CN108766867A - A kind of semiconductor chip production technology - Google Patents
A kind of semiconductor chip production technology Download PDFInfo
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- CN108766867A CN108766867A CN201810532937.1A CN201810532937A CN108766867A CN 108766867 A CN108766867 A CN 108766867A CN 201810532937 A CN201810532937 A CN 201810532937A CN 108766867 A CN108766867 A CN 108766867A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
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Abstract
The invention belongs to technical field of manufacturing semiconductors, specifically a kind of semiconductor chip production technology, the technique includes the following steps：Wafer is put on grinder and is ground into minute surface；Wafer is sent into high temperature dispersing furnace and carries out oxidation processes；Wafer is sent on spin coating device and smears photoresist；Wafer is sent into litho machine and is exposed, develops；Wafer is sent into etching machine and carries out plasma etching；Wafer is sent into high temperature furnace and is doped；Spin coating device in the present invention passes through side's setting spin coating plate on the table, No.1 motor drives the rotation that spin coating plate is stablized, electric cylinders drive No.1 motor, spin coating plate at the uniform velocity to move down, and spin coating plate is equably tiled glue to crystal column surface, realize spin coating that is uniform, stablizing；It by the mutual cooperation of No.1 sliding block and gas blow pipe, realizes and the dust of table surface is blowed to surrounding, and then be insufflated slot and eject upward air-flow and take out of.
Description
Technical field
The invention belongs to technical field of manufacturing semiconductors, specifically a kind of semiconductor chip production technology.
Background technology
Wafer refers to the silicon chip used in silicon semiconductor production of integrated circuits, and wafer is the load for producing used in integrated circuits
Body, general significance wafer refer to monocrystalline silicon wafer more, and wafer is most common semi-conducting material.Photoetching process includes that chip is even in total
Glue, front baking, exposure, development, post bake, burn into remove photoresist, wherein spin coating is to make to be distributed in the photoresist on chip
It is evenly distributed and certain thickness can be reached, the photoresist of wafer surface can obtain appropriate photosensitive when to expose；Wherein exist
Usually all it is that the afer rotates being adsorbed on vacuum cup are driven using motor when spin coating, to make glue under the influence of centrifugal force
It is uniformly distributed on a wafer, glued membrane applied thickness can be controlled according to the speed of electric machine rotational axis.But due to work
Platform may not be in horizontality when mounted, and such vacuum cup is not just horizontality, so when motor rotates, inhale
The centrifugal force that disk generates just not on horizontal plane direction, to make the uneven of coating adhesive distribution, leads to the glue-line on chip
Thickness differ, to largely effect on subsequent photoetching process, therefore there is an urgent need to the spin coating schemes that a kind of other modes are realized.
Also occur in the prior art some semiconductor silicon wafers manufacture technical solution, such as application No. is
201721240564.8 Chinese patent discloses a kind of litho machine wafer spin coating device, including workbench, fixation
The motor of connection on the table, and the horizontal vacuum cup being set on electric machine main shaft, further include a L-shaped support plate；
The front of the workbench is equipped with a horizon rule；The left side of the workbench is rotatably connected on support plate by articulated shaft
On vertical plate portion medial surface；Two horizontally disposed guide rails and one are additionally provided on the medial surface of the vertical plate portion of the support plate
Between two guide rails, and horizontally disposed threaded rod, wherein one end of the threaded rod is rotatably connected on branch by bearing
On the vertical plate portion medial surface of fagging；
Spin processes in the technical solution are realized makes entire workbench be in horizontality by adjusting threaded rod, from
And ensure that the thickness of coating adhesive is uniform, but the motor rotation above the workbench in the program will produce vibration, and then make
The sucker shake of side, influences the uniformity of spin coating layer；The wind turbine being arranged above wafer can only ensure that the air above wafer is stream
Dynamic, outside is not blocked in from source dust；The spin coating in the way of centrifugation throws glue out using centrifugal force, even
The surface of glue can not very be ensured of a smooth flat, also cannot very ensure the quality of wafer.
Invention content
In order to make up for the deficiencies of the prior art, a kind of semiconductor chip production technology proposed by the present invention makes in the technique
Spin coating device drives the rotation that spin coating plate is stablized, electric cylinders to drive by side's setting spin coating plate on the table, No.1 motor
No.1 motor, spin coating plate at the uniform velocity move down, and spin coating plate is equably tiled glue to crystal column surface, realize uniform, stable
Spin coating；By the way that in bench top edges of boards, along setting blowing groove, the high pressure draught of blowing groove blowout is ejected on Pneumatic extension plate,
It realizes rectangular at the enclosure space being made of air-flow on the table, prevents having dust entrance during spin coating；Pass through
The mutual cooperation of No.1 sliding block and gas blow pipe realizes and the dust of table surface is blowed to surrounding, and then realizes and blow to air blowing
The dust for the air-flow that slot ejects is taken out of by upward air-flow, and the dust for blowing to support plate riser blows to air along dust board
In.
