CN108376650B - A kind of small outline integrated circuit packaging system - Google Patents
A kind of small outline integrated circuit packaging system Download PDFInfo
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- CN108376650B CN108376650B CN201810086006.3A CN201810086006A CN108376650B CN 108376650 B CN108376650 B CN 108376650B CN 201810086006 A CN201810086006 A CN 201810086006A CN 108376650 B CN108376650 B CN 108376650B
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 50
- 238000005538 encapsulation Methods 0.000 claims abstract description 80
- 230000007246 mechanism Effects 0.000 claims abstract description 59
- 230000005540 biological transmission Effects 0.000 claims abstract description 38
- 230000007723 transport mechanism Effects 0.000 claims abstract description 37
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000010276 construction Methods 0.000 claims abstract description 11
- 239000000203 mixture Substances 0.000 claims abstract description 8
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000007787 solid Substances 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 claims description 2
- 230000007547 defect Effects 0.000 abstract description 6
- 238000000034 method Methods 0.000 description 9
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 230000008450 motivation Effects 0.000 description 2
- 235000012431 wafers Nutrition 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000000994 depressogenic effect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
- H01L21/67742—Mechanical parts of transfer devices
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Robotics (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
Abstract
The invention discloses a kind of small outline integrated circuit packaging systems, its structure includes substrate entrance, encapsulate control cabinet, conveyer belt fixed plate, conveyer belt, thermovent, protect pedestal, cable, control button, control cabinet is encapsulated by lifting packaging mechanism, power device, control room, actuating mechanism, transmission mechanism, lever construction, first transport mechanism, second transport mechanism, rotating electric machine, drive band, energize motor, encapsulate fixed device composition, the present invention is equipped in the inside of control room and encapsulates fixed device when chip to be packaged is sent to the position by conveyer belt, the weight pressure of chip touches chip sense base, since chip sense base is set there are two and is corresponded with lifting packaging mechanism, only work is just packaged when the chip of encapsulation is transmitted to chip sense base, avoid the occurrence of encapsulation dislocation, realize double Packaging mechanism and chip sense base can effectively improve packaging efficiency and reduce the frequency for defect ware occur.
Description
Technical field
The present invention is a kind of small outline integrated circuit packaging system, belongs to integrated circuit package device field.
Background technique
Integrated circuit is a kind of microelectronic device or component, using certain technique, crystalline substance needed for a circuit
The elements such as body pipe, resistance, capacitor and inductance and wiring interconnection together, are produced on a fritter or a few fritter semiconductor wafers or medium
On substrate, it is then encapsulated in a shell, becomes the microstructure with required circuit function；Wherein all elements are in structure
On formed a whole, so that electronic component has been strided forward one in terms of microminaturization, low-power consumption, intelligence and high reliability big
Step, it uses alphabetical " IC " to indicate in circuit.It is that the one kind to grow up one sixties of later period the 1950s novel is partly led
Body device.It is that have certain function constituting through semiconductor fabrication process such as peroxidating, photoetching, diffusion, extension, evaporations of aluminum
The elements such as semiconductor needed for circuit, resistance, capacitor and the connecting wire between them are fully integrated on a fritter silicon wafer, so
The electronic device being encapsulated in a shell is welded afterwards.Its package casing has round shell-type, flat or dual inline type etc. a variety of
Form.Integrated circuit technique includes chip fabrication techniques and designing technique, is mainly reflected in process equipment, processing technology, encapsulation
In the ability of test, batch production and design innovation.
The single transmission encapsulation of the prior art causes working efficiency low, is unfavorable for the encapsulation production operation of big demand, and
Encapsulation dislocation caused by during being packaged, so that the frequency for defect ware occur is higher.
Summary of the invention
In view of the deficienciess of the prior art, it is an object of the present invention to provide a kind of small outline integrated circuit packaging system, with
Solving the single transmission encapsulation of the prior art causes working efficiency low, is unfavorable for the encapsulation production operation of big demand, and carrying out
Caused encapsulation dislocation in encapsulation process, so that the higher problem of the frequency for defect ware occur.
