CN109039293A - A kind of automatic biasing barium microwave dielectric filter and its laminated process - Google Patents

Abstract

The invention discloses a kind of automatic biasing barium microwave dielectric filter and its laminated process, comprising: inductance element, capacity cell and floor, the inductance element is L-shaped, lamination above and below inductance element vertical spin structure；Through-hole is set on inductance element, inductance interconnections are carried out by through-hole between each layer inductance element, the capacity cell uses vertical finger-inserting type capacitance structure, and the floor is separately positioned on the two sides of capacity cell, and capacity cell and inductance element are interconnected with the floor of two sides respectively.The present invention is by low-temperature sintering barium microwave dielectric filter in conjunction with LTCC/LTCF technology, realize that filter material is compatible with LTCC/LTCF manufacturing process, the miniaturization and batch manufacture for realizing microwave dielectric filter, improve the consistency of device and advantageously reduce cost.

Description

A self-biased barium microwave dielectric filter and its lamination process

technical field

The invention relates to the technical field of microwave dielectric filters, in particular to a self-biased barium microwave dielectric filter and a lamination process thereof.

Background technique

As one of the basic components in electronic circuits, filters are widely used in systems such as microwave communications, radar navigation, electronic countermeasures, satellite communications, missile guidance, and test instruments. They can be used to separate or combine signals of various frequencies, and their performance directly affects the performance index of the entire communication system.

LTCC technology is to make low-temperature sintered ceramic powder into a green tape with precise thickness and density, and use laser drilling, micro-hole grouting, precision conductor paste printing and other processes to produce the required circuit pattern on the green tape, and Multiple passive components are embedded in it, then stacked together, and sintered at about 900°C to make a passive integrated component of a three-dimensional circuit network, or a three-dimensional circuit substrate with built-in passive components. Mount I and active devices to make passive/active integrated functional modules. In short, various high-tech LTCC products can be successfully manufactured using this process. Products developed with multi-layer LT have the characteristics of minimum system area, high system integration, system function optimization, short time to market and low cost, so they are quite competitive.

Contents of the invention

The purpose of the present invention is to provide a self-biased barium microwave dielectric filter and its lamination process, so as to solve the problems raised in the above-mentioned background technology.

To achieve the above object, the present invention provides the following technical solutions:

A self-biased barium microwave dielectric filter, comprising: an inductance element, a capacitance element and a floor, the inductance element is in an "L" shape, and the inductance element is stacked up and down in a vertical spiral structure; through holes are arranged on the inductance element, and the inductance of each layer The elements are inductively interconnected through through holes, and the capacitive element adopts a vertical finger-type capacitor structure. The floors are respectively arranged on both sides of the capacitive element, and the capacitive element and the inductive element are respectively interconnected with the floors on both sides.

As a further solution of the present invention: the diameter of the through hole and the line width of the printed conductor of the inductance element are both 0.2 mm.

A lamination process of a self-biased barium microwave dielectric filter, comprising the following steps:

S1: Mixing and casting, mixing organic matter and inorganic matter composed of ceramics and glass in a certain proportion, grinding and homogenizing by ball milling, and then pouring on a moving carrier belt, passing through the drying area, Remove all the solvent, and cast to the required thickness by controlling the blade gap;

S2: cutting the unsintered porcelain tape according to the required size;

S3: Use laser drilling technology to form holes with a diameter of 0.15-0.25mm, which are used on different layers to interconnect circuits;

S4: Through-hole filling, using thick film screen printing or template extrusion to fill the conductive paste into the hole;

S5: Using thick film printing technology, the conductive paste is printed and dried in a box or chain furnace;

S6: Check, organize and align different layers, make the alignment holes in each layer concentric and prepare for stacking, the substrate layers sorted and aligned are hot-pressed together during stacking, and the hot-pressing parameters are 60-70°C, Hot pressing at 20MPa for 15-30min, followed by one-step co-firing lamination;

S7: Debinding and sintering, co-firing the laminate to a peak temperature of 900°C at 200-500°C for 5-15 minutes, the fired parts are ready for the post-firing process, and then fired in the air.

