CN108530987A - White photosensitive solder resist ink of a kind of liquid development and preparation method thereof - Google Patents
White photosensitive solder resist ink of a kind of liquid development and preparation method thereof Download PDFInfo
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- CN108530987A CN108530987A CN201810468597.0A CN201810468597A CN108530987A CN 108530987 A CN108530987 A CN 108530987A CN 201810468597 A CN201810468597 A CN 201810468597A CN 108530987 A CN108530987 A CN 108530987A
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/10—Printing inks based on artificial resins
- C09D11/106—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds
- C09D11/107—Printing inks based on artificial resins containing macromolecular compounds obtained by reactions only involving carbon-to-carbon unsaturated bonds from unsaturated acids or derivatives thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/14—Polycondensates modified by chemical after-treatment
- C08G59/1433—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds
- C08G59/1438—Polycondensates modified by chemical after-treatment with organic low-molecular-weight compounds containing oxygen
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D11/00—Inks
- C09D11/02—Printing inks
- C09D11/03—Printing inks characterised by features other than the chemical nature of the binder
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Emergency Medicine (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Materials For Photolithography (AREA)
- Inks, Pencil-Leads, Or Crayons (AREA)
Abstract
The present invention discloses white photosensitive solder resist ink of a kind of liquid development and preparation method thereof, including 30~45 parts of multi-anhydride modified phenolic novolak epoxy acrylate by weight, 10~20 parts of acrylic acid activated monomer, 5~10 parts of photoinitiator, 3~8 parts of titanium dioxide, 2~5 parts of barium sulfate, 2~6 parts of fluorine-containing surfactant, 1~3 part of 1~3 part of antifoaming agent, 1~3 part of water-reducing agent and levelling agent.The present invention is using multi-anhydride phthalic anhydride to o-cresol formaldehyde epoxy acrylate, multi-anhydride modified phenolic novolak epoxy acrylate is obtained to be modified, its coefficient of thermal expansion is small, dimensionally stable, with higher softening temperature, the cold dryness that can ensure glue-line before exposing, to improve the precision of circuit board printing.
Description
Technical field
The present invention relates to white photosensitive solder resist ink of a kind of liquid development and preparation method thereof, belong to solder mask field.
Background technology
Liquid photosensitive ink is a kind of special UV ink, and full version printing can be carried out without printing plate.Ink coating is photosensitive solid
Change, after development, can be etched, be electroplated, the processing such as electrophoresis colors in, being suitable for small mount, multi items, personalization and high-precision and scheme
The making of shape product.Solder mask is the permanent resist coated in printing board surface, it selectively protects printing board surface,
It prevents that short circuit, bridge joint occurs when welding component between conducting wire and pad.In addition, it also has moisture-proof, mould proof, salt spray proof work
With.Therefore, the quality of welding resistance film quality not only influences the appearance of printed board, but also can influence the service life of printed board.
With the development of printed circuit board, curtain coating (or silk screen printing) liquid photosensitive solder mask (LiquidPhoto
ImageableInk is abbreviated as LPI) have become the predominant methods that printed board solder mask is processed.Liquid photosensitive solder mask, mainly
Based on photocuring and the resin of heat cure, cooperation emulsion, thermal curing agents, filler, colorant and various auxiliary agents composition.It is logical
Cross curtain apply or silk-screen method be coated to etching after substrate on, by preliminary drying, exposure, development, after cure etc. series of process
Process finally forms a kind of polymer coating of crosslinking curing in printing board surface.
Solder mask is after processing is completed, it is necessary to reach the requirements such as strong adhesive force, hardness height, solvent resistant, acid and alkali-resistance, heat resistant oils.
But existing epoxy type solder mask haves the shortcomings that hardening time is long, cured film brittleness is higher, printing precision is low, is not suitable for soft
The printing of property battery plate.
Invention content
It is a kind of suitable for flexible battery plate print the technical problem to be solved by the present invention is in view of the deficiencies of the prior art, provide
White photosensitive solder resist ink of liquid development of brush and preparation method thereof, to overcome, hardening time is long, cured film brittleness is higher, printing
The low disadvantage of precision.