The technical solution adopted by the present invention to solve the technical problems is：A kind of semiconductor chip production of the present invention
Technique, the technique include the following steps：
Step 1：Wafer is put on grinder and is ground into minute surface；
Step 2：Wafer in step 1 is sent into high temperature dispersing furnace and carries out oxidation processes；
Step 3：Wafer in step 2 is sent on spin coating device and smears photoresist；
Step 4：Wafer in step 3 is sent into litho machine and is exposed, develops；
Step 5：Wafer in step 4 is sent into etching machine and carries out plasma etching；
Step 6：Wafer in step 5 is sent into high temperature furnace and is doped；
Spin coating device in step 3, including support plate, dust-break module, electric cylinders, No.1 motor, swingle, spin coating plate, work
Make platform, vacuum generator, electric cylinders pedestal is fixedly connected with below the support plate top plate；Electric cylinders cylinder rod end is fixedly connected with one
Number non-output end of motor；The rotating shaft end head of the No.1 motor is fixedly connected with swingle one end；The swingle is hinged spin coating plate
One end, hinged place are equipped with torsional spring；Arc surface is arranged in the spin coating plate other end；Workbench is equipped with below the spin coating plate；It is described
Workbench left side is fixedly connected on support plate riser；The workbench is cuboid, and cavity, work are arranged inside workbench
One group of venthole is arranged in platform top plate；Lower section is equipped with vacuum generator, workbench bottom plate lower right-hand side in the middle part of the workbench bottom plate
Equipped with check valve；Dust-break module is equipped between the workbench and support plate top plate；The dust-break module is for preventing surrounding
Dust is between people's workbench and support plate top plate；Wafer is put on workbench, opens the switch of connection vacuum generator, wafer
It is attracted to worktable upper surface；No.1 motor drives swingle rotation, swingle to drive the rotation of spin coating plate, the rotation of spin coating plate
It is swung up simultaneously, when the stabilization of speed of No.1 motor, spin coating plate is also stabilized in a fixed plane；Electric cylinders drive one
Number motor, spin coating plate move down, and when spin coating plate touches the glue of wafer upper surface, spin coating plate equably tiles glue
To crystal column surface.
The dust-break module includes blowing groove, Pneumatic extension plate, dust board, and the blowing groove is arranged in bench top edges of boards
Edge, workbench left side edge are not provided with blowing groove；It is fixedly connected with Pneumatic extension plate on the hanging side wall of support plate top plate；It is described
Pneumatic extension plate is more piece liftout plate, and Pneumatic extension plate tilts upward ejection；The support plate riser is close to the position of workbench
Rectangular opening is set, dust board is hinged in rectangular opening；The dust board is used to exclude to blow to from glue-coated surface the ash of support plate riser
Dirt；The compressed air of high pressure is passed through in blowing groove, it is rectangular at the enclosure space being made of air-flow on the table, it prevents in spin coating
During have dust entrance；Air-flow with dust is ejected into upwards on Pneumatic extension plate, is pneumatically stretched by what is be obliquely installed
It is ejected outward after the blocking of contracting plate, it is long-term to stop that air-flow leads to Pneumatic extension plate surface gather dust, when stopping spin coating, gas
Dynamic expansion plate is shunk, and the surfaces externally and internally that Pneumatic extension plate respectively saves is capable of the dust of mutual scraper surface, realizes rapid cleaning gas
Dynamic expansion plate；Pneumatic extension plate and blowing groove are not arranged for support plate riser side, and setting dust board can be excluded from glue-coated surface
Blow to the dust of support plate riser.
Cavity is arranged in the spin coating intralamellar part, and one group of through-hole is arranged in one side surface of spin coating plate spin coating, and through-hole is horizontally disposed；Institute
It states spin coating plate and is hinged aeroscopic plate close to the position of through-hole, hinged place is equipped with torsional spring；It is passed through compressed air in spin coating intralamellar part cavity,
While spin coating plate spin coating, air is blown by horizontally disposed stomata, blows away the dust above wafer, when ensure that spin coating
Cleaning；Aeroscopic plate can realize the direction for changing air-flow and size.
