CN108200235B

CN108200235B - Output module and electronic device

Info

Publication number: CN108200235B
Application number: CN201711437437.1A
Authority: CN
Inventors: 吴安平
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-12-26
Filing date: 2017-12-26
Publication date: 2020-11-27
Anticipated expiration: 2037-12-26
Also published as: CN108200235A

Abstract

The invention discloses an output module. The output module comprises a packaging shell, a first infrared light source and a second infrared light source arranged around the first infrared light source. The package housing includes a package substrate. The first infrared light source and the second infrared light source are packaged in the packaging shell and are carried on the packaging substrate. When the second infrared light source is turned off and the first infrared light source emits infrared light to the outside of the packaging shell at a first power, the output module is used as a proximity infrared lamp; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell by second power, the output module is used as an infrared light supplement lamp. According to the output module disclosed by the embodiment of the invention, the first infrared light source and the second infrared light source are controlled to be turned on and off, the output module can be used as a proximity infrared lamp and an infrared light supplement lamp, the functions of infrared distance measurement and infrared light supplement by emitting infrared light are integrated, and the occupied space is small. In addition, the invention also discloses an electronic device.

Description

Output module and electronic device

Technical Field

The present invention relates to the field of consumer electronics technologies, and in particular, to an output module and an electronic device.

Background

Along with the functions supported by the mobile phone are more and more abundant and various, the types and the number of functional devices required to be set by the mobile phone are more and more, in order to realize the functions of distance detection, ambient light detection, facial 3D feature recognition of a user and the like, functional devices such as a proximity sensor, an ambient light sensor, an infrared camera, a structured light projector and the like need to be configured in the electronic equipment, and in order to arrange numerous functional devices, the mobile phone occupies too much space.

Disclosure of Invention

The embodiment of the invention provides an output module and an electronic device.

The output module comprises a packaging shell, a first infrared light source and a second infrared light source arranged around the first infrared light source, wherein the packaging shell comprises a packaging substrate, the first infrared light source and the second infrared light source are packaged in the packaging shell and are carried on the packaging substrate, and when the second infrared light source is closed and the first infrared light source emits infrared light to the outside of the packaging shell with first power, the output module is used as a proximity infrared lamp; when the first infrared light source and the second infrared light source are both started and emit infrared light to the outside of the packaging shell by second power, the output module is used as an infrared light supplement lamp.

An electronic device according to an embodiment of the present invention includes:

a housing; and

according to the output module provided by the embodiment of the invention, the output module is arranged in the shell.

In the output module and the electronic device of the embodiment of the invention, by controlling the on and off of the first infrared light source and the second infrared light source, the output module can be used as a proximity infrared lamp and an infrared light supplement lamp, and integrates the functions of infrared distance measurement and infrared light supplement by emitting infrared light. In addition, first infrared source and the integration of second infrared source are a single packaging body structure, and the integrated level of output module is higher, and the volume is less, and output module has practiced thrift the space that realizes infrared light filling and infrared range finding function. Moreover, the first infrared light source and the second infrared light source are borne on the same packaging substrate, and compared with the infrared light supplement lamp and the proximity infrared lamp which are manufactured by adopting different wafers respectively and then combined on a PCB substrate for packaging in the traditional process, the packaging efficiency is improved.

Additional aspects and advantages of embodiments of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of embodiments of the invention.

Drawings

The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:

FIG. 1 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

fig. 2 is a schematic perspective view of an output module of an electronic device according to an embodiment of the invention;

fig. 3 to 4 are schematic views illustrating states of an output module of an electronic device according to an embodiment of the invention;

FIG. 5 is a schematic cross-sectional view illustrating an output module of an electronic device according to an embodiment of the invention;

fig. 6 to 8 are schematic distribution diagrams of the first infrared light source and the second infrared light source of the output module according to the embodiment of the invention;

FIG. 9 is a partial perspective view of an output module of an electronic device according to an embodiment of the invention;

FIG. 10 is a schematic, partially cross-sectional view of an electronic device according to an embodiment of the invention;

fig. 11 is a schematic perspective view of a receiving module and an imaging module of an electronic device according to an embodiment of the invention;

fig. 12 is a schematic arrangement of electronic components of an electronic device according to an embodiment of the invention;

FIG. 13 is a schematic cross-sectional view of an output module of an electronic device according to an embodiment of the invention;

FIG. 14 is a perspective view of a proximity sensor and an imaging module according to an embodiment of the present invention;

FIG. 15 is a schematic structural diagram of an electronic device according to an embodiment of the invention;

FIG. 16 is a schematic, partially cross-sectional view of an electronic device according to an embodiment of the invention;

fig. 17 is a schematic perspective view of a receiving module and an imaging module according to an embodiment of the invention;

fig. 18 to 25 are schematic perspective views of a receiving module and an imaging module of an electronic device according to an embodiment of the invention.

Detailed Description

The following further describes embodiments of the present invention with reference to the drawings. The same or similar reference numbers in the drawings identify the same or similar elements or elements having the same or similar functionality throughout.

In addition, the embodiments of the present invention described below with reference to the accompanying drawings are exemplary only for the purpose of explaining the embodiments of the present invention, and are not to be construed as limiting the present invention.

In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.

Referring to fig. 1, an electronic device 100 according to an embodiment of the invention includes a housing 20, a cover 30, and electronic components. The electronic components include an output module 10, a receiving module 50 (see fig. 11), an imaging module 60 (see fig. 11), a receiver 70, and a structured light projector 80. The electronic device 100 may be a mobile phone, a tablet computer, a notebook computer, an intelligent watch, an intelligent bracelet, a teller machine, and the like, and the embodiment of the invention is described by taking the electronic device 100 as a mobile phone, it is understood that the specific form of the electronic device 100 may be other, and is not limited herein.

