CN108389808A - Silicon chip sorting machine - Google Patents
Silicon chip sorting machine Download PDFInfo
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- CN108389808A CN108389808A CN201810365065.4A CN201810365065A CN108389808A CN 108389808 A CN108389808 A CN 108389808A CN 201810365065 A CN201810365065 A CN 201810365065A CN 108389808 A CN108389808 A CN 108389808A
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- silicon chip
- light source
- pipeline
- camera
- sorting machine
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 184
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 184
- 239000010703 silicon Substances 0.000 title claims abstract description 184
- 238000001514 detection method Methods 0.000 claims abstract description 99
- 239000000463 material Substances 0.000 claims description 23
- 238000001179 sorption measurement Methods 0.000 claims description 10
- 230000007423 decrease Effects 0.000 claims description 9
- 230000000977 initiatory effect Effects 0.000 claims description 7
- 230000005540 biological transmission Effects 0.000 claims description 5
- 230000000630 rising effect Effects 0.000 claims description 4
- 238000005286 illumination Methods 0.000 claims description 3
- 230000001360 synchronised effect Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims description 2
- 230000002045 lasting effect Effects 0.000 claims 1
- 239000007787 solid Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 230000000694 effects Effects 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910002027 silica gel Inorganic materials 0.000 description 6
- 239000000741 silica gel Substances 0.000 description 6
- 229960001866 silicon dioxide Drugs 0.000 description 6
- 230000035945 sensitivity Effects 0.000 description 4
- 230000006978 adaptation Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67271—Sorting devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Sorting Of Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses a kind of silicon chip sorting machines, belong to solar battery sheet technical field.The silicon chip sorting machine further includes at least two in appearance and size detection device, subfissure detection device, dirty detection device, thickness detection apparatus, P/N type detection devices, wherein：Whether the appearance and size detection device, the appearance and size for detecting the silicon chip conveyed on the pipeline are qualified；The subfissure detection device is split on the silicon chip with the presence or absence of hidden for detecting；The dirty detection device, with the presence or absence of dirty on the surface for detecting the silicon chip；Whether the thickness detection apparatus, the thickness for detecting the silicon chip are qualified；The P/N types detection device is p-type or N-type for detecting the silicon chip.The present invention solve the problems, such as in the related technology silicon chip sorting machine be typically only capable to complete individual event detection lead to low production efficiency, achieved the effect that improve solar battery sheet production efficiency.
Description
Technical field
The present invention relates to solar battery sheet technical field, more particularly to a kind of silicon chip sorting machine.
Background technology
It in the production process of solar battery sheet, needs that silicon rod is first cut into silicon chip, then to Wafer Cleaning, cleaning
It needs to carry out multinomial detection to silicon chip after the completion, such as may include dirty surface, thickness, size and the hidden detection split.
Traditional silicon chip sorting machine is typically only capable to complete individual event detection, automatic without being formed between conveying and detection
It works continuously, leads to low production efficiency.
Invention content
In order to solve the problems, such as in the prior art silicon chip sorting machine be typically only capable to complete individual event detection lead to low production efficiency,
An embodiment of the present invention provides a kind of silicon chip sorting machine, which further includes appearance and size detection device, hidden splits detection
At least two in device, dirty detection device, thickness detection apparatus, P/N type detection devices, wherein：
Whether the appearance and size detection device, the appearance and size for detecting the silicon chip conveyed on the pipeline close
Lattice；
The subfissure detection device is split on the silicon chip with the presence or absence of hidden for detecting；
The dirty detection device, with the presence or absence of dirty on the surface for detecting the silicon chip；
Whether the thickness detection apparatus, the thickness for detecting the silicon chip are qualified；
The P/N types detection device is p-type or N-type for detecting the silicon chip.
By providing a kind of silicon chip sorting machine, which further includes appearance and size detection device, hidden splits detection dress
Set, at least two in dirty detection device, thickness detection apparatus, P/N type detection devices, solve silicon chip point in the prior art
It selects machine to be typically only capable to complete the problem of individual event detection leads to low production efficiency, has reached the production efficiency for improving solar battery sheet
Effect.
Optionally, the appearance and size detection device includes first camera, first light source, first light source cover and first camera
Cover, wherein：
The interior bottom portion in the first light source cover is arranged in the first light source, and the both sides of the first light source cover offer
Can make the pipeline above the first light source by opening；
The first camera cover is located at the top of the first light source cover, and the first camera is set to the first camera
The inside of cover；
The first camera is used for being taken pictures by the silicon chip above the first light source, and the first camera is taken pictures
Obtained image is for determining whether the appearance and size of the silicon chip is qualified.
