CN108842520A - A kind of high temperature resistance high heat conduction slot insulation composite material and preparation method - Google Patents
A kind of high temperature resistance high heat conduction slot insulation composite material and preparation method Download PDFInfo
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- CN108842520A CN108842520A CN201810568901.9A CN201810568901A CN108842520A CN 108842520 A CN108842520 A CN 108842520A CN 201810568901 A CN201810568901 A CN 201810568901A CN 108842520 A CN108842520 A CN 108842520A
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- D—TEXTILES; PAPER
- D21—PAPER-MAKING; PRODUCTION OF CELLULOSE
- D21H—PULP COMPOSITIONS; PREPARATION THEREOF NOT COVERED BY SUBCLASSES D21C OR D21D; IMPREGNATING OR COATING OF PAPER; TREATMENT OF FINISHED PAPER NOT COVERED BY CLASS B31 OR SUBCLASS D21G; PAPER NOT OTHERWISE PROVIDED FOR
- D21H27/00—Special paper not otherwise provided for, e.g. made by multi-step processes
- D21H27/30—Multi-ply
- D21H27/38—Multi-ply at least one of the sheets having a fibrous composition differing from that of other sheets
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B27/10—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of paper or cardboard
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/34—Layered products comprising a layer of synthetic resin comprising polyamides
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/002—Layered products comprising a layer of paper or cardboard as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B29/00—Layered products comprising a layer of paper or cardboard
- B32B29/06—Layered products comprising a layer of paper or cardboard specially treated, e.g. surfaced, parchmentised
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/48—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials
- H01B3/52—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances fibrous materials wood; paper; press board
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
- B32B2307/206—Insulating
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2457/00—Electrical equipment
- B32B2457/04—Insulators
Landscapes
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Wood Science & Technology (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Fluid Mechanics (AREA)
- Insulating Bodies (AREA)
- Organic Insulating Materials (AREA)
Abstract
The embodiment of the invention discloses a kind of high temperature resistance high heat conduction insulation tank composite materials, it is 3-layer composite material, it is calendering aromatic polyamide paper outer layer, high thermal conductivity PA membrane middle layer, calendering aromatic polyamide paper outer layer respectively, calendering aromatic polyamide paper is combined by composite glue using dry type complex method with high thermal conductivity PA membrane；The composite glue is the compound interface for forming organic-inorganic by coupling agent and polyurethane adhesive by inorganic nanometer powder.It is different from the prior art; the present invention is to provide a kind of high temperature resistance high heat conduction insulating composite materials; it is easy to formed at normal temp and thermoforming in new energy motor slot insulation; the temperature resistant grade of material is higher; thermal resistance is higher, and thermal coefficient is lower, and heat dissipation effect is more preferable; the service life for extending material, it is more preferable to the protecting effect of motor.
Description
Technical field
The present embodiments relate to insulating materials technical fields, compound more particularly to a kind of high temperature resistance high heat conduction slot insulation
Material and preparation method thereof.
Background technique
The insulating materials of conventional motors has simple insulating paper, the flexible insulation of simple insulating film and paper and film MULTILAYER COMPOSITE
Material, as new energy technology continues to develop, new energy motor with insulating materials require it is higher and higher, such as to material thermoforming,
High thermal conductivity require, it is ageing-resistant be proposed higher and higher requirement, the prior art is less to the research of high-performance extrusion coating paper, especially
The field of compound material of aromatic polyamide paper and high thermal conductivity polyimides.Conventional composite materials temperature resistant grade is poor at present, thermally conductive
Coefficient is relatively low, has been unable to meet the requirement of the high-end motor in new-energy automobile field.
Summary of the invention
The embodiment of the present invention meets new energy mainly solving the technical problems that provide a kind of high temperature resistance high heat conduction insulating materials
Thermoforming is good during the insulation of source motor slot, and the resistance to temperature stability of material is good, non-aging, and the heat transfer efficiency of material is high.
