CN108709894B - Chip routing detection method - Google Patents
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- CN108709894B CN108709894B CN201810662553.1A CN201810662553A CN108709894B CN 108709894 B CN108709894 B CN 108709894B CN 201810662553 A CN201810662553 A CN 201810662553A CN 108709894 B CN108709894 B CN 108709894B
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- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
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Abstract
The invention relates to the technical field of semiconductor manufacturing, in particular to a chip routing detection method. According to the invention, the characteristics of gold balls and bonding wires in the to-be-detected IC packaging chip are compared and highlighted in the whole scanning image in a manner of illuminating the to-be-detected IC packaging chip by the annular light source and the cubic light source on the optical detection equipment, so that the comparison between the bonding wires of the chip and the chip is improved, the bonding wire detection area is protruded, and the movement is not needed under the conditions of high resolution and limited depth of field, thereby improving the precision of chip defect detection, greatly improving the success rate of the defect detection of the IC packaging chip, and accurately reflecting the real defect condition of the to-be-detected IC packaging chip.
Description
Technical Field
The invention relates to the technical field of semiconductor manufacturing, in particular to a chip routing detection method.
Background
Along with the progress of science and technology, degree of automation in the modern production process constantly improves, and encapsulation IC's productivity promotes by a wide margin, and it also constantly improves to its detection requirement, and traditional artifical detection needs to invest a large amount of manpowers and material resources to cultivate professional detection personnel, and the controllability during artifical detection is relatively poor, and operation can produce visual fatigue under the long-time high power microscope, and it is comparatively difficult to detect the implementation overall process to IC. With the development of machine vision technology, they have been successfully applied to the fields of quality control, finished product appearance detection and the like, but by adopting the traditional light source illumination detection method, high-resolution images of the characteristics of gold balls and bonding wires are difficult to obtain, so that the detection contrast cannot be clearly displayed in the whole picture.
Disclosure of Invention
The invention aims to provide a chip routing detection method which can obtain high-contrast scanning images of gold balls and bonding pads and has high defect detection precision.
In order to solve the technical problems, the technical scheme adopted by the invention for solving the technical problems is as follows:
a chip routing detection method comprises the following specific steps:
the method comprises the following steps: providing an IC packaging chip to be detected and optical detection equipment, wherein the optical detection equipment is provided with an annular light source and a cubic light source, and the cubic light source is placed at the circle center of the annular light source;
step two: horizontally placing an IC packaging chip to be tested under an annular light source and a cubic light source, scanning the IC packaging chip to be tested by taking the annular light source and the cubic light source as incident light, and storing an initial scanning result in a database;
step three: and comparing the scanning result of the IC packaging chip to be detected in the database with the normal scanning result of the chip to determine the detection result.
Preferably, in the second step, a first focal length value and a second focal length value of the cubic light source are set, and the IC packaging chip to be tested is scanned for a second time by adopting the first focal length value of the cubic light source to obtain a first scanning result; performing second scanning on the IC packaging chip to be detected by adopting a second focal length value of the cubic light source to obtain a second scanning result; and overlapping the first scanning result and the second scanning result to obtain a complete scanning result.
Preferably, the first focal length value and the second focal length value are distances between the cubic light source and the annular light source.
Preferably, in the second step, the annular light source is adopted to carry out first scanning on the IC packaging chip to be detected, so as to obtain a first detection result; scanning the IC packaging chip to be detected for the second time by adopting the cubic light source to obtain a second detection result; scanning the IC packaging chip to be detected for the third time by adopting an annular light source and a cubic light source simultaneously to obtain a third detection result; and integrating the first detection result, the second detection result and the third detection result to obtain a complete detection result.
Preferably, a camera used for collecting scanning images of the IC packaging chip to be detected on the optical detection equipment is arranged on the side surface of the IC packaging chip to be detected, and an included angle formed between the camera and the horizontal plane is 45-75 degrees.
Preferably, the included angle between the cubic light source and the horizontal plane is 90 degrees, 4 third lamp beads are arranged on the cubic light source, the 4 third lamp beads are arranged in a square structure, and the light emitting color of the third lamp beads is blue.
Preferably, the wave band of the blue light emitted by the third lamp beads is 390nm-410 nm.
Preferably, the annular light source outer lane evenly distributed has first lamp pearl, and evenly distributed has second lamp pearl on its inner circle, first lamp pearl jets out and is 90 light sources of contained angle with the horizontal plane, the second lamp pearl jets out and is 15 light sources of contained angle with the horizontal plane.
