CN109095913A - 一种高导热绝缘陶瓷及其制备方法 - Google Patents
一种高导热绝缘陶瓷及其制备方法 Download PDFInfo
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- 239000000919 ceramic Substances 0.000 title claims abstract description 52
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- PNEYBMLMFCGWSK-UHFFFAOYSA-N Alumina Chemical compound [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims abstract description 42
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 38
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims abstract description 36
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 28
- 239000013078 crystal Substances 0.000 claims abstract description 28
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 28
- 239000003365 glass fiber Substances 0.000 claims abstract description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 21
- 229910021389 graphene Inorganic materials 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 20
- DUIOKRXOKLLURE-UHFFFAOYSA-N 2-octylphenol Chemical compound CCCCCCCCC1=CC=CC=C1O DUIOKRXOKLLURE-UHFFFAOYSA-N 0.000 claims abstract description 19
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 claims abstract description 19
- 239000012752 auxiliary agent Substances 0.000 claims abstract description 19
- 239000010445 mica Substances 0.000 claims abstract description 19
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 19
- 229940051841 polyoxyethylene ether Drugs 0.000 claims abstract description 19
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- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 claims abstract description 19
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- 239000000377 silicon dioxide Substances 0.000 claims abstract description 19
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- 239000007822 coupling agent Substances 0.000 claims abstract description 18
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 claims abstract description 18
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- 229910001928 zirconium oxide Inorganic materials 0.000 claims abstract description 18
- 239000002994 raw material Substances 0.000 claims abstract description 12
- 229910052726 zirconium Inorganic materials 0.000 claims abstract description 12
