CN108470850A - A kind of packaging method of display panel - Google Patents
A kind of packaging method of display panel Download PDFInfo
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- CN108470850A CN108470850A CN201810246612.7A CN201810246612A CN108470850A CN 108470850 A CN108470850 A CN 108470850A CN 201810246612 A CN201810246612 A CN 201810246612A CN 108470850 A CN108470850 A CN 108470850A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
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Abstract
The present invention provides a kind of packaging method of display panel, the method includes：First in first electrode layer, the side far from the first substrate forms at least two layers stacked solid encapsulated layer, and the fusing point of each encapsulated layer is all different, again by first substrate and second substrate to box, so that spacer material is corresponding with pixel defining layer, finally heated each encapsulated layer, and apply pressure to first substrate and/or second substrate, so that first electrode layer and the second electrode lay are in contact.In the encapsulation process of display panel, each layer encapsulated layer can be converted to liquid from solid-state successively, corresponding each layer encapsulated layer can successively be compressed, during each layer encapsulated layer is compressed, since deformation quantity caused by each layer encapsulated layer is smaller, accordingly make generated stress in each encapsulated layer smaller, so as to reduce active force of the entire encapsulated layer to first electrode layer, and then can be cracked to avoid first electrode layer, to improve the yield of OLED display panel.
Description
Technical field
The present invention relates to display technology field, more particularly to a kind of packaging method of display panel.
Background technology
Since OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display panel has entirely admittedly
State structure, high brightness, full view, fast response time and can Flexible Displays the advantages that, it has also become great competitiveness and development prospect
Next-generation show product.Existing OLED display panel includes first substrate and second substrate, and first substrate includes the first substrate
With pixel confining layer, anode layer, organic luminous layer and the cathode layer being sequentially formed in the first substrate, second substrate includes second
Substrate and black matrix, chromatic filter layer, planarization layer and the spacer material being sequentially formed on second substrate.
Due to the thinner thickness of cathode layer, the resistance of respective cathode layer is larger, is applied on cathode layer to be easy to cause
Voltage pressure drop it is larger.In order to solve the above technical problems, being formed in the prior art in side of the spacer material far from the second substrate
Auxiliary electrode layer, and in the encapsulation process of display panel, apply certain pressure to first substrate and second substrate, with compression
The encapsulated layer being formed between pixel defining layer and black matrix, corresponding encapsulated layer can generate deformation, so that cathode layer and auxiliary
Electrode layer is connected, so as to increase the thickness of cathode layer, to reduce the resistance of cathode layer.
But during compressing encapsulated layer, the deformation quantity that encapsulated layer generates is larger, accordingly makes the stress in encapsulated layer
It is larger, it is larger to the active force of cathode layer to be easy to cause encapsulated layer, it is accordingly easy that cathode layer is made to crack, and then influence
The yield of OLED display panel.
Invention content
The present invention aiming at the above shortcomings existing in the prior art, provides a kind of packaging method of display panel, with so that
Small part solves the problems, such as that the cathode layer of existing display panel easy tos produce crackle.
To achieve the above object, the present invention provides a kind of packaging method of display panel, and the display panel includes first
Substrate and second substrate, the first substrate includes the first substrate, the pixel defining layer and shape that are formed in first substrate
At the first electrode layer in the pixel defining layer；The second substrate includes the second substrate, is formed in second substrate
On spacer material and the second electrode lay that is formed on the spacer material；
The method includes：
In side of the first electrode layer far from first substrate, or in the second electrode lay far from described
The side of two substrates forms at least two layers stacked solid encapsulated layer, wherein the fusing point of each encapsulated layer is all different；
By the first substrate and the second substrate to box, so that the spacer material is opposite with the pixel defining layer
It answers；
It heats each encapsulated layer, and applies pressure to the first substrate and/or the second substrate, so that described the
One electrode layer and the second electrode lay are in contact, wherein heating temperature reaches the fusing point of each encapsulated layer successively.
Preferably, the maximum fusing point of each encapsulated layer is less than 100 DEG C.
Preferably, the minimum value of the difference of the fusing point of arbitrary two encapsulated layers is 5-10 DEG C.