Referring to fig. 2 to 4, the output module 10 is a single package structure, and includes a package housing 11, a first infrared light source 12 and a second infrared light source 13.

The package housing 11 is used for simultaneously packaging the first infrared light source 12 and the second infrared light source 13, or the first infrared light source 12 and the second infrared light source 13 are simultaneously packaged in the package housing 11. The package housing 11 includes a package substrate 111, a package sidewall 112, and a package top 113. The package housing 11 may be made of an Electromagnetic Interference (EMI) shielding material to prevent external EMI from affecting the output module 10.

Referring to fig. 5, the package substrate 111 is used for carrying the first infrared light source 12 and the second infrared light source 13. In manufacturing the output module 10, the first infrared light source 12 and the second infrared light source 13 may be formed on one chip 14, and then the first infrared light source 12, the second infrared light source 13, and the chip 14 may be disposed on the package substrate 111 together, and specifically, the chip 14 may be bonded on the package substrate 111. Meanwhile, the package substrate 111 may also be used to connect with other components of the electronic device 100 (e.g., the housing 20 and the motherboard of the electronic device 100), so as to fix the output module 10 in the electronic device 100.

The package sidewall 112 may be disposed around the first infrared light source 12 and the second infrared light source 13, the package sidewall 112 extends from the package substrate 111, the package sidewall 112 may be combined with the package substrate 111, and preferably, the package sidewall 112 and the package substrate 111 are detachably connected, so as to facilitate the repair of the first infrared light source 12 and the second infrared light source 13 after the package sidewall 112 is removed. The package sidewall 112 may be made of an infrared opaque material to prevent infrared light from the first and second

infrared light sources

12 and 13 from passing through the package sidewall 112.

The package top 113 is opposite to the package substrate 111, and the package top 113 is connected to the package sidewall 112. The package top 113 is formed with a light emitting window 1131, the light emitting window 1131 corresponds to the first infrared light source 12 and the second infrared light source 13, and infrared light emitted from the first infrared light source 12 and the second infrared light source 13 passes through the light emitting window 1131. The package top 113 and the package side wall 112 may be formed integrally or separately. In one example, the light-emitting window 1131 is a through hole, and the package top 113 is made of a material opaque to infrared light. In another example, the package top 113 is made of a material that is opaque to infrared light and a material that is opaque to infrared light, specifically, the light emitting window 1131 is made of a material that is opaque to infrared light, and the rest of the light emitting window 1131 is made of a material that is opaque to infrared light, and further, the light emitting window 1131 may be formed with a lens structure to improve the emission angle of infrared light emitted from the light emitting window 1131, for example, the light emitting window 1131 is formed with a concave lens structure to diffuse light passing through the light emitting window 1131 to be emitted outward; the light emitting window 1131 is formed with a convex lens structure, so that light passing through the light emitting window 1131 is gathered and emitted outwards.

The first infrared light source 12 and the second infrared light source 13 can be formed on one chip 14, so that the volume of the integrated first infrared light source 12 and the integrated second infrared light source 13 is further reduced, and the preparation process is simple. The first infrared light source 12 and the second infrared light source 13 may emit infrared light. When the first infrared light source 12 and the second infrared light source 13 are both turned on and emit infrared light to the outside of the package housing 11 (as shown in fig. 3), the infrared light passes through the light emitting window 1131 to be projected onto the surface of the object, the infrared camera 62 (as shown in fig. 1) of the electronic device 100 receives the infrared light reflected by the object to obtain image information of the object, at this time, the output module 10 is used as an infrared fill-in lamp (i.e. for infrared fill-in), the light emitting area covered by the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 together for fill-in is large, and the field angle α of the infrared light for fill-in can be 60 degrees to 90 degrees, for example: the angle of view α of the fill-in infrared light is 60 degrees, 65 degrees, 70 degrees, 75 degrees, 80 degrees, 82 degrees, 85 degrees, 87 degrees, 90 degrees, or the like. When the second infrared light source 13 is turned off and the first infrared light source 12 emits infrared light to the outside of the package housing 11 (as shown in fig. 4), the infrared light passes through the light emitting window 1131 and reaches the surface of the object, the proximity sensor 51 of the electronic device 100 (as shown in fig. 11) receives the infrared light reflected by the object to detect the distance from the object to the electronic device 100, at this time, the output module 10 is used as a proximity infrared lamp (i.e. for infrared distance measurement), and the light emitting area covered by the infrared light emitted by the first infrared light source 12 for infrared distance measurement is small, and the field angle β of the infrared light for infrared distance measurement is 10 degrees to 30 degrees, for example: the angle of view β of the infrared light for infrared distance measurement is 10 degrees, 15 degrees, 20 degrees, 25 degrees, 30 degrees, or the like. In the embodiment of the present invention, the angle of field refers to a range covered by the infrared light exiting from the package case 11 through the light emission window 1131.

The output module 10 can emit infrared light to the outside of the package case 11 with different powers when used as an infrared fill light and when used as a near infrared light. The output module 10 emits infrared light to the outside of the package housing 11 with a first power when used as a proximity infrared lamp, and the output module 10 emits infrared light to the outside of the package housing 11 with a second power when used as an infrared fill light, where the first power may be smaller than the second power.

The second infrared light source 13 is disposed around the first infrared light source 12. The first infrared light source 12 and the second infrared light source 13 may be circular, annular, square, regular polygon, or the like as a whole. Can be as follows: the first infrared light source 12 is a point light source, and the second infrared light source 13 is also a point light source and is a plurality of (as shown in fig. 6); or the first infrared light source 12 is a point light source, and the second infrared light source 13 is a ring light source (as shown in fig. 7); or the first infrared light source 12 is a plurality of point light sources surrounding into a ring, and the second infrared light source 13 is a ring light source; or the first infrared light source 12 is a plurality of point light sources surrounding a ring, and the second infrared light source 13 is a plurality of point light sources (as shown in fig. 8); or the first infrared light source 12 is a ring light source; the second infrared light sources 13 are point light sources and are multiple in number; or the first infrared light source 12 is a ring light source; the second infrared light source 13 is a ring light source.

