CN108349057A - The method and apparatus for being used to form the uniform surface through polishing of metal tape - Google Patents

Abstract

The present invention relates to a kind of methods for manufacturing metal tape (1), wherein, it is at least substantially polished on the whole surface the metal tape (1) on a side with multiple processes, wherein, it is polished metal tape (1) with aging or abrasion polishing medium (4,8,12) in last polishing operation.In addition, a kind of equipment for manufacturing metal tape (1) is given, the equipment includes for keeping and two rollers of moving metal strip (1) (2,3) or two capstan winches (13,14) and grinding device (4,8,12).In addition, the equipment further includes exporting the device of alarm when not meeting prespecified degree of aging or the prespecified degree of wear (A) with the degree of aging or the degree of wear (A) that are used to determine polishing medium (4,8,12) and the polishing medium (4,8,12) in last polishing operation.

Description

The method and apparatus for being used to form the uniform surface through polishing of metal tape

Technical field

The present invention relates to a kind of methods for manufacturing metal tape, wherein with multiple processes at least in side substantially whole It polishes metal tape on a surface.The invention further relates to a kind of equipment for manufacturing metal tape, the equipment, which has, to be used In keep and moving metal strip two rollers or two capstan winches, and including for multiple processes at least on a side The grinding device polished metal tape in substantially whole surface.

Background technology

It is known from the state of the art in the method and apparatus principle for metal tape of polishing.For determining use purpose This metal tape is manufactured with very high surface quality and therefore this metal tape is that polishing or bloom are thrown in most cases Light.The metal tape for example for manufacturing plate or membranaceous material, it is logical be not for photographing, LCD screen or be used for people The material of work stone material (" engineered stone ").Here, apply liquid or pasta material and will at least to taking for driven/movement The partially solidified material peels.The surface quality of this product using metal tape manufacture directly depends on metal The surface quality of band.

Here the problem of is to be difficult to form the sufficiently uniform surface of metal tape using traditional polishing process.This metal Band there may come a time when the area that there are hundreds of square metres of needs to polish.It is easy to imagine that, it is difficult to real on entire belt surface Now uniformly grind line (Schliffbild).Thus caused to be, the product using the manufacture of this metal tape does not have unified table Face.

Invention content

Therefore the object of the present invention is to which the polishing improved to metal tape manufactures improved metal tape in other words.Especially institute Stating metal tape should polish in this way so that uniform belt surface be formed, so as to meet requirement above.

This purpose is realized by a kind of method of type described above, in the method, in last polishing work With aging or abrasion polishing medium polishing metal tape (at least a side in substantially whole surface) in sequence.Change and Yan Zhi, last milling tools are started with the polishing medium of aging or abrasion, and in other words, last polishing operation is completely with old Change or the polishing medium of abrasion is implemented.

The purpose of the present invention also realizes that the metal tape utilizes type described above using a kind of metal tape Method manufactures.

Finally, the purpose of the invention also realizes that the equipment is additionally using the equipment of type described above With for determine polishing medium degree of aging or the degree of wear and for when the polishing medium in last polishing operation not The device of alarm is exported when meeting prespecified degree of aging or the prespecified degree of wear.

Realize that metal tape is especially smooth and surface of high quality by proposed measure.Here with such Situation, i.e. aging or the polishing medium having worn out only have seldom degeneration and result of polishing only occurs very within some time Small variation.In contrast, in the prior art, in order to realize the polishing of high quality as a result, most use sum as new as possible Not used polishing medium.But this processing mode effectively or can more be realized uniformly only for smaller area to be polished Mill line.But for big area, polishing particle will appear abrasion, and this abrasion is king-sized for new polishing medium. Polishing on particle sharp and sharp seamed edge can be relatively rapid by rounding, but when the polishing seamed edge of this rounding can have longer Between.When granularity is identical, compared with using new polishing medium, can be realized clearly more uniformly using used polishing medium With smooth surface.

The purpose of polishing for example may is that, metal tape is ground to determining thickness and/or ensures that determining thickness is equal Evenness and/or the surface characteristic for forming determination.Such as the tolerance range around determining norminal size of metal tape thickness can be +/- 100 μm, in contrast, the tolerance of thickness uniformity is only +/- 25 μm.Therefore the thickness of metal tape is all answered at an arbitrary position Within two tolerance ranges.Surface characteristic can for example be defined by surface roughness and/or glossiness.Surface roughness Majority is μm to provide, this data can indicate intermediate value roughness, mean square roughness or mean roughness here.

This is it is noted that the present invention is directed not only to the polishing medium of bonding, and is directed to loose polishing particle.Cause This present invention is especially directed to abrasive pastes, and in the abrasive pastes, for example there is in aqueous or oil-containing solution for polishing particle In.

" substantially whole surface " refers to an entire belt surface at least 90% with side within the scope of the invention Part.Some smaller regions can be excluded in except processing, such as around the weld seam in endless belt for connecting strap end portion Region.Certainly, the method is not limited in polishing to a band side, and the two band sides that can also also polish Face.

Other advantageous forms of implementation and improvement project of the invention can be combined by dependent claims and by specification Attached drawing obtains.

