CN109244615B - Capacitive coupling device and filter - Google Patents
Capacitive coupling device and filter Download PDFInfo
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- CN109244615B CN109244615B CN201811036762.1A CN201811036762A CN109244615B CN 109244615 B CN109244615 B CN 109244615B CN 201811036762 A CN201811036762 A CN 201811036762A CN 109244615 B CN109244615 B CN 109244615B
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- blind hole
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- 230000008878 coupling Effects 0.000 title claims abstract description 101
- 238000010168 coupling process Methods 0.000 title claims abstract description 101
- 238000005859 coupling reaction Methods 0.000 title claims abstract description 101
- 239000000178 monomer Substances 0.000 claims abstract description 99
- 239000002184 metal Substances 0.000 claims abstract description 15
- 239000007787 solid Substances 0.000 claims abstract description 5
- 238000005245 sintering Methods 0.000 claims description 5
- 238000003466 welding Methods 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 abstract description 12
- 238000006880 cross-coupling reaction Methods 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 230000001939 inductive effect Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
- H01P1/00—Auxiliary devices
- H01P1/20—Frequency-selective devices, e.g. filters
- H01P1/207—Hollow waveguide filters
- H01P1/208—Cascaded cavities; Cascaded resonators inside a hollow waveguide structure
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- Control Of Motors That Do Not Use Commutators (AREA)
Abstract
The invention discloses a capacitive coupling device and a filter. The novel metal shielding structure comprises a plurality of solid medium monomers, wherein adjacent medium monomers are spliced and connected, a capacitive coupling structure is arranged on a splicing surface of at least one adjacent medium monomer, the capacitive coupling structure comprises a first blind hole and a first air coupling window with an unmetallized surface, the depth of the first blind hole is greater than or equal to 1/2 of the depth of the first air coupling window and less than the depth of the first air coupling window, a metal shielding layer is arranged on the inner wall of the first blind hole, and the first air coupling window is arranged on two sides and the bottom of the first blind hole. The invention has the advantages that the multiple medium monomers are spliced and connected, the blind holes and the air coupling windows are arranged on the splicing surfaces to realize the coupling between the two cavities, the structure is used in the filter, the transmission zero point can be formed at the lower end of the passband of the filter, the rectangular coefficient of the filter is increased, the filter performance is improved, and the volume of the filter is reduced.
Description
Technical Field
The invention belongs to the technical field of communication, and particularly relates to a capacitive coupling device and a filter.
Background
In the field of mobile communication, with the development of technology, the performance requirements for filters in a system are higher and higher. With the improvement of requirements, the high-power microwave filter at the base station end has the characteristics of high index, small volume and low cost. In implementing these high performance filters, the filters need to be implemented using new materials or techniques, limited by the cavity dimensions.
Limited by the material properties of the dielectric filter, it is generally necessary to incorporate transmission zeroes when designing the filter. And dielectric filters are more difficult to implement than metal filters when capacitive cross-coupling is implemented. In the existing design, patent number 201310688407.3 discloses three possible schemes, one of which is a scheme for realizing capacitive cross coupling for a zero-cavity design; secondly, a scheme of adopting two cavities to carry out 180-degree phase inversion to realize capacitive cross coupling is adopted; thirdly, holes are punched on the medium coupling window (no electromagnetic shielding layer is arranged in the holes), the screw is deep into the holes within about 2mm from the hole bottom, and then the holes are fixed in a cover plate or screw sleeve mode, so that the scheme of capacitive cross coupling is realized. For the first scheme and the second scheme, the capacitive coupling device occupies more space of one cavity in the horizontal direction when realizing one capacitive cross coupling; for the third scheme, in order to invert the polarity, a screw sleeve or a cover plate needs to be added, and a height space needs to be added in the vertical direction, so that the design of a dielectric filter with a severe space is not facilitated, and therefore, the prior art needs to be improved.
Disclosure of Invention
The invention aims to solve the defects in the prior art and provides the capacitive coupling device and the filter which have simple structure, small volume and good performance.
