CN108666346A - The manufacturing method of display screen, electronic device and display screen - Google Patents
The manufacturing method of display screen, electronic device and display screen Download PDFInfo
- Publication number
- CN108666346A CN108666346A CN201810266030.5A CN201810266030A CN108666346A CN 108666346 A CN108666346 A CN 108666346A CN 201810266030 A CN201810266030 A CN 201810266030A CN 108666346 A CN108666346 A CN 108666346A
- Authority
- CN
- China
- Prior art keywords
- electronic device
- light
- infrared sensor
- display screen
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/40—OLEDs integrated with touch screens
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/123—Connection of the pixel electrodes to the thin film transistors [TFT]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Telephone Set Structure (AREA)
Abstract
The invention discloses the manufacturing methods of a kind of display screen, electronic device and display screen.Display screen includes organic luminous layer, TFT circuit layer, polaroid and infrared sensor.Wherein, TFT circuit layer is arranged below organic luminous layer, and TFT circuit layer is for driving organic luminous layer to shine to be shown.Polaroid is arranged above organic luminous layer.Infrared sensor is arranged above polaroid, and infrared sensor is for emitting and/or receiving infrared light.The present invention also provides the manufacturing methods of a kind of electronic device and display screen.Display screen, electronic device and the display screen manufacturing method of the present invention infrared sensor can be arranged on polaroid in the case of comprehensive screen, so as to avoid infrared sensor that the phenomenon that causing screen flicker below TFT circuit layer is arranged.
Description
Technical field
The present invention relates to electronic technology field, more particularly to a kind of display screen, electronic device and display screen manufacturing method.
Background technology
Usually, the electronic devices such as mobile phone include the elements such as display screen and infrared sensor, and infrared sensor can be used for
Detect the distance between object and the display screen outside display screen.With the development of mobile phone technique and the demand of user, shield hand comprehensively
Machine has become the development trend of mobile phone, but the position of current infrared sensor arrange so that the screen of mobile phone account for it is smaller.So
And when infrared sensor is arranged below display screen, and easily cause the scintillation of screen.
Invention content
In order to solve the above technical problems, embodiments of the present invention provide a kind of display screen, electronic device and display screen
Manufacturing method.
The display screen of embodiment of the present invention, including：
Organic luminous layer；
The TFT circuit layer being arranged below the organic luminous layer, the TFT circuit layer is for driving the organic light emission
Layer shines to be shown；
Polaroid above the organic luminous layer is set；With
Infrared sensor above the polaroid is set, and the infrared sensor is for emitting and/or receiving infrared
Light.
The electronic device of embodiment of the present invention includes shell and the display screen.
The manufacturing method of the display screen of embodiment of the present invention, including step：
One organic luminous layer is provided；
One TFT circuit layer is set below the organic luminous layer, and the TFT circuit layer is for driving the organic light emission
Layer shines to be shown；
One polaroid is set above the organic luminous layer；With
One infrared sensor is set above the polaroid, and the infrared sensor is for emitting and/or receiving infrared
Light
In the manufacturing method of the display screen of embodiment of the present invention, electronic device and display screen, infrared sensor is arranged
In the screen accounting that electronic device on polaroid, can either be improved, is conducive to electronic device and realizes screen effect comprehensively, and can keep away
Exempt from the electronics in the infrared ray excited TFT circuit layer of infrared sensor transmitting, so as to avoid the scintillation of screen is caused.
The additional aspect and advantage of the present invention will be set forth in part in the description, and will partly become from the following description
Obviously, or practice through the invention is recognized.