Advantageously, the metal tape is polished in last polishing operation using the polishing medium with minimal wear. Polishing medium is thus avoided to degenerate too much.

It is advantageous in addition, the metal tape be polished to always in last polishing operation it is described polishing medium maximum Abrasion.It ensures in this way, polishing medium still has sufficiently strong de-material effect or sufficiently long remaining usage time.

The degree of wear of polishing medium can be usually determined with form in different ways.Such as it can be according to polishing medium Usage time determine the degree of wear.It is also contemplated that determining the degree of wear according to the number of polishing cycle, that is, The degree of wear is determined according to polishing particle and the frequency of metal tape effect.Another influence factor is the ringing time, that is, Particle of polishing in one cycle period is in active duration with metal tape.One particularly like influence factor is that cycle is made With distance, that is, polishing particle polish particle in a cycle period and metal tape is in active path length.Finally, Also the fight each other degree of wear of grinding media of pressing force of the medium on metal tape of polishing has an impact.For example, can be by following Formula calculates the degree of wear：

The degree of wear=coefficient × active force × ringing distance × cycle-index

Or

The degree of wear=coefficient × active force × ringing time × cycle-index

In general polishing particle can be considered using natural granular materials (quartz, corundum, diamond dust, pomegranate Stone, natural diamond) and synthesis granular materials (corundum, silicon carbide, chromium oxide, cubic boron nitride, diamond).

Particularly advantageously, it is carried out using the polishing medium that scleroma is closed in last polishing operation.It is beaten such In grinding media, polishing particle is maintained in matrix for a long time, and polishing particle is embedded in the matrix.Therefore, in polishing Before grain is detached from and the new polishing particle with tip and sharp seamed edge is made to expose, even the seamed edge of polishing particle rounding Keep effective for a long time.Using this polishing medium belt surface is become especially uniformly.But in principle it is also contemplated that using Softer polishing medium.In general, the hardness of polishing medium is provided by the way that alphabetical D=is very soft to T=is stone.

Particularly advantageously, it is carried out using single polishing medium in last polishing operation.It is advantageous to keep and adds at this time Between working hour it is shorter and prevent replace polish medium after occur stage portion on belt surface.

Particularly advantageously, the last polishing operation using multiple agings or used polishing medium into Row.The influence that polishing medium is degenerated can be reduced in this way.This processing mode is especially suitable for king-sized gold of polishing Belong to band.

It polishes with longitudinal it is also advantageous that carrying out laterally polishing to the metal tape.Pass through " intersecting polishing " metal tape Surface becomes especially flat.It at this time can be with：

A) setting is for transverse to the first grinding device longitudinally laterally polished to metal tape and being used for along it Longitudinal the second grinding device longitudinally polished metal tape, or

B) single grinding device is arranged to be used for transverse to longitudinally carrying out lateral polishing to metal tape and be used for Longitudinal polishing is carried out to metal tape along its longitudinal direction, what the single grinding device can be oriented around the plane transverse to metal tape Axis rotatably supports.

When laterally polishing, such as can be to the reciprocating motion of feeding superposition along longitudinal direction transversely or this movement It can also carry out by stages, that is, feeding along longitudinal direction is just carried out after Motor execution transversely is completed.

It is also advantageous that being polished for longitudinal using the polishing medium wider than the polishing medium for laterally polishing.By This can realize higher de-material effect, on the contrary, the surface of metal tape is vertical when laterally polishing with smaller polishing pressure It is preferably planarized by wider abrasive band to when polishing.

In an advantageous variant scheme of the manufacturing method, laterally polishing and longitudinal polishing are along the vertical of metal tape It is carried out at the same time to the position being staggered.Here for example longitudinal grinding device is arranged along direction of feed after lateral grinding device Face.By this processing mode, metal tape can be particularly rapidly manufactured.

In another advantageous variant scheme of the manufacturing method, laterally polishing and longitudinal polishing are front and back in time Successively carry out.In this variant scheme, laterally polishing is detached from longitudinal polishing and is associated with, it is possible thereby to very in line with the purpose It imposes to polishing fructufy.In addition, there is also such possibilities in principle, laterally polishing and longitudinal polishing are used only One single grinding device, the grinding device (thus) are rotated by 90 ° respectively.

Advantageously, the equipment for manufacturing metal tape has grinding wheel or grinding roller, grinding wheel or grinding roller is utilized to polish in other words Metal tape.It is also advantageous that the equipment for manufacturing metal tape has abrasive band, belt sanding metal tape is utilized in other words.Institute State various polishing media and be particularly well suited to mentioned use purpose because these polishing media with high durability degree and Therefore efficient and dimensionally stable polishing can be realized.

Advantageously, when longitudinally polishing, the contact between the polishing medium and metal tape is made to carry out on one wire. It is possible thereby to realize homogenization/planarizing of belt surface in the case where pressure of polishing is smaller.Can especially it make for this purpose With grinding wheel/grinding roller or abrasive band, these polishing media contact belt surface along a line.

Advantageously, polishing when, polishing medium on one face contacting metal band in other words metal tape and polishing medium Between contact carry out on one face.It is possible thereby to which belt surface is made to homogenize or planarize particularly well.Face formula it is fitted in Abrasive band on metal tape uses purpose particularly suitable for this.

