CN108682638B - Diode lead sealing device - Google Patents
Diode lead sealing device Download PDFInfo
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- CN108682638B CN108682638B CN201810491044.7A CN201810491044A CN108682638B CN 108682638 B CN108682638 B CN 108682638B CN 201810491044 A CN201810491044 A CN 201810491044A CN 108682638 B CN108682638 B CN 108682638B
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- rotating body
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- storage tank
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/1039—Recovery of excess liquid or other fluent material; Controlling means therefor
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C3/00—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material
- B05C3/20—Apparatus in which the work is brought into contact with a bulk quantity of liquid or other fluent material for applying liquid or other fluent material only at particular parts of the work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
Abstract
The invention belongs to the technical field of diode production equipment, and particularly relates to a diode lead glue sealing device which comprises a liquid storage tank, a rotating device, a bracket, a rotating body, a hose and a fixing device, wherein the liquid storage tank is used for storing glue solution to be sealed; the rotating device is arranged above the liquid storage tank through a bracket; the rotating body is of a built-in cavity structure, is positioned below the rotating device and rotates through the rotating device, the rotating body is used for placing the diodes, an opening is formed in the lower end of the rotating body, the rotating body is connected with the liquid storage tank through a hose at the position of the opening, glue in the liquid storage tank is injected into the rotating body through the hose, and the glue is applied to the diodes on the rotating body under the action of centrifugal force by utilizing the rotation of the rotating body to complete glue sealing work; the fixing device is arranged in the rotating body, and the diode is fixed on the rotating body through the fixing device. The invention realizes the mass gluing of the diodes by using the movement of the glue solution, and has uniform gluing, uniform glue solution components and good gluing quality.
Description
Technical Field
The invention belongs to the technical field of diode production equipment, and particularly relates to a diode lead glue sealing device.
Background
The diode is an electronic device capable of conducting current in one direction, and the general diode is composed of a PN junction and two lead terminals, wherein lead wires are welded on the lead terminals, and the electronic device has one-way current conductivity according to the direction of an applied voltage. The lead of the diode needs to be subjected to encapsulation treatment so that the diode can be prepared into a complete diode. In the existing sealing process, the lead is frequently subjected to gluing treatment by glue solution on the sealing teeth through repeated contact of the lead among a plurality of sealing teeth on the sealing rack. However, in the above molding process, the leads may be bent due to friction between the leads and the molding teeth while being glued; meanwhile, the glue distribution uniformity on the glue sealing teeth is difficult to ensure, and the gluing uniformity of the lead is also difficult to control.
Some technical solutions for gluing diode leads also appear in the prior art, for example, a chinese patent with application number 201510348183.0 discloses a gluing device for a diode lead gluing device, which includes a supporting platform, on which a transmission chain for transmitting diodes is arranged; the gluing device of the diode lead gluing device comprises a gluing groove arranged on the supporting platform, and a plurality of gluing holes extending in the vertical direction are formed in the gluing groove; a lead placing end block is arranged in a gluing device of the diode lead gluing device, wherein a plurality of parallel lead placing holes are formed in the lead placing end block; a plurality of hydraulic cylinders which lift along the vertical direction are arranged between the lead placing end block and the transmission chain; the glue sealing holes correspond to the lead placing holes one by one. Although the technical scheme can realize the gluing operation on the diode under the condition of not damaging the lead, the technical scheme still has the conditions of insufficient gluing and poor gluing effect caused by glue solution precipitation.
In view of this, the diode lead glue sealing device provided by the invention realizes large-scale gluing of diodes by using the movement of glue solution, and has the advantages of uniform gluing, uniform glue solution component mixing and good gluing quality.
Disclosure of Invention
In order to make up for the defects of the prior art, the invention provides a diode lead glue sealing device which is mainly used for realizing batch gluing of diode leads under the condition that the leads are not damaged. The invention can realize the uniform gluing of the diode leads on a large scale by the mutual matching work of the liquid storage tank, the rotating device, the bracket, the rotating body, the hose and the fixing device, and simultaneously has uniform glue solution components, good gluing effect and high working efficiency.
