CN109241114A - Faulty equipment identifying system and recognition methods and computer storage medium - Google Patents
Faulty equipment identifying system and recognition methods and computer storage medium Download PDFInfo
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Abstract
The present invention provides a kind of faulty equipment identifying system and recognition methods and computer storage medium, the faulty equipment recognition methods includes: the angle value for obtaining the direction characteristic defect on multiple wafers, is defined as first angle value；First time grouping is carried out to the multiple wafer according to each first angle value, to obtain the first group coding；Angle value when each wafer in the multiple wafer comes out from each process equipment of experience is obtained, second angle value is defined as；It carries out second to the multiple wafer according to each second angle value to be grouped, to obtain the second group coding；And be compared first group coding and second group coding, to identify out of order process equipment from all process equipments that the multiple wafer is undergone, and then realize the quickly and effectively identification to faulty equipment.
Description
Technical field
The present invention relates to semiconductor technology manufacturing field, in particular to a kind of faulty equipment identifying system and recognition methods and
Computer storage medium.
Background technique
In the manufacturing process of semiconductor integrated circuit, faulty equipment can be quickly recognized and have become promotion yield
One important means.During volume production, often it will appear in the defect map (defect map) that detection device scans
Defect with directionality group (group) feature, these defects with directionality group (group) feature can make to cause this
The faulty equipment of defect map (defect map) obtains strong signal, and these directionality group (group) features is scarce
It falls into and is characterized usually using angle value.Industry is all made of the method for calling the angle-data library of equipment manually and carries out failure at present
The identification of equipment judges the defect of directionality group (group) feature by the angle value of obtained every wafer, and to equipment
Investigation judgement one by one is carried out, to identify faulty equipment.But the method low efficiency, it is error-prone, it is therefore, how accurate quick
The defect information by directionality group (group) feature identify faulty equipment become one need solve the problems, such as.
Summary of the invention
The purpose of the present invention is to provide a kind of faulty equipment identifying system and recognition methods and computer storage medium, with
The faulty equipment for the defect for leading to direction characteristic is quickly and effectively identified.
To achieve the above object, the present invention provides a kind of faulty equipment recognition methods, comprising:
The angle value for obtaining the direction characteristic defect on multiple wafers, is defined as first angle value；
First time grouping is carried out to the multiple wafer according to each first angle value, is compiled with obtaining the first group
Code；
Angle value when each wafer in the multiple wafer comes out from each process equipment of experience is obtained, is defined as
Second angle value；
Second is carried out to the multiple wafer according to each second angle value to be grouped, and is compiled with obtaining the second group
Code；And
First group coding and second group coding are compared, with the institute undergone from the multiple wafer
Have and identifies out of order process equipment in process equipment.
Optionally, the step of obtaining the first angle value include:
Defects detection is carried out to each wafer, to detect the multiple wafer with direction characteristic defect；And
Angle at the V slot of each wafer in the multiple wafer is set as zero, is pros with direction of rotation counterclockwise
To the angle value of the V slot of the relatively described wafer of direction characteristic defect on each wafer being calculated, using as the crystalline substance
The corresponding first angle value of circle.
Optionally, the step of obtaining the second angle value include:
Angle detection device is set in the wafer exit of each process equipment, and defines each wafer into the processing
Angle when equipment at V slot is zero；And
It detects from the wafer exit of the process equipment by the angle detection device on each process equipment
Angle value of relatively described wafer when entering at the V slot of the wafer come, using as the corresponding second angle value of the wafer.
Optionally, the angle detection device is mainly made of 360 ° of aperture.
Optionally, the principle of the first time grouping is by the first angle value having the same in the multiple wafer
Wafer be grouped into the same group；The principle of second of grouping is by the second angle having the same in the multiple wafer
The wafer of value is grouped into the same group.
Optionally, the first time is grouped into manual grouping, described to be grouped into automatic grouping for the second time.
Optionally, first group coding and second group encode be all made of the packet number of each grouping with it is described
The combined mode of the number of each wafer in grouping, when some described first group coding and some described second group coding
When identical, second group encodes the process equipment that corresponding process equipment is failure.
The present invention also provides a kind of computer storage mediums, are stored thereon with computer program, the computer program quilt
Processor realizes faulty equipment recognition methods of the present invention when executing.