The first camera cover that first camera is surrounded by being configured to first camera configures to first light source and surrounds first light source
First light source cover, to improve the quality of taking pictures of first camera.
Optionally, the dirty detection device includes second camera, second light source, second light source cover, third camera, third
Light source and third light source cover, wherein：
The interior bottom portion in the second light source cover is arranged in the second light source, and the second light source cover is located at the conveying
The lower section of line, the second camera are located at the top of the second light source cover, the pipeline, and the second camera is used for logical
The upper surface for the silicon chip crossed above the second light source is taken pictures, and the image that the second camera is taken pictures is for determining institute
Upper surface is stated with the presence or absence of dirty；
The interior bottom portion in the third light source cover is arranged in the third light source, and the third light source cover is located at the conveying
The top of line, the third camera are located at the lower section of the third light source cover, the pipeline, and the third camera is used for logical
The lower surface for the silicon chip crossed below the third light source is taken pictures, and the image that the third camera is taken pictures is for determining institute
Lower surface is stated with the presence or absence of dirty.
It takes pictures to the upper surface by the silicon chip above second light source by using second camera, utilizes third camera
It takes pictures to the lower surface of the silicon chip below third light source, to complete the dirty detection upper and lower surfaces of of a silicon chip.
Optionally, the thickness detection apparatus include first on light source, first time light source, the first side light source, the 4th camera,
First prism and the second prism, wherein：
Light source is located above the side of the pipeline on described first, and first time light source is located under the side
Side, the 4th camera are located at the side of the 4th camera towards the side, first side light source；
First prism is located on described first between light source, the pipeline, and second prism is located at described the
Once between light source, the pipeline,
Light source, first time light source and first side light source are used to provide light for the first silicon chip on described first
According to first silicon chip is the silicon chip of the 4th camera direction on the pipeline；The upper surface of first silicon chip is reflected
Light out is by first prismatic reflection to the 4th camera, light that the lower surface of first silicon chip reflects
Line passes through on second prismatic reflection to the 4th camera.
Optionally, the silicon chip sorting machine further includes feeding device, and the feeding device includes to be sorted for loading
The material basket of silicon chip and mobile mechanism, wherein：
It is described during the mobile mechanism drives the material basket above the conveying initiating terminal of the pipeline to decline
The conveying of the lower surface for expecting the silicon chip that basket loads and the pipeline originates end in contact, and the pipeline drives the material basket to load
Silicon chip be detached from the material basket to the pipeline and conveyed, to complete the automatic charging of silicon chip.
Optionally, the pipeline includes two the first belt conveyors of Synchronous Transmission, and the silicon chip sorting machine further includes
Rotating mechanism below the pipeline, the rotating mechanism include for carrying the rotating platform of silicon chip, the first lifting
Motor and electric rotating machine, wherein：
During first lifting motor drives the rotating platform to rise, the rotating platform passes through described two
Between first belt conveyor and the second silicon chip is driven to be detached from the pipeline, second silicon chip is positioned at the rotating platform
The silicon chip of top；
After second silicon chip is detached from the pipeline, the electric rotating machine drives the rotating platform to rotate predetermined angular
Make predetermined angular described in second silicon slice rotating, first lifting motor that the rotating platform decline be driven to make described second
Silicon chip is detached from the rotating platform and falls on the pipeline.
Since one group of thickness detection apparatus can only be to carrying out Thickness sensitivity on silicon chip with two sides of conveying direction.In order to
To the Thickness sensitivity of two other side, rotating mechanism is set between this two groups of thickness detection apparatus, and rotating mechanism is used for will
Silicon slice rotating degree on pipeline.
Optionally, be provided at least one adsorption hole on the rotating platform, the adsorption hole and the air-flow of lower section one
Chamber is connected, and the lower end of the air flow chamber is provided with air inlet and gas outlet, and the bore of the air inlet is more than the air inlet
Bore, the air inlet is connected with inflatable body, wherein：
During the electric rotating machine drives the rotating platform rotation predetermined angular, the inflatable body to it is described into
Gas port is persistently blown, and the rotating platform is enable to adsorb second silicon chip.
