CN108807359A - A kind of LED component and manufacturing method - Google Patents
A kind of LED component and manufacturing method Download PDFInfo
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- CN108807359A CN108807359A CN201810831659.XA CN201810831659A CN108807359A CN 108807359 A CN108807359 A CN 108807359A CN 201810831659 A CN201810831659 A CN 201810831659A CN 108807359 A CN108807359 A CN 108807359A
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- led
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- mounting groove
- light extraction
- convex lens
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 238000000605 extraction Methods 0.000 claims abstract description 59
- 238000005538 encapsulation Methods 0.000 claims abstract description 43
- 239000011159 matrix material Substances 0.000 claims description 20
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 17
- 239000013078 crystal Substances 0.000 claims description 10
- 239000011521 glass Substances 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000008119 colloidal silica Substances 0.000 claims description 6
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 6
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 6
- 239000000741 silica gel Substances 0.000 claims description 6
- 229910002027 silica gel Inorganic materials 0.000 claims description 6
- 229960001866 silicon dioxide Drugs 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims description 4
- 229910052751 metal Inorganic materials 0.000 claims description 4
- 239000002184 metal Substances 0.000 claims description 4
- 229920000515 polycarbonate Polymers 0.000 claims description 4
- 239000010453 quartz Substances 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 210000002421 cell wall Anatomy 0.000 claims description 3
- 239000002131 composite material Substances 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 239000011195 cermet Substances 0.000 claims description 2
- 239000004417 polycarbonate Substances 0.000 claims description 2
- 239000004952 Polyamide Substances 0.000 claims 1
- 125000000879 imine group Chemical group 0.000 claims 1
- 229920002647 polyamide Polymers 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 230000003287 optical effect Effects 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- 238000005286 illumination Methods 0.000 description 3
- 239000004425 Makrolon Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 2
- 230000032683 aging Effects 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 238000007711 solidification Methods 0.000 description 2
- 230000008023 solidification Effects 0.000 description 2
- 230000001954 sterilising effect Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- TVEXGJYMHHTVKP-UHFFFAOYSA-N 6-oxabicyclo[3.2.1]oct-3-en-7-one Chemical compound C1C2C(=O)OC1C=CC2 TVEXGJYMHHTVKP-UHFFFAOYSA-N 0.000 description 1
- 239000000571 coke Substances 0.000 description 1
- 239000000084 colloidal system Substances 0.000 description 1
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- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 238000004021 metal welding Methods 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED components, encapsulation base is equipped with mounting groove, flexible circuit board is fitted on the madial wall of mounting groove, flexible circuit board is equipped with multiple LED chips, the light extraction convex lens of closing mounting groove notch is also associated on encapsulation base, the light that LED chip is sent out converges at the focal position of light extraction convex lens.LED device structure of the present invention realizes low-angle parallel light emergence effect.The invention also discloses a kind of manufacturing methods of LED component, including step：A：Encapsulation base is made, mounting groove is opened up on encapsulation base；B：LED chip is installed on flexible circuit board；C：Flexible circuit board is bent into spherical structure and is bonded and is installed in mounting groove and fixes, and LED chip is made to be connected to external electrode；D：Light extraction convex lens is overlying on mounting groove, and light extraction convex lens is sealably coupled on encapsulation base, it is ensured that the light of LED chip 4 converges at the focal position of light extraction convex lens 5.The manufacturing approach craft is simple.
Description
【Technical field】
The present invention relates to a kind of LED component, the present invention also designs a kind of LED component manufacturing method, belongs to LED component encapsulation
Technical field.
【Background technology】
Light-emitting diode LED is as a kind of New Solid light source, the narrow spectral property of monochrome with light, and wavelength from
It is continuously adjusted within the scope of 200nm to 2000nm, is customizing and comparing traditional incandescent lamp, fluorescent lamp and mercury lamp in light source design
Equal light sources have incomparable huge advantage, while it also has the spies such as high electro-optical efficiency, long-life, environment friendly and pollution-free
Property.With the new type light source design of LED and the continuous breakthrough of application, answered in LED illumination and including the special source in being solidificated in
It will become more dependent on the design advantage and convenience of solid state light emitter with field, these changes all will provide more wide answer for LED
Use foreground.
