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CN108153117A - Substrate processing device, processing method for substrate and storage medium - Google Patents

Substrate processing device, processing method for substrate and storage medium Download PDF

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Publication number
CN108153117A
CN108153117A CN201711247835.7A CN201711247835A CN108153117A CN 108153117 A CN108153117 A CN 108153117A CN 201711247835 A CN201711247835 A CN 201711247835A CN 108153117 A CN108153117 A CN 108153117A
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CN
China
Prior art keywords
substrate
nozzle
control
liquid level
supply unit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201711247835.7A
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Chinese (zh)
Other versions
CN108153117B (en
Inventor
桥本祐作
下青木刚
福田昌弘
田中公朗
田中公一朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
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Tokyo Electron Ltd
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Filing date
Publication date
Priority claimed from JP2017180543A external-priority patent/JP7025872B2/en
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN108153117A publication Critical patent/CN108153117A/en
Application granted granted Critical
Publication of CN108153117B publication Critical patent/CN108153117B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3042—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations
    • G03F7/3064—Imagewise removal using liquid means from printing plates transported horizontally through the processing stations characterised by the transport means or means for confining the different units, e.g. to avoid the overflow
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/002—Processes for applying liquids or other fluent materials the substrate being rotated
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/40—Distributing applied liquids or other fluent materials by members moving relatively to surface
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/26—Processes for applying liquids or other fluent materials performed by applying the liquid or other fluent material from an outlet device in contact with, or almost in contact with, the surface

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)

Abstract

The present invention provides a kind of device for effectively inhibiting the degree that processing carries out and deviation being generated due to the position difference on substrate.Coating, developing apparatus (2) include rotating holding portion (30), developer solution supply unit (40) and controller (100).Controller performs：After the hydrops of flushing liquor being formed on the surface of chip (W) (Wa), the liquid level that connects of the nozzle (41) of developer solution supply unit is made to be contacted with the hydrops of the flushing liquor, the control of the hydrops of dilute development liquid is formed from nozzle discharge developer solution；The control that chip is made to be rotated with the first rotating speed, above-mentioned first rotating speed is connect between liquid level and surface so that being retained in the dilute development liquid positioned inside compared with the periphery for connecing liquid level, with the rotating speed that the dilute development liquid for being located at outside compared with the periphery for connecing liquid level is extended to the peripheral side of chip；, under the second rotating speed state of rotation smaller than the first rotating speed, to discharge developer solution on one side, make the control of peripheral side movement of the nozzle to chip on one side in chip.

Description

Substrate processing device, processing method for substrate and storage medium
Technical field
The present invention relates to substrate processing device, processing method for substrate and storage mediums.
Background technology
Patent Document 1 discloses a kind of processing method for substrate, including：It is dilute in the central part formation pure water of substrate The hydrops forming step for the hydrops of dilute development liquid released；Later, make substrate so that the first rotating speed rotates and makes dilute development liquid Hydrops expand to all surfaces of substrate so as to form the liquid film forming step of the liquid film of dilute development liquid；Later, make In a state that substrate is with the second rotating speed rotation slower than the first rotating speed, on one side from supply developer solution with the nozzle for connecing liquid level and Substrate and the hydrops for connecing formation developer solution between liquid level, make nozzle to moving radially towards substrate center, on substrate on one side Supply the developer solution supplying step of developer solution.
Existing technical literature
Patent document
Patent document 1：Japanese Unexamined Patent Publication 2016-11345
Invention content
The technical problem that the invention wants to solve
The purpose of the present invention is to provide effectively inhibit the carry out degree of processing to produce since the position on substrate is different Substrate processing device, processing method for substrate and the storage medium of raw deviation.
