CN108600599B

CN108600599B - Imaging module, camera assembly and electronic device

Info

Publication number: CN108600599B
Application number: CN201810829417.7A
Authority: CN
Inventors: 张弓
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2018-07-25
Filing date: 2018-07-25
Publication date: 2021-04-09
Anticipated expiration: 2038-07-25
Also published as: CN108600599A

Abstract

The application provides an imaging module, camera subassembly and electron device. The imaging module comprises a shell provided with a light inlet, and a reflecting element, a mounting seat and an image sensor which are all arranged in the shell. The light reflecting element is fixed on the mounting seat, the light reflecting element is used for steering incident light incident from the light inlet and then transmitting the incident light to the image sensor so that the image sensor can sense the incident light outside the imaging module, the mounting seat can rotate around the rotating shaft relative to the shell, and the axial direction of the rotating shaft is perpendicular to the optical axis of the light inlet. The imaging module further comprises a driving device, the driving device is used for applying driving force deviating from the rotating shaft to the mounting seat, and the driving force drives the mounting seat to rotate around the rotating shaft, so that the imaging module realizes optical anti-shake in the optical axis direction of the light inlet. Above-mentioned imaging module, camera subassembly and electron device are because drive arrangement applys the drive power of skew pivot to the mount pad to make imaging module realize the optical anti-shake in the light inlet optical axis direction and can improve the precision of anti-shake.

Description

Imaging module, camera assembly and electronic device

Technical Field

The application relates to the field of electronic devices, in particular to an imaging module, a camera assembly and an electronic device.

Background

In the related art, in order to improve the photographing effect of the mobile phone, a periscopic lens is adopted in the camera of the mobile phone, and the periscopic camera can perform, for example, three times of optical focal length to obtain an image with better quality. The periscopic camera comprises a reflecting element, and the reflecting element is used for guiding light rays incident into the periscopic lens to the image sensor after the light rays are turned, so that the image sensor can acquire images outside the periscopic lens. How to drive the reflective element to move to realize the optical anti-shake of the periscopic lens is a technical problem to be solved.

Disclosure of Invention

The application provides an imaging module, camera subassembly and electron device.

The imaging module of this application embodiment is in including offering the shell of light inlet and all setting up reflection of light component, mount pad and image sensor in the shell. The light reflecting element is fixed on the mounting seat, the light reflecting element is used for steering incident light incident from the light inlet and then transmitting the incident light to the image sensor so that the image sensor senses the incident light outside the imaging module, the mounting seat can rotate around a rotating shaft relative to the shell, and the axial direction of the rotating shaft is perpendicular to the optical axis of the light inlet. The imaging module further comprises a driving device, the driving device is used for applying deviation to the mounting seat to drive the driving force of the rotating shaft, and the driving force drives the mounting seat to rotate around the rotating shaft, so that the imaging module is enabled to realize optical anti-shake in the optical axis direction of the light inlet.

The camera assembly of this application embodiment includes the formation of image module of decoration and above embodiment, the decoration cover is established the light inlet top of formation of image module.

The electronic device of the embodiment of the application comprises a machine shell and the camera assembly of the embodiment, wherein the camera assembly is arranged on the machine shell.

Among above-mentioned imaging module, camera subassembly and the electron device, drive arrangement applys the drive power of skew pivot to the mount pad to make imaging module realize the optical anti-shake in the light inlet optical axis direction and can improve the precision of anti-shake.

Additional aspects and advantages of the present application will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the present application.

Drawings

The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

fig. 1 is a schematic plan view of an electronic device according to an embodiment of the present application;

FIG. 2 is a schematic perspective view of a camera assembly according to an embodiment of the present application;

FIG. 3 is an exploded schematic view of a camera head assembly according to an embodiment of the present application;

FIG. 4 is a schematic perspective view of a trim piece according to an embodiment of the present application;

FIG. 5 is an exploded view of a first imaging module according to an embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view of a first imaging module according to an embodiment of the present disclosure;

FIG. 7 is a schematic cross-sectional view of a first imaging module according to another embodiment of the present disclosure;

FIG. 8 is a schematic cross-sectional view A-A of the camera assembly of FIG. 2;

FIG. 9 is a schematic cross-sectional view of a second imaging module according to an embodiment of the present disclosure;

FIG. 10 is a schematic view of the configuration of some embodiments of the imaging module in cooperation with a decorative element;

FIG. 11 is a schematic cross-sectional view of the electronic device of FIG. 1 taken along line B-B;

FIG. 12 is a perspective view of a retroreflective element according to an embodiment of the present application.

