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CN109246928A - The production technology of the flexible wires wiring board of new-energy automobile - Google Patents

The production technology of the flexible wires wiring board of new-energy automobile Download PDF

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Publication number
CN109246928A
CN109246928A CN201811128079.0A CN201811128079A CN109246928A CN 109246928 A CN109246928 A CN 109246928A CN 201811128079 A CN201811128079 A CN 201811128079A CN 109246928 A CN109246928 A CN 109246928A
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CN
China
Prior art keywords
substrate
temperature
treated
finished product
semi
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201811128079.0A
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Chinese (zh)
Inventor
侯晓明
徐建华
侯燕芬
张素安
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou Wujin Three-Dimensional Electronics Co Ltd
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Changzhou Wujin Three-Dimensional Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by Changzhou Wujin Three-Dimensional Electronics Co Ltd filed Critical Changzhou Wujin Three-Dimensional Electronics Co Ltd
Priority to CN201811128079.0A priority Critical patent/CN109246928A/en
Publication of CN109246928A publication Critical patent/CN109246928A/en
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0326—Organic insulating material consisting of one material containing O
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/032—Organic insulating material consisting of one material
    • H05K1/0346—Organic insulating material consisting of one material containing N
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0047—Drilling of holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention belongs to flexible circuit board fields, and in particular to the production technology of the flexible wires wiring board of new-energy automobile, comprising the following steps: 1) substrate is stocked up: be cut using laser cutting device by layout after substrate detection is qualified；2) cover film forms；3) dry film is pasted；4) it exposes；5) develop:, into development treatment is carried out, controlling 30-45 DEG C of temperature, transmission speed 1.3-1.8m/min in development to through step 4) treated substrate blank；6) etch: to through step 5), treated that substrate blank is etched, 45-52 DEG C of temperature of control, sprays 1.8-1.5kg/cm at transmission speed 1.4-1.8m/min2；7) striping is dried；8) AOI is detected；9) epiphragma is pasted；10) it is laminated；11) lettering accords with；12) electrical measurement；13) anti-oxidation processing；14) it is punched；15) it examines, pack；High production efficiency, the control parameter fitness between process is high, improves final product quality, and flexible circuit board is made to have preferable quality.