In order to achieve the above object, the embodiment of the present invention adopts the following technical scheme that：It is exhausted to provide a kind of high temperature resistance high heat conduction
Edge composite material, is 3-layer composite material, is calendering aromatic polyamide paper outer layer respectively, among high thermal conductivity PA membrane
Layer, calendering aromatic polyamide paper outer layer, calendering aromatic polyamide paper and high thermal conductivity PA membrane are used by composite glue
Dry type complex method is combined；The composite glue is to be formed with by inorganic nanometer powder by coupling agent and polyurethane adhesive
The inorganic compound interface of machine.
Wherein, the calendering aromatic polyamide paper is NOMEX insulating paper, including 410 paper, 416 paper, 464 paper, described
The thickness of calendering aromatic polyamide paper is 0.0375mm, 0.05mm or 0.08mm.
Wherein, the high thermal conductivity PA membrane is high thermal conductivity film, and thermal coefficient is 0.4~0.8w/m.k.
Wherein, the composite glue is polyurethane-modified oiliness glue, C grades of glue temperature resistant grade or more.
Wherein, the inorganic nanometer powder is conduction powder, including nano-silicon nitride, aluminum oxide (α-Al2O3)、
Boron nitride, aluminium nitride.
Wherein, the coupling agent has silane coupling agent, titanate coupling agent.
Wherein, the glue is oiliness two-component polyurethane adhesive, and glue is two-component composition, and host agent is that macromolecular polyester adds
At object, curing agent is hexamethylene diisocyanate addition product, the host agent and curing agent solvent be acetone, ethyl acetate,
One of butanone or a variety of mixtures.
Wherein, the dry-lamination process method is that two-component glue is diluted dilution agent uniformly to apply after mixing evenly
Then glue removes solvent by drying tunnel in Kapton, then compound with the progress hot pressing of calendering aromatic polyamide paper, finally
It is handled to obtain the insulating materials of composite construction into curing room.
A kind of high temperature resistance high heat conduction insulating composite material preparation method, which is characterized in that including：
(1) it is stirred evenly after being handled host agent, curing agent, solvent, inorganic nanometer powder and coupling agent in proportion；
(2) after mixing evenly Tu apply high thermal conductivity PA membrane on.
(3) it is compound that hot pressing is then carried out with calendering aromatic polyamide paper by drying, obtains 3-layer composite material.
Wherein, the ratio is：20:2:15:1.5:0.1 or 20:2.6:10:1.4:0.12；The high thermal conductivity polyamide
Film thickness is 0.125mm or 0.075mm；The 3-layer composite material with a thickness of 0.25mm or 0.18mm.
The beneficial effect of the embodiment of the present invention is：It is different from the prior art, the present invention is to provide a kind of high temperature resistant height to lead
Thermal insulation composite material is easy to formed at normal temp and thermoforming in new energy motor slot insulation, and the temperature resistant grade of material is higher, heat
Resistance is higher, and thermal coefficient is lower, and heat dissipation effect is more preferable, extends the service life of material, more preferable to the protecting effect of motor.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of high temperature resistance high heat conduction slot insulation composite material provided in an embodiment of the present invention.
Specific embodiment
It is with reference to the accompanying drawings and embodiments, right in order to which the purpose of the present invention, method scheme and advantage is more clearly understood
The present invention is further elaborated.It should be appreciated that described herein, specific examples are only used to explain the present invention, not
For limiting the present invention.
Term "and/or" used in this specification includes the arbitrary and all of one or more relevant listed items
Combination.As long as in addition, the non-structure each other of technical characteristic involved in invention described below different embodiments
It can be combined with each other at conflict.
Refering to fig. 1, a kind of high temperature resistance high heat conduction slot insulation composite material provided in an embodiment of the present invention includes：The poly- virtue of calendering
Nylon paper 10 and high thermal conductivity PA membrane 20.Calendering aromatic polyamide paper 10 is passed through using dry-lamination process method
Composite glue is compound to be pasted on high thermal conductivity PA membrane 20.Wherein calendering aromatic polyamide paper 10 is located at outer layer, high thermal conductivity
PA membrane 20 is located at middle layer, calendering aromatic polyamide paper 10 is that outer layer forms three-layer composite structure.
