CN109065482A - A kind of die grading mechanism and its die grading method - Google Patents
A kind of die grading mechanism and its die grading method Download PDFInfo
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- CN109065482A CN109065482A CN201810904625.9A CN201810904625A CN109065482A CN 109065482 A CN109065482 A CN 109065482A CN 201810904625 A CN201810904625 A CN 201810904625A CN 109065482 A CN109065482 A CN 109065482A
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 230000007246 mechanism Effects 0.000 title claims abstract description 24
- 239000000853 adhesive Substances 0.000 claims abstract description 36
- 230000001070 adhesive effect Effects 0.000 claims abstract description 36
- 230000008569 process Effects 0.000 claims abstract description 26
- 238000001514 detection method Methods 0.000 claims description 8
- 238000001179 sorption measurement Methods 0.000 claims description 7
- 230000009471 action Effects 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 5
- 239000000126 substance Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 5
- 230000008520 organization Effects 0.000 abstract description 3
- 239000000463 material Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 4
- 238000013507 mapping Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000008707 rearrangement Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
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- 238000007599 discharging Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
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- 238000012423 maintenance Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010408 sweeping Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H01L33/00—
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The present invention relates to a kind of die grading mechanism and its die grading methods.A kind of die grading mechanism, including sorting frame, and the adhesive holder set on sorting frame side；Sorting is provided with through-hole；Through-hole is for the fixed wafer film for being pasted with chip；The side that sorting frame is distal to adhesive holder is equipped with sorting thimble；Adhesive holder is equipped with for attaching the empty film for being sorted chip；Wafer film is oppositely arranged with empty film, and opposite face is equipped with the adhered layer of fixed chip.It sorts thimble to reset chip onto empty film, chip can settle at one go, it is not easy to it drops off, puts neatly, avoid picking and placing and expect that suction nozzle scratches chip, it is easy to maintain.The present invention simplifies the internal structure of an organization, and reduces process flow, improves efficiency, and reduces production cost.
Description
Technical field
The present invention relates to LED production equipments, more specifically refer to a kind of die grading mechanism and its die grading method.
Background technique
Currently, die grading equipment when sorting chip, by the suction nozzle on swing arm fetching device, draws the core on diaphragm
Piece, swing arm couple with servo motor, then the servo motor by carrying rotates 180 °, and chip is transferred to reset on sky film and is put
It sets, completes the movement for picking classification, be as shown in Figure 1 original structure overall construction drawing.In the actual production process, suction nozzle is picked point
The process of class, is easy to appear: (1) chip drops off in transfer process on suction nozzle；(2) when resetting onto empty film, occur
Chip remains on suction nozzle, puts unsuccessfully；(3) when picking and placing material, suction nozzle or contact or the moment for being detached from chip scratch chip；
(4) suction nozzle is prone to wear, and chip volume is small, and the suction nozzle of loss is expanded or reduced as stomata, adsorbs the reduced capability of chip, needs frequency
Numerous replacement；(5) every replacement suction nozzle need to be aligned and be surveyed again high debugging to PP1 and PP2, and process is relatively complicated；(6) suction nozzle needs
Timing is wiped dirty, is safeguarded.It is necessary to consider that a kind of new mode removes sorting chip.
Summary of the invention
It is an object of the invention to overcome the deficiencies of existing technologies, a kind of die grading mechanism and its die grading side are provided
Method.
To achieve the above object, the invention adopts the following technical scheme:
A kind of die grading mechanism, including sorting frame, and the adhesive holder set on sorting frame side；The sorting is provided with logical
Hole；It is bordering on the side installing retaining ring of adhesive holder on the through-hole, expands brilliant ring for fixed；The brilliant ring of the expansion is for expanding and fixing
Wafer film to be sorted, wafer film can be described as disk, and it is die bond face, the back side is inviscid, and chip is fixed that disk front, which has viscosity,
In disk die bond face；Disk die bond face is oppositely arranged with adhesive holder；The side that the sorting frame is distal to adhesive holder is equipped with top
Needle cover, thimble lid center are equipped with sorting thimble；The adhesive holder is equipped with through-hole；The adhesive holder is for pasting empty film；The sky
Film front toughness, is die bond face, and the back side is inviscid；The sky film die bond face is for attaching the chip being sorted；The sky film
Die bond face is oppositely arranged with sorting frame；The sky film can be referred to as square piece after having attached the chip being sorted.