To achieve the goals above, the present invention is to realize by the following technical solutions: a kind of small outline integrated circuit
Packaging system, structure include substrate entrance, encapsulation control cabinet, conveyer belt fixed plate, conveyer belt, thermovent, protection pedestal, electricity
The upper port of cable, control button, the encapsulation control cabinet is set there are two the substrate entrance for installing substrate, and the control is pressed
Button is equipped with two or more and is installed at the left end half of encapsulation control cabinet, two terminal of inside of the conveyer belt fixed plate
Tool is connected with conveyer belt and through encapsulation control cabinet, and the bottom front of the encapsulation control cabinet is equipped with thermovent, the protection
Tube chamber welds with base in encapsulation control cabinet bottom end and be integrated, the end of the cable through encapsulation control cabinet and with
Internal energy supply motor electrical connection, the encapsulation control cabinet is by lifting packaging mechanism, power device, control room, actuating mechanism, biography
Motivation structure, lever construction, the first transport mechanism, the second transport mechanism, rotating electric machine, driving band, energy supply motor, the fixed dress of encapsulation
Set composition, the lifting packaging mechanism and power device using be electrically connected, the lifting packaging mechanism set there are two be mounted on
The upper end inner wall of control room simultaneously cooperates with fixed device is encapsulated, and one end of the actuating mechanism is connected with power device, another
End is mechanically connected to transmission mechanism, and the bottom end two sides mechanical connection for encapsulating fixed device has lever mechanism, the Lever machine
One end of structure is fixed in the inner left wall of control room, and the other end and the first transport mechanism connect, first conveyer
Structure is sequentially connected by the second transport mechanism and rotating electric machine, and second transport mechanism is connected by driving band and energy supply motor
It connects.
Further, the lifting packaging mechanism is made of heater, lifting encapsulation header, cylinder, the lifting encapsulation header
If there are two and between be fixedly mounted having heaters, the signal end of the lifting encapsulation header is connected to cylinder.
Further, the power device is by lead, exhaust tube, gas outlet, solenoid valve block at the exhaust tube is equipped with two
More than a and its signal end of the inside of control room is mounted on solenoid valve using being electrically connected, and is pacified on the right side of the outer surface of the solenoid valve
It is connect equipped with gas outlet and by lead with cylinder.
Further, the actuating mechanism is by first pulley, the first conveyer belt, second pulley, fixed transverse slat, feeler lever, drawing
Spring, rack gear composition are stretched, the first pulley is fixedly mounted on the bottom end of solenoid valve and using mechanical connection, the first pulley
It is sequentially connected by the first conveyer belt and second pulley, the second pulley is equipped with feeler lever and connects with the end thereof contacts of rack gear
It connects, the fixed transverse slat is horizontally fixed on the inside of control room and is welded with stretching on the inside of the vertical end of lifting packaging mechanism
Spring, one end of the extension spring are fixed with rack gear and are meshed with transmission mechanism.
Further, the transmission mechanism by movable pulley, the second conveyer belt, third conveyer belt, fixed link, servo motor,
Transmission gear composition, for the second conveyer belt clearance fit between movable pulley and transmission gear, the movable pulley passes through second
Conveyer belt is connect with servo motor transmission, and the servo motor is fixedly mounted on the bottom end of fixed link, and the fixed link is in level
One end of which is fixed at the half of control room inner left wall, the other end of the fixed link is fixed on the fixed dress of encapsulation for installation
The left end outer wall set.
Further, the lever construction is made of lever, lever fixing axle, contact pulley, the central part of the lever
The lever fixing axle that position is bolted is fixed on the lower-left end for encapsulating fixed device, and the right end mechanical connection of the lever has
Contact pulley one end is matched with fixed device is encapsulated, and the other end of the contact pulley is matched with the first transport mechanism.
Further, first transport mechanism is by the 4th conveyer belt, third pulley, pulley feeler lever, horizontal fixing axle group
At the 4th conveyer belt is sequentially connected by third pulley and pulley feeler lever, and one end of the pulley feeler lever is fixed on third
The other end is connect with contact pulley contact on pulley, and the horizontal fixing axle is fixed on the interior of control room in horizontal linear and both ends
Portion.