The technical scheme adopted by the invention is as follows: the utility model provides a capacitive coupling device, includes a plurality of solid medium monomer, splice connection between the adjacent medium monomer, be provided with capacitive coupling structure on the free concatenation face of at least one adjacent medium, capacitive coupling structure includes first blind hole and the first air coupling window that the surface is not metallized, one side of the free concatenation face of adjacent medium is equipped with assorted half recess along vertical corresponding position department, forms after two assorted half recess concatenation first blind hole, the degree of depth of first blind hole is greater than or equal to 1/2 of air coupling window degree of depth and is less than first air coupling window degree of depth, be provided with the metal shielding layer on the inner wall and the bottom of first blind hole, first air coupling window sets up in the both sides and the bottom of first blind hole.
Further, a second air coupling window with an unmetallized surface is arranged on the splicing surface of at least one adjacent medium monomer.
Further, the media monomer includes one or more media single cavities.
Further, adjacent medium single cavities in the medium monomers are coupled through a medium coupling window arranged at the joint.
Further, a second blind hole for tuning frequency is vertically arranged in the medium single cavity, and a metal shielding layer is arranged on the inner wall and the bottom of the second blind hole.
Further, the splicing surfaces of the plurality of medium monomers are connected through bonding or welding and sintering.
Further, when the plurality of medium monomers are horizontally arranged, the plurality of medium monomers are distributed in a delta shape or a field shape or a linear shape; when the plurality of medium monomers are vertically arranged (namely, the arrangement of an upper layer and a lower layer), the plurality of medium monomers are distributed in a two-character shape.
Further, the first blind hole is cylindrical or polygonal.
Still further, another bottom surface perpendicular to the splicing surface of the adjacent medium monomers is provided with a third blind hole, the third blind hole and the first blind hole are arranged along the same axial direction, the inner wall and the bottom of the third blind hole are provided with metal shielding layers, and the third blind hole can be the whole blind hole of a single medium monomer or two medium monomers are respectively formed by matching with one half blind hole.
A dielectric filter comprising at least one capacitive coupling device as any one of the above.
The invention has the advantages of simple structure, reasonable design, small deformation of the medium before and after sintering, convenient production and debugging, realization of coupling between two cavities by arranging blind holes and air coupling windows with non-metallized surfaces on the splicing surfaces of the medium monomers, realization of coupling polarity inversion from inductance to capacitance by setting the depth of the blind holes to be more than 1/2 of the depth of the coupling windows (or the depth of the cavities), realization of capacitive coupling between medium filters, and realization of transmission zero point at the lower end of a passband of the filter.
Drawings
Fig. 1 is a schematic perspective view of embodiment 1 of the present invention.
Fig. 2 is a schematic perspective view of another side of embodiment 1 of the present invention.
Fig. 3 is a perspective view of embodiment 1 of the present invention.
Fig. 4 is a schematic plan perspective view of embodiment 1 of the present invention.
Fig. 5 is a schematic perspective view of embodiment 2 of the present invention.
Fig. 6 is a schematic perspective view of another side of embodiment 2 of the present invention.
Fig. 7 is a perspective view of embodiment 2 of the present invention.
Fig. 8 is a schematic plan view of embodiment 2 of the present invention.
Fig. 9 is a schematic perspective view of embodiment 3 of the present invention.
Fig. 10 is a schematic perspective view of another side of embodiment 3 of the present invention.
Fig. 11 is a perspective view of embodiment 3 of the present invention.
Fig. 12 is a schematic plan view of embodiment 3 of the present invention.
Fig. 13 is a schematic perspective view of embodiment 4 of the present invention.
Fig. 14 is a schematic view showing another perspective structure of embodiment 4 of the present invention.
Fig. 15 is a perspective view of embodiment 4 of the present invention.
Fig. 16 is a schematic plan view of embodiment 4 of the present invention.
Fig. 17 is a schematic perspective view of embodiment 5 of the present invention.
Fig. 18 is a schematic view showing another perspective structure of embodiment 5 of the present invention.
Fig. 19 is a perspective view of embodiment 5 of the present invention.
Fig. 20 is a schematic plan view of embodiment 5 of the present invention.
Fig. 21 is a three-dimensional electromagnetic simulation S-parameter curve corresponding to embodiment 1 of the present invention.
Fig. 22 is a three-dimensional electromagnetic simulation S-parameter curve corresponding to embodiment 4 of the present invention.