- -1 zirconium ester Chemical class 0.000 claims abstract description 11
- 238000007731 hot pressing Methods 0.000 claims description 28
- 238000010792 warming Methods 0.000 claims description 21
- 238000001816 cooling Methods 0.000 claims description 15
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- 210000001161 mammalian embryo Anatomy 0.000 claims description 7
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- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 claims 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims 1
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- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
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- WRXCBRHBHGNNQA-UHFFFAOYSA-N (2,4-dichlorobenzoyl) 2,4-dichlorobenzenecarboperoxoate Chemical compound ClC1=CC(Cl)=CC=C1C(=O)OOC(=O)C1=CC=C(Cl)C=C1Cl WRXCBRHBHGNNQA-UHFFFAOYSA-N 0.000 description 1
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- NIPNSKYNPDTRPC-UHFFFAOYSA-N N-[2-oxo-2-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)ethyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 NIPNSKYNPDTRPC-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
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- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
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- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
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- 229910000077 silane Inorganic materials 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
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Abstract
本发明公开了一种高导热绝缘陶瓷,包括以下按照重量份的原料:云母粉30‑50份、钛白粉20‑30份、氧化铝30‑50份、氧化锆10‑20份、碳化硅5‑10份、二氧化硅10‑20份、玻璃纤维4‑8份、氮化硅晶须3‑6份、石墨烯6‑12份、2,4‑二氯过氧化苯甲酰2‑4份、辛基酚聚氧乙烯醚3‑5份、二氨基二苯砜3‑6份、硅烷偶联剂1‑2份、锆酸酯偶联剂2‑4份、助剂4‑8份。本发明还公开了所述高导热绝缘陶瓷的制备方法。本发明制备的陶瓷在各种原料的共同配合作用下,具有良好的导热性能,将本发明制备的陶瓷应用于电子产品中,有利于电子产品散热。
Description
技术领域
本发明涉及陶瓷技术领域,具体是一种高导热绝缘陶瓷及其制备方法。
背景技术
陶瓷有着古老的历史,早在公元前十世纪,人类就开始制备陶瓷,陶瓷具有强度大、硬度高、不怕化学腐蚀等优点。现在,陶瓷已经广泛用来制作剪刀、螺丝刀、鎯头、锯、斧头等日用工具,其坚硬程度已经超过钢铁制品,而且,还不会带铁锈味和磁性,更适宜切生吃食物和熟食,以及用于剪接磁带等带有磁性物质的制品;陶瓷的绝缘性能好,耐磨耐腐蚀,在电子产品中同样开始应用。
陶瓷虽然性能优异,但依旧存在一定的缺陷性,陶瓷产品的导热性不如金属,散热能力一般,在电子产品中,电子线路的集成度越来越高,芯片期间运行中产生的热量难以释放,热量的聚集会影响器件的工作稳定性,缩短其寿命,因此如何使电子器件有效快速散热成为关键的问题,提高陶瓷的导热散热能力有助于陶瓷在电子产品中的应用。
