CN108982665A - A kind of reflectoscope and method - Google Patents
A kind of reflectoscope and method Download PDFInfo
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- CN108982665A CN108982665A CN201810818339.0A CN201810818339A CN108982665A CN 108982665 A CN108982665 A CN 108982665A CN 201810818339 A CN201810818339 A CN 201810818339A CN 108982665 A CN108982665 A CN 108982665A
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- 238000002604 ultrasonography Methods 0.000 claims description 7
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N29/00—Investigating or analysing materials by the use of ultrasonic, sonic or infrasonic waves; Visualisation of the interior of objects by transmitting ultrasonic or sonic waves through the object
- G01N29/04—Analysing solids
- G01N29/048—Marking the faulty objects
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4183—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by data acquisition, e.g. workpiece identification
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- G—PHYSICS
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- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/4185—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by the network communication
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N2291/00—Indexing codes associated with group G01N29/00
- G01N2291/02—Indexing codes associated with the analysed material
- G01N2291/023—Solids
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
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Abstract
The invention belongs to ultrasonic guided wave detection technology field, it is related to a kind of reflectoscope and method.The host computer for including: the slave computer detected a flaw and being controlled and being shown；Host computer carries out the transmission of data and order by optional communication interface and slave computer, therefore, the present invention has the advantage that 1, control simple and flexible, slave computer core only need a piece of main control chip, without another plus FPGA control.2, scalability is strong, is suitable for a variety of detection occasions, has bluetooth, WiFi, serial ports and CAN multiple communication interface.3, multiple slave computer networkings can be carried out, a host computer can individually control multiple slave computers.
Description
Technical field
The invention belongs to ultrasonic guided wave detection technology field, it is related to a kind of reflectoscope and method.
Background technique
Ultrasonic Flaw Defect is most widely used non-destructive testing technology at this stage.It is visited compared to gamma ray, X-ray
Wound, it has harmless characteristic.Compared to vision-based detection, Magnetic testing and Liquid penetrant testing, it has can detection object
The characteristic of internal flaw, and can institute's detection defects be classified and be positioned.Since ultrasonic inspection has these advantages, it is wide
It is applied to the various fields such as railway traffic, petrochemical industry, machine-building, aerospace etc. of national economy generally.
China is about the technology of ultrasonic probe and reflectoscope all comparative maturities at present, but uses mostly as independent
Instrument and exist, encapsulate it is too deep, upper and lower computer is generally integrated, is unable to secondary development.And instrument is all single use, it cannot
Multiple equipment while line flaw detection.In addition, the data acquisition of ultrasound detection instrument at this stage is generally controlled by FPGA and is completed, at
This is relatively high, and structure is complicated, and volume is larger.
In recent years, for the research of reflectoscope, China has been achieved for certain research achievement.But it is overall next
It says, the complexity and cost realized are relatively high.And shortage can extend on a large scale and the ability of Distributed Detection.
Summary of the invention
For technical problem presented above, the invention patent technical problem to be solved is: providing a kind of knot
Structure is simple, favorable expandability, and the reflectoscope with the detection of more device distribution formulas.The method effect that the present invention uses is good
Good, structure is simple, controls without FPGA.Its scalability and portable better than existing product, and can be large-scale distributed
Using.Efficiently solve that ultrasonic testing apparatus encapsulation at this stage is too deep, structure is complicated, development difficulty is big, cannot divide on a large scale
The deficiency that cloth uses etc..
Above-mentioned technical problem of the invention is mainly to be addressed by following technical proposals:
A kind of reflectoscope characterized by comprising the slave computer detected a flaw and controlled and shown and is upper
Position machine；Host computer carries out the transmission of data and order by optional communication interface and slave computer, and the host computer includes
Node control module: for show all slave computers ID number, operator by this panel to slave computer into
The control of traveling single stepping；
Sampling parameter setup module: different sampling rates, the ginseng such as sampling length are arranged according to flaw detection object and environment
Number, to match the ability of slave computer acquisition and transmission data；
Data show/logging modle: being analyzed and handled according to the data that slave computer transmits and shown and data
It saves；Operator can intuitively obtain the defect situation of detected a flaw object；
The slave computer includes
Main control chip: amplify mould for the control of whole device, including control ultrasonic excitation module, control signal condition
Block, signal acquisition module, signal cache module and communication module；
Power supply module: for the power supply of whole device, energy is provided for whole device；
High pressure activation module: for generating the voltage of 200-700V；
Ultrasonic probe: for the material surface contact with required detection, and ultrasound is generated；
Ultrasonic excitation control module: for controlling the on-off of high-pressure modular, high-voltage pulse work is generated by controlling the module
For ultrasonic probe；
Ultrasonic signal improves amplification module: for the conditioning and amplification of signal of detecting a flaw, signal can reach after passing through the module
It requires to acquisition, is acquired by signal acquisition module；
Signal acquisition module: for acquiring ultrasound and echo-signal；
Signal cache module: it for the signal of acquisition will to be told to be temporarily stored into cache module, is passed after the completion of one acquisition
It is defeated to arrive main control chip；
Communication module: the transmission of data and instruction is carried out for slave computer and computer, mobile phone or embedded device；
Main control chip, ultrasonic excitation control module, high pressure activation module, ultrasonic probe are sequentially connected；Ultrasonic probe, ultrasound
Signal condition amplification module, signal acquisition module, signal cache module, main control chip are sequentially connected；Main control chip is adopted with signal
Collection module, communication module are respectively connected with.