In the figure: 1-a first medium monomer; 2-a second medium monomer; 3-a third medium monomer; 4-signal input/output connectors; 5-a first blind hole; 6-a first air coupling window; 7-a second air coupling window; 8-15-medium single cavity; 16-a main coupling channel; 17-a second blind hole; 18-a third blind hole; 19-dielectric coupling window.
Detailed Description
The invention will now be described in further detail with reference to the drawings and specific examples, which are given for clarity of understanding and are not to be construed as limiting the invention.
The invention comprises a plurality of medium monomers, each medium monomer can comprise one or a plurality of solid medium single cavities, the plurality of solid medium monomers are spliced and connected in a bonding or welding and sintering mode, a second air coupling window 7 with an unmetallized surface is arranged on the splicing surface of at least one adjacent medium monomer, a capacitive coupling structure is arranged on the splicing surface of at least one adjacent medium monomer, the capacitive coupling structure comprises a first blind hole 5 and a first air coupling window 6 with an unmetallized surface, a matched half groove is arranged at one side of the splicing surface of the adjacent medium monomer along the vertical corresponding position, the two matched half grooves are spliced to form the first blind hole 5, the depth of the first blind hole 5 is greater than or equal to 1/2 of the depth 6 of the air coupling window and is smaller than the depth of the first air coupling window 6, the depth of the first air coupling window 6 is smaller than the depth of the medium monomer, and the width and the depth of the specific air coupling window are determined according to actual needs. The inner wall and the bottom of the first blind hole 5 are provided with metal shielding layers, and the first air coupling windows 6 are arranged on the two sides and the bottom of the first blind hole 5. The first blind hole 5 is cylindrical or polygonal or other shape. The surface of the dielectric monomer is provided with a metal shielding layer except that the surface of the area between the first air coupling window and the second air coupling window and the input/output inner/outer conductors is not metallized, and the shielding layer is not shown in the figure.
In the above scheme, when the medium monomer comprises a plurality of medium single cavities, the adjacent medium single cavities are coupled through the medium coupling window 19 arranged at the joint.
The invention has the advantages of simple structure, reasonable design, small deformation of the medium before and after sintering, convenient production and debugging, and inductive coupling between the two cavities by arranging blind holes and air coupling windows with non-metallized surfaces on the splicing surfaces of the medium monomers. Inductive cross coupling becomes a transmission zero outside the passband Gao Duanxing, and the frequency of the zero is higher; when the depth of the blind hole is increased, the frequency is lowered until the frequency is shifted from the high end outside the passband to the position of the designated frequency at the low end, so that a transmission zero is formed at the low end outside the passband. Therefore, the blind hole depth is set to be more than 1/2 of the depth of the coupling window (or the depth of the cavity), the coupling polarity is turned from sensitivity to capacitance, and the capacitive coupling between the dielectric filters is realized.
The invention also provides a dielectric filter, which at least comprises the capacitive coupling device, wherein the two dielectric monomers are respectively provided with a signal input/output connector 4.
Example 1
As shown in fig. 1-4, the capacitive coupling device in this embodiment includes three dielectric monomers, namely, a first dielectric monomer 1, a second dielectric monomer 2 and a third dielectric monomer 3, where the three dielectric monomers are spliced and connected to form a linear structure, the first dielectric monomer 1 and the third dielectric monomer 3 include two dielectric single cavities, the second dielectric monomer 2 includes four dielectric single cavities, between the first dielectric monomer 1 and the dielectric single cavities 9 and 10 on the second dielectric monomer 2, between the dielectric single cavities 13 and 14 on the second dielectric monomer 2 and the third dielectric monomer 3 are all coupled through a second air coupling window 7 set on a splicing surface, the dielectric single cavities 8-15 on the three dielectric monomers form a main coupling channel 16, and between two non-adjacent dielectric single cavities (such as between the dielectric single cavities 8 and 11 and between the dielectric single cavities 12 and 15) in the main coupling channel form a capacitive coupling structure through a first blind hole 5 and a first air coupling window 6 set on the splicing surface, so as to generate two transmission zeros at a low end and a high end, respectively, as shown in fig. 21.