The present invention also provides a kind of faulty equipment identifying systems, comprising:
First detection unit, for establishing connection with corresponding defect detecting system, to be examined from the defect detecting system
Multiple wafers with direction characteristic defect are obtained in the wafer of survey, and then are obtained on each wafer in the multiple wafer
Direction characteristic defect angle value, the angle value is defined as first angle value；
First coding unit, the first angle value for being obtained according to the first detection unit is to the multiple crystalline substance
Circle carries out first time grouping, and obtains the first group coding；
Second detection unit connects for establishing with each wafer in the multiple wafer from each process equipment of experience
It connects, to obtain angle value when each wafer in the multiple wafer comes out from each process equipment of experience, and will be described
Angle value is defined as second angle value；
Second coding unit, the second angle value for being obtained according to the second detection unit is to the multiple crystalline substance
Circle carries out second and is grouped, to obtain the second group coding；And
Comparing unit, first group coding and second coding for obtaining first coding unit are single
Second group coding that member obtains is compared, to identify event from all process equipments that the multiple wafer is undergone
The process equipment of barrier.
Optionally, the first detection unit is also used to the angle at the V slot of each wafer in the multiple wafer
It is set as zero, using direction of rotation counterclockwise as positive direction, the direction characteristic defect calculated on each wafer is relatively described
The angle value of the V slot of wafer, using as the corresponding first angle value of the wafer.
Optionally, the second detection unit is to be mounted on the angle detection in the wafer exit of each process equipment
Device, the angle for being configured as defining when each wafer enters the process equipment at V slot is zero, and detects each crystalline substance
Angle value of circle when being come out from the wafer exit of the process equipment from the V slot of the wafer when opposite entrance, using as institute
State the corresponding second angle value of wafer.
Optionally, the angle detection device is mainly made of 360 ° of aperture.
Optionally, the principle that the first time in first coding unit is grouped is will be in the multiple wafer with identical
The wafer of the first angle value be grouped into the same group；The principle of second of grouping in second coding unit is will be described
The wafer of the second angle value having the same is grouped into the same group in multiple wafers.
Optionally, the first time is grouped into manual grouping, described to be grouped into automatic grouping for the second time.
Optionally, first group coding and second group encode be all made of the packet number of each grouping with it is described
The combined mode of the number of each wafer in grouping, when some described first group coding and some described second group coding
When identical, second group encodes the process equipment that corresponding process equipment is failure.
Compared with prior art, faulty equipment identifying system provided by the invention and recognition methods and computer storage are situated between
Matter, by the block encodings of multiple wafers to the defect with direction characteristic and the multiple wafer from each of experience
The block encoding of angle value when a process equipment comes out is compared, and realizes the quickly and effectively identification to faulty equipment.
Detailed description of the invention
Fig. 1 is the flow chart of the faulty equipment recognition methods of one embodiment of the invention；
Fig. 2 is the setting schematic diagram of the angle value of one embodiment of the invention；
Fig. 3 is the angle direction characteristic defect D1 of the wafer with direction characteristic defect D1 of one embodiment of the invention
Spend schematic diagram；
Fig. 4 is the example of the first group coding of one embodiment of the invention；
Fig. 5 is the schematic diagram of the angle detection device of the wafer of one embodiment of the invention；
Fig. 6 is the example of the second group coding of one embodiment of the invention；
Fig. 7 is the system block diagram of the faulty equipment identifying system of one embodiment of the invention.
Wherein, the reference numerals are as follows for attached drawing 1~7:
D1- defect；G1- aperture；W1- wafer；1- faulty equipment identifying system；2- defect detecting system；3- wafer；4- adds
Construction equipment；11- first detection unit；The first coding unit of 12-；13- second detection unit；The second coding unit of 14-；15- ratio
Compared with unit.
Specific embodiment
To keep the purpose of the present invention, advantages and features clearer, below in conjunction with 1~7 pair of attached drawing event proposed by the present invention
Barrier equipment identifying system and recognition methods and computer storage medium are described in further detail.It should be noted that attached drawing is adopted
With very simplified form and using non-accurate ratio, only to facilitate, lucidly aid in illustrating the embodiment of the present invention
Purpose.