Referring to fig. 9, in the embodiment of the invention, a ground pin 15, a fill light pin 16 and a proximity light pin 17 are formed on the output module 10. The ground pin 15, the fill-in lamp pin 16, and the proximity lamp pin 17 may be formed on the package substrate 111, and when the ground pin 15 and the fill-in lamp pin 16 are enabled (i.e., when the ground pin 15 and the fill-in lamp pin 16 are connected to the circuit, the first infrared light source 12 and the second infrared light source 13 emit infrared light; when the ground pin 15 and the proximity lamp pin 17 are enabled (i.e., when the ground pin 15 and the proximity lamp pin 17 access circuit are on), the first infrared light source 12 emits infrared light.

Referring to fig. 1 and 10, the housing 20 may serve as a mounting carrier for the output module 10, or the output module 10 may be disposed in the housing 20. The housing 20 may be a housing of the electronic device 100, in the embodiment of the present invention, the housing 20 may further be used to set the display screen 90 of the electronic device 100, and since the volume occupied by the output module 10 according to the embodiment of the present invention is smaller, the volume occupied by the housing 20 to set the display screen 90 may be correspondingly increased, so as to increase the screen occupation ratio of the electronic device 100. Specifically, the housing 20 includes a top 21 and a bottom 22, the display screen 90 and the output module 10 are disposed between the top 21 and the bottom 22, and the top 21 is located above the bottom 22 in a state that the user normally uses the electronic device 100, as shown in fig. 1, and the output module 10 may be disposed between the display screen 90 and the top 21. In other embodiments, the display screen 90 may be a full screen with a gap, the display screen 90 surrounds the output module 10, and the output module 10 is exposed from the gap of the display screen 90.

The housing 20 further defines a housing through hole 23. When the output module 10 is disposed in the housing 20, the first infrared light source 12 and the second infrared light source 13 correspond to the housing through hole 23. The first infrared light source 12 and the second infrared light source 13 correspond to the housing through hole 23, which means that light emitted by the first infrared light source 12 and the second infrared light source 13 can pass through the housing through hole 23, specifically, the first infrared light source 12 and the second infrared light source 13 are opposite to the housing through hole 23, or the light emitted by the first infrared light source 12 and the second infrared light source 13 passes through the housing through hole 23 after being acted by the light guide element.

The cover plate 30 may be light-transmissive, and the material of the cover plate 30 may be light-transmissive glass, resin, plastic, or the like. The cover plate 30 is disposed on the chassis 20, the cover plate 30 includes an inner surface 32 combined with the chassis 20, and an outer surface 31 opposite to the inner surface 32, and the light emitted from the output module 10 sequentially passes through the inner surface 32 and the outer surface 31 and then passes through the cover plate 30. In the embodiment shown in fig. 10, the cover plate 30 covers the through hole 23 of the chassis, the inner surface 32 of the cover plate 30 is coated with the infrared transmissive ink 40, and the infrared transmissive ink 40 has a high transmittance to infrared light, for example, 85% or more, and a high attenuation to visible light, for example, 70% or more, so that it is difficult for a user to see the area of the electronic device 100 covered by the infrared transmissive ink 40 with naked eyes in normal use. Specifically, infrared-transmissive ink 40 may cover areas of inner surface 32 that do not correspond to display 90.

The infrared transparent ink 40 can also block the case through hole 23 (as shown in fig. 10), so that it is difficult for a user to see the internal structure of the electronic device 100 through the case through hole 23, and the appearance of the electronic device 100 is more beautiful.

Referring to fig. 11, the receiving module 50 is integrated with a proximity sensor 51 and a light sensor 52, and the proximity sensor 51 and the light sensor 52 form a single package structure. The output module 10 is used for receiving the infrared light emitted outwards when approaching the infrared lamp, and the infrared light is reflected by the external object and received by the proximity sensor 51, and the proximity sensor 51 determines the distance between the external object and the electronic device 100 according to the received reflected infrared light. The light sensor 52 receives the visible light in the ambient light and detects the intensity of the visible light as a basis for controlling the display brightness of the display 90. The proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the two modules during independent assembly is reduced, and the installation space in the electronic device 100 is saved.

Referring to fig. 1 and 11, the imaging module 60 may be one or both of a visible light camera 61 and an infrared camera 62. The imaging module 60 includes a lens mount 63, a lens barrel 64, and an image sensor 65. The lens barrel 64 is mounted on the lens holder 63, and the image sensor 65 is housed in the lens holder 63. The mirror base 63 includes a mounting surface 631, and the mounting surface 631 is located between the lens barrel 64 and the image sensor 65. In the embodiment shown in fig. 11, the receiving module 50 is disposed on the mounting surface 631, and specifically, the receiving module 50 at least partially falls onto the mounting surface 631 in the orthogonal projection of the plane where the mounting surface 631 is located, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the lateral space occupied by the two modules is small.

Referring to fig. 1, the receiver 70 is used for sending out an acoustic signal when being excited by a power supply, and a user can talk through the receiver 70. The structured light projector 80 is configured to emit structured light outwards, the structured light is reflected after being projected onto the object to be measured, the reflected structured light can be received by the infrared camera 62, and the processor of the electronic device 100 further analyzes the structured light received by the infrared camera 62 to obtain depth information of the object to be measured.