Wherein, the calendering aromatic polyamide paper 10 is NOMEX insulating paper, such as 410 paper, 416 paper, 464 paper, described
Thickness be 0.0375mm, 0.05mm or 0.08mm, preferred thickness is 0.05mm, while guaranteeing the class of insulation, material
Cost can also be taken into account.
Wherein, the high thermal conductivity PA membrane 20 is high thermal conductivity biaxial stretching film, unidirectional different from conventional low heat conductivity
It is cast PA membrane, thermal coefficient is in 0.4~0.8w/m.k, the film such as kapton MT film, kapton MT+ film, institute
The thickness for the film stated is 0.075~0.188mm, preferably selection kapton MT+ film, and preferred thickness is 0.125mm.
Wherein, the composite glue is modified polyurethane oiliness glue, is passed through by the inorganic nanometer powder of high thermal conductivity
Coupling agent and polyurethane adhesive form the compound interface of organic-inorganic, reach high thermal conductivity effect.C grades of glue temperature resistant grade or more, institute
The solidification temperature for stating glue is 60~100 DEG C, and curing time is 48~96H；Preferably solidification temperature is 70 DEG C, curing time
72H。
It wherein, include high thermal conductivity powder and coupling agent in composite glue.
The inorganic nanometer powder is high thermal conductivity powder, including nano-silicon nitride, aluminum oxide (α-Al2O3), nitridation
Boron, aluminium nitride etc., preferred powder are silicon nitride, aluminum oxide (α-Al2O3)。
The coupling agent has silane coupling agent, such as A151 (vinyltriethoxysilane), A171 (vinyl trimethoxy
Silane), A172 (vinyl three (beta-methoxy ethyoxyl) silane), 3- glycidyl ether oxypropyltrimethoxysilane
(KH560), titanate coupling agent, such as monoalkoxy type, monoalkoxy pyrophosphoric acid ester type, integrated and coordination figure, preferably
The coupling agent on ground is KH560.
Wherein, the composite glue is oiliness two-component polyurethane adhesive, and glue is two-component composition, and host agent is that macromolecular is poly-
Ester addition product, such as COLFLEX HP8050, LOCTIFE LA2681, LIOFOL LA2638；Curing agent is two isocyanide of hexa-methylene
Acid esters addition product, such as Hardeer Z, LOCTIFE LA5500, DESMODUR N3390.The host agent and curing agent solvent is
One of acetone, ethyl acetate, butanone or a variety of mixtures, preferred host agent, curing agent, solvent are preferably COLFLEX
HP8050, Hardeer Z and acetone.
Wherein, the composition ratio of the composite glue is host agent (macromolecular polyester addition product)：Curing agent (hexa-methylene two
Isocyanate addition product)：Solvent：High thermal conductivity powder：Coupling agent=20:2~2.6:10~25:1~2:0.05~0.5.It is preferred that
Ratio is 20:2~2.2:12~15:1.2~1.5:0.1~0.3
Wherein, dry-lamination process method be two-component glue is diluted dilution agent after mixing evenly uniform gluing in
Then Kapton 20 removes solvent by drying tunnel, then compound with the progress hot pressing of calendering aromatic polyamide paper 10, finally
It is handled to obtain the insulating materials of composite construction into curing room, the glue viscosity is 200~1000mpa.s, preferably
Be 250~500mpa.s.
Wherein, the glue amount on Kapton 20 is applied in 15~35g/m2, and preferably glue amount is 20~25g/m2.
Wherein, the overall thickness of the insulated compound paper insulation composite material is 0.18~0.35mm, preferred thickness design
Proportion is 2:3:2 or 2:5:2, corresponding thickness is 0.18mm and 0.25mm.
Wherein, the thermal coefficient of the insulating composite material is 0.3~0.4w/m.k, higher than conventional thermal coefficient
0.1~0.15w/m.k.