One embodiment of the invention provides a kind of faulty equipment recognition methods, and refering to fig. 1, Fig. 1 is one embodiment of the invention
The flow chart of faulty equipment recognition methods, the faulty equipment recognition methods include:
Step S1-A, the angle value for obtaining the direction characteristic defect on multiple wafers, is defined as first angle value；
Step S1-B, first time grouping is carried out to the multiple wafer according to each first angle value, to obtain the
One group coding；
Step S1-C, angle when each wafer in the multiple wafer comes out from each process equipment of experience is obtained
Value, is defined as second angle value；
Step S1-D, it carries out second to the multiple wafer according to each second angle value to be grouped, to obtain the
Two groups coding；
Step S1-E, first group coding and second group coding are compared, with from the multiple crystalline substance
Out of order process equipment is identified in all process equipments of circle experience.
Introduce faulty equipment recognition methods provided in this embodiment in more detail referring next to Fig. 2~Fig. 6.
Firstly, according to step S1-A, obtaining the angle of the direction characteristic defect on multiple wafers refering to Fig. 2 and Fig. 3
Value, is defined as first angle value.Specifically, defects detection is carried out to each wafer, to detect with direction characteristic defect
The multiple wafer；And angle at the V slot of each wafer in the multiple wafer is set as zero, to revolve counterclockwise
Turning direction is positive direction, calculates the angle value of the V slot of the relatively described wafer of direction characteristic defect on each wafer,
Using as the corresponding first angle value of the wafer.Fig. 2 is the setting schematic diagram of the angle value of one embodiment of the invention, from Fig. 2
In can be seen that, the initial position (i.e. 0 ° of position) of the angle can be set at the V slot of the wafer, and set counterclockwise rotation
Turning direction is positive-angle direction, and the range of the angle is 0 °~360 °.Fig. 3 be one embodiment of the invention one have directionality
The direction characteristic defect D1 angle schematic diagram of the wafer of characteristics defect D1, from figure 3, it can be seen that can institute to detect
The center for stating direction characteristic defect D1 is the position of the defect D1, and therefore, the angle value of the defect D1 is 135 °, that is, is had
The first angle value for having the wafer of the defect D1 is 135 °.
Then, refering to Fig. 4, according to step S1-B, the is carried out to the multiple wafer according to each first angle value
Primary grouping, to obtain the first group coding.The principle of the first time grouping is will be having the same in the multiple wafer
The wafer of the first angle value is grouped into the same group, and the first time is grouped into manual grouping, and the first group coding uses
The packet number of each grouping mode combined with the number of each wafer in the grouping.Fig. 4 is one embodiment of the invention
The example of first group coding, as can be seen from Figure 4, the number of each wafer with corresponding direction characteristic defect is respectively
01,02,03,04 and 05, the corresponding first angle value of these wafers is respectively 45 °, 30 °, 45 °, 45 ° and 30 °, by described first
Angle value is all that 30 ° of the wafer 02 and 05 point is one group, packet number GA；It and by the first angle value is all 45 °
01,03 and 04 point of the wafer is one group, packet number GB.Therefore, first group obtained encodes
GA0205GB010304。
Then, refering to Fig. 5, according to step S1-C, each wafer obtained in the multiple wafer adds from each of experience
Angle value when construction equipment comes out is defined as second angle value.Specifically, angle is set in the wafer exit of each process equipment
Detection device is spent, and the angle defined when each wafer enters the process equipment at V slot is zero；And by each described
Opposite institute from the V slot of wafer of the angle detection device detection from the wafer exit of the process equipment out on process equipment
Angle value when wafer enters is stated, using as the corresponding second angle value of the wafer.The range of the angle value be 0 °~
360 °, the angle detection device is mainly made of 360 ° of aperture.Fig. 5 is the angle detection of the wafer of one embodiment of the invention
The schematic diagram of device enters institute after the wafer W1 comes out from the wafer exit of the process equipment as can be seen from Figure 5
The lower section of the aperture G1 of angle detection device is stated, the angle detection device detects the relatively described crystalline substance at the V slot of the wafer
Circle enters the angle value when process equipment, to obtain the second angle value.Referring to Fig. 6,01,02,03,04 and of wafer
05 experienced equipment 1,2,3 and 4 respectively, the second angle value of the corresponding equipment 1 of wafer 01,02,03,04 and 05 is respectively 90 °,
90 °, 90 °, 180 ° and 180 °；The second angle value of the corresponding equipment 2 of wafer 01,02,03,04 and 05 is respectively 90 °, 90 °,
180 °, 180 ° and 180 °；The second angle value of the corresponding equipment 3 of wafer 01,02,03,04 and 05 is respectively 90 °, 180 °, 90 °,
90 ° and 180 °；The second angle value of the corresponding equipment 4 of wafer 01,02,03,04 and 05 is respectively 90 °, 90 °, 90 °, 90 ° and 90 °.
