CN108417568B - Area light source for LED illumination - Google Patents
Area light source for LED illumination Download PDFInfo
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- CN108417568B CN108417568B CN201810179815.9A CN201810179815A CN108417568B CN 108417568 B CN108417568 B CN 108417568B CN 201810179815 A CN201810179815 A CN 201810179815A CN 108417568 B CN108417568 B CN 108417568B
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- fluorescent glass
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- 238000005286 illumination Methods 0.000 title claims abstract description 10
- 239000011521 glass Substances 0.000 claims abstract description 54
- 239000000853 adhesive Substances 0.000 claims abstract description 34
- 230000001070 adhesive effect Effects 0.000 claims abstract description 34
- 239000011347 resin Substances 0.000 claims abstract description 20
- 229920005989 resin Polymers 0.000 claims abstract description 20
- 150000004696 coordination complex Chemical class 0.000 claims abstract description 16
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 abstract description 8
- 239000003292 glue Substances 0.000 abstract description 6
- 238000000034 method Methods 0.000 abstract description 3
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0756—Stacked arrangements of devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides a surface light source for LED illumination, which utilizes upper and lower fluorescent glasses to carry out upper and lower contraposition of an LED chip, and utilizes solder to realize mutual series connection of the upper and lower LED chips, and has simple steps and extremely low cost; the resin adhesive containing the metal complex is used as an adhesive to glue the upper and lower fluorescent glasses, and the hemispherical concave hole realizes large-angle light emission; the electrode plate is inserted between the electrodes of the upper LED chip and the lower LED chip, when one LED chip is broken, the metal complex in the area is activated by laser to repair the whole series-connected LED passage, and the LED repairing method is convenient and feasible.
Description
Technical Field
The invention relates to the field of LED packaging, in particular to a surface light source for LED illumination.
Background
LED packages often require complex processes and materials, are relatively large in cost and size, and the realization of multiple light extraction from LED packages is now a trend sought by the skilled artisan.
Disclosure of Invention
In order to solve the above problems, the present invention provides a surface light source for LED lighting, which includes a first fluorescent glass, a second fluorescent glass, and an insulating adhesive between the first fluorescent glass and the second fluorescent glass, wherein the first fluorescent glass and the second fluorescent glass have the same size and shape, and the first fluorescent glass is stacked on the second fluorescent glass; a plurality of first grooves which are arranged in an array manner are arranged on the first surface of the first fluorescent glass, a plurality of second grooves which are arranged in an array manner are arranged on the second surface of the second fluorescent glass, a plurality of first LED chips are arranged in the plurality of first grooves, and a plurality of second LED chips are arranged in the plurality of second grooves; each of the plurality of first LED chips and the plurality of second LED chips is a flip-chip LED chip, and each of the plurality of first LED chips and the plurality of second LED chips includes a positive electrode and a negative electrode, the positive electrode and the negative electrode protrude from the plurality of first grooves or the plurality of second grooves, the plurality of second LED chips and the plurality of second LED chips are arranged in a staggered manner and partially overlapped manner from top to bottom, and when viewed from top, the first LED chips and the second LED chips are integrally arranged in an S-shape, so that the positive electrode of the first LED chip is electrically connected with the negative electrode of the second LED chip through solder, the negative electrode of the first LED chip is electrically connected with the positive electrode of the second LED chip through solder, the solder is covered by the insulating adhesive, and the partially overlapped portion is an electrode portion of the first LED chip and the second LED chip; and a plurality of hemispherical concave holes arranged in an array manner are arranged on the bottom surfaces of the first grooves and the second grooves.