Description of the drawings
The above-mentioned and/or additional aspect and advantage of the present invention is from combining in description of the following accompanying drawings to embodiment by change
It obtains obviously and is readily appreciated that, wherein：
Fig. 1 is the stereoscopic schematic diagram of electronic device of the present invention；
Fig. 2 is the schematic cross-section of the electronic device of the certain embodiments of the present invention；
Fig. 3 is the enlarged diagram at the III of Fig. 2 of the present invention；
Fig. 4 is the disconnection schematic cross-section of the electronic device of the certain embodiments of the present invention；
Fig. 5 and Fig. 6 is the schematic cross-section of the electronic device of the certain embodiments of the present invention；
Fig. 7 is the dimensional structure diagram of the transparent cover plate of the certain embodiments of the present invention；
Fig. 8 is the schematic cross-section of the electronic device of the certain embodiments of the present invention；
Fig. 9 is the enlarged diagram at the IX of Fig. 8 of the present invention；
Figure 10 is the schematic cross-section of the electronic device of the certain embodiments of the present invention；
Figure 11 is the enlarged diagram at the XI of Figure 10 of the present invention；
Figure 12 is the schematic cross-section of the electronic device of the certain embodiments of the present invention；
Figure 13 is the enlarged diagram at the XIII of Figure 12 of the present invention；
Figure 14 is the schematic cross-section of the electronic device of the certain embodiments of the present invention；
Figure 15 is the enlarged diagram at the XV of Figure 14 of the present invention；
Figure 16 and Figure 17 is the schematic cross-section of the electronic device of the certain embodiments of the present invention；With
The flow diagram of the manufacturing method of the certain embodiments of Figure 18 present invention.
Specific implementation mode
Embodiments of the present invention are described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein from beginning
Same or similar element or element with the same or similar functions are indicated to same or similar label eventually.Below by ginseng
The embodiment for examining attached drawing description is exemplary, and is only used for explaining the present invention, and is not considered as limiting the invention.
Electronic equipment, such as mobile phone or tablet computer etc. generally detect electronic equipment by installing infrared sensor
The distance between user.By taking mobile phone as an example, the upper area of mobile phone is provided with infrared sensor.Lead to when user carries out voice
When words or relevant operation, range information is fed back to processor by mobile phone close to head, infrared sensor, and processor just executes accordingly
Instruction, such as close display screen component light.In the related art, infrared sensor is arranged on electronic equipment to need in machine
Corresponding hole is opened up on shell for emitting and receiving infrared signal, but with the fast development of electronic equipment, people couple
The appearance of mobile phone and the requirement of operating experience are higher and higher.Mobile phone develops in the comprehensive screen mobile phone direction of warp-wise, and comprehensive screen mobile phone
Ultra-narrow frame is formed between casing and display screen component may not have enough skies since the width of ultra-narrow frame is too small
Between open up hole, even if trepanning also leads to the strength reduction of frame entirety.However, when infrared sensor is arranged under display screen
Fang Shi, due to photoelectric effect, electronics that infrared light is easy in excitation display screen and cause the scintillation of screen.
Referring to Fig. 1, the electronic device 100 of embodiments of the present invention can be mobile phone or tablet computer etc..This hair
The electronic device 100 of bright embodiment is illustrated by taking mobile phone as an example, and certainly, the concrete form of electronic device 100 can also be
It is other, it is not limited herein.
Fig. 2 and Fig. 3 are please referred to, electronic device 100 includes display screen 13 and shell 20.Wherein, display screen 13 includes organic
Luminescent layer 134, TFT circuit layer 135, polaroid 133 and infrared sensor 16.TFT circuit layer 135 is arranged in organic luminous layer
134 lower sections, TFT circuit layer 135 is for driving organic luminous layer 134 to carry out luminescence display.Polaroid 133 is arranged in organic hair
134 top of photosphere, infrared sensor 16 are arranged above polaroid 133, and infrared sensor 16 is for emitting and/or receiving infrared
Light.
