CN108958437A - Air-cooled and water cooling integrated radiator and air-cooled and water cooling dual-cooled method - Google Patents
Air-cooled and water cooling integrated radiator and air-cooled and water cooling dual-cooled method Download PDFInfo
- Publication number
- CN108958437A CN108958437A CN201811101573.8A CN201811101573A CN108958437A CN 108958437 A CN108958437 A CN 108958437A CN 201811101573 A CN201811101573 A CN 201811101573A CN 108958437 A CN108958437 A CN 108958437A
- Authority
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- China
- Prior art keywords
- heat
- cooled
- radiating fin
- dissipating pipe
- fin group
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 title claims abstract description 80
- 238000001816 cooling Methods 0.000 title claims abstract description 44
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000002826 coolant Substances 0.000 claims abstract description 25
- 239000007788 liquid Substances 0.000 claims abstract description 24
- 230000017525 heat dissipation Effects 0.000 claims abstract description 16
- 238000010521 absorption reaction Methods 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052709 silver Inorganic materials 0.000 claims description 4
- 239000004332 silver Substances 0.000 claims description 4
- 238000005476 soldering Methods 0.000 claims description 4
- 230000000694 effects Effects 0.000 abstract description 4
- CWYNVVGOOAEACU-UHFFFAOYSA-N Fe2+ Chemical compound [Fe+2] CWYNVVGOOAEACU-UHFFFAOYSA-N 0.000 abstract 1
- 239000007769 metal material Substances 0.000 abstract 1
- 238000009434 installation Methods 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 230000003487 anti-permeability effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005474 detonation Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/201—Cooling arrangements using cooling fluid
Landscapes
- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The present invention relates to a kind of air-cooled methods with water cooling integrated radiator and its dual-cooled, including water pump, (multiple flow passages heat-dissipating pipe is hard non-ferrous metal material to the much faster runner heat-dissipating pipe of heat-transfer rate, greatly reduce the volatilization of coolant liquid), radiating fin group (it is convenient that heat dissipation area increases mode) and fan, water pump is mounted on mainboard, the radiating fin group is located at the top of water pump, one end of multiple flow passages heat-dissipating pipe is connect with water pump, the other end of multiple flow passages heat-dissipating pipe is located in radiating fin group, fan is located at the top of radiating fin group, multiple flow passages heat-dissipating pipe is entered by water pump after the heat that element manipulation on coolant liquid absorption mainboard generates, expand heat dissipation area using multiple flow passages heat-dissipating pipe and radiating fin group and accelerates radiating rate, heat is discharged finally by fan.The present invention has good heat dissipation effect, in conjunction with the advantages of water-cooling, wind-cooling heat dissipating, while carrying out water cooling, air-cooled dual-cooled, realizes that cooling velocity is fast；It is high-efficient.
Description
Technical field
It is espespecially a kind of air-cooled with water cooling integrated radiator and air-cooled dual cold with water cooling the present invention relates to radiator field
But method.
Background technique
Existing computer radiating mode mainly has wind-cooling heat dissipating and two kinds of water-cooling, and water-cooled radiator occupies empty at present
Between it is big, it has not been convenient to install, traditional air-cooled radiator heat dissipation effect is not good enough.
Summary of the invention
To solve the above problems, the present invention provides the air-cooled and water cooling that a kind of structure is simple, occupies little space, is easily installed
Integrated radiator.
To achieve the above object, the present invention, which adopts the following technical scheme that, is: a kind of air-cooled and water cooling integrated radiator,
Including water pump, the much faster runner heat-dissipating pipe of heat-transfer rate, radiating fin group and fan, the water pump is mounted on mainboard, described
Radiating fin group is located at the top of water pump, and the multiple flow passages heat-dissipating pipe is tightly attached to radiating fin group surface, and the fan is located at scattered
The top of hot fins group, the multiple flow passages heat-dissipating pipe are the hollow metal with heat-dissipating pipe water inlet and heat-dissipating pipe water outlet
Pipe, the heat-dissipating pipe water inlet and heat-dissipating pipe water outlet are connected to form recirculated water with the water outlet of water pump and water inlet respectively
Road.Traditional water-cooled radiator can only radiate for single mainboard element, the present invention combination water-cooled radiator and air-cooled scattered
Hot device can export the thermal energy of CPU by water pump, multiple flow passages heat-dissipating pipe, radiating fin group, while fan is perpendicular to master
Plate setting can take into account the heat dissipation of the other parts on mainboard other than preferably the thermal energy of CPU is exported.
It preferably, further include side plate, the side plate is respectively provided at the two sides of radiating fin group, reinforces air duct, reduces air quantity
Loss.