For solving the technical solution of technical problem
Substrate processing device in the present invention, including：The rotating holding portion for keeping substrate and rotating it；To the table of substrate Face supplies the first supply unit of dilution；To the second supply unit of the surface supply treatment fluid of substrate；And control unit, the second supply Portion includes：Nozzle connects liquid level and is opened in the outlet for connecing liquid level to discharge treatment fluid including opposite with the surface of substrate； With the position-regulation portion of position for adjusting nozzle, control unit performs：Control the first supply unit so that the surface supply to substrate is dilute The step of releasing liquid, forming the hydrops of dilution；Control the second supply unit so that move nozzle by position-regulation portion, make to connect Liquid level is contacted with the hydrops of dilution, and the step of the hydrops of the mixed liquor of dilution and treatment fluid is formed from outlet discharge treatment fluid Suddenly；The step of controlling rotating holding portion, substrate made to be rotated with the first rotating speed, wherein, the first rotating speed is so that with connecing the outer of liquid level The mixed liquor that week is compared positioned inside, which is retained in, to be connect between liquid level and the surface of substrate, with being located at outside compared with the periphery for connecing liquid level Peripheral side from mixed liquor to substrate extend rotating speed；Control rotating holding portion so that after substrate is rotated with the first rotating speed, The step of substrate is made to be rotated with the second rotating speed smaller than the first rotating speed；With control the second supply unit so that in substrate with second turn Under fast state of rotation, treatment fluid is discharged from outlet on one side, nozzle is made to the outer of substrate by position-regulation portion on one side The step of side movement.
On the surface of substrate, the part that treatment fluid initially reaches has what is carried out using treatment fluid compared with other parts The trend that the progress of processing becomes larger.In this regard, according to this substrate processing device, perform：Before treatment fluid is supplied, mixed liquor is formed Hydrops the step of；With in the state of connecing liquid level and being contacted with the hydrops of mixed liquor, rotated into enforcement substrate with the first rotating speed Step.It is retained in the mixed liquor for being located inside (hereinafter referred to as " inside region ") compared with the periphery for connecing liquid level as a result, and connects liquid In the state of between face and surface, with compared with the periphery for connecing liquid level be located at outside (hereinafter referred to as " lateral area ") mixed liquor to The peripheral side extension of substrate.As a result, the mixing liquid layer that the thickness for forming the thickness ratio lateral area of inside region is big.Mixing Liquid layer is changed over time and is deteriorated.The mixing liquid layer of deterioration interferes the processing carried out based on the treatment fluid supplied later.As above institute It states, exists in inside region than in the thick mixing liquid layer of outer side region.Therefore, it after mixing liquid layer is formed, is supplied initially What is handled in the part (hereinafter referred to as " initial stage reaches part ") for the treatment of fluid be alleviated.Thereby, it is possible to reduce to arrive in the early stage The difference of the degree of the progress of degree up to the progress of the processing of part and the processing in other parts.Therefore, place is effectively inhibited The degree (hereinafter referred to as " processing degree of progress ") of the progress of reason generates deviation due to the position on substrate.
Control the second supply unit so that move nozzle by position-regulation portion, connect the hydrops for connecing liquid level and dilution Tactile step includes：Control the second supply unit so that in a state that outlet is full of by treatment fluid, make by position-regulation portion The step of nozzle is close to the surface of substrate.At this point, bubble can be inhibited to be mixed into the hydrops of mixed liquor, and inhibit to be caused by the bubble Processing degree of progress deviation.
Control the second supply unit so that make nozzle in a state that outlet is full of by treatment fluid close to the surface of substrate Step includes：Control the second supply unit so that discharge treatment fluid from outlet on one side, lean on nozzle by position-regulation portion on one side The step of surface of nearly substrate.At this point, after connecing liquid level and being contacted with dilution, treatment fluid is directly mixed with dilution.As a result, The hydrops of mixed liquor can be formed ahead of time, shorten processing time.
Control the second supply unit so that discharge treatment fluid from outlet on one side, make nozzle on one side close to the surface of substrate Step includes：Control the second supply unit so that connect the distance on surface of liquid level and substrate in the state of 5~7mm, start from Outlet discharge treatment fluid, make later nozzle close to the surface of substrate to the surface for connecing liquid level and substrate distance become 0.5~ The step of 2mm.At this point, start after outlet discharge treatment fluid between connecing the hydrops of liquid level contact dilution, it can Prevent treatment fluid from falling.The processing that thereby, it is possible to inhibit to carry out due to the treatment fluid fallen, and inhibit to draw since this falls The deviation of processing degree of progress risen.
First rotating speed can be 300~1500rpm.