Example 2
As shown in fig. 5 to 8, the difference between the arrangement modes of three dielectric monomers in this embodiment and embodiment 1 is that the capacitive coupling device in this embodiment includes three dielectric monomers, which are respectively a first dielectric monomer 1, a second dielectric monomer 2 and a third dielectric monomer 3, and the three dielectric monomers are spliced and connected to form a finished product type structure, where the first dielectric monomer 1 and the third dielectric monomer 3 include two dielectric single cavities, the second dielectric monomer 2 includes three dielectric single cavities, the first dielectric monomer 1 and the dielectric single cavities on the second dielectric monomer 2, and the second dielectric single cavities on the second dielectric monomer 2 and the third dielectric monomer 3 are all coupled through a second air coupling window 7 disposed on a splicing surface, the dielectric single cavities 8 to 14 on the three dielectric monomers form a main coupling channel 16, and the non-adjacent two dielectric single cavities in the main coupling channel (such as between the dielectric single cavities 10 and 12) form capacitive coupling through a first blind hole 5 and the first air coupling window 6 disposed on the splicing surface, so as to generate a transmission zero at the low end, and the filter generates two transmission zero points at the high end.
Example 3
As shown in fig. 9-12, the capacitive coupling device in this embodiment includes eight dielectric monomers, where the eight dielectric monomers are connected in a spliced manner, and a field-shaped structure is formed between the adjacent four dielectric monomers, each of the eight dielectric monomers includes only one dielectric single cavity, the eight dielectric single cavities 8-15 are all coupled to form a main coupling channel 16 through a second air coupling window 7 disposed on a splicing surface, and capacitive coupling is formed between two non-adjacent dielectric single cavities (such as between dielectric single cavities 10 and 13) in the main coupling channel through a first blind hole 5 and a first air coupling window 6 disposed on the splicing surface, so that a transmission zero point is generated at each of a low end and a high end of the passband. The center of each medium single cavity is provided with a second blind hole 17 for tuning frequency, and the inner wall and the bottom of the second blind hole 17 are provided with metal shielding layers.
Example 4
As shown in fig. 13-16, the capacitive coupling device in this embodiment includes two dielectric monomers, which are a first dielectric monomer 1 and a second dielectric monomer 2, where the two dielectric monomers are spliced and connected to form a linear structure, the first dielectric monomer 1 and the second dielectric monomer 2 each include four dielectric single cavities, the first dielectric monomer 1 and the second dielectric single cavities on the second dielectric monomer 2 are coupled by a second air coupling window 7 disposed on a splicing surface, the dielectric single cavities 8-15 on the two dielectric monomers form a main coupling channel 16, and a first blind hole 5 and a first air coupling window 6 disposed on the splicing surface form capacitive coupling between two non-adjacent dielectric single cavities (such as between the dielectric single cavities 10 and 13) in the main coupling channel, so that a transmission zero point is generated at the low end and the high end of the passband, respectively, as shown in fig. 22. The center of each medium single cavity is provided with a second blind hole 17 for tuning frequency, and the inner wall and the bottom of the second blind hole 17 are provided with metal shielding layers.
Example 5
As shown in fig. 17-20, this embodiment includes three dielectric monomers, which are spliced to form a delta-shaped structure as in embodiment 1, except that the number of dielectric single cavities included in the three dielectric monomers is different, and the third blind holes 18 for reducing the frequency are added. In this embodiment, the first medium monomer 1 and the second medium monomer 2 include three medium single cavities, the third medium monomer 3 includes one medium single cavity, the first medium monomer 1 and the medium single cavity on the second medium monomer 2, and the second medium monomer 2 and the medium single cavity on the third medium monomer 3 are all coupled through the second air coupling window 7 arranged on the splicing surface, the medium single cavities 8-14 on the three medium monomers form a main coupling channel 16, and two non-adjacent medium single cavities (such as between the medium single cavities 12 and 14) in the main coupling channel form capacitive coupling through the first blind hole 5 and the first air coupling window 6 arranged on the splicing surface, so that a transmission zero is generated at the lower end of the passband, and the filter simultaneously generates two transmission zero at the upper end of the passband. The other bottom surface perpendicular to the splicing surface of the adjacent medium monomer provided with the first blind hole 5 is provided with a third blind hole 18, the third blind hole 18 and the first blind hole 5 are arranged along the same axial direction, the inner wall and the bottom of the third blind hole 18 are provided with metal shielding layers, and the third blind hole 18 can be an entire blind hole arranged on a single medium monomer or can be formed by matching two medium monomers with one half blind hole respectively.