In order to solve the above-mentioned technical problem, the invention discloses a kind of white photosensitive solder resist ink of liquid development, including such as
The component of lower parts by weight：
30~45 parts of multi-anhydride modified phenolic novolak epoxy acrylate,
10~20 parts of acrylic acid activated monomer,
5~10 parts of photoinitiator,
3~8 parts of titanium dioxide,
2~5 parts of barium sulfate,
2~6 parts of fluorine-containing surfactant,
1~3 part of antifoaming agent,
1~3 part of water-reducing agent,
1~3 part of levelling agent；
The multi-anhydride modified phenolic novolak epoxy acrylate is by o-cresol formaldehyde epoxy acrylate, the molten fibre of butyl
Agent, polymerization inhibitor and catalyst mixing are warming up to 70~80 DEG C and are stirred to react 30~45min, and the first of phthalic anhydride is then added
Benzole soln, after reacting to the half that acid value is initial acid value after vacuum distillation removal solvent to obtain the final product.
Preferably, the acrylic acid activated monomer is by difunctional acrylic monomers and monofunctional acrylates' monomer
The weight ratio of composition, the difunctional acrylic monomers and monofunctional acrylates' monomer is 0.8~1:1.
The photoinitiator is 2- hydroxy-2-methyl -1- phenyl -1- acetone.
The fluorine-containing surfactant is perfluor alkyl ethyl acrylate.
The antifoaming agent is Germany's 057 antifoaming agent of BYK.
The water-reducing agent is polycarboxylate water-reducer.
The levelling agent is Germany's 307 levelling agents of BYK.
The preparation method of the above-mentioned white photosensitive solder resist ink of liquid development, includes the following steps：
Step 1：Multi-anhydride modified phenolic novolak epoxy acrylate, acrylic acid activated monomer and photoinitiator are thrown
Enter in the channel that feeds intake；
Step 2：With high speed dispersor under the rotating speed of 800~1200r/min, disperse 0.5~0.8h in 50~80 DEG C,
Stop stirring and keeping the temperature；
Step 3：Titanium dioxide is added in the feed liquid that step 2 obtains, barium sulfate, fluorine-containing surfactant, antifoaming agent, subtracts
Aqua and levelling agent continue to stir 0.3~0.5h with 500~800r/min；
Step 4：After stirring and evenly mixing, it is 300 nanometers or less to be ground to grain size with hydraulic three-roller machine；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
The present invention is first modified o-cresol formaldehyde epoxy acrylate using multi-anhydride phthalic anhydride, obtains
Multi-anhydride modified phenolic novolak epoxy acrylate, coefficient of thermal expansion is small, dimensionally stable, has higher softening temperature,
The cold dryness that can ensure glue-line before exposing, to improve the precision of circuit board printing.
Acrylic acid activated monomer can be interspersed in by difunctional acrylic monomers and monofunctional acrylates' monomer composition
Between multi-anhydride modified phenolic novolak epoxy acrylic ester molecule so that system combines more secured, and improves system
Compatibility improves solidification rate.
Fluorine-containing surfactant is conducive to the dispersion of titanium dioxide and barium sulfate particle, and improves film formation surface performance.
Advantageous effect：
The present invention is combined using multi-anhydride modified phenolic novolak epoxy acrylate with acrylic acid activated monomer, it is utilized
It cooperates between molecular structure, synergistic effect is prepared for that a kind of hardening time is short, printing precision is high, is suitable for flexibility
The white photosensitive solder resist ink of liquid development of battery plate printing, and significantly improve the higher problem of cured film brittleness.
Specific implementation mode
According to following embodiments, the present invention may be better understood.
Embodiment 1
By o-cresol formaldehyde epoxy acrylate, butyl cellosolve, di-tert-butyl p-cresol polymerization inhibitor and Triethylamine catalyst
Mixing is warming up to 75 DEG C and is stirred to react 45min, and the toluene solution of phthalic anhydride, (o-cresol formaldehyde propylene oxide is then added
Acid esters, butyl cellosolve, di-tert-butyl p-cresol, the reaction molar ratio of triethylamine and phthalic anhydride are 3:1:0.2:0.3:
2) it is evaporated under reduced pressure after removal solvent up to multi-anhydride modified phenolic novolak epoxy after reaction to the half that acid value is initial acid value
Acrylate.