Preferably, the material of each encapsulated layer includes for reducing the temperature sensitivity chemical combination of the encapsulated layer fusing point
Object material.
Preferably, the temperature sensitivity compound-material includes the first derivative, or including the first derivative and the
Two derivatives, the mass percent of the second derivative described in the material of higher melting-point encapsulated layer are more than lower melting-point encapsulation
The mass percent of second derivative described in the material of layer, wherein first derivative includes an alkadienes chemical combination
Object and a nucleophilie diene compound, second derivative include two diolefin compounds and two nucleophilie diene compounds.
Preferably, the side in the first electrode layer far from first substrate or in the second electrode lay
Side far from second substrate forms the solid encapsulated layer of at least two layer laminates, specifically includes：
In side of the first electrode layer far from first substrate, or in the second electrode lay far from described
The side of two substrates forms solid first encapsulated layer, solid second encapsulated layer and solid third encapsulated layer, wherein described
First encapsulated layer, second encapsulated layer and third encapsulation layer laminate setting, and the fusing point of first encapsulated layer is less than
The fusing point of second encapsulated layer, the fusing point of second encapsulated layer are less than the fusing point of the third encapsulated layer.
Preferably, do not include second derivative, the material of second encapsulated layer in the material of first encapsulated layer
The mass percent of second derivative described in material is 10%-20%, and second spreads out described in the material of the third encapsulated layer
The mass percent of biology is 20%-30%.
Preferably, each encapsulated layer of heating, and apply pressure to the first substrate and/or the second substrate
Power specifically includes：
When the heating temperature respectively reaches the fusing point of each encapsulated layer, respectively to the first substrate and/or institute
It states second substrate and applies different pressure, wherein when the pressure applied when reaching compared with low melting point is less than reached higher melt
The pressure of application.
Preferably, each encapsulated layer of heating, and apply pressure to the first substrate and/or the second substrate
Later, the method further includes：
Using each encapsulated layer of ultraviolet light, so that each encapsulated layer is converted to solid-state from liquid.
Preferably, which is characterized in that the material of the encapsulated layer includes epoxide resin material.
The invention has the advantages that：
The present invention provides a kind of packaging method of display panel, the method includes：First in first electrode layer far from first
The side of substrate forms at least two layers stacked solid encapsulated layer, and the fusing point of each encapsulated layer is all different, then by the first base
Plate and second substrate are to box, so that spacer material is corresponding with pixel defining layer, finally heated each encapsulated layer, and to first substrate
And/or second substrate applies pressure, so that first electrode layer and the second electrode lay are in contact.In the encapsulation process of display panel
In, each layer encapsulated layer can be converted to liquid from solid-state successively, and corresponding each layer encapsulated layer can successively be compressed, and be encapsulated in each layer
During layer is compressed, since deformation quantity caused by each layer encapsulated layer is smaller, accordingly make generated in each encapsulated layer answer
Power is smaller, so as to reduce active force of the entire encapsulated layer to first electrode layer, and then can be generated to avoid first electrode layer
Crackle, to improve the yield of OLED display panel.
Description of the drawings
Fig. 1 be display panel provided in this embodiment packaging method in step 1 schematic diagram；
Fig. 2 be display panel provided in this embodiment packaging method in step 2 schematic diagram；
Fig. 3 be display panel provided in this embodiment packaging method in step 3 schematic diagram；
Fig. 4 is the flow chart of the packaging method of display panel provided in this embodiment.
Marginal data：
1, first substrate 11, the first substrate 12, pixel defining layer 13, first electrode layer
14, organic luminous layer 15, third electrode layer 2, second substrate 21, the second substrate
22, spacer material 23, the second electrode lay 24, black matrix 25, chromatic filter layer
26, planarization layer 3, encapsulated layer 31, the first encapsulated layer 32, the second encapsulated layer
33, third encapsulated layer 4, pixel unit 5, sealant
Specific implementation mode
To make those skilled in the art more fully understand technical scheme of the present invention, the present invention is carried below in conjunction with the accompanying drawings
A kind of packaging method of the display panel supplied is described in detail.
