CN109096973A - A kind of automotive wire bundle conductive heat melten gel and preparation method thereof - Google Patents
A kind of automotive wire bundle conductive heat melten gel and preparation method thereof Download PDFInfo
- Publication number
- CN109096973A CN109096973A CN201810684073.5A CN201810684073A CN109096973A CN 109096973 A CN109096973 A CN 109096973A CN 201810684073 A CN201810684073 A CN 201810684073A CN 109096973 A CN109096973 A CN 109096973A
- Authority
- CN
- China
- Prior art keywords
- parts
- wire bundle
- automotive wire
- agent
- melten gel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J167/00—Adhesives based on polyesters obtained by reactions forming a carboxylic ester link in the main chain; Adhesives based on derivatives of such polymers
- C09J167/06—Unsaturated polyesters having carbon-to-carbon unsaturation
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/085—Copper
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/001—Conductive additives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention discloses a kind of automotive wire bundle conductive heat melten gels, raw material including following parts by weight: 20-35 parts of poly terephthalic acid diallyl, 18-30 parts of one isoprene block copolymer rubber of styrene, 18-25 parts of terpene phenolic resin, 10-18 parts of conducing composite material, 5-8 parts of polyethylene wax, 0.8-1.3 parts of catalyst, 2-4 parts of bonding agent, 1.5-3 parts of auxiliary agent.Automotive wire bundle of the invention is reasonable with conductive hot melt glue formula, has good conductive property after preparation, adhesive property, thermal stability, mechanical performance etc., and excellent combination property can be used in the preparation of automotive wire bundle or auto parts and components, and effect is preferable.
Description
Technical field
The invention belongs to macromolecule glue formula technique fields, and in particular to a kind of automotive wire bundle conductive heat melten gel and its
Preparation method.
Background technique
Hot melt adhesive is a kind of adhesive of plasticity, and room temperature is in solid state, can rapid link after heating and melting.Have following
Feature: (1) bonding is rapid: usually cementing from gluing to cooling, it is only necessary to Ji Shimiao or even several seconds time;(2) it is bonded range
It is wide: to glue material (such as polyolefin to many materials, or even to generally acknowledged difficulty!Paraffin paper!Carbon paper etc.) it can also be bonded, especially
It is the connector being bonded using hot melt adhesive, the 105-106 above bending can be subjected to without cracking;(3) it can heat repeatedly, conducting repeated adhesion
It connects;(4) performance is stablized, convenient for storage transport;(5) low in cost: hot melt adhesive does not have solvent consumption, avoids depositing because of solvent
, and deform adherend!The disadvantages such as dislocation and contraction, help to reduce cost!Improve product quality.However, hot melt adhesive
It has some disadvantages: that mainly electric conductivity, heat resistance and adhesive strength are lower, is not suitable for using as sqtructural adhesive.Due to
Hot melt adhesive melt viscosity is generally higher, poor to the wellability for being glued material, it usually needs and pressurized adhesion is strong so as to improve bonding
Degree;In addition, hot melt adhesive needs special equipment, such as glue spreader hot melt gun when in use, therefore it is limited to a certain extent
Application range.Hot melt adhesive its physical state in certain temperature range changes with temperature and is changed, and chemical characteristic is constant,
It is non-toxic and tasteless, belong to environmental-protecting chemical product.
Summary of the invention
In view of the foregoing, it is an object to provide a kind of automotive wire bundle conductive heat melten gel and its preparation side
Method, the conductive heat melten gel being prepared have good conductive property, adhesive property, thermal stability, mechanical performance etc., comprehensive
It has excellent performance.
To achieve the goals above, the technical solution adopted by the present invention are as follows: a kind of automotive wire bundle conductive heat melten gel, by with
The raw material of lower parts by weight forms: 20-35 parts of poly terephthalic acid diallyl, one isoprene block copolymer rubber of styrene
18-30 parts, 18-25 parts of terpene phenolic resin, 10-18 parts of conducing composite material, 5-8 parts of polyethylene wax, catalyst 0.8-1.3
Part, 2-4 parts of bonding agent, 1.5-3 parts of auxiliary agent;Wherein, the preparation step of the conducing composite material is as follows:
(1) according to parts by weight, weigh 3-5 parts of expanded graphites, 1.5-3 parts of nickel coated copper powders, 0.4-0.7 parts of Conductive micas and
2-3.5 parts of polyanilines are mixed evenly, and add 2-4 parts of silane coupling agents and are uniformly mixed;
(2) step (1) resulting mixture is placed in ball mill after grinding 4-6h and is taken out, then the mixture of taking-up is set
Dry 6-8h at 60-80 DEG C in a vacuum drying oven, obtains conducing composite material.