Second rotating speed can be 10~100rpm.In the process for moving nozzle while treatment fluid is discharged from outlet In, the lateral peripheral side of the rotation center for the treatment of fluid and mixed liquor from chip is alternately arranged and is distributed with swirl shape sometimes.At this point, At the position that the position for the treatment of fluid contact is contacted with mixed liquor, the deviation of processing degree of progress becomes larger.In this regard, by making the second rotating speed For more than 10rpm, can extended hybrid liquid as early as possible, inhibit the formation of gyrate distribution.In addition, by making the second rotating speed be 100rpm is hereinafter, can inhibit the processing degree of progress of the rotation center RC sides on substrate to become too much.
Control unit also performs：Control rotating holding portion so that move nozzle by position-regulation portion in the second supply unit And make to connect liquid level contacted with the hydrops of dilution and from outlet discharge treatment fluid when, make substrate with the third smaller than the first rotating speed Rotating speed rotates.
Control the second supply unit so that make nozzle mobile by position-regulation portion connect the hydrops for connecing liquid level and dilution Tactile step includes：Control the second supply unit so that at the center for connecing liquid level from the position that the rotation center of substrate deviates, make to connect The step of liquid level is contacted with the hydrops of dilution controls the second supply unit so that discharges treatment fluid from outlet, forms dilution Include with the step of hydrops of the mixed liquor for the treatment of fluid：Control the second supply unit so that on one side from outlet discharge treatment fluid, one While make nozzle mobile by position-regulation portion to make to connect the step of center of liquid level is close to the rotation center of substrate.At this point, opening Begin after the discharge from outlet, treatment fluid extends at once in the direction of rotation of substrate.By nozzle substrate rotation center Side is moved, and treatment fluid is also in radially (passing through the direction of rotation center) extension.Thereby, it is possible to quickly form the concentration of developer solution The hydrops of high uniformity, and inhibit to handle the deviation of degree of progress caused by the concentration deviation of developer solution.
Third rotating speed can be in below 100rpm.
Control the second supply unit so that in substrate under the second rotating speed state of rotation, discharged on one side from outlet Treatment fluid, the step for nozzle being made to be moved to the peripheral side of substrate by position-regulation portion on one side include：The second supply unit is controlled, is made The movement speed of the second rotating speed and nozzle the step of meeting 3≤RF/V≤5, wherein,
V：The movement speed [mm/s] of nozzle,
RF：Second rotating speed [rpm].
By making above-mentioned RF/V more than 3, therefore the formation of above-mentioned gyrate distribution can be inhibited.It is above-mentioned by making RF/V is 5 hereinafter, the processing degree of progress of the rotation center side of chip can be inhibited to become too much.Therefore, it is possible to further suppress Handle the deviation of degree of progress.
Control the second supply unit so that in substrate under the second rotating speed state of rotation, discharged on one side from outlet Treatment fluid, the step for nozzle being made to be moved to the peripheral side of substrate by position-regulation portion on one side include：The second supply unit is controlled, is made The step of obtaining in the way moved in nozzle to the peripheral side of substrate, increasing the discharge rate of the treatment fluid from outlet.At this point, by Processing degree of progress in the rotation center side for relatively reducing chip, therefore the deviation of processing degree of progress can be further suppressed.
The processing method for substrate of the present invention, including：Dilution is supplied to the surface of substrate, forms the step of the hydrops of dilution Suddenly；Make to include connect liquid level and be opened in the nozzle of outlet that connects liquid level to discharge treatment fluid opposite with the surface of substrate to move It is dynamic, make to connect liquid level and contacted with the hydrops of dilution, discharge treatment fluid from outlet, form the mixed liquor of dilution and treatment fluid The step of hydrops；The step of substrate is made to be rotated with the first rotating speed, wherein the first rotating speed be so that compared with the periphery for connecing liquid level position Mixed liquor in inside, which is retained in, to be connect between liquid level and the surface of substrate, the mixed liquor with being located at outside compared with the periphery for connecing liquid level The rotating speed extended to the peripheral side of substrate；After substrate is rotated with the first rotating speed, make substrate with smaller than the first rotating speed second The step of rotating speed rotates；With under the second rotating speed state of rotation, treatment fluid is discharged from outlet on one side, on one side in substrate The step that nozzle is made to be moved to the peripheral side of substrate.