Preferably, the multiple flow passages heat-dissipating pipe is high temperature silver soldering multiple flow passages copper pipe, and heat-transfer rate is fast, and heat exchange area is big,
The coolant duct of traditional water-cooled radiator uses hose, easily causes coolant liquid reduction, and high temperature silver soldering multiple flow passages copper pipe is anti-
Good penetrability.
Preferably, the radiating fin group is fastened up and down by two pieces of radiating fins and is formed, it is possible to increase multiple flow passages heat-dissipating pipe
Heat dissipation area.
It preferably, further include fixed bracket, the fixed branch is erected between water pump and radiating fin group, is dissipated for fixed
Hot fins group.
Preferably, the fixed bracket is metal plate material.
Water pump conveys coolant liquid into multiple flow passages heat-dissipating pipe, and coolant liquid absorbs main air-cooled and water cooling by multiple flow passages heat-dissipating pipe
The method of the air-cooled and water cooling dual-cooled of integrated radiator, it is characterised in that: include the following steps: that water pump is defeated by coolant liquid
It is sent into multiple flow passages heat-dissipating pipe, after coolant liquid absorbs the heat that mainboard element manipulation generates by multiple flow passages heat-dissipating pipe, keeps mainboard first
Part cooling, multiple flow passages heat-dissipating pipe carry out heat with radiating fin group and exchange, and take away 95% or more heat of coolant liquid, and fan will radiate
The heat of fins group is discharged, and coolant liquid after cooling enters water pump, and circulation heat absorption radiates coolant liquid in cycles, to take away
Mainboard elements heat.Specific coolant liquid enters the cooling path that multiple flow passages heat-dissipating pipe enters back into water pump through water pump in cycles, dissipates
Hot fins group is exchanged with multiple flow passages heat dissipation tubular heat, carries out wind-cooling heat dissipating by fan, simultaneous since fan wind direction is perpendicular to mainboard
The heat dissipation of customer's plate other parts.
The beneficial effects of the present invention are: the present invention to have good heat dissipation effect, in conjunction with water-cooling, wind-cooling heat dissipating it is excellent
Point, while water cooling, air-cooled dual-cooled are carried out, realize that cooling velocity is fast；It is high-efficient；Main component can be not only cooled down, it can also be cold
But the purpose of periphery adjacent component.Multiple flow passages are entered by water pump after the heat that element manipulation on coolant liquid absorption mainboard generates
Heat-dissipating pipe expands heat dissipation area using multiple flow passages heat-dissipating pipe and radiating fin group and accelerates radiating rate, will finally by fan
Heat discharge, structure is simple, and radiating efficiency is high, and overall volume is small, easy for installation, occupies little space.
Detailed description of the invention
Fig. 1 is stereoscopic schematic diagram of the invention.
Fig. 2 is detonation configuration figure of the invention.
Fig. 3 is scheme of installation of the invention.
Description of symbols: 1. water pumps；2. multiple flow passages heat-dissipating pipe；3. radiating fin group；4. fan；5. side plate；6. fixed
Bracket.
Specific embodiment
It please refers to shown in Fig. 1-3, the present invention is about a kind of air-cooled and water cooling integrated radiator, including water pump 1, thermally conductive speed
Much faster runner heat-dissipating pipe 2, radiating fin group 3, fan 4, side plate 5 and fixed bracket 6, the water pump 1 is spent to be mounted on mainboard,
The side of the water pump 1 is equipped with water inlet and water outlet, and two pieces of fixed brackets 6 are respectively provided on water pump 1, the fixed branch
Frame 6 is metal plate material, and the fixation of radiating fin group 3 is located on fixed bracket 6, and the radiating fin group 3 is by two pieces of heat radiating fins
Piece fastens composition up and down, and increasing heat dissipation area, mode is convenient, and equipped with through-hole in the radiating fin group 3, the fan 4 is located at
In radiating fin group 3, one end of the multiple flow passages heat-dissipating pipe 2 is connect with water inlet with water outlet respectively, the multiple flow passages heat dissipation
The other end of pipe 2 is located in through-hole, and the multiple flow passages heat-dissipating pipe is high temperature silver soldering multiple flow passages copper pipe, and material is coloured using hard
Metal greatly reduces the volatilization of coolant liquid, and heat-transfer rate is fast, and heat exchange area is big and anti-permeability is good, can prevent coolant liquid from letting out
Leakage causes to burn out mainboard, and two blocks of side plates 5 are respectively provided at the two sides of radiating fin group 3, radiating fin group 3 is wrapped, can
Reinforce air duct, reduces wind loss.