The technical scheme adopted by the invention for solving the technical problems is as follows: the diode lead glue sealing device comprises a liquid storage tank, a rotating device, a support, a rotating body, a hose and a fixing device, wherein the liquid storage tank is arranged on the ground and is used for storing glue solution to be sealed; the rotating device is arranged above the liquid storage tank through a support; the rotating bodies are of a built-in cavity structure, the rotating bodies are located below the rotating device and rotate through the rotating device, the rotating bodies are used for placing diodes, openings are formed in the lower ends of the rotating bodies, the rotating bodies are connected with the liquid storage tank through hoses at the positions of the openings, glue in the liquid storage tank is injected into the rotating bodies through the hoses, and the glue is applied to diode leads on the rotating bodies under the action of centrifugal force through the rotation of the rotating bodies to complete glue sealing work; the fixing device is arranged in the rotating body, and the diode is fixed on the rotating body through the fixing device.
The rotating device comprises belt wheels, a rotating shaft, a belt, a motor, a fixing frame and a spring I, wherein the number of the belt wheels is two, and the belt wheels are horizontally arranged on the bracket through the rotating shaft; the belt is arranged on the belt wheels and is used for realizing synchronous rotation of the two belt wheels; the motor is arranged on the bracket through the fixing frame and used for driving the belt wheel to rotate; the spring is located the support below, and a spring upper end links to each other with the pivot, and a spring lower extreme links to each other with the rotator, and the rotator motion is driven through the spring to the pivot rotation, realizes the rotation and the vibration from top to bottom of rotator. During operation, the motor drives the belt pulley to rotate, the rotating shaft synchronously rotates, and the rotating shaft drives the spring to rotate, so that the rotating body rotates, the glue solution in the rotating body rotates along with the inner wall in the cavity of the rotating body and continuously rises, and the diode lead in the rotating body is uniformly glued.
The rotating body is of a circular truncated cone structure, the diodes are arranged on the side face of the rotating body, grooves are uniformly formed in the outer side face of the rotating body inwards, lead grooves are formed in the bottoms of the grooves and communicated with the inside of the rotating body, limiting grooves are formed in the outer side of the rotating body, the limiting grooves are of an arc-shaped structure, and one ends, close to the outer surface of the rotating body, of the limiting grooves are communicated with the grooves; the fixing device comprises a sliding block, a pressing head, a second spring and a rubber bag, the sliding block is positioned in a limiting groove of the rotating body, and the sliding block can slide along the limiting groove; the pressing head is fixed at one end of the sliding block, a second spring is arranged on the pressing head, and the pressing head is used for clamping the head of the diode; the second spring is a compression spring, a closed cavity is formed between one end, away from the pressing head, of the sliding block in the limiting groove and the limiting groove, liquid is arranged in the closed cavity, and when the rotating body rotates, the liquid moves to the outer side of the rotating body under the action of centrifugal force to push the sliding block to move outwards along the limiting groove to clamp the head of the diode; the rubber bag is located the cavity inner wall of rotator, and the rubber bag is in the corresponding position of recess, and the position that corresponds with the lead wire groove on the rubber bag is provided with the through-hole that supplies the lead wire to wear out, injects compressed air into the rubber bag, and after the through-hole of rubber bag was passed to the diode pin, the automatic shutoff of through-hole can be realized to the rubber bag. Before the diode rotating body works, the diode is inserted into the side face of the rotating body, the lead of the diode penetrates out of the through hole of the rubber bag after passing through the lead groove, the compressed air is filled in the rubber bag, after the lead of the diode penetrates out, the through hole is automatically plugged by the rubber bag, glue liquid in the cavity of the rotating body is prevented from flowing out through the rubber bag, after the diode is inserted into the rotating body, the head of the diode is positioned in the groove of the rotating body, when the rotating body rotates, liquid in the limiting groove of the rotating body moves towards the outer side of the rotating body under the action of centrifugal force to outwards push the sliding block along the limiting groove, and the compressing head at the front end of the sliding block is.
The lead slot is also provided with a barrier strip and a third spring, one end of the barrier strip close to the limiting groove is hinged to the inner wall of the lead slot, and the barrier strip forms a conical opening in the lead slot and is used for correcting and guiding the lead pins. When the lead of the diode is inserted into the lead groove, the lead is prevented from deflecting in the insertion process by the barrier strip, and the lead is prevented from being damaged.