The hole of workbench top plate center is No.1 through-hole；The No.1 through-hole to worktable upper surface for blowing
Gas；It is fixedly connected with air blowing cylinder in the No.1 through-hole；No.1 cylindrical cavity, No.1 cylinder are set inside air blowing cylinder lower end
The No.1 that is slidably installed in shape cavity sliding block；Spring is equipped with below the No.1 sliding block；Through-hole is arranged in air blowing cylinder lower end, blows
No.1 blind hole is arranged in cylinder upper surface, and be slidably installed gas blow pipe in No.1 blind hole；Spring is equipped with below the gas blow pipe；The air blowing
Pipe is internally provided with cavity, gas blow pipe lower ending opening, and one group of through-hole is arranged on gas blow pipe cylindrical surface；On the No.1 cylindrical cavity
It is connected in the middle part of side right side setting connection stomata and No.1 blind hole；The air blowing cylinder is close to the outer of No.1 cylindrical cavity upper right
Wall is equipped with check valve；Described check valve one end is connected to the connection stomata above No.1 cylindrical cavity, and the check valve other end is logical
Tracheae is crossed to be connected in extraneous air；Wafer is put on workbench, and wafer squeezes gas blow pipe upper end, and gas blow pipe compressed spring is downward
It is mobile；No.1 upper end of slide block is connected by check valve and extraneous air, opens the switch of connection vacuum generator, No.1 sliding block pressure
Contracting spring moves down；After the completion of spin coating, close the switch of vacuum generator, remove wafer, gas blow pipe spring-loaded to
Upper movement, connection stomata is opened when being moved to the top, and No.1 sliding block is moved up by spring extruding, the sky above No.1 sliding block
Gas connects stomata by top and is pressed into No.1 blind hole, is ejected by the inflatable mouth on gas blow pipe cylindrical surface, the gas ejected
The dust of table surface is blowed to surrounding by stream；The dust for blowing to the air-flow that blowing groove ejects is taken out of by upward air-flow, blows
It is blown in air along dust board to the dust of support plate riser.
All holes on the workbench top plate on the outside of No.1 through-hole are No. two through-holes；No. two through-holes are for adsorbing crystalline substance
Circle；It is fixedly connected with cylinder sleeve below No. two through-holes；The cylinder sleeve is cylinder, and No. two cylindrical cavities are arranged inside cylinder sleeve,
Through-hole is set below No. two cylindrical cavities, and No.1 gas vent is arranged in No. two cylindrical cavity right side centrals；No. two cylinders
Be slidably installed conical sliding block in shape cavity；Spring is equipped with below the conical sliding block；Plane is arranged No. two on the conical sliding block
Blind hole, No. two blind holes lower section setting stomatas are connected to No. two cylindrical cavities；Brush stroke is equipped in No. two blind holes；The hair
Brush holder support is connect by ball-screw with No. two blind holes, and spring is equipped with below brush stroke；Brush stroke upper end cylindrical surface is equipped with
One group of hairbrush；Wafer is put on workbench, opens the switch of connection vacuum generator, and brush stroke is rotated while being pressed along ball-screw
Contracting spring moves down；Conical sliding block compressed spring moves down, and cavity passes through No.1 gas vent and work above conical sliding block
When making connection inside platform, conical sliding block moves up under spring force, and brush stroke rotation moves up, and gap disappears,
When the pressure loss above conical sliding block, brush stroke rotation moves down, and conical sliding block moves down again, the cone of conical sliding block
Gap between shape face and No.1 gas vent is again turned on, and conical sliding block and brush stroke realization pump；Spin coating is completed
Afterwards, the switch for closing vacuum generator removes wafer, and brush stroke spring-loaded rotation moves up, and conical sliding block is by bullet
Spring force effect moves up, and realization is taken to after the dust in No. two through-holes is brushed outside hole, then the air-flow blown out by gas blow pipe is sent
Into air.
Beneficial effects of the present invention are as follows：
1. a kind of semiconductor chip production technology of the present invention, the spin coating device used in the technique is by working
Spin coating plate is set above platform, and No.1 motor drives the rotation that spin coating plate is stablized, electric cylinders to drive No.1 motor, spin coating plate at the uniform velocity downward
Mobile, spin coating plate is equably tiled glue to crystal column surface, realizes spin coating that is uniform, stablizing.
2. a kind of semiconductor chip production technology of the present invention, the spin coating device used in the technique is by working
Blowing groove is arranged in platform top plate edge, and the high pressure draught of blowing groove blowout is ejected on Pneumatic extension plate, realizes on the table
It is rectangular at the enclosure space being made of air-flow, prevent having dust entrance during spin coating.
3. a kind of semiconductor chip production technology of the present invention, the spin coating device used in the technique passes through in spin coating
The horizontal stomata of plate spin coating side setting, blows away the dust above wafer, the cleaning of crystal column surface when realizing spin coating.
