CN109227352B - Substrate defect repairing method and system - Google Patents
Substrate defect repairing method and system Download PDFInfo
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- CN109227352B CN109227352B CN201811087521.XA CN201811087521A CN109227352B CN 109227352 B CN109227352 B CN 109227352B CN 201811087521 A CN201811087521 A CN 201811087521A CN 109227352 B CN109227352 B CN 109227352B
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- 230000007547 defect Effects 0.000 title claims abstract description 367
- 239000000758 substrate Substances 0.000 title claims abstract description 96
- 238000000034 method Methods 0.000 title claims abstract description 26
- 238000001514 detection method Methods 0.000 claims description 7
- 238000005259 measurement Methods 0.000 description 12
- 238000005498 polishing Methods 0.000 description 8
- 238000010586 diagram Methods 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003292 glue Substances 0.000 description 4
- 239000012528 membrane Substances 0.000 description 4
- 238000003384 imaging method Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000004590 computer program Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
- B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
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Abstract
The invention discloses a method and a system for repairing substrate defects, wherein the method comprises the steps of controlling a shooting device to shoot the surface of a substrate to be detected; acquiring defect information of the substrate according to the shooting result; identifying a defect meeting a first preset condition in the defect information as a target defect according to the defect information; positioning the target defect; judging whether the target defect meets a second preset condition or not; and if the target defect meets the second preset condition, controlling the grinding device to repair the target defect according to the positioning result. Whether the target defect meets the second preset condition is judged by identifying and positioning the target defect, and if so, the grinding device is controlled to grind the target defect according to the positioning result, so that the automation degree of the grinding device is improved, the labor cost is reduced, the error of manual judgment is avoided, and the product percent of pass repaired by grinding is improved.
Description
Technical Field
The invention relates to the technical field of display, in particular to a method and a system for repairing defects of a substrate.
Background
In the existing substrate production, for example, a Color Film (CF) substrate manufacturing process inevitably has various defects, the existing scheme is to take a picture of the surface of the color film substrate and then automatically or visually distinguish the picture to classify, judge and identify the defects. For defects needing to be repaired, in the existing operation process, an operator judges and guides a repairing device to grind and repair the defects according to a picture, and once the operator judges that the defects are wrong, the number of times of repairing the defects by the grinding device exceeds the specified number of times, so that the yield of products repaired by grinding is reduced.
Disclosure of Invention
The invention provides a method and a system for repairing defects of a substrate, which can improve the product percent of pass of product repair through grinding.
In one aspect, the present invention provides a method for repairing a defect of a substrate, including:
controlling a shooting device to shoot the surface of the substrate to be detected;
acquiring defect information of the substrate according to the shooting result;
identifying a defect meeting a first preset condition in the defect information as a target defect according to the defect information;
positioning the target defect;
judging whether the target defect meets a second preset condition or not;
and if the target defect meets a second preset condition, controlling a grinding device to grind the target defect according to a positioning result.
In another aspect, the present invention provides a method for repairing a defect of a substrate, including:
controlling a shooting device to shoot the surface of the substrate to be detected;
acquiring defect information of the substrate according to the shooting result;
identifying the defect with the highest value in the defect information as a target defect according to the defect information;
establishing a coordinate system corresponding to the shooting result;
acquiring coordinate information of the target defect in the coordinate system;
judging whether the height of the target defect exceeds a preset height threshold value or not;
if the height of the target defect exceeds a preset height threshold, acquiring a difference value between the height of the target defect and the preset height threshold;
correspondingly adjusting the repair time length of the grinding device to the target defect according to the difference;
and controlling the grinding device to repair the target defect according to the coordinate information and the repair duration.
In another aspect, the present invention provides a system for repairing defects of a substrate, which is applied to a substrate baking machine, and comprises:
the shooting unit is used for controlling the shooting device to shoot the surface of the measured substrate;
an acquisition unit configured to acquire defect information of the substrate according to a shooting result;
the identification unit is used for identifying the defects meeting the first preset condition in the defect information as target defects according to the defect information;
the positioning unit is used for positioning the target defect;
the judging unit is used for judging whether the target defects meet a second preset condition or not;
and the execution unit is used for controlling a grinding device to grind the target defects according to the positioning result if the target defects meet a second preset condition.