In another advantageous variant scheme of the manufacturing method, the metal tape of polishing on whole bandwidth degree. It is possible thereby to form the especially flat surface of metal tape.Particularly advantageously, longitudinal polishing carries out on whole bandwidth degree.

Advantageously, the metal tape of polishing in the region reduced relative to whole bandwidth.Thus, it is possible to unusual difference Change ground and carries out bruting process.Such as can realize higher de-material amount in a width range of metal tape, on the contrary in metal Smaller de-material amount is realized in another width range of band.

It is also advantageous that bruting process carries out on the metal tape of annular closed.In this way can well with Multiple processes implement bruting process.Such as laterally polishing can be implemented with multiple processes, or can also be implemented with multiple processes Longitudinal polishing.

It is also advantageous that bruting process carries out on open (=inc) metal tape.In this way, i.e., Make for longer metal tape can also it is narrow it is limited spatially carry out bruting process, such as its mode is, will polish Metal tape by the metal coil tape that unwinds on a capstan winch, and polished on another capstan winch.It in principle can also be not Abrasive band is kept flat in the case of using capstan winch.

It is also advantageous that dry type ground metal tape of polishing.It is formed by polishing powder in this way it is possible to siphon away well Dirt.

But also advantageously, wet type or metal tape of polishing under the auxiliary of lubricant.It can prevent out in this way It now polishes dust.Furthermore, it is possible to which being kept substantially polishing medium does not have deposit, and Working position is cooled down.Wet When formula is polished, such as oil, oil or water may be used as lubricant.Finally, in wet type polishing, de-material effect is generally also high De-material effect in polishing in dry type.

It is carried out it is also advantageous that the feed motion between polishing medium and metal tape is in reverse to polishing direction.On the one hand, It is thus achieved that high cutting speed, on the other hand, the remover of metal tape, that is, polish dust or polishing mud are from the table through polishing Get rid of or keep it far from the surface through polishing on face.Therefore surface through polishing keeps more clean.

But it is also advantageous that the feed motion between polishing medium and metal tape orients in the same direction relative to polishing direction. On the one hand, cutting speed is thus reduced, on the other hand, the remover of metal tape, i.e. polishing dust or polishing mud are from not yet Get rid of or keep it far from the surface not yet polished on the surface of polishing.Therefore it is practically without polishing dust and reaches Working position Place, it is possible thereby to realize the polishing result of high quality.

It is noted here that being equally also suitable for variant scheme and thus obtained advantage disclosed in manufacturing method In disclosed equipment, and vice versa.

Description of the drawings

It is for a better understanding of the present invention, below with reference to the accompanying drawings next that the present invention will be described in detail.

Wherein respectively with obviously simplified diagram：

Fig. 1 with side view illustrate for manufacture metal tape, band be useful for the first equipment of the grinding roller laterally polished；

Fig. 2 overlooks the equipment for illustrating Fig. 1；

Fig. 3 with side view illustrate for manufacture metal tape, band be useful for the second of the belt type grinding device longitudinally polished Equipment；

Fig. 4 overlooks the equipment for illustrating Fig. 3；

Fig. 5 schematically shows the relationship of the roughness and its degree of wear of polishing medium

Fig. 6 with side view illustrate for manufacture metal tape, band is useful for the grinding roller laterally polished and polishes for longitudinal Belt type grinding device another equipment；

Fig. 7 overlooks the equipment for illustrating Fig. 6；

Fig. 8 illustrates the equipment with the single belt type grinding device revolvably supported with side view；

Fig. 9 overlooks the equipment for illustrating Fig. 8；

Figure 10 with side view illustrate for manufacture metal tape, band is useful for the grinding wheel laterally polished and polishes for longitudinal Grinding roller equipment；

Figure 11 overlooks the equipment for illustrating Figure 10；

Figure 12 illustrates equipment for open metal tape of polishing, with grinding wheel and belt type grinding device with side view；

Figure 13 overlooks the equipment for illustrating Figure 12；

Figure 14 illustrates the equipment for open metal tape of polishing using mobile door type structure with side view；And

Figure 15 overlooks the equipment for illustrating Figure 14.

Specific implementation mode

It should determine first, in the form of implementation differently illustrated, identical component has same reference numerals or identical Component name, including disclosure throughout the specification can be reasonably converted to same reference numerals or phase isomorphism The same parts of part title.The position description selected in the description, as described in being directed to currently for example upper and lower, side etc. with And the attached drawing that shows and these position descriptions can reasonably convert with new position in change in location.In addition, shown and institute Each single feature or the feature combination itself for stating different embodiments constitute solution that is independent, creative or belonging to the present invention Certainly scheme.

Fig. 1 schematically shows the equipment for manufacturing metal tape with side view, which is illustrated with vertical view in fig. 2. Fig. 1 and 2 specifically illustrate be configured to endless belt and around the metal tape 1 that two rollers 2 and 3 guide, wherein at least one roller It is driven.In addition, grinding roller 4 is also shown in Fig. 1.