The lower end of the rotating shaft is fixedly connected with an air cylinder, the lower end of the air cylinder is connected with the rotating body, the air cylinder is located inside the first spring, an air inlet of the air cylinder is communicated with the outside, and an air outlet of the air cylinder is connected with an air storage tank; a conical shaft is arranged in the rotating body along the axis, a ventilation cavity is arranged in the conical shaft, an air outlet hole is obliquely and downwards arranged on the surface of the conical shaft, and the inner part of the air outlet hole is communicated with the ventilation cavity; the conical shaft is provided with a blocking plate at the position of the air outlet hole; the barrier plate is positioned in the air outlet hole of the conical shaft, the upper end of the barrier plate is hinged to the inner wall of the air outlet hole, and the barrier plate is obliquely arranged downwards in the air outlet hole; the rotary body is provided with a gas heating cavity at the top, a heating plate is arranged in the gas heating cavity, the gas heating cavity is connected with a gas storage tank through a gas pipe, and the upper end of the ventilation cavity extends upwards to be communicated with the gas heating cavity of the rotary body. When the spring drives the rotating body to rotate, the rotating body rotates and vibrates up and down due to the change of the elastic force of the spring, and in the process of up-and-down movement of the rotating body, a piston rod of the air cylinder moves to compress outside air and charge the compressed air into the air storage tank. After the diode finishes gluing, glue in the rotating body flows into the liquid storage tank from an opening at the lower end of the rotating body through the hose, so that the glue in the rotating body is emptied, then gas in the liquid storage tank enters the gas heating cavity of the rotating body for heating, the heated gas is blown out from the gas outlet hole of the conical shaft through the ventilation cavity of the conical shaft, the diode lead is dried, the glue on the lead is rapidly solidified, and glue sealing is finished.
The rotator inside wall is provided with an upward inclined bearing strip, and the bearing strip is vertically provided with a through hole with a large upper end opening and a small lower end opening. The existence of bearing strip makes the glue solution be difficult to drop when the centrifugal force effect is down along rotator inner wall upward movement to can increase the height of rebound, thereby make once can the rubberizing diode the quantity increase, improve work efficiency.
The invention has the beneficial effects that:
1. according to the diode lead glue sealing device, the liquid storage tank, the rotating device, the support, the rotating body, the hose and the fixing device are matched with one another to work, the diode lead is uniformly glued by using the centrifugal motion of glue solution, the working efficiency is high, the lead cannot be damaged, and the gluing quality is good.
2. According to the diode lead glue sealing device, the rotator moves under the action of the spring to vibrate up and down to realize gas compression, and the glue sealing is realized by drying the lead glued by using compressed air, so that the utilization of energy is improved, and the utilization rate of the device is high.
3. According to the diode lead glue sealing device, the fixing device clamps the head of the diode by utilizing the centrifugal force of liquid, the device is simplified, the device is more compact, and the diode can be positioned reliably in the rotating process.
Drawings
The invention will be further explained with reference to the drawings.
FIG. 1 is a front view of the present invention;
FIG. 2 is an enlarged view of a portion of the invention at A in FIG. 1;
FIG. 3 is a schematic view of the diode of the present invention mounted on a rotating body by a fixture;
in the figure: the device comprises a liquid storage box 1, a rotating device 2, a support 3, a rotating body 4, a hose 5, a fixing device 6, a belt wheel 21, a belt 22, a motor 23, a fixing frame 24, a first spring 25, a limiting groove 41, a sliding block 61, a pressing head 62, a rubber bag 63, a blocking strip 42, a cylinder 7, a conical shaft 43, a blocking plate 44, a gas heating cavity 45, a heating plate 46 and a bearing strip 47.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
As shown in fig. 1 to 3, the diode lead glue sealing device according to the present invention includes a liquid storage tank 1, a rotating device 2, a bracket 3, a rotating body 4, a hose 5 and a fixing device 6, wherein the liquid storage tank 1 is disposed on the ground, and the liquid storage tank 1 is used for storing glue solution to be sealed; the rotating device 2 is arranged above the liquid storage tank 1 through a bracket 3; the number of the rotating bodies 4 is two, the rotating bodies 4 are of a built-in cavity structure, the rotating bodies 4 are located below the rotating device 2, the rotating bodies 4 rotate through the rotating device 2, the rotating bodies 4 are used for placing diodes, openings are formed in the lower ends of the rotating bodies 4, the rotating bodies 4 are connected with the liquid storage tank 1 through hoses 5 at the opening positions, glue in the liquid storage tank 1 is injected into the rotating bodies 4 through the hoses 5, and the glue is applied to diode leads on the rotating bodies 4 under the action of centrifugal force by the aid of rotation of the rotating bodies 4 to complete glue sealing work; the fixing device 6 is arranged inside the rotating body 4, and the diode is fixed on the rotating body 4 through the fixing device 6.