According to the embodiment of the invention, the shooting device is controlled to shoot the surface of the detected substrate, the defect information of the substrate is obtained, the target defect is identified and positioned, whether the target defect meets the second preset condition is judged, and if the target defect meets the second preset condition, the grinding device is controlled to grind the target defect according to the positioning result, so that the automation degree of the grinding device is improved, the labor cost is reduced, the error of artificial judgment is avoided, and the product percent of pass repaired by grinding is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a method for repairing a defect of a substrate according to an embodiment of the present invention;
FIG. 2 is a flow diagram illustrating sub-steps of the substrate defect repair method of FIG. 1;
fig. 3 is a schematic flow chart of a substrate defect repairing method according to a second embodiment of the present invention;
fig. 4 is a schematic block diagram of a substrate defect repairing system according to an embodiment of the present invention;
fig. 5 is a schematic block diagram of a substrate defect repairing system according to a second embodiment of the present invention;
fig. 6 is a schematic structural diagram of a substrate defect repairing apparatus according to an embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
Referring to fig. 1, which is a schematic flowchart of a method for repairing a defect of a substrate according to an embodiment of the present invention, as shown in the figure, the method includes the following steps S101 to S106:
step S101: and controlling the shooting device to shoot the surface of the measured substrate.
Specifically, when the substrate is detected, in order to acquire defect information of the substrate, the photographing device is first controlled to photograph the surface of the substrate to acquire required image information.
Step S102: and acquiring the defect information of the substrate according to the shooting result.
Specifically, the captured pictures are compared to obtain defect information, such as what kinds of defects are identified, for example, white defects, black defects, and the like. In an embodiment, for example, in the present embodiment, as shown in fig. 2, the step S102 includes the following sub-steps S102a, S102b and S102 c:
step S102 a: gray scale images of the substrate surface are acquired.
Specifically, for example, a Color Filter (CF) substrate is used, in a specific implementation, an automatic optical inspection machine (AOI) is used to detect the CF substrate, and the AOI device at least includes a backlight source and a shooting device. The shooting device is used for shooting the CF substrate placed in the AOI equipment to acquire a gray scale image of the CF substrate. In a specific implementation, the shooting device of the AOI device may be a Charge Coupled Device (CCD) camera, and a gray-scale image acquired by the CCD camera has a higher resolution.
Step S102 b: and acquiring a gray scale value corresponding to each detection point on the surface of the substrate according to the gray scale image.
Specifically, taking the CF substrate as an example, the CF substrate may include different color regions, for example, three different color regions of R (red), G (green), and B (blue). Of course, in a specific implementation, the CF substrate is not limited to include R, G, B three color regions, and the embodiments of the present invention are also applicable to CF substrates including two, four, five or other more different color regions. For a CF substrate comprising R, G, B three color areas, which has 256 different gray scale values, namely 0-255, the CCD acquires different gray scale values from different color areas on the CF substrate illuminated by the backlight source. A corresponding gray scale value can be obtained for each detected point position.
Step S102 c: and acquiring the defect information of the substrate according to the gray-scale value.
Specifically, each normal area has a preset normal gray scale value, which can be specifically set as a preset normal gray scale value range, the gray scale value of each detection point is compared with the preset normal gray scale value range, if the gray scale value of the detection point is within the preset normal gray scale value range, the detection point is determined to be normal, no defect exists, and if the gray scale value of the detection point is not within the preset normal gray scale value range, the detection point is determined to be defective. And when the gray scale value is higher than the preset normal gray scale value range, judging the defect as a white defect, and when the gray scale value is lower than the preset normal gray scale value range, judging the defect as a black defect.
Step S103: and identifying the defects meeting the first preset condition in the defect information as target defects according to the defect information.