In the early time, the technical solution for generally using blue LED excited yellow fluorescent powder mixed white light in illumination applications, general
The angle of emergence of bigger means that light source has the irradiated area of bigger in logical illumination application, therefore main emphasis improves in the design
The extraction efficiency of light source.Then, for searchlight, auto lamp, exposure etc. need light low-angle be emitted special applications in,
It is generally realized by the even multiple optical design of complicated lens, but the structure design of such complexity is near ultraviolet
There is huge challenge in curing light source design.Ultra-violet curing application needs light source high-density arrangement and light source and shadow surface are apart from pole
It is short, and the multiple optical design for requiring the luminous power of unit area high, therefore being used on white light at present improves and light distribution
Scheme be not suitable for the monochromatic sources such as high-power near ultraviolet cure applications design.
Therefore, the present invention is based on above deficiency and generates.
【Invention content】
The purpose of the present invention is to overcome the shortcomings of the prior art and to provide a kind of simple in structure, it can be achieved that high-power, uniformity
Good, low-angle parallel light emergence effect LED component, to push LED in the further big rule of the extraordinary application field such as solidification
Mould application.
The present invention also provides a kind of LED component manufacturing method simple for process, the LED devices produced using the manufacturing method
Part has that power is big, uniformity is good, the outgoing effect of low-angle parallel light emergence, to push LED in the extraordinary application such as solidification
The further large-scale application in field.
The present invention is achieved by the following technical solutions：
A kind of LED component, it is characterised in that：Including encapsulation base 1, the encapsulation base 1 is equipped with soft for installing
The mounting groove 3 of property circuit board 2, the flexible circuit board 2 are fitted on the madial wall of mounting groove 3, the flexible electrical
Base board 3 is equipped with multiple LED chips 4, closing 3 notch of mounting groove is also associated on the encapsulation base 1 and can be for LED core
The light extraction convex lens 5 that the light of piece 4 projects, the light that the LED chip 4 is sent out converge at the focus position of light extraction convex lens 5
It sets, the external electrode 6 for being connected to LED chip 4 and external power supply is additionally provided on the encapsulation base 1.
LED component as described above, it is characterised in that：The flexible circuit board 2 is bent spherical structure and is bonded
On the cell wall of mounting groove 3, the centre of sphere 2a of the spherical structure is overlapped with the focus of light extraction convex lens 5.
LED component as described above, it is characterised in that：In the mounting groove 3 and it is located at light extraction convex lens 5 and flexible electrical
Space between base board 2 for vacuum or is full of nitrogen.
LED component as described above, it is characterised in that：In the mounting groove 3 and it is located at light extraction convex lens 5 and flexible electrical
Colloidal silica 7 is filled between base board 2.
LED component as described above, it is characterised in that：The light extraction convex lens 5 be quartz lens or glass lens or
Resin lens or acrylic lens or polycarbonate lens.
LED component as described above, it is characterised in that：The light extraction convex lens 5 be with 7 one of the colloidal silica at
The silica-gel lens of type.
LED component as described above, it is characterised in that：The encapsulation base 1 is metal structure or ceramic structure or gold
Belong to ceramic composite structures or pcb board structure or MCPCB harden structures.
LED component as described above, it is characterised in that：The flexible circuit board 2 includes flexible board matrix and setting
Chip circuit on flexible board matrix, chip crystal bonding area is additionally provided on the flexible board matrix, and the LED chip 4 is solid
It is scheduled on chip crystal bonding area, the chip circuit includes the chip bonding pad being arranged in chip crystal bonding area, is arranged in flexible board
The external circuits mouth being connected on matrix and with external electrode 6, and be arranged in flexible board matrix and be connected to external circuits mouth with
Circuit in the flexible base board of chip bonding pad.
LED component as described above, it is characterised in that：The flexible board matrix is polyester construction or polyimide structures
Or polytetrafluoroethylene (PTFE) structure or soft epoxy-glass cloth.
A kind of manufacturing method of LED component, it is characterised in that：Include the following steps：
A：Encapsulation base 1 is made, mounting groove 3 is opened up on encapsulation base 1；
B：LED chip 4 is carried out on corresponding position to install, realize LED after flexible circuit board 2 is planarized by fixture
Chip 4 is fixed and LED chip 4 is made to be connected to the chip circuit in flexible circuit board 2；
C：Flexible circuit board 2 is bent to spherical structure and is bonded and is installed in mounting groove 3 and fixes, and is made soft
LED chip 4 in property circuit board 2 is connected to external electrode 6；
D：Light extraction convex lens 5 is overlying on mounting groove 3, and light extraction convex lens 5 is sealably coupled on encapsulation base 1.Really
The light for protecting LED chip 4 converges at the focal position of light extraction convex lens 5.