The bonding agent is the compound of tackifying resin TKM-M and silane coupling agent;Wherein, tackifying resin TKM-M and silicon
The mass ratio of alkane coupling agent is (1.2-2): 1.
The catalyst is methoxytrimethylsilane.
The auxiliary agent is antioxidant, the compound of heat stabilizer and ultraviolet absorbing agent;Wherein, antioxidant, heat are steady
The mass ratio for determining agent and ultraviolet absorbing agent is (1-1.5): (1.2-1.8): 1.
The antioxidant is antioxidant 1010, and heat stabilizer is organic tin stabilizer, and ultraviolet absorbing agent is nanometer
Zinc oxide.
The preparation method of above-mentioned automotive wire bundle conductive heat melten gel, including following preparation method:
(1) formula rate is pressed, by conducing composite material, polyethylene wax and catalyst are placed in stirrer for mixing stirring
Even, blender stirring rate is 600-700r/min;
(2) formula rate is pressed, by poly terephthalic acid diallyl, one isoprene block copolymer rubber of styrene,
Terpene phenolic resin, bonding agent and auxiliary agent are placed in stirrer for mixing and stir evenly, and blender stirring rate is 400-500r/
min;
(3) step (1) resulting mixture is added in step (2) resulting mixture, is subsequently placed in blender
It is mixed evenly, then is granulated by twin-screw mixer extruder blending extrusion, as conductive heat melten gel;Wherein, blender stirs
Mixing rate is 300-400r/min.
Automotive wire bundle of the invention conductive heat melten gel, with one isoprene of poly terephthalic acid diallyl and styrene
Matrix of the block copolymer rubber as hot melt adhesive is added terpene phenolic resin, bonding agent and auxiliary agent, reduces the melting of matrix
Viscosity has preferable workability;Then it adds polyethylene wax and conducing composite material that catalyst treatment is crossed, increases
The performances such as electric conductivity, the bonding of hot melt adhesive, so that the excellent combination property of hot melt adhesive.
Beneficial effects of the present invention: automotive wire bundle of the invention is reasonable with conductive hot melt glue formula, has after preparation good
Electric conductivity, adhesive property, thermal stability, mechanical performance etc., excellent combination property can be used for automotive wire bundle or automobile
In the preparation of components, effect is preferable.
Specific embodiment
Detailed description of the preferred embodiments below.It should be understood that described herein specific
Embodiment is merely to illustrate and explain the present invention, it is not limited to these embodiments.In embodiment, all raw materials are commercially available
Product.
Embodiment 1
A kind of automotive wire bundle conductive heat melten gel, is made of the raw material of following parts by weight:
31 parts of poly terephthalic acid diallyl, 24 parts of one isoprene block copolymer rubber of styrene, terpenes phenolic aldehyde
22 parts of resin, 15 parts of conducing composite material, 6 parts of polyethylene wax, 1.1 parts of methoxytrimethylsilane, 3.2 parts of bonding agent, auxiliary agent
2.3 part;Wherein, the preparation step of the conducing composite material is as follows:
(1) according to parts by weight, 4.2 parts of expanded graphites, 2.6 parts of nickel coated copper powders, 0.6 part of Conductive mica and 3.2 parts are weighed
Polyaniline is mixed evenly, and adds 3.8 parts of silane coupling agents and is uniformly mixed;
(2) step (1) resulting mixture is placed in ball mill after grinding 5h and is taken out, then the mixture of taking-up is placed in
Dry 8h at 75 DEG C, obtains conducing composite material in vacuum oven.
The bonding agent is the compound of tackifying resin TKM-M and silane coupling agent;Wherein, tackifying resin TKM-M and silicon
The mass ratio of alkane coupling agent is 1.5:1.