Its further technical solution are as follows: the retaining ring is equipped with notch, and notch two sides are consolidated with the both ends of the spring being equipped with respectively
Fixed connection, so that retaining ring is clamped by spring force expands brilliant ring；The sorting frame is bordering on incision equipped with clamping block.
Its further technical solution are as follows: the sorting thimble is set in the thimble lid center being equipped with；The thimble lid is set
There is the through-hole across sorting thimble.
Its further technical solution are as follows: the thimble lid and the vacuum generating device connection being equipped with；The thimble lid direction
It sorts frame one end and is equipped with several equally distributed adsorption holes of annular, so that thimble lid adsorbs disk, sorting thimble is carried on the back from disk
Face ejects chip.
Its further technical solution are as follows: the brilliant ring of the expansion includes outer ring and inner ring；The disk is fixed on inner ring and outer ring
Between；The inner ring periphery is equipped with groove；The lug boss to match with groove is equipped on the inside of the outer ring；The brilliant ring outer ring of the expansion
With inner ring clamping wafer centreless panel region；After the brilliant ring of the expansion expands disk, make the chip chamber on disk away from increase, and make to justify
Piece tensioning；The brilliant ring of the expansion is selected according to disk size；
Its further technical solution are as follows: the adhesive holder is distal to sorting frame side and is equipped with apical axis；The apical axis and sorting are pushed up
The corresponding setting of needle.
A kind of die grading method, including sorting process: disk to be sorted is fixed on sorting frame, and carrying is sorted core
The empty film of piece is pasted on adhesive holder, and is oppositely arranged with disk；It is located at the thimble lid of sorting frame side and is located at adhesive holder one
The apical axis of side moves toward one another, and thimble lid just touches disk or squeezes disk, and apical axis squeezes empty film, guarantee on disk currently to
Sort region and the smooth no relaxation in region of chip to be lifted on empty film of chip；Thimble lid center is directed at the core being sorted
Piece, apical axis and thimble lid are coaxial；Adjust the relative distance of disk and empty film；Thimble lid and vacuum generating device connection, pass through top
Disk is sucked in adsorption hole in needle cover, then sorts thimble and moves towards die bottom surface, and chip is ejected and is removed with disk；Core
Continue uniform motion forward after piece removing, chip is attached on sky film；Thimble lid and vacuum generating device disconnect, and sort thimble
It retracts, completes the sorting movement of single chip；Thimble lid and apical axis are moved to the next chip being sorted, and recycle the above work
Sequence sorts the chip on disk.
Its further technical solution are as follows: sorting process further include: sorting thimble is moved towards disk, and quickly pierces through circle
Piece；When sorting thimble pierces through disk and touches chip bottom, adjustment sorting thimble is with uniform motion, until chip is attached to
On empty film.
Its further technical solution are as follows: further include modeling process: before sorting chip, first passing through vision system and scan circle
The each chip of on piece records the information such as physical coordinates, tilt angle and its corresponding mechanical coordinate of each of which chip, and generates
Corresponding map；Wafer thickness and chip thickness size are measured by the detection piece being equipped with again, chip is adjusted according to test result
At a distance from empty film, distance is between 0.05mm-0.2mm.
Its further technical solution are as follows: further include pour mask process: after sorting because of disk into square piece, the front of chip is attached to
Square piece die bond face, and die bottom surface is upward；Pour mask is the bottom surface that chip in square piece is attached to the adhesive surface of a new empty film, is made
Die bottom surface and new empty film bond, then by the film stripping of square piece, so that chip is transferred on new empty film, and make chip
It just faces outwardly, process is simple and fast；After pour mask, then chip front side is detected.