Compared with prior art, the present invention has the following advantages：The present invention is mounted on the LED chip on flexible circuit board
Light converges at the focal position of light extraction convex lens, it is believed that and the light extraction of LED component is the point light source light extraction close to multi-angle,
Therefore, according to the beam projecting track of convex lens, you can realize final high-power, the parallel light extraction of low-angle.Moreover, of the invention
Simple in structure, size can be made very small, and need not subsequently carry out repeatedly complicated optical design and directional light can be realized, can be direct
It is applied to the fields such as ultra-violet curing, exposure of the light source with collimation property；In addition, LED component of the present invention can introduce more waves
The combination of long monochromatic source by the matching of circuit design and is respectively driven, high-quality white light and monochromatic source may be implemented
Collimation outgoing, meet long-range searchlighting and signal transmitting etc. application fields；Again, LED component manufacturing method of the present invention can adopt
It is of low cost with the full-inorganic packaging technology for resisting high-power nearly deep ultraviolet aging, it can also realize the sterilizing of orientation.
【Description of the drawings】
Fig. 1 is 1 sectional view of LED component embodiment of the present invention；
Fig. 2 is 1 light path schematic diagram of LED component embodiment of the present invention；
Fig. 3 is 1 vertical view of LED component embodiment of the present invention；
Fig. 4 is 2 sectional view of LED component embodiment of the present invention；
Fig. 5 is 3 sectional view of LED component embodiment of the present invention.
【Specific implementation mode】
The invention will be further described below in conjunction with the accompanying drawings：
LED component embodiment 1：
As shown in Figure 1 to Figure 3, a kind of LED component, including encapsulation base 1, the encapsulation base 1 are equipped with for pacifying
The mounting groove 3 of flexible circuit board 2 is filled, the flexible circuit board 2 is fitted on the madial wall of mounting groove 3, and described is soft
Property circuit board 3 be equipped with multiple LED chips 4, closing 3 notch of mounting groove is also associated on the encapsulation base 1 and can be supplied
The light extraction convex lens 5 that the light of LED chip 4 projects, the light that the LED chip 4 is sent out converge at the coke of light extraction convex lens 5
Position is put, the external electrode 6 for being connected to LED chip 4 and external power supply is additionally provided on the encapsulation base 1.
The light for the LED chip 4 being mounted on flexible circuit board 2 converges at the focal position of light extraction convex lens 5, can be with
Think that the light extraction of LED component is the point light source light extraction close to multi-angle, therefore, according to the beam projecting track of convex lens, you can
Realize final high-power, the parallel light extraction of low-angle.Moreover, the configuration of the present invention is simple, size can be made very small, after not needing
Repeatedly directional light can be realized in complicated optical design for continuous progress, may be directly applied to that light source is needed to have the ultraviolet solid of collimation property
The fields such as change, exposure；In addition, LED component of the present invention can introduce the combination of multi-wavelength monochromatic source, simultaneously by the matching of circuit design
It is respectively driven, the collimation outgoing of high-quality white light and monochromatic source may be implemented, meet long-range searchlighting and signal transmitting etc.
Application field.
As shown in Figure 1, the flexible circuit board 2 is bent spherical structure and is fitted on the cell wall of mounting groove 3, it should
The centre of sphere 2a of spherical structure is overlapped with the focus of light extraction convex lens 5.Therefore, it more can ensure that the LED chip on flexible circuit board 2
4 light sent out converge at the focal position of light extraction convex lens 5, realize final high-power, the parallel light extraction of low-angle.
The encapsulation base 1 be metal structure or ceramic structure or having cermet composite structure or pcb board structure or
MCPCB harden structures.The homonymy on encapsulation base 1 and positioned at 3 notch of mounting groove can be arranged in external electrode 6, can also pacify
The other side of 3 notch of tankage；If 1 surface insulation of encapsulation base, such as surface are ceramics, external electrode 6 can be set up directly on
On encapsulation base 1, if 1 surface of encapsulation base is on-insulated, such as surface is metal, between external electrode 6 and encapsulation base 1
It needs that insulating layer is arranged.
Space in the mounting groove 3 and between light extraction convex lens 5 and flexible circuit board 2 is vacuum or is full of
Nitrogen.
The light extraction convex lens 5 is quartz lens or glass lens or resin lens or acrylic lens or makrolon
Lens.
The flexible circuit board 2 includes flexible board matrix and the chip circuit being arranged on flexible board matrix, described
Flexible board matrix on be additionally provided with chip crystal bonding area, the LED chip 4 is fixed on chip crystal bonding area, the flexible board
Matrix is polyester construction or polyimide structures or polytetrafluoroethylene (PTFE) structure or soft epoxy-glass cloth.
