CN108173019B - Communication interface structure and electronic equipment - Google Patents
Communication interface structure and electronic equipment Download PDFInfo
- Publication number
- CN108173019B CN108173019B CN201711417797.5A CN201711417797A CN108173019B CN 108173019 B CN108173019 B CN 108173019B CN 201711417797 A CN201711417797 A CN 201711417797A CN 108173019 B CN108173019 B CN 108173019B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- communication interface
- contact terminal
- board substrate
- connecting line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
- H01R12/722—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures coupling devices mounted on the edge of the printed circuits
- H01R12/727—Coupling devices presenting arrays of contacts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
The present invention relates to a kind of communication interface structures, it is connect for the communication interface with docking, including circuit board substrate, the edge of the circuit board substrate has connecting plate, contact terminal and connecting line are provided on the circuit board substrate, the contact terminal with the communication interface of the docking for connecting, and the contact terminal is arranged on the connecting plate, and the connecting line with the contact terminal for being correspondingly connected with.The invention further relates to a kind of electronic equipment.The beneficial effects of the present invention are: contact terminal is directly made on circuit board substrate, eliminate the tongue piece of plastic cement production in the prior art, improve the tongue piece as made of plastic cement and caused by the contact terminal be easy to be corroded or occurs short-circuit problem.
Description
Technical field
The present invention relates to communication product manufacture technology field more particularly to a kind of communication interface structures and electronic equipment.
Background technique
The charging of USB (Universal Serial Bus, universal serial bus) and data transmission interface are all logical at present
Cross the mutual cooperation realization of USB socket and plug.As shown in Figure 1, socket includes shell 3, the tongue piece being fixed in shell 32,
The contact terminal 1 being set on tongue piece, one end of contact terminal 1 pass through the shell 3 and weld with the circuit board being located at outside shell 3
It connects, has the following problems:
Tongue piece is generally plastic cement and is made, and tongue piece and is set between the contact terminal on tongue piece there may be gap, is easy
Occur to enter due to liquid or foreign matter the gap, contact terminal is caused to be corroded or short circuit.
Summary of the invention
In order to solve the above technical problem, the present invention provides a kind of communication interface structure and electronic equipments, improve contact jaw
Son is easy to be corroded or occur the problem of short circuit.
In order to achieve the above object, the technical solution adopted by the present invention is that: a kind of communication interface structure, for dock
Communication interface connection；A kind of communication interface structure is connect, which is characterized in that including circuit board for the communication interface with docking
Substrate, the edge of the circuit board substrate have connecting plate, are provided with contact terminal and connecting line on the circuit board substrate,
The contact terminal with the communication interface of the docking for connecting, and the contact terminal is arranged on the connecting plate, institute
Connecting line is stated for being correspondingly connected with the contact terminal.
The beneficial effects of the present invention are: contact terminal is directly made on circuit board substrate, eliminate in the prior art
The tongue piece of plastic cement production, improve the tongue piece as made of plastic cement and caused by the contact terminal be easy to be corroded or occur it is short
The problem of road.
Detailed description of the invention
Fig. 1 shows the side sectional views of communication interface socket in the prior art；
Fig. 2 indicates the side sectional view of communication interface socket in one embodiment of the embodiment of the present invention；
Fig. 3 indicates that contact terminal connection schematic diagram is arranged in one embodiment of the embodiment of the present invention on circuit board substrate；
Fig. 4 indicates the side sectional view of communication interface socket in another embodiment of the embodiment of the present invention；
Fig. 5 indicates the connection schematic diagram that contact terminal is arranged in another embodiment of the embodiment of the present invention on circuit board substrate
One；
Fig. 6 indicates the connection schematic diagram that contact terminal is arranged in another embodiment of the embodiment of the present invention on circuit board substrate
Two；
Fig. 7 indicates the side sectional view of Fig. 6.
Specific embodiment
Feature and principle of the invention are described in detail below in conjunction with attached drawing, illustrated embodiment is only used for explaining this hair
It is bright, not limited the scope of protection of the present invention with this.
As illustrated in figs. 2-7, the present embodiment provides a kind of communication interface structures, connect for the communication interface with docking；Packet
Circuit board substrate 4 is included, the edge of the circuit board substrate 4 has connecting plate 41, is provided with and is used on the circuit board substrate 4
The contact terminal 1 being connect with the communication interface of the docking, and the connecting line 2 being correspondingly connected with the contact terminal 1, it is described to connect
Contravention is arranged on the connecting plate 41.
The connecting plate 41 and the circuit board substrate 4 are integral structures, and the contact terminal 1 is set to the connecting plate
On 41, that is to say, that the contact terminal 1 is directly made on circuit board substrate 4, eliminates plastic cement production in the prior art
Tongue piece, improve the tongue piece as made of plastic cement and caused by the contact terminal 1 be easy to be corroded or occur the problem of short circuit,
And it reduces the production cost.
