CN109082548A - A kind of Cu-Ni system powder sintering process - Google Patents
A kind of Cu-Ni system powder sintering process Download PDFInfo
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- CN109082548A CN109082548A CN201810770349.1A CN201810770349A CN109082548A CN 109082548 A CN109082548 A CN 109082548A CN 201810770349 A CN201810770349 A CN 201810770349A CN 109082548 A CN109082548 A CN 109082548A
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- powder
- sintering
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- sintering process
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0425—Copper-based alloys
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
- B22F3/10—Sintering only
- B22F3/1017—Multiple heating or additional steps
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/04—Making non-ferrous alloys by powder metallurgy
- C22C1/0433—Nickel- or cobalt-based alloys
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C19/00—Alloys based on nickel or cobalt
- C22C19/002—Alloys based on nickel or cobalt with copper as the next major constituent
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/06—Alloys based on copper with nickel or cobalt as the next major constituent
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a kind of new Cu-Ni system powder sintering process, and its step are as follows: (1) ingredient: according to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.2-0.5 parts of Sm powder, 0.1-0.4 Co powder；(2) it suppresses: 100-220N compacting；(3) it is sintered: one-stage sintering: 500 DEG C of -3h；Bis sintering: 800 DEG C of -2h；Three-stage sintering: 300 DEG C of -1-2h.The present invention provides a kind of new Cu-Ni system powder sintering process, and by the way that a small amount of Sm is added, Co powder cooperates multistage pressure process, can form the alloy of high rigidity, energy conservation and environmental protection under less high pressure, the sintering of short period.
Description
Technical field
The present invention relates to a kind of Cu-Ni system powder sintering process, belong to powder metallurgical technology.
Background technique
Powder metallurgy is to produce metal powder or made with metal powder (or mixture of metal powder and non-metal powder)
For raw material, by shaping and being sintered, the technology of manufacture metal material, composite material and various types product.Powder smelting
Jin Fayu production ceramics have similar place, belong to sintered powder technique, therefore, a series of New Technologies In Powder Metallu Rgies also can be used
In the preparation of ceramic material.The advantages of due to PM technique, it has become the key for solving the problems, such as new material, in new material
Development in play very important effect.
Powder metallurgy includes powder processed and product.Wherein powder processed be mainly metallurgical process and it is literal coincide.And powder metallurgy system
Technology of the product then often far beyond the scope of material and metallurgy, often across multidisciplinary (material and metallurgy, mechanical and mechanics etc.).
Especially contemporary metal powder 3D printing collects mechanical engineering, CAD, reverse Engineering Technology, Layered Manufacturing Technology, Numeric Control Technology, material
Science, laser technology so that sintered metal product technology becomes across more multi-disciplinary modern complex art.
Cu powder and Ni powder can form single-phase Cu-Ni solid solution during forming and solid-phase sintering, through diffusion
Tissue.Pressing process is one of the important stage in metallurgy forming process for powder, and different pressing parameters is selected in pressing process
The sintering result of mixed powder can be had an important influence on, and pressing pressure is the key factor of pressing process.The prior art is
Disclosed, powder forms many holes due to arch bridge effect in the case where pine dress between particle.After applying pressure, powder
End is subjected to displacement first, and particle produces relative sliding, and some holes are filled.After particle reaches most close accumulation, into
The densification of one step is then realized by the deformation of powder particle.Therefore, small pressure can only make particle occur relative displacement and
Small deformation, the green compact consistency obtained at this time are smaller;With the increase of pressure, powder generates plastic deformation, fracture, hole
In air be extruded, green compact porosity reduces, and consistency increases considerably.In addition, increase pressure, drawing hardening effect
Significantly, green compact hardness increases.Cu powder and Ni powder increase pressing pressure during forming and solid-phase sintering, and powder connects
Touching interface is increased, and the formation of Cu-Ni single phase solid solution body tissue is conducive to.With the increase of pressing pressure, Cu-Ni is single-phase solid
Solution tissue gradually forms, and the consistency and hardness of Cu powder and Ni powder green compact and sintered body are also all in increase tendency.
The present invention is intended to provide a kind of new Cu-Ni system powder sintering process, by the way that a small amount of Sm, Co powder, cooperation is added
Multistage sintering process can form the alloy of high rigidity under less high pressure.