The embodiment of the present invention provides a kind of packaging method of display panel, as shown in figure 3, the display panel may include
First substrate 1 and second substrate 2, first substrate 1 may include the first substrate 11, the pixel that is formed in the first substrate 11 defines
Layer 12 and the first electrode layer 13 being formed in pixel defining layer 12, pixel defining layer 12 can limit in the first substrate 11
Multiple pixel units 4；The spacer material 22 and formed that second substrate 2 may include the second substrate 21, be formed in the second substrate 21
The second electrode lay 23 on spacer material 22, spacer material 22 can be such that the box thickness of display panel each position is consistent.
Specifically, can utilize patterning processes (such as：Photoetching process) pixel defining layer 12 is formed in the first substrate 11；
Vacuum evaporation process or magnetron sputtering technique can be utilized to form first in side of the pixel defining layer 12 far from the first substrate 11
Electrode layer 13, first electrode layer 13 can be cathode layer, and the material of cathode layer can be that tin indium oxide, indium zinc oxide or magnesium silver close
Gold.Can utilize patterning processes (such as：Photoetching process) spacer material 22 is formed in the second substrate 21；Magnetron sputtering can be utilized
Technique forms the second electrode lay 23 in side of the spacer material 22 far from the second substrate 21, and the second electrode lay 23 can be auxiliary electrode
Layer, auxiliary electrode layer can reduce the resistance of cathode layer, and the material of auxiliary electrode layer can be tin indium oxide or indium zinc oxide.
After first substrate 1 and second substrate 2 form above structure, in conjunction with shown in Fig. 1 to Fig. 4, the packaging method
It may comprise steps of：
Step 1, in side of the first electrode layer 13 far from the first substrate 11, or in the second electrode lay 23 far from the second base
The side at bottom 21 forms at least two layers stacked solid encapsulated layer 3, wherein the fusing point of each encapsulated layer 3 is all different.
Specifically, as shown in Figure 1, in embodiments of the present invention, be in first electrode layer 13 far from the first substrate 11
It is illustrated at least two layers stacked solid encapsulated layer 3 of side formation.Each encapsulated layer 3 can be covered in first electrode
13 side far from the first substrate 11 of layer, each encapsulated layer 3 can be as the raising of temperature be successively from solid state transformed for liquid.
Wherein, as shown in Figure 1, the side in first electrode layer 13 far from the first substrate 11 formed at least two layers it is stacked
Solid encapsulated layer 3 (i.e. step 1) specifically includes：
Solid first encapsulated layer 31, solid second envelope are formed in side of the first electrode layer 13 far from the first substrate 11
Fill layer 32 and solid third encapsulated layer 33, wherein the first encapsulated layer 31, the second encapsulated layer 32 and the stacking of third encapsulated layer 33 are set
It sets, and the fusing point of the first encapsulated layer 31 is less than the fusing point of the second encapsulated layer 32, the fusing point of the second encapsulated layer 32 is encapsulated less than third
The fusing point of layer 33.
Specifically, the first encapsulated layer 31, the second encapsulated layer 32 and third encapsulated layer 33 can be covered in first electrode successively
13 side far from the first substrate 11 of layer, can also be covered in side of the first electrode layer 13 far from the first substrate 11 simultaneously.
It should be noted that forming solid first encapsulated layer in side of the second electrode lay 23 far from the second substrate 21
31, solid second encapsulated layer 32 and solid third encapsulated layer 33 are also feasible.It should also be noted that, the present invention is implemented
Example is illustrated so that the quantity of encapsulated layer 3 is three layers as an example, and certainly, the quantity of encapsulated layer 3 is two layers, four layers or more layers
It is also feasible.
As shown in Figure 1, in embodiments of the present invention, third encapsulated layer 33 is compared with the second encapsulated layer 32 adjacent to first electrode
Layer 13, the second encapsulated layer 32 are compared with the first encapsulated layer 31 adjacent to first electrode layer 13.It should be noted that the first encapsulated layer
31, other arrangement modes of the second encapsulated layer 32 and third encapsulated layer 33 are also feasible, are not limited thereto.
Step 2, by first substrate 1 and second substrate 2 to box, so that spacer material 22 is corresponding with pixel defining layer 12.
Specifically, as shown in Fig. 2, after first substrate 1 and second substrate 2 are to box, it is located at spacer material 22 far from second
The second electrode lay 23 of 21 side of substrate be located at first encapsulated layer 31 phase of the pixel defining layer 12 far from 11 side of the first substrate
Against.