Embodiment 2
By o-cresol formaldehyde epoxy acrylate, butyl cellosolve, di-tert-butyl p-cresol polymerization inhibitor and Triethylamine catalyst
Mixing is warming up to 80 DEG C and is stirred to react 30min, and the toluene solution of phthalic anhydride, (o-cresol formaldehyde propylene oxide is then added
Acid esters, butyl cellosolve, di-tert-butyl p-cresol, the reaction molar ratio of triethylamine and phthalic anhydride are 3:1:0.2:0.3:
5) it is evaporated under reduced pressure after removal solvent up to multi-anhydride modified phenolic novolak epoxy after reaction to the half that acid value is initial acid value
Acrylate.
Embodiment 3
Step 1：42 parts of multi-anhydride modified phenolic novolak epoxy acrylate, the propylene acid activity of the preparation of Example 1
16 parts of monomer (dipropylene glycol diacrylate and tetrahydrofuran acrylate monomer, weight ratio 1:And photoinitiator 2- hydroxyls 1)
Base -2- methyl-1s -8 parts of phenyl -1- acetone feeds intake in channel；
Step 2：With high speed dispersor under the rotating speed of 900r/min, disperse 0.6h in 75 DEG C, stops stirring and keeping the temperature；
Step 3：In the feed liquid that step 2 obtains be added 6 parts of titanium dioxide, 3 parts of barium sulfate, 4 parts of fluorine-containing surfactant,
2 parts of 2 parts of antifoaming agent, 2 parts of water-reducing agent and levelling agent continue to stir 0.4h with 600r/min；
Step 4：After stirring and evenly mixing, it is 300 nanometers or less to be ground to grain size with hydraulic three-roller machine；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Embodiment 4
Step 1：30 parts of multi-anhydride modified phenolic novolak epoxy acrylate, the propylene acid activity of the preparation of Example 1
(dipropylene glycol diacrylate and lauric acid acrylate weight ratio are 0.8 to 20 parts of monomer:And photoinitiator 2- hydroxyls -2- 1)
Methyl-1-5 parts of phenyl-1- acetone feeds intake in channel；
Step 2：With high speed dispersor under the rotating speed of 800r/min, disperse 0.8h in 50 DEG C, stops stirring and keeping the temperature；
Step 3：In the feed liquid that step 2 obtains be added 3 parts of titanium dioxide, 2 parts of barium sulfate, 2 parts of fluorine-containing surfactant,
1 part of 1 part of antifoaming agent, 1 part of water-reducing agent and levelling agent continue to stir 0.5h with 500r/min；
Step 4：After stirring and evenly mixing, it is 300 nanometers or less to be ground to grain size with hydraulic three-roller machine；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Embodiment 5
Step 1：45 parts of multi-anhydride modified phenolic novolak epoxy acrylate, the propylene acid activity of the preparation of Example 1
10 parts of monomer (hexanediyl ester and tetrahydrofuran acrylate monomer, weight ratio 1:And photoinitiator 2- hydroxyls -1)
2- methyl-1s -10 parts of phenyl -1- acetone feeds intake in channel；
Step 2：With high speed dispersor under the rotating speed of 1200r/min, disperse 0.5h in 80 DEG C, stops stirring and keeping the temperature；
Step 3：In the feed liquid that step 2 obtains be added 8 parts of titanium dioxide, 5 parts of barium sulfate, 6 parts of fluorine-containing surfactant,
3 parts of 3 parts of antifoaming agent, 3 parts of water-reducing agent and levelling agent continue to stir 0.3h with 800r/min；
Step 4：After stirring and evenly mixing, it is 300 nanometers or less to be ground to grain size with hydraulic three-roller machine；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Comparative example 1
Step 1：42 parts of multi-anhydride modified phenolic novolak epoxy acrylate and photoinitiator prepared by Example 1
In 8 parts of channels that feed intake of 2- hydroxy-2-methyl -1- phenyl -1- acetone；
Step 2：With high speed dispersor under the rotating speed of 900r/min, disperse 0.6h in 75 DEG C, stops stirring and keeping the temperature；
Step 3：In the feed liquid that step 2 obtains be added 6 parts of titanium dioxide, 3 parts of barium sulfate, 4 parts of fluorine-containing surfactant,
2 parts of 2 parts of antifoaming agent, 2 parts of water-reducing agent and levelling agent continue to stir 0.4h with 600r/min；
Step 4：After stirring and evenly mixing, it is 300 nanometers or less to be ground to grain size with hydraulic three-roller machine；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
