CN108493124B - Automatic wafer test machine - Google Patents
Automatic wafer test machine Download PDFInfo
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- CN108493124B CN108493124B CN201810467796.XA CN201810467796A CN108493124B CN 108493124 B CN108493124 B CN 108493124B CN 201810467796 A CN201810467796 A CN 201810467796A CN 108493124 B CN108493124 B CN 108493124B
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- 238000012360 testing method Methods 0.000 title claims abstract description 226
- 230000007246 mechanism Effects 0.000 claims abstract description 36
- 238000013519 translation Methods 0.000 claims abstract description 19
- 238000004891 communication Methods 0.000 claims abstract description 6
- 238000001179 sorption measurement Methods 0.000 claims description 53
- 230000003287 optical effect Effects 0.000 claims description 26
- 239000013307 optical fiber Substances 0.000 claims description 23
- 239000000523 sample Substances 0.000 claims description 16
- 230000003068 static effect Effects 0.000 claims description 15
- 239000000758 substrate Substances 0.000 claims description 14
- 230000005540 biological transmission Effects 0.000 claims description 3
- 230000008030 elimination Effects 0.000 claims 2
- 238000003379 elimination reaction Methods 0.000 claims 2
- 235000012431 wafers Nutrition 0.000 description 98
- 238000010438 heat treatment Methods 0.000 description 11
- 230000000694 effects Effects 0.000 description 10
- 238000011056 performance test Methods 0.000 description 8
- 238000000034 method Methods 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000033001 locomotion Effects 0.000 description 3
- 230000013011 mating Effects 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 230000003028 elevating effect Effects 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 238000012512 characterization method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67796—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations with angular orientation of workpieces
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- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to an automatic wafer testing machine for fixing and testing chips on a wafer. The automatic wafer testing machine comprises a machine table, an angle adjusting mechanism, a wafer testing and positioning device, a testing component and a controller. The machine is provided with a test station. The angle adjusting mechanism comprises a rotating component and a translation component. The wafer test positioning device is arranged on the surface of the angle adjusting mechanism, which is back to the mounting surface, and the angle adjusting mechanism can drive the wafer test positioning device to rotate or translate so as to drive the chip to move to the test station. The test assembly is used for detecting performance of the chip located at the test station. The controller is in communication connection with the angle adjusting mechanism and the testing component, and is used for respectively sending trigger signals to the angle adjusting mechanism and the testing component so as to trigger the angle adjusting mechanism and the testing component. The automatic wafer test machine provided by the invention has the characteristics of high test speed and high test efficiency.
Description
Technical Field
The invention relates to the technical field of wafer testing, in particular to an automatic wafer testing machine.
Background
The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit. Various chips can be manufactured on the wafer, so that the wafer becomes a product with specific functions. In the process of wafer processing, the wafer is usually fixed on a wafer test machine, and optical and electrical performance tests are performed on chips disposed on the wafer one by one. The existing wafer test machine has low test speed and low test efficiency.
Disclosure of Invention
Based on this, it is necessary to provide an automated wafer test machine with high test efficiency, aiming at the problem of low test efficiency in the prior art.
An automated wafer test station for securing and testing chips located on a wafer, comprising:
The machine table with the supporting function is provided with a mounting surface, and a test station is arranged on the mounting surface;
The angle adjusting mechanism is arranged on the mounting surface and comprises a rotating assembly and a translation assembly;
The wafer test positioning device is used for adsorbing and fixing the chip, the wafer test positioning device is arranged on the surface of the angle adjusting mechanism, which is opposite to the mounting surface, and the angle adjusting mechanism can drive the wafer test positioning device to rotate or translate so as to drive the chip to move to the test station;
the testing component is arranged on the machine table and is used for detecting the performance of the chip positioned at the testing station; and
And the controller is in communication connection with the angle adjusting mechanism and the testing component and is used for respectively sending trigger signals to the angle adjusting mechanism and the testing component so as to trigger the angle adjusting mechanism and the testing component.