Further, second transport mechanism is made of the 5th conveyer belt, gear, the 6th conveyer belt, and the gear is logical
The 5th transmission belt and the 4th conveyer belt is crossed to be sequentially connected, the gear set there are two and between by the 6th transmission band connection, institute
Sawtooth of the gear with rotating electric machine outer surface around connection is stated to be meshed.
Further, the fixed device of the encapsulation is made of chip sense base, screw rod, encapsulation fixed frame, the chip
Sense base set there are two and be mechanically connected to encapsulation fixed frame inside matched by lead screw with lever.
Further, the lifting packaging mechanism, power device, actuating mechanism, transmission mechanism, lever construction, first pass
Mechanism, the second transport mechanism, rotating electric machine, driving band is sent to be respectively provided with two and size structure is equally installed in the interior of control room
Portion.
Further, the junction of the chip sense base and encapsulation fixed frame is equipped with spring, for the effect of reset,
The substrate entrance is integrated with lifting packaging mechanism, and substrate is packed into the interior of lifting packaging mechanism by substrate entrance
Portion.
Beneficial effect
A kind of small outline integrated circuit packaging system of the present invention, energy supply electric motor starting drive rotation by the driving band of connection
Motor driven, rotating electric machine rotation, which is meshed by sawtooth with the second transport mechanism, drives the transmission of the second transport mechanism, and second passes
Mechanism is sent to drive the 4th transmission V belt translation by the 5th conveyer belt, the 4th conveyer belt drives third pulley to rotate simultaneously, therefore, the
One transport mechanism is under state, when chip is sent to chip sense base by conveyer belt, due to chip itself have it is certain
Weight, therefore chip sense base is depressed, chip sense base is pressed down, and the lever one end for being fixed on encapsulation fixed frame lower end is upward
Servo motor work, the contact pulley contact that the other end is connected with this to pulley feeler lever are touched, servo motor starts, drive the
Three conveyer belts and movable pulley, which are realized, to be rotated, and movable pulley rotation is rotated by the second conveyer belt band nutating gear of connection, transmission
The rack gear that is meshed with this, which does level and moves downward, while gear rotates touches feeler lever and drives second pulley to rotate simultaneously, because
This first pulley under the drive of the first conveyer belt rotates, and first pulley is connect with solenoid valve, realizes that signal conduction, solenoid valve are logical
Electricity is connect by the lead that gas outlet connects with cylinder, and the pressure energy of compressed gas will be converted to machinery in Pneumatic Transmission by cylinder
Can, driving lifting encapsulation header, which is done, up and down reciprocatingly to move along a straight line, realize encapsulation work, in order to realize the more sufficiently fitting of encapsulation,
Having heaters is installed in lifting encapsulation header, improves the leakproofness of encapsulation.
It is equipped in the inside of control room and encapsulates fixed device when chip to be packaged is sent to the position by conveyer belt,
The weight pressure of chip touches chip sense base, due to chip sense base set there are two and with lifting packaging mechanism one it is a pair of
It answers, is only just packaged work when the chip of encapsulation is transmitted to chip sense base, avoid the occurrence of encapsulation dislocation, realize double
A packaging mechanism and chip sense base can effectively improve packaging efficiency and reduce the frequency for defect ware occur.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other feature of the invention,
Objects and advantages will become more apparent upon:
Fig. 1 is a kind of surface structure schematic diagram of small outline integrated circuit packaging system of the present invention.
Fig. 2 is a kind of internal cross section structural schematic diagram of small outline integrated circuit packaging system of the present invention.
Fig. 3 is the first partial enlarged diagram of Fig. 2 of the present invention.
Fig. 4 is the second partial enlargement diagram of Fig. 2 of the present invention.
Fig. 5 is a kind of work transmission principle structural schematic diagram of small outline integrated circuit packaging system of the present invention.
Fig. 6 is the structural schematic diagram of A in Fig. 2 of the present invention.