Then, refering to Fig. 6, according to step S1-D, the is carried out to the multiple wafer according to each second angle value
Secondary grouping, to obtain the second group coding.The principle of second of grouping is will be having the same in the multiple wafer
The wafer of the second angle value is grouped into the same group, described to be grouped into automatic grouping for the second time, and the second group coding uses
The packet number of each grouping mode combined with the number of each wafer in the grouping.Fig. 6 is one embodiment of the invention
The example of second group coding produces technique totally 4 of the wafer, the technique includes 1~work of technique as can be seen from Figure 6
Skill 4, the corresponding process equipment of the 1~technique of technique 4 respectively include 1~equipment of equipment 4,01,02,03,04 and of wafer
Each wafer in 05 can generate the second angle value when coming out from process equipment described in every, will have identical
The second angle value wafer number be grouped into the same group automatically, therefore from the 1~equipment of equipment 4 out the crystalline substance
Round second group coding respectively can for GA010203GB0405, GA0102GB030405, GA0205GB010304 and
GA0102030405。
Finally, according to step S1-E, first group coding and second group coding are compared, with from institute
It states in all process equipments of multiple wafer experience and identifies out of order process equipment.When some described first group coding and certain
When a second group encodes identical, second group encodes the processing that corresponding process equipment is failure and sets
It is standby.By taking first group coding in Fig. 4 and second group coding in Fig. 6 as an example, the first group coding
GA0205GB010304 is identical as second group coding GA0205GB010304, therefore, the second group coding
The corresponding process equipment 3 of GA0205GB010304 is the faulty equipment.
In conclusion faulty equipment recognition methods provided by the invention, comprising: obtain the direction characteristic on multiple wafers
The angle value of defect is defined as first angle value；The multiple wafer is carried out for the first time according to each first angle value
Grouping, to obtain the first group coding；The each wafer obtained in the multiple wafer comes out from each process equipment of experience
When angle value, be defined as second angle value；Second point is carried out to the multiple wafer according to each second angle value
Group, to obtain the second group coding；And by first group coding and second group coding be compared, with from
Out of order process equipment is identified in all process equipments of the multiple wafer experience, is realized to the fast and effective of faulty equipment
Identification.
One embodiment of the invention provides a kind of computer storage medium, is stored thereon with computer program, the computer
Faulty equipment recognition methods of the step S1-A into step S1-F is realized when program is executed by processor.Computer of the invention is deposited
Storage media, which can be embedded in, to be installed in the defect detecting system and the angle detection device, has direction characteristic to obtain
Defect wafer angle value and the angle value of wafer that comes out of wafer exit from the process equipment.Meter of the invention
When computer program in calculation machine storage medium is executed by processor, the multiple wafer can be set from each processing of experience
It is standby out when angle value carry out automatic block encoding, and by the result of the automatic block encoding and described can have directionality
The block encoding result of the angle value of the wafer of the defect of feature is compared, to realize the quickly and effectively knowledge to faulty equipment
Not.
One embodiment of the invention provides a kind of faulty equipment identifying system, is one embodiment of the invention refering to Fig. 7, Fig. 7
The system block diagram of faulty equipment identifying system, the faulty equipment identifying system 1 include that the coding of first detection unit 11, first is single
Member 12, second detection unit 13, the second coding unit 14 and comparing unit 15.
First detection unit 11 is used to corresponding defect detecting system 2 establish connection, with from the defect detecting system 2
Multiple wafers with direction characteristic defect are obtained in the wafer 3 of detection, and then obtain each crystalline substance in the multiple wafer
The angle value of direction characteristic defect on circle, the angle value are defined as first angle value, the range of the first angle value
It is 0 °~360 °.The first detection unit 11 is also used to set the angle at the V slot of each wafer in the multiple wafer
It is zero, using direction of rotation counterclockwise as positive direction, calculates the relatively described crystalline substance of direction characteristic defect on each wafer
The angle value of round V slot, using as the corresponding first angle value of the wafer.