The storage medium of the present invention is the computer that record is useful for the program that device is made to perform above-mentioned processing method for substrate Readable storage medium storing program for executing.
Invention effect
In accordance with the invention it is possible to the degree for providing the progress for effectively inhibiting processing is generated partially due to the position on substrate Substrate processing device, processing method for substrate and the storage medium of difference.
Description of the drawings
Fig. 1 is the stereogram for the schematic configuration for representing the substrate handling system of the present invention.
Fig. 2 is along II-II sectional view in Fig. 1.
Fig. 3 is along III-III sectional view in Fig. 2.
Fig. 4 is the schematic diagram for the schematic configuration for representing developing cell.
Fig. 5 is the stereogram for an example for representing nozzle.
Fig. 6 is the stereogram for the variation for representing nozzle.
Fig. 7 is the vertical view for another variation for representing nozzle.
Fig. 8 is the sectional view along the III-V III of V in Fig. 7.
Fig. 9 is to illustrate the schematic diagram that the hardware of control unit is formed.
Figure 10 is the flow chart of development treatment step.
The flow chart for the step of Figure 11 is the hydrops to form flushing liquor.
Figure 12 is the schematic diagram of the state of the substrate in the formation for the hydrops for representing flushing liquor.
Figure 13 is the flow chart of step of prewetting.
Figure 14 be represent to prewet substrate in execution state schematic diagram.
Figure 15 is the flow chart of applying step.
Figure 16 is the schematic diagram for the state for showing the substrate in developer solution coating.
Figure 17 is development, cleans, the flow chart of drying steps.
Figure 18 be represent to clean, dry in substrate state schematic diagram.
Figure 19 be represent to prewet step variation flow chart.
Figure 20 is the flow chart for the variation for representing applying step.
Reference sign
2 ... coatings, developing apparatus (substrate processing device)
30 ... rotating holding portion
40 ... developer solution supply units (the second supply unit)
50 ... flushing liquor supply units (the first supply unit)
W ... chips (substrate)
Wa ... surfaces
Wb ... peripheries
41 ... nozzles
48 ... nozzle transport mechanisms (position-regulation portion)
43 ... connect liquid level
42 ... outlets
100 ... controllers (control unit).
Specific embodiment
Hereinafter, embodiment is described in detail with reference to attached drawing.In explanation, to identical element or identical The element of function marks identical reference numeral, and the repetitive description thereof will be omitted.
[substrate handling system]
Substrate handling system 1 is to implement the formation of photosensitive film, the exposure of the photosensitive film and the photosensitive film to substrate Development system.The substrate of process object is, for example, the wafer W of semiconductor.Photosensitive film is, for example, resist film.At substrate Reason system 1 has coating, developing apparatus 2 and exposure device 3.Exposure device 3 is to the resist film that is formed in wafer W (substrate) (photosensitive film) is exposed processing.Specifically, the exposure object part of resist film is shone using the methods of immersion exposure Penetrate energy line.Coating, developing apparatus 2 are being exposed surface shape of the before processing progress in wafer W (substrate) using exposure device 3 Into the processing of resist film, the development treatment of resist film is carried out after exposure-processed.
[substrate processing device]
Hereinafter, an example as substrate processing device, illustrates the composition of coating, developing apparatus 2.Such as Fig. 1 Shown in~Fig. 3, coating, developing apparatus 2 include mounting block 4, processing unit 5, interface block 6 and controller 100 (control unit).
Block 4 is loaded to import wafer W into coating, developing apparatus 2 and export wafer W from coating, developing apparatus 2.For example, it carries Multiple bearing members 11 of wafer W, built-in handing-over arm A1 can be supported by putting block 4.Bearing member 11 can for example store multiple circles Wafer W.Handing-over arm A1 takes out wafer W from bearing member 11 and transports to processing unit 5, collects wafer W from processing unit 5 and returns to mounting In body 11.