In the embodiment shown in fig. 1, the imaging module 60 includes a visible light camera 61 and an infrared light camera 62, and the centers of the output module 10, the infrared light camera 62, the visible light camera 61, the receiver 70 and the structured light projector 80 are located on the same line segment. Specifically, the output module 10, the structured light projector 80, the receiver 70, the infrared camera 62, and the visible light camera 61 (as shown in fig. 12) are sequentially arranged from one end to the other end of the line segment; or the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61 and the structured light projector 80 (as shown in fig. 1) are sequentially arranged from one end of the line segment to the other end; or the infrared camera 62, the output module 10, the receiver 70, the visible light camera 61 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment; or the infrared camera 62, the visible light camera 61, the receiver 70, the output module 10 and the structured light projector 80 are arranged in sequence from one end to the other end of the line segment. Of course, the arrangement of the output module 10, the infrared camera 62, the receiver 70, the visible light camera 61, and the structured light projector 80 is not limited to the above example, and may be other shapes such as a shape in which the centers of the respective electronic components are arranged in a circular arc shape and a shape in which the centers are arranged in a rectangular shape.

Further, referring to fig. 11, the receiving module 50 may be disposed on the mounting surface 631 of the infrared camera 62, or may be disposed on the mounting surface 631 of the visible light camera 61, of course, the receiving module 50 may not be disposed on the mounting surface 631, the receiving module 50 may be disposed adjacent to the output module 10, and the proximity sensor 51 is easy to receive the infrared light emitted by the output module 10 when serving as a proximity infrared lamp and reflected by an external object; the receiving module 50 can also be disposed adjacent to the receiver 70, and when the user answers the phone, the proximity sensor 51 can easily detect that the user's ear is close to the receiver 70.

In summary, in the electronic device 100 according to the embodiment of the invention, by controlling the first infrared light source 12 and the second infrared light source 13 to be turned on and off, the output module 10 can be used as both a proximity infrared lamp and an infrared light supplement lamp, and integrates functions of emitting infrared light for infrared distance measurement and infrared light supplement. In addition, first infrared light source 12 and second infrared light source 13 are integrated into a single packaging body structure, and output module 10's integrated level is higher, and the volume is less, and output module 10 has practiced thrift the space of realizing infrared light filling and infrared range finding's function. In addition, because the first infrared light source 12 and the second infrared light source 13 are supported on the same package substrate 111, compared with the infrared fill-in light and the proximity infrared light in the conventional process, which need to be manufactured by different wafers and then packaged on a PCB substrate, the packaging efficiency is improved.

Referring to fig. 5, in some embodiments, the output module 10 further includes a lens 18. A lens 18 is disposed within the package housing 11 and corresponds to the first infrared light source 12 and the second infrared light source 13. The infrared light emitted by the first infrared light source 12 and the second infrared light source 13 is converged into the light emitting window 1131 under the action of the lens 18 to be emitted, so as to reduce the light quantity emitted to other areas of the package sidewall 112 and the package top 113, and it only needs to be satisfied that the field angle α of the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 for light supplement after passing through the lens 18 is 60 degrees to 90 degrees, and the field angle β of the infrared light emitted by the first infrared light source 12 for infrared distance measurement after passing through the lens 18 is 10 degrees to 30 degrees. Specifically, the lens 18 may be located on a transparent substrate, and more specifically, the lens 18 may be integrally formed with the transparent substrate. Of course, the output module 10 may not be provided with the lens 18.

Referring to fig. 13, in some embodiments, output module 10 further includes an optical enclosure 19. The optical enclosure 19 is made of a light transmissive material, and the optical enclosure 19 is formed on the package substrate 111 and located within the package housing 11. An optical enclosure 19 encloses first infrared light source 12 and second infrared light source 13. Specifically, optical enclosure 19 may be formed by a potting injection molding process, optical enclosure 19 may be made of a transparent thermosetting epoxy to be not easily softened in use, optical enclosure 19 may fix the positions of first infrared light source 12 and second infrared light source 13, and make first infrared light source 12 and second infrared light source 13 not easily shake within package housing 11.

Referring to fig. 14, in some embodiments, the proximity sensor 51 and the optical sensor 52 may not be integrated in the receiving module 50, or the proximity sensor 51 and the optical sensor 52 are separately disposed. At this time, the proximity sensor 51 may be provided on the mounting surface 631 of the mirror base 63; the light sensor 52 may also be disposed on the mounting surface 631 of the mirror base 63; or the proximity sensor 51 is provided on the mounting surface 631 of the mirror base 63 together with the optical sensor 52. The lens mount 63 can be the lens mount 63 of the infrared camera 62, and can also be the lens mount 63 of the visible camera 61.

Referring to fig. 15, in some embodiments, the housing 20 further has a housing sound outlet (not shown), the cover 30 further has a cover sound outlet 34, and the receiver 70 corresponds to the positions of the cover sound outlet 34 and the housing sound outlet. The centers of the output module 10, the infrared camera 62, the visible light camera 61 and the structured light projector 80 are located on the same line segment, and the receiver 70 is located between the line segment and the top 21 of the housing 20.

The center of the receiver 70 is not located on the line segment, so that the lateral space occupied by each electronic component (the output module 10, the infrared camera 62, the visible light camera 61, the structured light projector 80, and the like) on the cover plate 30 is saved. In the embodiment shown in fig. 15, the cover sound outlet 34 is opened at the edge of the cover 30, and the case sound outlet is opened near the top 21.

Referring to fig. 16, in some embodiments, the cover plate 30 may further have a cover plate through hole 33, the cover plate through hole 33 corresponds to the case through hole 23, and the infrared light emitted by the first infrared light source 12 and the second infrared light source 13 may pass through the case through hole 23 and then pass out of the electronic device 100 from the cover plate through hole 33.