In one embodiment, the translation assembly comprises:
The first translation piece comprises a first sliding rail, a first motor and a first sliding block, wherein the first sliding rail extends along a first direction, the first sliding rail is fixed on the mounting surface, the first sliding block is slidably arranged on the first sliding rail, and the first motor is used for driving the first sliding block to slide along the first sliding rail; and
The second translation piece comprises a second sliding rail, a second motor and a second sliding block, wherein the second sliding rail extends along a second direction, the second sliding rail is fixed on the surface of the first sliding block, which is opposite to the first sliding rail, the second sliding block is slidably arranged on the second sliding rail, the rotating assembly and the wafer testing and positioning device are fixed on the surface of the second sliding block, which is opposite to the second sliding rail, and the second motor is used for driving the second sliding block to slide along the second sliding rail.
In one embodiment, the rotating assembly includes a turntable and a driving member, the turntable is rotatably disposed on a surface of the second slider, the driving member is in transmission connection with the turntable, and the wafer test positioning device is fixed on a surface of the turntable opposite to the second slider.
In one embodiment, the test assembly comprises:
The optical assembly comprises an emitting optical fiber, a receiving light ray, an optical driving piece and an optical guide rail extending along a third direction perpendicular to the first direction and the second direction, wherein the optical driving piece is used for driving the emitting optical fiber and the receiving optical fiber to move along the optical guide rail;
the electrical assembly comprises a probe, an electrical driving piece and an electrical guide rail extending along a third direction perpendicular to the first direction and the second direction, wherein the electrical driving piece is used for driving the probe to move along the electrical guide rail.
In one embodiment, the device further comprises a laser distance meter, the laser distance meter is movably arranged on the machine table and is in communication connection with the controller, and the laser distance meter is used for acquiring thickness parameters of the chip in the third direction and feeding back to the controller so as to calibrate the distance between the test component and the surface of the chip in the third direction.
In one embodiment, the camera positioning assembly is arranged on the machine table and corresponds to the test station, the camera positioning assembly is in communication connection with the controller, and the camera positioning assembly is used for photographing towards the test station, comparing with a preset photo and feeding back to the controller.
In one embodiment, the wafer testing device further comprises two static eliminators, wherein the two static eliminators are respectively arranged at two ends of the machine table to form a static eliminating area, and the angle adjusting mechanism, the wafer testing positioning device and the testing component are all located in the static eliminating area.
In one embodiment, the wafer test positioning apparatus includes:
a substrate for supporting and having a bearing surface;
a plurality of lifting pieces which are arranged on the bearing surface;
The vacuum adsorption platform is arranged at one end, far away from the bearing surface, of the lifting pieces, and the lifting pieces can drive the vacuum adsorption platform to lift along the first direction; the vacuum adsorption platform is provided with a vacuum cavity, and a plurality of vacuum adsorption holes communicated with the vacuum cavity are formed in the surface of the vacuum adsorption platform.
In one embodiment, the plurality of lifting members are provided with mounting portions, one side of the vacuum adsorption platform facing the bearing surface is provided with a plurality of matching portions, the mounting portions are of internal thread structures, the matching portions are of external thread structures, and the plurality of matching portions are respectively matched with the plurality of mounting portions, so that screw thread rotation connection is formed between the lifting members and the vacuum adsorption platform.
In one embodiment, the device further comprises a lock nut, wherein the lock nut is sleeved on the external thread structure and is screwed with the external thread structure.
The automatic wafer testing machine is characterized in that the wafer is fixed on the surface of the wafer testing and positioning device. When the wafer testing and positioning device works, the controller controls the rotating assembly to rotate or the translating assembly to translate, and drives the wafer testing and positioning device and the wafer to move so that the chip moves to the testing station. And the controller controls the test assembly to move to the test station and tests the performance of the chip. Compared with the existing semi-automatic test machine, the automatic wafer test machine can completely realize the automation of the test process, so that the test speed is high and the test efficiency is high.
Drawings
FIG. 1 is a schematic diagram of an automated wafer test equipment in accordance with a preferred embodiment of the present invention;
FIG. 2 is a schematic view of an angle adjustment mechanism in the automated wafer test equipment of FIG. 1;
FIG. 3 is a schematic view of a wafer test positioning apparatus in the automated wafer test machine shown in FIG. 1;
fig. 4 is an exploded view of a wafer test positioning apparatus in the automated wafer test machine of fig. 1.
Detailed Description
In order that the invention may be readily understood, a more complete description of the invention will be rendered by reference to the appended drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1 and 2, an automated wafer test apparatus 10 according to a preferred embodiment of the present invention includes a machine 200, an angle adjustment mechanism 300, a wafer test positioning apparatus 100, a test assembly 400, and a controller (not shown). The automated wafer test station 10 is used to secure and perform performance tests on chips located on a wafer.