Specifically, the defect information may be, for example, a height of the defect, and the first preset condition is a maximum value of the defect height, that is, a defect with a maximum defect height among all the defects is identified. In the concrete realization, use various membrane point glue repairing machine to restore the base plate defect, can preset the height threshold value of a defect before the grinding, when the defect height was ground to within this height threshold value, then be considered as repairing qualified, can measure the height of current defect after grinding each time, will measure instant height and predetermine the height threshold value and compare, if do not grind to within predetermineeing the height threshold value, then grind once more. In a specific implementation, the number of times of determining the repeated grinding of the defect is set, for example, the number of times of repeated grinding is set to m, that is, when one time of grinding fails to reduce the current height of the defect to within a preset height threshold, the grinding can be performed again, and then the height measurement is performed, so that the number of times of repeated grinding is m, and if the number of times of grinding exceeds m, the height of the defect cannot be ground to within the preset height threshold, the defect is determined to be failed in repair. Because the height measurement mode of the adhesive dispensing repair machine is confocal height measurement, the obtained height value is the height value in the whole grinding picture, the equipment only grinds the place aligned with a grinding belt (Tape) in the grinding process, and when the operator makes a judgment error and the current defect height is not the highest point in the grinding picture, the Tape always grinds the aligned place, so that the preset judgment times are exceeded, and the repair yield is reduced.
Step S104: and positioning the target defect.
Specifically, if the defect meets the first preset condition, the position of the defect is located, and in the specific implementation, for example, a coordinate system processing may be performed on the shooting result, that is, a coordinate system corresponding to the shot picture is established, so that the position of each defect is specified as a coordinate position in the coordinate system, and thus, the device itself may accurately locate the corresponding defect position through a specific coordinate in the coordinate system during the location.
Step S105: and judging whether the target defect meets a second preset condition.
Specifically, when the target defect is determined, the defect with the largest height value is identified, and the defect with the largest height value is further determined to determine whether the defect with the largest height value needs to be repaired. The judgment here is to judge whether the defect needs to be repaired.
Step S106: and if the target defect meets the second preset condition, controlling the grinding device to grind the target defect according to the positioning result.
Specifically, the target defect meets the second preset condition, and in a specific implementation, for example, the height of the defect with the maximum height exceeds a preset height threshold, that is, the defect needs to be repaired, the grinding device is controlled to grind the defect according to the positioning result, here, the coordinate position of the defect can be obtained, for example, through an established coordinate system, and the grinding device accurately finds the position of the defect through coordinate information, and further grinds the defect.
Specifically, the surface of the measured substrate is shot by controlling the shooting device, the defect information of the substrate is obtained, the target defect is identified and positioned, whether the target defect meets a second preset condition is judged, and if the target defect meets the second preset condition, the grinding device is controlled to grind the target defect according to a positioning result, so that the automation degree of the grinding device is improved, the labor cost is reduced, the error of manual judgment is avoided, and the product percent of pass repaired by grinding is improved.
Referring to fig. 3, which is a schematic flowchart of a substrate defect repairing method according to a second embodiment of the present invention, as shown in the figure, the method includes the following steps S201 to S209:
step S201: and controlling the shooting device to shoot the surface of the measured substrate.
Specifically, when detecting the substrate, in order to acquire defect information of the substrate, the photographing device is first controlled to photograph the surface of the substrate to acquire required image information.
Step S202: and acquiring the defect information of the substrate according to the shooting result.
Specifically, the captured pictures are compared to obtain defect information, such as what kinds of defects are identified, for example, white defects, black defects, and the like.
Step S203: and identifying the defect with the highest value in the defect information as a target defect according to the defect information.