Wherein, the insulating composite material heatproof testing requirements be able to take following test and it is not stratified, do not rise
Bubble, gummosis, the condition are not 220 DEG C/2000H.
The present invention is further described for embodiment below, but is not therefore limited to the present invention.
Embodiment 1
High temperature resistance high heat conduction slot insulation composite material and preparation method thereof is as follows：
(1) by HP8050：Hardeer Z：Acetone：Aluminum oxide (α-Al2O3)：KH560=20:2:15:1.5:0.1
It is stirred evenly after being handled.
(2) Tu applies on the kapton MT+ film of 0.125mm after mixing evenly.
(3) it is compound that hot pressing is then carried out with 410 paper of 0.05mm by drying, obtains 3-layer composite material, with a thickness of
0.25mm。
The described insulating composite material tensile strength machinery direction 80Mpa, transverse tensile strength 60Mpa, dielectric strength
15KV, C grades of heatproof, thermal coefficient 0.37w/m.k.
Embodiment 2
High temperature resistance high heat conduction slot insulation composite material and preparation method thereof is as follows：
(1) by LOCTIFE LA2681：LOCTIFE LA5500：Ethyl acetate：Boron nitride：KH560=20:2.6:10:
1.4:0.12 handled after stir evenly.
(2) Tu applies on the kapton MT+ film of 0.075mm after mixing evenly.
(3) it is compound that hot pressing is then carried out with 464 paper of 0.05mm by drying, obtains 3-layer composite material, with a thickness of
0.18mm。
The described insulating composite material tensile strength machinery direction 75Mpa, transverse tensile strength 65Mpa, dielectric strength
13KV, C grades of heatproof, thermal coefficient 0.3w/m.k.
The above description is only an embodiment of the present invention, is not intended to limit the scope of the present invention, all to be said using the present invention
Equivalent structure or equivalent flow shift made by bright book and accompanying drawing content is applied directly or indirectly in other relevant technology necks
Domain similarly includes within the scope of the present invention.
Claims (10)
1. a kind of high temperature resistance high heat conduction insulating composite material, which is characterized in that it is 3-layer composite material, is the poly- virtue of calendering respectively
Nylon paper outer layer, high thermal conductivity PA membrane middle layer, calendering aromatic polyamide paper outer layer, calendering aromatic polyamide paper
It is combined by composite glue using dry type complex method with high thermal conductivity PA membrane；The composite glue is received by inorganic
Rice flour body forms the compound interface of organic-inorganic by coupling agent and polyurethane adhesive.
2. requiring the insulating composite material according to right 1, which is characterized in that the calendering aromatic polyamide paper is
NOMEX insulating paper, including 410 paper, 416 paper, 464 paper, the thickness of the calendering aromatic polyamide paper be 0.0375mm,
0.05mm or 0.08mm.
3. requiring the insulating composite material according to right 1, which is characterized in that the high thermal conductivity PA membrane is high thermal conductivity
Film, thermal coefficient are 0.4~0.8w/m.k.
4. requiring the insulating composite material according to right 1, which is characterized in that the composite glue is polyurethane-modified oil
Property glue, C grades of glue temperature resistant grade or more.
5. requiring the insulating composite material according to right 1, which is characterized in that the inorganic nanometer powder is conductive powder
Body, including nano-silicon nitride, aluminum oxide, boron nitride, aluminium nitride.
6. requiring the insulating composite material according to right 1, which is characterized in that the coupling agent has silane coupling agent, metatitanic acid
Ester coupling agent.
7. requiring the insulating composite material according to right 1, which is characterized in that the glue is oiliness dual-component polyurethane
Glue, glue are two-component compositions, and host agent is macromolecular polyester addition product, and curing agent is hexamethylene diisocyanate addition product,
The host agent and curing agent solvent is one of acetone, ethyl acetate, butanone or a variety of mixtures.
8. requiring the insulating composite material according to right 1, which is characterized in that the dry-lamination process method is by double groups
Part glue is diluted dilution agent, and after mixing evenly then uniform gluing removes solvent by drying tunnel in Kapton, then
It is compound with the progress hot pressing of calendering aromatic polyamide paper, it finally enters curing room and is handled to obtain the insulation material of composite construction
Material.