The auxiliary agent is antioxidant, the compound of heat stabilizer and ultraviolet absorbing agent;Wherein, antioxidant, heat are steady
The mass ratio for determining agent and ultraviolet absorbing agent is 1.2:1.5:1.
The antioxidant is antioxidant 1010, and heat stabilizer is organic tin stabilizer, and ultraviolet absorbing agent is nanometer
Zinc oxide.
The preparation method of above-mentioned automotive wire bundle conductive heat melten gel, including following preparation method:
(1) formula rate is pressed, by conducing composite material, polyethylene wax and methoxytrimethylsilane are placed in blender
It is mixed evenly, blender stirring rate is 660r/min;
(2) formula rate is pressed, by poly terephthalic acid diallyl, one isoprene block copolymer rubber of styrene,
Terpene phenolic resin, bonding agent and auxiliary agent are placed in stirrer for mixing and stir evenly, and blender stirring rate is 450r/min;
(3) step (1) resulting mixture is added in step (2) resulting mixture, is subsequently placed in blender
It is mixed evenly, then is granulated by twin-screw mixer extruder blending extrusion, as conductive heat melten gel;Wherein, blender stirs
Mixing rate is 380r/min.
Embodiment 2
A kind of automotive wire bundle conductive heat melten gel, is made of the raw material of following parts by weight:
32 parts of poly terephthalic acid diallyl, 26 parts of one isoprene block copolymer rubber of styrene, terpenes phenolic aldehyde
24 parts of resin, 16 parts of conducing composite material, 7 parts of polyethylene wax, 1.2 parts of methoxytrimethylsilane, 3.6 parts of bonding agent, auxiliary agent
2.8 part;Wherein, the preparation step of the conducing composite material is as follows:
(1) according to parts by weight, 4.2 parts of expanded graphites, 2.6 parts of nickel coated copper powders, 0.6 part of Conductive mica and 3.2 parts are weighed
Polyaniline is mixed evenly, and adds 3.8 parts of silane coupling agents and is uniformly mixed;
(2) step (1) resulting mixture is placed in ball mill after grinding 5h and is taken out, then the mixture of taking-up is placed in
Dry 8h at 75 DEG C, obtains conducing composite material in vacuum oven.
The bonding agent is the compound of tackifying resin TKM-M and silane coupling agent;Wherein, tackifying resin TKM-M and silicon
The mass ratio of alkane coupling agent is 1.8:1.
The auxiliary agent is antioxidant, the compound of heat stabilizer and ultraviolet absorbing agent;Wherein, antioxidant, heat are steady
The mass ratio for determining agent and ultraviolet absorbing agent is 1.3:1.6:1.
The antioxidant is antioxidant 1010, and heat stabilizer is organic tin stabilizer, and ultraviolet absorbing agent is nanometer
Zinc oxide.
The preparation method of above-mentioned automotive wire bundle conductive heat melten gel, including following preparation method:
(1) formula rate is pressed, by conducing composite material, polyethylene wax and methoxytrimethylsilane are placed in blender
It is mixed evenly, blender stirring rate is 700r/min;
(2) formula rate is pressed, by poly terephthalic acid diallyl, one isoprene block copolymer rubber of styrene,
Terpene phenolic resin, bonding agent and auxiliary agent are placed in stirrer for mixing and stir evenly, and blender stirring rate is 480r/min;
(3) step (1) resulting mixture is added in step (2) resulting mixture, is subsequently placed in blender
It is mixed evenly, then is granulated by twin-screw mixer extruder blending extrusion, as conductive heat melten gel;Wherein, blender stirs
Mixing rate is 380r/min.