The machine 200 is supported and has a mounting surface 210. Specifically, the machine 200 may be made of an alloy, plastic steel or other polymer material with strong mechanical strength, so as to prevent deformation and fracture of the machine during operation. The mounting surface 210 is provided with a test station 220, and the chip is located at the test station 220 for performance testing.
The angle adjustment mechanism 300 is provided on the mounting surface 210. The angular adjustment mechanism 300 includes a translation assembly 320 and a rotation assembly 310. The angular adjustment mechanism 300 may be rotated or translated to move the chip to the test station 220.
The wafer test positioning apparatus 100 is used for adsorbing and fixing chips. The wafer test positioning apparatus 100 is mounted on a surface of the angle adjustment mechanism 300 facing away from the mounting surface 210. The angle adjustment mechanism 300 can drive the wafer test positioning apparatus 100 to rotate or translate, so as to drive the chip to move to the test station 220.
In the present embodiment, the translation assembly 320 includes a first translation member 322 and a second translation member 324.
The first translation member 322 includes a first slide rail 3223 extending in a first direction, a first motor (not shown), and a first slider 3224. The first slide rail 3223 is fixed to the mounting surface 210, and the first slider 3224 is slidably disposed on the first slide rail 3223. The first motor is used to drive the first slider 3224 to slide along the first sliding rail 3223.
The second translation member 324 includes a second sliding rail 3243 extending along a second direction, a second motor (not shown), and a second slider 3244. The second sliding rail 3243 is fixed on a surface of the first sliding block 3244 facing away from the first sliding rail 3223. The second slider 3244 is slidably disposed on the second sliding rail 3243, and the rotating assembly 310 and the wafer testing and positioning device 100 are fixed on a surface of the second slider 3244 facing away from the second sliding rail 3243. The second motor is used for driving the second slider 3244 to slide along the second sliding rail 3243.
When the first motor drives the first slider 3224 to slide along the first sliding rail 3223, the first slider 3224 can drive the second translation member 324 and the wafer test positioning apparatus 100 to move along the first direction. When the second motor drives the second slider 3244 to slide along the second sliding rail 3243, the second slider 3244 can drive the wafer testing and positioning device 100 to move along the second direction. Therefore, when the position of the chip fixed on the wafer test positioning apparatus 100 deviates from the test station 220, the wafer test positioning apparatus 100 is driven to move by the first translation member 322 and the second translation member 324, so as to perform coarse adjustment on the position of the chip.
In the present embodiment, the rotating assembly 310 includes a turntable 312 and a driving member (not shown). The turntable 312 is rotatably disposed on the surface of the second slider 3244, and the driving member is in driving connection with the turntable 312. The wafer test positioning apparatus 100 is fixed on a surface of the turntable 312 facing away from the second slider 3244.
When the turntable 312 works, the driving member drives the turntable 312 to rotate the wafer test positioning apparatus 100. Because a plurality of wafers are fixed on the wafer test positioning apparatus 100, during testing, the chips can be aligned with the test station 220 by rotating, so that the chips can be accurately tested for performance. After the test is completed, the turntable 312 is rotated, the chip with the performance test is separated from the test station 220, and the next chip to be tested is moved to the test station 220 for the cycle test.
The test assembly 400 is disposed on the machine 200. Test assembly 400 is used to perform performance testing on chips located at test station 220. In particular, the test assembly 400 may test optical, electrical, thermodynamic, characterization, and other properties of a chip. The test performance items of the test assembly 400 may be set as desired.
In particular, in the present embodiment, the test assembly 400 includes an optical assembly 410 and an electrical assembly 420.
The optical assembly 410 includes a transmitting optical fiber 414, a receiving optical fiber 416, an optical drive 418, and an optical rail 412 extending in a third direction perpendicular to the first and second directions. The optical drive 418 is used to drive the transmitting optical fiber 414 and the receiving optical fiber 416 along the optical rail 412. The optical assembly 410 is used to test the optical performance of the chip.
The transmitting fiber 414 is used to transmit light to the surface of the chip, and the receiving fiber 416 is used to receive light reflected from the surface of the chip. The optical performance parameters of the chip surface are obtained by comparing the energy difference between the emitted light and the reflected light. In operation, the optical driving element 418 drives the transmitting optical fiber 414 and the receiving optical fiber 416 to move along the optical guide 412, so that the transmitting optical fiber 414 moves to a position capable of transmitting light to the chip surface, and the receiving optical fiber 416 moves to a position capable of receiving light reflected from the chip surface.