FIG. 13 is a schematic diagram of a first imaging module according to the related art;

FIG. 14 is a schematic view of a light reflection imaging of a first imaging module according to an embodiment of the present disclosure;

FIG. 15 is a schematic structural diagram of an imaging module according to an embodiment of the present disclosure;

fig. 16 is a schematic structural diagram of an imaging module according to another embodiment of the present disclosure.

Description of the main element symbols:

the electronic device 1000, the housing 102, the camera head assembly 100, the decoration 10, the through hole 11, the first sub-hole 111, the second sub-hole 112, the decoration ring 12, the convex edge 13, the first imaging module 20, the housing 21, the light inlet 211, the groove 212, the top wall 213, the side wall 214, the light reflecting element 22, the light incident surface 222, the back surface 224, the light reflecting surface 226, the light emitting surface 228, the mounting seat 23, the first lens assembly 24, the lens 241, the moving element 25, the clip 222, the first image sensor 26, the driving mechanism 27, the driving device 28, the magnetic element 282, the coil 284, the piezoelectric element 286, the spring 287, the rotating shaft 29, the second imaging module 30, the second lens assembly 31, the second image sensor 32, and the bracket 40.

Detailed Description

Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative and are only for the purpose of explaining the present application and are not to be construed as limiting the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

Referring to fig. 1, an electronic device 1000 according to an embodiment of the present disclosure includes a housing 102 and a camera assembly 100. The camera assembly 100 is disposed on a chassis 102. The electronic device 1000 may be a mobile phone, a tablet computer, a notebook computer, an intelligent bracelet, an intelligent watch, an intelligent helmet, an intelligent glasses, and the like. In the embodiment of the present application, the electronic device 1000 is a mobile phone as an example, and it is understood that the specific form of the electronic device 1000 may be other, and is not limited herein.

Specifically, the housing 102 is an external component of the electronic device 1000, which functions to protect internal components of the electronic device 1000. The housing 102 may be a rear cover of the electronic device 1000, which covers components of the electronic device 1000 such as a battery. In this embodiment, the camera assembly 100 is disposed at the rear, or the camera assembly 100 is disposed at the rear of the electronic device 1000 so that the electronic device 1000 can perform rear-view imaging. As in the example of fig. 1, the camera assembly 100 is disposed at an upper left corner of the housing 102. Of course, it is understood that the camera assembly 100 may be disposed at other locations, such as at the top-middle or top-right position of the housing 102. The position where the camera head assembly 100 is provided in the chassis 102 is not limited to the example of the present application.

Referring to fig. 2 and 3, the camera assembly 100 includes a decoration 10, a first imaging module 20, a second imaging module 30, and a bracket 40. The decoration 10 is disposed on the housing 102 and protrudes from the surface of the housing 102. The first imaging module 20 and the second imaging module 30 are both disposed inside the cabinet 102. The first imaging module 20 and the second imaging module 30 are each disposed proximate to the trim piece 10. The first imaging module 20 and the second imaging module 30 are both disposed in the support 40 and fixedly connected to the support 40.

The garnish 10 is disposed above the bracket 40, and specifically, the garnish 10 may abut on the bracket 40 or may be disposed spaced apart from the bracket 10. The support 40 can reduce the impact on the first and

second imaging modules

20 and 30, and improve the service life of the first and

second imaging modules

20 and 30.

The decoration 10 may be made of a metal material, for example, the decoration 10 may be made of stainless steel, and the decoration 10 may be processed by a polishing process to form a bright surface so that the decoration 10 is more beautiful.

Referring to fig. 4, the decoration 10 is formed with a through hole 11, and the first imaging module 20 and the second imaging module 30 are exposed out of the decoration 10 from the through hole 11, or the first imaging module 20 and the second imaging module 30 capture external images through the through hole 11. Specifically, in the present embodiment, the through hole 11 includes a first sub-hole 111 and a second sub-hole 112, and the first sub-hole 111 and the second sub-hole 112 are disposed at intervals. Alternatively, the first sub-hole 111 and the second sub-hole 112 are not communicated.

Of course, in other embodiments, the first sub-aperture 111 and the second sub-aperture 112 may communicate to form a single integral aperture. The first imaging module 20 captures an ambient image through the first sub-aperture 111 and the second imaging module 30 captures an ambient image through the second sub-aperture 112. In this embodiment, the first sub-holes 111 are circular holes, and the second sub-holes 112 are square holes.

In other embodiments, the shapes of the first sub-hole 111 and the second sub-hole 112 are not limited to the shapes illustrated in the drawings. For example, the first sub-hole 111 and the second sub-hole 112 are both circular holes; for another example, the first sub-hole 111 and the second sub-hole 112 are both square holes.