The invention also provides another area light source for LED illumination, which comprises first fluorescent glass, second fluorescent glass and resin adhesive which is arranged between the first fluorescent glass and the second fluorescent glass and contains laser-activated metal complex, wherein the first fluorescent glass and the second fluorescent glass have the same size and shape, and the first fluorescent glass is superposed on the second fluorescent glass; a plurality of first grooves which are arranged in an array manner are arranged on the first surface of the first fluorescent glass, a plurality of second grooves which are arranged in an array manner are arranged on the second surface of the second fluorescent glass, a plurality of first LED chips are arranged in the plurality of first grooves, and a plurality of second LED chips are arranged in the plurality of second grooves; each of the first LED chips and the second LED chips is a flip LED chip and comprises a positive electrode and a negative electrode, the positive electrode and the negative electrode protrude from the first grooves or the second grooves, the first LED chips and the second LED chips are arranged in a staggered manner and partially overlapped manner, and when viewed from top, the first LED chips and the second LED chips are integrally arranged in an S shape, so that the positive electrode of the first LED chip is electrically connected with the negative electrode of the second LED chip through an electrode plate, the negative electrode of the first LED chip is electrically connected with the positive electrode of the second LED chip through an electrode plate, the electrode plate is coated by the resin adhesive, and the partially overlapped part is an electrode part of the first LED chip and the second LED chip; and a plurality of hemispherical concave holes arranged in an array manner are arranged on the bottom surfaces of the first grooves and the second grooves.
According to the embodiment of the invention, the length and width dimensions of the plurality of first grooves and the plurality of second grooves are consistent with the length and width dimensions of the plurality of first LED chips and the plurality of second LED chips.
According to an embodiment of the present invention, the plurality of first LED chips and the plurality of second LED chips are fixed on bottom surfaces of the plurality of first grooves and the plurality of second grooves by a transparent adhesive, and the transparent adhesive fills the plurality of hemispherical recesses.
According to the embodiment of the invention, the LED lamp further comprises leading-out terminals which are electrically connected with the first LED chips and the second LED chips at the tail ends, wherein the leading-out terminals are linear, one end of each leading-out terminal is inserted into the insulating adhesive glue, and the other end of each leading-out terminal extends out of the insulating adhesive glue.
According to the embodiment of the invention, the LED chip structure further comprises leading-out terminals electrically connected with the first LED chips and the second LED chips at the tail ends, wherein the leading-out terminals are L-shaped, the short sides of the leading-out terminals are inserted into the resin adhesive of the laser activatable metal complex and are opposite to the electrode slice, and the long sides of the leading-out terminals extend out of the resin adhesive of the laser activatable metal complex.
According to the embodiment of the invention, one of the first LED chips and the second LED chips is a damaged LED chip, a conductive path electrically connecting two electrode pads on the positive electrode and the negative electrode of the damaged LED chip is formed in the resin adhesive at a position corresponding to the damaged LED chip, and the conductive path is a metal conductive path formed by irradiating the resin adhesive at a position corresponding to the damaged LED chip with a laser beam to activate a laser-activatable metal complex therein.
The invention has the following advantages:
(1) the upper and lower fluorescent glasses are used for carrying out upper and lower contraposition on the LED chips, and the upper and lower LED chips are mutually connected in series by using the solder, so that the steps are simple, and the cost is extremely low;
(2) the resin adhesive containing the metal complex is used as an adhesive to glue the upper and lower fluorescent glasses, and the hemispherical concave hole realizes large-angle light emission;
(3) the electrode plate is inserted between the electrodes of the upper LED chip and the lower LED chip, when one LED chip is broken, the metal complex in the area is activated by laser to repair the whole series-connected LED passage, and the LED repairing method is convenient and feasible.
Drawings
Fig. 1 is a sectional view of a surface light source for LED illumination of a first embodiment;
fig. 2 is a plan view of a surface light source for LED illumination of the first embodiment;
fig. 3 is a sectional view of a surface light source for LED illumination of a second embodiment;
fig. 4 is a schematic diagram of a surface light source for LED lighting forming a conductive path according to a second embodiment.