4. a kind of semiconductor chip production technology of the present invention, the spin coating device used in the technique passes through in No.1
Air blowing cylinder is set in through-hole, setting No.1 sliding block, gas blow pipe inside air blowing cylinder, the mutual cooperation of No.1 sliding block and gas blow pipe,
It realizes and the dust of table surface is blowed to surrounding, and then realize the dust for blowing to the air-flow that blowing groove ejects by upward
Air-flow is taken out of, and the dust for blowing to support plate riser is blown to along dust board in air.
5. a kind of semiconductor chip production technology of the present invention, the spin coating device used in the technique is logical by No. two
Brush stroke is set in hole, conical sliding block is set below No. two through-holes, conical sliding block and brush stroke cooperate, realize No. two
Dust in through-hole takes to after brushing outside hole, and the air-flow blown out by gas blow pipe is then sent through in the high-speed flow of surrounding blowing groove blowout
It takes out of.
Description of the drawings
The invention will be further described below in conjunction with the accompanying drawings.
Fig. 1 is the process flow chart of the present invention；
Fig. 2 is the front view of spin coating device in the present invention；
Fig. 3 is the enlarged view at A in Fig. 2；
Fig. 4 is the enlarged view at B in Fig. 2；
Fig. 5 is the enlarged view at C in Fig. 2；
In figure：Support plate 1, dust-break module 2, blowing groove 21, Pneumatic extension plate 22, dust board 23, electric cylinders 3, No.1 motor
4, swingle 5, spin coating plate 6, aeroscopic plate 61, workbench 7, No.1 through-hole 71, air blowing cylinder 72, No.1 cylindrical cavity 721, No.1
Blind hole 722, connection stomata 723, No.1 sliding block 73,74, No. two through-holes 75 of gas blow pipe, 76, No. two cylindrical cavities 761 of cylinder sleeve,
No.1 gas vent 762, conical sliding block 77, No. two blind holes 771, brush stroke 78, hairbrush 781, vacuum generators 8.
Specific implementation mode
In order to make the technical means, the creative features, the aims and the efficiencies achieved by the present invention be easy to understand, tie below
Specific implementation mode is closed, the present invention is further explained.
As shown in Figures 1 to 5, a kind of semiconductor chip production technology of the present invention, the technique include the following steps：
Step 1：Wafer is put on grinder and is ground into minute surface；
Step 2：Wafer in step 1 is sent into high temperature dispersing furnace and carries out oxidation processes；
Step 3：Wafer in step 2 is sent on spin coating device and smears photoresist；
Step 4：Wafer in step 3 is sent into litho machine and is exposed, develops；
Step 5：Wafer in step 4 is sent into etching machine and carries out plasma etching；
Step 6：Wafer in step 5 is sent into high temperature furnace and is doped；
Spin coating device in step 3, including support plate 1, dust-break module 2, electric cylinders 3, No.1 motor 4, swingle 5, spin coating
Plate 6, workbench 7, vacuum generator 8,1 top plate of support plate lower section are fixedly connected with 3 pedestal of electric cylinders；3 cylinder rod end of the electric cylinders
Head is fixedly connected with 4 non-output end of No.1 motor；The rotating shaft end head of the No.1 motor 4 is fixedly connected with 5 one end of swingle；The rotation
Bull stick 5 is hinged 6 one end of spin coating plate, and hinged place is equipped with torsional spring；Arc surface is arranged in 6 other end of spin coating plate；Under the spin coating plate 6
Side is equipped with workbench 7；7 left side of the workbench is fixedly connected on 1 riser of support plate；The workbench 7 is cuboid, work
Make 7 inside of platform and cavity is set, one group of venthole is arranged in 7 top plate of workbench, and through-hole is arranged in border circular areas；The workbench 7
Lower section is equipped with vacuum generator 8 in the middle part of bottom plate, and 7 bottom plate lower right-hand side of workbench is equipped with check valve；The workbench 7 and support plate
Dust-break module 2 is equipped between 1 top plate；The dust-break module 2 is used to prevent the dust of surrounding from being pushed up into people's workbench 7 and support plate 1
Between plate；Wafer is put on workbench 7, opens the switch of connection vacuum generator 8, and wafer is attracted to 7 upper surface of workbench；
No.1 motor 4 drives swingle 5 to rotate, and swingle 5 drives spin coating plate 6 to rotate, and spin coating plate 6 is swung up while rotation, when
When the stabilization of speed of No.1 motor 4, spin coating plate 6 is also stabilized in a fixed plane；Electric cylinders 3 drive No.1 motor 4, spin coating
Plate 6 moves down, and when spin coating plate 6 touches the glue of wafer upper surface, spin coating plate 6 is equably tiled glue to wafer table
Face.