Optionally, the upper surface of the rotating platform is provided with silicagel pad, the shape of the silicagel pad and rotating platform
The shape of upper surface is identical, avoids rotating platform from drawing and splits silicon chip；The upper surface of the silicagel pad is provided with non-slip texture, to improve
The adsorption capacity of rotating platform.
Optionally, the P/N types detection device includes telescopic first detector and telescopic second detector, institute
The lower section that the first detector is located at the pipeline is stated, second detector is located at the top of first detector.
Optionally, the silicon chip sorting machine further includes at least one stepping mechanism and at least one rewinding box, the stepping
Mechanism is located at the lower section of the pipeline, and the rewinding box is located at the side of the pipeline, wherein：
The stepping mechanism includes, stepper motor and the second lifting motor, the conveying direction of second belt conveyor with
The conveying direction of the pipeline is vertical；
For second lifting motor for driving second belt conveyor to rise or fall, the stepper motor drives institute
The second belt conveyor is stated for being driven；
It is described when second lifting motor drives the second belt conveyor rising and the lower surface of third silicon chip to contact
Stepper motor drives the second belt conveyor transmission, so that the third silicon chip is transported in the rewinding box, the third
Silicon chip is the silicon chip above second belt conveyor.
Optionally, the stepping mechanism further includes eccentric wheel and connecting rod, wherein：
Second lifting motor is mechanically connected with the eccentric wheel, the turning end of the eccentric wheel and the one of the connecting rod
End is fixedly connected, and the other end of the connecting rod is fixedly connected with the mounting base of second belt conveyor.
Description of the drawings
To describe the technical solutions in the embodiments of the present invention more clearly, make required in being described below to embodiment
Attached drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the invention, for
For those of ordinary skill in the art, without creative efforts, other are can also be obtained according to these attached drawings
Attached drawing.
Fig. 1 is a kind of structural schematic diagram of silicon chip sorting machine shown in an exemplary embodiment of the invention；
Fig. 2 is a kind of structural schematic diagram of the feeding device provided in one embodiment of the invention；
Fig. 3 is a kind of structural schematic diagram of the appearance and size detection device provided in one embodiment of the invention；
Fig. 4 is a kind of structural schematic diagram of the subfissure detection device provided in one embodiment of the invention；
Fig. 5 is a kind of structural schematic diagram of the dirty detection device provided in one embodiment of the invention；
Fig. 6-1 is a kind of structural schematic diagram of the thickness detection apparatus provided in one embodiment of the invention；
Fig. 6-2 is the third prism provided in one embodiment of the invention, the schematic diagram of the 4th prism；
Fig. 7 is a kind of structural schematic diagram of the rotating mechanism provided in one embodiment of the invention；
Fig. 8 is a kind of structural schematic diagram of the P/N types detection device provided in one embodiment of the invention；
Fig. 9 is a kind of structural schematic diagram of the stepping mechanism provided in one embodiment of the invention；
Figure 10 is the schematic diagram of eccentric wheel and connecting rod in a kind of stepping mechanism provided in one embodiment of the invention.
Specific implementation mode
To make the object, technical solutions and advantages of the present invention clearer, below in conjunction with attached drawing to embodiment party of the present invention
Formula is described in further detail.
An embodiment of the present invention provides a kind of silicon chip sorting machines, which includes pipeline, the silicon chip sorting machine
Further include in appearance and size detection device, subfissure detection device, dirty detection device, thickness detection apparatus, P/N type detection devices
At least two, wherein：
Whether appearance and size detection device, the appearance and size for detecting the silicon chip conveyed on pipeline are qualified；
Subfissure detection device is split on silicon chip with the presence or absence of hidden for detecting；
Dirty detection device, with the presence or absence of dirty on the surface for detecting silicon chip；
Whether thickness detection apparatus, the thickness for detecting silicon chip are qualified；
P/N type detection devices are p-type or N-type for detecting silicon chip.
By inventive embodiments by a kind of silicon chip sorting machine of offer, which further includes appearance and size detection dress
Set, at least two in subfissure detection device, dirty detection device, thickness detection apparatus, P/N type detection devices, solve existing
There is silicon chip sorting machine in technology to be typically only capable to complete the problem of individual event detection leads to low production efficiency, has reached raising solar-electricity
The effect of the production efficiency of pond piece.
For example, as shown in Figure 1, Fig. 1 is a kind of knot of silicon chip sorting machine shown in an exemplary embodiment of the invention
Structure schematic diagram.As shown in Figure 1, the silicon chip sorting machine includes pipeline 10, appearance and size detection device 20, subfissure detection device
30, dirty detection device 40 and thickness detection apparatus 50.