It should be noted that before first substrate 1 and second substrate 2 are to box, can be formed at the edge of second substrate 2
The sealant 5 of one circle liquid, when first substrate 1 and second substrate 2 are to box, sealant 5 can be by first substrate 1 and the second base
Plate 2 seals.
Step 3, each encapsulated layer 3 is heated, and applies pressure to first substrate 1 and/or second substrate 2, so that first electrode
Layer 13 and the second electrode lay 23 are in contact, wherein heating temperature reaches the fusing point of each encapsulated layer 3 successively.
Specifically, as shown in figure 3, with temperature raising, the first encapsulated layer 31 first is converted to liquid from solid-state, at this time
Apply first pressure to first substrate 1 and/or second substrate 2, so that the first encapsulated layer 31 generates deformation, is correspondingly positioned at spacer material
22 the second electrode lays 23 far from 21 side of the second substrate can be in contact with the second encapsulated layer 32；Then the second encapsulated layer 32 from
Solid-state is converted to liquid, applies second pressure to first substrate 1 and/or second substrate 2 at this time, so that the second encapsulated layer 32 generates
Deformation, being correspondingly positioned at the second electrode lay 23 of the spacer material 22 far from 21 side of the second substrate can connect with third encapsulated layer 33
It touches；Last third encapsulated layer 33 is converted to liquid from solid-state, applies the first pressure to first substrate 1 and/or second substrate 2 at this time
Power is correspondingly positioned at the second electrode lay 23 of the spacer material 22 far from 21 side of the second substrate so that third encapsulated layer 33 generates deformation
It can be in contact with positioned at first electrode layer 13 of the pixel defining layer 12 far from 11 side of the first substrate.
It should be noted that first substrate 1 and second substrate 2 carry out, to box, inciting somebody to action in sealant 5 usually in vacuum chamber
After first substrate 1 and second substrate 2 seal, the pressure in display panel box is equal with the indoor pressure of vacuum chamber.First
After substrate 1 and second substrate 2 are to box, it can be increased in vacuum chamber by being passed through certain gas into vacuum chamber
Pressure, with using display panel box in in vacuum chamber between pressure difference to first substrate 1 and/or second substrate 2
Apply pressure, in the box that can accordingly control the display panel in vacuum chamber between pressure difference size, to control to the
The size for the pressure that one substrate 1 and/or second substrate 2 apply.
Preferably, the pressure difference in the box of display panel and between vacuum chamber is interior is more than 0, and is less than or equal to 1atm
(standard atmospheric pressure).This way it is possible to avoid first substrate 1 and second substrate 2 are generated compared with large deformation, it accordingly can be to avoid the first base
Plate 1 and second substrate 2 rupture.
Preferably, each encapsulated layer 3 of heating, and apply pressure (i.e. step to first substrate 1 and/or second substrate 2
3) it, specifically includes：When heating temperature respectively reaches the fusing point of each encapsulated layer 3, respectively to first substrate 1 and/or second substrate 2
Apply different pressure, wherein the pressure applied when reaching compared with low melting point is less than the pressure applied when reached higher melt.
Apply when the second 32 fusing point of encapsulated layer that is, reaching the first pressure that applies when the first 31 fusing point of encapsulated layer and being less than to reach
Second pressure, and reach the second pressure that applies when the second 32 fusing point of encapsulated layer and be less than the when of reaching third 33 fusing point of encapsulated layer and apply
Third pressure.In this way, being connected with the second electrode lay 23 convenient for first electrode layer 13.Optionally, first pressure can be 0-
0.5atm, second pressure can be 0.5-0.8atm, and third pressure can be 0.8-1.0atm.Certainly, first pressure, the second pressure
Power and third pressure are all identical and feasible.