Referring to fig. 17, in some embodiments, the imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be further fixed on the substrate 66. Specifically, the substrate 66 is provided with an FPC, a part of the substrate 66 is located in the mirror base 63, another part of the substrate extends out of the mirror base 63, one end of the FPC is located in the mirror base 63 and is used for bearing the image sensor 65, and the other end of the FPC can be connected with a main board of the electronic device 100. When the receiving module 50 is disposed on the substrate 66, the receiving module 50 is disposed outside the lens holder 63, and the receiving module 50 may be connected to an FPC.

Further, the receiving module 50 disposed on the substrate 66 includes a proximity sensor 51 and a light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so that a gap between the two when they are separately assembled is reduced, and an installation space in the electronic device 100 is saved. In other embodiments, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and/or the light sensor 52, and each of the proximity sensor 51 and the light sensor 52 is a single package structure. That is, the proximity sensor 51 in which the receiving module 50 provided on the substrate 66 has a single package structure; alternatively, the photo sensor 52 with a single package structure is disposed on the receiving module 50 of the substrate 66; alternatively, the receiving module 50 disposed on the substrate 66 is a proximity sensor 51 of a single package structure and a photosensor 52 of a single package structure.

The imaging module 60 may be one or two of a visible light camera 61 and an infrared light camera 62. Specifically, the receiving module 50 may be fixed on the substrate 66 of the visible light camera 61; the receiving module 50 may be fixed on the substrate 66 of the infrared camera 62. When the proximity sensor 51 and the optical sensor 52 are separately packaged, the proximity sensor 51 may be fixed on the substrate 66 of the visible light camera 61, and the optical sensor 52 may be fixed on the substrate 66 of the infrared light camera 62; alternatively, the photosensor 52 may be fixed on the substrate 66 of the visible light camera 61, and the proximity sensor 51 may be fixed on the substrate 66 of the infrared light camera 62; alternatively, the proximity sensor 51 and the optical sensor 52 are both fixed on the substrate 66 of the visible light camera 61; alternatively, the proximity sensor 51 and the optical sensor 52 are both fixed to the substrate 66 of the infrared camera 62.

Further, the substrate 66 further includes a reinforcing plate disposed on a side opposite to the receiving module 50 to increase the overall strength of the substrate 66, so that the FPC is not prone to being folded, and the receiving module 50 (or the proximity sensor 51 or the light sensor 52) is not prone to shaking when disposed on the substrate 66. In one example, the receiving module 50 (or the proximity sensor 51 or the optical sensor 52) may also be fixed on the outer sidewall of the mirror base 63, for example, by bonding.

Referring to fig. 18, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 includes an image sensor 65, a camera housing 67 and a lens module 68. The top surface 670 of the camera housing 67 is a stepped surface, the top surface 670 includes a first sub-top surface 671, a second sub-top surface 672 and a third sub-top surface 673, the second sub-top surface 672 is connected to the first sub-top surface 671 in an inclined manner and forms a notch 675 with the first sub-top surface 671, the third sub-top surface 673 is connected to the second sub-top surface 672 in an inclined manner, and the second sub-top surface 672 is located between the first sub-top surface 671 and the third sub-top surface 673 to connect the first sub-top surface 671 and the third sub-top surface 673. The angle between the second sub top surface 672 and the first sub top surface 671 may be an obtuse angle or a right angle, and the angle between the second sub top surface 672 and the third sub top surface 673 may be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The third sub-top surface 673 is provided with a light-emitting through hole 674, and the lens module 68 is accommodated in the camera housing 67 and corresponds to the light-emitting through hole 674. The image sensor 65 is accommodated in the camera housing 67 and corresponds to the lens module 68, light outside the electronic device 100 can pass through the light-out hole 674 and the lens module 68 and be transmitted to the image sensor 65, and the image sensor 65 converts an optical signal into an electrical signal. The receiving module 50 is disposed at the first sub-top surface 671, and the receiving module 50 includes a proximity sensor 51 and a photosensor 52. In the present embodiment, the imaging module 60 may be a visible light camera 61, and the receiving module 50 is a single package structure formed by the proximity sensor 51 and the optical sensor 52. The direction of the center line connecting the proximity sensor 51 and the light sensor 52 may coincide with the extending direction of the slit 675 (as shown in fig. 18); alternatively, the direction of the central line connecting the proximity sensor 51 and the optical sensor 52 may be perpendicular to the extending direction of the slit 675 or an included angle formed by the two may be an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62.

The imaging module 60 of the present embodiment has a notch 675, and the receiving module 50 is disposed on the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the two occupy a smaller lateral space, thereby saving the installation space in the electronic device 100; meanwhile, the proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the proximity sensor 51 and the optical sensor when the proximity sensor and the optical sensor are independently assembled is reduced, and the installation space in the electronic device 100 is saved.

With reference to fig. 18, in some embodiments, the receiving module 50 of the above embodiments is disposed on the first sub-top surface 671 and located outside the camera housing 67, and specifically, a projection of the entire receiving module 50 along a direction perpendicular to the first sub-top surface 671 may be located inside the first sub-top surface 671 (as shown in fig. 18); alternatively, a part of the receiving module 50 is located in the first sub-top surface 671 along a projection perpendicular to the first sub-top surface 671. That is, at least a portion of the receiving module 50 is located directly above the first sub-top surface 671, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the occupied lateral space is small, thereby further saving the installation space in the electronic device 100. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the optical sensor 52, but the proximity sensor 51 and the optical sensor 52 are two separate single package structures, and in this case, the proximity sensor 51 and the optical sensor 52, which are each a single package structure, may also be both disposed on the first sub-top surface 671.

Referring to fig. 19, in some embodiments, the receiving module 50 of the above embodiments only includes the proximity sensor 51 and does not include the optical sensor 52, in this case, the proximity sensor 51 (or the receiving module 50) and the optical sensor 52 are respectively of a single package structure, the proximity sensor 51 is disposed on the first sub-top surface 671, and the optical sensor 52 is disposed at any other position except the first sub-top surface 671.