As a kind of embodiment of the present invention, the dust-break module 2 includes blowing groove 21, Pneumatic extension plate 22, dust-break
Plate 23, the blowing groove 21 are arranged at 7 top plate edge of workbench, and 7 left side edge of workbench is not provided with blowing groove 21；The support
It is fixedly connected with Pneumatic extension plate 22 on the hanging side wall of 1 top plate of plate；The Pneumatic extension plate 22 is more piece liftout plate, Pneumatic extension plate
22 tilt upward ejection；Rectangular opening is arranged close to the position of workbench 7 in 1 riser of the support plate, and dust board is hinged in rectangular opening
23；The dust board 23 is used to exclude to blow to from glue-coated surface the dust of 1 riser of support plate；The pressure of high pressure is passed through in blowing groove 21
Contracting air, it is rectangular at the enclosure space being made of air-flow on the table 7, prevent having dust entrance during spin coating；Band
There is the air-flow of dust to be ejected into upwards on Pneumatic extension plate 22, is sprayed outward after the Pneumatic extension plate 22 being obliquely installed stops
It goes out, long-term to stop that air-flow leads to 22 surface aggregation dust of Pneumatic extension plate, when stopping spin coating, Pneumatic extension plate 22 is shunk,
The surfaces externally and internally that Pneumatic extension plate 22 respectively saves is capable of the dust of mutual scraper surface, realizes rapid cleaning Pneumatic extension plate 22；
Pneumatic extension plate 22 and blowing groove 21 are not arranged for 1 riser side of support plate, and setting dust board 23 can exclude to blow from glue-coated surface
To the dust of 1 riser of support plate.
As a kind of embodiment of the present invention, cavity, 6 spin coating of spin coating plate, one side surface is arranged in 6 inside of the spin coating plate
One group of through-hole is set, and through-hole is horizontally disposed；The spin coating plate 6 is hinged aeroscopic plate 61 close to the position of through-hole, and hinged place, which is equipped with, to be turned round
Spring；It is passed through compressed air in 6 internal cavities of spin coating plate, while spin coating 6 spin coating of plate, sky is blown by horizontally disposed stomata
Gas blows away the dust above wafer, ensure that cleaning when spin coating；Aeroscopic plate 61 can realize the direction for changing air-flow and big
It is small.
As a kind of embodiment of the present invention, the hole of 7 roof center position of the workbench is No.1 through-hole 71；It is described
No.1 through-hole 71 is used to blow to 7 upper surface of workbench；It is fixedly connected with air blowing cylinder 72 in the No.1 through-hole 71；The air blowing cylinder
No.1 cylindrical cavity 721 is set inside 72 lower ends, and be slidably installed No.1 sliding block 73 in No.1 cylindrical cavity 721；Described one
73 lower section of number sliding block is equipped with spring；Through-hole is arranged in 72 lower end of air blowing cylinder, and No.1 blind hole 722 is arranged in 72 upper surface of air blowing cylinder,
Be slidably installed gas blow pipe 74 in No.1 blind hole 722；74 lower section of the gas blow pipe is equipped with spring；The gas blow pipe 74 is internally provided with sky
One group of through-hole is arranged on 74 cylindrical surface of gas blow pipe in chamber, 74 lower ending opening of gas blow pipe；721 top of the No.1 cylindrical cavity is right
Setting connection stomata 723 in side is connected to 722 middle part of No.1 blind hole；The air blowing cylinder 72 is above No.1 cylindrical cavity 721
The outer wall on right side is equipped with check valve；Described check valve one end is connected to the connection stomata 723 of 721 top of No.1 cylindrical cavity,
The check valve other end is connected to by tracheae in extraneous air；Wafer is put on workbench 7, and wafer squeezes 74 upper end of gas blow pipe,
74 compressed spring of gas blow pipe moves down；73 upper end of No.1 sliding block is connected by check valve and extraneous air, opens connection vacuum
The switch of generator 8,73 compressed spring of No.1 sliding block move down；After the completion of spin coating, the switch of vacuum generator 8 is closed, is taken
Lower wafer, 74 spring-loaded of gas blow pipe move up, and connection stomata 723 is opened when being moved to the top, No.1 sliding block 73
It being moved up by spring extruding, the air of 73 top of No.1 sliding block connects stomata 723 by top and is pressed into No.1 blind hole 722,
It is ejected by the inflatable mouth on 74 cylindrical surface of gas blow pipe, the dust on 7 surface of workbench is blowed to surrounding by the air-flow ejected；It blows
The dust of the air-flow ejected to blowing groove 21 is taken out of by upward air-flow, blows to the dust of 1 riser of support plate along dust board
23 blow in air.