Optionally, pipeline 10 includes two the first belt conveyors of Synchronous Transmission, this two the first belt conveyor difference
Two conveying initiating terminals for carrying a silicon chip.
Optionally, as shown in Figure 1, the silicon chip sorting machine further includes feeding device 11, feeding device 11 is for removing silicon chip
It is transported on pipeline 10 and completes feeding.
As shown in Fig. 2, in a kind of possible embodiment, feeding device 11 includes for loading silicon chip to be sorted
Expect that basket 111 and mobile mechanism 112, the bottom end of material basket 111 are connected with the holder 113 of mobile mechanism 112；112 energy of mobile mechanism
It is enough that material basket 111 is driven to rise or fall.
If fruit basket 111 is located at the top of the conveying initiating terminal of pipeline 10, then mobile mechanism 112 drives under material basket 111
Make the lower surface of the silicon chip loaded on material basket 111 with the conveying starting end in contact of pipeline 10 during drop, to pipeline
10, which drive the silicon chip loaded on material basket 111 to be detached from the material basket 111 to pipeline 10, is conveyed, after so that the silicon chip is transported to
Continuous process is detected.Subsequent handling said here may include appearance and size detection, hidden split detection, dirty detection, thickness
At least one of detection, the detection of P/N types etc..
It should be noted is that being more than for loading the distance between two load-bearing parts of a silicon chip on material basket 111
The width of pipeline 10, the two load-bearing parts are respectively used to carry the both ends of the silicon chip.
Further, at least one holder 113 is provided in mobile mechanism 112, the bottom end of material basket 111 may be mounted to that this
On holder 113.Optionally, at least two holders 113 are provided in mobile mechanism 112, mobile mechanism 112 can drive holder
Material basket 111 on 113 moves in the horizontal direction.Moving structure 112 drives the material above the conveying initiating terminal of pipeline 10
After the silicon chip that the decline of basket 111 makes the material basket 111 load all is transferred on pipeline 10, its 113 feeding of all holders is driven
A material basket 111 for being mounted with silicon chip is driven to be moved horizontally to the top of the conveying initiating terminal of pipeline 10 after the rising of basket 111, then
It is complete to repeat the silicon chip for driving the decline of the material basket 111 above the conveying initiating terminal of pipeline 10 that the material basket 111 is made to load
Portion is transferred to the step on pipeline 10, with constantly to 10 feeding of pipeline (that is, silicon chip).
As shown in figure 3, in a kind of possible embodiment, appearance and size detection device 20 includes first camera 21, the
One light source 22, first light source cover 23 and first camera cover 24, wherein：The inner bottom in first light source cover 23 is arranged in first light source 22
Portion, the both sides of first light source cover 23 offer can make pipeline 10 above first light source 22 by opening；First camera
For 21 covers positioned at the top of first light source cover 23, first camera 21 is set to the inside of the cover of first camera 21.First camera 21 is used for
It takes pictures to the silicon chip by 22 top of first light source, the image that first camera 21 is taken pictures is used to determine the outer of the silicon chip
Whether shape size is qualified.
The first camera cover 24 that first camera 21 is surrounded by being configured to first camera 21 is surrounded to the configuration of first light source 22
The first light source cover 23 of first light source 22, to improve the quality of taking pictures of first camera 21.Silicon chip sorting machine can be according to the first phase
The image that machine 21 is shot determines the size of the silicon chip shot in the image.
As shown in figure 4, in a kind of possible embodiment, subfissure detection device 30 includes infrared camera 31 and infrared light
Source 32, infrared camera position 31 is in the top of pipeline 10.The silicon chip that infrared camera 31 is used to irradiate infrared light supply 32 is clapped
According to silicon chip sorting machine can be determined to split with the presence or absence of hidden in the silicon chip according to the infrared image that infrared camera 31 is shot.
The present embodiment is not especially limited the installation site of infrared light supply 32.Optionally, infrared light supply 32 can be located at
The lower section of pipeline 10.Optionally, infrared light supply 32 is located at the top of pipeline 10, then the image that infrared camera 31 is shot is should
Silicon chip reflects the infrared image of infrared ray.
