CN108659747A - A kind of pressure sensitive conductive adhesive and preparation method thereof - Google Patents
A kind of pressure sensitive conductive adhesive and preparation method thereof Download PDFInfo
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- CN108659747A CN108659747A CN201810337644.8A CN201810337644A CN108659747A CN 108659747 A CN108659747 A CN 108659747A CN 201810337644 A CN201810337644 A CN 201810337644A CN 108659747 A CN108659747 A CN 108659747A
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- parts
- pressure sensitive
- conductive adhesive
- sensitive conductive
- silver
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- 230000001070 adhesive effect Effects 0.000 title claims abstract description 37
- 239000000853 adhesive Substances 0.000 title claims abstract description 36
- 238000002360 preparation method Methods 0.000 title claims abstract description 13
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 claims abstract description 34
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 claims abstract description 25
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 claims abstract description 25
- CQEYYJKEWSMYFG-UHFFFAOYSA-N butyl acrylate Chemical compound CCCCOC(=O)C=C CQEYYJKEWSMYFG-UHFFFAOYSA-N 0.000 claims abstract description 17
- 238000003756 stirring Methods 0.000 claims abstract description 15
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 13
- 239000002994 raw material Substances 0.000 claims abstract description 9
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 8
- 239000011231 conductive filler Substances 0.000 claims abstract description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 42
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 26
- 229910052709 silver Inorganic materials 0.000 claims description 25
- 239000004332 silver Substances 0.000 claims description 25
- KRKNYBCHXYNGOX-UHFFFAOYSA-N citric acid Chemical compound OC(=O)CC(O)(C(O)=O)CC(O)=O KRKNYBCHXYNGOX-UHFFFAOYSA-N 0.000 claims description 24
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 15
- 239000000725 suspension Substances 0.000 claims description 14
- SQGYOTSLMSWVJD-UHFFFAOYSA-N silver(1+) nitrate Chemical class [Ag+].[O-]N(=O)=O SQGYOTSLMSWVJD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052757 nitrogen Inorganic materials 0.000 claims description 10
- 238000006243 chemical reaction Methods 0.000 claims description 9
- 238000001035 drying Methods 0.000 claims description 9
- 229910001961 silver nitrate Inorganic materials 0.000 claims description 9
- VHUUQVKOLVNVRT-UHFFFAOYSA-N Ammonium hydroxide Chemical compound [NH4+].[OH-] VHUUQVKOLVNVRT-UHFFFAOYSA-N 0.000 claims description 8
- 239000000908 ammonium hydroxide Substances 0.000 claims description 8
- 235000013855 polyvinylpyrrolidone Nutrition 0.000 claims description 8
- 229920000036 polyvinylpyrrolidone Polymers 0.000 claims description 8
- 239000001267 polyvinylpyrrolidone Substances 0.000 claims description 8
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 claims description 7
- 238000000034 method Methods 0.000 claims description 7
- 230000001681 protective effect Effects 0.000 claims description 7
- PIZHFBODNLEQBL-UHFFFAOYSA-N 2,2-diethoxy-1-phenylethanone Chemical compound CCOC(OCC)C(=O)C1=CC=CC=C1 PIZHFBODNLEQBL-UHFFFAOYSA-N 0.000 claims description 3
- 239000012965 benzophenone Substances 0.000 claims description 2
- GGSUCNLOZRCGPQ-UHFFFAOYSA-N diethylaniline Chemical class CCN(CC)C1=CC=CC=C1 GGSUCNLOZRCGPQ-UHFFFAOYSA-N 0.000 claims description 2
- 239000000843 powder Substances 0.000 claims description 2
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 6
- 206010013786 Dry skin Diseases 0.000 description 5
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical group C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 239000003292 glue Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- -1 20 parts Chemical compound 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000002322 conducting polymer Substances 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
- C09J133/04—Homopolymers or copolymers of esters
- C09J133/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, the oxygen atom being present only as part of the carboxyl radical
- C09J133/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/46—Polymerisation initiated by wave energy or particle radiation
- C08F2/48—Polymerisation initiated by wave energy or particle radiation by ultraviolet or visible light