The chip circuit include the chip bonding pad being arranged in chip crystal bonding area, be arranged on flexible board matrix and with
The external circuits mouth that external electrode 6 is connected to, and it is arranged in flexible board matrix and is connected to external circuits mouth and chip bonding pad
Circuit in flexible base board.
Wherein chip bonding pad can be connected by the electrode of the techniques such as face-down bonding, formal dress welding, vertical welding and LED chip
Logical, circuit connects chip bonding pad and the external circuits mouth on flexible board matrix according to circuit design demand in flexible base board.For reality
Show the radiating requirements of high-power chip and reduce thermal resistance, the flexible board matrix thickness of chip crystal bonding area can be more soft than other positions
The thickness of property plate matrix is thin.
The LED chip wave-length coverage is 200nm to 2000nm, can be a kind of LED chip can also be a variety of LED
Chip carries out driving modulation by circuit design.4 size of LED chip is microLED, miniLED or routine of 10um to 1mm
LED。
The manufacturing method for manufacturing LED component in the present embodiment, includes the following steps：
A：Encapsulation base 1 is made, mounting groove 3 is opened up on encapsulation base 1；
B：LED chip 4 is carried out on corresponding position to install, realize LED after flexible circuit board 2 is planarized by fixture
Chip 4 is fixed and LED chip 4 is made to be connected to the chip circuit in flexible circuit board 2；
C：Flexible circuit board 2 is bent to spherical structure and is bonded and is installed in mounting groove 3 and fixes, and is made soft
LED chip 4 in property circuit board 2 is connected to external electrode 6；
D：Light extraction convex lens 5 is overlying on mounting groove 3, and light extraction convex lens 5 is sealably coupled on encapsulation base 1, really
The light for protecting LED chip 4 converges at the focal position of light extraction convex lens 5.When installing light extraction convex lens 5, light extraction convex lens 5 passes through
Fluid sealant or metal welding procedure are directly sealed on encapsulation base 1 and cover 3 notch of mounting groove, thus by entire flexible circuit
The full-inorganic packaging technology of anti-high-power nearly deep ultraviolet aging may be used using above-mentioned LED component manufacturing method for base plate seals,
It is of low cost, it can also realize the sterilizing of orientation.
LED component embodiment 2：
As shown in figure 4, LED component embodiment 2 and LED component embodiment 1 difference lies in：
In the mounting groove 3 and it is filled with colloidal silica 7 between light extraction convex lens 5 and flexible circuit board 2, it is described
Light extraction convex lens 5 be and the 7 integrally formed silica-gel lens of colloidal silica.
The manufacturing method for manufacturing LED component in the present embodiment, includes the following steps：
A：Encapsulation base 1 is made, mounting groove 3 is opened up on encapsulation base 1；
B：LED chip 4 is carried out on corresponding position to install, realize LED after flexible circuit board 2 is planarized by fixture
Chip 4 is fixed and LED chip 4 is made to be connected to the chip circuit in flexible circuit board 2；
C：Flexible circuit board 2 is bent to spherical structure and is bonded and is installed in mounting groove 3 and fixes, and is made soft
LED chip 4 in property circuit board 2 is connected to external electrode 6；
D：Light extraction convex lens 5 is overlying on mounting groove 3, and light extraction convex lens 5 is sealably coupled on encapsulation base 1, really
The light for protecting LED chip 4 converges at the focal position of light extraction convex lens 5.Install light extraction convex lens 5 when, by it is above-mentioned install it is soft
Property circuit board 2 encapsulation base 1 be placed in molding process equipments, be integrally formed embedded mounting groove 3 according to the shape that presets
Silica-gel lens.
LED component embodiment 3：
As shown in figure 5, LED component embodiment 3 and LED component embodiment 1 difference lies in：
The light extraction convex lens 5 is quartz lens or glass lens or resin lens or acrylic lens or makrolon
Lens, the mounting groove 3 is interior and colloidal silica 7 is filled between light extraction convex lens 5 and flexible circuit board 2.