The ornament 10 includes an ornament ring 12 and a flange 13, and the flange 13 extends from the bottom of the ornament ring 12 to a direction away from the ornament ring 12. The through hole 11 is formed in the decorative ring 12 and penetrates through the decorative ring 12 and the flange 13, the decorative ring 12 is mounted on the housing 102, and the flange 13 abuts against the housing 102, as shown in fig. 11. In this way, the rim 13 can limit the position of the decoration 10 and prevent the decoration 10 from moving out of the housing 102.

In one example, the garnish 10 is inserted outwardly from the interior of the housing 102 when the garnish 10 is installed, and the garnish 10 is installed at a predetermined position when the collar 13 abuts against the interior surface of the housing 102. The decoration 10 can be fixed on the housing 102 by using an adhesive, or the decoration 10 can be in interference fit with the housing 102, so that the decoration 10 is not easy to fall off from the housing 102.

The decoration 10 may be an integrally formed structure formed by the decoration ring 12 and the convex edge 13, for example, the decoration 10 is manufactured by cutting. In addition, the decorative ring 12 and the flange 13 may be separate structures, or the decorative ring 12 and the flange 13 are formed as two separate elements and then assembled together by welding or the like to form the decoration 10.

It should be noted that in other embodiments, the collar 13 may be omitted, that is, in this embodiment, the decorative piece 10 includes only the configuration of the bezel 12.

The first imaging module 20 and the second imaging module 30 are arranged in parallel, that is, the second imaging module 30 is disposed on one side of the first imaging module 20. In the present embodiment, the first imaging module 20 and the second imaging module 30 are arranged in a straight line, or the first imaging module 20 and the second imaging module 30 are arranged along the same straight line. In other embodiments, the first imaging module 20 and the second imaging module 30 may be arranged in an L-shape. The first imaging module 20 and the second imaging module 30 may be disposed at a distance from each other or may abut against each other.

In this embodiment, the first imaging module 20 is located at the right side of the second imaging module 30, or the first imaging module 20 is closer to the middle of the electronic device 1000 than the second imaging module 30. Of course, it is understood that in other embodiments, the positions of the first imaging module 20 and the second imaging module 30 may be interchanged, or the first imaging module 20 is located on the left side of the second imaging module 30.

In the first imaging module 20 and the second imaging module 30, one of the imaging modules may be a black-and-white camera, and the other imaging module is an RGB camera; or one imaging module is an infrared camera, and the other imaging module is an RGB camera; or one imaging module is an RGB camera, and the other imaging module is also an RGB camera; or one imaging module is a wide-angle camera and the other imaging module is a long-focus camera and the like.

In other embodiments, the second imaging module 30 may be omitted, or the electronic device 1000 may include more than three imaging modules.

Referring to fig. 5-7, in the present embodiment, the first imaging module 20 includes a housing 21, a reflective element 22, a mounting base 23, a first lens assembly 24, a moving element 25, a first image sensor 26, and a driving mechanism 27.

The retroreflective element 22, the mount 23, the first lens assembly 24, the moving element 25, the first image sensor 26, and the driving mechanism 27 are disposed within the housing 21. The retroreflective element 22 is mounted on the mounting base 23 and the first lens assembly 24 is received in the motion element 25. The moving element 25 is disposed on the first image sensor 26 side.

A drive mechanism 27 connects the moving element 25 with the housing 21. Incident light enters the housing 21, is deflected by the reflective element 22, and then passes through the first lens assembly 24 to the first image sensor 26, so that the first image sensor 26 obtains an ambient image. The driving mechanism 27 drives the moving element 25 to move the first lens assembly 24, so that the first imaging module 20 achieves the focusing effect.

The housing 21 is substantially square, and the housing 21 is opened with a light inlet 211, and the incident light enters the first imaging module 20 through the light inlet 211. That is, the reflective member 22 is used to divert incident light from the light inlet 211 to the first image sensor 26. Therefore, it can be understood that the first imaging module 20 is a periscopic lens module, and the height of the periscopic lens module is smaller than that of the vertical lens module, so that the overall thickness of the electronic device 1000 can be reduced. The vertical lens module means that the optical axis of the lens module is a straight line, or the incident light is transmitted to the photosensitive device of the lens module along the direction of the straight line optical axis.

It can be understood that the light inlet 211 is exposed through the through hole 11, so that external light enters the first imaging module 20 from the light inlet 211 after passing through the through hole 11.

Referring to fig. 8, in the present embodiment, in the width direction of the first imaging module 20, a groove 212 is formed on one side of the light inlet 211 of the housing 21, and the decoration 10 is covered on the light inlet 211 and partially inserted into the groove 212.