Polaroid 133 is interfered for reducing ambient light caused by display.Since the cathode in TFT circuit layer 135 uses
Metal material reflects when ambient light being caused to be radiated on cathode, and the contrast of display is made to reduce.By by polaroid 133
It is arranged above organic luminous layer 134, in ambient after polaroid 133, direction of vibration can be made saturating with polaroid 133
It crosses the vertical light of axis to be absorbed, only by the direction of vibration light parallel with 133 between axlemolecules of polaroid, passes through the light of polaroid 133
It will deviate 90 degree with original incident direction after emission of cathode again, make reflected light can not be by polaroid 133, energy
Enough it is effectively prevented the reflection of illumination.In addition, when if infrared sensor is arranged below display screen, infrared sensor is to outgoing
During penetrating infrared light, due to photoelectric effect, infrared light mid-infrared light is easy electronics in excitation display screen, to cause to shield
The scintillation of curtain.
The infrared sensor 16 of embodiment of the present invention is arranged above TFT circuit layer 135, therefore works as infrared sensor 16
Outward when transmitting infrared light, infrared light not through TFT circuit layer 135, thus will not be in laser TFT circuit layer 135 electricity
Son, so as to avoid the scintillation of screen is caused.
Infrared sensor 16 includes transmitter 1611 and receiver 1612, and transmitter 1611 works as hair for emitting infrared light
When detection direction meets barrier, a part of infrared light will be reflected to be received the infrared light penetrated by receiver 1612,
Calculate infrared light from being emitted to the reflected time by processor, it may be determined that between electronic device 100 and barrier away from
From and make corresponding adjustment.When user is when answering or making a phone call, electronic device 100 is close to head, transmitter 1611
Send out infrared light, receiver 1612 receives reflected infrared light, by processor calculate the infrared light from be emitted to reflection
Time back just sends out command adapted thereto control and closes screen light, and when electronic device 100 is far from head, processor is again
Instruction is calculated and sent out according to the data fed back, reopens screen light.In this way, not only preventing the mistake of user
Operation, and save the electricity of mobile phone.
Shell 20 is for receiver member and component to play the role of protection.By the way that shell 20 is arranged by element and component packet
It fences up, avoids extraneous factor and these elements are caused directly to damage.Shell 20 can process aluminium alloy by CNC machine
It is formed, makrolon (Polycarbonate, PC) or PC+ABS material injections can also be used to be molded.
In conclusion the electronic device 100 of embodiment of the present invention can be in the case of comprehensive screen by infrared sensor
16 are arranged above polaroid, avoid traditional tap operation, ensure the reliability of 100 integral strength of electronic device, and
Also further improve the screen accounting of electronic device 100.The infrared light that infrared sensor 16 emits simultaneously is not through TFT circuit
Layer, so as to avoid the scintillation of screen is caused.
In some embodiments, infrared sensor 16 includes transmitter 1611 and receiver 1612,1611 He of transmitter
Receiver 1612 is wholely set.
Specifically, transmitter 1611 and receiver 1612 are structure as a whole, it is possible to reduce transmitter 1611 and receiver
Circuit technique thereof step between 1612 and wiring space, be conducive to improve product production efficiency, reduce production cost and
Facilitate the maintenance and maintenance of element.
Referring to Fig. 4, in some embodiments, infrared sensor 16 includes transmitter 1611 and receiver 1612, hair
1612 split settings of emitter 1611 and receiver.
Specifically, since transmitter 1611 and receiver 1612 are separate structure, so can be selected when arranging position
Compact arrangement can also select dispersion to arrange, and neatly receiver 1612 can be arranged in different location, be also beneficial to simultaneously
Transmitter 1611 of different shapes and receiver 1612 are optionally applied according to actual installation position.Such as transmitter 1611 is arranged
Above polaroid 133, and receiver 1612 can be arranged above polaroid 133 or below TFT circuit layer 135.It can be with
Understand that ground, above-described embodiment are not construed as limiting the invention, the specific installation position of transmitter 1611 and receiver 1612 can
Depending on design requirement.
Referring to Fig. 5, in some embodiments, electronic device 100 further includes euphotic cover plate 11 and light transmission touch panel
12.Euphotic cover plate 11 is formed on light transmission touch panel 12, and light transmission touch panel 12 is arranged on display screen 13, euphotic cover plate 11
90% is all higher than to visible light transmittance rate and infrared light transmittance with light transmission touch panel 12.