发明内容
本发明的目的在于提供一种高导热绝缘陶瓷,以解决上述背景技术中提出的问题。
为实现上述目的,本发明提供如下技术方案:
一种高导热绝缘陶瓷,云母粉30-50份、钛白粉20-30份、氧化铝30-50份、氧化锆10-20份、碳化硅5-10份、二氧化硅10-20份、玻璃纤维4-8份、氮化硅晶须3-6份、石墨烯6-12份、2,4-二氯过氧化苯甲酰2-4份、辛基酚聚氧乙烯醚3-5份、二氨基二苯砜3-6份、硅烷偶联剂1-2份、锆酸酯偶联剂2-4份、助剂4-8份。
作为本发明进一步的方案:云母粉35-45份、钛白粉22-28份、氧化铝35-45份、氧化锆12-18份、碳化硅6-9份、二氧化硅12-18份、玻璃纤维5-7份、氮化硅晶须4-5份、石墨烯8-10份、2,4-二氯过氧化苯甲酰2.5-3.5份、辛基酚聚氧乙烯醚3.5-4.5份、二氨基二苯砜4-5份、硅烷偶联剂1.2-1.8份、锆酸酯偶联剂2.5-3.5份、助剂5-7份。
作为本发明再进一步的方案:云母粉40份、钛白粉25份、氧化铝40份、氧化锆15份、碳化硅8份、二氧化硅15份、玻璃纤维6份、氮化硅晶须4.5份、石墨烯9份、2,4-二氯过氧化苯甲酰3份、辛基酚聚氧乙烯醚4份、二氨基二苯砜4.5份、硅烷偶联剂1.5份、锆酸酯偶联剂3份、助剂6份。
作为本发明再进一步的方案:所述玻璃纤维直径为5-10μm,长度为3-5mm。
作为本发明再进一步的方案:所述氮化硅晶须直径为3-5μm,长度为6-8mm。
所述高导热绝缘陶瓷的制备方法,步骤如下:
1)将云母粉、钛白粉、氧化铝、氧化锆、碳化硅、二氧化硅分别粉碎后过200-300目筛,混合均匀,加入2,4-二氯过氧化苯甲酰、辛基酚聚氧乙烯醚、二氨基二苯砜,再加入总重量1-2倍的去离子水,以湿法球磨的方式混磨均匀得到浆料;
2)向步骤1)获得的浆料中加入玻璃纤维、氮化硅晶须、石墨烯、硅烷偶联剂、锆酸酯偶联剂、助剂,以300-500r/min转速搅拌10-15min,完成后升温至80-100℃,以20-30KHz的频率进行超声处理20-30min,获得混合浆料;
3)将步骤2)获得的混合浆料注入热压模具中进行热压,热压压力为200-300kgf/cm2,热压温度为120-150℃,排气8-10次后取出,冷却,获得成型料;
4)将步骤3)获得的陶瓷胚料在20-30min内从室温升温至130-150℃,保温10-20min,然后在1-1.2h内升温至200-220℃,保温50-60min,再在2-2.5h内升温至1000-1200℃,保温1.2-1.5h,出料,冷却,即可。
上述陶瓷在电子产品中的应用。
与现有技术相比,本发明的有益效果是:
本发明制备的陶瓷在各种原料的共同配合作用下,具有良好的导热性能,将本发明制备的陶瓷应用于电子产品中,有利于电子产品散热,提高电子产品的性能和寿命;而且本发明制备的陶瓷具有较好强度和绝缘性能,能够对电子元件进行有效的保护,防止漏电或电击穿。
具体实施方式
下面将结合本发明实施例,对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。
实施例1
一种高导热绝缘陶瓷,包括以下按照重量份的原料:云母粉30份、钛白粉20份、氧化铝30份、氧化锆10份、碳化硅5份、二氧化硅10份、玻璃纤维4份、氮化硅晶须3份、石墨烯6份、2,4-二氯过氧化苯甲酰2份、辛基酚聚氧乙烯醚3份、二氨基二苯砜3份、硅烷偶联剂1份、锆酸酯偶联剂2份、助剂4份。
其中,所述玻璃纤维直径为5μm,长度为3mm。
其中,所述氮化硅晶须直径为3μm,长度为6mm。
本实施例中,所述高导热绝缘陶瓷的制备方法,步骤如下:
1)将云母粉、钛白粉、氧化铝、氧化锆、碳化硅、二氧化硅分别粉碎后过200目筛,混合均匀,加入2,4-二氯过氧化苯甲酰、辛基酚聚氧乙烯醚、二氨基二苯砜,再加入总重量1倍的去离子水,以湿法球磨的方式混磨均匀得到浆料;
2)向步骤1)获得的浆料中加入玻璃纤维、氮化硅晶须、石墨烯、硅烷偶联剂、锆酸酯偶联剂、助剂,以300r/min转速搅拌10min,完成后升温至80℃,以20-30KHz的频率进行超声处理20min,获得混合浆料;
3)将步骤2)获得的混合浆料注入热压模具中进行热压,热压压力为200kgf/cm2,热压温度为120℃,排气8次后取出,冷却,获得成型料;
4)将步骤3)获得的陶瓷胚料在20min内从室温升温至130℃,保温10min,然后在1h内升温至200℃,保温50min,再在2h内升温至1000℃,保温1.2h,出料,冷却,即可。
实施例2
一种高导热绝缘陶瓷,包括以下按照重量份的原料:云母粉35份、钛白粉22份、氧化铝35份、氧化锆12份、碳化硅6份、二氧化硅12份、玻璃纤维5份、氮化硅晶须4份、石墨烯8份、2,4-二氯过氧化苯甲酰3.5份、辛基酚聚氧乙烯醚4.5份、二氨基二苯砜5份、硅烷偶联剂1.8份、锆酸酯偶联剂3.5份、助剂7份。
其中,所述玻璃纤维直径为8μm,长度为4mm。
其中,所述氮化硅晶须直径为4μm,长度为7mm。
本实施例中,所述高导热绝缘陶瓷的制备方法,步骤如下:
1)将云母粉、钛白粉、氧化铝、氧化锆、碳化硅、二氧化硅分别粉碎后过260目筛,混合均匀,加入2,4-二氯过氧化苯甲酰、辛基酚聚氧乙烯醚、二氨基二苯砜,再加入总重量1.5倍的去离子水,以湿法球磨的方式混磨均匀得到浆料;