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1804—C4-(meth)acrylate, e.g. butyl (meth)acrylate, isobutyl (meth)acrylate or tert-butyl (meth)acrylate
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Conductive Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to adhesive technical fields.A kind of pressure sensitive conductive adhesive of the present invention, includes the raw material of following components：10 20 parts of acrylic acid, 10 20 parts of methyl acrylate, 20 30 parts of butyl acrylate, 10 20 parts of conductive filler, 5 10 parts of photoinitiator, 23 parts of crosslinking agent, 67 parts of poly- second butyl ester, 5 10 parts of accelerating agent.The present invention also provides a kind of preparation methods of pressure sensitive conductive adhesive, include the following steps：First the acrylic acid of butyl acrylate, methyl acrylate and a part is mixed, stirs evenly, is heated to 85 90 DEG C, 15 20min, crosslinking agent is added, after reacting 20 30min, remaining acrylic acid is added dropwise, surplus stock is added, continues to heat 4 5h, is cooled to room temperature.The present invention has a kind of hardening time short, the good advantage of bond effect, and has good mechanical strength.
Description
Technical field
The present invention relates to adhesive technical fields, in particular to a kind of pressure sensitive conductive adhesive and preparation method thereof.
Background technology
Conductivity type adhesive be one kind can effectively be glued a variety of materials but also adhesive.It is conductive
Glue can be divided into structural type and filled-type two major classes by base composition.Structural type refers to the high molecular material itself as conducting resinl matrix
I.e. conductive conducting resinl；Filled-type refers to usual adhesive as matrix, and addition electroconductive stuffing is relied on to make glue
Conducting resinl with electric action.At present conducting polymer composite prepare it is sufficiently complex, from practical application also have it is larger away from
From, therefore widely used is filled conductive glue.
And now with electronic device towards miniaturization, current conducting resinl gradually develops to filming, therefore mesh
Preceding conducting resinl is long there are hardening time, bond effect difference the problem of, therefore need a kind of hardening time short at present, bond
The good conductive adhesive of effect.
Invention content
To solve the above-mentioned problems, provide that a kind of hardening time is short, the good conductive adhesive of bond effect.The present invention uses
Following technical scheme：
A kind of pressure sensitive conductive adhesive, which is characterized in that the raw material including following components：
10-20 parts of acrylic acid, 10-20 parts of methyl acrylate, 20-30 parts of butyl acrylate, 10-20 parts of conductive filler are light-initiated
5-10 parts of agent, 2-3 parts of crosslinking agent, 6-7 parts of poly- second butyl ester, 5-10 parts of accelerating agent.
Present invention employs photoinitiators to close the coefficient scheme of latent curing agent, can be auxiliary by ultraviolet light
Carry out curing reaction is helped, the cured efficiency of adhesive is accelerated, and the present invention additionally uses poly- second butyl ester, contributes to the present invention non-
Component is sufficiently mixed, and improves the mechanical strength of the present invention.
Preferably, the conductive filler uses silver-coated copper powder.
Present invention employs silver-coated copper powders as conductive filler, and silver-coated copper powder is as conductive filler compared to using the silver powder to have
Help reduce cost, and add silver-coated copper powder help to improve the present invention machine capability, and silver-coated copper powder compared to
There is higher conductive capability using copper powder, enhance the toughness and abrasive resistance of the present invention.
Preferably, the silver-coated copper powder granularity is 300-450 mesh.
Using the silver-coated copper powder that mesh number is larger in the present invention program, copper powder is contributed to be well dispersed in adhesive system
It is interior, it on the one hand can enhance the conductive capability of adhesive, on the other hand can enhance the toughness of adhesive, improve the machinery of product
Performance helps to improve the adhesive property of product.