Referring to fig. 19, in some embodiments, the receiving module 50 of the above embodiments only includes the optical sensor 52 and does not include the proximity sensor 51, in which case, the optical sensor 52 (or the receiving module 50) and the proximity sensor 51 are each a single package structure, the optical sensor 52 is disposed on the first sub-top surface 671, and the proximity sensor 51 is disposed at any other position except the first sub-top surface 671.

Referring to fig. 20, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the proximity sensor 51 without the photosensor 52, and the photosensor 52 is disposed outside the camera housing 67, the number of the light-transmitting holes 676 may be one, and light outside the electronic device 100 can pass through the light-transmitting holes 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 20, the first sub-top surface 671 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light holes 676 may be one, and light outside the electronic device 100 can pass through the light holes 676 and be transmitted to the light sensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 21, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 integrates the proximity sensor 51 and the light sensor 52, the light hole 676 can be one light hole corresponding to both the proximity sensor 51 and the light sensor 52 or two light holes spaced apart from each other and corresponding to the proximity sensor 51 and the light sensor 52, respectively, and light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are of two separate single-package structures, and in this case, the proximity sensor 51 and the light sensor 52, which are of the single-package structure, may be both disposed in the camera housing 67 and correspond to the light-transmitting hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 21, in some embodiments, the first sub-top surface 671 of the above embodiments is formed with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be fixed on the substrate 66 and accommodated in the camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the receiving module 50 may be connected to an FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and the light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so as to reduce a gap between the two when they are separately assembled, and save an installation space in the electronic device 100.

In other embodiments, the receiving module 50 only includes the proximity sensor 51, and the optical sensor 52 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the proximity sensor 51, the optical sensor 52 is also a single package structure, and the optical sensor 52 can be fixed on the substrate 66 and accommodated in the camera housing 67; alternatively, when a part of the substrate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the light sensor 52 may be fixed to the substrate 66 and located outside the camera housing 67.

In another embodiment, the receiving module 50 only includes the optical sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the optical sensor 52, the proximity sensor 51 is also a single package structure, and the proximity sensor 51 can be fixed on the substrate 66 and accommodated in the camera housing 67; alternatively, when a part of the base plate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the proximity sensor 51 may be fixed to the base plate 66 and located outside the camera housing 67.

The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20; meanwhile, the imaging module 60 sets the substrate 66 and sets the receiving module 50 on the substrate 66, so that the receiving module 50 can be stably installed in the camera housing 67.

Referring to fig. 22, in some embodiments, the electronic device 100 and the imaging module 60 of the above embodiments may be replaced with the following structures: the imaging module 60 is a dual-camera module, and includes two image sensors 65, a camera housing 67, and two lens modules 68. The top surface 670 of the camera housing 67 is a stepped surface, and the top surface 670 includes a first step surface 677, a second step surface 678 lower than the first step surface 677, and a first connection surface 679 a. The first connecting surface 679a is obliquely connected with the second tread 678 and forms a notch 675 with the second tread 678, the first connecting surface 679a is obliquely connected with the first tread 677, and the first connecting surface 679a is positioned between the first tread 677 and the second tread 678 to connect the first tread 677 with the second tread 678. The included angle between the first connecting surface 679a and the first tread 677 can be an obtuse angle or a right angle, and the included angle between the first connecting surface 679a and the second tread 678 can be an obtuse angle or a right angle. A cutout 675 is opened in one end of the camera housing 67, that is, the cutout 675 is located at an edge position of the top surface 670. The two light-emitting through holes 674 are arranged on the first ladder surface 677 and are located on the same side of the cut 675, and a central connecting line of the two light-emitting through holes 674 is perpendicular to the extending direction of the cut 675. The two lens modules 68 are accommodated in the camera housing 67 and respectively correspond to the two light-emitting through holes 674, the two image sensors 65 are accommodated in the camera housing 67 and respectively correspond to the two lens modules 68, and light outside the electronic device 100 can pass through the light-emitting through holes 674 and the lens modules 68 and is transmitted to the image sensors 65. In the present embodiment, the imaging module 60 can be a visible light camera 61, and at this time, both the two lens modules 68 are lens modules corresponding to the visible light camera 61. The receiving module 50 is disposed on the second step face 678 and is located outside the camera housing 67. The receiving module 50 is a single package structure formed by the proximity sensor 51 and the optical sensor 52. The direction of the central line connecting the proximity sensor 51 and the light sensor 52 may coincide with the extending direction of the slit 675; alternatively, the direction of the center line connecting the proximity sensor 51 and the optical sensor 52 may be perpendicular to the extending direction of the slit 675 (as shown in fig. 22) or an acute angle or an obtuse angle. In other embodiments, the imaging module 60 may be an infrared camera 62, and both of the lens modules 68 correspond to the infrared camera 62. In another embodiment, the imaging module 60 includes a visible light camera 61 and an infrared camera 62, and in this case, one of the lens modules 68 is a lens module corresponding to the infrared camera 62, and the other lens module 68 is a lens module corresponding to the visible light camera 61.

The imaging module 60 of the present embodiment has a notch 675, and the receiving module 50 is disposed on the second step surface 678, so that the receiving module 50 and the imaging module 60 are disposed compactly, and the two occupy a smaller lateral space, thereby saving the installation space in the electronic device 100; meanwhile, the proximity sensor 51 and the optical sensor 52 are packaged together to form the receiving module 50, so that the gap between the proximity sensor 51 and the optical sensor when the proximity sensor and the optical sensor are independently assembled is reduced, and the installation space in the electronic device 100 is saved.