The packaging method of display panel provided in an embodiment of the present invention, first in first electrode layer 13 far from the first substrate 11
Side forms at least two layers stacked solid encapsulated layer 3, and the fusing point of each encapsulated layer 3 is all different (i.e. step 1), then by the
One substrate 1 and second substrate 2 are to box, so that spacer material 22 corresponding with pixel defining layer 12 (i.e. step 2), finally heated each envelope
Layer 3 is filled, and applies pressure to first substrate 1 and/or second substrate 2, so that first electrode layer 13 and the second electrode lay 23 connect
It touches.In the encapsulation process of display panel, each layer encapsulated layer can be converted to liquid from solid-state successively, and corresponding each encapsulated layer 3 can
Successively to be compressed, during each layer encapsulated layer 3 is compressed, due to deformation quantity caused by the 3 of each layer encapsulated layer compared with
It is small, accordingly make generated stress in each layer encapsulated layer 3 smaller, so as to reduce entire encapsulated layer 3 to first electrode layer 13
Active force, and then can be cracked to avoid first electrode layer 13, to improve the yield of OLED display panel.
As shown in figure 3, each pixel unit 4 may include organic luminous layer 14 and be formed on organic luminous layer 14 first
Electrode layer 13.Specifically, after the first substrate 11 forms pixel defining layer 12, evaporation process can be utilized in pixel unit 4
Interior formation organic luminous layer 14 forms the process of first electrode layer 13 in side of the pixel defining layer 12 far from the first substrate 11
In, it can synchronize and form first electrode layer 13 in pixel unit 4.
The tolerable temperature of existing organic luminous layer 14 is usually 100 DEG C, i.e., organic when temperature is greater than or equal to 100 DEG C
The material of luminescent layer 14 is easy crystallization, the corresponding luminous efficiency for being easy to influence organic luminous layer 14.To avoid the envelope of display panel
Dress process influences the luminous efficiency of organic luminous layer 14, and the maximum fusing point of each encapsulated layer 3 is less than 100 DEG C.
Preferably, the material of each encapsulated layer 3 includes temperature sensitivity compound-material, the temperature sensitivity compound
Material can reduce the fusing point of each encapsulated layer 3, and the maximum fusing point of each encapsulated layer 3 is accordingly made to be less than 100 DEG C.Optionally, encapsulated layer 3
Temperature in materials sensitive compound material mass percent be 30-50%.
Specifically, temperature sensitivity compound-material may include the first derivative, or it may include the first derivative
With the second derivative, wherein the first derivative may include a diolefin compound and a nucleophilie diene compound, and second spreads out
Biology may include two diolefin compounds and two nucleophilie diene compounds.Diolefin compound can be furans
Nucleophilie diene compound can be maleimideThere is furans electron-donating group, maleimide to have electron-withdrawing group
Cycloaddition reaction can occur for group, corresponding furans and maleimide, and a furans and a maleimide can generate(i.e. the first derivative), two furans and two maleimides can generate
(i.e. the second derivative).The first derivative accordingly generated since furans and maleimide all have unsaturated group and
The fusing point of two derivatives is relatively low, so as to reduce the fusing point of each encapsulated layer 3.
The fusing point of the larger organic matter of usual molecular weight is more than the fusing point of the smaller organic matter of molecular weight, due to the second derivative
The molecular weight of object is more than the molecular weight of the first derivative, the matter of the second derivative in the material of corresponding higher melting-point encapsulated layer 3
Measure the mass percent that percentage is more than the second derivative in the material of lower melting-point encapsulated layer 3, corresponding third encapsulated layer 33
Material in the second derivative mass percent be more than the second encapsulated layer 32 material in the second derivative mass percent,
The mass percent of second derivative of the second encapsulated layer 32 is more than the quality of the second derivative in the material of the first encapsulated layer 31
Percentage.
It should be noted that as described in chemical formula 1, furans and maleimide can be coupled under normal temperature environment
Reaction forms solid polymer；The solid polymer can generate liquid under high temperature environment (when i.e. temperature reaches fusing point)
First derivative of state, or generate the first derivative and the second derivative of liquid.
Preferably, the minimum value of the difference of the fusing point of arbitrary two encapsulated layer 3 is 5-10 DEG C, that is to say, that arbitrary two encapsulated layer 3
Fusing point difference be more than 5 DEG C.This way it is possible to avoid since technological fluctuation causes multilayer encapsulation layer 3 to be converted to liquid from solid-state simultaneously
State accordingly can cause the stress in entire encapsulated layer 3 larger, so as to more preferably by compression simultaneously to avoid multilayer encapsulation layer 3
Reduce active force of the entire encapsulated layer 3 to first electrode layer 13.