It can be longitudinally extended polishing metal tape transverse to the metal tape 1 by means of shown equipment.Specific In embodiment, grinding roller 4, the polishing direction (not being direction of feed) of the grinding roller is used to be marked with " B " thus.This polishing movement By grinding roller 4 around it is horizontal, rotate along the axis that metal tape 1 orients and to realize.Metal tape 1 is by means of roller 2 and 3 along direction " C " is moved and is thus realized length feed when laterally polishing.

It is additional to the length feed along direction C, when laterally polishing, also transverse to the longitudinal direction of metal tape 1 along direction D Feeding.It can also be polished in this way welding region using grinding roller 4.It here, such as can be to the feeding along direction C It is superimposed the reciprocating motion along direction D, such as is superimposed with the tendency of triangle, sawtooth or sinusoidal waveform.Along the movement of direction D It can carry out by stages.In this case, the Motor execution of transversely D completion after, just progress along longitudinal direction C into It gives.As a result, during being moved along direction D, metal tape 1 stops.

Laterally polishing can carry out such as can also be limited in relative to whole bandwidth degree on whole bandwidth degree to subtract On small region, this region uses " E " to mark in Fig. 1.

Fig. 3 illustrates another illustrative and pure equipment for manufacturing metal tape 1 schematically shown with side view. The equipment also includes metal tape 1, and the metal tape is designed to endless belt and is guided around two rollers 2 and 3, wherein at least one What a roller was driven.In addition, showing belt type grinding device in figures 3 and 4, the belt type grinding device includes three steerings Roller 5,6 and 7 and an abrasive band 8.Finally, support plate 9 is also shown in Fig. 1, is used to support metal tape 1 and (pays attention to：Sensor 10 And electronic analysis assessment or alarm unit 11 illustrate in conjunction with Fig. 5).

Substitute support plate 9, can also be equipped with support roller, or in principle can also without support plate 9 or support roller into Row polishing.Identical situation is also applied for equipment shown in Fig. 1 and 2.It herein can also with support plate 9 or support roller It polishes.

In this illustration, metal tape 1 is polished vertically.In specific example, polished thus using belt The polishing direction (not being direction of feed) of device 6 to 8, the belt type grinding device is indicated with " F ".Metal tape 1 is by means of roller 2 It is moved along direction " C " with 3 and thus realizes length feed during longitudinally polishing.

In current method, in order to carry out lateral polishing to metal tape 1, grinding roller 4 is used, in order to carry out longitudinal beat Mill, has used abrasive band 8.Although each polishing medium is perfectly suitable for described using purpose, media tool because these are polished There is high durability and thus, it is possible to realize that efficiently and the polishing of dimensionally stable, but this is not unique possibility.It can certainly Imagine, carries out lateral polishing using abrasive band 8, or longitudinal polishing is carried out using grinding roller 4.In general manner especially it is contemplated that replacing Grinding wheel, the main distinction of the grinding wheel and grinding roller 4 is used to be the diameter/width ratio with bigger for grinding roller 4.Due to contact surface Smaller to reduce polishing pressure, this is advantageously implemented high de-material amount.

Fig. 5 schematically shows the relationship of the roughness R and the degree of wear A of polishing medium 4,8 of polishing medium 4,8.Such as Fig. 5 As can finding out well, the initial roughness R0 (degree of wear A0) in the presence of new polishing medium 4,8 is higher simultaneously And it quickly reduces.With the development of degree of wear A, the speed that roughness R is reduced at this time persistently slows down.That is when beginning, beat The polishing particle of grinding media 4,8 has sharp tip and a seamed edge, these tips and seamed edge are relatively rapid by rounding/polish. By the seamed edge of rounding although can not achieve very high de-material effect, there is higher durability, the journey degenerated in other words It spends relatively low.

It can be seen that, the reduction R1-R0 of roughness polishes medium in other words in the A1-A0 of section in Figure 5 4,8 degeneration is more than the reduction R2-R1 of roughness in the A2-A1 of section and polishes in other words the degeneration of medium 4,8.That is coarse The reduction or the degeneration for spending R non-linearly carry out.Such case can utilize in this way, that is, at least with multiple processes On a side substantially on the whole surface polish metal tape 1, wherein metal tape 1 is in last complete polishing operation In at least polished on a side using aging or abrasion polishing medium 4,8 in substantially whole surface.Thus Especially flat and high quality the surface of metal tape 1 can be generated.

In general, the degree of wear of polishing medium 4,8 can be determined with mode in different forms.For example, degree of wear A can To be determined according to the usage time of polishing medium 4,8.It is also contemplated that determining abrasion according to the number of polishing cycle Degree A, that is, determined according to the frequency had an effect with metal tape 1 of polishing particle.Another influence factor is that cycle is made With the time, that is, in the duration that polishing particle is had an effect in a cycle period with metal tape 1.One very similar Influence factor be ringing distance, that is have an effect with metal tape 1 in a cycle period in polishing particle Path length.Finally, also the fight each other abrasion of grinding media of the pressing force that is applied on metal tape 1 of polishing medium 4,8 has an impact.Example Such as, the degree of wear can be determined by following formula：.