As a kind of embodiment of the present invention, all holes on 7 top plate of the workbench on the outside of No.1 through-hole (71) are
No. two through-holes 75；No. two through-holes 75 are for adsorbing wafer；75 lower section of No. two through-holes is fixedly connected with cylinder sleeve 76；The cylinder
Set 76 is cylindrical, No. two cylindrical cavities 761 of setting inside cylinder sleeve 76, No. two 761 lower section setting through-holes of cylindrical cavity, two
Number 761 right side central of cylindrical cavity setting No.1 gas vent 762；Be slidably installed taper in No. two cylindrical cavities 761
Sliding block 77；77 lower section of the conical sliding block is equipped with spring；No. two blind holes 771 are arranged in plane on the conical sliding block 77, and No. two blind
771 lower section setting stomata of hole is connected to No. two cylindrical cavities 761；Brush stroke 78 is equipped in No. two blind holes 771；The hair
Brush holder support 78 is connect by ball-screw with No. two blind holes 771, and 78 lower section of brush stroke is equipped with spring；78 upper end cylinder of the brush stroke
Face is equipped with one group of hairbrush 781；Wafer is put on workbench 7, opens the switch of connection vacuum generator 8, brush stroke 78 is along rolling
Compressed spring moves down simultaneously for ballscrew rotation；77 compressed spring of conical sliding block moves down, when 77 top of conical sliding block is empty
When chamber inside No.1 gas vent 762 and workbench by being connected to, conical sliding block 77 moves up under spring force, hairbrush
The rotation of bar 78 moves up, and gap disappears, and when the pressure loss of the top of conical sliding block 77, the rotation of brush stroke 78 moves down, and bores
Shape sliding block 77 moves down again, and the gap between the taper surface and No.1 gas vent 762 of conical sliding block 77 is again turned on, taper
Sliding block 77 and the realization of brush stroke 78 pump；After the completion of spin coating, the switch of vacuum generator 8 is closed, wafer, hair are removed
78 spring-loaded of brush holder support rotation moves up, and 77 spring-loaded of conical sliding block moves up, and realizes No. two through-holes
Dust in 75 takes to after brushing outside hole, then the air-flow blown out by gas blow pipe 74 is sent in air.
When work, wafer is put on workbench 7, is sprayed glue toward wafer upper surface, is opened opening for connection vacuum generator 8
It closes, along ball-screw rotation, compressed spring moves down brush stroke 78 simultaneously；77 compressed spring of conical sliding block moves down, and works as cone
When 77 top cavity of shape sliding block inside No.1 gas vent 762 and workbench by being connected to, effect of the conical sliding block 77 in spring force
Under move up, the rotation of brush stroke 78 moves up, and gap disappears, when the pressure loss of the top of conical sliding block 77, brush stroke 78
Rotation moves down, and conical sliding block 77 moves down again, between the taper surface and No.1 gas vent 762 of conical sliding block 77 between
Gap is again turned on, and conical sliding block 77 and the realization of brush stroke 78 pump；When wafer is put on workbench 7, wafer squeezes
Gas blow pipe 74,74 compressed spring of gas blow pipe move down；73 upper end of No.1 sliding block is connected by check valve and extraneous air, is opened
When being connected to the switch of vacuum generator 8,73 compressed spring of No.1 sliding block moves down；No.1 motor 4 drives swingle 5 to rotate,
Swingle 5 drives spin coating plate 6 to rotate, and spin coating plate 6 is swung up while rotation, when the stabilization of speed of No.1 motor 4, spin coating
Plate 6 is also stabilized in a fixed plane；Electric cylinders 3 drive No.1 motor 4, spin coating plate 6 to move down, when spin coating plate 6 contacts
To wafer upper surface glue when, spin coating plate 6 is equably tiled glue to crystal column surface；It is passed through in 6 internal cavities of spin coating plate
Compressed air while spin coating 6 spin coating of plate, blows air by horizontally disposed stomata, blows away the dust above wafer, ensures
Cleaning when spin coating；Aeroscopic plate 61 can realize the direction for changing air-flow and size；After the completion of spin coating, vacuum generator is closed
8 switch removes wafer, and 78 spring-loaded of brush stroke rotation moves up, and 77 spring-loaded of conical sliding block is upward
Mobile, realization is taken to after the dust in No. two through-holes 75 is brushed outside hole, then the air-flow blown out by gas blow pipe 74 is sent in air；
74 spring-loaded of gas blow pipe moves up, and connection stomata 723 is opened when being moved to the top, and No.1 sliding block 73 is squeezed by spring
Pressure moves up, and the air of 73 top of No.1 sliding block connects stomata 723 by top and is pressed into No.1 blind hole 722, by blowing
Inflatable mouth on 74 cylindrical surface of pipe ejects, and the dust on 7 surface of workbench is blowed to surrounding by the air-flow ejected；Blow to blowing groove
The dust of 21 air-flows ejected is taken out of by upward air-flow, and the dust for blowing to 1 riser of support plate blows to sky along dust board 23
In gas；Air-flow with dust is ejected into upwards on Pneumatic extension plate 22, after the Pneumatic extension plate 22 being obliquely installed stops
It ejects outward, it is long-term to stop that air-flow leads to 22 surface aggregation dust of Pneumatic extension plate, when stopping spin coating, Pneumatic extension plate
22 shrink, and the surfaces externally and internally that Pneumatic extension plate 22 respectively saves is capable of the dust of mutual scraper surface, realizes rapid cleaning and pneumatically stretches
Contracting plate 22.