2)向步骤1)获得的浆料中加入玻璃纤维、氮化硅晶须、石墨烯、硅烷偶联剂、锆酸酯偶联剂、助剂,以400r/min转速搅拌12min,完成后升温至90℃,以25KHz的频率进行超声处理25min,获得混合浆料;
3)将步骤2)获得的混合浆料注入热压模具中进行热压,热压压力为250kgf/cm2,热压温度为135℃,排气9次后取出,冷却,获得成型料;
4)将步骤3)获得的陶瓷胚料在25min内从室温升温至140℃,保温15min,然后在1.1h内升温至210℃,保温50-60min,再在2.2h内升温至1100℃,保温1.4h,出料,冷却,即可。
实施例3
一种高导热绝缘陶瓷,包括以下按照重量份的原料:云母粉40份、钛白粉25份、氧化铝40份、氧化锆15份、碳化硅8份、二氧化硅15份、玻璃纤维6份、氮化硅晶须4.5份、石墨烯9份、2,4-二氯过氧化苯甲酰3份、辛基酚聚氧乙烯醚4份、二氨基二苯砜4.5份、硅烷偶联剂1.5份、锆酸酯偶联剂3份、助剂6份。
其中,所述玻璃纤维直径为8μm,长度为4mm。
其中,所述氮化硅晶须直径为4μm,长度为7mm。
本实施例中,所述高导热绝缘陶瓷的制备方法,步骤如下:
1)将云母粉、钛白粉、氧化铝、氧化锆、碳化硅、二氧化硅分别粉碎后过260目筛,混合均匀,加入2,4-二氯过氧化苯甲酰、辛基酚聚氧乙烯醚、二氨基二苯砜,再加入总重量1.5倍的去离子水,以湿法球磨的方式混磨均匀得到浆料;
2)向步骤1)获得的浆料中加入玻璃纤维、氮化硅晶须、石墨烯、硅烷偶联剂、锆酸酯偶联剂、助剂,以400r/min转速搅拌12min,完成后升温至90℃,以25KHz的频率进行超声处理25min,获得混合浆料;
3)将步骤2)获得的混合浆料注入热压模具中进行热压,热压压力为250kgf/cm2,热压温度为135℃,排气9次后取出,冷却,获得成型料;
4)将步骤3)获得的陶瓷胚料在25min内从室温升温至140℃,保温15min,然后在1.1h内升温至210℃,保温50-60min,再在2.2h内升温至1100℃,保温1.4h,出料,冷却,即可。
实施例4
一种高导热绝缘陶瓷,包括以下按照重量份的原料:云母粉45份、钛白粉28份、氧化铝45份、氧化锆18份、碳化硅9份、二氧化硅18份、玻璃纤维7份、氮化硅晶须5份、石墨烯10份、2,4-二氯过氧化苯甲酰2.5份、辛基酚聚氧乙烯醚3.5份、二氨基二苯砜4份、硅烷偶联剂1.2份、锆酸酯偶联剂2.5份、助剂5份。
其中,所述玻璃纤维直径为8μm,长度为4mm。
其中,所述氮化硅晶须直径为4μm,长度为7mm。
本实施例中,所述高导热绝缘陶瓷的制备方法,步骤如下:
1)将云母粉、钛白粉、氧化铝、氧化锆、碳化硅、二氧化硅分别粉碎后过260目筛,混合均匀,加入2,4-二氯过氧化苯甲酰、辛基酚聚氧乙烯醚、二氨基二苯砜,再加入总重量1.5倍的去离子水,以湿法球磨的方式混磨均匀得到浆料;
2)向步骤1)获得的浆料中加入玻璃纤维、氮化硅晶须、石墨烯、硅烷偶联剂、锆酸酯偶联剂、助剂,以400r/min转速搅拌12min,完成后升温至90℃,以25KHz的频率进行超声处理25min,获得混合浆料;
3)将步骤2)获得的混合浆料注入热压模具中进行热压,热压压力为250kgf/cm2,热压温度为135℃,排气9次后取出,冷却,获得成型料;
4)将步骤3)获得的陶瓷胚料在25min内从室温升温至140℃,保温15min,然后在1.1h内升温至210℃,保温50-60min,再在2.2h内升温至1100℃,保温1.4h,出料,冷却,即可。
实施例5
一种高导热绝缘陶瓷,包括以下按照重量份的原料:云母粉50份、钛白粉30份、氧化铝50份、氧化锆20份、碳化硅10份、二氧化硅20份、玻璃纤维8份、氮化硅晶须6份、石墨烯12份、2,4-二氯过氧化苯甲酰4份、辛基酚聚氧乙烯醚5份、二氨基二苯砜6份、硅烷偶联剂2份、锆酸酯偶联剂4份、助剂8份。
其中,所述玻璃纤维直径为10μm,长度为5mm。
其中,所述氮化硅晶须直径为5μm,长度为8mm。
本实施例中,所述高导热绝缘陶瓷的制备方法,步骤如下:
1)将云母粉、钛白粉、氧化铝、氧化锆、碳化硅、二氧化硅分别粉碎后过300目筛,混合均匀,加入2,4-二氯过氧化苯甲酰、辛基酚聚氧乙烯醚、二氨基二苯砜,再加入总重量2倍的去离子水,以湿法球磨的方式混磨均匀得到浆料;
2)向步骤1)获得的浆料中加入玻璃纤维、氮化硅晶须、石墨烯、硅烷偶联剂、锆酸酯偶联剂、助剂,以500r/min转速搅拌15min,完成后升温至100℃,以30KHz的频率进行超声处理30min,获得混合浆料;
3)将步骤2)获得的混合浆料注入热压模具中进行热压,热压压力为300kgf/cm2,热压温度为150℃,排气10次后取出,冷却,获得成型料;
4)将步骤3)获得的陶瓷胚料在30min内从室温升温至150℃,保温20min,然后在1.2h内升温至220℃,保温60min,再在2-2.5h内升温至1200℃,保温1.5h,出料,冷却,即可。
对比例1
与实施例3相比,不含氮化硅晶须和石墨烯,其他与实施例3相同。
对比例2
与实施例3相比,不含二氨基二苯砜和2,4-二氯过氧化苯甲酰,其他与实施例3相同。
对比例3