In a kind of above-mentioned reflectoscope, the communication module includes: Bluetooth communication, WiFi communication, serial communication
With one of CAN communication or a variety of.
In a kind of above-mentioned reflectoscope, the host computer is with hand one or more in the communication interface
Machine, Windows or linux system computer, embedded host.
In a kind of above-mentioned reflectoscope, the ultrasonic signal conditioning amplification module includes signal pre-treatment, level-one
Amplification, second level amplification and post-processing part, wherein a kind of reflectoscope according to claim 10, feature exist
It is bandwidth in: signal pre-treatment core be more than the ultra-low noise operational amplifier of 30MHz, signal level-one amplification chip is that gain can
Adjust amplifier；Signal second level amplification chip is gain adjustable amplifier；Signal post-processing chip is that bandwidth is more than the ultralow of 30MHz
Noise operational amplifier；Pre-treatment, level-one amplification, second level amplification are all comprising signal amplification and high-pass filtering part, post-processing packet
Containing signal amplification and bandpass filtering two parts.
A kind of ultrasonic detection method characterized by comprising
Step 1, ultrasonic inspection is popped one's head in and is bonded with detection material tight, power supply module is opened, main control chip control device
Complete initialization；
Step 2, the instantaneous negative high voltage pulse of main control module control ultrasonic excitation control module conducting, high pressure activation module is made
For ultrasonic probe, random probe inspires ultrasonic wave；
Step 3, ultrasonic wave is propagated in detection material, can be reflected when encountering and borrowing defective, reflection echo is again
It returns to ultrasonic probe and generates small voltage, small voltage is admitted to signal pre-processing module；
Step 4, signal, which is filtered by signal pre-processing module and is amplified into signal level-one by a small margin, amplifies mould
Block, signal second level amplification module are further amplified, and then further filter by signal post-processing module and voltage is converted；
Step 5, the signal acquisition that signal acquisition module comes out signal post-processing module, and it is sent into signal cache module；
Step 6, after the completion of one acquisition, the data being all buffered in signal cache module are sent into main control chip；
Step 7, data are transmitted data to host computer by communication module by main control chip, are analyzed, handled and are shown
Show；
Step 2 is repeated to step 8, one acquisition analysis and processing can be completed, obtain detection material it is whether defective and
Its alternate position spike:
Wherein, v is the transmission speed of ultrasonic wave in the material, and Δ t is that echo time and hair wave time are only poor；S, that is, defect
The distance between probe alternate position spike；If after treatment without echo, then it represents that detected material does not have defect.
Therefore, the present invention has the advantage that 1, control simple and flexible, slave computer core only need a piece of main control chip, nothing
FPGA control need to separately be added.2, scalability is strong, is suitable for a variety of detection occasions, has bluetooth, WiFi, serial ports and more kinds of CAN logical
Believe interface.3, multiple slave computer networkings can be carried out, a host computer can individually control multiple slave computers.
Detailed description of the invention
Fig. 1 is integrated stand composition of the invention.
Fig. 2 is the device of the invention functions of modules figure.
Fig. 3 is host computer operational flowchart of the invention.
Specific embodiment
Reflectoscope provided by the invention is described in detail with reference to the accompanying drawings and examples, described be pair
Explanation of the invention rather than limit.
Embodiment:
The integrated stand composition of device of the present invention is as shown in Figure 1.In a communication network there may be it is one or more into
The slave computer of row ultrasonic inspection, host computer can be computer equipment, cell phone apparatus or other embedded devices.Slave computer and upper
Machine can be connected by one or more of WiFi, bluetooth, CAN or serial ports communication interface, to carry out control command, letter
The transmission and interaction of number.