The electrical assembly 420 includes probes 422, electrical drivers 426, and electrical rails 424 extending in a third direction perpendicular to the first and second directions. An electrical drive 426 is used to drive the movement of the probe 422 along the electrical rail 424. The electrical component 420 may be used to test the electrical performance of the chip.
Probes 422 are used to contact the chip and send electrical signals to the chip to detect the electrical properties of the chip. Specifically, in operation of the electrical assembly, the electrical drive 426 drives the probes 422 in a third direction to bring the probes 422 into contact with the surface of the chip. In turn, probes 422 send electrical signals to detect the electrical properties of the chip.
A controller (not shown) is communicatively coupled to the angle adjustment mechanism 300 and the test assembly 400. The controller is used for respectively sending trigger signals to the angle adjusting mechanism 300 and the testing component 400 so as to trigger the angle adjusting mechanism 300 and the testing component 400.
The controller controls the angle adjusting mechanism 300 to drive the wafer testing and positioning device 100 to move according to the actual position of the chip, so that the chip is located at the testing station 220. Furthermore, the controller can adjust the movement of the testing component 400 according to the height of the chip, so that the testing component 400 is positioned at a proper position for testing the chip, and control the testing component 400 to work so as to measure the optical performance and the electrical performance parameters of the chip. By arranging the controller, the problem of traditional manual operation is solved, so that the automatic wafer test machine 10 can completely realize the automation of the test process, and the test speed is high and the test efficiency is high.
Specifically, the wafer test positioning device 100 may fix the chip by fastening, and set up a limit groove, or may fix the chip by vacuum adsorption.
In particular, in the present embodiment, the wafer test positioning apparatus 100 fixes the chip by vacuum adsorption. The vacuum suction method can stably fix the chip on the wafer test positioning device 100. In addition, the vacuum adsorption mode does not need to use an external fastener, so that the damage of the external fastener to the surface of the chip can be effectively prevented, and the accuracy of the chip is improved.
Referring to fig. 3 and fig. 4 together, in the present embodiment, the wafer test positioning apparatus 100 includes a substrate 110, a plurality of lifting members 120, and a vacuum chuck 130.
The substrate 110 is supported and has a bearing surface 112.
A plurality of lifters 120 are mounted on the load surface 112.
The vacuum adsorption platform 130 is disposed at one end of the plurality of lifting members 120 away from the carrying surface 112. The plurality of lifting members 120 may drive the vacuum adsorption platform 130 to lift along the first direction. The vacuum adsorption platform 130 has a vacuum chamber 132, and a plurality of vacuum adsorption holes 134 communicating with the vacuum chamber 132 are formed in the surface of the vacuum adsorption platform 130.
The substrate 110 is generally made of an alloy, plastic steel or other polymer material with high mechanical strength to prevent the substrate 110 from being deformed and broken during operation. The vacuum adsorption platform 130 is used for adsorbing and fixing the wafer and the chip. The lifting member 120 is used for adjusting the height of the vacuum adsorption platform 130 from the carrying surface 112 and the inclination of the vacuum adsorption platform 130.
When the wafer is tested for optical performance and electrical performance, the wafer needs to be at a certain angle with the test assembly 400 to achieve a good test effect. When the wafer test positioning apparatus 100 works, the partial lifting member 120 can drive the vacuum adsorption platform 130 to partially lift. Furthermore, a height difference is formed between the fixed lifting member 120 and the lifting member 120 performing lifting motion, and the vacuum adsorption platform 130 is inclined, so that an angle between the wafer and the testing assembly 400 is adjusted, and a good testing effect is achieved. Or if there is a gap between the positions of the wafer test positioning apparatus 100 and the test assembly 400, the lifting members 120 may be lifted to adjust the distance between the vacuum adsorption platform 130 and the carrying surface 112, so as to adjust the distance between the vacuum adsorption platform 130 and the test assembly 400.