Description

The production technology of the flexible wires wiring board of new-energy automobile
Technical field
The invention belongs to flexible circuit board fields, and in particular to the production technology of the flexible wires wiring board of new-energy automobile.
Background technique
Flexible circuit board (FlexiblePrintedCircuit, abbreviation FPC) is the print made of insulating substrate flexible Brush circuit has the advantages that many rigid printed circuit boards do not have.Such as it can be with free bend, winding, folding, it can be according to Space layout requires any arrangement, and arbitrarily moves and flexible in three-dimensional space, connects to reach components and parts assembling with conducting wire Integration.It can be substantially reduced the volume of electronics FPC using FPC, be applicable in electronics FPC to high density, miniaturization, highly reliable direction The needs of development are widely used, especially in new-energy automobile field in many fields.
The shape of the flexible circuit board used on new-energy automobile needs to carry out cooperation according to specific body construction and sets Meter, currently, generally being cut using die cutting device in the production of flexible circuit board, production efficiency is low, and needs according to flexibility The shape of wiring board manufactures and designs punching cutter, high production cost.Moreover, the ginseng in existing production technology, between various processes Number control is unreasonable, and mutual conformability is poor, causes to reduce flexible circuit board quality after molding.
Summary of the invention
The technical problem to be solved by the present invention is in view of the foregoing drawbacks, provide the flexible wires wiring board of new-energy automobile Production technology, high production efficiency, the control parameter fitness between process is high, improves final product quality, has flexible circuit board Preferable quality.
The technical solution adopted by the present invention to solve the technical problems is as follows:
The production technology of the flexible wires wiring board of new-energy automobile, comprising the following steps:
1) substrate is stocked up: peel strength after the thickness of substrate, hot pressing is selected in detection, uses laser after substrate detection is qualified Cutting equipment is cut by layout, obtains substrate blank；
2) cover film forms: first forming location hole, is then punched into cover film by layout；
3) it pastes dry film: dry film being pasted using patch dry film equipment substrate blank surface obtained in step 1), pastes and is controlled in dry film Air pressure 0.4-0.5MPa processed, 115 ± 5 DEG C of temperature, transmission speed 2.5-3.5m/min；
4) it exposes: to through step 3), treated that substrate blank is exposed processing, 800 ± 100 millijoule of exposure energy；
5) develop:, into development treatment is carried out, controlling temperature 30-45 in development to through step 4) treated substrate blank DEG C, transmission speed 1.3-1.8m/min；
6) etch: controlled to through step 5), treated that substrate blank is etched, in etching 45-52 DEG C of temperature, Transmission speed 1.4-1.8m/min, 1.8-1.5kg/cm is sprayed2；
7) striping is dried: carrying out dry film removal, drying, drying temperature 80- to through step 6) treated substrate blank 90 DEG C, speed 1.6-2.2m/min；
8) AOI is detected, using AOI detection device to through step 7), treated that substrate blank detects；
9) epiphragma is pasted: by cover film hot pressure molding in step 2) in the table through the qualified substrate blank of step 8) detection Face, the temperature of hot pressure are 100-120 DEG C, obtain semi-finished product；
10) be laminated: using fast press to obtained in step 9) semi-finished product carry out lamination treatment, 155-165 DEG C of laminating temperature, Pressure 20-24KG/cm2, the time 400 seconds；
11) lettering accords with: in surface of semi-finished specified location print character, coating solder mask；
12) electrical measurement: using FPC special tester to treated that semi-finished product detect through step 11)；
13) anti-oxidation processing, anti-oxidation speed anti-oxidation processing: are carried out to the semi-finished product after step 12) detection is qualified Degree control is 1.2-2.0m/min；
14) it is punched: according to design requirement to treated that semi-finished product are punched out processing through step 13), obtaining specific ruler Very little, shape flexible circuitry board finished product；
15) it examines, pack: carrying out the inspection of plate face appearance, intensity to flexible circuit board board finished product obtained in step 14) It tests, is packed after the assay was approved.
The substrate includes the matrix of polyimides or polyester film, copper foil layer, and matrix, copper foil interlayer lead to glue-line and glue It connects, uniform disperse has graphene in glue-line.
The beneficial effects of the present invention are: using the above scheme, cutting in process using laser cutting machine, the efficiency of cutting Height improves production efficiency, and the control parameter between the processes such as exposure, development, etching cooperates, and improves flexible in this stage The Forming Quality of the corresponding process of wiring board cooperates between process, so that flexible circuit board after molding is had preferable quality, mentions High service performance has longer service life and inoxidizability etc..
Detailed description of the invention
Through the following detailed description taken in conjunction with the accompanying drawings, present invention objects, features and advantages above-mentioned and other will become Obviously.
Fig. 1 is a kind of cross section structure schematic diagram of embodiment of substrate in the present invention.
Wherein: 1 is matrix, and 2 be copper foil layer, and 3 be glue-line, and 4 be graphene powder.
Specific embodiment
The present invention will be further described with reference to the accompanying drawing.
Embodiment 1: the production technology of the flexible wires wiring board of new-energy automobile, comprising the following steps:
1) substrate is stocked up: after detecting the thickness for selecting substrate, hot pressing by equipment such as micrometer, press, peel test machines Peel strength, whether detection substrate is up to standard, and the substrate for detecting qualification is spare, using the laser cutting machine base qualified to monitoring Material is cut, and is cut according to layout, and substrate blank is obtained, and the cutting efficiency of laser cutting machine is high, improves production Efficiency detects substrate, it is ensured that the quality of substrate ensures the quality of flexible circuit board from the first step of production, to improve The final product quality of flexible circuit board, the substrate of selection include the matrix 1 of polyimides or polyester film, copper foil layer 2, matrix 1, copper Lead to glue-line 3 between layers of foil 2 to be bonded, uniform disperse has graphene powder 4 in glue-line 3, by graphene during preparing bonding It is stirred in powder incorporation glue, makes the sufficient disperse of graphene powder in glue-line, the graphene powder in glue-line improves glue-line Thermal conductivity, improve heat conduction velocity, accelerate the radiating rate of flexible circuit board, make the flexible circuitry of this new-energy automobile Plate radiating efficiency with higher improves use effect of flexible circuit board；
2) cover film forms: forming location hole using numerical control drilling machine line, the shaping efficiency of numerical control drilling machine is high, then using punching Bed is first punched into cover film by layout；
3) it pastes dry film: dry film being pasted using patch dry film equipment substrate blank surface obtained in step 1), pastes and is controlled in dry film Air pressure 0.4MPa processed, 115 DEG C of temperature, transmission speed 2.5-3.5m/min, the speed of transmission are matched with air pressure, proper temperature, are promoted Make the high-efficient of pad pasting, greatly reduce the probability for bubble, leakage copper, fold occur, patch dry film quality is high, promotes to improve flexible The final product quality of wiring board；
4) it exposes: using exposure machine to through step 3) treated substrate blank is exposed processing, exposure energy 800 ± 100 millijoules；
5) develop: to through step 4) treated substrate blank, into development treatment is carried out, temperature 45 C is controlled in development, is passed Speed 1.3m/min is sent, the temperature of development phase is reasonable with speeds match, improves the quality of development, fixing efficiency is improved, in addition, Development temperature control rationally, for the processing of next process lays preferable basis, promotes the processing effect for improving next process Rate, Forming Quality；
6) it etches: controlling temperature 45 C, transmission to treated that substrate blank is etched through step 5), in etching Speed 1.4m/min, 1.8-1.5kg/cm is sprayed2, keep balancing speed relatively steady in a upper procedure in temperature, greatly The quality of etching is improved, two procedures cooperate, greatly avoid etching transition, etching not clean and so on, really Guarantor's line-spacing, line width meet the requirements, and the state modulator between process cooperates, and achieve the purpose that improve quality, a upper procedure State modulator lays a solid foundation for next process under the premise of guaranteeing processing quality, greatly improves flexible wires The whole production efficiency of road plate and the quality of finished product；
7) striping is dried: carrying out dry film removal, drying to through step 6) treated substrate blank using striping dryer Processing, drying temperature are 90 DEG C, speed 1.6m/min, and the temperature of striping drying is twice of previous procedure, dry film removal Thoroughly, noresidue, drying efficiency is high, and speed further increases, and accelerates speed of production, according to process, speed is stepped up, to reach To the purpose for improving production efficiency；
8) AOI is detected, using AOI detection device to through step 7), treated that substrate blank detects, the procedure Effectively ensure wiring board without open circuit, short circuit phenomenon, no residual copper lacks copper, is not clean without striping, improves yield rate；
9) epiphragma is pasted: using electric iron by cover film hot pressure molding in step 2) in the base qualified through step 8) detection The surface of material blank, the temperature of hot pressure are 120 DEG C, obtain semi-finished product；
10) it is laminated: lamination treatment, 155 DEG C of laminating temperature, pressure is carried out to semi-finished product are obtained in step 9) using fast press 20-24KG/cm2, the time 400 seconds, fast to press temperature high, pressure value is big, it is ensured that flexible circuit board is without layering, bubble-free；
11) lettering accords with: using screen printer in surface of semi-finished specified location print character, coating solder mask, printing Speed 1m/min, 150 DEG C of baking temperature, baking time 30 minutes, it is ensured that effective attachment of solder mask；
12) electrical measurement: using FPC special tester to through step 11), treated that semi-finished product detect, detection molding matter Amount, improves the qualification rate of finished product；
13) anti-oxidation processing, anti-oxidation speed anti-oxidation processing: are carried out to the semi-finished product after step 12) detection is qualified Degree control is 1.2m/min, and antioxidant sprays control in 0.5-1.5kg/cm2, anti-oxidation 30-40 DEG C of the control of area's temperature, remove 20-35 DEG C of oil temperature, 30-40 DEG C of microetch temperature,
14) it is punched: using automatic aligning punching machine according to design requirement to through step 13), treated that semi-finished product rush Processing is cut, the flexible circuitry board finished product of specific dimensions, shape is obtained, carries out patch after punching；
15) it examines, pack: carrying out the inspection of plate face appearance, intensity to flexible circuit board board finished product obtained in step 14) It tests, is packed after the assay was approved.
Embodiment 2: the production technology of the flexible wires wiring board of new-energy automobile, comprising the following steps:
1) substrate is stocked up: after detecting the thickness for selecting substrate, hot pressing by equipment such as micrometer, press, peel test machines Peel strength, whether detection substrate is up to standard, and the substrate for detecting qualification is spare, using the laser cutting machine base qualified to monitoring Material is cut, and is cut according to layout, and substrate blank is obtained, and the cutting efficiency of laser cutting machine is high, improves production Efficiency detects substrate, it is ensured that the quality of substrate ensures the quality of flexible circuit board from the first step of production, to improve The final product quality of flexible circuit board, the substrate selected in this implementation include the matrix 1 of polyimides or polyester film, copper foil layer 2, Lead to glue-line 3 between matrix 1, copper foil layer 2 to be bonded, uniform disperse has graphene powder 4 in glue-line 3, during preparing bonding Graphene powder is mixed in glue and is stirred, makes the sufficient disperse of graphene powder in glue-line, the graphene powder in glue-line mentions The high thermal conductivity of glue-line, improves heat conduction velocity, accelerates the radiating rate of flexible circuit board, make this new-energy automobile Flexible circuit board radiating efficiency with higher improves use effect of flexible circuit board；
2) cover film forms: the shape for being cut by laser machining location hole and cover film is used, laser cutting Production efficiency that is high-efficient, greatly improving；
3) it pastes dry film: dry film being pasted using patch dry film equipment substrate blank surface obtained in step 1), pastes and is controlled in dry film Air pressure 0.5MPa processed, 120 DEG C of temperature, transmission speed 3.5m/min, speed is fast, and pad pasting is efficient, and pad pasting temperature is relatively high, transmission Speed matched with temperature, air pressure, effective to guarantee pad pasting quality, while keeping pad pasting high-efficient, the control parameter of this process is set The probability for rationally greatly reducing and bubble, leakage copper, fold occur is set, patch dry film quality is high, promotes to improve flexible circuit board Final product quality；
4) it exposes: using exposure machine to through step 3) treated substrate blank is exposed processing, exposure energy 800 ± 100 millijoules；
5) develop: to through step 4) treated substrate blank, into development treatment is carried out, 30 DEG C of temperature is controlled in development, is passed Send speed 1.8m/min；
6) it etches: controlling 52 DEG C of temperature, transmission to treated that substrate blank is etched through step 5), in etching Speed 1.8m/min, 1.8-1.5kg/cm is sprayed2, remained unchanged compared to the temperature raising of previous procedure, speed, two procedures It cooperates, greatly avoid etching transition, etching not clean and so on, it is ensured that line-spacing, line width meet the requirements, between process State modulator cooperate, achieve the purpose that improve quality, the state modulator of a upper procedure is before guaranteeing processing quality It puts, lays a solid foundation for next process, greatly improve the whole production efficiency and finished product of flexible circuit board Quality；
7) striping is dried: carrying out dry film removal, drying to through step 6) treated substrate blank using striping dryer Processing, drying temperature are 80 DEG C, speed 2.2m/min, and the temperature of striping drying is to improve, while speed is accelerated, dry film removal Thoroughly, noresidue, drying efficiency is high, accelerates speed of production, according to process, speed is stepped up, to reach raising production efficiency Purpose；
8) AOI is detected, using AOI detection device to through step 7), treated that substrate blank detects, the procedure Effectively ensure wiring board without open circuit, short circuit phenomenon, no residual copper lacks copper, is not clean without striping, improves yield rate；
9) epiphragma is pasted: using electric iron by cover film hot pressure molding in step 2) in the base qualified through step 8) detection The surface of material blank, the temperature of hot pressure are 120 DEG C, obtain semi-finished product；
10) it is laminated: lamination treatment, 165 DEG C of laminating temperature, pressure is carried out to semi-finished product are obtained in step 9) using fast press 20-24KG/cm2, the time 400 seconds, fast to press temperature high, pressure value is big, it is ensured that flexible circuit board is without layering, bubble-free；
11) lettering accords with: using screen printer in surface of semi-finished specified location print character, coating solder mask, printing Speed 1m/min, 150 DEG C of baking temperature, baking time 30 minutes, it is ensured that effective attachment of solder mask；
12) electrical measurement: using FPC special tester to through step 11), treated that semi-finished product detect, detection molding matter Amount, improves the qualification rate of finished product；
13) anti-oxidation processing, anti-oxidation speed anti-oxidation processing: are carried out to the semi-finished product after step 12) detection is qualified Degree control is 20m/min, and antioxidant sprays control in 0.5-1.5kg/cm2, anti-oxidation 30-40 DEG C of the control of area's temperature, remove 20-35 DEG C of oil temperature, 30-40 DEG C of microetch temperature,
14) it is punched: using laser cutting machine according to design requirement to through step 13), treated that semi-finished product carry out molding sanction Processing is cut, the flexible circuitry board finished product of specific dimensions, shape is obtained, patch is carried out after punching, the process that cuts in molding makes With laser cutting machine, what is cut is high-efficient, and guarantees that the dimensional accuracy of product is consistent, and production is efficient；
15) it examines, pack: carrying out the inspection of plate face appearance, intensity to flexible circuit board board finished product obtained in step 14) It tests, is packed after the assay was approved.
The above is only presently preferred embodiments of the present invention, not does limitation in any form to the present invention, it is all according to According to any simple modification to the above embodiments in technical spirit of the invention, equivalent variations, guarantor of the invention is each fallen within Within the scope of shield.