Processing unit 5 includes multiple processing modules 14,15,16,17.As shown in Figures 2 and 3, processing module 14,15,16,17 Built-in multiple liquid-treatment unit U1, multiple thermal treatment unit U2 and the carrying arm A3 in said units conveyance wafer W.Handle mould Block 17 is also built-in with the direct carrying arm A6 that wafer W is transported not via liquid-treatment unit U1 and thermal treatment unit U2.At liquid It manages unit U1 and supplies treatment fluid to the surface of wafer W.Thermal treatment unit U2 is for example built-in with heating plate and coldplate, passes through heating Plate heats wafer W, is heat-treated by the wafer W after coldplate cooling heating.
Processing module 14 forms lower membrane by liquid-treatment unit U1, thermal treatment unit U2 on the surface of wafer W.Place The liquid-treatment unit U1 of reason module 14 applies the treatment fluid for being used to form lower membrane on the wafer W.At the heat of processing module 14 Manage the various heat treatments for the formation that unit U2 is carried out with lower membrane.
Processing module 15 forms resist film by liquid-treatment unit U1, thermal treatment unit U2 in lower membrane.Processing The liquid-treatment unit U1 of module 15 applies the treatment fluid for being used to form resist film on lower membrane.The heat of processing module 15 Processing unit U2 carries out the various heat treatments of the formation with resist film.
Processing module 16 forms upper layer film by liquid-treatment unit U1, thermal treatment unit U2 on resist film.Processing The liquid-treatment unit U1 of module 16 applies the treatment fluid for being used to form upper layer film on resist film.At the heat of processing module 16 Manage the various heat treatments for the formation that unit U2 is carried out with upper layer film.
Processing module 17 be exposed by liquid-treatment unit U1, thermal treatment unit U2 after resist film development at Reason.After the liquid-treatment unit U1 of processing module 17 applies developer solution on the surface of the wafer W of end exposure, flushing liquor is utilized It is rinsed, thus carries out the development treatment of resist film.The thermal treatment unit U2 of processing module 17 is carried out with development The various heat treatments of processing.As the specific example of heat treatment, the heat treatment (PEB before development treatment can be enumerated：Post Exposure Bake), development after heat treatment (PB：Post Bake) etc..
4 side of mounting block in processing unit 5 is provided with frame unit U10.Frame unit U10 is divided into multiple in above-below direction The cell of arrangement.Lifting arm A7 is provided with beside frame unit U10.Lifting arm A7 makes wafer W between the cell of frame unit U10 Lifting.
6 side of interface block in processing unit 5 is provided with frame unit U11.Frame unit U11 is divided into multiple in above-below direction The cell of arrangement.
Interface block 6 carries out the handing-over of wafer W at it between exposure device 3.Such as interface block 6 is built-in with handing-over arm A8, And it is connect with exposure device 3.Handing-over arm A8 transports the wafer W for being configured at frame unit U11 to exposure device 3, from exposure device 3 Wafer W is collected, returns to frame unit U11.
The control of controller 100 coating, developing apparatus 2 so that for example perform coating/development treatment as follows.First, Controller 100 control handing-over arm A1 cause to frame unit U10 conveyance bearing member 11 in wafer W, control lifting arm A7 cause by The wafer W is configured in the cell of processing module 14.
Then, controller 100 controls carrying arm A3 to cause liquid of the wafer W by frame unit U10 into processing module 14 Processing unit U1 and thermal treatment unit U2 conveyances, control liquid-treatment unit U1 and thermal treatment unit U2 cause in the wafer W Lower membrane is formed on surface.Later, controller 100 controls carrying arm A3 that the wafer W for being formed with lower membrane is caused to return to frame list First U10, control lifting arm A7 cause the wafer W being configured in the cell of processing module 15.
Then, controller 100 controls carrying arm A3 to cause liquid of the wafer W by frame unit U10 into processing module 15 Processing unit U1 and thermal treatment unit U2 conveyances, control liquid-treatment unit U1 and thermal treatment unit U2 cause in the wafer W Resist film is formed in lower membrane.Later, controller 100 controls carrying arm A3 that wafer W is made to return to frame unit U10, control lifting Arm A7 causes the wafer W being configured in the cell of processing module 16.
Then, controller 100 controls the crystalline substance of each unit transporting rack unit U10 that carrying arm A3 causes into control module 16 Piece W, control liquid-treatment unit U1 and thermal treatment unit U2 to form upper layer film on the resist film of the wafer W.Later, Controller 100 controls carrying arm A3 that wafer W is made to return to frame unit U10, and control lifting arm A7 handling wafer W configuration The cell of module 17.