Specifically, the defect information may be, for example, a height of the defect, and the first preset condition is a maximum value of the defect height, that is, a defect with a maximum defect height among all the defects is identified. In the concrete realization, use various membrane point glue repairing machine to restore the base plate defect, can preset the height threshold value of a defect before the grinding, when the defect height was ground to within this height threshold value, then be considered as repairing qualified, can measure the height of current defect after grinding each time, will measure instant height and predetermine the height threshold value and compare, if do not grind to within predetermineeing the height threshold value, then grind once more. In a specific implementation, the number of times of determining the repeated grinding of the defect is set, for example, the number of times of repeated grinding is set to m, that is, when one time of grinding fails to reduce the current height of the defect to within a preset height threshold, the grinding can be performed again, and then the height measurement is performed, so that the number of times of repeated grinding is m, and if the number of times of grinding exceeds m, the height of the defect cannot be ground to within the preset height threshold, the defect is determined to be failed in repair. Because the height measurement mode of the adhesive dispensing repair machine is confocal height measurement, the obtained height value is the height value in the whole grinding picture, the equipment only grinds the place aligned with a grinding belt (Tape) in the grinding process, and when the operator makes a judgment error and the current defect height is not the highest point in the grinding picture, the Tape always grinds the aligned place, so that the preset judgment times are exceeded, and the repair yield is reduced.
Step S204: and establishing a coordinate system corresponding to the shooting result.
Specifically, the defect position in the shot picture is positioned by establishing a coordinate system, so that the defect position can be accurately positioned.
Step S205: and acquiring coordinate information of the target defect in a coordinate system.
Specifically, after finding the defect with the largest height value, the position of the defect is located, and in the specific implementation, for example, a coordinate system processing may be performed on the shooting result, that is, a coordinate system corresponding to the shot picture is established, so that the position of each defect is specified as a coordinate position in the coordinate system, and thus, the device itself may accurately locate the corresponding defect position through a specific coordinate in the coordinate system during the location.
Step S206: and judging whether the height of the target defect exceeds a preset height threshold value or not.
Specifically, a height threshold is preset to determine whether the defect meets a standard requiring repair, and whether the defect with the largest height value needs to be repaired is determined, and the defect with the largest height value can be compared with the preset height threshold, and if the defect with the largest height value does not exceed the height threshold, the defect in the grinding picture does not need to be repaired. The judgment here is to judge whether the defect needs to be repaired.
Step S207: and if the height of the target defect exceeds the preset height threshold, acquiring a difference value between the height of the target defect and the preset height threshold.
Specifically, when the height of the defect with the largest height value exceeds a preset height threshold, the height of each defect meeting the repair condition is correspondingly obtained, and the preset height threshold is subtracted from the obtained height to obtain a difference.
Step S208: and correspondingly adjusting the repair time of the grinding device on the defects meeting the repair conditions according to the difference.
Specifically, the repairing time of the grinding device for the defects meeting the repairing conditions is correspondingly adjusted according to the obtained difference, the larger the difference is, the higher the height of the corresponding defect is, the longer the repairing time is required, and conversely, the smaller the difference is, the lower the height of the corresponding defect is, the shorter the repairing time is required. The repairing time corresponding to the grinding device is controlled, the repairing time corresponding to each defect of the grinding device can be called according to actual needs, and the repairing efficiency of the grinding device is improved.
Step S209: and controlling the grinding device to repair the target defect according to the coordinate information and the repair duration.
Specifically, if the height of the defect with the largest height value exceeds a preset height threshold, that is, the defect needs to be repaired, the grinding device is controlled to grind the defect according to the positioning result, for example, the coordinate position of the defect can be acquired through an established coordinate system, the grinding device accurately finds the defect position through coordinate information, and then the target defect is ground and repaired through the repair duration corresponding to each target defect.
In one embodiment, the distance from the end of the polishing apparatus to the surface of the substrate is obtained, and if the length of the distance does not exceed the length of the preset height threshold, a stop command is issued to the polishing apparatus.
Specifically, the signal acquisition device is arranged to acquire the distance between the grinding end of the grinding device and the surface of the substrate in real time, after the height between the end of the grinding device and the surface of the substrate is acquired, the height is compared with a preset height threshold value, and once the height between the end of the grinding device and the surface of the substrate in real time is not more than the preset height threshold value, the real-time distance is smaller than or equal to the length of the preset height threshold value, namely, a stop instruction for the grinding device is sent out, so that the grinding device stops repairing. The distance between the repairing end of the bath device and the surface of the substrate is monitored, so that the defect height can be ground to be not more than a preset height threshold value in each repairing process, and the repairing efficiency of the grinding device is improved.