The degree of wear=coefficient × active force × ringing distance × cycle-index

Or

The degree of wear=coefficient × active force × ringing time × cycle-index

Especially with such polishing medium 4,8 polishing metal tape 1, polishing Jie in last polishing operation Matter has minimal wear degree.It thus avoids, the degeneration for medium 4,8 of polishing is excessively strong in last polishing operation.Example Minimal wear degree such as can be defined by value A1.

Metal tape 1 is especially the greatest wear journey for being also polished to polishing medium 4,8 always in last polishing operation Degree.It ensures in this fashion, polishing medium 4,8 has sufficiently large de-material effect remaining usage time sufficiently long in other words. Greatest wear degree can for example be defined by value A2.

The equipment shown in figures 3 and 4 includes the illustrative degree of aging for determining abrasive band 8 or the degree of wear and use In defeated when the abrasive band 8 in last polishing operation does not meet prespecified degree of aging or the prespecified degree of wear Go out the device of warning.For this purpose, in the shown embodiment, being equipped with analysis assessment or the alarm unit 11 of sensor 10 and electronics. Specifically, sensor 10 can be configured to displacement sensor or rotary angle transmitter or tachometer generator.The abrasion in abrasive band 8 is at this time Such as it can be provided as the product of ringing distance and cycle-index, wherein ringing distance corresponds essentially to two The level interval of a roller 5 and 6, and the determining position that cycle-index gives abrasive band 8 is made by or by the cycle With the frequency of distance.The number of cycle can for example be determined such as following formula by the revolution of roller 5：

The length in perimeter/abrasive band 8 of revolution × roller 5 of number=roller 5 of cycle

Can certainly it is as explained above as active force and/or a coefficient are used to determine the abrasion journey in abrasive band 8 Degree.It certainly, alternatively or additionally can also (i.e. a determining position in abrasive band 8 passes through the cycle by the ringing time Time needed for effect distance) or simply by the run time in abrasive band 8 for determining the degree of wear.

If the abrasive band 8 for last polishing operation does not meet determining regulation, i.e. degree of wear A is for example not at A1 In region between A2, then such case is reported to machine operator.It is also envisaged that in order to alarm, A1 and A2 it Between but close to A1 upper extreme value for determine for last polishing operation abrasive band 8 suitability, to ensure abrasive band 8 The remaining usage time also determined.

Certainly, above-mentioned design is applicable not only to abrasive band 8, and is also applied for other kinds of polishing medium, such as Grinding wheel and grinding roller 4.

It is frequently advantageous that, the contact between metal tape 1 and polishing medium 4 is realized on one wire, such as in fig 1 and 2 Illustrated by.For this purpose, abrasive band 8 can also be used by substituting grinding roller 4 or grinding wheel, the abrasive band is along a line contacting metal belt surface (also seeing Fig. 8 and 9).It is contacted by the line, especially can meet mesh under smaller polishing pressure as already described Ground to metal tape 1 carry out de-material.

It is also advantageous that the contact between metal tape 1 and polishing medium 8 carries out on one face, show as in Figures 3 and 4 As going out.It is possible thereby to which belt surface is made to homogenize or planarize particularly well.

Fig. 6 and 7 is presently shown another equipment for metal tape 1 of polishing (Fig. 6 is side view, and Fig. 7 is vertical view).This Kind equipment had both included the grinding roller 4 for metal tape 1 of laterally polishing, and also included the belt polishing dress for longitudinal metal tape 1 of polishing Set 6 to 8.The equipment for therefore also reasonably being suitable for showing in figs. 6 and 7 for the content described in Fig. 1 to 4.That is, it is possible to Laterally polishing can be carried out to metal tape and longitudinal direction is polished using shown equipment.In being configured shown in, laterally polishing is in longitudinal direction It is carried out before polishing.But can also polish metal tape 1 along longitudinal direction first in principle here, metal tape of then transversely polishing.

By means of the method shown in Fig. 6 and 7 another feature is that, longitudinal polishing carries out on whole bandwidth degree.By This can form the especially flat surface of metal tape 1.In addition transverse direction in figs. 6 and 7 is polished at one relative to entire band It is carried out on the region that width reduces, the region of the reduction is indicated for " E ".This polishing region can for example concentrate on as a result, Along the weld seam that the longitudinal direction of metal tape 1 extends, be thus kept away from the region of weld seam is not influenced by laterally polishing.Pass through Wider metal tape 1 can be made in this welding.But it is also contemplated that, longitudinal polishing is not in whole bandwidth degree in principle Upper progress and/or laterally polishing are the progress (also seeing Fig. 8 and 9) on whole bandwidth degree.

By means of the method shown in Fig. 6 and 7 another feature is that, using wider than the polishing medium for laterally polishing Polishing medium 8 polish for longitudinal.As a result, when laterally polishing, higher de-material can be realized with smaller polishing pressure Effect, on the contrary, the surface of metal tape 1 passes through the preferably planarizing (but also seeing Fig. 8 and 9) of wider abrasive band 8 when longitudinally polishing.