The basic principles, main features and advantages of the invention have been shown and described above.The technical staff of the industry should
Understand, the present invention is not limited to the above embodiments, and the above embodiments and description only describe the originals of the present invention
Reason, without departing from the spirit and scope of the present invention, various changes and improvements may be made to the invention, these changes and improvements
It all fall within the protetion scope of the claimed invention.The claimed scope of the invention is by appended claims and its equivalent circle
It is fixed.
Claims (5)
1. a kind of semiconductor chip production technology, it is characterised in that：The technique includes the following steps：
Step 1：Wafer is put on grinder and is ground into minute surface；
Step 2：Wafer in step 1 is sent into high temperature dispersing furnace and carries out oxidation processes；
Step 3：Wafer in step 2 is sent on spin coating device and smears photoresist；
Step 4：Wafer in step 3 is sent into litho machine and is exposed, develops；
Step 5：Wafer in step 4 is sent into etching machine and carries out plasma etching；
Step 6：Wafer in step 5 is sent into high temperature furnace and is doped；
Spin coating device in step 3, including support plate (1), dust-break module (2), electric cylinders (3), No.1 motor (4), swingle
(5), spin coating plate (6), workbench (7), vacuum generator (8), support plate (1) the top plate lower section are fixedly connected with electric cylinders (3) bottom
Seat；Electric cylinders (3) the cylinder rod end is fixedly connected with No.1 motor (4) non-output end；The rotating shaft end head of the No.1 motor (4) is solid
Surely swingle (5) one end is connected；The swingle (5) is hinged spin coating plate (6) one end, and hinged place is equipped with torsional spring；The spin coating plate
(6) arc surface is arranged in the other end；Workbench (7) is equipped with below the spin coating plate (6)；Workbench (7) left side, which is fixed, to be connected
It is connected on support plate (1) riser；The workbench (7) is cuboid, and cavity, workbench (7) top plate is arranged inside workbench (7)
One group of venthole is set；Lower section is equipped with vacuum generator (8) in the middle part of workbench (7) bottom plate, on the right side of workbench (7) bottom plate under
Side is equipped with check valve；Dust-break module (2) is equipped between the workbench (7) and support plate (1) top plate；The dust-break module (2)
For preventing the dust of surrounding between people's workbench (7) and support plate (1) top plate.
2. a kind of semiconductor chip production technology according to claim 1, it is characterised in that：Dust-break module (2) packet
Blowing groove (21), Pneumatic extension plate (22), dust board (23) are included, the blowing groove (21) is arranged at workbench (7) top plate edge,
Workbench (7) left side edge is not provided with blowing groove (21)；It is fixedly connected with Pneumatic extension on the hanging side wall of support plate (1) top plate
Plate (22)；The Pneumatic extension plate (22) is more piece liftout plate, and Pneumatic extension plate (22) tilts upward ejection；The support plate
(1) rectangular opening is arranged close to the position of workbench (7) in riser, and dust board (23) is hinged in rectangular opening；The dust board (23) is used
The dust of support plate (1) riser is blowed to from glue-coated surface in exclusion.
3. a kind of semiconductor chip production technology according to claim 1, it is characterised in that：The spin coating plate (6) is internal
Cavity is set, and one group of through-hole is arranged in one side surface of spin coating plate (6) spin coating, and through-hole is horizontally disposed；The spin coating plate (6) is close to through-hole
Position be hinged aeroscopic plate (61), hinged place is equipped with torsional spring.