Its further technical solution are as follows: the installation process of disk: the brilliant ring outer ring of the expansion and inner ring clamping wafer chipless
Region；After the brilliant ring of the expansion expands disk, make the chip chamber on disk away from increase, and be tensioned disk；The brilliant ring root of the expansion
It is selected according to disk size.
Compared with the prior art, the invention has the advantages that: the present invention is selected the chip on disk by sorting thimble
To square piece side, cancel existing swing arm fetching device, cancels suction nozzle absorption chip and retransfer the mode reset and placed, using top
Needle directly ejects chip, so that chip and disk are removed, while the mode of classification is completed in rearrangement to square piece.Thimble is sorted by core
Slice weight is discharged on sky film, and chip can settle at one go, it is not easy to be dropped off, be put neatly, avoid picking and placing material suction nozzle scratch chip, maintenance
It is convenient.The present invention simplifies the internal structure of an organization, and reduces process flow, improves efficiency, and reduces production cost.
The invention will be further described in the following with reference to the drawings and specific embodiments.
Detailed description of the invention
Fig. 1 is the sorting mechanism of the prior art；
Fig. 2 is a kind of three-dimensional structure diagram of die grading mechanism of the present invention；
Fig. 3 is a kind of sorting frame three-dimensional structure diagram of die grading mechanism of the present invention；
Fig. 4 is a kind of front view of the thimble lid of die grading mechanism of the present invention；
Fig. 5 is a kind of operation schematic diagram of die grading mechanism of the present invention；
Fig. 6 is a kind of expansion crystalline substance ring exploded view of die grading mechanism of the present invention；
Fig. 7 is the present invention a kind of the expansion crystalline substance ring mid section figure and partial enlarged view of die grading mechanism；
Fig. 8 is a kind of process flow chart of die grading method of the present invention；
Fig. 9 is a kind of structure chart of the retaining ring of die grading mechanism of the present invention.
Specific embodiment
In order to more fully understand technology contents of the invention, combined with specific embodiments below to technical solution of the present invention into
One step introduction and explanation, but not limited to this.
Such as the drawing that Fig. 1 to Fig. 9 is the embodiment of the present invention.
A kind of die grading mechanism, as shown in Figure 2 and Figure 5, including sorting frame 10, and the stickup set on sorting 10 side of frame
Frame 20.It sorts frame 10 and is equipped with through-hole 11, the side installing retaining ring 111 of adhesive holder 20 is bordering on through-hole 11, expand brilliant ring for fixed
15.Expand brilliant ring 15 for expanding and fixing wafer film to be sorted, wafer film can be described as disk 12；12 front of disk has viscous
Property, it is die bond face, the back side is inviscid, and chip is fixed on disk die bond face；12 die bond face of disk is oppositely arranged with adhesive holder 20.Point
The side for selecting frame 10 to be distal to adhesive holder 20 is equipped with thimble lid 14, and 14 center of thimble lid is equipped with sorting thimble 13.Adhesive holder 20 is equipped with
Through-hole, adhesive holder is for pasting empty film 22.Empty 22 front toughness of film, is die bond face, and the back side is inviscid.It uses in empty 22 die bond face of film
In the chip that attaching is sorted.Empty 22 die bond face of film is oppositely arranged with sorting frame 10.After empty film 22 has attached the chip being sorted
It can be referred to as square piece；
Disk 12 is uniformly attached to several chips, and chip is attached on disk 12 and forms border circular areas.
Blowpit 112 is provided on through-hole 11, convenient for brilliant ring 15 will be expanded from through-hole loading and unloading material.In the present embodiment, discharging
Slot 112 is the elongated hole of 11 two sides of through-hole.
As shown in Figure 4 and Figure 5, sorting thimble 13 is set in the thimble lid 14 being equipped with.Thimble lid 14 is equipped with across sorting
The through-hole 141 of thimble 13.Through-hole 141 and sorting thimble 13 are coaxially disposed, and are sorted thimble 13 and passed through under the action of force piece
Through-hole 141.