The air-cooled method with the air-cooled and water cooling dual-cooled of water cooling integrated radiator, it is characterised in that including following steps
Rapid: water pump conveys coolant liquid into multiple flow passages heat-dissipating pipe, and coolant liquid absorbs the element manipulation on mainboard by multiple flow passages heat-dissipating pipe
After the heat of generation, mainboard element is made to cool down, multiple flow passages heat-dissipating pipe carries out heat with radiating fin group and exchanges, radiating fin band
95% or more heat is walked, the heat of radiating fin group is discharged fan, and coolant liquid after cooling enters water pump, above-mentioned in cycles
Cooling path.The present invention has good heat dissipation effect, in conjunction with the advantages of water-cooling, wind-cooling heat dissipating, while carrying out water cooling, air-cooled pair
It cools down again, realizes that cooling velocity is fast；It is high-efficient；Main component can be not only cooled down, the purpose of periphery adjacent component can also be cooled down.
Coolant liquid from the water outlet of water pump 1 enters heat-dissipating pipe water inlet after absorbing the heat of the generation that works on CPU, more
Runner heat-dissipating pipe 2 absorbs the heat of cooling heat, leads to heat transfer, and radiating fin group 3 expands heat dissipation area and accelerates radiating rate,
The rotation of fan 4 forms circulating current and heat is discharged, and coolant liquid is after multiple flow passages heat-dissipating pipe 2 is cooling through heat-dissipating pipe water outlet stream
Out, and from water inlet it returns in water pump 1, structure is simple, and radiating efficiency is high, by fan 4, radiating fin group 3, multiple flow passages heat-dissipating pipe
2 successively fit together from top to bottom with water pump 1, and no setting is required, and very long heat conducting pipe and cold water is arranged, and overall volume is small, passes through button
The present invention can be mounted on mainboard by tool, easy for installation, be occupied little space.
Embodiment of above be only preferred embodiments of the present invention will be described, not to the scope of the present invention into
Row limits, and without departing from the spirit of the design of the present invention, this field ordinary engineering and technical personnel is to technical side of the invention
The various changes and improvements that case is made, should fall within the scope of protection determined by the claims of the present invention.
Claims (6)
1. a kind of air-cooled and water cooling integrated radiator, it is characterised in that: including water pump, the much faster runner heat dissipation of heat-transfer rate
Pipe, radiating fin group and fan, the water pump are mounted on mainboard, and the radiating fin group is located at the top of water pump, described more
Runner heat-dissipating pipe is tightly attached to radiating fin group surface, and the fan is located at the top of radiating fin group, the multiple flow passages heat dissipation
Pipe is the hollow metal pipe with heat-dissipating pipe water inlet and heat-dissipating pipe water outlet, the heat-dissipating pipe water inlet and heat-dissipating pipe water outlet
Mouth is connected to form circulation waterway with the water outlet of water pump and water inlet respectively.
2. according to claim 1 air-cooled and water cooling integrated radiator, it is characterised in that: it further include side plate, the side
Plate is respectively provided at the two sides of radiating fin group.
3. according to claim 1 air-cooled with water cooling integrated radiator, it is characterised in that: the multiple flow passages heat-dissipating pipe is
High temperature silver soldering multiple flow passages copper pipe.
4. according to claim 1 air-cooled and water cooling integrated radiator, it is characterised in that: the radiating fin group is by two
Block radiating fin fastens composition.
5. according to claim 1 air-cooled and water cooling integrated radiator, it is characterised in that: further include fixed bracket, institute
Fixed branch is stated to be erected between water pump and radiating fin group.