Specifically, refer to fig. 4, which is a schematic block diagram of a substrate defect repairing system according to an embodiment of the present invention. The system 300 of the present embodiment includes: a shooting unit 301, an acquisition unit 302, a recognition unit 303, a positioning unit 304, a determination unit 305, and an execution unit 306.
And the shooting unit 301 is used for controlling the shooting device to shoot the surface of the measured substrate.
Specifically, when the substrate is detected, in order to acquire defect information of the substrate, the photographing device is first controlled to photograph the surface of the substrate to acquire required image information.
An obtaining unit 302, configured to obtain defect information of the substrate according to the shooting result.
Specifically, the captured pictures are compared to obtain defect information, such as what kinds of defects are identified, for example, white defects, black defects, and the like.
An identifying unit 303, configured to identify, according to defect information, a defect that satisfies a first preset condition in the defect information as a target defect.
Specifically, the defect information may be, for example, a height of the defect, and the first preset condition is a maximum value of the defect height, that is, a defect with a maximum defect height among all the defects is identified. In the concrete realization, use various membrane point glue repairing machine to restore the base plate defect, can preset the height threshold value of a defect before the grinding, when the defect height was ground to within this height threshold value, then be considered as repairing qualified, can measure the height of current defect after grinding each time, will measure instant height and predetermine the height threshold value and compare, if do not grind to within predetermineeing the height threshold value, then grind once more. In a specific implementation, the number of times of determining the repeated grinding of the defect is set, for example, the number of times of repeated grinding is set to m, that is, when one time of grinding fails to reduce the current height of the defect to within a preset height threshold, the grinding can be performed again, and then the height measurement is performed, so that the number of times of repeated grinding is m, and if the number of times of grinding exceeds m, the height of the defect cannot be ground to within the preset height threshold, the defect is determined to be failed in repair. Because the height measurement mode of the adhesive dispensing repair machine is confocal height measurement, the obtained height value is the height value in the whole grinding picture, the equipment only grinds the place aligned with a grinding belt (Tape) in the grinding process, and when the operator makes a judgment error and the current defect height is not the highest point in the grinding picture, the Tape always grinds the aligned place, so that the preset judgment times are exceeded, and the repair yield is reduced.
And a positioning unit 304 for positioning the target defect.
Specifically, if the defect meets the first preset condition, the position of the defect is located, and in the specific implementation, for example, a coordinate system processing may be performed on the shooting result, that is, a coordinate system corresponding to the shot picture is established, so that the position of each defect is specified as a coordinate position in the coordinate system, and thus, the device itself may accurately locate the corresponding defect position through a specific coordinate in the coordinate system during the location.
A judging unit 305, configured to judge whether the target defect satisfies a second preset condition.
Specifically, when the target defect is determined, the defect with the largest height value is identified, and the defect with the largest height value is further determined to determine whether the defect with the largest height value needs to be repaired. The judgment here is to judge whether the defect needs to be repaired.
And the execution unit 306 is configured to control the polishing apparatus to polish the target defect according to the positioning result if the target defect meets the second preset condition.
Specifically, the target defect meets the second preset condition, and in a specific implementation, for example, the height of the defect with the maximum height exceeds a preset height threshold, that is, the defect needs to be repaired, the grinding device is controlled to grind the defect according to the positioning result, here, the coordinate position of the defect can be obtained, for example, through an established coordinate system, and the grinding device accurately finds the position of the defect through coordinate information, and further grinds the defect.
Specifically, referring to fig. 5, it is a schematic block diagram of a substrate defect repairing system according to a second embodiment of the present invention. The system 400 of the present embodiment includes: shooting unit 401, acquisition unit 402, recognition unit 403, realization unit 404, first acquisition unit 405, judgment unit 406, and execution unit 407. The execution unit 407 includes: a second obtaining unit 408, an adjusting unit 409 and an executing sub-unit 410.
And an imaging unit 401 for controlling the imaging device to image the surface of the substrate to be tested.