Thimble lid 14 and the vacuum generating device connection being equipped with.Thimble lid 14 is towards sorting 10 one end of frame equipped with several suctions
Attached hole 142.In the assorting room of chip, disk 12 is ejected about 0-2mm of distance by thimble lid 14, guarantees current carrying chip
The smooth no relaxation of 12 region area of disk.Preferably, disk 12 is ejected distance about 1mm by thimble lid 14.
Preferably, in order to which thimble lid 14 adsorbs uniformly disk 12, adsorption hole 142 is distributed in the periphery of through-hole 141.
As shown in figure 3, the edge of through-hole 11 is equipped with retaining ring 111.Disk 12 is fixed on the expansion crystalline substance ring 15 being equipped with.Expand brilliant ring
15 are fixedly clamped in retaining ring 111.
As shown in Figure 6 and Figure 7, expanding brilliant ring 15 includes outer ring 151 and inner ring 152.Disk 12 is fixed on inner ring 152 and outer ring
Between 151.
Wherein, 152 periphery of inner ring is equipped with groove 1521.The lug boss to match with groove 1521 is equipped on the inside of outer ring 151
1511.The outer rim of disk 12 is fixed between groove 1521 and lug boss 1511.
As shown in figure 9, retaining ring 111 is equipped with notch 113, and 113 two sides of notch are fixed with 114 both ends of spring being equipped with respectively
Connection, so that retaining ring 111 expands brilliant ring 15 by the way that spring force is fixed, while convenient for expanding brilliant ring installation and removal；The sorting frame
10 are bordering at notch 113 equipped with clamping block 115.Clamping block 115 is covered in the outside of notch 113, extends in through-hole 11, so that
Brilliant ring 15 is expanded in clamping.
As shown in figure 5, adhesive holder 20, which is distal to sorting 10 side of frame, is equipped with apical axis 21.Apical axis 21 is corresponding with sorting thimble 13
Setting.After sorting thimble 13 ejects chip, the sorting continuation of thimble 13 is moved forward, and then chip is attached on sky film 22,
In order to which chip bonds with empty film 22 stronger, sorting thimble 13 squeezes chip and sky film 22.In order to be sorted chip not
Thimble 13 damages by pressure, sorts thimble 13 and 21 end of apical axis is equipped with buffer unit, to protect chip.
Preferably, the tip diameter for sorting thimble 13 is 15-25 μm.
It wherein, as indicated with 2, further include apart from detection piece 30.Detection piece 30 for detect sorting frame 10 and adhesive holder 20 it
Between distance.Chip on disk 12 cannot be too close or too far at a distance from empty film 22, needs to keep suitable distance that can just have
Effect by die grading to empty film 22, distance is 0.05mm-0.2mm.
Wherein, empty film 22 is equipped with adhered layer towards sorting 10 one side of frame, and adhered layer is greater than disk to the viscous force of chip
12 viscous force to chip.
During die grading, the problematic chip of quality of 12 side of disk can be selected to empty film 22,
High-quality chip can also be selected to empty film 22.Equally, the chip of same class can also be selected to empty film 22,
Divide good class, is easy to use.
A kind of die grading method, including sorting process: disk 12 to be sorted is fixed on sorting frame 10, and carrying is divided
It selects the empty film 22 of chip to be pasted on adhesive holder 20, and is oppositely arranged with disk 12；It is located at the thimble lid 14 of sorting 10 side of frame
It is moved toward one another with the apical axis 21 for being located at 20 side of adhesive holder, thimble lid 14 just touches disk 12 or squeezes disk 12, is convenient for
Disk 12 is sucked in thimble lid 14, guarantees the currently smooth no relaxation in region of chip to be sorted on disk 12, convenient for the positioning of chip
And removing；Apical axis 21 also squeezes empty film 22 and is tensioned, and guarantees the smooth no relaxation in region of chip to be lifted on empty film 22, is convenient for core
The attaching and guarantee positioning accuracy of piece.14 center of thimble lid is directed at the chip being sorted, and apical axis 21 and thimble lid 14 are coaxial；Adjustment
The relative distance of chip and empty film 22 on disk 12, distance is 0.05mm-0.2mm.Thimble lid 14 and vacuum generating device
Disk 12 is sucked by the adsorption hole 142 on thimble lid 14 in connection, it is fixed, prevents from shifting, then sort 13 court of thimble
It moves to die bottom surface, chip is ejected and is removed with disk 12；Continue uniform motion forward after chip removing, in sorting thimble
13, under the action of apical axis 21, chip are attached on the die bond face of sky film 22；Thimble lid 14 and vacuum generating device disconnect, point
It selects thimble 13 to retract, completes the sorting movement of single chip；Thimble lid 14 and apical axis 21 are moved to the next chip being sorted,
The above process is recycled, the chip on disk is sorted.