6. the air-cooled method with the air-cooled and water cooling dual-cooled of water cooling integrated radiator according to claim 1,
It is characterized in that: including the following steps: that water pump conveys coolant liquid into multiple flow passages heat-dissipating pipe, coolant liquid is inhaled by multiple flow passages heat-dissipating pipe
After receiving the heat that mainboard element manipulation generates, mainboard element is made to cool down, multiple flow passages heat-dissipating pipe and radiating fin group carry out heat friendship
It changing, takes away 95% or more heat of coolant liquid, the heat of radiating fin group is discharged fan, and coolant liquid after cooling enters water pump,
Circulation heat absorption radiates coolant liquid in cycles, to take away mainboard elements heat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811101573.8A CN108958437A (en) | 2018-09-20 | 2018-09-20 | Air-cooled and water cooling integrated radiator and air-cooled and water cooling dual-cooled method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811101573.8A CN108958437A (en) | 2018-09-20 | 2018-09-20 | Air-cooled and water cooling integrated radiator and air-cooled and water cooling dual-cooled method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108958437A true CN108958437A (en) | 2018-12-07 |
Family
ID=64471855
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811101573.8A Pending CN108958437A (en) | 2018-09-20 | 2018-09-20 | Air-cooled and water cooling integrated radiator and air-cooled and water cooling dual-cooled method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108958437A (en) |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106642870A (en) * | 2017-01-24 | 2017-05-10 | 武汉攀升鼎承科技有限公司 | Three-dimensional type water cooling heat dissipation device |
| CN110948130A (en) * | 2019-12-23 | 2020-04-03 | 芜湖舍达激光科技有限公司 | Laser head cooling device for copper processing |
| CN111813206A (en) * | 2020-08-12 | 2020-10-23 | 东莞市冰点智能科技有限公司 | A new type of water-cooled water-cooled radiator with built-in fan |
| CN112054444A (en) * | 2020-09-08 | 2020-12-08 | 郭金荣 | Power conversion flat cable structure of new energy solar panel battery and use method |
| CN112467170A (en) * | 2020-11-23 | 2021-03-09 | 国网北京市电力公司 | Heat radiator |
| CN112654139A (en) * | 2020-12-21 | 2021-04-13 | 安徽展新电子有限公司 | Circuit board convenient to fixed mounting |
| CN112770596A (en) * | 2020-12-02 | 2021-05-07 | 合肥巨一动力系统有限公司 | Integrated heat pipe heat dissipation water channel structure applied to double-motor controller |
| CN112930098A (en) * | 2021-01-27 | 2021-06-08 | 东莞汉旭五金塑胶科技有限公司 | Integrated liquid cooling radiator |
| CN113138647A (en) * | 2021-05-10 | 2021-07-20 | 桐庐新纪计算机有限公司 | Computer radiator that geomantic omen cold combines together |
| CN114071955A (en) * | 2021-10-28 | 2022-02-18 | 上海电气风电集团股份有限公司 | Cooling device and electronic equipment containing the same |
| CN117234311A (en) * | 2023-11-15 | 2023-12-15 | 苏州元脑智能科技有限公司 | Cold plate type heat dissipation system of wind-liquid composite framework, main plate and server |
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| CN2930228Y (en) * | 2006-08-01 | 2007-08-01 | 北京市九州风神工贸有限责任公司 | Heat sink |
| TWI580344B (en) * | 2016-02-24 | 2017-04-21 | 訊凱國際股份有限公司 | Water Colling System |
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Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106642870A (en) * | 2017-01-24 | 2017-05-10 | 武汉攀升鼎承科技有限公司 | Three-dimensional type water cooling heat dissipation device |
| CN110948130A (en) * | 2019-12-23 | 2020-04-03 | 芜湖舍达激光科技有限公司 | Laser head cooling device for copper processing |
| CN111813206A (en) * | 2020-08-12 | 2020-10-23 | 东莞市冰点智能科技有限公司 | A new type of water-cooled water-cooled radiator with built-in fan |
| CN112054444A (en) * | 2020-09-08 | 2020-12-08 | 郭金荣 | Power conversion flat cable structure of new energy solar panel battery and use method |
| CN112467170A (en) * | 2020-11-23 | 2021-03-09 | 国网北京市电力公司 | Heat radiator |
| CN112770596A (en) * | 2020-12-02 | 2021-05-07 | 合肥巨一动力系统有限公司 | Integrated heat pipe heat dissipation water channel structure applied to double-motor controller |
| CN112770596B (en) * | 2020-12-02 | 2023-03-31 | 合肥巨一动力系统有限公司 | Integrated heat pipe heat dissipation water channel structure applied to double-motor controller |
| CN112654139A (en) * | 2020-12-21 | 2021-04-13 | 安徽展新电子有限公司 | Circuit board convenient to fixed mounting |
| CN112654139B (en) * | 2020-12-21 | 2021-12-07 | 安徽展新电子有限公司 | Circuit board convenient to fixed mounting |
| CN112930098A (en) * | 2021-01-27 | 2021-06-08 | 东莞汉旭五金塑胶科技有限公司 | Integrated liquid cooling radiator |
| CN113138647A (en) * | 2021-05-10 | 2021-07-20 | 桐庐新纪计算机有限公司 | Computer radiator that geomantic omen cold combines together |
| CN114071955A (en) * | 2021-10-28 | 2022-02-18 | 上海电气风电集团股份有限公司 | Cooling device and electronic equipment containing the same |
| CN117234311A (en) * | 2023-11-15 | 2023-12-15 | 苏州元脑智能科技有限公司 | Cold plate type heat dissipation system of wind-liquid composite framework, main plate and server |
| CN117234311B (en) * | 2023-11-15 | 2024-02-09 | 苏州元脑智能科技有限公司 | Cold plate type heat dissipation system of wind-liquid composite framework, main plate and server |
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Application publication date: 20181207 |