Specifically, light transmission touch panel 12 is mainly used for receiving the input that user generates when touching light transmission touch panel 12
Signal is simultaneously transmitted to circuit board progress data processing, to obtain the specific location that user touches light transmission touch panel 12.Wherein,
In-Cell On-Cell coating techniques may be used, light transmission touch panel 12 is bonded with display screen 13, Neng Gouyou
Effect ground mitigates the weight of display screen and reduces the integral thickness of display screen.In addition, being arranged euphotic cover plate 11 in light transmission touch surface
On plate 12, it can be effectively protected light transmission touch panel 12 and its internal structure, avoid external forces to light transmission touch surface
The damage of plate 12 and display screen 13.Euphotic cover plate 11 and light transmission touch panel 12 are all higher than the light transmittance of visible light and infrared light
90%, it not only contributes to display screen 13 and preferably shows content effect, and also help infrared sensor 16 and steadily emit
With reception infrared light, the normal work of infrared sensor 16 ensure that.
Fig. 6 and Fig. 7 are please referred to, in some embodiments, euphotic cover plate 11 is including viewing area 111 and is located at viewing area
The rim area 112 of 111 extensions, rim area 112 include window region 1120, and infrared sensor 16 is oppositely arranged with window region 1120.
Specifically, it is the ornamental value of holding 100 external structure of electronic device, needs to cover up infrared sensor 16,
By being arranged infrared sensor 16 in rim area 112, it can realize that the when of watching electronic device 100 from outside reaches infrared sensing
16 sightless effect of device.In addition, to ensure that infrared sensor 16 normally emits and receive infrared light, by infrared sensor 16
Be oppositely arranged with window region 1120, and window region 1120 done into specially treated, make window region 1120 have through infrared light and
Intercept the effect of visible light.
Fig. 7 to Fig. 9 is please referred to, in some embodiments, euphotic cover plate 11 further includes the first coating layer 14, the first coating
Layer 14 is coated on 11 lower surface 113 of euphotic cover plate and covering window region 1120.
Specifically, the optical density (OD) of window region 1120 can be changed in such a way that the first coating layer 14 is set, it can
The normal work of infrared sensor 16 is nor affected in the case where fully blocking infrared sensor 16.
Referring to Fig. 9, in some embodiments, orthographic projection of the infrared sensor 16 in 13 lower surface 113 of euphotic cover plate
Positioned at the first coating layer 14 in the orthographic projection of 11 lower surface 113 of euphotic cover plate.
Specifically, the installation of infrared sensor 16 usually requires reserved fit-up gap during carrying out technique assembly,
Lead to gap occur between infrared sensor 16 and other elements, so that extraneous visible light is entered in gap, light leakage phenomena occur.
Therefore, on the direction that infrared sensor 16 and euphotic cover plate 11 are laminated, the first coating layer 14 is in 11 lower surface 113 of euphotic cover plate
Orthographic projection area be more than infrared sensor 16 in the area of the orthographic projection of lower surface 113, infrared sensing can not influenced
In the case that device 16 works normally, the first coating layer 14 is made fully to block infrared sensor 16, realized from outside viewing electronics dress
When setting 100, reach 16 sightless effect of infrared sensor.
0 and Figure 11 are please referred to Fig.1, in some embodiments, infrared sensor 16 is in 11 lower surface 113 of euphotic cover plate
Orthographic projection is overlapped with the first coating layer 14.
Specifically, on the direction that infrared sensor 16 and euphotic cover plate 11 are laminated, the first coating layer 14 can also be set
Area of the orthographic projection in 11 lower surface 113 of euphotic cover plate is equal to 16 orthographic projection of infrared sensor in 11 lower surface 113 of euphotic cover plate
Area.It so, it is possible, in the case where not influencing the normal work of infrared sensor 16, to make the first coating layer 14 just block red
Outer sensor 16 is realized from when watching electronic device 100 towards and perpendicular to the direction of 11 upper surface 114 of euphotic cover plate, is reached
16 sightless effect of infrared sensor.