Specifically, the elevating member 120 may be a hydraulic rod, a screw rod, or a screw member. In this embodiment, the plurality of lifting members 120 are provided with mounting portions 122, and the vacuum suction platform 130 is provided with a plurality of engaging portions 136 on a side facing the carrying surface 112. The mounting portion 122 has an internal thread structure, and the mating portion 136 has an external thread structure. The plurality of engaging portions 136 are engaged with the plurality of mounting portions 122, respectively, so that a screw-threaded rotational connection is formed between the elevating member 120 and the vacuum suction platform 130.
When the lifter 120 works, the mounting portion 122 of part of the lifter 120 is fixed, the mounting portion 122 of the rest lifter 120 is rotated, and the rest mounting portion 122 is further screwed with the corresponding fitting portion 136. Furthermore, a height difference is formed between the fixed lift 120 and the rotating lift 120, and the vacuum suction platform 130 is tilted, so that an angle between the wafer and the test assembly 400 is adjusted. Therefore, by setting the mounting portion 122 to be of an internal thread structure, the mating portion 136 is of an external thread structure, so that the lifting member 120 is simple to mount and adjust, and the working efficiency is improved.
It should be noted that, in other embodiments, the mounting portion 122 may also be an external thread structure, and the mating portion 136 may be an internal thread structure.
Further, in the present embodiment, the wafer test positioning apparatus 100 further includes a bolt 140. The lifter 120 includes a base 124 and an internally threaded tube 126 protruding from the base 124. The surface of the vacuum adsorption platform 130 facing the bearing surface 112 is provided with a threaded post, and the internal threaded tube 126 is screwed with the threaded post. Bolts 140 detachably secure base 124 to base plate 110.
In operation, a portion of the lifting member 120 is rotated and a portion of the internally threaded tube 126 is further threaded with a portion of the threaded post. Therefore, in the case that the rest of the lifting member 120 remains stationary, the distance between the vacuum adsorption platform 130 and the substrate 110 at the rotating portion is reduced, so that the vacuum adsorption platform 130 is inclined, and the included angle between the vacuum adsorption platform 130 and the testing assembly 400 can be adjusted to meet the testing requirement. It should be noted that, if the height of the vacuum adsorption platform 130 from the substrate is too high or too low, all the lifting members 120 can be rotated simultaneously, so that the internal threaded pipe 126 is screwed with the threaded posts, and the whole vacuum adsorption platform 130 is lifted or lowered relative to the substrate 110, so as to meet the requirement of the vacuum adsorption platform 130 for testing the height. After the height or inclination of the vacuum suction platform 130 is adjusted, the bolts 140 can fix the base 124 to the base plate 110, so as to prevent the lifting member 120 from sliding during operation to affect the testing effect. Specifically, screw holes 128 are formed at positions of the base 124 opposite to the substrate 110, and bolts 140 are screwed into the screw holes 128 of the base 124 and the substrate 110, so that the lifter 120 and the vacuum chuck 130 can be stably fixed to the substrate 110. Therefore, by arranging the bolts 140, the lifting member 120 can be effectively prevented from moving, and the wafer can be conveniently tested in the adjusted angle, so that the testing effect is better.
Further, the threaded posts may be integrally formed with the vacuum adsorption platform 130, or may be formed separately from the vacuum adsorption platform 130, and fixed to the surface of the vacuum adsorption platform 130 facing the substrate 110 by fasteners.
Further, in the present embodiment, a plurality of screw posts are provided at equal intervals along the circumferential direction of the vacuum adsorption platform 130.
I.e., the lifters 120 are also disposed at equal intervals along the axial direction of the base plate 110. Therefore, the lifting member 120 is convenient to distribute the stress applied by the vacuum adsorption platform 130 at equal intervals along the circumferential direction of the vacuum adsorption platform 130, so that the wafer test positioning device 100 is prevented from being deformed or broken due to stress concentration, and the service life of the wafer test positioning device 100 is convenient to be prolonged. In addition, the lifter 120 is disposed at the edge of the substrate 110, so that the lifter 120 can be operated when the wafer test positioning apparatus 100 needs to perform the angle adjustment.
In this embodiment, the wafer test positioning apparatus 100 further includes a lock nut 150. The lock nut 150 is sleeved on the threaded column and is screwed with the threaded column.
By arranging the lock nut 150, the relative sliding of the position of the mounting portion 122 of the lifting member 120 and the position of the matching portion 136 of the vacuum adsorption platform 130 after the angle adjustment can be effectively avoided, so as to keep the inclination of the vacuum adsorption platform 130 constant, thereby having a better test effect.