Preferably, the silver-coated copper powder is prepared using following methods：By copper-bath and polyvinylpyrrolidone
Mixing so that a concentration of 1-3mol/L of copper sulphate is passed through nitrogen as protective atmosphere, then under the conditions of 50-60 DEG C, is added
It is 6-7 that citric acid solution, which adjusts system pH, reacts 20-30min, obtains copper powder, and 20-30 parts are dissipated in water, ammonia is then added dropwise
Water, adjustment pH are 8-9, and enuatrol is added, forms suspension, stirs 10-20 minutes, then 5-6 parts of silver nitrates are dissolved in water,
It is gradually added drop-wise in the time of 20-30min in the suspension, is filtered after reaction, washed, it is dry.
First, present invention employs the scheme that copper-bath and polyvinylpyrrolidone produce copper powder, help to obtain
The smaller copper powder of particle, and nitrogen protection and citric acid are added in preparation process, help to prevent in preparation process
Copper powder is aoxidized, and has then used the scheme of ammonium hydroxide and enuatrol again, and the copper oxide of Copper Powder Surface is destroyed by ammonium hydroxide, is then led to
It crosses and silver nitrate solution is slowly added dropwise so that copper and silver nitrate are reacted on the contact surface, protect copper will not be because of by enuatrol
The oxidation of air forms copper oxide, covers silver-colored effect to improve Copper Powder Surface, improves the electrical efficiency of the present invention.
Preferably, temperature dry in the drying process is 65-70 DEG C.
The present invention contributes to prevent copper powder is heated from quick oxidation occurs using lower drying temperature, prevents conduction
Rate reduces.
Preferably, the photoinitiator uses α, α-diethoxy acetophenone, alpha-hydroxyalkyl benzophenone, α-amine alkylbenzene
One or more of ketone combines.
Preferably, the crosslinking agent uses N, N- methylene-bisacrylamides, the accelerating agent to use N, N- bis-
Ethyl aniline.
A kind of preparation method of pressure sensitive conductive adhesive, which is characterized in that include the following steps：
（1）The acrylic acid of butyl acrylate, methyl acrylate and a part is mixed, stirs evenly, is heated to 85-90 DEG C,
15-20min adds crosslinking agent, after reacting 20-30min；
（2）Remaining acrylic acid is added dropwise, adds surplus stock, continues to heat 4-5h, is cooled to room temperature.
The present invention first by the acrylic acid hybrid reaction of butyl acrylate, methyl acrylate and a part, is crosslinked, so
After add surplus stock, contribute to reinforce raw material mixed effect, while also contribute to improve the present invention cementitiousness.
Specific implementation mode
The present invention is further expalined with reference to specific implementation case：
Embodiment 1
A kind of pressure sensitive conductive adhesive includes the raw material of following components：
10 parts of acrylic acid, 10 parts of methyl acrylate, 20 parts of butyl acrylate, 10 parts, α of silver-coated copper powder, α-diethoxy acetophenone 5
Part, N, 2 parts of N- methylene-bisacrylamides, 6 parts, N of poly- second butyl ester, 5 parts of N- diethylanilines.
Wherein, the silver-coated copper powder granularity is 300 mesh.
Wherein, the silver-coated copper powder is prepared using following methods：Copper-bath and polyvinylpyrrolidone are mixed,
So that a concentration of 1mol/L of copper sulphate, is passed through nitrogen as protective atmosphere, then under the conditions of 50 DEG C, citric acid solution is added
Adjustment system pH is 6-7, reacts 20min, obtains copper powder, and 20 parts are dissipated in water, and ammonium hydroxide is then added dropwise, and adjustment pH is 8, is added
Enuatrol forms suspension, stirs 10 minutes, then 5 parts of silver nitrates are dissolved in water, and institute is gradually added drop-wise within the time of 20min
It in the suspension stated, filters, washs, 65 DEG C of dryings after reaction.