Specifically, when detecting the substrate, in order to acquire defect information of the substrate, the photographing device is first controlled to photograph the surface of the substrate to acquire required image information.
An obtaining unit 402, configured to obtain defect information of the substrate according to the shooting result.
Specifically, the captured pictures are compared to obtain defect information, such as what kinds of defects are identified, for example, white defects, black defects, and the like.
An identifying unit 403, configured to identify the defect with the highest value in the defect information as a target defect according to the defect information.
Specifically, the defect information may be, for example, a height of the defect, and the first preset condition is a maximum value of the defect height, that is, a defect with a maximum defect height among all the defects is identified. In the concrete realization, use various membrane point glue repairing machine to restore the base plate defect, can preset the height threshold value of a defect before the grinding, when the defect height was ground to within this height threshold value, then be considered as repairing qualified, can measure the height of current defect after grinding each time, will measure instant height and predetermine the height threshold value and compare, if do not grind to within predetermineeing the height threshold value, then grind once more. In a specific implementation, the number of times of determining the repeated grinding of the defect is set, for example, the number of times of repeated grinding is set to m, that is, when one time of grinding fails to reduce the current height of the defect to within a preset height threshold, the grinding can be performed again, and then the height measurement is performed, so that the number of times of repeated grinding is m, and if the number of times of grinding exceeds m, the height of the defect cannot be ground to within the preset height threshold, the defect is determined to be failed in repair. Because the height measurement mode of the adhesive dispensing repair machine is confocal height measurement, the obtained height value is the height value in the whole grinding picture, the equipment only grinds the place aligned with a grinding belt (Tape) in the grinding process, and when the operator makes a judgment error and the current defect height is not the highest point in the grinding picture, the Tape always grinds the aligned place, so that the preset judgment times are exceeded, and the repair yield is reduced.
And an implementation unit 404, configured to establish a coordinate system corresponding to the shooting result.
Specifically, the defect position in the shot picture is positioned by establishing a coordinate system, so that the defect position can be accurately positioned.
A first obtaining unit 405, configured to obtain coordinate information of the target defect in a coordinate system.
Specifically, after finding the defect with the largest height value, the position of the defect is located, and in the specific implementation, for example, a coordinate system processing may be performed on the shooting result, that is, a coordinate system corresponding to the shot picture is established, so that the position of each defect is specified as a coordinate position in the coordinate system, and thus, the device itself may accurately locate the corresponding defect position through a specific coordinate in the coordinate system during the location.
A judging unit 406, configured to judge whether the height of the target defect exceeds a preset height threshold.
Specifically, a height threshold is preset to determine whether the defect meets a standard requiring repair, and whether the defect with the largest height value needs to be repaired is determined, and the defect with the largest height value can be compared with the preset height threshold, and if the defect with the largest height value does not exceed the height threshold, the defect in the grinding picture does not need to be repaired. The judgment here is to judge whether the defect needs to be repaired.
The execution unit 407 is configured to control the polishing apparatus to polish the target defect according to the coordinate information if the height of the target defect exceeds a preset height threshold.
Specifically, if the height of the defect with the largest height value exceeds a preset height threshold, that is, the defect needs to be repaired, the polishing device is controlled to polish the defect according to the positioning result, where the coordinate position of the defect can be obtained, for example, through an established coordinate system, and the polishing device accurately finds the position of the defect through coordinate information, so as to polish the defect.
The execution unit 407 includes a second obtaining unit 408, an adjusting unit 409, and an execution subunit 410.
A second obtaining unit 408, configured to obtain a difference between the height of the target defect satisfying the second preset condition and a preset height threshold.
Specifically, the height of each defect satisfying the repair condition is obtained correspondingly, and a difference is obtained by subtracting a preset height threshold from the height.
And the adjusting unit 409 is used for correspondingly adjusting the repair duration of the target defect meeting the repair condition by the grinding device according to the difference.