Laterally polishing and longitudinal polishing can also be carried out at the same time along the position that the longitudinal direction of metal tape 1 is staggered in principle. In figs. 6 and 7, grinding roller 4 and abrasive band 8 are activated simultaneously here.By this processing mode, metal tape can be particularly rapidly manufactured 1。

But it is also contemplated that laterally polishing and longitudinal polishing carry out in time before and after successive, that is, grinding roller 4 and abrasive band 8 do not activate simultaneously.It can be purposefully to result of polishing by making laterally polishing and longitudinal polishing disengaging be associated with Implement to influence.In addition, in principle there is also such possibility, for laterally polishing and longitudinal polishing be used only one it is single Grinding device, the grinding device (thus) are rotated by 90 ° (also see Fig. 8 and 9) respectively.To this advantageously, bruting process is preferred It is carried out on the metal tape 1 that annular is closed.

Fig. 8 and 9 is presently shown an embodiment, and the embodiment and the scheme that shows in figs. 6 and 7 are in principle very It is similar.But difference lies in now in order to which longitudinal polish uses single belt type grinding device 5 to 8 with laterally polishing with it.Figure 8 and 9 show the equipment in the position for longitudinally polishing.But here, belt type grinding device 5 to 8 can be in the embodiment party It is rotated by 90 ° (see the double-head arrow in Fig. 9) around its vertical axis in formula, thus only needs one with longitudinal polishing to laterally polish Single grinding device 5 to 8.Of course, it is possible to which substituting a single belt type grinding device 5 to 8 is also provided with two sseparated bands Formula grinding device 5 to 8, the two belt type grinding devices mutually turn over 90 °.

For the traverse feed along direction D, reasonably it is applicable in for the content described in Fig. 1 and 2.That is traverse feed Can reciprocally (such as triangle, zigzag or sinusoidal waveform) be carried out at the same time with the length feed along direction C, or when Between upper successively carry out.

In figs. 8 and 9, when laterally polishing and when longitudinally polishing, abrasive band 8 is all contacted along a line with metal tape 1. But it is also contemplated that for longitudinal polishing, on one face by the contact setting between abrasive band 8 and metal tape 1, such as also Illustrated by figures 3 and 4.This can be achieved like this, that is, be rotated relative to each other around its vertical axis there are two setting 90 ° of separated belt type grinding device 5 to 8, wherein setting is only pasted with roller 5 to the belt type grinding device 5 to 8 laterally polished By (line contact), and it is arranged and is uniformly set (face contact) in the belt type grinding device 5 to 8 and Fig. 3 and 4 longitudinally polished.But It can also alternatively set, a single belt type grinding device 5 to 8 can be not only rotated by 90 ° around vertical axis, Er Qieke Around the rotation of the axis of roller 5 (rotating 60 ° here), to switch so as to contact online between knead dough contacts.For two points The belt type grinding device 5 to 8 opened, there is also such possibilities, and different in width is used for longitudinal polishing and laterally polishing Abrasive band 8.In principle it is also contemplated that setting face can also be contacted between abrasive band 8 and metal tape 1 when laterally polishing.

By means of the method that shows in figs. 8 and 9 another feature is that, longitudinal polishing is not on whole bandwidth degree It carries out, but laterally polishing is the progress (also seeing region E) on whole bandwidth degree.In this case it is noted that along direction C Length feed can also be superimposed the reciprocating motion along direction D when longitudinally polishing, alternatively, the two movements can also be successively real It applies.

Figure 10 and 11 shows another scheme, the program and the scenario shown before this.But with its difference lies in, Grinding wheel 12 is used for laterally polishing, and grinding roller 4 is used for longitudinal polishing.In this case it is also noted that also may be used To imagine, for laterally polishing and longitudinal polishing also all using can be realized around the grinding roller 4 that its vertical axis is rotated by 90 ° (see Fig. 8 and 9)。

In addition, Figure 12 and 13 shows such embodiment, it is in this embodiment, enterprising in open metal tape 1 Row bruting process.Specifically, the metal tape 1 that will be polished thus is unwound from capstan winch 13, and by the metal tape volume 1 through polishing On another capstan winch 14.In this way, bruting process can also be narrow limited spatially to longer metal tape Upper progress.Certainly, all embodiments referred to so far can be used for polishing on open metal tape 1. It is of course also possible to be polished (and the not winding) metal tape 1 kept flat in a manner of given.

Figure 14 and 15 shows one embodiment, wherein belt type grinding device 6 to 8 is fixed on door type frame 15, the gate Frame can be moved by means of idler wheel 16 and track 17 along metal tape 1.It in this way especially can be flat to (open and) The metal tape 2 of smooth expansion is processed.Content described in embodiment for front is reasonably also applied for this equipment.When So, this door type structure is not enforceable, can also be by a universal manipulator (industrial machine to the polishing of metal tape 1 Device people) or multiple this manipulators implement.

Certainly, door type frame 15 and/or universal manipulator can also be with the metal tapes 1 of endless metal belt 1 or unwinding/winding Processing is used in combination.Relative motion between grinding device and metal tape 1 especially can pass through door type frame 1,5/0,000 at this time Movement to manipulator and/or the movement by metal tape 1 are realized.Such as the metal tape 1 that can be polished with piecewise, mode are, Relative motion between metal tape 1 and door type frame 15 can be realized only by the movement of door type frame 15 in polishing, and then Metal tape 1 is set to continue to move to next polishing section.