Fig. 7 is the structural schematic diagram of B in Fig. 3 of the present invention.
In figure: substrate entrance -1, encapsulation control cabinet -2, conveyer belt fixed plate -3, conveyer belt -4, thermovent -5, protection bottom
Seat -6, control button -8, lifting packaging mechanism -21, power device -22, control room -23, actuating mechanism -24, passes cable -7
Motivation structure -25, lever construction -26, the first transport mechanism -27, the second transport mechanism -28, rotating electric machine -29, driving band -210,
It energizes motor -211, encapsulate fixed device -212, heater -2101, lifting encapsulation header -2102, cylinder -2103, lead -
2201, exhaust tube -2202, gas outlet -2203, solenoid valve -2204, first pulley -2401, the first conveyer belt -2402, second are slided
Wheel -2403, fixed transverse slat -2404, feeler lever -2405, extension spring -2406, rack gear -2407, movable pulley -2500, the second transmission
Band -2501, third conveyer belt -2502, fixed link -2503, servo motor -2504, transmission gear -2505, lever -2601, thick stick
Bar fixing axle -2602, contact pulley -2603, the 4th conveyer belt -2701, third pulley -2702, pulley feeler lever -2703, level
Fixing axle -2704, the 5th conveyer belt -2801, gear -2802, the 6th conveyer belt -2803, chip sense base -2121, screw rod -
2122, fixed frame -2123 is encapsulated.
Specific embodiment
To be easy to understand the technical means, the creative features, the aims and the efficiencies achieved by the present invention, below with reference to
Specific embodiment, the present invention is further explained.
Embodiment 1
Fig. 1-Fig. 7 is please referred to, the present invention provides a kind of small outline integrated circuit packaging system, and structure includes substrate entrance
1, control cabinet 2, conveyer belt fixed plate 3, conveyer belt 4, thermovent 5, protection pedestal 6, cable 7, control button 8 are encapsulated, it is described
The upper port of encapsulation control cabinet 2 is set there are two the substrate entrance 1 for installing substrate, and the control button 8 is equipped with two or more
It is installed at the left end half of encapsulation control cabinet 2, the inside both ends mechanical connection of the conveyer belt fixed plate 3 has transmission
Band 4 and through encapsulation control cabinet 2, the bottom front of the encapsulation control cabinet 2 is equipped with thermovent 5, the protection pedestal 6 welding
In encapsulation control cabinet 2 bottom end and be integrated, the end of the cable 7 through encapsulation control cabinet 2 and with inside
Energy supply motor 211 be electrically connected, the encapsulation control cabinet 2 by lifting packaging mechanism 21, power device 22, control room 23, touch
Mechanism 24, transmission mechanism 25, lever construction 26, the first transport mechanism 27, the second transport mechanism 28, rotating electric machine 29, driving band
210, it energizing motor 211, encapsulates the fixed composition of device 212, the lifting packaging mechanism 21 is used with power device 22 and is electrically connected,
The lifting packaging mechanism 21 sets there are two the upper end inner wall for being mounted on control room 23 and cooperates with fixed device 212 is encapsulated,
One end of the actuating mechanism 24 is connected with power device 22, and the other end is mechanically connected to transmission mechanism 25, and the encapsulation is solid
The bottom end two sides mechanical connection for determining device 212 has lever mechanism 26, and one end of the lever mechanism 26 is fixed on control room 23
In inner left wall, the other end and the first transport mechanism 27 are connected, and first transport mechanism 27 passes through the second transport mechanism
28 are sequentially connected with rotating electric machine 29, and second transport mechanism 28 is connect by driving band 210 with energy supply motor 211, described
Lifting packaging mechanism 21 is made of heater 2101, lifting encapsulation header 2102, cylinder 2103, and the lifting encapsulation header 2102 is equipped with
Two and between be fixedly mounted having heaters 2101, it is described lifting encapsulation header 2102 signal end be connected to cylinder 2103, it is described