In some embodiments, the first coating layer 14 includes IR ink, and IR ink is more than the light transmittance of infrared light
85%, the wavelength that the infrared light that 6%, IR ink can pass through is less than to the light transmittance of visible light is 850nm-940nm.
Specifically, since IR ink has the characteristic to visible light low-transmittance, so watching electronic device 100 from outside
When, based on the visual observation of human eye less than the infrared sensor 16 being arranged under the first coating layer 14.Simultaneously as IR ink is simultaneous
Have the characteristic to infrared light high transparency, infrared sensor 16 can be made steadily to emit and receive infrared light, ensure that infrared
The normal work of sensor 16.
2 and Figure 13 are please referred to Fig.1, in some embodiments, electronic device 100 further includes being coated under euphotic cover plate 11
Surface 113 and the second coating layer 15 to connect with the first coating layer 14.
Specifically, the first coating layer 14 is mainly used for through infrared light and blocks infrared sensor 16, but due to the first painting
The cost for the IR ink that layer of cloth 14 uses is compared with general black ink height, if all coating IR is oily by 11 lower surface of euphotic cover plate 113
Ink will be unfavorable for reducing production cost, and general black ink can reach more the light transmittance of visible light compared to IR ink
Low, occlusion effect is more prominent.So by the way that the second coating layer 15 is arranged, not only contribute to reduce production cost, and block
Effect more meets technological requirement.
In some embodiments, the second coating layer 15 includes black ink, black ink to the light transmittance of visible light and
The light transmittance of infrared light is respectively less than 3%.
Specifically, one side black ink is lower to the light transmittance of visible light compared to IR ink, and occlusion effect becomes apparent,
More meet technological requirement.Another aspect black ink is low compared to the cost of IR ink, advantageously reduces production cost.
4 and Figure 15 are please referred to Fig.1, in some embodiments, electronic device 100 further includes being arranged under euphotic cover plate 11
Surface 113 and the light shield layer 17 for surrounding infrared sensor 16.
Specifically, after being coated with the technique that the second coating layer 15 connects with the first coating layer 14, the cured process of coating layer
In be possible in the joint of two coating layers gap can occur, when causing to watch electronic device 100 from external environment, around red
There is light leakage phenomena in space around outer sensor 16.Therefore, the light shield layer 17 that infrared sensor 16 is surrounded by setting, is filled up
The gap of the surrounding space and coating layer joint of infrared sensor 16, can eliminate this light leakage phenomena.Light shield layer 17 can
Can also be the foamed plastics or rubber of other black to be using foam made of black material.Certainly, these materials are only
As illustrative, the embodiment of the present invention is not limited to this.
6 are please referred to Fig.1, in some embodiments, electronic device 100 further includes covering buffer layer 18, and buffer layer 18 is set
It sets in the lower section of display screen 13.
Specifically, buffer layer 18 for slow down impact force and it is shockproof with protect light transmission touch panel 12 and display screen 13 and its
Internal structure avoids display screen from being damaged due to by extraneous percussion.Buffer layer 18 can be by foam or foamed plastics
Either rubber or other soft materials are made.Certainly, these padded coamings are only used as illustratively and the embodiment of the present invention
It is not limited to this.
7 are please referred to Fig.1, further, in such an embodiment, electronic device 100 further includes sheet metal 19, metal
Piece 19 is arranged in the lower section of buffer layer 18.
Specifically, sheet metal 19 has the function of spreading Wen Sheng for shielding electromagnetic interference and ground connection.Sheet metal 19 can be with
It is cut using metal materials such as copper foil, aluminium foils.Certainly, these metal materials only implementation of the present invention as illustrative
Example is not limited to this.