Specifically, the repairing time of the grinding device for the defects meeting the repairing conditions is correspondingly adjusted according to the obtained difference, the larger the difference is, the higher the height of the corresponding defect is, the longer the repairing time is required, and conversely, the smaller the difference is, the lower the height of the corresponding defect is, the shorter the repairing time is required. The repairing time corresponding to the grinding device is controlled, the repairing time corresponding to each defect of the grinding device can be called according to actual needs, and the repairing efficiency of the grinding device is improved.
An execution subunit 410, configured to execute controlling the grinding apparatus to repair the target defect according to the repair duration
Specifically, refer to fig. 6, which is a schematic structural diagram of a substrate defect repairing apparatus according to an embodiment of the present invention. The device comprises a machine table 10, a rack 11, a control device (not shown in the figure), a shooting device 30 and a grinding device 40, wherein the rack 11 is connected with the machine table 10, the shooting device 30 and the grinding device 40 are arranged on the rack 11, the shooting device 30 and the grinding device 40 are controlled by the control device, a substrate 20 is arranged on the machine table 10, the surface of the substrate 20 is detected through the shooting device 30 to obtain the specific information of a defect 21, and when the found defect 21 reaches the condition needing to be repaired, the grinding device 40 is called to grind the defect 21 until the height of the defect 21 exceeds the height of the substrate 20 and does not exceed a preset height threshold value. In one embodiment, the camera 30 may include a CCD camera for capturing gray-scale images of the surface of the substrate 20 and a structured light module for obtaining depth information of the surface of the substrate 20, so as to find the position of the defect 21 and determine the height information of the defect 21. In a specific implementation, the polishing device 40 can be controlled to freely move to a desired position on the frame 11 and can be controlled to freely stretch and contract to meet the requirement of polishing the defect 21.
The control apparatus comprises one or more processors and a memory for storing a computer program comprising program instructions, the processors being operable to execute the program instructions stored by the memory. Wherein the processor is configured to invoke the program instructions to perform the following:
controlling a shooting device to shoot the surface of the substrate to be detected; acquiring defect information of the substrate according to the shooting result; identifying a defect meeting a first preset condition in the defect information as a target defect according to the defect information; positioning the target defect; judging whether the target defect meets a second preset condition or not; and if the target defect meets a second preset condition, controlling a grinding device to repair the target defect according to the positioning result.
Controlling a shooting device to shoot the surface of the substrate to be detected; acquiring defect information of the substrate according to the shooting result; identifying the defect with the highest value in the defect information as a target defect according to the defect information; establishing a coordinate system corresponding to the shooting result; acquiring coordinate information of the target defect in a coordinate system; judging whether the height of the target defect exceeds a preset height threshold value or not; if the height of the target defect exceeds a preset height threshold, acquiring a difference value between the height of the target defect and the preset height threshold; correspondingly adjusting the repair time length of the grinding device to the target defect according to the difference; and controlling the grinding device to repair the target defect according to the positioning result and the repair duration.
In the embodiments provided in the present application, it should be understood that the disclosure is illustrative only and can be implemented in other ways.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (7)
1. A method for repairing a defect in a substrate, comprising:
controlling a shooting device to shoot the surface of the substrate to be detected;
acquiring defect information of the substrate according to the shooting result;
identifying a defect meeting a first preset condition in the defect information as a target defect according to the defect information;
positioning the target defect;
judging whether the target defect meets a second preset condition or not;
if the target defect meets a second preset condition, controlling a grinding device to repair the target defect according to a positioning result;
the identifying, according to the defect information, a defect that meets a first preset condition in the defect information as a target defect includes:
identifying the defect with the maximum defect height value in the defect information as a target defect according to the defect information;
the controlling the grinding device to repair the target defect comprises:
acquiring a difference value between the height of the target defect meeting the second preset condition and a preset height threshold value;
correspondingly adjusting the repair time length of the grinding device to the target defect according to the difference;
and controlling the grinding device to repair the target defect according to the repair duration.
2. The method of claim 1, wherein the determining whether the target defect satisfies a second predetermined condition comprises:
acquiring a height value of the target defect;
judging whether the height value exceeds a preset height threshold value or not;
and if the height value exceeds the preset height threshold value, determining that a second preset condition is met.