Detailed Description
First embodiment
Referring to fig. 1-2, a surface light source for LED lighting of a first embodiment includes a first fluorescent glass 1, a second fluorescent glass 2, and an insulating adhesive 7 interposed between the first fluorescent glass 1 and the second fluorescent glass 2, the first fluorescent glass 1 and the second fluorescent glass 2 having the same size and shape, the first fluorescent glass 1 being stacked on the second fluorescent glass 2; a plurality of first grooves 3a arranged in an array manner are arranged on the first surface of the first fluorescent glass 1, a plurality of second grooves 3b arranged in an array manner are arranged on the second surface of the second fluorescent glass 2 (see fig. 2), a plurality of first LED chips 5a are arranged in the plurality of first grooves 3a, and a plurality of second LED chips 5b are arranged in the plurality of second grooves 3 b; each of the plurality of first LED chips 5a and the plurality of second LED chips 5b is a flip LED chip, and each includes a positive electrode 9 and a negative electrode 10, the positive electrode 9 and the negative electrode 10 are protruded from the plurality of first grooves 3a or the plurality of second grooves 3b, the plurality of first LED chips 5a and the plurality of second LED chips 5b are arranged in a staggered and partially overlapping manner from top to bottom, and when viewed from above, the first LED chips 5a and the second LED chips 5b are arranged in an S-shape as a whole, so that the positive electrode of the first LED chip 5a and the negative electrode of the second LED chip 5b are electrically connected by the solder 8, the negative electrode of the first LED chip 5a and the positive electrode of the second LED chip 5b are electrically connected by the solder 8, the solder 8 is coated by the insulating adhesive 7, and the partially overlapped portions are electrode portions of the first LED chip 5a and the second LED chip 5 b; a plurality of hemispherical concave holes 4 arranged in an array manner are arranged on the bottom surfaces of the first grooves 3a and the second grooves 3 b. The length and width dimensions of the first and second grooves 3a and 3b are identical to those of the first and second LED chips 5a and 5 b.
The plurality of first LED chips 5a and the plurality of second LED chips 5b are fixed on the bottom surfaces of the plurality of first grooves 3a and the plurality of second grooves 3b by a transparent adhesive 6, and the transparent adhesive 6 fills the plurality of hemispherical recesses 4.
The LED lamp also comprises leading-out terminals 11 and 12 which are used for electrically connecting the first LED chips 5a and the second LED chips 5b at the tail ends, wherein the leading-out terminals 11 and 12 are linear, one end of each leading-out terminal is inserted into the insulating adhesive glue 7, and the other end of each leading-out terminal extends out of the insulating adhesive glue 7.
Second embodiment
The surface light source of the first embodiment can prevent the whole LED lamp string from being used when the surface light source has damaged LED chips, and the second embodiment can avoid the defect. Referring specifically to fig. 3 to 4, the surface light source for LED illumination of the second embodiment includes a first fluorescent glass 1, a second fluorescent glass 2, and a resin adhesive 17 containing a laser-activatable metal complex interposed between the first fluorescent glass 1 and the second fluorescent glass 2, wherein the first fluorescent glass 1 and the second fluorescent glass 2 have the same size and shape, and the first fluorescent glass 1 is stacked on the second fluorescent glass 2; a plurality of first grooves 3a arranged in an array manner are formed in the first surface of the first fluorescent glass 1, a plurality of second grooves 3b arranged in an array manner are formed in the second surface of the second fluorescent glass 2, a plurality of first LED chips 5a are arranged in the plurality of first grooves 3a, and a plurality of second LED chips 5b are arranged in the plurality of second grooves 3 b; each of the plurality of first LED chips 5a and the plurality of second LED chips 5b is a flip LED chip, and each includes a positive electrode 9 and a negative electrode 10, the positive electrode 9 and the negative electrode 10 are protruded from the plurality of first grooves 3a or the plurality of second grooves 3b, the plurality of first LED chips 5a and the plurality of second LED chips 5b are arranged in a staggered and partially overlapping manner from top to bottom, and when viewed from above, the first LED chips 5a and the second LED chips 5b are arranged in an S-shape as a whole, so that the positive electrode of the first LED chip 5a and the negative electrode of the second LED chip 5b are electrically connected through the electrode tab 13, the negative electrode of the first LED chip 5a and the positive electrode of the second LED chip 5b are electrically connected through the electrode tab 13, the electrode tab 13 is covered by the resin adhesive 17, and the partially overlapped portions are electrode portions of the first LED chip 5a and the second LED chip 5 b; a plurality of hemispherical concave holes 4 arranged in an array manner are arranged on the bottom surfaces of the first grooves 3a and the second grooves 3 b. The length and width dimensions of the first and second grooves 3a and 3b are identical to those of the first and second LED chips 5a and 5 b.