As a further solution of the present invention: the organic matter includes: a polymer binder, a plasticizer, a dispersant and a solvent, and the mass fraction ratio of each component is 1:0.08:0.5:3.

As a further solution of the present invention: the polymer adhesive uses polyvinyl butyral resin, the plasticizer uses butyl phenyl phthalate, and the dispersant is a mixture of fatty acids and esters. Solvent, described solvent adopts the mixed solvent of methyl ethyl ketone and denatured alcohol of equal quality.

As a further solution of the present invention: in step S3, alignment holes are processed at the same time.

As a further solution of the present invention: in step S7, the sintering is carried out in a N2 chain furnace.

Compared with the prior art, the beneficial effect of the present invention is: the present invention combines the low-temperature sintered barium microwave dielectric filter with LTCC/LTCF technology, realizes the compatibility of the filter material and the LTCC/LTCF manufacturing process, and realizes the microwave dielectric filter Miniaturization and batch manufacturing improve the consistency of devices and help reduce costs.

Description of drawings

Fig. 1 is a schematic structural diagram of a self-biased barium microwave dielectric filter.

Fig. 2 is a schematic structural diagram of a capacitive element in a self-biased barium microwave dielectric filter.

Fig. 3 is a schematic structural diagram of an inductance element in a self-biased barium microwave dielectric filter.

Detailed ways

The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

Please refer to FIGS. 1-3. In an embodiment of the present invention, a self-biased barium microwave dielectric filter includes: an inductance element 1, a capacitance element 2 and a floor 3. The inductance element 1 is in an "L" shape, and the inductance element 1 The vertical spiral structure is stacked up and down. Compared with the planar spiral type and displacement type, the vertical spiral structure has a higher self-resonant frequency and quality factor, and is conducive to reducing the size of components; Through holes 11, inductive interconnection between the inductive elements 1 of each layer is carried out through the through holes, and the connection mode between the through holes 11 and the conductor layer helps to guide the electromagnetic field signal into the vertical through hole and the conductor layer below, which improves the transmission performance, and the inductance The line width of the printed conductor of component 1 is also 0.2 mm, which is consistent with the diameter of the through hole 11, which can reduce the discontinuity of the transmission line;

The capacitive element 2 adopts a vertical interdigitated capacitor (VIC) structure, which can reduce the area of the terminal electrode, thereby effectively reducing the size of the filter. The floor boards 3 are respectively arranged on both sides of the capacitive element 2. The element 1 is interconnected with the floor boards 3 on both sides, so that the way of side packaging and ground-to-ground connection can reduce the impact on differential loss and standing wave ratio.

A lamination process of a self-biased barium microwave dielectric filter, comprising the following steps:

S1: Mixing, casting, mixing organic and inorganic components composed of ceramics and glass in a certain proportion, grinding and homogenizing by ball milling, and then pouring on a moving carrier belt and passing through a drying zone , remove all the solvent, and cast to the required thickness by controlling the blade gap;

S2: cutting the unsintered porcelain tape according to the required size;

S3: Use laser drilling technology to form holes with a diameter of 0.15-0.25mm, which are used on different layers to interconnect circuits.

S4: Through-hole filling, using thick film screen printing or template extrusion to fill the conductive paste into the hole;

S5: Using thick film printing technology, the conductive paste is printed and dried in a box or chain furnace;

S6: Check, organize and align different layers, make the alignment holes in each layer concentric and prepare for stacking, the substrate layers sorted and aligned are hot-pressed together during stacking, and the hot-pressing parameters are 60-70°C, Hot pressing at 20MPa for 15-30min, followed by one-step co-firing lamination;

S7: Debinding and sintering, co-firing the laminate to a peak temperature of 900°C within 200-500°C and 5-15min, and the fired parts are ready for post-firing process, such as printing conductors and precision resistors on the top surface, etc. , and then fired in air.

The organic matter includes: a polymer binder, a plasticizer, a dispersant and a solvent, and the mass fraction ratio of each component is 1:0.08:0.5:3.