A kind of preparation method of pressure sensitive conductive adhesive, which is characterized in that include the following steps：
（1）The acrylic acid of butyl acrylate, methyl acrylate and a part is mixed, stirs evenly, is heated to 85 DEG C,
15min adds crosslinking agent, after reacting 20min；
（2）Remaining acrylic acid is added dropwise, adds surplus stock, continues to heat 4h, is cooled to room temperature.
Embodiment 2
A kind of pressure sensitive conductive adhesive includes the raw material of following components：
20 parts of acrylic acid, 20 parts of methyl acrylate, 30 parts of butyl acrylate, 20 parts, α, α-diethoxy acetophenone of silver-coated copper powder
10 parts, N, 3 parts of N- methylene-bisacrylamides, 7 parts, N of poly- second butyl ester, 10 parts of N- diethylanilines.
Wherein, the silver-coated copper powder granularity is 450 mesh.
Wherein, the silver-coated copper powder is prepared using following methods：Copper-bath and polyvinylpyrrolidone are mixed,
So that a concentration of 3mol/L of copper sulphate, is passed through nitrogen as protective atmosphere, then under the conditions of 60 DEG C, citric acid solution is added
Adjustment system pH is 7, reacts 30min, obtains copper powder, and 30 parts are dissipated in water, and ammonium hydroxide is then added dropwise, and adjustment pH is 9, and oil is added
Sour sodium forms suspension, stirs 20 minutes, then 6 parts of silver nitrates are dissolved in water, and is gradually added drop-wise within the time of 30min described
Suspension in, filtered after reaction, wash, 70 DEG C of dryings.
A kind of preparation method of pressure sensitive conductive adhesive, which is characterized in that include the following steps：
（1）The acrylic acid of butyl acrylate, methyl acrylate and a part is mixed, stirs evenly, is heated to 90 DEG C,
20min adds crosslinking agent, after reacting 30min；
（2）Remaining acrylic acid is added dropwise, adds surplus stock, continues to heat 5h, is cooled to room temperature.
Embodiment 3
A kind of pressure sensitive conductive adhesive includes the raw material of following components：
15 parts of acrylic acid, 15 parts of methyl acrylate, 25 parts of butyl acrylate, 15 parts, α of silver-coated copper powder, α-diethoxy acetophenone 7
Part, N, 2 parts of N- methylene-bisacrylamides, 6 parts, N of poly- second butyl ester, 7 parts of N- diethylanilines.
Wherein, the silver-coated copper powder granularity is 400 mesh.
Wherein, the silver-coated copper powder is prepared using following methods：Copper-bath and polyvinylpyrrolidone are mixed,
So that a concentration of 2mol/L of copper sulphate, is passed through nitrogen as protective atmosphere, then under the conditions of 55 DEG C, citric acid solution is added
Adjustment system pH is 4, reacts 25min, obtains copper powder, and 25 parts are dissipated in water, and ammonium hydroxide is then added dropwise, and adjustment pH is 8, and oil is added
Sour sodium forms suspension, stirs 15 minutes, then 5 parts of silver nitrates are dissolved in water, and is gradually added drop-wise within the time of 25min described
Suspension in, filtered after reaction, wash, 70 DEG C of dryings.
A kind of preparation method of pressure sensitive conductive adhesive, which is characterized in that include the following steps：
（1）The acrylic acid of butyl acrylate, methyl acrylate and a part is mixed, stirs evenly, is heated to 90 DEG C,
15min adds crosslinking agent, after reacting 25min；
（2）Remaining acrylic acid is added dropwise, adds surplus stock, continues to heat 5h, is cooled to room temperature.
Embodiment 4
A kind of pressure sensitive conductive adhesive includes the raw material of following components：
12 parts of acrylic acid, 12 parts of methyl acrylate, 23 parts of butyl acrylate, 13 parts, α of silver-coated copper powder, α-diethoxy acetophenone 7
Part, N, 2 parts of N- methylene-bisacrylamides, 7 parts, N of poly- second butyl ester, 6 parts of N- diethylanilines.