Please refer to Fig. 2 and Figure 18, embodiment of the present invention provides a kind of manufacturing method 30 of display screen 13, including following
Step：
S301 provides an organic luminous layer.
A TFT circuit layer is arranged in S302 below organic luminous layer, and TFT circuit layer is for driving organic luminous layer to shine
To be shown.
A polaroid is arranged in S303 above organic luminous layer.With
An infrared sensor is arranged in S304 above polaroid, and infrared sensor is for emitting and/or receiving infrared light.
The manufacturing method 30 of the display screen 13 of embodiment of the present invention can be in the case of comprehensive screen by infrared sensor
16 are arranged above polaroid, avoid traditional tap operation, ensure the reliability of 100 integral strength of electronic device, and
Also further improve the screen accounting of electronic device 100.The infrared light that infrared sensor 16 emits simultaneously is not through TFT circuit
Layer, so as to avoid the scintillation of screen is caused.
In the present invention unless specifically defined or limited otherwise, fisrt feature the "upper" of second feature or "lower"
It may include that the first and second features are in direct contact, can also not be to be in direct contact but pass through it including the first and second features
Between other characterisation contact.Moreover, fisrt feature second feature " on ", " top " and " above " include first special
Sign is right over second feature and oblique upper, or is merely representative of fisrt feature level height and is higher than second feature.Fisrt feature exists
Second feature " under ", " lower section " and " following " include fisrt feature immediately below second feature and obliquely downward, or be merely representative of
Fisrt feature level height is less than second feature.
Above disclosure provides many different embodiments or example is used for realizing the different structure of the present invention.In order to
Simplify disclosure of the invention, above the component of specific examples and setting are described.Certainly, they are merely examples, and
And it is not intended to limit the present invention.In addition, the present invention can in different examples repeat reference numerals and/or reference letter,
This repetition is for purposes of simplicity and clarity, itself not indicate between discussed various embodiments and/or setting
Relationship.In addition, the present invention provides various specific techniques and material example, but those of ordinary skill in the art can be with
Recognize the application of other techniques and/or the use of other materials.
In the description of the present invention, it is to be understood that, term "center", " longitudinal direction ", " transverse direction ", " length ", " width ",
" thickness ", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside", " up time
The orientation or positional relationship of the instructions such as needle ", " counterclockwise " is to be based on the orientation or positional relationship shown in the drawings, and is merely for convenience of
The description present invention and simplified description, do not indicate or imply the indicated device or element must have a particular orientation, with spy
Fixed azimuth configuration and operation, therefore be not considered as limiting the invention.In addition, term " first ", " second " are only used for
Purpose is described, relative importance is not understood to indicate or imply or implicitly indicates the quantity of indicated technical characteristic.
" first " is defined as a result, the feature of " second " can explicitly or implicitly include one or more feature.
In description of the invention, the meaning of " plurality " is two or more, unless otherwise specifically defined.It should also manage
Solution, term "and/or" used herein refer to and include one or more associated list items purposes any or all can
It can combination.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " installation ", " phase
Even ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or be integrally connected.It can
Can also be electrical connection to be mechanical connection.It can be directly connected, can also indirectly connected through an intermediary, Ke Yishi
The interaction relationship of connection or two elements inside two elements.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
In the description of this specification, reference term " embodiment ", " some embodiments ", " schematically implementation
The description of mode ", " example ", " specific example " or " some examples " etc. means embodiment or example is combined to describe specific
Feature, structure, material or feature are contained at least one embodiment or example of the present invention.In the present specification, right
The schematic representation of above-mentioned term is not necessarily referring to identical embodiment or example.Moreover, the specific features of description, knot
Structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
While embodiments of the present invention have been illustrated and described, it will be understood by those skilled in the art that：
Can these embodiments be carried out with a variety of variations in the case of not departing from the principle of the present invention and objective, modification, replace and become
Type, the scope of the present invention are limited by claim and its equivalent.