The first angle value that first coding unit 12 is used to be obtained according to the first detection unit 11 is to institute
It states multiple wafers and carries out first time grouping, and obtain the first group coding.First time grouping in first coding unit 12
Principle be to be grouped into the same group the wafer of the first angle value having the same in the multiple wafer, wherein described first
First time grouping in coding unit 12 can be grouping manually to improve grouping accuracy, but first coding unit
12 can be by the way of autocoding when being encoded.First group coding using each grouping packet number with it is described
The combined mode of the number of each wafer in grouping.In other embodiments of the invention, in first coding unit 12
First time grouping or automatic grouping, to improve grouping speed.
Second detection unit 13 is used to establish with each wafer in the multiple wafer from each process equipment 4 of experience
Connection, to obtain angle value when each wafer in the multiple wafer comes out from each process equipment 4 of experience, and by institute
It states angle value and is defined as second angle value.The second detection unit 13 is to be mounted on the wafer of each process equipment 4 to go out
Angle detection device at mouthful, the angle for being configured as defining when each wafer enters the process equipment 4 at V slot is zero, and
When detecting to enter relatively from the V slot of the wafer when each wafer comes out from the wafer exit of the process equipment 4
Angle value, using as the corresponding second angle value of the wafer.The angle detection device is mainly made of 360 ° of aperture,
The range of the angle value is 0 °~360 °.
The second angle value that second coding unit 14 is used to be obtained according to the second detection unit 13 is to described more
A wafer carries out second and is grouped, to obtain the second group coding.The original of second of grouping in second coding unit 14
It is then to be grouped into the same group the wafer of the second angle value having the same in the multiple wafer, it is described to be grouped into for the second time
Automatic grouping, the second group coding are combined using the packet number of each grouping with the number of each wafer in the grouping
Mode.
First group coding and described second that comparing unit 15 is used to obtain first coding unit 12 is compiled
Second group coding that code unit 14 obtains is compared, from all process equipments 4 that the multiple wafer is undergone
Identify out of order process equipment.When some described first group encodes identical with the coding of the second group described in some,
Second group encodes the process equipment that corresponding process equipment 4 is failure.
In conclusion faulty equipment identifying system provided by the invention includes for obtaining the spy of the directionality on each wafer
Levy the first detection unit of the angle value of defect, for being divided the wafer of the angle value with the direction characteristic defect
First coding unit of group, the second detection for obtaining angle value when each wafer comes out from each process equipment of experience
The second coding unit and be used for that the wafer of angle value when unit, each process equipment for will test come out is grouped
The comparing unit that the coding that first coding unit and second coding unit obtain is compared.It mentions through the invention
The faulty equipment identifying system of confession can be realized the quickly and effectively identification to faulty equipment.
Foregoing description is only the description to present pre-ferred embodiments, not to any restriction of the scope of the invention, this hair
Any change, the modification that the those of ordinary skill in bright field does according to the disclosure above content, belong to the protection of claims
Range.
Claims (15)
1. a kind of faulty equipment recognition methods characterized by comprising
The angle value for obtaining the direction characteristic defect on multiple wafers, is defined as first angle value；
First time grouping is carried out to the multiple wafer according to each first angle value, to obtain the first group coding；
Angle value when each wafer in the multiple wafer comes out from each process equipment of experience is obtained, is defined as second
Angle value；
It carries out second to the multiple wafer according to each second angle value to be grouped, to obtain the second group coding；With
And
By first group coding and second group coding be compared, with undergo from the multiple wafer it is all add
Out of order process equipment is identified in construction equipment.
2. faulty equipment recognition methods as described in claim 1, which is characterized in that the step of obtaining first angle value packet
It includes:
Defects detection is carried out to each wafer, to detect the multiple wafer with direction characteristic defect；And
The angle at the V slot of each wafer in the multiple wafer is set as zero, using direction of rotation counterclockwise as positive direction, meter
The angle value for calculating the V slot of the relatively described wafer of direction characteristic defect on each wafer, using as the wafer pair
The first angle value answered.