与实施例3相比,不含氮化硅晶须、石墨烯、2,4-二氯过氧化苯甲酰和二氨基二苯砜,其他与实施例3相同。
对实施例1-5及对比例1-3所制备的陶瓷进行性能测试,测试结果如表1所示。
表1
从以上结果中可以看出,本发明制备的陶瓷在各种原料的共同配合作用下,具有良好的导热性能,将本发明制备的陶瓷应用于电子产品中,有利于电子产品散热,提高电子产品的性能和寿命;而且本发明制备的陶瓷具有较好强度和绝缘性能,能够对电子元件进行有效的保护,防止漏电或电击穿。
对于本领域技术人员而言,显然本发明不限于上述示范性实施例的细节,而且在不背离本发明的精神或基本特征的情况下,能够以其他的具体形式实现本发明。因此,无论从哪一点来看,均应将实施例看作是示范性的,而且是非限制性的,本发明的范围由所附权利要求而不是上述说明限定,因此旨在将落在权利要求的等同要件的含义和范围内的所有变化囊括在本发明内。
此外,应当理解,虽然本说明书按照实施方式加以描述,但并非每个实施方式仅包含一个独立的技术方案,说明书的这种叙述方式仅仅是为清楚起见,本领域技术人员应当将说明书作为一个整体,各实施例中的技术方案也可以经适当组合,形成本领域技术人员可以理解的其他实施方式。
Claims (7)
1.一种高导热绝缘陶瓷,其特征在于,包括以下按照重量份的原料:云母粉30-50份、钛白粉20-30份、氧化铝30-50份、氧化锆10-20份、碳化硅5-10份、二氧化硅10-20份、玻璃纤维4-8份、氮化硅晶须3-6份、石墨烯6-12份、2,4-二氯过氧化苯甲酰2-4份、辛基酚聚氧乙烯醚3-5份、二氨基二苯砜3-6份、硅烷偶联剂1-2份、锆酸酯偶联剂2-4份、助剂4-8份。
2.根据权利要求1所述的高导热绝缘陶瓷,其特征在于,包括以下按照重量份的原料:云母粉35-45份、钛白粉22-28份、氧化铝35-45份、氧化锆12-18份、碳化硅6-9份、二氧化硅12-18份、玻璃纤维5-7份、氮化硅晶须4-5份、石墨烯8-10份、2,4-二氯过氧化苯甲酰2.5-3.5份、辛基酚聚氧乙烯醚3.5-4.5份、二氨基二苯砜4-5份、硅烷偶联剂1.2-1.8份、锆酸酯偶联剂2.5-3.5份、助剂5-7份。
3.根据权利要求2所述的高导热绝缘陶瓷,其特征在于,包括以下按照重量份的原料:云母粉40份、钛白粉25份、氧化铝40份、氧化锆15份、碳化硅8份、二氧化硅15份、玻璃纤维6份、氮化硅晶须4.5份、石墨烯9份、2,4-二氯过氧化苯甲酰3份、辛基酚聚氧乙烯醚4份、二氨基二苯砜4.5份、硅烷偶联剂1.5份、锆酸酯偶联剂3份、助剂6份。
4.根据权利要求1所述的高导热绝缘陶瓷,其特征在于,所述玻璃纤维直径为5-10μm,长度为3-5mm。
5.根据权利要求4所述的高导热绝缘陶瓷,其特征在于,所述氮化硅晶须直径为3-5μm,长度为6-8mm。
6.一种如权利要求1-5任一所述的高导热绝缘陶瓷的制备方法,其特征在于,包括以下步骤:
1)将云母粉、钛白粉、氧化铝、氧化锆、碳化硅、二氧化硅分别粉碎后过200-300目筛,混合均匀,加入2,4-二氯过氧化苯甲酰、辛基酚聚氧乙烯醚、二氨基二苯砜,再加入总重量1-2倍的去离子水,以湿法球磨的方式混磨均匀得到浆料;
2)向步骤1)获得的浆料中加入玻璃纤维、氮化硅晶须、石墨烯、硅烷偶联剂、锆酸酯偶联剂、助剂,以300-500r/min转速搅拌10-15min,完成后升温至80-100℃,以20-30KHz的频率进行超声处理20-30min,获得混合浆料;
3)将步骤2)获得的混合浆料注入热压模具中进行热压,热压压力为200-300kgf/cm2,热压温度为120-150℃,排气8-10次后取出,冷却,获得成型料;
4)将步骤3)获得的陶瓷胚料在20-30min内从室温升温至130-150℃,保温10-20min,然后在1-1.2h内升温至200-220℃,保温50-60min,再在2-2.5h内升温至1000-1200℃,保温1.2-1.5h,出料,冷却,即可。
7.一种如权利要求1-5任一所述的陶瓷在电子产品中的应用。
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Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
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CN111775132A (zh) * | 2020-07-14 | 2020-10-16 | 广州百畅信息科技有限公司 | 一种磁力履带式通信塔设备维修攀爬机器人 |
CN116903955A (zh) * | 2023-07-28 | 2023-10-20 | 金发科技股份有限公司 | 一种聚烯烃组合物及其制备方法和应用 |
CN117550906A (zh) * | 2023-11-13 | 2024-02-13 | 广东电安新材料科技有限公司 | 一种高强度绝缘陶瓷及其制备方法和应用 |
CN117550906B (zh) * | 2023-11-13 | 2024-05-07 | 广东电安新材料科技有限公司 | 一种高强度绝缘陶瓷及其制备方法和应用 |
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