Claims (16)
1. a kind of display screen, which is characterized in that including；
Organic luminous layer；
The TFT circuit layer being arranged below the organic luminous layer, the TFT circuit layer is for driving the organic luminous layer to send out
Light is to be shown；
Polaroid above the organic luminous layer is set；With
Infrared sensor above the polaroid is set, and the infrared sensor is for emitting and/or receiving infrared light.
2. display screen as described in claim 1, which is characterized in that the infrared sensor includes transmitter and receiver, institute
Transmitter is stated to be wholely set with the receiver.
3. display screen as described in claim 1, which is characterized in that the infrared sensor includes transmitter and receiver, institute
State transmitter and the receiver split settings.
4. a kind of electronic device, which is characterized in that including：
Shell；With
Display screen as described in any one of claims 1-3.
5. electronic device as claimed in claim 4, which is characterized in that the electronic device further includes light transmission touch panel and formation
Euphotic cover plate on the light transmission touch panel, on the display screen, the light transmission is touched for the light transmission touch panel setting
90% is all higher than to the light transmittance of visible light and the light transmittance of infrared light described in control panel and euphotic cover plate.
6. electronic device as claimed in claim 5, which is characterized in that the euphotic cover plate includes viewing area and the encirclement display
The rim area in area, the rim area include window region, and the infrared sensor is oppositely arranged with the window region.
7. electronic device as claimed in claim 6, which is characterized in that the euphotic cover plate further includes the first coating layer, described
First coating layer is coated on the euphotic cover plate lower surface and the covering window region.
8. electronic device as claimed in claim 7, which is characterized in that the infrared sensor is in the euphotic cover plate lower surface
Orthographic projection be located at first coating layer in the orthographic projection of the euphotic cover plate lower surface.
9. electronic device as claimed in claim 7, which is characterized in that the infrared sensor is in the euphotic cover plate lower surface
Orthographic projection overlapped with first coating layer.
10. electronic device as claimed in claim 7, which is characterized in that first coating layer includes IR ink, the IR oil
Ink is more than 85% to the light transmittance of infrared light, and the IR ink is less than 6% to the light transmittance of visible light, and the IR ink can pass through
Infrared light wavelength be 850nm-940nm.
11. electronic device as claimed in claim 7, which is characterized in that the electronic device further includes being coated on the light transmission
Cover board lower surface and the second coating layer to connect with first coating layer.
12. electronic device as claimed in claim 11, which is characterized in that second coating layer includes black ink, described
Light transmittance of the black ink to visible light and the light transmittance to infrared light are respectively less than 3%.
13. electronic device as claimed in claim 7, which is characterized in that the electronic device further includes being arranged in the light transmission
Cover board lower surface and the light shield layer for surrounding the infrared sensor.
14. electronic device as claimed in claim 4, which is characterized in that the electronic device further includes buffer layer, the buffering
Layer is arranged in the lower section of the display screen.
15. electronic device as claimed in claim 15, which is characterized in that the electronic device further includes sheet metal, the gold
Belong to piece to be arranged in the lower section of the buffer layer.