In this embodiment, the wafer test positioning apparatus 100 further includes a heating rod 160 and a temperature controller. The sidewall of the vacuum adsorption platform 130 is provided with a mounting hole communicated with the vacuum chamber 132. The heating rod 160 penetrates through the mounting hole and is tightly adhered to the inner wall of the mounting hole. The temperature controller is electrically connected to the heating rod 160.
Since the wafer performance test is performed at a high temperature, the vacuum adsorption stage 130 can be rapidly heated by providing the heating rod 160. The temperature controller can control the heating rod 160 to heat so as to maintain the temperature of the vacuum adsorption platform 130 within a set range, thereby having higher testing accuracy.
Further, the heating rod 160 is provided in plurality. The plurality of heating bars 160 are disposed at equal intervals.
The heating rods 160 arranged at equal intervals are convenient for the vacuum adsorption platform 130 to uniformly and rapidly heat up, so that the temperature difference of the surface of the vacuum adsorption platform 130 is small, the test error is convenient to reduce, and the test precision is improved.
In this embodiment, the wafer test positioning apparatus 100 further includes a thermocouple 170. The thermocouple 170 is electrically connected to the temperature controller. The thermocouple 170 is used to measure the temperature value of the vacuum adsorption stage 130 and feed back to the temperature controller.
The thermocouple 170 has a function of detecting the temperature of the vacuum adsorption stage 130. The thermocouple 170 is electrically connected to a temperature controller, and can feed back the detected temperature value of the vacuum adsorption platform 130 to the temperature controller. If the temperature value is higher than the preset temperature value, the temperature controller controls the heating rod 160 to stop heating so as to realize temperature reduction. If the temperature value fed back is lower than the preset temperature value, the temperature controller controls the heating rod 160 to heat so as to realize temperature rise. Thus, by providing the thermocouple 170, automation of temperature control of the wafer test handler 100 is facilitated.
In this embodiment, the wafer test positioning apparatus 100 further includes a vacuum generator 180 and a vacuum pump. The vacuum generator 180 communicates with the vacuum chamber 132 through a vacuum exhaust.
Through setting up vacuum generator 180 and vacuum exhaust tube, can in time take away the air that gets into in the vacuum cavity, then maintain the good vacuum degree of vacuum cavity 132 to be fixed in the vacuum adsorption platform with the wafer is stable
130. The vacuum chamber 132 formed by the vacuum generator 180 is stable in vacuum environment, and the wafer test positioning apparatus 100 can work efficiently.
In this embodiment, the wafer test fixture 100 further includes a vacuum sensor 190. The vacuum sensor 190 is used to detect a vacuum value of the vacuum chamber 132.
The vacuum sensor 190 may measure and display the vacuum value of the vacuum chamber 132. In general, the vacuum value is a stable value, and there is a possibility that a mechanical failure occurs when the vacuum value is changed. Therefore, the vacuum sensor 190 is convenient for operators to monitor the vacuum environment of the vacuum chamber in real time, and when mechanical faults occur, faults can be checked in time, so that the production efficiency of the wafer test positioning device 100 is improved.
In this embodiment, the automated wafer test equipment 10 further includes a laser rangefinder 500. The laser range finder 500 is movably disposed on the machine 200 and is communicatively connected to the controller. The laser rangefinder 500 is used for obtaining a thickness parameter of the chip in the third direction, and feeding back the thickness parameter to the controller to calibrate the distance between the test assembly and the surface of the chip in the third direction.
Due to unavoidable errors between mechanical operations, the thickness of the molded chip cannot be kept uniform. In the optical performance and electrical performance test, the positions of the probe 422, the transmitting optical fiber 414 and the receiving optical fiber 416 need to be moved to achieve a good test effect. During testing, the probes 422 need to contact the surface of the chip, and the probes 422 may be excessively displaced, so that the probes may be excessively rigidly contacted with the surface of the chip to damage the chip. The transmitting optical fiber 414 and the receiving optical fiber 416 need to be within a predetermined distance from the surface of the chip to achieve good light transmitting and receiving effects. Therefore, the thickness parameter in the third direction of the chip is obtained by setting the laser rangefinder 500, and fed back to the controller. The controller can compare the thickness parameter signal of the received laser rangefinder 500 with a preset thickness value, and control the probe 422, the transmitting optical fiber 414 and the receiving optical fiber 416 to move along the third direction, so as to avoid rigid contact between the probe 422, the transmitting optical fiber 414 and the receiving optical fiber 416 and the chip surface, thereby achieving a good test effect.