Power device 22 is made of lead 2201, exhaust tube 2202, gas outlet 2203, solenoid valve 2204, and the exhaust tube 2202 is equipped with
It is more than two and be mounted on its signal end of the inside of control room 23 and be electrically connected with the use of solenoid valve 2204, the solenoid valve 2204
Gas outlet 2203 is installed on the right side of outer surface and is connect by lead 2201 with cylinder 2103, the actuating mechanism 24 is sliding by first
Take turns the 2401, first conveyer belt 2402, second pulley 2403, fixed transverse slat 2404, feeler lever 2405, extension spring 2406, rack gear
2407 compositions, the first pulley 2401 are fixedly mounted on the bottom end of solenoid valve 2204 and are slided using mechanical connection, described first
Wheel 2401 is sequentially connected by the first conveyer belt 2402 with second pulley 2403, and the second pulley 2403 is equipped with feeler lever 2405
And connect with the end thereof contacts of rack gear 2407, the fixed transverse slat 2404 is horizontally fixed on the inside of control room 23 and close to lifting
It is welded with extension spring 2406 on the inside of the vertical end of packaging mechanism 21, one end of the extension spring 2406 is fixed with rack gear 2407
And be meshed with transmission mechanism 25, the transmission mechanism 25 is by movable pulley 2500, the second conveyer belt 2501, third conveyer belt
2502, fixed link 2503, servo motor 2504, transmission gear 2505 form, and 2501 clearance fit of the second conveyer belt is in dynamic
Between pulley 2500 and transmission gear 2505, the movable pulley 2500 is driven by the second conveyer belt 2501 with servo motor 2504
Connection, the servo motor 2504 are fixedly mounted on the bottom end of fixed link 2503, and the fixed link 2503 is in be horizontally mounted one
End is fixed at the half of 23 inner left wall of control room, and the other end of the fixed link 2503 is fixed on the fixed device of encapsulation
212 left end outer wall, the lever construction 26 are made of lever 2601, lever fixing axle 2602, contact pulley 2603, the thick stick
The lever fixing axle 2602 that the centre of bar 2601 is bolted is fixed on the lower-left end for encapsulating fixed device 212, institute
The right end mechanical connection for stating lever 2601 has contact 2603 one end of pulley to match with fixed device 212 is encapsulated, the contact
The other end of pulley 2603 is matched with the first transport mechanism 27, and first transport mechanism 27 is by the 4th conveyer belt 2701,
Three pulleys 2702, pulley feeler lever 2703, horizontal fixing axle 2704 form, and the 4th conveyer belt 2701 passes through third pulley 2702
Be sequentially connected with pulley feeler lever 2703, one end of the pulley feeler lever 2703 be fixed on third pulley 2702 other end with contact
Pulley 2603 connects, and the horizontal fixing axle 2704 is fixed on the inside of control room 23 in horizontal linear and both ends, described
Second transport mechanism 28 is made of the 5th conveyer belt 2801, gear 2802, the 6th conveyer belt 2803, and the gear 2802 passes through the
Five transmission belts 2801 and the 4th conveyer belt 2701 are sequentially connected, the gear 2802 set there are two and between by the 6th conveyer belt
2803 connections, sawtooth of the gear 2802 with 29 outer surface of rotating electric machine around connection are meshed, the fixed device of the encapsulation
212 are made of chip sense base 2121, screw rod 2122, encapsulation fixed frame 2123, there are two the chip sense base 2121 is set
And the inside for being mechanically connected to encapsulation fixed frame 2123 is matched by lead screw 2122 with lever 2601, the lifting sealing machine
Structure 21, power device 22, actuating mechanism 24, transmission mechanism 25, lever construction 26, the first transport mechanism 27, the second transport mechanism
28, rotating electric machine 29, driving band 210 are respectively provided with two and size structure is equally installed in the inside of control room 23, the core
The junction of piece sense base 2121 and encapsulation fixed frame 2123 is equipped with spring, for the effect of reset, the substrate entrance 1 with
Lifting packaging mechanism 21 is integrated, and substrate is packed into the inside of lifting packaging mechanism 21 by substrate entrance 1.