16. a kind of manufacturing method of display screen, which is characterized in that including step：
One organic luminous layer is provided；
One TFT circuit layer is set below the organic luminous layer, and the TFT circuit layer is for driving the organic luminous layer to send out
Light is to be shown；
One polaroid is set above the organic luminous layer；With
One infrared sensor is set above the polaroid, and the infrared sensor is for emitting and/or receiving infrared light.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810266030.5A CN108666346A (en) | 2018-03-28 | 2018-03-28 | The manufacturing method of display screen, electronic device and display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810266030.5A CN108666346A (en) | 2018-03-28 | 2018-03-28 | The manufacturing method of display screen, electronic device and display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108666346A true CN108666346A (en) | 2018-10-16 |
Family
ID=63782054
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810266030.5A Pending CN108666346A (en) | 2018-03-28 | 2018-03-28 | The manufacturing method of display screen, electronic device and display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108666346A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190098A (en) * | 2019-05-28 | 2019-08-30 | 京东方科技集团股份有限公司 | A kind of display base plate, display module and display device |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105094467A (en) * | 2015-08-28 | 2015-11-25 | 京东方科技集团股份有限公司 | Touch apparatus |
| CN107135290A (en) * | 2017-05-17 | 2017-09-05 | 广东欧珀移动通信有限公司 | A kind of sensor cluster, cover plate assembly, display assembly and terminal |
| CN107767835A (en) * | 2017-11-22 | 2018-03-06 | 广东欧珀移动通信有限公司 | Display screen component and electronic equipment |
| CN107768546A (en) * | 2017-11-06 | 2018-03-06 | 华南理工大学 | A kind of organic electroluminescence display panel and preparation method thereof, display device |
-
2018
- 2018-03-28 CN CN201810266030.5A patent/CN108666346A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105094467A (en) * | 2015-08-28 | 2015-11-25 | 京东方科技集团股份有限公司 | Touch apparatus |
| CN107135290A (en) * | 2017-05-17 | 2017-09-05 | 广东欧珀移动通信有限公司 | A kind of sensor cluster, cover plate assembly, display assembly and terminal |
| CN107768546A (en) * | 2017-11-06 | 2018-03-06 | 华南理工大学 | A kind of organic electroluminescence display panel and preparation method thereof, display device |
| CN107767835A (en) * | 2017-11-22 | 2018-03-06 | 广东欧珀移动通信有限公司 | Display screen component and electronic equipment |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110190098A (en) * | 2019-05-28 | 2019-08-30 | 京东方科技集团股份有限公司 | A kind of display base plate, display module and display device |
| CN110190098B (en) * | 2019-05-28 | 2022-06-10 | 京东方科技集团股份有限公司 | Display substrate, display module and display device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN108600419A (en) | Electronic device and its manufacturing method | |
| EP3544268B1 (en) | Electronic device and manufacturing method for an electronic device | |
| CN108494909A (en) | Electronic device and manufacturing method | |
| EP3716588B1 (en) | Electronic device and fabrication method therefor | |
| CN108810195A (en) | Electronic device and its manufacturing method | |
| CN108461044A (en) | Electronic device and its manufacturing method | |
| CN108534891A (en) | Optical sensor, electronic device and its manufacturing method | |
| CN108512960A (en) | Electronic device and its manufacturing method | |
| CN108509088A (en) | Electronic device and its manufacturing method | |
| CN108540595A (en) | Electronic device and its manufacturing method | |
| CN108616618A (en) | Electronic device and its manufacturing method | |
| CN108712523A (en) | Electronic device and its manufacturing method | |
| CN109510885A (en) | Electronic device | |
| CN108494908A (en) | Electronic device and manufacturing method | |
| CN108769354A (en) | Control method, control device, electronic device, storage medium and computer equipment | |
| CN108769298A (en) | Electronic device | |
| CN108848259A (en) | Control method, control device, electronic device, computer storage medium and equipment | |
| CN108803917A (en) | Control method, control device, electronic device, computer storage media and equipment | |
| CN108718349A (en) | Control method, control device, electronic device, storage medium and computer equipment | |
| CN108924278A (en) | Electronic device and its manufacturing method | |
| CN108769297A (en) | Electronic device and its manufacturing method | |
| CN108600420A (en) | Electronic device and manufacturing method | |
| CN108803947A (en) | Control method, control device, electronic device, computer storage media and equipment | |
| CN108600422A (en) | Electronic device and manufacturing method | |
| CN108512956A (en) | Electronic device and its manufacturing method |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: OPPO Guangdong Mobile Communications Co., Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: Guangdong Opel Mobile Communications Co., Ltd. |
|
| CB02 | Change of applicant information | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20181016 |
|
| RJ01 | Rejection of invention patent application after publication |