The polymer adhesive uses polyvinyl butyral resin, the plasticizer uses butyl phenyl phthalate to make the green ceramic tape have toughness, and the dispersant is a mixture of fatty acids and esters The solvent, said solvent adopts the mixed solvent of methyl ethyl ketone and denatured alcohol of equal quality.

In step S3, alignment holes are processed at the same time to help alignment during lamination and to be used for automatic alignment when printing conductors and media.

In step S7, sintering is carried out in a N2 chain furnace.

It will be apparent to those skilled in the art that the invention is not limited to the details of the above-described exemplary embodiments, but that the invention can be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. Accordingly, the embodiments should be regarded in all points of view as exemplary and not restrictive, the scope of the invention being defined by the appended claims rather than the foregoing description, and it is therefore intended that the scope of the invention be defined by the appended claims rather than by the foregoing description. All changes within the meaning and range of equivalents of the elements are embraced in the present invention. Any reference sign in a claim should not be construed as limiting the claim concerned.

In addition, it should be understood that although this specification is described according to implementation modes, not each implementation mode only contains an independent technical solution, and this description in the specification is only for clarity, and those skilled in the art should take the specification as a whole , the technical solutions in the various embodiments can also be properly combined to form other implementations that can be understood by those skilled in the art.

Claims (7)

1. A self-biased barium microwave dielectric filter, comprising: inductive element, capacitive element and floor, is characterized in that: described inductive element is " L " type, and inductive element vertical helical structure stacks up and down; Arranges on the inductive element Through holes, the inductive elements of each layer are inductively interconnected through through holes, the capacitive elements adopt a vertical finger-type capacitor structure, the floors are respectively arranged on both sides of the capacitive elements, and the capacitive elements and inductive elements are respectively connected to the two sides. Floor interconnects. 2. A self-biased barium microwave dielectric filter according to claim 1, characterized in that: the diameter of the through hole and the line width of the printed conductor of the inductance element are both 0.2 mm. 3. a kind of lamination process of self-biased barium microwave dielectric filter according to claim 1 or 2, is characterized in that: comprise the following steps: S1: Mixing and casting, mixing organic matter and inorganic matter composed of ceramics and glass in a certain proportion, grinding and homogenizing by ball milling, and then pouring on a moving carrier belt, passing through the drying area, Remove all the solvent, and cast to the required thickness by controlling the blade gap; S2: cutting the unsintered porcelain tape according to the required size; S3: Use laser drilling technology to form holes with a diameter of 0.15-0.25mm; S4: Through-hole filling, using thick film screen printing or template extrusion to fill the conductive paste into the hole; S5: Using thick film printing technology, the conductive paste is printed and dried in a box or chain furnace; S6: Check, organize and align different layers, make the alignment holes in each layer concentric and prepare for stacking, the substrate layers sorted and aligned are hot-pressed together during stacking, and the hot-pressing parameters are 60-70°C, Hot pressing at 20MPa for 15-30min, followed by one-step co-firing lamination; S7: Debinding and sintering, co-firing the laminate to a peak temperature of 900°C at 200-500°C for 5-15 minutes, the fired parts are ready for the post-firing process, and then fired in the air. 4. The stacking process of a self-biased barium microwave dielectric filter according to claim 3, characterized in that: said organic matter comprises: polymer binder, plasticizer, dispersant and solvent, each group The mass-to-score ratio of points is 1:0.08:0.5:3. 5. The lamination process of a self-biased barium microwave dielectric filter according to claim 3, characterized in that: the polymer adhesive adopts polyvinyl butyral resin, and the plasticizer adopts Butyl phenyl phthalate, the dispersant is a solvent mixed with fatty acid and ester, and the solvent adopts a mixed solvent of methyl ethyl ketone and industrial alcohol with equal mass. 6. The lamination process of a self-biased barium microwave dielectric filter according to claim 3, characterized in that: in step S3, alignment holes are processed at the same time. 7. The lamination process of a self-biased barium microwave dielectric filter according to claim 3, characterized in that: in step S7, the sintering is carried out in an N2 chain furnace.