The communication interface structure further includes shell 3, and the shell 3 includes being inserted into for the communication interface for the docking
Open end and the closed end that is oppositely arranged with the open end, the shell 3 cover at outside the connecting plate 41.It is described outer
The setting of shell 3 defines the space of the communication interface insertion of docking, conducive to the connection of the communication interface of docking.
The circuit board substrate 4 is structure as a whole with the connecting plate 41, and the circuit board substrate 4 is located at the shell 3
Outside.
In one embodiment of the present embodiment, the circuit board substrate 4 is equipped with circuit, and the contact terminal 1 passes through described
Circuit connection on connecting line 2 and the circuit board substrate 4.That is, the circuit board of the circuit board substrate 4 and electronic equipment is integrated
It is structure as a whole, that is to say, that the circuit board substrate 4 directlys adopt the circuit board of electronic equipment, the communication interface structure
Directly production is formed on the circuit board of electronic equipment, as shown in Figures 2 and 3.
The circuit board substrate 4 includes the first surface and second surface being disposed opposite to each other, according to actual needs, described first
The contact terminal 1 and the connecting line 2 are provided on surface or the second surface, that is, only in the side of circuit board substrate 4
The contact terminal and the connecting line 2 is arranged in surface；Alternatively, being respectively provided on the first surface and the second surface
State contact terminal 1 and the connecting line 2.
The contact terminal 1 and the connecting line 2 on the same surface of the circuit board substrate 4 are using etching mode
The integral structure of formation, but be not limited thereto.
In another embodiment of the present embodiment, it is additionally provided on the circuit board substrate 4 for the electricity with electronic equipment
The solder pad 5 of road plate welding, one end of the connecting line 2 are correspondingly connected with the contact terminal 1, the connecting line 2 it is another
End is correspondingly connected with the solder pad 5, as shown in figure 4, the solder pad 5 is set to the outside of the shell 3.
The circuit board of the circuit board substrate 4 and electronic equipment is separate structure, and the circuit board substrate 4 is independently arranged,
The i.e. described communication interface structure and corresponding electronic equipment split settings, when communication interface structure is damaged, only need to change phase
The communication interface structure answered, the whole circuit board without replacing electronic equipment, easy to repair and replacement, and reduce cost.
As shown in figure 5, the circuit board substrate 4 includes the first surface and second surface being disposed opposite to each other, first table
The contact terminal 1, the connecting line 2 and the solder pad 5, the solder pad 5 and the connecting line 2 are provided on face
It is correspondingly connected with, alternatively,
The contact terminal 1, the connecting line 2 and the solder pad 5, the welding are provided on the second surface
Pad 5 is correspondingly connected with the connecting line 2.
As shown in Figure 6 and Figure 7, the circuit board substrate 4 includes the first surface and second surface that are disposed opposite to each other, and described the
The contact terminal 1 and the connecting line 2 are provided on one surface and the second surface,
The solder pad 5 includes the first weld part 6 and the second weld part 7, and first weld part 6 setting is described the
On one surface, and first weld part 6 is correspondingly connected with the connecting line 2 on the first surface, and second weld part 7 is set
It sets on the first surface, and second weld part 7 and first weld part 6 interval are arranged, the circuit board substrate 4
On position corresponding with second weld part 7 is provided with through-hole, second weld part 7 passes through the through-hole and described the
Connecting line 2 on two surfaces is correspondingly connected with.
The welding being correspondingly connected with corresponding connecting line 2 is respectively set on the first surface and the second surface
Portion, due to being respectively provided with weld part in the first surface of circuit board substrate 4 and the second surface, manufacture craft difficulty is high,
In order to reduce manufacture craft difficulty, in the present embodiment, first weld part 6 and second weld part 7 are set to same table
On face, first weld part 6 connecting line 2 corresponding with the first contact terminal 11 being set on the first surface is connected,
Position corresponding with second weld part 7 is provided with through-hole on the circuit board substrate 4, second weld part 7 passes through
Through-hole connecting line 2 corresponding with the second contact terminal 12 on the second surface is correspondingly connected with.
Above structure is provided with conducive to the design of special USB contact terminal, and such as by Vbus, (one in contact terminal is connect
Contact) with other contact point designs in contact terminal in different sides, solving Vbus, (one in contact terminal contacts with D-
Point) between problems of electromigration, and improve and be located at connecing on opposite two surfaces of tongue piece on Type-c USB (c-type UCB interface)
Short circuit problem between contravention.
In order to realize being correspondingly connected with for second weld part 7 and the connecting line 2 on the second surface, the through-hole
Conductive layer 9 is provided on side wall, according to actual needs, one end of the conductive layer 9, which extends outwardly, is covered in second welding
At the periphery of the through-hole in portion 7, the other end of the conductive layer 9 extend outwardly be covered in it is described on the second surface
At the periphery of through-hole.
In the present embodiment, the contact terminal 1 and the connecting line 2 on the same surface of the circuit board substrate 4 are
The integral structure formed using etching mode.
The contact terminal 1, the connecting line 2 and first weld part 6 in the present embodiment, on the first surface
For the integral structure formed using etching mode.