When being worked, the starting of energy supply motor 211 drives rotating electric machine 29 to drive by the driving band 210 of connection, rotation
The rotation of rotating motor 29, which is meshed by sawtooth with the second transport mechanism 28, drives the transmission of the second transport mechanism 28, the second transport mechanism
28 drive the transmission of the 4th conveyer belt 2701 by the 5th conveyer belt 2801, and the 4th conveyer belt 2701 drives third pulley 2702 simultaneously
Rotation, therefore, the first transport mechanism 27 is under state, when chip is sent to chip sense base 2121 by conveyer belt 4, due to
Chip itself has certain weight, therefore depresses chip sense base 2121, and chip sense base 2121 is pressed down, and is fixed on encapsulation
The work of servo motor 2504, the contact that the other end is connected with this are touched upwards in 2601 one end of lever of 2123 lower end of fixed frame
Pulley 2603 touches pulley feeler lever 2703, and servo motor 2504 starts, and drives third conveyer belt 2502 and movable pulley 2500 real
It now rotates, the rotation of movable pulley 2500 is rotated by the second conveyer belt 2501 of connection with nutating gear 2505, transmission gear
The rack gears 2407 that are meshed with this, which do level and move downward, while 2505 rotation touches feeler lever 2405 and drives the second cunning simultaneously
2403 rotation of wheel, therefore first pulley 2401 rotates under the drive of the first conveyer belt 2402, first pulley 2401 and solenoid valve
Signal conduction is realized in 2204 connections, and the lead 2201 and cylinder 2103 that the energization of solenoid valve 2204 is connected by gas outlet 2203 connect
It connects, the pressure energy of compressed gas will be converted to mechanical energy in Pneumatic Transmission by cylinder 2103, and driving lifting encapsulation header 2102 is done
Lower linear reciprocating motion realizes encapsulation work, in order to realize the more sufficiently fitting of encapsulation, installs in lifting encapsulation header 2102
Having heaters 2101 improves the leakproofness of encapsulation.
Its structure and principle are all that this technology personnel can be learnt by technical manual or be known by routine experiment method,
Problems solved by the invention is that the single transmission encapsulation of the prior art causes working efficiency low, is unfavorable for the encapsulation production of big demand
Operation, and caused encapsulation dislocation during being packaged, so that the frequency for defect ware occur is higher, the present invention passes through above-mentioned
Component is combined with each other, and is equipped in the inside of control room and is encapsulated fixed device when chip to be packaged is sent to this by conveyer belt
When position, the pressure of the weight of chip touches chip sense base, due to chip sense base set there are two and with lifting packaging mechanism
It corresponds, is only just packaged work when the chip of encapsulation is transmitted to chip sense base, avoid the occurrence of encapsulation dislocation, it is real
Packaging efficiency can effectively be improved and reduce the frequency for defect ware occur by having showed double packaging mechanisms and chip sense base.
The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention, for this field skill
For art personnel, it is clear that invention is not limited to the details of the above exemplary embodiments, and without departing substantially from spirit of the invention or
In the case where essential characteristic, the present invention can be realized in other specific forms.Therefore, in all respects, should all incite somebody to action
Embodiment regards exemplary as, and is non-limiting, the scope of the present invention by appended claims rather than on state
Bright restriction, it is intended that including all changes that fall within the meaning and scope of the equivalent elements of the claims in the present invention
It is interior.Any reference signs in the claims should not be construed as limiting the involved claims.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (9)
1. a kind of small outline integrated circuit packaging system, structure includes that substrate entrance (1), encapsulation control cabinet (2), conveyer belt are solid
Fixed board (3), conveyer belt (4), thermovent (5), protection pedestal (6), cable (7), control button (8), it is characterised in that:
The upper port of encapsulation control cabinet (2) sets that there are two for installing the substrate entrance (1) of substrate, the control button