Referring to fig. 10, if the recess is omitted, in order to make the overall thickness of the electronic device thinner, the periscopic imaging module 20a partially extends into the decoration 10a in the width direction, and since the width of the periscopic imaging module 20a is larger than that of the vertical imaging module, the size of the decoration 10a is larger, which is not good for the appearance of the electronic device, and the electronic device is not compact enough.

Referring to fig. 5 and 8 again, in the present embodiment, the groove 212 is formed at one side of the light inlet 211, and the decoration 10 is covered above the light inlet 211 and partially clamped into the groove 212, so that not only the width of the decoration 10 is smaller, but also the overall height of the camera assembly 100 is reduced, which is beneficial to the compact and miniaturized structure of the camera assembly 100.

Specifically, the housing 21 includes a top wall 213 and a side wall 214. The side wall 214 is formed extending from a side edge 2131 of the top wall 213. The top wall 213 includes two opposite sides 2131, the number of the side walls 214 is two, and each side wall 214 extends from a corresponding one of the side walls 2131, or the side walls 214 are respectively connected to two opposite sides of the top wall 213. The light inlet 211 is formed at the top wall 213, the recess 212 is formed at the junction of the top wall 213 and the side wall 214, and the decoration 10 abuts against the top wall 213. In this manner, the groove 212 is easily formed, facilitating the manufacture of the housing 21. In one example, the recess 212 is a profiling of the housing 21, i.e., the recess 212 may be formed by stamping.

In one example, a portion of the bottom of the bezel 12 is received in the recess 212 and a portion of the bezel 12 rests against the top wall 213. Or, the bezel 12 and the housing 21 form a complementary structure, and the bezel 12 and the housing 21 are engaged with each other, so that the fitting structure of the decoration 10 and the housing 21 is more compact.

In this embodiment, a groove 212 is formed at the junction of each side wall 214 and the top wall 213. Alternatively, the number of the grooves 212 is two. Of course, in the embodiment, the number of the grooves 212 may be single, that is, the groove 212 is formed at the connection of one of the side walls 214 and the top wall 213.

In the present embodiment, the groove 212 has an elongated shape, and the groove 212 extends along the length direction of the first imaging module 20. In this manner, the recess 212 mates more compactly with the trim piece 10. In some embodiments, the groove 212 may be arc-shaped, and the arc-shaped groove 212 surrounds the light inlet 211. Of course, in other embodiments, the structure and shape of the recess 212 is not limited to the above example, as long as the trim piece 10 and the first imaging module 20 form a complementary structure to reduce the size of the trim piece 10.

Reflective element 22 is a prism or a flat mirror. In one example, when reflective element 22 is a prism, the prism may be a triangular prism having a cross-section of a right triangle, wherein light is incident from one of the legs of the right triangle and exits through reflection from the hypotenuse to the other leg. It will be appreciated that, of course, the incident light may exit after being refracted by the prism, without being reflected. The prism can be made of glass, plastic and other materials with better light transmittance. In one embodiment, one of the surfaces of the prism may be coated with a light reflecting material such as silver to reflect incident light.

It will be appreciated that when reflective element 22 is a flat mirror, the flat mirror reflects incident light to effect steering of the incident light.

Referring to fig. 6 and 12, the reflective element 22 has a light incident surface 222, a light emitting surface 224, a light reflecting surface 226, and a light emitting surface 228. The light incident surface 222 is close to and faces the light entrance 211, the backlight surface 224 is far from the light entrance 211 and is opposite to the light incident surface 222, the light reflecting surface 226 is connected with the light incident surface 222 and the backlight surface 224, the light emitting surface 228 is connected with the light incident surface 222 and the backlight surface 224, the light reflecting surface 226 is inclined relative to the light incident surface 222, and the light emitting surface 228 is opposite to the light reflecting surface 226.

Specifically, in the light conversion process, the light passes through the light inlet 211, enters the reflective element 22 through the light incident surface 222, is reflected by the light reflecting surface 226, and finally reflects the reflective element 22 out of the light emitting surface 228, thereby completing the light conversion process, and the backlight surface 224 and the mounting base 23 are fixedly disposed, so that the reflective element 22 is kept stable.

As shown in fig. 13, in the related art, because the reflecting surface 226a of the reflector 22a is inclined with respect to the horizontal direction and the reflector 22a is asymmetric in the reflecting direction of the light, the actual optical area under the reflector 22a is smaller than that above the reflector 22a, and it can be understood that the part of the reflecting surface 226a far from the light inlet is less or unable to reflect the light.