Referring to fig. 23, in some embodiments, the cut 675 of the above embodiments is formed in the middle of the top surface 670, the first tread 677 is divided into a first sub-tread 677a and a second sub-tread 677b by the cut 675, the first sub-tread 677a and the second sub-tread 677b are respectively located on two opposite sides of the cut 675, two light-exiting through holes 674 are respectively formed in the first sub-tread 677a and the second sub-tread 677b, and the lens modules 68 mounted in the camera housing 67 are also located on two opposite sides of the cut 675. At this time, the cutout 675 is defined by the second step surface 678, the first connecting surface 679a and the second connecting surface 679b, the first connecting surface 679a connects the first sub top surface 677a and the second step surface 678 obliquely and is located between the first sub top surface 677a and the second step surface 678, and the second connecting surface 679b connects the second sub top surface 677b and the second step surface 678 obliquely and is located between the second sub top surface 677b and the second step surface 678. In this embodiment, the first terraced surface 677 is parallel to the second terraced surface 678, an included angle between the first connection surface 679a and the first sub terraced surface 677a is an obtuse angle, and an included angle between the second connection surface 679b and the second sub terraced surface 677b is an obtuse angle. In other embodiments, the first connection surface 679a and the first sub-step surface 677a form a right angle, and the second connection surface 679b and the second sub-step surface 677b form a right angle. The cutout 675 of the present embodiment is opened at the middle position of the top surface 670, relative to the cutout 675 opened at the edge position of the top surface 670, so that the width of the cutout 675 is wider, thereby facilitating the positioning of the receiving module 50 on the second tread 678.

Referring to fig. 22 and 23, in some embodiments, the receiving module 50 of the above embodiments is disposed on the second step 678 and is located outside the camera housing 67. Specifically, when the cut 675 is opened at the edge of the top surface 670, the projection of the whole receiving module 50 along the direction perpendicular to the second step surface 678 can be located in the second step surface 678; alternatively, a projection of a portion of the receiving module 50 along a direction perpendicular to the second tread 678 is located within the second tread 678 (as shown in fig. 22). That is, at least a portion of the receiving module 50 is located directly above the second step surface 678. When the cutout 675 is opened at the middle position of the top surface 670, the whole receiving module 50 can be located in the second step surface 678 along the projection perpendicular to the second step surface 678 (as shown in fig. 23). Thus, the receiving module 50 and the imaging module 60 are arranged compactly, and the horizontal space occupied by the receiving module and the imaging module is small, so that the installation space in the electronic device 100 is further saved. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are of two separate single-package structures, and in this case, the proximity sensor 51 and the light sensor 52, which are of the single-package structure, may also be both disposed on the second step surface 678.

Referring to fig. 23, in some embodiments, the receiving module 50 of the above embodiments only includes the proximity sensor 51, and the receiving module 50 does not include the optical sensor 52, in this case, the proximity sensor 51 (or the receiving module 50) and the optical sensor 52 are respectively a single package structure, the proximity sensor 51 is disposed on the second step surface 678, and the optical sensor 52 is disposed on the housing 20 outside the imaging module 60.

Referring to fig. 23, in some embodiments, the receiving module 50 of the above embodiments only includes the optical sensor 52, and the receiving module 50 does not include the proximity sensor 51, in this case, the optical sensor 52 (or the receiving module 50) and the proximity sensor 51 are respectively a single package structure, the optical sensor 52 is disposed on the second step surface 678, and the proximity sensor 51 is disposed on the housing 20 outside the imaging module 60.

Referring to fig. 24, the second step surface 678 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the proximity sensor 51 without the photosensor 52, and the photosensor 52 is disposed outside the camera housing 67, the number of the light-transmitting holes 676 may be one, and light outside the electronic device 100 can pass through the light-transmitting holes 676 and be transmitted to the proximity sensor 51. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 24, the second step surface 678 of the above embodiment is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 includes only the light sensor 52 without the proximity sensor 51, and the proximity sensor 51 is disposed outside the camera housing 67, the number of the light holes 676 may be one, and light outside the electronic device 100 can pass through the light holes 676 and be transmitted to the light sensor 52. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 25, in some embodiments, the second step surface 678 of the above embodiments is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. Specifically, when the receiving module 50 integrates the proximity sensor 51 and the light sensor 52, the light hole 676 can be one light hole corresponding to both the proximity sensor 51 and the light sensor 52 or two light holes spaced apart from each other and corresponding to the proximity sensor 51 and the light sensor 52, respectively, and light outside the electronic device 100 can pass through the light hole 676 and be transmitted to the proximity sensor 51 and the light sensor 52 in the receiving module 50. In other embodiments, the receiving module 50 includes the proximity sensor 51 and the light sensor 52, but the proximity sensor 51 and the light sensor 52 are of two separate single-package structures, and in this case, the proximity sensor 51 and the light sensor 52, which are of the single-package structure, may be both disposed in the camera housing 67 and correspond to the light-transmitting hole 676. The receiving module 50 of the present embodiment is disposed in the camera housing 67, so that the receiving module 50 and the camera housing 67 have more stable structures and the receiving module 50 and the imaging module 60 are conveniently mounted on the housing 20.

Referring to fig. 25, in some embodiments, the second step surface 678 of the above embodiments is provided with a light hole 676, and the receiving module 50 is located in the camera housing 67 and corresponds to the light hole 676. The imaging module 60 further includes a substrate 66, the image sensor 65 is disposed on the substrate 66, and the receiving module 50 can be fixed on the substrate 66 and accommodated in the camera housing 67. Specifically, the substrate 66 is provided with an FPC, one end of which is located in the camera housing 67 and is used for carrying the image sensor 65, and the other end of which can be connected to a main board of the electronic device 100. In other embodiments, the receiving module 50 may be connected to an FPC. In this embodiment, the receiving module 50 disposed on the substrate 66 includes the proximity sensor 51 and the light sensor 52, and the proximity sensor 51 and the light sensor 52 together form a single package structure, so as to reduce a gap between the two when they are separately assembled, and save an installation space in the electronic device 100.