The manufacturing method for manufacturing LED component in the present embodiment, includes the following steps：
A：Encapsulation base 1 is made, mounting groove 3 is opened up on encapsulation base 1；
B：LED chip 4 is carried out on corresponding position to install, realize LED after flexible circuit board 2 is planarized by fixture
Chip 4 is fixed and LED chip 4 is made to be connected to the chip circuit in flexible circuit board 2；
C：Flexible circuit board 2 is bent to spherical structure and is bonded and is installed in mounting groove 3 and fixes, and is made soft
LED chip 4 in property circuit board 2 is connected to external electrode 6；
D：Light extraction convex lens 5 is overlying on mounting groove 3, and light extraction convex lens 5 is sealably coupled on encapsulation base 1, really
The light for protecting LED chip 4 converges at the focal position of light extraction convex lens 5.When light extraction convex lens 5 is installed, light extraction convex lens 5 is covered
In on 3 notch of mounting groove, and silica gel is poured into mounting groove 3 by process for filling colloid and is sealed.
Claims (10)
1. a kind of LED component, it is characterised in that：Including encapsulation base (1), the encapsulation base (1) is equipped with for installing
The mounting groove (3) of flexible circuit board (2), the flexible circuit board (2) are fitted on the madial wall of mounting groove (3), institute
The flexible circuit board (3) stated is equipped with multiple LED chips (4), and the encapsulation base is also associated with closing mounting groove on (1)
(3) notch and the light extraction convex lens (5) that can be projected for the light of LED chip (4), the light remittance that the LED chip (4) is sent out
Gather in be additionally provided on the focal position of light extraction convex lens (5), the encapsulation base (1) for be connected to LED chip (4) with it is external
The external electrode (6) of power supply.
2. LED component according to claim 1, it is characterised in that：The flexible circuit board (2) is bent spherical knot
Structure and be fitted on the cell wall of mounting groove (3), the centre of sphere (2a) of the spherical structure is overlapped with the focus of light extraction convex lens (5).
3. LED component according to claim 1, it is characterised in that：In the mounting groove (3) and it is located at light extraction convex lens
(5) space between flexible circuit board (2) for vacuum or is full of nitrogen.
4. LED component according to claim 1, it is characterised in that：In the mounting groove (3) and it is located at light extraction convex lens
(5) colloidal silica (7) is filled between flexible circuit board (2).
5. LED component according to claim 4, it is characterised in that：The light extraction convex lens (5) is quartz lens or glass
Glass lens or resin lens or acrylic lens or polycarbonate lens.
6. LED component according to claim 4, it is characterised in that：The light extraction convex lens (5) be and the silica gel
Body (7) integrally formed silica-gel lens.
7. LED component according to claim 1, it is characterised in that：The encapsulation base (1) is metal structure or ceramics
Structure or having cermet composite structure or pcb board structure or MCPCB harden structures.
8. LED component according to claim 1, it is characterised in that：The flexible circuit board (2) includes flexible board base
Body and the chip circuit being arranged on flexible board matrix are additionally provided with chip crystal bonding area, the LED on the flexible board matrix
Chip (4) is fixed on chip crystal bonding area, and the chip circuit includes the chip bonding pad being arranged in chip crystal bonding area, setting
The external circuits mouth being connected on flexible board matrix and with external electrode (6), and be arranged in flexible board matrix and be connected to outer
Connect circuit in the flexible base board of circuit mouth and chip bonding pad.
9. LED component according to claim 8, it is characterised in that：The flexible board matrix is polyester construction or polyamides
Imine structure or polytetrafluoroethylene (PTFE) structure or soft epoxy-glass cloth.
10. a kind of manufacturing method of LED component, it is characterised in that：Include the following steps：
A：Encapsulation base (1) is made, mounting groove (3) is opened up on encapsulation base (1)；
B：LED chip (4) is carried out on corresponding position to install, realize LED after flexible circuit board (2) is planarized by fixture
Chip (4) is fixed and LED chip (4) is made to be connected to the chip circuit in flexible circuit board (2)；
C：Flexible circuit board (2) is bent to spherical structure and is bonded and is installed in mounting groove (3) and fixes, and is made soft
LED chip (4) in property circuit board (2) is connected to external electrode (6)；
D：Light extraction convex lens (5) is overlying on mounting groove (3), and light extraction convex lens (5) is sealably coupled to encapsulation base (1)
On, it is ensured that the light of LED chip (4) converges at the focal position of light extraction convex lens (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810831659.XA CN108807359A (en) | 2018-07-26 | 2018-07-26 | A kind of LED component and manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810831659.XA CN108807359A (en) | 2018-07-26 | 2018-07-26 | A kind of LED component and manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108807359A true CN108807359A (en) | 2018-11-13 |
Family
ID=64078264
Family Applications (1)
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|---|---|---|---|
| CN201810831659.XA Pending CN108807359A (en) | 2018-07-26 | 2018-07-26 | A kind of LED component and manufacturing method |
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