Specifically, for the ease of adjusting the position of disk 12 and square piece 22, adhesive holder 20 is arranged to live with sorting frame 10
Dynamic form.Wherein, sorting frame 10 can move on X, Y, and adhesive holder 20 can be to move on X, Y, Z, rotate, so that adjustment disk
12 with the position of empty film 22.
Specifically, thimble lid 14 touches the trailing flank of disk 12 in chip sorting procedures, apical axis 21 touches sky film 22
Trailing flank, and eject the empty about 1mm of film 22, guarantee the smooth no relaxation of 12 region area of disk of current carrying chip.Sort frame
10 move under the action of force piece, and the chip center chosen is aligned to the center of sorting thimble 13 and thimble lid 14, meanwhile,
Corresponding adhesive holder 20 adjusts under the action of another force piece, and the coordinate points of the empty film 22 carried in advance are moved on to and sort thimble
13 concentric positions.Then, vacuum sending device is opened, and disk is uniformly sucked by the stomata of the annular spread on thimble lid 14
12, the sorting jack-up moment of thimble 13 pierced disk 12, and sorting 13 impact force of thimble greatly reduces after piercing through disk 12, and adjustment point
Select 13 speed of thimble with uniform motion.Thimble moves forward, and touches die bottom surface, and chip stress is ejected, removing circle
Piece 12.Meanwhile chip front side touches 22 die bond upper surface of sky film, empty 22 die bond mask toughness of film, chip is touched.Sorting
It is returned to after thimble 13 in thimble lid 14, closes the vacuum of thimble lid, force piece drives sorting frame 10 to be moved to next, another
Force piece drives adhesive holder 20 to be moved to next die bond position, completes the sorting movement of single chip, recycles the above process, point
Select the chip on wafer.
Sort process further include: sorting thimble 13 is moved towards disk 12, and quickly pierces through disk 12；Thimble 13 is sorted to pierce
When wearing disk 12 and touching chip bottom, 13 uniform motion of thimble is sorted, until chip is attached on sky film 22.
Method for separating further includes modeling process: before sorting chip, first passing through vision system and scans on disk 12 each
Chip records the information such as physical coordinates, tilt angle and its corresponding mechanical coordinate of each of which chip, and generates corresponding figure
Spectrum；12 thickness of disk and chip thickness size are measured by the detection piece being equipped with again, chip and empty film are adjusted according to test result
22 distance, distance is between 0.05mm-0.2mm.
It is impacted to avoid chip from being sorted thimble 13 and push up to 21 moment of apical axis at 20 end of adhesive holder, sorts 13 He of thimble
Apical axis 21 increases flexible buffer device.
Method for separating further includes pour mask process: after sorting because of disk 12 into square piece, the front of chip is attached to square piece die bond
Face, and die bottom surface is upward；Pour mask is the bottom surface that chip in square piece is attached to the adhesive surface of a new empty film, makes die bottom surface
It is bonded with new empty film, then by the film stripping of square piece, so that chip is transferred on new empty film, and makes just facing for chip
Outside, process is simple and fast；After pour mask, then chip front side is detected.