Therefore, referring to fig. 14, the reflector 22 of the present embodiment is cut away from the light inlet with respect to the reflector 22a of the related art, which not only does not affect the light reflection effect of the reflector 22, but also reduces the overall thickness of the reflector 22.

In some embodiments, the light-reflecting surface 226 is inclined at an angle α of 45 degrees with respect to the light-entering surface 222.

Therefore, the incident light rays are better reflected and converted, and a better light ray conversion effect is achieved.

Retroreflective element 22 may be made of a material having relatively good light transmission properties such as glass or plastic. In one embodiment, one of the surfaces of retroreflective element 22 may be coated with a reflective material such as silver to reflect incident light.

In some embodiments, the light incident surface 222 is disposed parallel to the light emergent surface 224.

Thus, when the backlight surface 224 and the mounting seat 23 are fixedly arranged, the light reflecting element 22 can be kept stable, the light incident surface 222 is also a plane, and incident light forms a regular light path in the conversion process of the light reflecting element 22, so that the conversion efficiency of the light is better. Specifically, the cross section of the reflector 22 is substantially trapezoidal along the light incident direction of the light inlet 211, or the reflector 22 is substantially trapezoidal.

In some embodiments, the light-in surface 222 and the light-out surface 224 are perpendicular to the light-out surface 228.

Thus, a regular reflector 22 can be formed, so that the incident light path is straight, and the light conversion efficiency is improved.

In some embodiments, the distance between the light incident surface 222 and the light emergent surface 224 is in the range of 4.8 mm to 5.0 mm.

Specifically, the distance between the light incident surface 222 and the light backlight surface 224 may be 4.85mm, 4.9mm, 4.95mm, and the like. Alternatively, the distance between the light incident surface 222 and the light emergent surface 224 is understood to be 4.8-5.0mm in height of the reflector 22. The size of the reflector 22 formed by the light incident surface 222 and the light backlight surface 224 within the above distance range is moderate, and the reflector can be better fit into the first imaging module 20, so as to form a more compact and miniaturized first imaging module 20, camera assembly 100 and electronic device 1000, thereby satisfying more demands of consumers.

In some embodiments, the light incident surface 222, the light backlight surface 224, the light reflecting surface 226 and the light emitting surface 228 are hardened to form a hardened layer.

When reflector 22 is made of glass or the like, reflector 22 itself is brittle, and in order to increase the strength of reflector 22, the light-incident surface 222, the light-backlight surface 224, the light-reflecting surface 226, and the light-emitting surface 228 of reflector 22 may be hardened, or more, all the surfaces of the reflector may be hardened to further increase the strength of the reflector. Hardening processes such as infiltration of lithium ions, lamination of the various surfaces without affecting the light conversion of retroreflective element 22, and the like.

In one example, the retroreflective elements 22 redirect incident light from the light inlet 211 at an angle of 90 degrees. For example, the incident angle of incident light on the emitting surface of the light reflecting member 22 is 45 degrees, and the reflection angle is also 45 degrees. Of course, the angle at which the reflective element 22 deflects the incident light may be other angles, such as 80 degrees, 100 degrees, etc., as long as the incident light is deflected to reach the first image sensor 26.

In the present embodiment, the number of the reflective elements 22 is one, and the incident light is transmitted to the first image sensor 26 after being once deflected. In other embodiments, the reflective element 22 is provided in a plurality, and the incident light is deflected at least twice to the first image sensor 26.

The mounting 23 is used to mount the reflector 22, or the mounting 23 is a carrier for the reflector 22, and the reflector 22 is fixed on the mounting 23. This allows the position of the retroreflective elements 22 to be determined to facilitate the retroreflective elements 22 to reflect or refract incident light. Retroreflective element 22 may be adhesively secured to mount 23 to provide a secure attachment to mount 23.

Referring again to FIG. 6, in one example, the mounting base 23 is movably disposed within the housing 21, and the mounting base 23 can rotate relative to the housing 21 to adjust the direction in which the reflective element 22 redirects the incident light.

The mounting seat 23 can drive the reflective element 22 to rotate together in the direction opposite to the shaking direction of the first imaging module 20, so as to compensate the incident deviation of the incident light of the light inlet 211, thereby achieving the optical anti-shaking effect.

The first lens assembly 24 is received in the moving element 25, and further, the first lens assembly 24 is disposed between the reflective element 22 and the first image sensor 26. The first lens assembly 24 is used to image incident light onto a first image sensor 26. This allows the first image sensor 26 to obtain a better quality image.