As shown in figure 5, in a kind of possible embodiment, dirty detection device 40 includes second camera 41, the second light
Source (not shown), second light source cover 42, third camera 43, third light source (not shown) and third light source cover 44,
Wherein：
The interior bottom portion in second light source cover 42 is arranged in second light source, and second light source cover 42 is located at the lower section of pipeline 10,
Second camera 41 is located at the top of second light source cover 42, pipeline 10, and second camera 41 is used for above by second light source
It takes pictures the upper surface of silicon chip；Silicon chip sorting machine can determine the upper surface of the silicon chip according to the image that second camera 41 is shot
With the presence or absence of dirty, and determine stain type.
The interior bottom portion in third light source cover 44 is arranged in third light source, and third light source cover 44 is located at the top of pipeline 10,
Third camera 43 is located at the lower section of third light source cover 44, pipeline 10, and third camera 43 is used for below by third light source
It takes pictures the lower surface of silicon chip.Silicon chip sorting machine can determine the lower surface of the silicon chip according to the image that third camera 43 is shot
With the presence or absence of dirty, and determine stain type.
As in Figure 6-1, in a kind of possible embodiment, thickness detection apparatus 50 includes light source 51a, the on first
Once light source 52a, the first side light source 53a, the 4th camera 54a, the first prism (not shown) and the second prism (do not show in figure
Go out), wherein：
Light source 51a is located above the side of pipeline 10 on first, and first time light source 52a is located at the lower section of side, and the 4th
Camera 54a is located at the side of the 4th camera 54a towards side, the first side light source 53a；
As in fig. 6-2, the first prism 55a is located on first between light source 51a, pipeline 10, and the second prism 56a is located at
Between first time light source 52a, pipeline 10,
Light source 51a, first time light source 52a and the first side light source 53a are used to provide illumination for the first silicon chip on first,
First silicon chip is the silicon chip of the 4th camera 54a directions on pipeline 10；The light that the upper surface of first silicon chip reflects passes through
On first prismatic reflection to the 4th camera 54a, the light that the lower surface of the first silicon chip reflects passes through the second prismatic reflection to
On four camera 54a.
Optionally, the first prism 55a and the second prism 56a is right angle prism.
The first right-angle surface of first prism 55a is parallel to the plane where pipeline 10, the second right angle of the first prism 55a
Face is close to the 4th camera 54a settings；The first right-angle surface of second prism 56a is parallel to the plane where pipeline 10, the second rib
The second right-angle surface of mirror 56a is close to the 4th camera 54a settings.
The top of first prism 55 is less than the top of the 4th camera 54a, and the bottom end of the second prism 56a is higher than the 4th camera
The bottom end of 54a.The image of 4th camera 54a shootings is used to determine the thickness of the first silicon chip.
As in Figure 6-1, in a kind of possible embodiment, thickness detection apparatus 50 further include light source 51b on second,
Second time light source 52b, the second side light source 53b, the 5th camera 54b, third prism (not shown) and the 4th prism are (in figure not
Show), wherein：
Light source 51b is located above another side of pipeline 10 on second, and second time light source 52b is located at another side
Lower section, the 5th camera 54b are located at the side of the 5th camera 54b towards another side, the second side light source 53b；
Third prism is located on second between light source 51b, pipeline 10, and the 4th prism is located at second time light source 52b, conveying
Between line 10,
Light source 51b, second time light source 52b and the second side light source 53b are used to provide illumination for the first silicon chip on second；
The light that the upper surface of first silicon chip reflects is by third prismatic reflection to the 5th camera 54b, the following table of the first silicon chip
The light that face reflects is reflexed to by the 4th prism on the 5th camera 54b.
Optionally, third prism and the 4th prism are right angle prism.
First right-angle surface of third prism is parallel to the plane where pipeline 10, and the second right-angle surface of third prism is close
5th camera 54b settings；First right-angle surface of the 4th prism is parallel to the plane where pipeline 10, and the second of the 4th prism is straight
Edged surface is close to the 5th camera 54b settings.
The top of third prism is less than the top of the 5th camera 54b, and the bottom end of the 4th prism is higher than the bottom of the 5th camera 54b
End.The image of 5th camera 54b shootings is used to determine the thickness of the first silicon chip.
As shown in Figure 1, in a kind of possible embodiment, which includes two groups of thickness detection apparatus 50
And/or two groups of subfissure detection devices 30, the silicon chip sorting machine further include rotating mechanism 60, which is located at this two groups thickness
It spends between detection device 50 and/or between this two groups of subfissure detection devices 30, rotating mechanism 60 is located at 10 lower section of pipeline.