More specifically, it as shown in figure 8, sorting mechanism is applied on sorting machine, (is needed point according to requiring to establish Bin table
That class chip is selected, can be that quality is defective or quality is intact, is also possible to a certain class), it is tested further according to test machine
As a result, then automatic stepping, generates Bin archives and mapping figure such as photoelectric properties parameter.After the data preparation of early period,
Disk (the i.e. disk 12) expansion of chip will be carried, so that disk 12 is tensioned, it is then solid by expanding brilliant ring (expanding brilliant ring 15)
It is scheduled on Wafer Frame (i.e. sorting frame 10), square piece is that empty film 22 is fixed on Bin Frame (i.e. attaching frame 20).By Wafer
Frame and Bin Frame is put into the material lock of board, and conveying loader mechanism takes Wafer Frame, Bin Frame, and surface sweeping automatically
Bar code, and the information is sent and stored in the central control system of sorting machine, then sorting machine automatic charging.Scanning system pair
Disk is scanned, in conjunction with divide Bin archives generate distribution map, and generate mapping figure.Detection piece to measurement disk thickness,
Then the information such as the thickness of crystal grain set the distance at the end Wafer Frame and the end Bin Frame.Confirm sorting machine scanning
The conjunction figure of mapping and the mapping figure of test machine scanning is as a result, control system control sorting thimble 13 picks sorting core automatically
Piece, and generate data and deposit the gear current end the Bin gear information label of automatic printing, the chip stepping of this batch finishes.In Bin
Square piece is removed on Frame, the bottom surface of the chip in this square piece is attached in addition a piece of empty film by the quality of detection chip, complete
At pour mask, the release paper for protection is sticked in the front of chip after pour mask, and further according to bar code, square piece is labelled, finally
Human eye detection completes sorting work.
Wherein it is possible to which the chip stepping on disk is picked out, that then classifies is attached in square piece.
In other embodiments, in addition to the above-mentioned chip that quality on disk is intact is selected in square piece (referred to as
Just choose), the substandard products chip on disk can also be selected into square piece (referred to as counter to choose).It is counter choose it is identical with the process just chosen,
Do not make burden herein.
In conclusion the present invention is selected the chip on disk to square piece side by sorting thimble, cancel existing pendulum
Arm fetching device cancels suction nozzle absorption chip and retransfers the mode reset and placed, chip directly ejected using thimble, so that chip
It is removed with disk, while completing the mode of classification in rearrangement to square piece.It sorts thimble to reset chip onto empty film, chip energy one
Step is in place, it is not easy to and it drops off, puts neatly, avoid picking and placing material suction nozzle scratch chip, it is easy to maintain.The present invention simplifies the internal structure of an organization, and subtracts
Few process flow, improves efficiency, and reduces production cost.
It is above-mentioned that technology contents of the invention are only further illustrated with embodiment, in order to which reader is easier to understand, but not
It represents embodiments of the present invention and is only limitted to this, any technology done according to the present invention extends or recreation, by of the invention
Protection.Protection scope of the present invention is subject to claims.
Claims (10)
1. a kind of die grading mechanism, including sorting frame, and the adhesive holder set on sorting frame side；It is characterized in that, described point
Choosing is provided with through-hole；The through-hole is for the fixed wafer film for being pasted with chip；The side that the sorting frame is distal to adhesive holder is set
There is sorting thimble；The adhesive holder is equipped with for attaching the empty film for being sorted chip；The wafer film is oppositely arranged with empty film, and
Opposite face is equipped with the adhered layer of fixed chip.
2. a kind of die grading mechanism according to claim 1, which is characterized in that the sorting thimble, which is set to, to be equipped with
In thimble lid；The thimble is covered with the through-hole across sorting thimble.
3. a kind of die grading mechanism according to claim 2, which is characterized in that the thimble lid is sent out with the vacuum being equipped with
Generating apparatus connection；The thimble lid is equipped with several adsorption holes towards sorting frame one end, so that thimble lid adsorbs wafer film, sorting
Thimble ejects chip from the opposite side of wafer film fixed chip.
4. a kind of die grading mechanism according to claim 1, which is characterized in that the edge of the through-hole is equipped with button
Ring；The wafer film is fixed on the expansion crystalline substance ring being equipped with；The brilliant ring of the expansion is fixedly clamped in retaining ring.
