A (en) | A kind of case chip and packaging method | |
| CN101150118A (en) | Semiconductor device | |
| CN207262354U (en) | A kind of shell structure of backlight source module, backlight source module and display device | |
| KR20110098237A (en) | Semiconductor chip, film and tab package containing same | |
| CN205452275U (en) | Semiconductor device | |
| WO2008111304A1 (en) | Method for manufacturing semiconductor device, semiconductor device and optical pickup module | |
| US8292079B2 (en) | Semiconductor chip holding tray | |
| JPH03278554A (en) | Chip tray structure | |
| KR950012798B1 (en) | Coplanar die to substrate bond method | |
| TW201418499A (en) | Clamp device for use in sputtering process of wafer fabrication, and method of sputtering and electroplating semiconductor package | |
| CN212517143U (en) | Substrate placing box | |
| CN210110727U (en) | Silicon wafer cleaning flower basket | |
| CN203078978U (en) | Packaging for antenna terminals | |
| CN204223462U (en) | Carrying belt | |
| CN208970480U (en) | Mold external member easy to clean | |
| US9184696B2 (en) | Solar cell module and method for manufacturing the same | |
| CN204167288U (en) | Flat no-lead packages body | |
| JP5674346B2 (en) | Semiconductor device manufacturing method, semiconductor device, semiconductor device storage method, and semiconductor manufacturing apparatus | |
| CN105457962B (en) | The clean method of electronic component | |
| CN210575933U (en) | Frame and open type electrocardiogram sensor comprising same | |
| CN204720426U (en) | A kind of thimble cap | |
| TW200614481A (en) | Wafer level process for manufacturing leadframe and device from the same | |
| TWI871001B (en) | OLED display structure | |
| CN109743850B (en) | Jig for fixing lamp panel and manufacturing method of jig |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: No. 188, CHENFENG Road, high tech Zone, Suzhou City, Jiangsu Province Applicant after: Suzhou Qingyue Photoelectric Technology Co., Ltd Address before: 215300 No. 188 Feng Feng Road, hi tech Zone, Jiangsu, Kunshan Applicant before: Kunshan Visionox Technology Co.,Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190205 |
|
| RJ01 | Rejection of invention patent application after publication |