In this embodiment, the automated wafer test station 10 further includes a camera positioning assembly 700. The camera positioning assembly 700 is disposed on the machine 200 and corresponds to the testing station 220. The camera positioning assembly 700 is communicatively coupled to a controller. The camera positioning assembly 700 is used for photographing towards the testing station 220, comparing with a preset photo and feeding back to the controller.
By arranging the camera positioning assembly 700, the position of the chip can be precisely positioned, so that a good test effect is achieved.
Specifically, the camera positioning assembly 700 includes a camera 710, a positioning drive (not shown), and a positioning slide rail 720. The positioning slide rail 720 extends in the third direction. The camera 710 is slidably disposed on the positioning rail 720, and the positioning driving member is in transmission connection with the camera 710. Before testing, the positioning driving member drives the camera 710 to slide along the third direction, so that the camera 710 moves to a proper photographing position. During testing, the positioning drive is not in operation and the camera 710 is stationary. The camera 710 takes a picture toward the test station 220 and compares the taken picture with a preset picture. If the photographed picture is not consistent with the preset picture, the camera 710 will send a feedback signal to the controller. The controller controls the angle adjustment mechanism 300 to drive the wafer test positioning apparatus 100 to translate or rotate, so as to adjust the position of the chip until the chip corresponds to the test station 220. In addition, when the wafer is removed after the performance test of the chip is completed, for convenience of operation, the positioning driving member drives the camera 710 to move along the direction opposite to the mounting surface 210, so as to facilitate the removal of the wafer by an operator.
In this embodiment, the automated wafer test equipment 10 further includes two static eliminators 600. The two static eliminators 600 are disposed at both ends of the machine 200, respectively, to form a static eliminating area. The angle adjustment mechanism 300, the wafer test positioning apparatus 100 and the test assembly 400 are all located in the static electricity eliminating area.
The automated wafer test station 10 is powered on during operation, and the powered mechanical products generate static electricity during operation. And static electricity will affect the test of the electrical performance of the chip, thereby reducing the test accuracy of the chip. Therefore, by providing the static eliminator 600, static electricity during the operation of the automated wafer test equipment 10 can be eliminated, thereby improving the test accuracy of the chips.
The operation of the automated wafer test station 10 is briefly described by the following description:
The controller controls the angle adjusting mechanism 300 to move, and drives the wafer test positioning apparatus 100 and the chip to move to the test station 220. The camera 710 photographs toward the test station 220, compares the photographed photograph with a preset photograph, and feeds back the comparison result to the controller. The controller judges according to the feedback result, if the chip is not in the test station 220, the controller continues to control the angle adjusting mechanism 300 to move until the chip moves to the test station 220. Furthermore, the controller controls the laser rangefinder 500 to measure the thickness parameter of the chip in the third direction, compares the measured thickness parameter with a preset parameter value, controls the test assembly 400 to move to a test position with a better test effect according to the comparison result, and the test assembly 400 performs performance test on the chip and feeds back the test result to the controller. After the test is completed, the controller controls the turntable 312 to rotate, and the next chip to be tested on the wafer moves to the test station 220 for performance test.
The automated wafer test equipment 10 is configured to hold a wafer on a surface of the wafer test fixture 100. In operation, the controller controls the rotation assembly 310 to rotate or the translation assembly 320 to translate, so as to drive the wafer test positioning apparatus 100 and the wafer to move, and the chip moves to the test station 220. Further, the controller controls the test assembly 400 to move to the test station 220 and test the chip performance. Compared with the existing semi-automatic test machine, the automatic wafer test machine 10 can completely realize the automation of the test process, so that the test speed is high and the test efficiency is high.
The technical features of the above-described embodiments may be arbitrarily combined, and all possible combinations of the technical features in the above-described embodiments are not described for brevity of description, however, as long as there is no contradiction between the combinations of the technical features, they should be considered as the scope of the description.
The above examples illustrate only a few embodiments of the invention, which are described in detail and are not to be construed as limiting the scope of the invention. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the invention, which are all within the scope of the invention. Accordingly, the scope of protection of the present invention is to be determined by the appended claims.