5. a kind of die grading mechanism according to claim 4, which is characterized in that the retaining ring is equipped with notch, and notch
Two sides are fixedly connected with the both ends of the spring being equipped with respectively, so that retaining ring is clamped by spring force expands brilliant ring；The sorting frame is close
Clamping block is equipped in incision.
6. a kind of die grading mechanism according to claim 1, which is characterized in that the adhesive holder is distal to sorting frame side
Equipped with apical axis；Apical axis setting corresponding with sorting thimble.
7. a kind of die grading method, which is characterized in that including sorting process: disk to be sorted is fixed on sorting frame, is held
The empty film that load is sorted chip is pasted on adhesive holder, and is oppositely arranged with disk；It is located at the thimble Gai Yushe of sorting frame side
Apical axis in adhesive holder side moves toward one another, and thimble lid just touches disk or squeezes disk, and apical axis squeezes empty film, guarantees circle
On piece currently on the region of chip to be sorted and empty film chip to be lifted the smooth no relaxation in region；Thimble lid center is directed at quilt
The chip of sorting, apical axis and thimble lid are coaxial；Adjust the relative distance of disk and empty film；Thimble lid and vacuum generating device join
It is logical, disk is sucked by the adsorption hole that thimble covers, thimble is then sorted and is moved towards die bottom surface, by chip eject and with circle
Piece removing；Continue uniform motion forward after chip removing, chip is attached on sky film；Thimble lid and vacuum generating device are disconnected
It opens, sorting thimble retracts, and completes the sorting movement of single chip；Thimble lid and apical axis are moved to the next chip being sorted,
Recycle the above process, sorting the chip on disk includes sorting process: the wafer film for being pasted with chip is fixed on sorting frame, side
Piece is fixed on adhesive holder and is oppositely arranged with wafer film；Adjust the relative distance of wafer film and square piece；It is located at sorting frame side
Thimble lid and the apical axis for being located at adhesive holder side move toward one another, and are squeezed in opposite directions with square piece wafer film respectively；Thimble lid and vacuum
Wafer film is sucked by the adsorption hole that thimble covers in generating device connection, then sorts thimble and moves towards die bottom surface, by core
Piece ejection and with wafer film stripping；It moves forward after chip removing, under the action of sorting thimble and apical axis, chip is pasted
It is attached to the side of square piece；Thimble lid and vacuum generating device disconnect, and sorting thimble retracts, and enters next sorting chip.
8. a kind of die grading method according to claim 7, which is characterized in that sorting process further include: sorting thimble
It is moved towards wafer film, and quickly pierces through wafer film；When sorting thimble pierces through wafer film and touches chip bottom, thimble is sorted
Uniform motion, until chip is attached on sky film.
9. a kind of die grading method according to claim 7, which is characterized in that further include modeling process: in sorting core
Before piece, first pass through vision system and scan each chip on wafer film, record the physical coordinates of each of which chip, tilt angle and
The information such as its corresponding mechanical coordinate, and generate corresponding map；Wafer film thickness degree and core are measured by the detection piece being equipped with again
Piece thickness adjusts chip at a distance from empty film according to test result, and distance is between 0.05mm-0.2mm.
10. a kind of die grading method according to claim 7, which is characterized in that further include pour mask process: chip is whole
After sorting to empty film, the front of chip is attached to the adhered layer of sky film, and die bottom surface is upward；Utilize the stickup of a new empty film
Layer is attached to the bottom surface of chip on sky film, bonds die bottom surface and new empty film, then by empty film stripping, so that chip is transferred to
On new empty film, so that chip just faces outwardly；After pour mask, then chip front side is detected.
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| CN114937629B (en) * | 2022-04-20 | 2022-12-27 | 东莞市德镌精密设备有限公司 | MiniLED acupuncture transfer equipment |
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| CN115295476B (en) * | 2022-10-08 | 2023-01-10 | 四川洪芯微科技有限公司 | Chip demoulding device |
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