It should be noted is that one group of thickness detection apparatus 50 can only on silicon chip with two sides of conveying direction into
Row Thickness sensitivity.For the Thickness sensitivity to two other side, whirler is set between this two groups of thickness detection apparatus 50
Structure 60, rotating mechanism 60 are used for 90 degree of silicon slice rotating on pipeline 10.
In addition, one group of subfissure detection device 30 can only detect silicon chip whether there is hidden split in the conveying direction.In order to detect
Silicon chip in the Y direction with the presence or absence of hidden split by (direction vertical with conveying direction), is arranged between this two groups of subfissure detection devices 30
Rotating mechanism 60, rotating mechanism 60 are used for 90 degree of silicon slice rotating on pipeline 10.
As shown in fig. 7, in a kind of possible embodiment, rotating mechanism 60 includes the rotating platform for carrying silicon chip
61, the first lifting motor 62 and electric rotating machine 63, wherein：
First lifting motor 62 can drive electric rotating machine 63 and rotating platform 61 to rise or fall；
During first lifting motor 62 drives rotating platform 61 to rise, rotating platform 61 pass through two belt conveyors it
Between and drive the second silicon chip to be detached from pipeline 10, the second silicon chip is silicon chip above rotating platform 61.It needs to illustrate
Any is, during rotating platform 61 drives the second silicon chip to be detached from pipeline 10, the upper surface of rotating platform 61 and silicon chip
Lower surface contacts, and rotating platform 61 is held the silicon chip and risen to be detached from pipeline 10.
After second silicon chip is detached from pipeline 10, electric rotating machine 63, which drives rotating platform 61 to rotate predetermined angular, makes the second silicon chip
Predetermined angular is rotated, the first lifting motor 62 drives the decline of rotating platform 61 that the second silicon chip disengaging rotating platform 61 is made to fall and conveying
On line 10.Wherein, predetermined angular is usually 90 degree.
In a kind of possible embodiment, during electric rotating machine 63 drives rotating platform 61 to rotate predetermined angular,
Rotating platform 61 can adsorb the second silicon chip.Specifically, it is provided at least one adsorption hole on 61 rotating platform 61 of rotating platform,
Each adsorption hole is connected with an air flow chamber of lower section, and the lower end of air flow chamber is provided with air inlet and gas outlet, the air inlet
Bore be more than the bore of the air inlet, air inlet is connected with inflatable body, wherein：
During electric rotating machine 63 drives rotating platform 61 to rotate predetermined angular, inflatable body is persistently blown to air inlet
Gas enables rotating platform 61 to adsorb the second silicon chip.
Optionally, the upper surface of rotating platform 61 is provided with silicagel pad, edge shape and the rotating platform 61 of silicagel pad
The edge shape of upper surface is identical, is drawn to avoid rotating platform 61 and splits silicon chip.
Optionally, at least one hollow out is provided in silicagel pad, which is connected to adsorption hole.The gas come out from adsorption hole
Stream can reverberate in the space fallen in that engraved structure is formed with absorption platform, enhance between air-flow and the silicon chip adsorbed
Adsorption area, to enhance adsorption capacity.The present embodiment is illustrated in rotating platform 61 for circular platform, but not to rotating platform 61
Shape be specifically limited.
In a kind of possible embodiment, rotating mechanism 60 further includes driving motor 64, and driving motor 64 can drive
Rotating platform 61, the first lifting motor 62 and electric rotating machine 63 move simultaneously along the direction where pipeline 10.
As shown in Figure 1, silicon chip sorting machine includes P/N types detection device 70.As shown in figure 8, in a kind of possible embodiment party
In formula, including P/N types detection device 70 includes telescopic first detector 71 and telescopic second detector 72, the first inspection
Survey device 71 and be located at the lower section of pipeline 10, the second detector position 72 in the top of the first detector, wherein：
When silicon chip on pipeline 10 is transported between the first detector 71, the second detector 72, silicon chip sorting machine control
The decline of the second detector, the rising of the first detector 71 are made, the second detector 72 is made to compress the upper surface of the silicon chip, the first detector
71 contact the upper surface of the silicon chip, to complete the P/N types detection of the silicon chip, determine that the silicon chip belongs to p-type or N-type.