The foregoing description of the preferred embodiments of the invention is not intended to limit the invention to the precise form disclosed, and any such modifications, equivalents, and alternatives falling within the spirit and scope of the invention are intended to be included within the scope of the invention. What is not described in detail in this specification is prior art known to those skilled in the art.
Claims (10)
1. A capacitive coupling device, characterized by: the device comprises a plurality of solid medium monomers, wherein adjacent medium monomers are spliced and connected, a capacitive coupling structure is arranged on a splicing surface of at least one adjacent medium monomer, the capacitive coupling structure comprises a first blind hole and a first air coupling window with an unmetallized surface, a matched half groove is arranged at one side of the splicing surface of the adjacent medium monomer along a vertical corresponding position, the two matched half grooves are spliced to form the first blind hole, the depth of the first blind hole is greater than or equal to 1/2 of the depth of the air coupling window and less than the depth of the first air coupling window, metal shielding layers are arranged on the inner wall and the bottom of the first blind hole, and the first air coupling window is arranged on two sides and the bottom of the first blind hole; and metal shielding layers are arranged on the surfaces of the medium monomers except the surfaces of the areas where the first air coupling window, the second air coupling window and the input/output inner and outer conductors are positioned.
2. The capacitive coupling device of claim 1, wherein: and a second air coupling window with an unmetallized surface is arranged on the splicing surface of at least one adjacent medium monomer.
3. The capacitive coupling device of claim 1, wherein: the media monomer includes one or more media single cavities.
4. A capacitive coupling device according to claim 3, characterized in that: and adjacent medium single cavities in the medium monomers are coupled through a medium coupling window arranged at the joint.
5. A capacitive coupling device according to claim 3, characterized in that: the medium single cavity is vertically provided with a second blind hole for tuning frequency, and the inner wall and the bottom of the second blind hole are provided with metal shielding layers.
6. The capacitive coupling device of claim 1, wherein: the splicing surfaces of the medium monomers are connected through bonding or welding and sintering.
7. The capacitive coupling device of claim 1, wherein: when the medium monomers are horizontally arranged, the medium monomers are distributed in a delta shape or a field shape or a linear shape; when the plurality of medium monomers are vertically arranged, the plurality of medium monomers are distributed in a two-character shape.
8. The capacitive coupling device of claim 1, wherein: the first blind hole is cylindrical or polygonal.
9. The capacitive coupling device of claim 1, wherein: the other bottom surface perpendicular to the splicing surface of the adjacent medium monomers is at least provided with a third blind hole, the third blind hole and the first blind hole are arranged along the same axial direction, and the inner wall and the bottom of the third blind hole are provided with metal shielding layers.
10. A dielectric filter, characterized by: said filter comprising at least one capacitive coupling device according to any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201811036762.1A CN109244615B (en) | 2018-09-06 | 2018-09-06 | Capacitive coupling device and filter |
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| CN201811036762.1A CN109244615B (en) | 2018-09-06 | 2018-09-06 | Capacitive coupling device and filter |
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| CN109244615A CN109244615A (en) | 2019-01-18 |
| CN109244615B true CN109244615B (en) | 2024-04-05 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110534849A (en) * | 2019-05-31 | 2019-12-03 | 摩比科技（深圳）有限公司 | It is a kind of to introduce capacitively coupled dielectric waveguide filter |
| CN110534851B (en) * | 2019-09-28 | 2024-05-28 | 江西一创新材料有限公司 | Dielectric filter and dielectric filter coupling structure for realizing symmetrical transmission zero point |
| CN111313137A (en) * | 2020-02-25 | 2020-06-19 | 重庆思睿创瓷电科技有限公司 | Capacitive coupling design method for harmonic-adjustable filter |
| CN111370817B (en) * | 2020-03-06 | 2021-09-10 | 广东国华新材料科技股份有限公司 | Dielectric filter |
| CN111355008A (en) * | 2020-04-16 | 2020-06-30 | 昆山立讯射频科技有限公司 | Dielectric waveguide filter |
| CN114927845B (en) * | 2022-06-13 | 2024-03-22 | 深圳大学 | Single-cavity multimode dielectric cavity band-pass filter |
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