(8) be equipped with two or more be installed in encapsulation control cabinet (2) left end half at, the conveyer belt fixed plate (3) it is interior
Side both ends mechanical connection has conveyer belt (4) and through encapsulation control cabinet (2), and the bottom front of encapsulation control cabinet (2) is set
Have thermovent (5), protection pedestal (6) is welded in the bottom end of encapsulation control cabinet (2) and is integrated, the cable
(7) end is electrically connected through encapsulation control cabinet (2) and with internal energy supply motor (211)；
The encapsulation control cabinet (2) by lifting packaging mechanism (21), power device (22), control room (23), actuating mechanism (24),
Transmission mechanism (25), lever construction (26), the first transport mechanism (27), the second transport mechanism (28), rotating electric machine (29), driving
Band (210), energy supply motor (211) encapsulate fixed device (212) composition, the lifting packaging mechanism (21) and power device
(22) using electrical connection, it is described lifting packaging mechanism (21) set there are two be mounted on control room (23) upper end inner wall and with envelope
Fixed device (212) cooperation is filled, one end of the actuating mechanism (24) is connected with power device (22), other end mechanical connection
In transmission mechanism (25), the bottom end two sides mechanical connection for encapsulating fixed device (212) has lever construction (26), the lever
One end of structure (26) is fixed in the inner left wall of control room (23), and the other end and the first transport mechanism (27) connect,
First transport mechanism (27) is sequentially connected by the second transport mechanism (28) and rotating electric machine (29), second conveyer
Structure (28) is connect by driving band (210) with energy supply motor (211).
2. a kind of small outline integrated circuit packaging system according to claim 1, it is characterised in that: the lifting sealing machine
Structure (21) is made of heater (2101), lifting encapsulation header (2102), cylinder (2103), and the lifting encapsulation header (2102) is equipped with
Two and between be fixedly mounted having heaters (2101), it is described lifting encapsulation header (2102) signal end be connected to cylinder
(2103).
3. a kind of small outline integrated circuit packaging system according to claim 1, it is characterised in that: the power device
(22) it is made of lead (2201), exhaust tube (2202), gas outlet (2203), solenoid valve (2204), the exhaust tube (2202)
Equipped with two or more and it is mounted on its signal end of the inside of control room (23) and solenoid valve (2204) using being electrically connected, the electromagnetism
Gas outlet (2203) is installed on the right side of the outer surface of valve (2204) and is connect by lead (2201) with cylinder (2103).
4. a kind of small outline integrated circuit packaging system according to claim 1, it is characterised in that: the actuating mechanism
(24) by first pulley (2401), the first conveyer belt (2402), second pulley (2403), fixed transverse slat (2404), feeler lever
(2405), extension spring (2406), rack gear (2407) composition, the first pulley (2401) are fixedly mounted on solenoid valve (2204)
Bottom end and using mechanical connection, the first pulley (2401) is passed by the first conveyer belt (2402) and second pulley (2403)
Dynamic connection, the second pulley (2403) is equipped with feeler lever (2405) and connect with the end thereof contacts of rack gear (2407), described solid
Determine the inside that transverse slat (2404) is horizontally fixed on control room (23) and the welding on the inside of the vertical end of lifting packaging mechanism (21)
Have extension spring (2406), one end of the extension spring (2406) is fixed with rack gear (2407) and mutually nibbles with transmission mechanism (25)
It closes.
5. a kind of small outline integrated circuit packaging system according to claim 1, it is characterised in that: the transmission mechanism
(25) by movable pulley (2500), the second conveyer belt (2501), third conveyer belt (2502), fixed link (2503), servo motor
(2504), transmission gear (2505) forms, and the second conveyer belt (2501) clearance fit is in movable pulley (2500) and driving cog
It takes turns between (2505), the movable pulley (2500) is sequentially connected by the second conveyer belt (2501) and servo motor (2504), institute
The bottom end that servo motor (2504) is fixedly mounted on fixed link (2503) is stated, the fixed link (2503) is in be horizontally mounted one end
It is fixed at the half of control room (23) inner left wall, the other end of the fixed link (2503) is fixed on the fixed dress of encapsulation
Set the left end outer wall of (212).