Then, controller 100 controls direct carrying arm A6 to cause the wafer W to frame unit U11 transporting rack units U10, control System handing-over arm A8 to transport the wafer W to exposure device 3.Later, the control of controller 100 handing-over arm A8 causes from exposure device 3 receive the wafer W for implementing exposure-processed and return to frame unit U11.
Then, controller 100 controls the crystalline substance of each unit transporting rack unit U11 that carrying arm A3 causes into processing module 17 Piece W, control liquid-treatment unit U1 and thermal treatment unit U2 to implement development treatment to the resist film of the wafer W.Later, Controller 100, which controls carrying arm A3 that wafer W is made to return to frame unit U10, control lifting arm A7 and handing-over arm A1, returns to the wafer W In bearing member 11.By the above, coating/development treatment terminates.
In addition, the specific composition of substrate processing device be not limited to it is illustrated above coating, developing apparatus 2 composition.Base Piece treating apparatus may be the liquid-treatment unit U1 (the liquid-treatment unit U1 of visualization module 17) with development treatment With the arbitrary device of controller 100 that can control said units.
[developing cell]
Then, the liquid-treatment unit U1 of processing unit 17 is described in detail.Processing module 17 has as liquid The developing cell 20 of body processing unit U1.As shown in figure 4, developing cell 20 includes rotating holding portion 30, developer solution supply unit 40 (the second supply unit) and flushing liquor supply unit 50 (the first supply unit).
Rotating holding portion 30 keeps substrate and makes its rotation.Such as rotating holding portion 30 has holding mechanism 31 and whirler Structure 32.Holding mechanism 31 supports the central part for the wafer W being flatly configured, such as keeps the wafer W by vacuum suction etc..Rotation Rotation mechanism 32, as power source, makes holding mechanism 31 be rotated around the rotation center RC of vertical such as built-in electro-motor.As a result, Wafer W is rotated around rotation center RC.
Developer solution supply unit 40 supplies developer solution (treatment fluid) to the surface Wa of wafer W.Developer solution is to be exposed for removing The treatment fluid of the removal object part of resist film afterwards.The removal object part of resist film is in development in exposure-processed The soluble part of liquid.When developer solution is eurymeric, the part exposed in exposure-processed is soluble to developer solution.In developer solution During for minus, the part for not having exposure in exposure-processed is soluble to developer solution.The concrete example of developer solution as eurymeric Son can enumerate aqueous slkali.The specific example of developer solution as minus can enumerate organic solution.
For example with nozzle 41, tank 44, pump 46, valve 47 and nozzle transport mechanism 48, (position is adjusted developer solution supply unit 40 Portion).
Nozzle 41 discharges developer solution to the surface Wa of wafer W.As shown in figure 5, nozzle 41 includes the surface Wa phases with wafer W To connect and liquid level 43 and be opened in the outlet 42 for connecing liquid level 43 to discharge developer solution.For example, nozzle 41 connects liquid with circular Face 43, outlet 42 are opened in the central portion for connecing liquid level 43.The area for connecing liquid level 43 is smaller than the area of the surface Wa of wafer W.It connects The area of liquid level 43 is compared with the area of the surface Wa of wafer W, and for example, 1~11%, or 1~3%.Nozzle 41 is for example It can be made of resin materials such as PTFE.In addition, nozzle 41 can also include being dispersed in the multiple outlets 42 for connecing liquid level 43.
Nozzle 41 under conditions of the discharge rate for making developer solution is 90ml/min, is configured to by connecing liquid level 43 Mean flow rate is 1.2~5.5m/min, can also be configured to the mean flow rate as 1.2~3.5m/min.
For example, nozzle 41 be configured to outlet 42 connect liquid level 43 opening area (nozzle 41 include multiple discharges During mouth 42, the summation of the opening area of multiple outlets 42) it is 16.4~75mm2, it is 25 that can also be configured to the opening area ~75mm2。
As shown in fig. 6, the opening area of outlet 42 can gradually increase with by proximity liquid level 43.