As shown in Figure 1, silicon chip sorting machine includes drawing mechanism 80.Drawing mechanism 80 is including at least one stepping mechanism and extremely
A few rewinding box, each stepping mechanism are located at the lower section of pipeline 10, and each rewinding box is located at the side of the pipeline 10,
Wherein：
As shown in figure 9, stepping mechanism includes the second belt conveyor 81, stepper motor 82 and the second lifting motor 83, second
The conveying direction of belt conveyor 81 is vertical with the conveying direction of pipeline 10；
Second lifting motor 83 is for driving the second belt conveyor 81 to rise or fall, and stepper motor 82 is for driving second
Belt conveyor 81 is driven；
When the lower surface of second belt conveyor 81 and third silicon chip contacts, stepper motor 82 drives the second belt conveyor 81 to pass
It is dynamic, so that third silicon chip is transported in rewinding box, third silicon chip is the silicon chip of 81 top of the second belt conveyor；
After the third silicon chip is transported in rewinding box, the second lifting motor 83 drives the second belt conveyor 81 to decline.
As shown in Figure 10, stepping mechanism includes eccentric wheel and connecting rod, wherein：Second lifting motor 83 and 84 machinery of eccentric wheel
Connection, the turning end of eccentric wheel are fixedly connected with one end of connecting rod 85, the installation of the other end of connecting rod and the second belt conveyor 81
Seat is fixedly connected.
Term " first ", " second " are used for description purposes only, and are not understood to indicate or imply relative importance or hidden
Quantity containing indicated technical characteristic.The feature of " first ", " second " that limit as a result, can express or implicitly include one
A or more this feature.In the description of the present invention, unless otherwise indicated, the meaning of " plurality " is two or two with
On.
Those skilled in the art will readily occur to other implementations of the present invention after considering specification and practice invention here
Scheme.This application is intended to cover any variations, uses, or adaptations of the present invention, these modifications, purposes or adaptations
Property variation follow the general principle of the present invention and include the common knowledge or usual in the art that is not directed to of the present invention
Technological means.The description and examples are only to be considered as illustrative, and true scope and spirit of the invention are wanted by following right
It asks and points out.
It should be understood that the invention is not limited in the precision architectures for being described above and being shown in the accompanying drawings, and
And various modifications and changes may be made without departing from the scope thereof.The scope of the present invention is limited only by the attached claims.
Claims (10)
1. a kind of silicon chip sorting machine, which is characterized in that the silicon chip sorting machine includes pipeline, and the silicon chip sorting machine further includes
In appearance and size detection device, subfissure detection device, dirty detection device, thickness detection apparatus, P/N type detection devices at least
Two kinds, wherein：
Whether the appearance and size detection device, the appearance and size for detecting the silicon chip conveyed on the pipeline are qualified；
The subfissure detection device is split on the silicon chip with the presence or absence of hidden for detecting；
The dirty detection device, with the presence or absence of dirty on the surface for detecting the silicon chip；
Whether the thickness detection apparatus, the thickness for detecting the silicon chip are qualified；
The P/N types detection device is p-type or N-type for detecting the silicon chip.
2. silicon chip sorting machine according to claim 1, which is characterized in that the appearance and size detection device includes the first phase
Machine, first light source, first light source cover and first camera cover, wherein：
The interior bottom portion in the first light source cover is arranged in the first light source, and the both sides of the first light source cover offer can
Make the pipeline above the first light source by opening；
The first camera cover is located at the top of the first light source cover, and the first camera is set to the first camera cover
It is internal；
The first camera is used for being taken pictures by the silicon chip above the first light source, and the first camera takes pictures to obtain
Image for determining whether the appearance and size of the silicon chip qualified.
3. silicon chip sorting machine according to claim 1, which is characterized in that the dirty detection device include second camera,
Second light source, second light source cover, third camera, third light source and third light source cover, wherein：
The interior bottom portion in the second light source cover is arranged in the second light source, and the second light source cover is located at the pipeline
Lower section, the second camera are located at the top of the second light source cover, the pipeline, and the second camera is used for passing through
The upper surface for stating the silicon chip above second light source is taken pictures, and the image that the second camera is taken pictures is described for determining
Surface is with the presence or absence of dirty；
The interior bottom portion in the third light source cover is arranged in the third light source, and the third light source cover is located at the pipeline
Top, the third camera are located at the lower section of the third light source cover, the pipeline, and the third camera is used for passing through
The lower surface for stating the silicon chip below third light source is taken pictures, the image that the third camera is taken pictures for determine it is described under
Surface is with the presence or absence of dirty.