Summary of the invention
The object of the present invention is to provide a kind of new Cu-Ni system powder sintering process, by being added a small amount of Sm, Co powder,
Cooperate multistage pressure process, the alloy of high rigidity, energy-saving ring can be formed under less high pressure, the sintering of short period
It protects.
The present invention is implemented as follows:
A kind of new Cu-Ni system powder sintering process, its step are as follows:
(1) ingredient:
According to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.2-0.5 parts of Sm powder, 0.1-0.4 Co powder；
(2) it suppresses:
100-220N compacting；
(3) it is sintered:
One-stage sintering: 500 DEG C of -3h；
Bis sintering: 800 DEG C of -2h；
Three-stage sintering: 300 DEG C of -1-2h.
Advantages of the present invention:
The present invention provides a kind of new Cu-Ni system powder sintering process, and by the way that a small amount of Sm is added, Co powder cooperates multistage pressure
Technique can form the alloy of high rigidity, energy conservation and environmental protection under less high pressure, the sintering of short period.
Specific embodiment
The embodiment of the present invention is described below in detail, described the examples are only for explaining the invention, and should not be understood as pair
Limitation of the invention.
Embodiment 1
A kind of new Cu-Ni system powder sintering process, its step are as follows:
(1) ingredient:
According to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.2 part of Sm powder, 0.1 Co powder；
(2) it suppresses:
100 compactings；
(3) it is sintered:
One-stage sintering: 500 DEG C of -3h；
Bis sintering: 800 DEG C of -2h；
Three-stage sintering: 300 DEG C of -1h.
As a result: electricity obtains single phase solid solution body tissue under the microscope.
Vickers hardness is 93.
Embodiment 2
A kind of new Cu-Ni system powder sintering process, its step are as follows:
(1) ingredient:
According to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.5 part of Sm powder, 0.4 Co powder；
(2) it suppresses:
220N compacting；
(3) it is sintered:
One-stage sintering: 500 DEG C of -3h；
Bis sintering: 800 DEG C of -2h；
Three-stage sintering: 300 DEG C of -2h.
As a result: electricity obtains single phase solid solution body tissue under the microscope.
Vickers hardness is 95.
Embodiment 3
A kind of new Cu-Ni system powder sintering process, its step are as follows:
(1) ingredient:
According to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.3 part of Sm powder, 0.3 Co powder；
(2) it suppresses:
160N compacting；
(3) it is sintered:
One-stage sintering: 500 DEG C of -3h；
Bis sintering: 800 DEG C of -2h；
Three-stage sintering: 300 DEG C of -1.5h.
As a result: electricity obtains single phase solid solution body tissue under the microscope.
Vickers hardness is 102.
Embodiment 4
A kind of new Cu-Ni system powder sintering process, its step are as follows:
(1) ingredient:
According to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.2-0.5 parts of Sm powder, 0.1-0.4 Co powder；
(2) it suppresses:
100-220N compacting；
(3) it is sintered:
One-stage sintering: 500 DEG C of -3h；
Bis sintering: 800 DEG C of -2h；
Three-stage sintering: 300 DEG C of -1-2h.
As a result: electricity obtains single phase solid solution body tissue, Vickers hardness 90-102 under the microscope.
Embodiment 5
A kind of new Cu-Ni system powder sintering process, its step are as follows:
(1) ingredient:
According to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.4 part of Sm powder, 0.2Co powder；
(2) it suppresses:
170N compacting；
(3) it is sintered:
One-stage sintering: 500 DEG C of -3h；
Bis sintering: 800 DEG C of -2h；
Three-stage sintering: 300 DEG C of -1.2h.
As a result: electricity obtains single phase solid solution body tissue under the microscope.
Vickers hardness is 94.
Embodiment 6
A kind of new Cu-Ni system powder sintering process, its step are as follows:
(1) ingredient:
According to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.4 part of Sm powder, 0.1 Co powder；
(2) it suppresses:
190N compacting；
(3) it is sintered:
One-stage sintering: 500 DEG C of -3h；
Bis sintering: 800 DEG C of -2h；
Three-stage sintering: 300 DEG C of -1.5h.
As a result: electricity obtains single phase solid solution body tissue under the microscope.