Comparative example 2
Step 1：By 42 parts of Epoxy Phenolic Acrylates, 16 parts of acrylic acid activated monomer (dipropylene glycol diacrylate and
Tetrahydrofuran acrylate monomer, weight ratio 1:1) it is put into 8 parts of photoinitiator 2- hydroxy-2-methyl -1- phenyl -1- acetone
It feeds intake in channel；
Step 2：With high speed dispersor under the rotating speed of 900r/min, disperse 0.6h in 75 DEG C, stops stirring and keeping the temperature；
Step 3：In the feed liquid that step 2 obtains be added 6 parts of titanium dioxide, 3 parts of barium sulfate, 4 parts of fluorine-containing surfactant,
2 parts of 2 parts of antifoaming agent, 2 parts of water-reducing agent and levelling agent continue to stir 0.4h with 600r/min；
Step 4：After stirring and evenly mixing, it is 300 nanometers or less to be ground to grain size with hydraulic three-roller machine；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
The solder mask that above-described embodiment 3~5 and comparative example 1~3 are prepared carries out conventional performance test, as a result
It is shown in Table 1：Pcb board spray printing is carried out using UV ink-jet screen printers, solidification ultraviolet source power is 250W/cm, under 25 DEG C of environment
The viscosity of test ink, adhesive force are measured according to GB/T 9286-1998 test methods, hardness according to GB/T6739-2006, resistance
It is 288 DEG C of dippings 10 seconds of solder furnace four times to weld performance condition, and see whether to fall off enters phenomenon with scolding tin, and no discoloration, is floated at stripping
It rises and scolding tin infiltration is excellent.
Table 1
As can be seen from Table 1, it is obtained through the modified o-cresol formaldehyde epoxy acrylate light-cured performance of multi-anhydride
To significantly improving, better light-cured performance can be reached with the use of acrylic monomers, strong adhesive force, printing precision are high, Gu
Change film size more to stablize.
The present invention provides the thinkings and method of white photosensitive solder resist ink of a kind of liquid development and preparation method thereof, specifically
Realize that there are many method and the approach of the technical solution, the above is only a preferred embodiment of the present invention, it is noted that for
For those skilled in the art, without departing from the principle of the present invention, can also make it is several improvement and
Retouching, these improvements and modifications also should be regarded as protection scope of the present invention.Each component part being not known in the present embodiment
It is realized with the prior art.
Claims (8)
1. a kind of white photosensitive solder resist ink of liquid development, which is characterized in that include the component of following parts by weight：
30~45 parts of multi-anhydride modified phenolic novolak epoxy acrylate,
10~20 parts of acrylic acid activated monomer,
5~10 parts of photoinitiator,
3~8 parts of titanium dioxide,
2~5 parts of barium sulfate,
2~6 parts of fluorine-containing surfactant,
1~3 part of antifoaming agent,
1~3 part of water-reducing agent,
1~3 part of levelling agent；
The multi-anhydride modified phenolic novolak epoxy acrylate be by o-cresol formaldehyde epoxy acrylate, butyl cellosolve,
Polymerization inhibitor and catalyst mixing are warming up to 70~80 DEG C and are stirred to react 30~45min, and the toluene of phthalic anhydride is then added
Solution, after reacting to the half that acid value is initial acid value after vacuum distillation removal solvent to obtain the final product.
2. a kind of white photosensitive solder resist ink of liquid development according to claim 1, which is characterized in that the propylene
Acid activity monomer is by difunctional acrylic monomers and monofunctional acrylates' monomer composition, the difunctional acrylic monomers
Weight ratio with monofunctional acrylates' monomer is 0.8~1:1.
3. a kind of white photosensitive solder resist ink of liquid development according to claim 1, which is characterized in that the photoinitiator
For 2- hydroxy-2-methyl -1- phenyl -1- acetone.
4. a kind of white photosensitive solder resist ink of liquid development according to claim 1, which is characterized in that the fluorochemical surface
Activating agent is perfluor alkyl ethyl acrylate.