4. silicon chip sorting machine according to claim 1, which is characterized in that the thickness detection apparatus includes the first glazing
Source, first time light source, the first side light source, the 4th camera, the first prism and the second prism, wherein：
Light source is located above the side of the pipeline on described first, and first time light source is located at the lower section of the side,
4th camera is located at the side of the 4th camera towards the side, first side light source；
First prism is located on described first between light source, the pipeline, and second prism is located under described first
Between light source, the pipeline,
Light source, first time light source and first side light source are used to provide illumination for the first silicon chip on described first,
First silicon chip is the silicon chip of the 4th camera direction on the pipeline；The upper surface of first silicon chip reflects
Light by first prismatic reflection to the 4th camera, the light that the lower surface of first silicon chip reflects is logical
It crosses on second prismatic reflection to the 4th camera.
5. silicon chip sorting machine according to claim 1, which is characterized in that the silicon chip sorting machine further includes feeding device,
The feeding device includes the material basket and mobile mechanism for loading silicon chip to be sorted, wherein：
During the mobile mechanism drives the material basket above the conveying initiating terminal of the pipeline to decline, the material basket
The conveying of the lower surface of the silicon chip of loading and the pipeline originates end in contact, and the pipeline drives the silicon that the material basket loads
Piece is detached from the material basket to the pipeline and is conveyed.
6. silicon chip sorting machine according to claim 1, which is characterized in that the pipeline includes two article of Synchronous Transmission
One belt conveyor, the silicon chip sorting machine further include the rotating mechanism being located at below the pipeline, and the rotating mechanism includes
Rotating platform, the first lifting motor and electric rotating machine for carrying silicon chip, wherein：
During first lifting motor drives the rotating platform to rise, the rotating platform passes through described two first
Between belt conveyor and the second silicon chip is driven to be detached from the pipeline, second silicon chip is above the rotating platform
Silicon chip；
After second silicon chip is detached from the pipeline, the electric rotating machine drives the rotating platform rotation predetermined angular to make institute
Predetermined angular described in the second silicon slice rotating is stated, first lifting motor drives the rotating platform decline to make second silicon chip
The rotating platform is detached to fall on the pipeline.
7. silicon chip sorting machine according to claim 6, which is characterized in that be provided at least one suction on the rotating platform
Attached hole, the adsorption hole with the air flow chamber of lower section one be connected, the lower end of the air flow chamber is provided with air inlet and gas outlet,
The bore of the air inlet is more than the bore of the air inlet, and the air inlet is connected with inflatable body, wherein：
During the electric rotating machine drives the rotating platform rotation predetermined angular, the inflatable body is to the air inlet
It is lasting to blow, so that the rotating platform is adsorbed second silicon chip.
8. silicon chip sorting machine according to claim 1, which is characterized in that the P/N types detection device includes telescopic
First detector and telescopic second detector, first detector are located at the lower section of the pipeline, second inspection
Survey the top that device is located at first detector.
9. silicon chip sorting machine according to claim 1, which is characterized in that the silicon chip sorting machine further includes at least one point
Gear mechanism and at least one rewinding box, the stepping mechanism are located at the lower section of the pipeline, and the rewinding box is located at described defeated
The side of line sending, wherein：
The stepping mechanism include the second belt conveyor, stepper motor and the second lifting motor, second belt conveyor it is defeated
Send direction vertical with the conveying direction of the pipeline；
For second lifting motor for driving second belt conveyor to rise or fall, the stepper motor drives described the
Two belt conveyors are for being driven；
When second lifting motor drives the second belt conveyor rising and the lower surface of third silicon chip to contact, the stepping
Motor drives the second belt conveyor transmission, so that the third silicon chip is transported in the rewinding box, the third silicon chip
For the silicon chip above second belt conveyor.
10. silicon chip sorting machine according to claim 9, which is characterized in that the stepping mechanism further includes eccentric wheel and company
Bar, wherein：
Second lifting motor is mechanically connected with the eccentric wheel, and the turning end of the eccentric wheel and one end of the connecting rod are solid
Fixed connection, the other end of the connecting rod are fixedly connected with the mounting base of second belt conveyor.
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| CN201810365065.4A CN108389808B (en) | 2018-04-23 | 2018-04-23 | Silicon chip sorting machine |
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| CN110379736A (en) * | 2019-07-09 | 2019-10-25 | 无锡奥特维科技股份有限公司 | Silicon wafer sorting machine |
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