Optionally, including the second derivative in the material of the first encapsulated layer 31, the mass percent of the first derivative is
30-50%, it is 60-70 DEG C accordingly to make the fusing point of the first encapsulated layer 31；The material of second encapsulated layer 32 includes the first derivative
Mass percent with the second derivative, the first derivative is 20-40%, and the mass percent of the second derivative is 10-20%,
It is corresponding that the fusing point of the second encapsulated layer 32 is made to be 70-80 DEG C；The material of third encapsulated layer 33 includes that the first derivative and second spread out
Biology, the mass percent that the mass percent of the first derivative is is 10%-30%, and the mass percent of the second derivative is
20-30%, it is 80-90 DEG C accordingly to make the fusing point of third encapsulated layer 33.
As shown in figure 4, each encapsulated layer 3 of heating, and apply pressure to first substrate 1 and/or second substrate 2 and (walk
It is rapid 3) after, the method can also include：
Step 4, using each encapsulated layer 3 of ultraviolet light, so that each encapsulated layer 3 is converted to solid-state from liquid.
Specifically, the material of encapsulated layer 3 can also include epoxide resin material, optionally, epoxy in the material of encapsulated layer 3
The mass percent of resin material is 40-60%.During encapsulated layer 3 each using ultraviolet light, epoxy monomer
Polymerisation can occur, so that each encapsulated layer 3 is converted to solid-state from liquid.The polymerisation occurred due to epoxy monomer
It is irreversible reaction, when mutually should again be heated to each encapsulated layer 3, each encapsulated layer 3 cannot be converted to liquid from solid-state.
It should be noted that accelerate the ultra-violet curing speed of encapsulated layer 3, the material of encapsulated layer 3 can also include solidification
Agent.It can select, the mass percent for curing agent material in the material of encapsulated layer 3 is 0-10%.
Preferably, during encapsulated layer 3 each using ultraviolet light, ultraviolet light sealant 5 can also be utilized,
So that sealant 5 is converted to solid-state from liquid.In this way, a ultraviolet lighting technique can be utilized simultaneously by sealant 5 and each envelope
It fills layer 3 to cure, the packaging technology of corresponding visible simplified display panel.
It should be noted that the first substrate 11 can be rigid basement or flexible substrates, the second substrate 21 can be rigidity
Substrate or flexible substrates.
As shown in figure 3, pixel unit 4 can also include being formed in organic luminous layer 14 adjacent to the of 11 side of the first substrate
Three electrode layers 15, third electrode layer 15 can reflect the light that organic luminous layer 14 is emitted.Specifically, in the first substrate
11 form after pixel defining layer 12, and before the first substrate 11 forms organic luminous layer 14, can utilize magnetron sputtering work
Skill forms third electrode layer 15 in pixel unit 4, and third electrode layer 15 can be anode layer, and three layers of electricity may be used in anode layer
The material of pole structure, three layers of electrode can be respectively tin indium oxide, silver and tin indium oxide.
As shown in figure 3, second substrate 2 can also include being formed in black matrix of the spacer material 22 adjacent to 21 side of the second substrate
24 and chromatic filter layer 25, wherein black matrix 24 is corresponding with spacer material 22.Specifically, forming dottle pin in the second substrate 21
Before object 22, can utilize patterning processes (such as：Photoetching process) in the second substrate 21 it is respectively formed black matrix 24 and colour
Filter layer 25, chromatic filter layer 25 may include red filter layer, blue color filter layer and green color filter.
To improve the flatness of 22 place plane of spacer material, as shown in figure 3, in spacer material 22 and black matrix 24 and colored filter
Planarization layer 26 is also formed between photosphere 25.Specifically, forming black matrix 24 and chromatic filter layer 25 in the second substrate 21
Later, and in the second substrate 21 it is formed before spacer material 22, planarization layer is formed in the second substrate 21 using spin coating proceeding
26。
It is understood that the principle that embodiment of above is intended to be merely illustrative of the present and the exemplary implementation that uses
Mode, however the present invention is not limited thereto.For those skilled in the art, in the essence for not departing from the present invention
In the case of refreshing and essence, various changes and modifications can be made therein, these variations and modifications are also considered as protection scope of the present invention.