Figure 15 also clearly shows weld seam 18, and multiple portions can be connected into a metal tape 1 by means of the weld seam.It is described Weld seam can utilize belt type grinding device 6 to 8 along weld grinding.If be equipped with dedicated for lateral polishing on door type frame 15 Device (such as seeing Fig. 6 and 7), then can especially set, in the welded seam area G of weld seam 18 laterally and thus along The polishing metal tape 1 of weld seam 18.In this way it is possible to targetedly remove very much weld seam 18.Hereafter can to metal tape 1 into The longitudinal polishing of row.But it is also contemplated that when belt type grinding device be designed to as shown in FIG. 8 and 9 it is rotatable, then can profit Lateral polishing is carried out to weld seam 18 with belt type grinding device 6-8.Similar design is of course also apply to metal tape 1 to be welded into The weld seam of endless belt.

It is noted here that each bruting process can usually be carried out with multiple processes.Such as it can be with multiple processes Implement laterally polishing, and then also carries out longitudinal polishing with multiple processes.

Although explaining this manufacturing method with reference to the metal tape 1 that weld seam transversely orients, method described here is worked as The weld seam being longitudinally extended can also be so equally applicable to.The weld seam can laterally polish first, then longitudinal polishing.

It is frequently advantageous that, last polishing operation is executed with the polishing medium 4,8,12 that scleroma is closed.Such It polishes in medium 4,8,12, polishing particle is maintained in matrix for a long time, and polishing particle is embedded in the matrix.Therefore, Before polishing particle is detached from and the new polishing particle with tip and sharp seamed edge is made to expose, even polishing particle rounding Seamed edge also keep for a long time it is effective.Become especially uniformly using this polishing media tape surface 1.But in principle it is also contemplated that Using softer polishing medium 4,8,12.In general, polishing medium 4,8,12 hardness by alphabetical D=it is very soft to T=very It provides firmly.

Polish medium 4,8,12 tissue or structure by polish particle spacing provide and with from 0=closely to 14=is very sparse to express.In general, polishing of the sparse or close polishing media implementation to metal tape 1 can be utilized.

In general polishing particle can be considered using natural granular materials (quartz, corundum, diamond dust, pomegranate Stone, natural diamond) and synthesis granular materials (corundum, silicon carbide, chromium oxide, cubic boron nitride, diamond).

In addition particularly advantageously, last polishing operation is implemented with single polishing medium 4,8,12.Here advantageously It is kept for process time shorter and prevents occurring stage portion on belt surface after replacing polishing medium 4,8,12.For example, most Polishing operation afterwards can be carried out by means of the equipment shown in figures 3 and 4 so that beat the merging belt of used abrasive band 8 Mill apparatus 5 to 7 or the abrasive band have been in here, and 1 surround movement of metal tape is primary, that is implement cycle row Into.This abrasive band 8 is here without replacing.

Also particularly advantageously, last polishing operation with multiple agings or used polishing medium 4,8,12 Implement.In this way it is possible to further decrease the influence of the degeneration of polishing medium 4,8,12.This processing mode particularly suitable for Dedicated for king-sized metal tape 1 of polishing.Such as last polishing operation can be by means of equipment shown in figure 3 and 4 To realize so that used abrasive band 8 is placed in belt type grinding device 5-7 or has been positioned at here and polishes the one of metal tape 1 Part.Then another used abrasive band 8, and another part of the belt sanding metal tape 1 are placed in.This process can be with It repeats always, until entire belt surface is completed to polish.Used abrasive band is advantageously having the same or approximately uniform abrasion Degree A.Certainly last polishing operation can also be implemented using grinding roller 4 or grinding wheel 12.Here for the content described in abrasive band 8 Grinding roller 4 or grinding wheel 12 can also be reasonably applied to.

Usual metal tape 1 can be polished with dry type or wet type.In dry type polishing, being formed by polishing dust can be fine Ground siphons away, and can entirely prevent polishing dust occur in wet type polishing.Do not have furthermore, it is possible to be kept substantially polishing medium 4,8,12 There is deposit, and Working position is cooled down.When wet type is polished, such as oil, oil or water may be used as lubrication Agent.

In the embodiment shown before this based on the fact that, that is, polishing medium 4,8,12 and metal tape 1 between feeding Movement is relative to polishing direction oriented opposite.On the one hand, it is thus achieved that high cutting speed, another aspect, the removal of metal tape 1 Object, i.e. polishing dust or polishing mud get rid of from the surface through polishing or keep its far from the surface through polishing.Through polishing Therefore surface keeps more clean.

It is also contemplated that, the feed motion polished between medium 4,8,12 and metal tape 1 is relative to polishing in principle Direction orients in the same direction.On the one hand, thus reduce cutting speed, on the other hand, the remover of metal tape 1, that is, polish dust or Polishing mud gets rid of or keeps it far from the surface not yet polished from the surface not yet polished.Therefore it is practically without polishing ash Dirt reaches at Working position, it is possible thereby to realize the polishing result of high quality.

Each possible embodiment for implementing to exemplify the manufacturing method for metal tape 1, wherein should be noted that herein Be, the present invention is not limited to specifically shown embodiment itself, but each embodiment to each other different combination be also can Can and this scheme possibility based on being to the introduction of technological means through the invention skilled artisans appreciate that 's.That is the embodiment that the combination of all conceivable single details by shown or described embodiment obtains is all It can be achieved on.