Wherein, the silver-coated copper powder granularity is 320 mesh.
Wherein, the silver-coated copper powder is prepared using following methods：Copper-bath and polyvinylpyrrolidone are mixed,
So that a concentration of 1mol/L of copper sulphate, is passed through nitrogen as protective atmosphere, then under the conditions of 52 DEG C, citric acid solution is added
Adjustment system pH is 6, reacts 22min, obtains copper powder, and 22 parts are dissipated in water, and ammonium hydroxide is then added dropwise, and adjustment pH is 8, and oil is added
Sour sodium forms suspension, stirs 10 minutes, then 5-6 parts of silver nitrates are dissolved in water, and institute is gradually added drop-wise within the time of 20min
It in the suspension stated, filters, washs, 65 DEG C of dryings after reaction.
A kind of preparation method of pressure sensitive conductive adhesive, which is characterized in that include the following steps：
（1）The acrylic acid of butyl acrylate, methyl acrylate and a part is mixed, stirs evenly, is heated to 85 DEG C,
15min adds crosslinking agent, after reacting 22min；
（2）Remaining acrylic acid is added dropwise, adds surplus stock, continues to heat 4h, is cooled to room temperature.
Embodiment 5
A kind of pressure sensitive conductive adhesive includes the raw material of following components：
19 parts of acrylic acid, 18 parts of methyl acrylate, 28 parts of butyl acrylate, 17 parts, α of silver-coated copper powder, α-diethoxy acetophenone 8
Part, N, 2 parts of N- methylene-bisacrylamides, 7 parts, N of poly- second butyl ester, 7 parts of N- diethylanilines.
Wherein, the silver-coated copper powder granularity is 300 mesh.
Wherein, the silver-coated copper powder is prepared using following methods：Copper-bath and polyvinylpyrrolidone are mixed,
So that a concentration of 1mol/L of copper sulphate, is passed through nitrogen as protective atmosphere, then under the conditions of 50 DEG C, citric acid solution is added
Adjustment system pH is 6, reacts 30min, obtains copper powder, and 20 parts are dissipated in water, and ammonium hydroxide is then added dropwise, and adjustment pH is 8, and oil is added
Sour sodium forms suspension, stirs 20 minutes, then 6 parts of silver nitrates are dissolved in water, and is gradually added drop-wise within the time of 30min described
Suspension in, filtered after reaction, wash, 70 DEG C of dryings.
A kind of preparation method of pressure sensitive conductive adhesive, which is characterized in that include the following steps：
（1）The acrylic acid of butyl acrylate, methyl acrylate and a part is mixed, stirs evenly, is heated to 88 DEG C,
18min adds crosslinking agent, after reacting 24min；
（2）Remaining acrylic acid is added dropwise, adds surplus stock, continues to heat 5h, is cooled to room temperature.
Claims (8)
1. a kind of pressure sensitive conductive adhesive, which is characterized in that the raw material including following components：
10-20 parts of acrylic acid, 10-20 parts of methyl acrylate, 20-30 parts of butyl acrylate, 10-20 parts of conductive filler are light-initiated
5-10 parts of agent, 2-3 parts of crosslinking agent, 6-7 parts of poly- second butyl ester, 5-10 parts of accelerating agent.
2. a kind of pressure sensitive conductive adhesive according to claim 1, it is characterised in that：The conductive filler is wrapped using silver
Copper powder.
3. a kind of pressure sensitive conductive adhesive according to claim 2, it is characterised in that：The silver-coated copper powder granularity is
300-450 mesh.