4. a kind of semiconductor chip production technology according to claim 1, it is characterised in that：Workbench (7) top plate
The hole of center is No.1 through-hole (71)；The No.1 through-hole (71) is used to blow to workbench (7) upper surface；The No.1
It is fixedly connected with air blowing cylinder (72) in through-hole (71)；Setting No.1 cylindrical cavity (721) inside air blowing cylinder (72) lower end, one
Be slidably installed No.1 sliding block (73) in number cylindrical cavity (721)；Spring is equipped with below the No.1 sliding block (73)；The air blowing
Through-hole is arranged in cylinder (72) lower end, and air blowing cylinder (72) upper surface is arranged No.1 blind hole (722), is slidably installed in No.1 blind hole (722)
Gas blow pipe (74)；Spring is equipped with below the gas blow pipe (74)；The gas blow pipe (74) is internally provided with cavity, under gas blow pipe (74)
One group of through-hole is arranged on gas blow pipe (74) cylindrical surface in end opening；No.1 cylindrical cavity (721) the upper right setting connection
It is connected in the middle part of stomata (723) and No.1 blind hole (722)；The air blowing cylinder (72) is right above No.1 cylindrical cavity (721)
The outer wall of side is equipped with check valve；The check valve is connected to the connection stomata (723) above No.1 cylindrical cavity (721), single
It is connected in extraneous air by tracheae to the valve other end.
5. a kind of semiconductor chip production technology according to claim 1, it is characterised in that：Workbench (7) top plate
All holes on the outside of upper No.1 through-hole (71) are No. two through-holes (75)；No. two through-holes (75) are for adsorbing wafer；Described two
It is fixedly connected with cylinder sleeve (76) below number through-hole (75)；The cylinder sleeve (76) is cylinder, and No. two cylinders are arranged inside cylinder sleeve (76)
Through-hole, No. two cylindrical cavity (761) right side centrals settings one are arranged in shape cavity (761), No. two cylindrical cavities (761) lower sections
Number gas vent (762)；Be slidably installed conical sliding block (77) in No. two cylindrical cavities (761)；The conical sliding block (77)
Lower section is equipped with spring；No. two blind holes (771) are arranged in plane on the conical sliding block (77), and gas is arranged below No. two blind holes (771)
Hole is connected to No. two cylindrical cavities (761)；Brush stroke (78) is equipped in No. two blind holes (771)；The brush stroke (78)
It is connect with No. two blind holes (771) by ball-screw, spring is equipped with below brush stroke (78)；Brush stroke (78) upper end cylinder
Face is equipped with one group of hairbrush (781).
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810532937.1A CN108766867B (en) | 2018-05-29 | 2018-05-29 | Semiconductor chip production process |
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| CN201810532937.1A CN108766867B (en) | 2018-05-29 | 2018-05-29 | Semiconductor chip production process |
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| CN108766867B CN108766867B (en) | 2021-01-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116193746A (en) * | 2023-05-05 | 2023-05-30 | 西安畅榜电子科技有限公司 | Chip mounting device for integrated circuit processing |
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| CN200991679Y (en) * | 2006-12-20 | 2007-12-19 | 沈阳芯源先进半导体技术有限公司 | Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus |
| CN102569610B (en) * | 2011-12-31 | 2015-05-27 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of vertical-structure wafer of LED with fluorescent glue |
| JP2015213111A (en) * | 2014-05-01 | 2015-11-26 | スリーエム イノベイティブ プロパティズ カンパニー | Sheet sticking method, sheet sticking device and wafer processing method |
| CN205238418U (en) * | 2015-11-07 | 2016-05-18 | 廖振连 | LED liquid silica gel packaging forming machine |
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2018
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN200991679Y (en) * | 2006-12-20 | 2007-12-19 | 沈阳芯源先进半导体技术有限公司 | Lid-mounting structure of glue harmonizing unit of glue-harmonizing apparatus |
| CN102569610B (en) * | 2011-12-31 | 2015-05-27 | 深圳市瑞丰光电子股份有限公司 | Method for coating surface of vertical-structure wafer of LED with fluorescent glue |
| JP2015213111A (en) * | 2014-05-01 | 2015-11-26 | スリーエム イノベイティブ プロパティズ カンパニー | Sheet sticking method, sheet sticking device and wafer processing method |
| CN205238418U (en) * | 2015-11-07 | 2016-05-18 | 廖振连 | LED liquid silica gel packaging forming machine |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116193746A (en) * | 2023-05-05 | 2023-05-30 | 西安畅榜电子科技有限公司 | Chip mounting device for integrated circuit processing |
| CN116193746B (en) * | 2023-05-05 | 2023-08-22 | 浙江晶引电子科技有限公司 | Chip mounting device for integrated circuit processing |
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| CN108766867B (en) | 2021-01-15 |
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Effective date of registration: 20201223 Address after: 518039 rooms 1140 and 1141, New Asia Guoli building, 18 Zhonghang Road, Huahang community, Huaqiang North Street, Futian District, Shenzhen City, Guangdong Province Applicant after: Shenzhen kinetic energy Century Technology Co.,Ltd. Address before: 211189 Southeast University, No.2, Southeast University Road, Jiangning District, Nanjing City, Jiangsu Province Applicant before: LAN Feng |
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