In another embodiment, the receiving module 50 only includes the optical sensor 52, and the proximity sensor 51 is not integrated in the receiving module 50, that is, the receiving module 50 is a single package structure of the optical sensor 52, the proximity sensor 51 is also a single package structure, and the proximity sensor 51 can be fixed on the substrate 66 and housed in the camera housing 67; alternatively, when a part of the base plate 66 is located inside the camera housing 67 and another part thereof protrudes from the camera housing 67, the proximity sensor 51 may be fixed to the base plate 66 and located outside the camera housing 67.

In the description of the specification, reference to the terms "certain embodiments," "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples" means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, unless specifically limited otherwise.

Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments within the scope of the present invention, which is defined by the claims and their equivalents.

Claims

1. An output module is characterized by comprising a packaging shell, a first infrared light source and a second infrared light source arranged around the first infrared light source, wherein the packaging shell comprises a packaging substrate, the first infrared light source and the second infrared light source are packaged in the packaging shell and are carried on the packaging substrate, and when the second infrared light source is turned off and the first infrared light source emits infrared light to the outside of the packaging shell with first power, the output module is used as a proximity infrared lamp; when the first infrared light source and the second infrared light source are both started and emit infrared light rays to the outside of the packaging shell together at a second power, the output module is used as an infrared light supplement lamp;

the output module further comprises an optical sealing cover made of a light-transmitting material, the optical sealing cover is formed on the packaging substrate and is positioned in the packaging shell, and the optical sealing cover wraps the first infrared light source and the second infrared light source and fills the cavity where the first infrared light source and the second infrared light source are located;

the packaging shell further comprises a packaging side wall and a packaging top, the packaging side wall extends from the packaging substrate and is connected between the packaging top and the packaging substrate, a light-emitting window is formed in the packaging top, the light-emitting window corresponds to the first infrared light source and the second infrared light source, and a concave lens structure is formed in the light-emitting window.

2. The output module of claim 1,

the first infrared light sources are point light sources, and the second infrared light sources are multiple point light sources; or

The first infrared light source is a point light source, and the second infrared light source is an annular light source; or

The first infrared light source is a plurality of point light sources which surround into a ring, and the second infrared light source is a ring light source; or

The first infrared light sources are a plurality of point light sources which surround into a ring, and the second infrared light sources are a plurality of point light sources; or

The first infrared light source is an annular light source; the second infrared light sources are point light sources and are multiple in number; or

The first infrared light source is an annular light source; the second infrared light source is an annular light source.

3. The output module of claim 1, further comprising a chip, wherein the first infrared light source and the second infrared light source are formed on one piece of the chip.

4. The output module of claim 3, further comprising a lens disposed within the package housing and corresponding to the first and second infrared light sources.

5. The output module of claim 3, further comprising a lens disposed within the package housing, the lens corresponding to the first and second infrared light sources, the lens being on a transparent substrate.

6. The output module according to any one of claims 1 to 5, wherein a ground pin, a fill light pin and a proximity light pin are formed on the output module, and when the ground pin and the proximity light pin are enabled, the first infrared light source emits infrared light; when the grounding pin and the light supplement lamp pin are enabled, the first infrared light source and the second infrared light source emit infrared light.

7. An electronic device, comprising:

a housing; and

the output module of any of claims 1-6, disposed within the housing.

8. The electronic device of claim 7, further comprising a transparent cover plate, wherein the housing defines a housing opening, the first infrared light source and the second infrared light source correspond to the housing opening, and the cover plate is disposed on the housing.

9. The electronic device according to claim 7, further comprising a transparent cover plate, wherein the housing has a housing through hole, the first infrared light source and the second infrared light source correspond to the housing through hole, the cover plate is disposed on the housing, an infrared transparent ink that only transmits infrared light is formed on a surface of the cover plate that is combined with the housing, and the infrared transparent ink covers the housing through hole.

10. The electronic device according to claim 7, further comprising a receiving module and an imaging module, wherein the receiving module integrates a proximity sensor and a light sensor, the imaging module comprises a lens base, a lens barrel mounted on the lens base, and an image sensor accommodated in the lens base, the lens base comprises a mounting surface between the lens barrel and the image sensor, and the receiving module is disposed on the mounting surface.

11. The electronic device of claim 7, further comprising a proximity sensor, a light sensor, and an imaging module, wherein the imaging module comprises a lens base, a lens barrel mounted on the lens base, and an image sensor housed in the lens base, the lens base comprises a mounting surface located between the lens barrel and the image sensor, and at least one of the proximity sensor and the light sensor is disposed on the mounting surface.

12. The electronic device of claim 10 or 11, wherein the imaging module comprises at least one of a visible light camera and an infrared camera.

13. The electronic device of claim 7, further comprising an infrared camera, a visible light camera, a receiver, and a structured light projector, wherein centers of the output module, the infrared camera, the visible light camera, the receiver, and the structured light projector are located on a same line segment, and sequentially from one end to the other end of the line segment:

the output module, the structured light projector, the receiver, the infrared camera and the visible light camera; or

The output module, the infrared camera, the telephone receiver, the visible light camera and the structured light projector; or

The infrared camera, the output module, the telephone receiver, the visible light camera and the structured light projector; or

The infrared camera, the visible light camera, the telephone receiver, the output module and the structured light projector.

14. The electronic device of claim 7, further comprising a receiver, an infrared camera, a visible light camera, a structured light projector, and a transparent cover plate, wherein the housing has a housing sound outlet, the cover plate has a cover plate sound outlet, the receiver corresponds to the cover plate sound outlet and the housing sound outlet, the centers of the output module, the infrared camera, the visible light camera, and the structured light projector are located on a same line, and the receiver is located between the line and the top of the housing.