The first lens assembly 24 can form an image on the first image sensor 26 when moving integrally along the optical axis thereof, thereby realizing the focusing of the first imaging module 20. The first lens assembly 24 includes a plurality of lenses 241, when at least one lens 241 moves, the overall focal length of the first lens assembly 24 changes, so as to implement the function of zooming the first imaging module 20, and further, the driving mechanism 27 drives the moving element 25 to move in the housing 21 for zooming.

In the example of FIG. 6, in some embodiments, the moving element 25 is cylindrical, and the plurality of lenses 241 of the first lens assembly 24 are fixed in the moving element 25 at intervals along the axial direction of the moving element 25; or as in fig. 7, the moving element 25 comprises two clips 252, the two clips 252 sandwiching the lens 241 between the two clips 252.

It can be understood that, because the moving element 25 is used for fixedly arranging the plurality of lenses 241, the length of the moving element 25 is large, and the moving element 25 can be cylindrical or square-cylindrical and has a certain cavity shape, so that the moving element 25 can be in a cylindrical shape to better arrange the plurality of lenses 241, and can better protect the lenses 241 in the cavity, so that the lenses 241 are not easy to shake.

In addition, in the example of fig. 7, the moving element 25 clamps the plurality of lenses 241 between the two clamping pieces 252, which not only has certain stability, but also reduces the weight of the moving element 25, which can reduce the power required by the driving mechanism 27 to drive the moving element 25, and the moving element 25 is also less difficult to design, and the lenses 241 are also easier to be disposed on the moving element 25.

Of course, the moving element 25 is not limited to the above-mentioned cylindrical shape and two clips 252, and in other embodiments, the moving element 25 may include three, four, etc. more clips 252 to form a more stable structure, or one clip 252 to form a simpler structure; or a rectangular body, a circular body, etc. having a cavity for accommodating various regular or irregular shapes of the lens 241. On the premise of ensuring normal imaging and operation of the imaging module 10, the specific selection is only needed.

The first image sensor 26 may employ a Complementary Metal Oxide Semiconductor (CMOS) photosensitive element or a Charge-coupled Device (CCD) photosensitive element.

In certain embodiments, the drive mechanism 27 is an electromagnetic drive mechanism, a piezoelectric drive mechanism, or a memory alloy drive mechanism.

Specifically, the electromagnetic driving mechanism includes a magnetic field and a conductor, if the magnetic field moves relative to the conductor, an induced current is generated in the conductor, the induced current makes the conductor subject to an ampere force, and the ampere force makes the conductor move, where the conductor is a part of the electromagnetic driving mechanism that drives the moving element 25 to move; the piezoelectric driving mechanism is based on the inverse piezoelectric effect of the piezoelectric ceramic material: if voltage is applied to the piezoelectric material, mechanical stress is generated, namely, the electric energy and the mechanical energy are converted, and the rotation or linear motion is generated by controlling the mechanical deformation of the piezoelectric material, so that the piezoelectric material has the advantages of simple structure and low speed.

The driving of the memory alloy driving mechanism is based on the characteristics of the shape memory alloy: the shape memory alloy is a special alloy which, once it has memorized any shape, even if deformed, can recover to the shape before deformation when heated to a certain proper temperature, thereby achieving the purpose of driving, and has the characteristics of rapid displacement and free direction.

Referring to fig. 6 again, further, the first imaging module 20 further includes a driving device 28, the driving device 28 is configured to apply a driving force to the mounting base 23, the driving force drives the mounting base 23 to rotate around the rotating shaft 29, so that the first imaging module 20 realizes optical anti-shake in the optical axis direction of the light inlet 211.

In this way, since the driving device 28 applies a driving force deviating from the rotating shaft 29 to the mounting base 23, the first imaging module 20 achieves optical anti-shake in the optical axis direction of the light inlet 211 and can improve anti-shake accuracy.

Referring to fig. 5 and 6, for convenience of description, the width direction, the height direction and the length direction of the first imaging module 20 are defined as X direction, Y direction and Z direction, respectively. Accordingly, the optical axis of the light inlet 211 is the Y direction, the light receiving direction of the first image sensor 26 is the Z direction, and the axial direction of the rotation shaft 29 is the X direction.

The driving device 28 drives the mounting base 23 to rotate, so that the reflecting element 22 rotates around the X direction, and the first imaging module 20 achieves the Y-direction optical anti-shake effect. In addition, the driving device 28 drives the mounting seat 23 to move along the axial direction of the rotating shaft 29, so that the first imaging module 20 achieves the effect of optical anti-shake in the X direction. Additionally, the first lens assembly 24 may be along the Z-direction to achieve focusing of the first lens assembly 24 on the first image sensor 26.