Claims (10)
1. a kind of packaging method of display panel, which is characterized in that the display panel includes first substrate and second substrate, institute
First substrate is stated to include the first substrate, the pixel defining layer that is formed in first substrate and be formed in the pixel defining layer
On first electrode layer；The spacer material and be formed in that the second substrate includes the second substrate, is formed in second substrate
The second electrode lay on the spacer material；
The method includes：
In side of the first electrode layer far from first substrate, or in the second electrode lay far from second base
The side at bottom forms at least two layers stacked solid encapsulated layer, wherein the fusing point of each encapsulated layer is all different；
By the first substrate and the second substrate to box, so that the spacer material is corresponding with the pixel defining layer；
Each encapsulated layer is heated, and applies pressure to the first substrate and/or the second substrate, so that first electricity
Pole layer and the second electrode lay are in contact, wherein heating temperature reaches the fusing point of each encapsulated layer successively.
2. the packaging method of display panel according to claim 1, which is characterized in that the maximum fusing point of each encapsulated layer
Less than 100 DEG C.
3. the packaging method of display panel according to claim 1, which is characterized in that the fusing point of arbitrary two encapsulated layer
Difference minimum value be 5-10 DEG C.
4. the packaging method of display panel according to claim 1, which is characterized in that the material of each encapsulated layer wraps
It includes for reducing the temperature sensitivity compound-material of the encapsulated layer fusing point.
5. the packaging method of display panel according to claim 4, which is characterized in that the temperature sensitivity compound material
Material includes the first derivative, or including the first derivative and the second derivative, described in the material of higher melting-point encapsulated layer
The mass percent of second derivative is more than the quality percentage of second derivative described in the material of lower melting-point encapsulated layer
Than, wherein first derivative includes a diolefin compound and a nucleophilie diene compound, the second derivative packet
Include two diolefin compounds and two nucleophilie diene compounds.
6. the packaging method of display panel according to claim 5, which is characterized in that described remote in the first electrode layer
Side from first substrate forms at least two stackings in side of the second electrode lay far from second substrate
The solid encapsulated layer of layer, specifically includes：
In side of the first electrode layer far from first substrate, or in the second electrode lay far from second base
The side at bottom forms solid first encapsulated layer, solid second encapsulated layer and solid third encapsulated layer, wherein described first
Encapsulated layer, second encapsulated layer and third encapsulation layer laminate setting, and the fusing point of first encapsulated layer is less than described
The fusing point of second encapsulated layer, the fusing point of second encapsulated layer are less than the fusing point of the third encapsulated layer.
7. the packaging method of display panel according to claim 6, which is characterized in that in the material of first encapsulated layer
Do not include second derivative, the mass percent of the second derivative described in the material of second encapsulated layer is 10%-
20%, the mass percent of second derivative described in the material of the third encapsulated layer is 20%-30%.
8. the packaging method of display panel according to claim 1, which is characterized in that each encapsulated layer of heating,
And apply pressure to the first substrate and/or the second substrate, it specifically includes：
When the heating temperature respectively reaches the fusing point of each encapsulated layer, respectively to the first substrate and/or described
Two substrates apply different pressure, wherein the pressure applied when reaching compared with low melting point applies when being less than reached higher melt
Pressure.
9. according to the packaging method of claim 1-8 any one of them display panels, which is characterized in that the heating is each described
Encapsulated layer, and after applying pressure to the first substrate and/or the second substrate, the method further includes：
Using each encapsulated layer of ultraviolet light, so that each encapsulated layer is converted to solid-state from liquid.
10. the packaging method of display panel according to claim 9, which is characterized in that the material of the encapsulated layer includes
Epoxide resin material.
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020118626A1 (en) * | 2018-12-13 | 2020-06-18 | 深圳市柔宇科技有限公司 | Flexible display panel and flexible display apparatus |
| WO2021051494A1 (en) * | 2019-09-16 | 2021-03-25 | 深圳市华星光电半导体显示技术有限公司 | Color film substrate, display panel and preparation method therefor |
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| CN108470850B (en) | 2019-10-01 |
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