5. a kind of white photosensitive solder resist ink of liquid development according to claim 1, which is characterized in that the defoaming
Agent is Germany's 057 antifoaming agent of BYK.
6. the white photosensitive solder resist ink of a kind of liquid development according to claim 1, which is characterized in that the water-reducing agent is
Polycarboxylate water-reducer.
7. the white photosensitive solder resist ink of a kind of liquid development according to claim 1, which is characterized in that the levelling agent is
307 levelling agents of German BYK.
8. the preparation method of the white photosensitive solder resist ink of liquid development described in claim 1~7 any one, feature exist
In including the following steps：
Step 1：Multi-anhydride modified phenolic novolak epoxy acrylate, acrylic acid activated monomer and photoinitiator are put into and thrown
Expect in channel；
Step 2：With high speed dispersor under the rotating speed of 800~1200r/min, disperses 0.5~0.8h in 50~80 DEG C, stop
It stirs and keeps the temperature；
Step 3：Titanium dioxide, barium sulfate, fluorine-containing surfactant, antifoaming agent, water-reducing agent are added in the feed liquid that step 2 obtains
And levelling agent, continue to stir 0.3~0.5h with 500~800r/min；
Step 4：After stirring and evenly mixing, it is 300 nanometers or less to be ground to grain size with hydraulic three-roller machine；
Step 5：After being filtered using 1 μm of filter element filtering machine to obtain the final product.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111100499A (en) * | 2019-12-23 | 2020-05-05 | 无锡德贝尔光电材料有限公司 | High-resolution solder resist ink |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101395535A (en) * | 2006-05-31 | 2009-03-25 | 三菱化学株式会社 | Heat curable composition for protective film, cured product and liquid crystal display device |
| CN101717599A (en) * | 2009-12-27 | 2010-06-02 | 浙江桐乡新东方油墨有限公司 | Liquid photosensitive solder resist ink and preparation method thereof |
| CN101928378A (en) * | 2010-05-12 | 2010-12-29 | 台州新韩电子油墨有限公司 | Photosensitive resin and use thereof for preparing liquid photoimageable solder resist ink |
| CN103045015A (en) * | 2013-01-25 | 2013-04-17 | 深圳市万佳原丝印器材有限公司 | Liquid photo-imageable alkali developable and anodizing resistant ink and preparation method thereof |
| CN104479507A (en) * | 2014-12-18 | 2015-04-01 | 江苏广信感光新材料股份有限公司 | Ultraviolet-cured resin composition and application thereof as solder resist |
| CN104710871A (en) * | 2014-05-28 | 2015-06-17 | 广东丹邦科技有限公司 | Alkaline-developable photosensitive solder resist ink for FPC, preparation method, application and product |
-
2018
- 2018-05-16 CN CN201810468597.0A patent/CN108530987A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101395535A (en) * | 2006-05-31 | 2009-03-25 | 三菱化学株式会社 | Heat curable composition for protective film, cured product and liquid crystal display device |
| CN101717599A (en) * | 2009-12-27 | 2010-06-02 | 浙江桐乡新东方油墨有限公司 | Liquid photosensitive solder resist ink and preparation method thereof |
| CN101928378A (en) * | 2010-05-12 | 2010-12-29 | 台州新韩电子油墨有限公司 | Photosensitive resin and use thereof for preparing liquid photoimageable solder resist ink |
| CN103045015A (en) * | 2013-01-25 | 2013-04-17 | 深圳市万佳原丝印器材有限公司 | Liquid photo-imageable alkali developable and anodizing resistant ink and preparation method thereof |
| CN104710871A (en) * | 2014-05-28 | 2015-06-17 | 广东丹邦科技有限公司 | Alkaline-developable photosensitive solder resist ink for FPC, preparation method, application and product |
| CN104479507A (en) * | 2014-12-18 | 2015-04-01 | 江苏广信感光新材料股份有限公司 | Ultraviolet-cured resin composition and application thereof as solder resist |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111100499A (en) * | 2019-12-23 | 2020-05-05 | 无锡德贝尔光电材料有限公司 | High-resolution solder resist ink |
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Application publication date: 20180914 |