The rotating device 2 comprises belt wheels 21, a rotating shaft, a belt 22, a motor 23, a fixing frame 24 and a first spring 25, the number of the belt wheels 21 is two, and the belt wheels 21 are horizontally arranged on the support 3 through the rotating shaft; the belt 22 is installed on the belt wheels 21, and the belt 22 is used for realizing synchronous rotation of the two belt wheels 21; the motor 23 is arranged on the bracket 3 through a fixed frame 24, and the motor 23 is used for driving the belt wheel 21 to rotate; the first spring 25 is located below the support 3, the upper end of the first spring 25 is connected with the rotating shaft, the lower end of the first spring 25 is connected with the rotating body 4, the rotating shaft rotates to drive the rotating body 4 to move through the first spring 25, and rotation and up-and-down vibration of the rotating body 4 are achieved. During operation, the motor 23 drives the belt wheel 21 to rotate, the rotating shaft synchronously rotates, the rotating shaft drives the first spring 25 to rotate, so that the rotating body 4 rotates, the glue solution in the rotating body 4 rotates in the cavity of the rotating body 4 along with the inner wall and continuously rises, and therefore the diode lead in the rotating body 4 is uniformly glued.
The rotating body 4 is of a circular truncated cone structure, the diodes are arranged on the side face of the rotating body 4, grooves are uniformly formed in the outer side face of the rotating body 4 inwards, lead grooves are formed in the bottoms of the grooves and communicated with the inside of the rotating body 4, the rotating body 4 is provided with limiting grooves 41 on the outer sides of the grooves, the limiting grooves 41 are of an arc-shaped structure, and one ends, close to the outer surface of the rotating body 4, of the limiting grooves 41 are communicated with the grooves; the fixing device 6 comprises a slide block 61, a pressing head 62, a second spring and a rubber bag 63, the slide block 61 is positioned in the limiting groove 41 of the rotating body 4, and the slide block 61 can slide along the limiting groove 41; the pressing head 62 is fixed at one end of the sliding block 61, a second spring is arranged on the pressing head 62, and the pressing head 62 is used for clamping the head of the diode; the second spring is a compression spring, a closed cavity is formed between one end, away from the pressing head 62, of the sliding block 61 in the limiting groove 41 and the limiting groove 41, liquid is arranged in the closed cavity, and when the rotating body 4 rotates, the liquid moves towards the outer side of the rotating body 4 under the action of centrifugal force to push the sliding block 61 to move outwards along the limiting groove 41 to clamp the head of the diode; the rubber bag 63 is located on the inner wall of the cavity of the rotating body 4, the rubber bag 63 is located at the position corresponding to the groove, a through hole for the lead to penetrate out is formed in the position, corresponding to the lead groove, of the rubber bag 63, compressed air is injected into the rubber bag 63, and after the pins of the diode penetrate through the through hole of the rubber bag 63, the rubber bag 63 can automatically plug the through hole. Before the diode rotating body works, the diode is inserted into the side face of the rotating body 4, the lead of the diode penetrates out of the through hole of the rubber bag 63 after passing through the lead slot, the rubber bag 63 automatically plugs the through hole after the lead of the diode penetrates out due to the fact that compressed air is filled in the rubber bag 63, glue in the cavity of the rotating body 4 is prevented from flowing out through the rubber bag 63, the head of the diode is located in the groove of the rotating body 4 after the diode is inserted into the rotating body 4, when the rotating body 4 rotates, liquid in the limiting groove 41 of the rotating body 4 moves towards the outer side of the rotating body 4 under the action of centrifugal force to push the sliding block 61 outwards along the limiting groove 41, and the pressing head 62 at the front end of the sliding block 61 is pushed out of.