4. a kind of pressure sensitive conductive adhesive according to claim 3, which is characterized in that the silver-coated copper powder is using following
It is prepared by method：Copper-bath and polyvinylpyrrolidone are mixed so that a concentration of 1-3mol/L of copper sulphate is passed through nitrogen
As protective atmosphere, then under the conditions of 50-60 DEG C, citric acid solution is added and adjusts system pH between 6-7, reacts 20-
30min obtains copper powder, and 20-30 parts are dissipated in water, ammonium hydroxide is then added dropwise, pH is between 8-9 for adjustment, and enuatrol is added, and is formed
Suspension stirs 10-20 minute, then 5-6 parts of silver nitrates are dissolved in water, be gradually added drop-wise within the time of 20-30min described in
It in suspension, filters, washs after reaction, it is dry.
5. a kind of pressure sensitive conductive adhesive according to claim 4, it is characterised in that：Drying in the drying process
Temperature is 65-70 DEG C.
6. a kind of pressure sensitive conductive adhesive according to claim 1, it is characterised in that：The photoinitiator uses α, α-
One or more of diethoxy acetophenone, alpha-hydroxyalkyl benzophenone, α-amine alkyl phenones combine.
7. a kind of pressure sensitive conductive adhesive according to claim 1, it is characterised in that：The crosslinking agent uses N, N- sub-
Bisacrylamide, the accelerating agent use N, N- diethylanilines.
8. a kind of preparation method of pressure sensitive conductive adhesive according to one of claim 1-7, which is characterized in that including with
Lower step：
（1）The acrylic acid of butyl acrylate, methyl acrylate and a part is mixed, stirs evenly, is heated to 85-90 DEG C,
15-20min adds crosslinking agent, after reacting 20-30min；
（2）Remaining acrylic acid is added dropwise, adds surplus stock, continues to heat 4-5h, is cooled to room temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337644.8A CN108659747A (en) | 2018-04-16 | 2018-04-16 | A kind of pressure sensitive conductive adhesive and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810337644.8A CN108659747A (en) | 2018-04-16 | 2018-04-16 | A kind of pressure sensitive conductive adhesive and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108659747A true CN108659747A (en) | 2018-10-16 |
Family
ID=63783530
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810337644.8A Pending CN108659747A (en) | 2018-04-16 | 2018-04-16 | A kind of pressure sensitive conductive adhesive and preparation method thereof |
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| Country | Link |
|---|---|
| CN (1) | CN108659747A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN111500215A (en) * | 2020-04-30 | 2020-08-07 | 张家港保税区汇英聚福材料科技合伙企业(有限合伙) | Pressure-sensitive conductive adhesive and preparation method thereof |
| IT201900015794A1 (en) * | 2019-09-06 | 2021-03-06 | Jianqiang Zhao | Fast setting conductive adhesive at room temperature |
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| CN101698784A (en) * | 2009-09-22 | 2010-04-28 | 北京高盟化工有限公司 | Pressure sensitive conductive adhesive composite and preparation method thereof |
| CN105219315A (en) * | 2015-11-09 | 2016-01-06 | 深圳德邦界面材料有限公司 | A kind of sedimentation-prevention type pressure-sensitive conductive glue and preparation method thereof |
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| CN101698784A (en) * | 2009-09-22 | 2010-04-28 | 北京高盟化工有限公司 | Pressure sensitive conductive adhesive composite and preparation method thereof |
| CN105219315A (en) * | 2015-11-09 | 2016-01-06 | 深圳德邦界面材料有限公司 | A kind of sedimentation-prevention type pressure-sensitive conductive glue and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| IT201900015794A1 (en) * | 2019-09-06 | 2021-03-06 | Jianqiang Zhao | Fast setting conductive adhesive at room temperature |
| CN111500215A (en) * | 2020-04-30 | 2020-08-07 | 张家港保税区汇英聚福材料科技合伙企业(有限合伙) | Pressure-sensitive conductive adhesive and preparation method thereof |
| CN111500215B (en) * | 2020-04-30 | 2021-11-26 | 张家港保税区汇英聚福材料科技合伙企业(有限合伙) | Pressure-sensitive conductive adhesive and preparation method thereof |
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