Embodiment 3
A kind of automotive wire bundle conductive heat melten gel, is made of the raw material of following parts by weight:
32 parts of poly terephthalic acid diallyl, 25 parts of one isoprene block copolymer rubber of styrene, terpenes phenolic aldehyde
23 parts of resin, 15 parts of conducing composite material, 7 parts of polyethylene wax, 1.1 parts of methoxytrimethylsilane, 3.4 parts of bonding agent, auxiliary agent
2.6 part;Wherein, the preparation step of the conducing composite material is as follows:
(1) according to parts by weight, 4.2 parts of expanded graphites, 2.6 parts of nickel coated copper powders, 0.6 part of Conductive mica and 3.2 parts are weighed
Polyaniline is mixed evenly, and adds 3.8 parts of silane coupling agents and is uniformly mixed;
(2) step (1) resulting mixture is placed in ball mill after grinding 5h and is taken out, then the mixture of taking-up is placed in
Dry 8h at 75 DEG C, obtains conducing composite material in vacuum oven.
The bonding agent is the compound of tackifying resin TKM-M and silane coupling agent;Wherein, tackifying resin TKM-M and silicon
The mass ratio of alkane coupling agent is 1.6:1.
The auxiliary agent is antioxidant, the compound of heat stabilizer and ultraviolet absorbing agent;Wherein, antioxidant, heat are steady
The mass ratio for determining agent and ultraviolet absorbing agent is 1.2:1.6:1.
The antioxidant is antioxidant 1010, and heat stabilizer is organic tin stabilizer, and ultraviolet absorbing agent is nanometer
Zinc oxide.
The preparation method of above-mentioned automotive wire bundle conductive heat melten gel, including following preparation method:
(1) formula rate is pressed, by conducing composite material, polyethylene wax and methoxytrimethylsilane are placed in blender
It is mixed evenly, blender stirring rate is 680r/min;
(2) formula rate is pressed, by poly terephthalic acid diallyl, one isoprene block copolymer rubber of styrene,
Terpene phenolic resin, bonding agent and auxiliary agent are placed in stirrer for mixing and stir evenly, and blender stirring rate is 480r/min;
(3) step (1) resulting mixture is added in step (2) resulting mixture, is subsequently placed in blender
It is mixed evenly, then is granulated by twin-screw mixer extruder blending extrusion, as conductive heat melten gel;Wherein, blender stirs
Mixing rate is 370r/min.
Test example
Automotive wire bundle produced by the present invention is tested with the electric conductivity of conductive heat melten gel and stripping performance, test knot
Fruit is as shown in the table:
Index request | Embodiment 1 | Embodiment 2 | Embodiment 3 | |
Conductivity | s/m | 0.21 | 0.15 | 0.17 |
Peel strength | ≧20N/cm | 26.4 | 29.8 | 28.2 |
In conclusion automotive wire bundle of the invention is had good conductive property with conductive heat melten gel and adhesive property, it can
In preparation for automotive wire bundle or auto parts and components.
Claims (6)
1. a kind of automotive wire bundle conductive heat melten gel, which is characterized in that be made of the raw material of following parts by weight: poly terephthalic acid
20-35 parts of diallyl, 18-30 parts of one isoprene block copolymer rubber of styrene, is led by 18-25 parts of terpene phenolic resin
10-18 parts of composite, 5-8 parts of polyethylene wax, 0.8-1.3 parts of catalyst, 2-4 parts of bonding agent, 1.5-3 parts of auxiliary agent;Wherein,
The preparation step of the conducing composite material is as follows:
(1) according to parts by weight, 3-5 parts of expanded graphites, 1.5-3 parts of nickel coated copper powders, 0.4-0.7 parts of Conductive micas and 2- are weighed
3.5 parts of polyanilines are mixed evenly, and add 2-4 parts of silane coupling agents and are uniformly mixed;
(2) step (1) resulting mixture is placed in ball mill after grinding 4-6h and is taken out, then the mixture of taking-up is placed in very
Dry 6-8h at 60-80 DEG C, obtains conducing composite material in empty drying box.
2. a kind of automotive wire bundle conductive heat melten gel according to claim 1, which is characterized in that the bonding agent is thickening
The compound of resin TKM-M and silane coupling agent;Wherein, the mass ratio of tackifying resin TKM-M and silane coupling agent is (1.2-
2):1。
3. a kind of automotive wire bundle conductive heat melten gel according to claim 1, which is characterized in that the catalyst is methoxy
Base trimethyl silane.