The lead slot is further provided with a barrier strip 42 and a third spring, one end of the barrier strip 42 close to the limiting groove 41 is hinged to the inner wall of the lead slot, and the barrier strip 42 forms a conical opening in the lead slot for correcting and guiding the lead pin. When the lead of the diode is inserted into the lead slot, the presence of the barrier strip 42 prevents the lead from deflecting during insertion, avoiding damage to the lead.
The lower end of the rotating shaft is also fixedly connected with an air cylinder 7, the lower end of the air cylinder 7 is connected with the rotating body 4, the air cylinder 7 is positioned inside a first spring 25, an air inlet of the air cylinder 7 is communicated with the outside, and an air outlet of the air cylinder 7 is connected with an air storage tank; a conical shaft 43 is arranged in the rotating body 4 along the axis, a ventilation cavity is arranged in the conical shaft 43, an air outlet hole is obliquely and downwards arranged on the surface of the conical shaft 43, and the inner part of the air outlet hole is communicated with the ventilation cavity; the conical shaft 43 is provided with a blocking plate 44 at the position of the air outlet hole; the blocking plate 44 is positioned in the air outlet of the conical shaft 43, the upper end of the blocking plate 44 is hinged to the inner wall of the air outlet, and the blocking plate 44 is obliquely arranged downwards in the air outlet; the position of rotator 4 at the top is provided with gas heating chamber 45, is provided with hot plate 46 in the gas heating chamber 45, and gas heating chamber 45 passes through the trachea and links to each other with the gas holder, and the upper end of the ventilation chamber upwards extends and communicates with each other with gas heating chamber 45 of rotator 4. When the first spring 25 drives the rotating body 4 to rotate, the rotating body 4 rotates and vibrates up and down due to the change of the elastic force of the spring, and in the process of up-and-down movement of the rotating body 4, the piston rod of the air cylinder 7 moves to compress outside air and charge the compressed air into the air storage tank. After the diode finishes gluing, glue in the rotating body 4 flows into the liquid storage tank 1 from the lower end opening of the rotating body 4 through the hose 5, so that the glue in the rotating body 4 is emptied, then, gas in the liquid storage tank enters the gas heating cavity 45 of the rotating body 4 to be heated, the heated gas is blown out from the air outlet of the conical shaft 43 through the air vent of the conical shaft 43, the diode lead is dried, the glue on the lead is rapidly solidified, and glue sealing is finished.
Be provided with the ascending bearing strip 47 of slope on the rotator 4 inside wall, vertically set up the through-hole that the upper end opening is big, the lower extreme opening is little on the bearing strip 47. The existence of bearing strip 47 makes the glue solution be difficult to drop when moving upwards along rotator 4 inner wall under the centrifugal force effect to can increase the height of rebound, thereby make the quantity increase, the improvement work efficiency of the diode that once can rubberize.
The specific working process is as follows:
before the diode rotating body works, the diode is inserted into the side face of the rotating body 4, the lead of the diode penetrates out of the through hole of the rubber bag 63 after passing through the lead slot, the rubber bag 63 automatically plugs the through hole after the lead of the diode penetrates out due to the fact that compressed air is filled in the rubber bag 63, glue in the cavity of the rotating body 4 is prevented from flowing out through the rubber bag 63, the head of the diode is located in the groove of the rotating body 4 after the diode is inserted into the rotating body 4, when the rotating body 4 rotates, liquid in the limiting groove 41 of the rotating body 4 moves towards the outer side of the rotating body 4 under the action of centrifugal force to push the sliding block 61 outwards along the limiting groove 41, and the pressing head 62 at the front end of the sliding block 61 is pushed out of. When the lead of the diode is inserted into the lead slot, the presence of the barrier strip 42 prevents the lead from deflecting during insertion, avoiding damage to the lead.
When the glue applying machine works, glue in the liquid storage tank 1 is injected into the rotating body 4 through the hose 5, the motor 23 drives the belt wheel 21 to rotate, the rotating shaft drives the first spring 25 to rotate, so that the rotating body 4 rotates, the glue in the rotating body 4 rotates along the inner wall in the cavity of the rotating body 4 under the action of centrifugal force and continuously rises, and therefore the diode lead in the rotating body 4 is uniformly applied with glue.