The plurality of first LED chips 5a and the plurality of second LED chips 5b are fixed on the bottom surfaces of the plurality of first grooves 3a and the plurality of second grooves 3b by a transparent adhesive 6, and the transparent adhesive 6 fills the plurality of hemispherical recesses 4.
According to the embodiment of the present invention, the LED-out terminals 11a and 12a of the first LED chips 5a and the second LED chips 5b electrically connected to the ends are further included, the LED-out terminals 11a and 12a are L-shaped, the short sides thereof are inserted into the resin paste 17 of the laser-activatable metal complex and are opposed to the electrode pad 13, and the long sides thereof protrude outside the resin paste 17 of the laser-activatable metal complex.
Referring to fig. 4, when one LED chip 14 of the first LED chips 5a and the second LED chips 5b is a damaged LED chip 14, a conductive path 16 electrically connecting two electrode pads 13 on the positive and negative electrodes of the damaged LED chip is formed in a resin paste 17 at a position corresponding to the damaged LED chip 14, and the conductive path 16 is a metal conductive path formed by irradiating the resin paste 17 at a position corresponding to the damaged LED chip 14 with a laser beam 18 to activate a laser-activatable metal complex inside the conductive path.
Finally, it should be noted that: it should be understood that the above examples are only for clearly illustrating the present invention and are not intended to limit the embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. And obvious variations or modifications of the invention may be made without departing from the scope of the invention.
Claims (5)
1. An area light source for LED illumination, comprising a first fluorescent glass, a second fluorescent glass and a resin adhesive containing a laser-activatable metal complex interposed between the first fluorescent glass and the second fluorescent glass, the first fluorescent glass and the second fluorescent glass having the same size and shape, the first fluorescent glass being superposed on the second fluorescent glass; a plurality of first grooves which are arranged in an array manner are arranged on the first surface of the first fluorescent glass, a plurality of second grooves which are arranged in an array manner are arranged on the second surface of the second fluorescent glass, a plurality of first LED chips are arranged in the plurality of first grooves, and a plurality of second LED chips are arranged in the plurality of second grooves; each of the first LED chips and the second LED chips is a flip LED chip and comprises a positive electrode and a negative electrode, the positive electrode and the negative electrode protrude from the first grooves or the second grooves, the first LED chips and the second LED chips are arranged in a staggered manner and partially overlapped manner, and when viewed from top, the first LED chips and the second LED chips are integrally arranged in an S shape, so that the positive electrode of the first LED chip is electrically connected with the negative electrode of the second LED chip through an electrode plate, the negative electrode of the first LED chip is electrically connected with the positive electrode of the second LED chip through an electrode plate, the electrode plate is coated by the resin adhesive, and the partially overlapped part is an electrode part of the first LED chip and the second LED chip; and a plurality of hemispherical concave holes arranged in an array manner are arranged on the bottom surfaces of the first grooves and the second grooves.
2. The surface light source for LED lighting according to claim 1, wherein: the length and width dimensions of the first grooves and the second grooves are consistent with the length and width dimensions of the first LED chips and the second LED chips.
3. The surface light source for LED lighting according to claim 2, wherein: the first LED chips and the second LED chips are fixed on the bottom surfaces of the first grooves and the second grooves through transparent adhesives, and the transparent adhesives are filled in the hemispherical concave holes.