Vickers hardness is 97.
As it can be seen that the present invention provides a kind of new Cu-Ni system powder sintering process, by the way that a small amount of Sm is added, Co powder is matched
Multistage pressure process is closed, the alloy of high rigidity, energy conservation and environmental protection can be formed under less high pressure, the sintering of short period.
In the description of this specification, reference term " one embodiment ", " some embodiments ", " example ", " specifically show
The description of example " or " some examples " etc. means specific features, structure, material or spy described in conjunction with this embodiment or example
Point is included at least one embodiment or example of the invention.In the present specification, schematic expression of the above terms are not
Centainly refer to identical embodiment or example.Moreover, particular features, structures, materials, or characteristics described can be any
One or more embodiment or examples in can be combined in any suitable manner.
Although an embodiment of the present invention has been shown and described, it will be understood by those skilled in the art that: not
A variety of change, modification, replacement and modification can be carried out to these embodiments in the case where being detached from the principle of the present invention and objective, this
The range of invention is defined by the claims and their equivalents.
Claims (3)
1. a kind of new Cu-Ni system powder sintering method, its step are as follows:
(1) ingredient:
According to parts by weight, 50 parts of Cu powder, 50 parts of Ni powder, 0.2-0.5 parts of Sm powder, 0.1-0.4 Co powder；
(2) it suppresses:
100-220N compacting；
(3) it is sintered:
Multistage sintering.
2. method described in claim 1, it is characterised in that:
One-stage sintering: 500 DEG C of -3h；
Bis sintering: 800 DEG C of -2h；
Three-stage sintering: 300 DEG C of -1-2h.
3. the alloy that method claimed in claims 1-2 is prepared.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810770349.1A CN109082548A (en) | 2018-07-13 | 2018-07-13 | A kind of Cu-Ni system powder sintering process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810770349.1A CN109082548A (en) | 2018-07-13 | 2018-07-13 | A kind of Cu-Ni system powder sintering process |
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| Publication Number | Publication Date |
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| CN109082548A true CN109082548A (en) | 2018-12-25 |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08264860A (en) * | 1995-03-22 | 1996-10-11 | Kazuaki Fukamichi | Particle-dispersed magnetoresistive material, method for manufacturing the same, and magnetoresistive element |
| CN101780543A (en) * | 2009-09-02 | 2010-07-21 | 兰州理工大学 | Copper-based powder sintered diamond composite material and preparation method thereof |
| CN101880791A (en) * | 2010-06-04 | 2010-11-10 | 北京工业大学 | A kind of Cu-based alloy base strip for coated conductor and preparation method thereof |
| CN102031414A (en) * | 2010-12-10 | 2011-04-27 | 西安理工大学 | Method for preparing fine grain CuNi45 alloy wires |
| CN102888528A (en) * | 2012-09-21 | 2013-01-23 | 厦门火炬特种金属材料有限公司 | Graphite-containing packfong alloy easy for cutting and preparation technology thereof |
-
2018
- 2018-07-13 CN CN201810770349.1A patent/CN109082548A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08264860A (en) * | 1995-03-22 | 1996-10-11 | Kazuaki Fukamichi | Particle-dispersed magnetoresistive material, method for manufacturing the same, and magnetoresistive element |
| CN101780543A (en) * | 2009-09-02 | 2010-07-21 | 兰州理工大学 | Copper-based powder sintered diamond composite material and preparation method thereof |
| CN101880791A (en) * | 2010-06-04 | 2010-11-10 | 北京工业大学 | A kind of Cu-based alloy base strip for coated conductor and preparation method thereof |
| CN102031414A (en) * | 2010-12-10 | 2011-04-27 | 西安理工大学 | Method for preparing fine grain CuNi45 alloy wires |
| CN102888528A (en) * | 2012-09-21 | 2013-01-23 | 厦门火炬特种金属材料有限公司 | Graphite-containing packfong alloy easy for cutting and preparation technology thereof |
Non-Patent Citations (1)
| Title |
|---|
| B.N. MONDAL等: "Magnetic behavior of nanocrystalline Cu-Ni-Co alloys prepared by mechanical alloying and isothermal annealing", 《JOURNAL OF ALLOYS AND COMPOUNDS》 * |
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