When the first spring 25 drives the rotating body 4 to rotate, the rotating body 4 rotates and vibrates up and down due to the change of the elastic force of the spring, and in the process of up-and-down movement of the rotating body 4, the piston rod of the air cylinder 7 moves to compress outside air and charge the compressed air into the air storage tank. After the diode finishes gluing, glue in the rotating body 4 flows into the liquid storage tank 1 from the lower end opening of the rotating body 4 through the hose 5, so that the glue in the rotating body 4 is emptied, then, gas in the liquid storage tank enters the gas heating cavity 45 of the rotating body 4 to be heated, the heated gas is blown out from the air outlet of the conical shaft 43 through the air vent of the conical shaft 43, the diode lead is dried, the glue on the lead is rapidly solidified, and glue sealing is finished.
The foregoing illustrates and describes the principles, general features, and advantages of the present invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a diode lead wire molding equipment which characterized in that: the glue storage device comprises a liquid storage tank (1), a rotating device (2), a support (3), a rotating body (4), a hose (5) and a fixing device (6), wherein the liquid storage tank (1) is arranged on the ground, and the liquid storage tank (1) is used for storing glue liquid to be sealed; the rotating device (2) is arranged above the liquid storage tank (1) through a support (3); the rotating bodies (4) are two in number, the rotating bodies (4) are of a built-in cavity structure, the rotating bodies (4) are located below the rotating device (2), the rotating bodies (4) rotate through the rotating device (2), the rotating bodies (4) are used for placing diodes, openings are formed in the lower ends of the rotating bodies (4), the rotating bodies (4) are connected with the liquid storage tank (1) through hoses (5) at the opening positions, glue liquid in the liquid storage tank (1) is injected into the rotating bodies (4) through the hoses (5), and the glue liquid is enabled to glue diode leads on the rotating bodies (4) under the action of centrifugal force by the rotation of the rotating bodies (4) to glue and complete glue gluing work; the fixing device (6) is arranged inside the rotating body (4), and the diode is fixed on the rotating body (4) through the fixing device (6).
2. The device of claim 1, wherein: the rotating device (2) comprises belt wheels (21), a rotating shaft, a belt (22), a motor (23), a fixing frame (24) and a first spring (25), the number of the belt wheels (21) is two, and the belt wheels (21) are horizontally arranged on the support (3) through the rotating shaft; the belt (22) is arranged on the belt wheels (21), and the belt (22) is used for realizing synchronous rotation of the two belt wheels (21); the motor (23) is arranged on the bracket (3) through a fixed frame (24), and the motor (23) is used for driving the belt wheel (21) to rotate; the first spring (25) is located below the support (3), the upper end of the first spring (25) is connected with the rotating shaft, the lower end of the first spring (25) is connected with the rotating body (4), and the rotating shaft rotates to drive the rotating body (4) to move through the first spring (25), so that the rotating body (4) rotates and vibrates up and down.
3. The device of claim 1, wherein: the rotating body (4) is of a circular truncated cone structure, the diodes are arranged on the side face of the rotating body (4), grooves are uniformly formed in the outer side face of the rotating body (4) inwards, lead grooves are formed in the bottoms of the grooves and communicated with the inside of the rotating body (4), a limiting groove (41) is formed in the outer side of each groove of the rotating body (4), each limiting groove (41) is of an arc-shaped structure, and one end, close to the outer surface of the rotating body (4), of each limiting groove (41) is communicated with the corresponding groove; the fixing device (6) comprises a sliding block (61), a pressing head (62), a second spring and a rubber bag (63), the sliding block (61) is located in a limiting groove (41) of the rotating body (4), and the sliding block (61) can slide along the limiting groove (41); the pressing head (62) is fixed at one end of the sliding block (61), a second spring is arranged on the pressing head (62), and the pressing head (62) is used for clamping the head of the diode; the second spring is a compression spring, a closed cavity is formed between one end, away from the pressing head (62), of the sliding block (61) in the limiting groove (41) and the limiting groove (41), liquid is arranged in the closed cavity, and when the rotating body (4) rotates, the liquid moves towards the outer side of the rotating body (4) under the action of centrifugal force to push the sliding block (61) to move outwards along the limiting groove (41) to clamp the head of the diode; the rubber bag (63) is positioned on the inner wall of the cavity of the rotating body (4), the rubber bag (63) is positioned at the position corresponding to the groove, a through hole for the lead to penetrate out is formed in the position, corresponding to the lead groove, of the rubber bag (63), and compressed air is injected into the rubber bag (63).