Preferably, the first lamp bead and the second lamp bead are white in light emitting color.
According to the technical scheme, the characteristics of the gold balls and the bonding wires in the IC packaging chip to be detected are compared and highlighted in the whole scanning image in an illumination mode of the annular light source and the cubic light source on the optical detection equipment, the contrast between the chip bonding wires and the chip is improved, the bonding wire detection area is enabled to be prominent, under the conditions of high resolution and limited depth of field, the high-contrast scanning images of three characteristic areas, namely the upper row of gold balls, the lower row of gold balls and the bonding wires, can be obtained without moving, the contrast of the gold balls and the bonding wires in the images is effectively improved, the precision of chip defect detection is improved, the success rate of the defect detection of the IC packaging chip is greatly improved, and the defect real condition of the IC packaging chip to be detected can be accurately reflected; and high-contrast scanning images of three characteristic areas, namely the upper row of gold balls, the lower row of gold balls and the bonding wires, can greatly simplify the complexity of the whole image processing algorithm, so that the stability of the whole system is better.
Drawings
FIG. 1 is a schematic diagram of a chip wire bonding detection method according to the present invention.
Fig. 2 is a high contrast diagram of an upper row of gold ball regions and wire bond regions.
Fig. 3 is a high contrast diagram of gold ball under pad and gold ball under pad regions.
Detailed Description
The present invention is further described below in conjunction with the following figures and specific examples so that those skilled in the art may better understand the present invention and practice it, but the examples are not intended to limit the present invention.
Referring to fig. 1, a chip wire bonding detection method includes the following specific steps:
the method comprises the following steps: providing an IC packaging chip to be detected and optical detection equipment, wherein the optical detection equipment is provided with an annular light source and a cubic light source, and the cubic light source is placed at the circle center of the annular light source;
step two: horizontally placing an IC packaging chip to be tested under an annular light source and a cubic light source, scanning the IC packaging chip to be tested by taking the annular light source and the cubic light source as incident light, and storing an initial scanning result in a database;
step three: and comparing the scanning result of the IC packaging chip to be detected in the database with the normal scanning result of the chip to determine the detection result.
Setting a first focal length value and a second focal length value of the cubic light source, and scanning the IC packaging chip to be tested for the second time by adopting the first focal length value of the cubic light source to obtain a first scanning result; performing second scanning on the IC packaging chip to be detected by adopting a second focal length value of the cubic light source to obtain a second scanning result; and overlapping the first scanning result and the second scanning result to obtain a complete scanning result.
The first focal length value and the second focal length value are distances between the cubic light source and the annular light source.
And setting different focal length values of the cubic light source in the second step, so that the defects on different focal length planes in the IC packaging chip to be detected can be detected, and the precision of chip defect detection is improved.
In the second step, the IC packaging chip to be detected is scanned for the first time by adopting an annular light source to obtain a first detection result; scanning the IC packaging chip to be detected for the second time by adopting the cubic light source to obtain a second detection result; scanning the IC packaging chip to be detected for the third time by adopting an annular light source and a cubic light source simultaneously to obtain a third detection result; and integrating the first detection result, the second detection result and the third detection result to obtain a complete detection result.
Utilize annular light source, cube light source and annular light source and cube light source combination light source to scan the IC package chip that awaits measuring to in integrating 3 kinds of incident light sources to same scanning process, not only avoided a plurality of light sources separately to scan and the process that repeated correction and location that arouses, thereby shortened the cycle of the IC package chip scanning process that awaits measuring greatly, and then promoted defect detection's work efficiency.
The camera used for collecting the scanning image of the IC packaging chip to be detected on the optical detection equipment is arranged on the side surface of the IC packaging chip to be detected, the included angle formed by the camera and the horizontal plane is 45-75 degrees, and the preferable scheme of the embodiment is that the included angle formed by the camera and the horizontal plane is 60 degrees.
The light source with an included angle of 90 degrees is formed between the cubic light source and the horizontal plane, 4 third lamp beads are arranged on the cubic light source, the 4 third lamp beads are arranged in a square structure, and the light emitting color of the third lamp beads is blue.
The wave band of the third light bead emitting blue light is 390nm-410nm, and the preferable scheme of the embodiment is that the wave band of the third light bead emitting blue light is 400 nm.
First lamp beads are uniformly distributed on the outer ring of the annular light source, second lamp beads are uniformly distributed on the inner ring of the annular light source, the first lamp beads emit light sources with an included angle of 90 degrees with the horizontal plane, and the second lamp beads emit light sources with an included angle of 15 degrees with the horizontal plane.