Apparatus function module map of the present invention is as shown in Figure 2.Host computer includes node control panel, and sampling parameter is set
Panel and data are set analysis shows that panel three parts.Operator can number selection one or more according to corresponding node ID
A node, being set and controlled for sampling parameter can be carried out later by choosing node, and can be to the data that node-node transmission comes
It analyzed, handled and is shown；
Slave computer connects optocoupler TLP2345 by the I/O interface of main control chip STM32 and controls power MOS pipe IRF840S
Turn-on and turn-off, constitute the ultrasonic excitation control module.GRB12500D booster power and its surrounding component structure together
At the high pressure activation module, ultrasonic excitation control module connection high pressure activation module, which acts on, generates ultrasound on ultrasonic probe
Signal.Ultrasonic signal, which acts on flaw detection object, can generate echo-signal entering signal pre-processing module together.Signal pre-treatment mould
Block carries out high-pass filtering and prime amplification using MAX4104.Amplified signal entering signal first stage amplifier, first stage amplifier
Core chips use AD603, pass through the adjustable level-one gain amplifier of the DAC function of main control chip.Amplify mould by level-one
Signal enters second level amplification module after block, and the core chips of second level amplification module uses AD603, passes through the DAC function of main control chip
It can adjustable second level gain amplifier.By the signal entering signal post-processing module of second level amplification module.Signal post-processing mould
The core chips of block uses MAX4106, and filter center frequency is selected to carry out bandpass filtering for ultrasonic probe frequency 2.5MHz.By
The signal entering signal acquisition module of post-processing, herein signal acquisition ADC use AD9283, and by be connected with main control chip with
Control its sampling length and frequency.Collected signal is synchronized deposit FIFO core by signal acquisition module connection signal cache module
Piece IDT7205.Main control chip is connected with the control carried out data transmission with IDT7205.
Main control chip passes through one in bluetooth communication, WiFi communication module, serial communication modular or CAN communication module
A or multiple transmission that data and order are carried out with host computer.
The host computer operational flowchart of device of the present invention is as shown in Figure 3.This is read and is arranged after host computer starting
Then the parameter of machine searches for host computer present in communication network automatically.If there are slave computer node in the communication network,
Host computer is by the available slave computer node serial number unrelated with communication mode.Obtaining node serial number then indicates that slave computer connects into
Function.If not searching slave computer node, slave computer can be either automatically or manually re-searched for, this parameter set according to the machine
To determine.The state that slave computer is obtained after slave computer successful connection, gets the setting that slave computer parameter can be carried out after state
Or sampling.Parameter can be read immediately after carrying out parameter setting to determine whether parameter is arranged success, if being arranged successfully into
Row operates in next step, and resetting for parameter is carried out if setup failed.
Corresponding slave computer node will start a ultrasonic inspection, flaw detection data after host computer issues data acquisition instructions
Acquisition will be transferred to host computer by the communication mode after completing.Host computer starts after receiving data to data
It is analyzed and is handled, and carry out the display of data and the storage of data.Simultaneously by the available result of detection of these steps
It can intuitively be reflected from host computer.Operator can perform corresponding processing according to result of detection.
Particular examples described herein is only the illustration to spirit of that invention.The technical field of the invention
Technical staff can do various modifications or additions to described specific example or be substituted in a similar manner, but not
Spirit or beyond the scope defined by the appended claims of the invention can be deviateed.