4. The device of claim 3, wherein: the lead slot is further provided with a barrier strip (42) and a third spring, one end, close to the limiting groove (41), of the barrier strip (42) is hinged to the inner wall of the lead slot, and the barrier strip (42) forms a conical opening in the lead slot and is used for correcting and guiding a lead pin.
5. The device of claim 2, wherein: the lower end of the rotating shaft is also fixedly connected with an air cylinder (7), the lower end of the air cylinder (7) is connected with the rotating body (4), the air cylinder (7) is positioned inside the first spring (25), an air inlet of the air cylinder (7) is communicated with the outside, and an air outlet of the air cylinder (7) is connected with an air storage tank; a conical shaft (43) is arranged in the rotating body (4) along the axis, a ventilation cavity is arranged in the conical shaft (43), an air outlet hole is obliquely and downwards formed in the surface of the conical shaft (43), and the inner part of the air outlet hole is communicated with the ventilation cavity; a blocking plate (44) is arranged at the position of the air outlet hole of the conical shaft (43); the blocking plate (44) is positioned in the air outlet of the conical shaft (43), the upper end of the blocking plate (44) is hinged to the inner wall of the air outlet, and the blocking plate (44) is obliquely and downwards arranged in the air outlet; the rotary body (4) is provided with a gas heating cavity (45) at the top, a heating plate (46) is arranged in the gas heating cavity (45), the gas heating cavity (45) is connected with a gas storage tank through a gas pipe, and the upper end of the ventilation cavity extends upwards to be communicated with the gas heating cavity (45) of the rotary body (4).
6. The device of claim 3, wherein: be provided with ascending bearing strip (47) of slope on rotator (4) inside wall, vertically set up the through-hole that the upper end opening is big, the lower extreme opening is little on bearing strip (47).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN110957255A (en) * | 2019-12-29 | 2020-04-03 | 太仓佳锐精密模具有限公司 | Material rack for diode packaging |
| CN112151419B (en) * | 2020-09-15 | 2021-05-18 | 简胜坚 | Environmental protection equipment capable of automatically adjusting glue homogenizing amount according to chip size |
| CN112719889B (en) * | 2020-12-28 | 2022-10-25 | 李嘉 | Automatic paste cell-phone shell accessory processingequipment of decoration |
| CN118023074B (en) * | 2024-01-10 | 2024-07-19 | 安徽佰亿微电子技术有限公司 | Diode lead sealing treatment device |
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| CN102364705A (en) * | 2011-10-14 | 2012-02-29 | 宁波瑞昀光电照明科技有限公司 | Method for packaging light emitting diode (LED) |
| CN105374702A (en) * | 2014-08-06 | 2016-03-02 | 华凌光电股份有限公司 | Full-automatic glue sealing machine |
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| US6379988B1 (en) * | 2000-05-16 | 2002-04-30 | Sandia Corporation | Pre-release plastic packaging of MEMS and IMEMS devices |
| CN101325228A (en) * | 2007-06-15 | 2008-12-17 | 亿光电子工业股份有限公司 | LED structure and combination method thereof |
| US9093416B2 (en) * | 2011-11-28 | 2015-07-28 | Infineon Technologies Ag | Chip-package and a method for forming a chip-package |
| CN103151273B (en) * | 2013-03-22 | 2016-08-10 | 江苏艾科瑞思封装自动化设备有限公司 | Diode encapsulation device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN102364705A (en) * | 2011-10-14 | 2012-02-29 | 宁波瑞昀光电照明科技有限公司 | Method for packaging light emitting diode (LED) |
| CN105374702A (en) * | 2014-08-06 | 2016-03-02 | 华凌光电股份有限公司 | Full-automatic glue sealing machine |
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