3. faulty equipment recognition methods as described in claim 1, which is characterized in that the step of obtaining second angle value packet
It includes:
Angle detection device is set in the wafer exit of each process equipment, and defines each wafer into the process equipment
When V slot at angle be zero；And
It is come out by the angle detection device detection on each process equipment from the wafer exit of the process equipment
Angle value when the relatively described wafer enters at the V slot of wafer, using as the corresponding second angle value of the wafer.
4. faulty equipment recognition methods as claimed in claim 3, which is characterized in that the angle detection device is mainly by 360 °
Aperture constitute.
5. faulty equipment recognition methods as described in claim 1, which is characterized in that the principle of the first time grouping is by institute
The wafer for stating the first angle value having the same in multiple wafers is grouped into the same group；The principle of second grouping be by
The wafer of the second angle value having the same is grouped into the same group in the multiple wafer.
6. faulty equipment recognition methods as claimed in claim 5, which is characterized in that the first time is grouped into manual grouping,
It is described to be grouped into automatic grouping for the second time.
7. such as faulty equipment recognition methods described in any one of claims 1 to 6, which is characterized in that first group compiles
Code and second group coding are all made of what the packet number of each grouping was combined with the number of each wafer in the grouping
Mode, when some described first group encodes identical with the coding of the second group described in some, the second group coding
Corresponding process equipment is the process equipment of failure.
8. a kind of computer storage medium, is stored thereon with computer program, which is characterized in that the computer program is processed
Device realizes faulty equipment recognition methods described in any one of claims 1 to 7 when executing.
9. a kind of faulty equipment identifying system characterized by comprising
First detection unit, for establishing connection with corresponding defect detecting system, with what is detected from the defect detecting system
Multiple wafers with direction characteristic defect are obtained in wafer, and then obtain the side on each wafer in the multiple wafer
The angle value of tropism characteristics defect, the angle value are defined as first angle value；
First coding unit, the first angle value for being obtained according to the first detection unit to the multiple wafer into
Row is grouped for the first time, and obtains the first group coding；
Second detection unit, for establishing connection from each process equipment of experience with each wafer in the multiple wafer,
To obtain angle value when each wafer in the multiple wafer comes out from each process equipment of experience, and by the angle
Value is defined as second angle value；
Second coding unit, the second angle value for being obtained according to the second detection unit to the multiple wafer into
Second of grouping of row, to obtain the second group coding；And
Comparing unit, first group coding and second coding unit for obtaining first coding unit obtain
To second group coding be compared, it is out of order to be identified from all process equipments that the multiple wafer is undergone
Process equipment.
10. faulty equipment identifying system as claimed in claim 9, which is characterized in that the first detection unit be also used to by
Angle at the V slot of each wafer in the multiple wafer is set as zero, using direction of rotation counterclockwise as positive direction, calculates every
The angle value of the V slot of the relatively described wafer of direction characteristic defect on a wafer, using as the wafer corresponding
One angle value.
11. faulty equipment identifying system as claimed in claim 10, which is characterized in that the second detection unit is to be mounted on
The angle detection device in the wafer exit of each process equipment, is configured as defining each wafer and enters the processing and set
Angle when standby at V slot is zero, and described in detecting when each wafer comes out from the wafer exit of the process equipment
With respect to angle value when entering at the V slot of wafer, using as the corresponding second angle value of the wafer.
12. faulty equipment identifying system as claimed in claim 10, which is characterized in that the angle detection device mainly by
360 ° of aperture is constituted.
13. faulty equipment identifying system as claimed in claim 12, which is characterized in that first in first coding unit
The principle of secondary grouping is to be grouped into the same group the wafer of the first angle value having the same in the multiple wafer；Described
The principle of second of grouping in two coding units is by the crystalline substance of the second angle value having the same in the multiple wafer
Circle is grouped into the same group.
14. faulty equipment identifying system as claimed in claim 12, which is characterized in that the first time is grouped into divides manually
Group, it is described to be grouped into automatic grouping for the second time.
15. the faulty equipment identifying system as described in any one of claim 9 to 14, which is characterized in that first group
The packet number that coding and second group coding are all made of each grouping is combined with the number of each wafer in the grouping
Mode, when some described first group coding is identical with the coding of the second group described in some, the second group volume
The corresponding process equipment of code is the process equipment of failure.
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