9. a kind of high temperature resistance high heat conduction insulating composite material preparation method, which is characterized in that including：
(1) it is stirred evenly after being handled host agent, curing agent, solvent, inorganic nanometer powder and coupling agent in proportion；
(2) after mixing evenly Tu apply high thermal conductivity PA membrane on；
(3) it is compound that hot pressing is then carried out with calendering aromatic polyamide paper by drying, obtains 3-layer composite material.
10. preparation method according to claim 9, which is characterized in that the ratio is：20:2:15:1.5:0.1 or 20:
2.6:10:1.4:0.12；The high thermal conductivity PA membrane is with a thickness of 0.125mm or 0.075mm；The thickness of the 3-layer composite material
Degree is 0.25mm or 0.18mm.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810568901.9A CN108842520A (en) | 2018-06-05 | 2018-06-05 | A kind of high temperature resistance high heat conduction slot insulation composite material and preparation method |
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| CN201810568901.9A CN108842520A (en) | 2018-06-05 | 2018-06-05 | A kind of high temperature resistance high heat conduction slot insulation composite material and preparation method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109605850A (en) * | 2018-11-29 | 2019-04-12 | 瑞安复合材料(深圳)有限公司 | A kind of thermoelectric generator Inverter fed motor lower shrinkage flexible insulation composite film material |
| CN110349717A (en) * | 2019-07-15 | 2019-10-18 | 瑞安复合材料(深圳)有限公司 | A kind of fire retardant insulating composite material of generator high-temperature stable |
| CN110713716A (en) * | 2019-11-23 | 2020-01-21 | 西北工业大学 | High-thermal-conductivity polydopamine modified boron nitride/polyimide composite material and preparation method thereof |
| CN112659695A (en) * | 2020-12-21 | 2021-04-16 | 四川东材科技集团股份有限公司 | High-thermal-conductivity polyaramide fiber paper polyimide film soft composite material and preparation method and application thereof |
| CN112677600A (en) * | 2020-11-18 | 2021-04-20 | 中车株洲电机有限公司 | High-thermal-conductivity, high-corona-resistance and high-paint-coating-quantity groove insulating material and preparation method thereof |
| CN114927297A (en) * | 2022-06-28 | 2022-08-19 | 瑞安复合材料(深圳)有限公司 | Insulating composite material for new energy motor |
| CN116479683A (en) * | 2023-06-25 | 2023-07-25 | 烟台泰和新材高分子新材料研究院有限公司 | Preparation method of adhesive-free insulating composite paper and insulating composite paper |
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Cited By (10)
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|---|---|---|---|---|
| CN109605850A (en) * | 2018-11-29 | 2019-04-12 | 瑞安复合材料(深圳)有限公司 | A kind of thermoelectric generator Inverter fed motor lower shrinkage flexible insulation composite film material |
| CN110349717A (en) * | 2019-07-15 | 2019-10-18 | 瑞安复合材料(深圳)有限公司 | A kind of fire retardant insulating composite material of generator high-temperature stable |
| CN110713716A (en) * | 2019-11-23 | 2020-01-21 | 西北工业大学 | High-thermal-conductivity polydopamine modified boron nitride/polyimide composite material and preparation method thereof |
| CN110713716B (en) * | 2019-11-23 | 2022-01-28 | 西北工业大学 | High-thermal-conductivity polydopamine modified boron nitride/polyimide composite material and preparation method thereof |
| CN112677600A (en) * | 2020-11-18 | 2021-04-20 | 中车株洲电机有限公司 | High-thermal-conductivity, high-corona-resistance and high-paint-coating-quantity groove insulating material and preparation method thereof |
| CN112659695A (en) * | 2020-12-21 | 2021-04-16 | 四川东材科技集团股份有限公司 | High-thermal-conductivity polyaramide fiber paper polyimide film soft composite material and preparation method and application thereof |
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Application publication date: 20181120 |