6. a kind of small outline integrated circuit packaging system according to claim 1, it is characterised in that: the lever construction
(26) it is made of lever (2601), lever fixing axle (2602), contact pulley (2603), the centre of the lever (2601)
The lever fixing axle (2602) being bolted is fixed on the lower-left end for encapsulating fixed device (212), the lever (2601)
Right end mechanical connection have contact pulley (2603) one end with encapsulation fixation device (212) match, the contact pulley
(2603) the other end is matched with the first transport mechanism (27).
7. a kind of small outline integrated circuit packaging system according to claim 1, it is characterised in that: first conveyer
Structure (27) is made of the 4th conveyer belt (2701), third pulley (2702), pulley feeler lever (2703), horizontal fixing axle (2704),
4th conveyer belt (2701) is sequentially connected by third pulley (2702) and pulley feeler lever (2703), the pulley feeler lever
(2703) one end is fixed on the other end and contact pulley (2603) on third pulley (2702) and connects, described horizontal fixed
Axis (2704) is fixed on the inside of control room (23) in horizontal linear and both ends.
8. a kind of small outline integrated circuit packaging system according to claim 1, it is characterised in that: second conveyer
Structure (28) is made of the 5th conveyer belt (2801), gear (2802), the 6th conveyer belt (2803), and the gear (2802) passes through the
Five conveyer belts (2801) and the 4th conveyer belt (2701) are sequentially connected, the gear (2802) set there are two and between by the 6th
Conveyer belt (2803) connection, sawtooth of the gear (2802) with rotating electric machine (29) outer surface around connection are meshed.
9. a kind of small outline integrated circuit packaging system according to claim 1, it is characterised in that: the fixed dress of the encapsulation
It sets (212) to be made of chip sense base (2121), screw rod (2122), encapsulation fixed frame (2123), the chip sense base
(2121) it sets there are two and the inside for being mechanically connected to encapsulation fixed frame (2123) passes through screw rod (2122) and lever (2601)
It matches.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810086006.3A CN108376650B (en) | 2018-01-29 | 2018-01-29 | A kind of small outline integrated circuit packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810086006.3A CN108376650B (en) | 2018-01-29 | 2018-01-29 | A kind of small outline integrated circuit packaging system |
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| Publication Number | Publication Date |
|---|---|
| CN108376650A CN108376650A (en) | 2018-08-07 |
| CN108376650B true CN108376650B (en) | 2019-12-03 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201810086006.3A Active CN108376650B (en) | 2018-01-29 | 2018-01-29 | A kind of small outline integrated circuit packaging system |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109166811A (en) * | 2018-08-28 | 2019-01-08 | 安徽星宇生产力促进中心有限公司 | A kind of microelectronic device package mechanism |
| CN110137093B (en) * | 2019-06-21 | 2020-11-03 | 浙江金果知识产权有限公司 | High-protectiveness packaging equipment for silicon-based chip set |
| CN116885075B (en) * | 2023-09-06 | 2023-11-24 | 深圳市德明新微电子有限公司 | Pin quick welding cut-off type LED packaging device |
| CN118782484A (en) * | 2024-09-04 | 2024-10-15 | 深圳市沃德芯科技有限公司 | Packaging and processing device for integrated circuit chip |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104051318B (en) * | 2014-07-04 | 2017-02-01 | 格科微电子（上海）有限公司 | Automatic packaging system and automatic packaging method of image sensor chip |
| CN204424221U (en) * | 2015-02-28 | 2015-06-24 | 兴化市华宇电子有限公司 | Chip automatic packaging device |
| CN105742216B (en) * | 2016-04-11 | 2019-01-18 | 上海华力微电子有限公司 | Wafer handling system |
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Effective date of registration: 20221215 Address after: 0705, Floor 7, Building A, Electronic Technology Building, No. 2070, Shennan Middle Road, Fuqiang Community, Huaqiang North Street, Futian District, Shenzhen, Guangdong 518000 Patentee after: Shenzhen Jiesheng micro Semiconductor Co.,Ltd. Address before: 230000 12 km Heyu Road, CuO Town, Feidong County, Hefei City, Anhui Province Patentee before: HEFEI LANCHUAN ECOLOGICAL TECHNOLOGY Co.,Ltd. |
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