It is especially also to confirm, shown equipment may also include more or fewer component parts in reality And what the equipment was sometimes simplifiedly shown very much in figure.

In order to meet regulation, finally it is also pointed out that the structure of shown equipment, the manufacture are set in order to better understand Standby and its component part is not with meeting ratio, and/or to show with enlarging and/or reducing sometimes.

The purpose of the solution of these independent creativeness can be obtained by specification.

In general, in this case it is noted that by embodiments and especially in Fig. 1 to 4 and 6 to 15 It provides mode can not only to carry out the polishing that metal tape 1 carries out using the polishing medium 4,8,12 of abrasion, but also can also use New, unworn polishing medium 4,8,12 carries out.Therefore in the case of the feature of no claim 1, special polishing Method can also constitute the basis of divisional application.It is alternative or additional in the polishing medium 4,8,12 used in figure, can also make With loose polishing medium, such as grind cream.

Reference numerals list

1 metal tape

2 rollers

3 rollers

4 grinding rollers

5 slewing rollers

6 slewing rollers

7 slewing rollers

8 abrasive bands

9 support plates

10 sensors

11 analysis assessments or alarm unit

12 grinding wheels

13 capstan winches

14 capstan winches

15 door type frames

16 idler wheels

17 tracks

18 weld seams

The A degrees of wear

The polishing directions of B transversely

The direction of C length feeds

The direction of D traverse feeds

Polishing region when E laterally polishes

Polishing region when F longitudinally polishes

G welded seam areas

R roughness

Claims (23)

1. the method for manufacturing metal tape (1), wherein with multiple processes at least on a side substantially in whole surface On polish the metal tape (1), which is characterized in that in last polishing operation with aging wear in other words beat Grinding media (4,8,12) polishes to metal tape (1).

2. according to the method described in claim 1, it is characterized in that, using with minimal wear journey in last polishing operation Polishing medium (4,8,12) the polishing metal tape (1) of degree.

3. method according to claim 1 or 2, which is characterized in that metal tape (1) quilt in last polishing operation It is polished to the greatest wear degree of the polishing medium (4,8,12) always.

4. method according to claim 1 to 3, which is characterized in that last polishing operation is beaten using what scleroma was closed Grinding media (4,8,12) carries out.

5. method according to claim 1 to 4, which is characterized in that last polishing operation utilizes single polishing Medium (4,8,12) carries out.

6. method according to claim 1 to 4, which is characterized in that it is characterized in that, the last polishing operation Using multiple agings or used polishing medium (4,8,12) has carried out.

7. method according to claim 1 to 6, which is characterized in that the metal tape (1) carry out laterally polishing and Longitudinal polishing.

8. method according to claim 1 to 7, which is characterized in that using grinding wheel (12) or grinding roller (4) to metal tape (1) it polishes.

9. method according to claim 1 to 8, which is characterized in that beaten metal tape (1) using abrasive band (8) Mill.

10. the method according to one of claim 1 to 9, which is characterized in that make the polishing medium (4,8,12) at one It is contacted with metal tape (1) on line.

11. the method according to one of claim 1 to 9, which is characterized in that make the polishing medium (4,8,12) at one It is contacted with metal tape (1) on face.

12. the method according to one of claim 1 to 11, which is characterized in that the metal of polishing on whole bandwidth degree Band (1).

13. the method according to one of claim 1 to 11, which is characterized in that in the area reduced relative to whole bandwidth degree The polishing metal tape (1) in domain (E).

14. the method according to one of claim 1 to 13, which is characterized in that metal tape of the bruting process in annular closed (1) it is carried out on.

15. the method according to one of claim 1 to 13, which is characterized in that bruting process is in open metal tape (1) Upper progress.

16. the method according to one of claim 1 to 15, which is characterized in that polish metal tape (1) to dry type.

17. the method according to one of claim 1 to 15, which is characterized in that wet type or under the auxiliary of lubricating oil it is right Metal tape (1) is polished.

18. the method according to one of claim 1 to 17, which is characterized in that polishing medium and metal tape (1) between into It is oppositely carried out to movement and polishing direction.

19. the method according to one of claim 1 to 17, which is characterized in that polishing medium and metal tape (1) between into It is carried out in the same direction to movement and polishing direction.

20. metal tape (1), which is characterized in that the metal tape utilizes the method system according to one of claim 1 to 19 It makes.

21. the equipment for manufacturing metal tape (1), the equipment includes for keeping and two rollers of moving metal strip (1) (2,3) or two capstan winches (13,14) and grinding device (4,8,12), the grinding device are used for multiple processes at least one Substantially polish in entire surface the metal tape (1) a side, which is characterized in that have for determine polishing medium (4,8, 12) degree of aging in other words the degree of wear and for when last polishing operation starts polish medium (4,8,12) do not meet Prespecified degree of aging or the device that alarm is exported when the prespecified degree of wear (A).

22. equipment according to claim 21, which is characterized in that the equipment has grinding wheel (12) or grinding roller (4).

23. equipment according to claim 21, which is characterized in that the equipment has abrasive band (8).