In the present embodiment, the circuit substrate 4 is printing board PCB or flexible circuit board FPC.
The above is present pre-ferred embodiments, it should be noted that those skilled in the art, In
Under the premise of not departing from principle of the present invention, several improvements and modifications can also be made, these improvements and modifications also should be regarded as
The scope of the present invention.
Claims (7)
1. a kind of communication interface structure is connect for the communication interface with docking, which is characterized in that including circuit board substrate, institute
The edge for stating circuit board substrate has connecting plate, is provided with contact terminal and connecting line on the circuit board substrate, described to connect
Contravention with the communication interface of the docking for connecting, and the contact terminal is arranged on the connecting plate, the connection
Line with the contact terminal for being correspondingly connected with；
The solder pad for the welding circuit board with electronic equipment is additionally provided on the circuit board substrate, the connecting line
One end connects the contact terminal, and the other end of the connecting line connects the solder pad；
The circuit board substrate includes the first surface and second surface being disposed opposite to each other, the first surface and the second surface
On be provided with the contact terminal and the connecting line,
The solder pad includes the first weld part and the second weld part, and first weld part is arranged in the first surface
On, and first weld part is correspondingly connected with the connecting line on the first surface, second weld part is arranged described
On first surface, and second weld part and first weld part interval are arranged,
Position corresponding with second weld part is provided with through-hole on the circuit board substrate, second weld part passes through
The through-hole is correspondingly connected with the connecting line on the second surface；Conductive layer is provided on the side wall of the through-hole；
One end of the conductive layer extend outwardly the through-hole being covered on second weld part periphery at, the conduction
Layer the other end extend outwardly the through-hole being covered on the second surface periphery at.
2. communication interface structure according to claim 1, which is characterized in that the communication interface structure further includes shell,
The jacket is set to outside the connecting plate, and the interior of shell has the space of the communication interface insertion for docking, institute
State the outside that circuit board substrate is located at the shell.
3. communication interface structure according to claim 1, which is characterized in that the circuit board substrate is equipped with circuit, institute
It states contact terminal and passes through the circuit connection on the connecting line and the circuit board substrate.
4. communication interface structure according to claim 3, which is characterized in that the connecting plate includes first be disposed opposite to each other
The contact terminal and the connection are provided on surface and second surface, the first surface and/or the second surface
Line.
5. communication interface structure according to claim 4, which is characterized in that on the same surface of the circuit board substrate
The contact terminal and the connecting line are the integral structure formed using etching mode.
6. communication interface structure according to claim 1, which is characterized in that on the same surface of the circuit board substrate
The contact terminal and the connecting line are the integral structure formed using etching mode.
7. a kind of electronic equipment, which is characterized in that including communication interface structure such as claimed in any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711417797.5A CN108173019B (en) | 2017-12-25 | 2017-12-25 | Communication interface structure and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711417797.5A CN108173019B (en) | 2017-12-25 | 2017-12-25 | Communication interface structure and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108173019A CN108173019A (en) | 2018-06-15 |
| CN108173019B true CN108173019B (en) | 2019-11-26 |
Family
ID=62520328
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711417797.5A Active CN108173019B (en) | 2017-12-25 | 2017-12-25 | Communication interface structure and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108173019B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109586068B (en) * | 2019-01-08 | 2024-02-20 | 广东杰思通讯股份有限公司 | Electric connector socket |
| CN110854573B (en) * | 2019-11-22 | 2021-02-09 | 维沃移动通信有限公司 | Plug of data transmission line and data transmission line |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5342208A (en) * | 1992-02-19 | 1994-08-30 | Nec Corporation | Package connector apparatus |
| CN204633058U (en) * | 2015-05-18 | 2015-09-09 | 特通科技有限公司 | USB Type-C connector modules |
| CN205693026U (en) * | 2016-06-03 | 2016-11-16 | 巧连科技股份有限公司 | Rigid circuit board connecting device |
| CN206340697U (en) * | 2016-11-23 | 2017-07-18 | 巧连科技股份有限公司 | USB attachment means |
| CN206674294U (en) * | 2017-03-09 | 2017-11-24 | 鹏鼎控股(深圳)股份有限公司 | USB Type C board structure of circuit and USB Type C connectors |
-
2017
- 2017-12-25 CN CN201711417797.5A patent/CN108173019B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5342208A (en) * | 1992-02-19 | 1994-08-30 | Nec Corporation | Package connector apparatus |
| CN204633058U (en) * | 2015-05-18 | 2015-09-09 | 特通科技有限公司 | USB Type-C connector modules |
| CN205693026U (en) * | 2016-06-03 | 2016-11-16 | 巧连科技股份有限公司 | Rigid circuit board connecting device |
| CN206340697U (en) * | 2016-11-23 | 2017-07-18 | 巧连科技股份有限公司 | USB attachment means |
| CN206674294U (en) * | 2017-03-09 | 2017-11-24 | 鹏鼎控股(深圳)股份有限公司 | USB Type C board structure of circuit and USB Type C connectors |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108173019A (en) | 2018-06-15 |
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