Specifically, when the reflective element 22 rotates in the X direction, the light reflected by the reflective element 22 moves in the Y direction, so that the first image sensor 26 forms different images in the Y direction to achieve the anti-shake effect in the Y direction. When the reflective element 22 moves along the X direction, the light reflected by the reflective element 22 moves in the X direction, so that the first image sensor 26 forms different images in the X direction to achieve the anti-shake effect in the X direction.

In some embodiments, the direction of the drive force is tangential to the axis of rotation 29. In this manner, the driving force may cause the mounting base 23 to move about the rotation axis 29, thereby rotating the reflective element 22 about the rotation axis 29.

Referring again to fig. 6, in some embodiments, the driving device 28 includes a magnetic element 282 and a coil 284. The magnetic element 282 is disposed on the mount 23, and the coil 284 is disposed on the housing 21 opposite the magnetic element 282. The coil 284 is used for generating a driving force by acting on the magnetic element 282 after applying a voltage. In this way, the driving device 28 drives the mounting seat 23 to rotate through an electromagnetic mode.

In the example of fig. 6, the coil 284 is provided on the bottom of the housing 21 of the drive device 28, and the electromagnetic piece 282 corresponding thereto is fixed to the mount 23. The side wall of the housing 21 is also provided with a coil 284, and an electromagnetic piece 282 corresponding thereto is fixed to the mount 23. Upon energization of coil 284, coil 284 generates a magnetic field to drive movement of electromagnet plate 282, thereby rotating mounting base 23 and reflector element 22 together.

Referring again to fig. 7, in some embodiments, the driving device 28 includes a piezoelectric element 286 coupled to the mounting base 23, the piezoelectric element 286 being configured to generate a driving force when a voltage is applied. In this way, the driving device 28 can drive the mounting seat 23 to move in a piezoelectric driving mode.

In addition, the driving device 28 can also drive the mounting seat 23 to move through a memory alloy driving mode. Please refer to the above description for the piezoelectric driving method and the memory alloy driving method, which are not described herein.

Referring to fig. 15, in some embodiments, the number of the driving forces is two, wherein one of the driving forces is in a direction of the optical axis of the light inlet 211, and the other driving force is in a direction perpendicular to the optical axis of the light inlet 211. As shown in fig. 6, one of the driving forces is directed in the Y direction, and the other driving force is directed in the Z direction.

Specifically, the two driving forces may be equal in magnitude or may not be equal in magnitude. The two driving forces may be generated by the electromagnetic driving method, the piezoelectric driving method, the memory alloy driving method, or other methods. It will be appreciated that the mounting 23 will rotate about the axis of rotation 29 as a result of the driving force, and after the mounting 23 is stabilized, the mounting 23 is balanced and the angle of deflection of the reflective element 22 is stabilized.

When there are two driving forces, one of the two driving forces may be used as a power to rotate the light reflecting member 22 to a predetermined position for anti-shake, and the other of the two driving forces may be used as a restoring force to rotate the deflected light reflecting member 22 back to the original position.

In one example, as shown in FIG. 15, two driving forces are applied to the reflective element 22, F1 and F2, and when the reflective element 22 needs to rotate counterclockwise, F1 may be used as the power and F2 as the restoring force; when clockwise rotation of retroreflective element 22 is desired, F2 may be used as the motive force and F1 may be used as the return force.

Referring to fig. 16, when the driving force is single, an elastic force generated by the deformation of the spring 287 may be used as the restoring force. In the example shown in FIG. 16, spring 287 is in its original state when reflective member 22 is in its original position, i.e., spring 287 is neither stretched nor compressed, nor deformed nor resilient when reflective member 22 is in its original position.

When it is desired to rotate reflector 22 counterclockwise, a force F3 is applied to reflector 22, and reflector 22 rotates counterclockwise about axis 29 and compresses spring 287, and when reflector 22 needs to return to the original position, F3 can be removed and compressed spring 287 exerts a spring force to urge reflector 22 to rotate clockwise about axis 29 to the original position. Of course, in other embodiments, spring 287 may be in either a compressed or an extended state when reflective element 22 is in the home position.

Referring to fig. 9, in the present embodiment, the second imaging module 30 is an upright lens module, but in other embodiments, the second imaging module 30 may also be a periscopic lens module. The second imaging module 30 includes a second lens assembly 31 and a second image sensor 32, the second lens assembly 31 is configured to image light onto the second image sensor 32, and an incident optical axis of the second imaging module 30 coincides with an optical axis of the second lens assembly 31.

In this embodiment, the second imaging module 30 is a fixed focus lens module, and therefore, the number of lenses 241 of the second lens assembly 31 is small, so that the height of the second imaging module 30 is low, which is beneficial to reducing the thickness of the electronic device 1000.