Claims (5)
1. a kind of reflectoscope characterized by comprising the slave computer detected a flaw and controlled and shown and is upper
Machine；Host computer carries out the transmission of data and order by optional communication interface and slave computer, and the host computer includes
Node control module: for show all slave computers ID number, operator by this panel to slave computer carry out into
Single stepping control；
Sampling parameter setup module: being arranged different sampling rates according to flaw detection object and environment, the parameters such as sampling length, with
Match the ability of slave computer acquisition and transmission data；
Data show/logging modle: being analyzed and handled according to the data that slave computer transmits and shown and data save；
Operator can intuitively obtain the defect situation of detected a flaw object；
The slave computer includes
Main control chip: for the control of whole device, including control ultrasonic excitation module, control signal condition amplification module, letter
Number acquisition module, signal cache module and communication module；
Power supply module: for the power supply of whole device, energy is provided for whole device；
High pressure activation module: for generating the voltage of 200-700V；
Ultrasonic probe: for the material surface contact with required detection, and ultrasound is generated；
Ultrasonic excitation control module: it for controlling the on-off of high-pressure modular, is acted on by controlling module generation high-voltage pulse
Ultrasonic probe；
Ultrasonic signal improves amplification module: for the conditioning and amplification of signal of detecting a flaw, signal is adopted by that can reach after the module
Collection requires, and is acquired by signal acquisition module；
Signal acquisition module: for acquiring ultrasound and echo-signal；
Signal cache module: for the signal of acquisition will to be told to be temporarily stored into cache module, after be transferred to after the completion of one acquisition
Main control chip；
Communication module: the transmission of data and instruction is carried out for slave computer and computer, mobile phone or embedded device；
Main control chip, ultrasonic excitation control module, high pressure activation module, ultrasonic probe are sequentially connected；Ultrasonic probe, ultrasonic signal
Conditioning amplification module, signal acquisition module, signal cache module, main control chip are sequentially connected；Main control chip and signal acquisition mould
Block, communication module are respectively connected with.
2. a kind of reflectoscope according to claim 1, it is characterised in that: the communication module includes: that bluetooth is logical
One of letter, WiFi communication, serial communication and CAN communication are a variety of.
3. a kind of reflectoscope according to claim 1, it is characterised in that: the host computer is connect with the communication
One or more mobile phones, Windows or linux system computer, embedded host in mouthful.
4. a kind of reflectoscope according to claim 1, it is characterised in that: the ultrasonic signal improves amplification module
Including signal pre-treatment, level-one amplification, second level amplification and post-processing part, wherein according to claim 10 a kind of super
Acoustic inspection device, it is characterised in that: signal pre-treatment core is ultra-low noise operational amplifier, the signal that bandwidth is more than 30MHz
Level-one amplification chip is gain adjustable amplifier；Signal second level amplification chip is gain adjustable amplifier；Signal post-processing chip
It is more than the ultra-low noise operational amplifier of 30MHz for bandwidth；Pre-treatment, level-one amplification, second level amplification all comprising signal amplification and
High-pass filtering part, post-processing include signal amplification and bandpass filtering two parts.
5. a kind of ultrasonic detection method characterized by comprising
Step 1, ultrasonic inspection is popped one's head in and is bonded with detection material tight, power supply module is opened, and main control chip control device is completed
Initialization；
Step 2, main control module control ultrasonic excitation control module conducting, the instantaneous negative high voltage impulse action of high pressure activation module in
Ultrasonic probe, random probe inspire ultrasonic wave；
Step 3, ultrasonic wave is propagated in detection material, can be reflected when encountering and borrowing defective, reflection echo comes back to
Ultrasonic probe generates small voltage, and small voltage is admitted to signal pre-processing module；
Step 4, signal is filtered by signal pre-processing module and is amplified into signal primary magnification module by a small margin, believes
Number second level amplification module is further amplified, and then further filter by signal post-processing module and voltage is converted；
Step 5, the signal acquisition that signal acquisition module comes out signal post-processing module, and it is sent into signal cache module；
Step 6, after the completion of one acquisition, the data being all buffered in signal cache module are sent into main control chip；
Step 7, data are transmitted data to host computer by communication module by main control chip, are analyzed, handled and are shown；
Step 2 is repeated to step 8, one acquisition analysis and processing can be completed, obtains whether detection material defective and its position
Set difference:
Wherein, v is the transmission speed of ultrasonic wave in the material, and Δ t is that echo time and hair wave time are only poor；S, that is, defect and spy
The distance between head alternate position spike；If after treatment without echo, then it represents that detected material does not have defect.
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| CN201810818339.0A CN108982665A (en) | 2018-07-24 | 2018-07-24 | A kind of reflectoscope and method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109655527A (en) * | 2019-01-31 | 2019-04-19 | 武汉大学 | A kind of integrated form ultrasound detection mechanism |
| CN110174897A (en) * | 2019-06-26 | 2019-08-27 | 宝鸡知为机电技术有限公司 | Double track supersonic detecting vehicle Unmanned Systems and remote monitoring system |
| CN111505122A (en) * | 2020-05-26 | 2020-08-07 | 上海市东方海事工程技术有限公司 | Multichannel ultrasonic flaw detection signal processing system and flaw detection vehicle |
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| DE19959069A1 (en) * | 1999-12-08 | 2001-06-21 | Siemens Ag | Device and method for (vibro) acoustic monitoring of a process and / or manufacturing process |
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