4. The surface light source for LED lighting according to claim 1, wherein: the LED chip structure is characterized by further comprising a plurality of leading-out terminals which are electrically connected with the tail ends and are used for connecting the first LED chips and the second LED chips, wherein the leading-out terminals are L-shaped, the short sides of the leading-out terminals are inserted into the resin adhesive of the laser activatable metal complex and are opposite to the electrode plate, and the long sides of the leading-out terminals extend out of the resin adhesive of the laser activatable metal complex.
5. The surface light source for LED lighting according to claim 1, wherein: one LED chip in the first LED chips and the second LED chips is a damaged LED chip, a conductive path electrically connected with two electrode plates on the positive electrode and the negative electrode of the damaged LED chip is formed in the resin adhesive at the corresponding position of the damaged LED chip, and the conductive path is a metal conductive path formed by irradiating the resin adhesive at the corresponding position of the damaged LED chip with laser beams to activate a laser-activatable metal complex inside the conductive path.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810179815.9A CN108417568B (en) | 2018-03-05 | 2018-03-05 | Area light source for LED illumination |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810179815.9A CN108417568B (en) | 2018-03-05 | 2018-03-05 | Area light source for LED illumination |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108417568A CN108417568A (en) | 2018-08-17 |
| CN108417568B true CN108417568B (en) | 2020-04-21 |
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|---|---|---|---|
| CN201810179815.9A Active CN108417568B (en) | 2018-03-05 | 2018-03-05 | Area light source for LED illumination |
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Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109461724A (en) * | 2018-11-14 | 2019-03-12 | 佛山市国星半导体技术有限公司 | A kind of polycrystal string high voltage LED chip |
| CN111477659B (en) * | 2020-04-15 | 2022-12-16 | 东莞市兴展光电科技有限公司 | Flexible display panel and repairing method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203800084U (en) * | 2014-03-06 | 2014-08-27 | 晶科电子（广州）有限公司 | Three-dimensional luminous LED device |
| CN105161608A (en) * | 2015-07-03 | 2015-12-16 | 山东浪潮华光光电子股份有限公司 | LED lamp filament illuminating strip and preparation method therefor |
| CN106298754A (en) * | 2016-09-30 | 2017-01-04 | 鸿利智汇集团股份有限公司 | The manufacture method of a kind of CSP lamp bead and CSP lamp bead |
| CN106531731A (en) * | 2016-12-07 | 2017-03-22 | 鸿利智汇集团股份有限公司 | Stentless LED packaging structure and manufacturing method thereof |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5287643B2 (en) * | 2009-09-29 | 2013-09-11 | 豊田合成株式会社 | Optical device manufacturing method and optical device |
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2018
- 2018-03-05 CN CN201810179815.9A patent/CN108417568B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203800084U (en) * | 2014-03-06 | 2014-08-27 | 晶科电子（广州）有限公司 | Three-dimensional luminous LED device |
| CN105161608A (en) * | 2015-07-03 | 2015-12-16 | 山东浪潮华光光电子股份有限公司 | LED lamp filament illuminating strip and preparation method therefor |
| CN106298754A (en) * | 2016-09-30 | 2017-01-04 | 鸿利智汇集团股份有限公司 | The manufacture method of a kind of CSP lamp bead and CSP lamp bead |
| CN106531731A (en) * | 2016-12-07 | 2017-03-22 | 鸿利智汇集团股份有限公司 | Stentless LED packaging structure and manufacturing method thereof |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20200325 Address after: 200030 building 26, No. 1000, Jinhai Road, Pudong New Area, Shanghai Applicant after: SHANGHAI WELLMAX LIGHTING INDUSTRY Co.,Ltd. Address before: 262500 Shandong city of Weifang province Qingzhou City Road No. 8979 Weifang yunmenshan engineering Career Academy Applicant before: Sun Aifen |
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