4. a kind of automotive wire bundle conductive heat melten gel according to claim 1, which is characterized in that the auxiliary agent is anti-oxidant
The compound of agent, heat stabilizer and ultraviolet absorbing agent;Wherein, the quality of antioxidant, heat stabilizer and ultraviolet absorbing agent
Than for (1-1.5): (1.2-1.8): 1.
5. a kind of automotive wire bundle conductive heat melten gel according to claim 4, which is characterized in that the antioxidant is anti-
Oxidant 1010, heat stabilizer are organic tin stabilizer, and ultraviolet absorbing agent is nano zine oxide.
6. a kind of preparation method of automotive wire bundle conductive heat melten gel as described in claim 1-5 any one, feature exist
In, including following preparation method:
(1) formula rate is pressed, by conducing composite material, polyethylene wax and catalyst are placed in stirrer for mixing and stir evenly,
Blender stirring rate is 600-700r/min;
(2) formula rate is pressed, by poly terephthalic acid diallyl, one isoprene block copolymer rubber of styrene, terpenes
Phenolic resin, bonding agent and auxiliary agent are placed in stirrer for mixing and stir evenly, and blender stirring rate is 400-500r/min;
(3) step (1) resulting mixture is added in step (2) resulting mixture, is subsequently placed in stirrer for mixing
It stirs evenly, then is granulated by twin-screw mixer extruder blending extrusion, as conductive heat melten gel;Wherein, blender stirring speed
Rate is 300-400r/min.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810684073.5A CN109096973A (en) | 2018-06-28 | 2018-06-28 | A kind of automotive wire bundle conductive heat melten gel and preparation method thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810684073.5A CN109096973A (en) | 2018-06-28 | 2018-06-28 | A kind of automotive wire bundle conductive heat melten gel and preparation method thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
CN109096973A true CN109096973A (en) | 2018-12-28 |
Family
ID=64845249
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810684073.5A Pending CN109096973A (en) | 2018-06-28 | 2018-06-28 | A kind of automotive wire bundle conductive heat melten gel and preparation method thereof |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN109096973A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022186771A (en) * | 2018-08-28 | 2022-12-15 | 東洋インキScホールディングス株式会社 | Conductive hot-melt adhesive composition, and laminate |
Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101970720A (en) * | 2008-03-13 | 2011-02-09 | 巴斯夫欧洲公司 | Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound |
CN103140557A (en) * | 2010-09-30 | 2013-06-05 | 3M创新有限公司 | Hot melt processable pressure sensitive adhesives containing fibrous materials |
CN103205210A (en) * | 2013-03-19 | 2013-07-17 | 江苏鹿山光伏科技有限公司 | High-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards, and preparation method thereof |
CN103540280A (en) * | 2013-09-27 | 2014-01-29 | 沈阳建筑大学 | Heat-conduction and electric-conduction hot melt glue and preparation method thereof |
CN104531002A (en) * | 2015-01-09 | 2015-04-22 | 沈阳理工大学 | Magnetic hot melt adhesive and preparing and using method thereof |
CN104927697A (en) * | 2015-03-04 | 2015-09-23 | 河北华夏实业有限公司 | Automotive wire harness cloth-based adhesive tape manufactured with UV-curable hot-melt pressure-sensitive adhesive, and manufacturing technology thereof |
CN105957913A (en) * | 2016-05-12 | 2016-09-21 | 东莞市联洲知识产权运营管理有限公司 | Solar cell backboard with high thermal conductivity and preparation method thereof |
CN107722889A (en) * | 2017-11-15 | 2018-02-23 | 郴州国盛新材科技有限公司 | A kind of PUR containing micro- swollen graphite and preparation method thereof |
-
2018
- 2018-06-28 CN CN201810684073.5A patent/CN109096973A/en active Pending
Patent Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101970720A (en) * | 2008-03-13 | 2011-02-09 | 巴斯夫欧洲公司 | Method and dispersion for applying a metal layer to a substrate and metallizable thermoplastic molding compound |
CN103140557A (en) * | 2010-09-30 | 2013-06-05 | 3M创新有限公司 | Hot melt processable pressure sensitive adhesives containing fibrous materials |