Claims (6)
1. An automated wafer test station for securing and testing chips located on a wafer, comprising:
The machine table with the supporting function is provided with a mounting surface, and a test station is arranged on the mounting surface;
The angle adjusting mechanism is arranged on the mounting surface and comprises a rotating assembly and a translation assembly;
The wafer test positioning device is used for adsorbing and fixing the chip, the wafer test positioning device is arranged on the surface of the angle adjusting mechanism, which is opposite to the mounting surface, and the angle adjusting mechanism can drive the wafer test positioning device to rotate or translate so as to drive the chip to move to the test station;
the testing component is arranged on the machine table and is used for detecting the performance of the chip positioned at the testing station; and
The controller is in communication connection with the angle adjusting mechanism and the testing component and is used for respectively sending trigger signals to the angle adjusting mechanism and the testing component so as to trigger the angle adjusting mechanism and the testing component;
The translation assembly includes:
The first translation piece comprises a first sliding rail, a first motor and a first sliding block, wherein the first sliding rail extends along a first direction, the first sliding rail is fixed on the mounting surface, the first sliding block is slidably arranged on the first sliding rail, and the first motor is used for driving the first sliding block to slide along the first sliding rail; and
The second translation piece comprises a second sliding rail, a second motor and a second sliding block, the second sliding rail extends along a second direction, the second sliding rail is fixed on the surface of the first sliding block, which is opposite to the first sliding rail, the second sliding block is slidably arranged on the second sliding rail, the rotating assembly and the wafer testing and positioning device are fixed on the surface of the second sliding block, which is opposite to the second sliding rail, and the second motor is used for driving the second sliding block to slide along the second sliding rail;
the wafer test positioning device comprises:
a substrate for supporting and having a bearing surface;
a plurality of lifting pieces which are arranged on the bearing surface;
The vacuum adsorption platform is arranged at one end, far away from the bearing surface, of the lifting pieces, and the lifting pieces can drive the vacuum adsorption platform to lift along the first direction; the vacuum adsorption platform is provided with a vacuum cavity, and a plurality of vacuum adsorption holes communicated with the vacuum cavity are formed in the surface of the vacuum adsorption platform;
The lifting pieces are provided with mounting parts, a plurality of matching parts are arranged on one side, facing the bearing surface, of the vacuum adsorption platform, the mounting parts are of internal thread structures, the matching parts are of external thread structures, and the matching parts are respectively matched with the mounting parts so as to form threaded rotary connection between the lifting pieces and the vacuum adsorption platform;
The locking nut is sleeved on the external thread structure and is screwed with the external thread structure.
2. The automated wafer test station of claim 1, wherein the rotating assembly comprises a turntable and a driving member, the turntable is rotatably disposed on a surface of the second slider, the driving member is in transmission connection with the turntable, and the wafer test positioning device is fixed on a surface of the turntable opposite to the second slider.
3. The automated wafer test station of claim 1, wherein the test assembly comprises:
An optical assembly comprising a transmitting optical fiber, a receiving optical fiber, an optical driving member and an optical guide rail extending along a third direction perpendicular to the first direction and the second direction, the optical driving member being used for driving the transmitting optical fiber and the receiving optical fiber to move along the optical guide rail;
the electrical assembly comprises a probe, an electrical driving piece and an electrical guide rail extending along a third direction perpendicular to the first direction and the second direction, wherein the electrical driving piece is used for driving the probe to move along the electrical guide rail.
4. The automated wafer test station of claim 3, further comprising a laser rangefinder movably disposed on the station and communicatively coupled to the controller, the laser rangefinder configured to obtain a thickness parameter of the chip in the third direction and to feed back to the controller to calibrate a distance of the test assembly from the chip surface in the third direction.
5. The automated wafer test station of claim 1, further comprising a camera positioning assembly disposed on the station and in communication with the controller, the camera positioning assembly configured to take a photograph of the test station and compare the photograph with a predetermined photograph and feed the photograph back to the controller.
6. The automated wafer test station of claim 1, further comprising two static eliminators disposed at opposite ends of the station, respectively, to form a static elimination region, the angle adjustment mechanism, the wafer test positioning device, and the test assembly being located within the static elimination region.
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| CN201810467796.XA CN108493124B (en) | 2018-05-16 | 2018-05-16 | Automatic wafer test machine |
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| CN201810467796.XA CN108493124B (en) | 2018-05-16 | 2018-05-16 | Automatic wafer test machine |
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