The type of the second image sensor 32 may be the same as the type of the first image sensor 26 and will not be described in detail herein.

In summary, the first imaging module 20 of the present embodiment includes a housing 21 with a light inlet 211, and a reflector 22, a mounting seat 23, and a first image sensor 26 all disposed in the housing 21. The light reflecting element 22 is fixed on the mounting seat 23, the light reflecting element 22 is used for deflecting incident light incident from the light inlet 211 and then transmitting the incident light to the first image sensor 26 so that the first image sensor 26 can sense the incident light outside the first imaging module 20, the mounting seat 23 can rotate around the rotating shaft 29 relative to the shell 21, and the axial direction of the rotating shaft 29 is perpendicular to the optical axis of the light inlet 211. The first imaging module 20 further comprises a driving device 28, wherein the driving device 28 is configured to apply a driving force to the mounting base 23, the driving force is offset from the rotating shaft 29, and the mounting base 23 is driven to rotate around the rotating shaft 29, so that the first imaging module 20 realizes optical anti-shake in the direction of the optical axis 29 of the light inlet 211.

In the description herein, references to the description of the terms "one embodiment," "certain embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: numerous changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. A camera head assembly, comprising:

the imaging module includes:

the shell is provided with a light inlet; and

the light reflecting element is fixed on the mounting seat, the light reflecting element is used for steering incident light incident from the light inlet and then transmitting the incident light to the image sensor so that the image sensor senses the incident light outside the imaging module, the mounting seat can rotate around a rotating shaft relative to the housing, and the axial direction of the rotating shaft is perpendicular to the optical axis of the light inlet;

the imaging module further comprises a driving device, the driving device is used for applying a driving force deviating from the rotating shaft to the mounting seat, the driving force drives the mounting seat to rotate around the rotating shaft, so that the imaging module realizes optical anti-shake in the optical axis direction of the light inlet, the driving device comprises a magnetic element and a coil, the magnetic element is arranged on the mounting seat, the coil is arranged at the bottom of the shell relative to the magnetic element, and the coil is used for acting with the magnetic element after voltage is applied to generate the driving force;

the direction of the driving force is tangential to the rotating shaft, and when the driving force is single, the elastic force generated by the deformation of the spring is used as restoring force;

the camera subassembly still includes the decoration, the decoration cover is established the light inlet top of formation of image module, the decoration adopts metal material to make on the width direction of formation of image module, the shell is in one side of light inlet is formed with the recess, the decoration is partly gone into to block in the recess, the decoration is formed with the through-hole, light inlet passes through the through-hole exposes, the formation of image module passes through external image is gathered to the through-hole, the shell includes the roof and certainly the lateral wall that the side extension of roof formed, light inlet is formed in the roof, the recess is formed the roof with the junction of lateral wall, the decoration supports and leans on the roof.

2. The camera head assembly according to claim 1, wherein when the number of the driving forces is two, a direction of one of the driving forces is an optical axis direction of the light inlet, and a direction of the other of the driving forces is perpendicular to the optical axis direction of the light inlet.

3. A camera assembly according to claim 1, wherein said reflective element has:

the light incident surface is close to and faces the light inlet;

a backlight surface which is far away from the light inlet and is opposite to the light incident surface;

the light reflecting surface is connected with the light incident surface and the light backlight surface and is obliquely arranged relative to the light incident surface; and

and the light emitting surface is connected with the light incident surface and the light emergent surface of the backlight surface, and the light emergent surface and the light reflecting surface are arranged in a back-to-back manner.

4. A camera assembly according to claim 3, wherein said light-incident surface is disposed parallel to said light-backlight surface.

5. The camera assembly of claim 1, wherein the imaging module further comprises:

the moving element is arranged on one side of the image sensor and is accommodated in the shell;

a lens assembly secured to the moving element; and

and the driving mechanism is used for driving the moving element to move along the optical axis of the lens assembly so as to enable the lens assembly to focus and image on the image sensor.

6. The camera assembly of claim 5, wherein said moving element is cylindrical and a plurality of lenses of said lens assembly are fixed in said moving element at spaced intervals along an axial direction of said moving element; or

The moving element comprises two clamping pieces, and the lens assembly is clamped between the two clamping pieces.

7. The camera assembly of claim 1, wherein the number of side walls is two, the top wall includes two opposing side edges, each side wall extends from a corresponding one of the side edges, and the recess is formed at a junction of each side wall and the top wall.

8. An electronic device, comprising:

a housing; and

the camera assembly of any of claims 1-7, disposed on the chassis.