3. The method of claim 1, wherein the locating the target defect comprises:
establishing a coordinate system corresponding to the shooting result;
and acquiring coordinate information of the target defect in the coordinate system.
4. The method according to claim 1, wherein the acquiring the defect information of the substrate according to the photographing result comprises:
acquiring a gray scale image of the surface of the substrate;
acquiring a gray scale value corresponding to each detection point on the surface of the substrate according to the gray scale image;
and acquiring the defect information of the substrate according to the gray-scale value.
5. A method for repairing a defect in a substrate, comprising:
controlling a shooting device to shoot the surface of the substrate to be detected;
acquiring defect information of the substrate according to the shooting result;
identifying the defect with the highest value in the defect information as a target defect according to the defect information;
establishing a coordinate system corresponding to the shooting result;
acquiring coordinate information of the target defect in the coordinate system;
judging whether the height of the target defect exceeds a preset height threshold value or not;
if the height of the target defect exceeds a preset height threshold, acquiring a difference value between the height of the target defect and the preset height threshold;
correspondingly adjusting the repair time length of the grinding device to the target defect according to the difference;
and controlling the grinding device to repair the target defect according to the coordinate information and the repair duration.
6. A substrate defect repair system, comprising:
the shooting unit is used for controlling the shooting device to shoot the surface of the measured substrate;
an acquisition unit configured to acquire defect information of the substrate according to a shooting result;
the identification unit is used for identifying the defect meeting a first preset condition in the defect information as a target defect according to the defect information;
the positioning unit is used for positioning the target defect;
the judging unit is used for judging whether the target defects meet a second preset condition or not;
the execution unit is used for controlling the grinding device to repair the target defect according to a positioning result if the target defect meets a second preset condition;
wherein the execution unit includes:
the second acquisition unit is used for acquiring the difference value between the height of the defect meeting the second preset condition and a preset height threshold value;
the adjusting unit is used for correspondingly adjusting the repair time length of the grinding device on the defects meeting the repair conditions according to the difference value;
and the execution subunit is used for executing the control of the grinding device to repair the target defect according to the repair duration.
7. The substrate defect repair system of claim 6, wherein the positioning unit comprises:
the realization unit is used for establishing a coordinate system corresponding to the shooting result;
and the first acquisition unit is used for acquiring the coordinate information of the target defect in the coordinate system.
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| CN110625491A (en) * | 2019-08-29 | 2019-12-31 | 中车青岛四方机车车辆股份有限公司 | Polishing apparatus and polishing method |
| CN110782782B (en) * | 2019-11-28 | 2022-03-29 | 合肥维信诺科技有限公司 | Array substrate repairing method and system |
| CN111203805B (en) * | 2020-01-08 | 2022-02-25 | 苏州德龙激光股份有限公司 | Full-automatic glass scratch repairing method |
| CN111331435B (en) * | 2020-03-27 | 2024-09-10 | 中冶赛迪工程技术股份有限公司 | Intelligent surface grinding process and production line for alloy medium plate |
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| CN102645435A (en) * | 2012-04-19 | 2012-08-22 | 深圳市华星光电技术有限公司 | Method and device for detecting substrate |
| CN103064206B (en) * | 2013-01-08 | 2015-04-22 | 深圳市华星光电技术有限公司 | Glass substrate defect detection method |
| CN103091331B (en) * | 2013-01-11 | 2014-12-31 | 华中科技大学 | System and method for visual inspection on burrs and stain defects of radio frequency identification (RFID) antennae |
| CN103809309B (en) * | 2014-01-22 | 2016-07-06 | 北京京东方显示技术有限公司 | Substrate detection equipment and method |
| CN107464236B (en) * | 2017-07-28 | 2020-05-05 | 武汉华星光电半导体显示技术有限公司 | Flexible display substrate defect discrimination method based on AOI |
| CN107402218A (en) * | 2017-09-25 | 2017-11-28 | 武汉华星光电技术有限公司 | Microdefect detection method, device and the equipment of CF substrates |
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