The first lamp bead and the second lamp bead are white in light-emitting color.
The bonding pad of the IC packaging chip to be tested is silver, the welding spot is copper, and under the illumination of the annular light source and the cubic light source, the bonding pad and the welding spot can be distinguished by the residual light on four sides of the annular light source and the cubic light source through gray contrast comparison. Copper absorbs blue light and reflects light to appear dark color and has low gray value; silver reflects blue light, the color presents bright color and high gray value, expected defect detection is achieved, and therefore high-contrast scanning images of three characteristic areas, namely an upper row of gold balls, a lower row of gold balls and bonding wires, are obtained simultaneously.
The above-mentioned embodiments are merely preferred embodiments for fully illustrating the present invention, and the scope of the present invention is not limited thereto. The equivalent substitution or change made by the technical personnel in the technical field on the basis of the invention is all within the protection scope of the invention. The protection scope of the invention is subject to the claims.
Claims (6)
1. A chip routing detection method is characterized by comprising the following specific steps:
the method comprises the following steps: providing an IC packaging chip to be detected and optical detection equipment, wherein the optical detection equipment is provided with an annular light source and a cubic light source, and the cubic light source is placed at the circle center of the annular light source;
step two: horizontally placing an IC packaging chip to be tested under an annular light source and a cubic light source, scanning the IC packaging chip to be tested by taking the annular light source and the cubic light source as incident light, and storing an initial scanning result in a database;
step three: comparing the scanning result of the IC packaging chip to be detected in the database with the normal scanning result of the chip to determine a detection result;
in the second step, the IC packaging chip to be detected is scanned for the first time by adopting an annular light source to obtain a first detection result; scanning the IC packaging chip to be detected for the second time by adopting the cubic light source to obtain a second detection result; scanning the IC packaging chip to be detected for the third time by adopting an annular light source and a cubic light source simultaneously to obtain a third detection result; and integrating the first detection result, the second detection result and the third detection result to obtain a complete detection result.
2. The chip wire bonding detection method according to claim 1, wherein a camera for collecting a scan image of the IC package chip to be detected on the optical detection device is disposed on a side surface of the IC package chip to be detected, and an included angle formed between the camera and a horizontal plane is 45 ° to 75 °.
3. The chip wire bonding detection method according to claim 1, wherein the cubic light source emits a light source having an included angle of 90 ° with a horizontal plane, the cubic light source is provided with 4 third light beads, the 4 third light beads are arranged in a square structure, and the light emitting color of the third light beads is blue.
4. The chip wire bonding detection method according to claim 3, wherein the wavelength band of the blue light emitted by the third lamp bead is 390nm-410 nm.
5. The chip wire bonding detection method according to claim 1, wherein first lamp beads are uniformly distributed on the outer ring of the annular light source, second lamp beads are uniformly distributed on the inner ring of the annular light source, the first lamp beads emit a light source with an included angle of 90 degrees with the horizontal plane, and the second lamp beads emit a light source with an included angle of 15 degrees with the horizontal plane.
6. The chip wire bonding detection method according to claim 5, wherein the first lamp bead and the second lamp bead are white in light color.
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| CN201810662553.1A CN108709894B (en) | 2018-06-25 | 2018-06-25 | Chip routing detection method |
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| CN201810662553.1A CN108709894B (en) | 2018-06-25 | 2018-06-25 | Chip routing detection method |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN110174403A (en) * | 2019-07-02 | 2019-08-27 | 何应辉 | A kind of polar detection method of filtering chip pin |
| CN111307421B (en) * | 2020-03-20 | 2022-08-19 | 宁波舜宇仪器有限公司 | Lens defect detection system |
| CN112113974A (en) * | 2020-08-07 | 2020-12-22 | 深圳瑞波光电子有限公司 | Chip detection device and chip detection method |
| CN112179920B (en) * | 2020-11-29 | 2021-04-13 | 惠州高视科技有限公司 | Method and system for detecting chip bonding wire defects |
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| CN202203760U (en) * | 2011-05-31 | 2012-04-25 | 王锦峰 | Bonding coaxial illumination AOI light source device |
| CN102539440A (en) * | 2011-12-29 | 2012-07-04 | 王锦峰 | Bonding detection equipment |
| CN103324380A (en) * | 2012-03-20 | 2013-09-25 | 赵盾 | Computer display method of test result of camera module group |
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