Claims (2)

1. the production technology of the flexible wires wiring board of new-energy automobile, which comprises the following steps:
1) substrate is stocked up: peel strength after the thickness of substrate, hot pressing is selected in detection, using laser cutting after substrate detection is qualified Equipment is cut by layout, obtains substrate blank；
2) cover film forms: first forming location hole, then cuts out cover film by layout；
3) it pastes dry film: dry film being pasted using patch dry film equipment substrate blank surface obtained in step 1), pastes in dry film and controls gas Press 0.4-0.5MPa, 115 ± 5 DEG C of temperature, transmission speed 2.5-3.5m/min；
4) it exposes: to through step 3), treated that substrate blank is exposed processing, 800 ± 100 millijoule of exposure energy；
5) develop: to through step 4) treated substrate blank, into development treatment is carried out, 30-45 DEG C of temperature is controlled in development, is passed Send speed 1.3-1.8m/min；
6) it etches: controlling 45-52 DEG C of temperature, transmission to treated that substrate blank is etched through step 5), in etching Speed 1.4-1.8m/min, 1.8-1.5kg/cm is sprayed2；
7) striping is dried: dry film removal, drying are carried out to through step 6) treated substrate blank, drying temperature is 80-90 DEG C, Speed 1.6-2.2m/min；
8) AOI is detected, using AOI detection device to through step 7), treated that substrate blank detects；
9) epiphragma is pasted: by cover film hot pressure molding in step 2) on the surface through the qualified substrate blank of step 8) detection, The temperature of hot pressure is 100-120 DEG C, obtains semi-finished product；
10) it is laminated: lamination treatment, 155-165 DEG C of laminating temperature, pressure is carried out to semi-finished product are obtained in step 9) using fast press 20-24KG/cm2, the time 400 seconds；
11) lettering accords with: in surface of semi-finished specified location print character, coating solder mask；
12) electrical measurement: using FPC special tester to treated that semi-finished product detect through step 11)；
13) anti-oxidation processing, anti-oxidation speed control anti-oxidation processing: are carried out to the semi-finished product after step 12) detection is qualified 1.2-2.0m/min is made as,
14) it is punched: according to design requirement to treated that semi-finished product are punched out processing through step 13), obtaining specific dimensions, shape The flexible circuitry board finished product of shape；
15) it examines, pack: carrying out the inspection of plate face appearance, intensity, inspection to flexible circuit board board finished product obtained in step 14) It is packed after testing qualification.
2. the production technology of the flexible wires wiring board of new-energy automobile according to claim 1, which is characterized in that described Substrate includes the matrix of polyimides or polyester film, copper foil layer, and matrix, copper foil interlayer lead to glue-line and be bonded, uniform in glue-line Disperse has graphene.
CN201811128079.0A 2018-09-27 2018-09-27 The production technology of the flexible wires wiring board of new-energy automobile Pending CN109246928A (en)

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Cited By (3)

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CN113825313A (en) * 2021-09-28 2021-12-21 东莞市溢信高电子科技有限公司 Manufacturing method of wear-resistant flexible circuit board for 3D rocker
CN114786352A (en) * 2022-03-16 2022-07-22 珠海中京元盛电子科技有限公司 Manufacturing method of anti-warping circuit board
CN115527867A (en) * 2022-11-24 2022-12-27 宁波德洲精密电子有限公司 Anti-layering process for lead frame packaging

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CN113825313A (en) * 2021-09-28 2021-12-21 东莞市溢信高电子科技有限公司 Manufacturing method of wear-resistant flexible circuit board for 3D rocker
CN113825313B (en) * 2021-09-28 2023-11-03 东莞市溢信高电子科技有限公司 Manufacturing method of wear-resistant flexible circuit board for 3D rocker
CN114786352A (en) * 2022-03-16 2022-07-22 珠海中京元盛电子科技有限公司 Manufacturing method of anti-warping circuit board
CN114786352B (en) * 2022-03-16 2023-08-29 珠海中京元盛电子科技有限公司 Manufacturing method of anti-warping circuit board
CN115527867A (en) * 2022-11-24 2022-12-27 宁波德洲精密电子有限公司 Anti-layering process for lead frame packaging
CN115527867B (en) * 2022-11-24 2023-03-17 宁波德洲精密电子有限公司 Anti-layering preparation method for lead frame packaging

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