CN103205210A (en) * | 2013-03-19 | 2013-07-17 | 江苏鹿山光伏科技有限公司 | High-temperature-resistant hot melt adhesive membrane for aluminum honeycomb boards, and preparation method thereof |
CN103540280A (en) * | 2013-09-27 | 2014-01-29 | 沈阳建筑大学 | Heat-conduction and electric-conduction hot melt glue and preparation method thereof |
CN104531002A (en) * | 2015-01-09 | 2015-04-22 | 沈阳理工大学 | Magnetic hot melt adhesive and preparing and using method thereof |
CN104927697A (en) * | 2015-03-04 | 2015-09-23 | 河北华夏实业有限公司 | Automotive wire harness cloth-based adhesive tape manufactured with UV-curable hot-melt pressure-sensitive adhesive, and manufacturing technology thereof |
CN105957913A (en) * | 2016-05-12 | 2016-09-21 | 东莞市联洲知识产权运营管理有限公司 | Solar cell backboard with high thermal conductivity and preparation method thereof |
CN107722889A (en) * | 2017-11-15 | 2018-02-23 | 郴州国盛新材科技有限公司 | A kind of PUR containing micro- swollen graphite and preparation method thereof |
Non-Patent Citations (2)
Title |
---|
李红强: "《胶粘原理、技术及应用》", 30 January 2014, 华南理工大学出版社 * |
陈静静: "《精细化学品检验实用技术》", 30 March 2014, 广东高等教育出版社 * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022186771A (en) * | 2018-08-28 | 2022-12-15 | 東洋インキScホールディングス株式会社 | Conductive hot-melt adhesive composition, and laminate |
JP7473763B2 (en) | 2018-08-28 | 2024-04-24 | artience株式会社 | Conductive hot melt adhesive composition and laminate |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN103059576B (en) | High-heat-conductivity flexible silica gel gasket and preparation method thereof | |
CN103030976B (en) | Single-component heat-curing liquid silicone rubber and preparation method thereof | |
CN102618041B (en) | High heat-conducting insulating silicon rubber and preparation method thereof | |
CN110713742B (en) | Preparation and application method of intelligent conductive paint based on liquid metal-polymer | |
WO2010031264A1 (en) | Anisotropic flexible bonded ndfeb magnet and manufacturing method of the same | |
WO2008133211A1 (en) | Thermally conductive compound and process for producing the same | |
CN105153620A (en) | Modified polypropylene/hyper branched polyimide insulated alloy material and preparation method thereof | |
CN105255004B (en) | A kind of graphite resin composite material with nucleocapsid and preparation method thereof | |
EP3303494A1 (en) | High thermally conductive low pressure mouldable hotmelt | |
CN109096973A (en) | A kind of automotive wire bundle conductive heat melten gel and preparation method thereof | |
CN112480848B (en) | Electric and heat conducting silver adhesive for chip bonding and preparation method thereof | |
CN103122200B (en) | A kind of epoxy self-bonding paint possessing heat sinking function and preparation method thereof | |
CN108774487A (en) | A kind of automotive wire bundle flame-retardant hot-melt adhesive and preparation method thereof | |
CN116751531A (en) | Heat-conducting insulating adhesive film and preparation method and application thereof | |
CN105111844A (en) | Anti-peeling heat-dissipation paint and preparation method therefor | |
CN113150665A (en) | Medium-high temperature graphene heating slurry and preparation method thereof | |
CN105969236A (en) | Insect and rat bite preventing micropore insulated binding band | |
CN108822795A (en) | A kind of automotive wire bundle High-temp.-resistant hot-melt adhesive and preparation method thereof | |
CN106010333A (en) | Microporous compound insulation binder with enhanced heat radiation performance | |
CN114716789B (en) | Preparation method of graphene composite material with heat conduction function | |
CN118359874A (en) | Phase-change sheet with high heat conductivity and preparation method thereof | |
CN105925221A (en) | High-adhesiveness heat-conducting adhesive and preparation method thereof | |
CN116731632A (en) | High-thermal-conductivity-coefficient heat-conducting adhesive film and preparation method thereof | |
CN109266262B (en) | Method for preparing low dielectric loss composite adhesive | |
CN106117866A (en) | A kind of anti abrasive micropore pressure-sensitive insulating bag band |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181228 |