As shown in Figure 7 and Figure 8, nozzle 41 can be the circumferential array with edge around the center for connecing liquid level 43, and have There are multiple outlets 42 of the inclined of each comfortable circumferential direction.More specifically, the nozzle 41 of Fig. 7 and Fig. 8 has：Edge First group of outlet 42 of above-mentioned circumferential array；In the peripheral side of nozzle 41 along above-mentioned week compared with first group of outlet 42 To second group of outlet 42 of arrangement；In the peripheral side of nozzle 41 along above-mentioned circumferential array compared with second group of outlet 42 Third group outlet 42；With compared with the outlet 42 of third group in the peripheral side of nozzle 41 along the of above-mentioned circumferential array Four groups of outlet 42.The position of above-mentioned circumferential outlet 42 is consistent between above-mentioned group.Any one outlet 42 is all to this Circumferential inclined.It, can be in the rotation for connecing formation developer solution between liquid level 43 and wafer W according to such nozzle 41 Stream, can improve in the uniformity for connecing the developer solution between liquid level 43 and wafer W.
Fig. 4 is returned to, nozzle 41 is connect via pipeline 45 with tank 44.Tank 44 stores developer solution.Pump 46 and valve 47 are set to pipe Road 45.Pump 46 is, for example, diaphragm pump, from tank 44 to 41 force feed developer solution of nozzle.Valve 47 is, for example, air driven pump, is adjusted in pipeline 45 Aperture.By controlling pump 47, the state that nozzle 41 discharges the state of developer solution and nozzle 41 does not discharge developer solution is allowed hand over. In addition, by least one of control pump 46 and valve 47, the discharge rate (unit interval of the developer solution from nozzle 41 can be adjusted Discharge rate).
Nozzle transport mechanism 48 adjusts the position of nozzle 41.More specifically, nozzle transport mechanism 48 makes to connect liquid level 43 In the state of downward, nozzle 41 is transported in a manner of the top across wafer W, lifts nozzle 41.For example, nozzle transports Mechanism 48 has：The transport mechanism of nozzle 41 is transported in a manner of the top across wafer W using electro-motor etc. as power source； With the mechanism for being used to lift nozzle 41 using electro-motor etc. as power source.
Nozzle transport mechanism 48 can transport nozzle 41 along the path of the rotation center RC towards wafer W, can also be along phase Nozzle 41 is transported to the path that rotation center RC deviates.Nozzle transport mechanism 48 can transport nozzle 41 along the path of straight shape, Nozzle 41 can be transported along the path of bending.
Flushing liquor supply unit 50, to the surface Wa supply flushing liquors (dilution) of wafer W.Flushing liquor is, for example, pure water.
For example with nozzle 51, tank 52, pump 54, valve 55 and nozzle transport mechanism 56, (position is adjusted flushing liquor supply unit 50 Portion).
Nozzle 51 discharges flushing liquor to the surface Wa of wafer W.Nozzle 51 is connect via pipeline 53 with tank 52.The storage punching of tank 52 Washing lotion.Pump 54 and valve 55 are set to pipeline 53.Pump 54 is, for example, diaphragm pump, from tank 52 to 51 force feed flushing liquor of nozzle.55, valve It is such as pneumatic operated valve, adjusts the aperture in pipeline 53.By controlling valve 55, allow hand over from nozzle 51 and discharge flushing liquor State and the state for not discharging flushing liquor from nozzle 51.In addition, at least one party by controlling pump 54 and valve 55, can adjust and From the discharge rate of the flushing liquor of nozzle 51.
Nozzle transport mechanism 56 as power source electro-motor such as to transport nozzle 51.Specifically, nozzle is removed Send mechanism 56 the outlet for making nozzle 51 downward in the state of, nozzle 51 is transported in a manner of the top across wafer W.
The developing cell 20 being constructed as described above is controlled by above-mentioned controller 100.Controller 100 performs：Control punching Washing lotion supply unit 50 so that supply the step of flushing liquor is to form the hydrops of flushing liquor to surface Wa；Control developer solution supply unit 40 so that move nozzle 41 by nozzle transport mechanism 48 and contacted so as to connect liquid level 43 with the hydrops of flushing liquor, from outlet The step of 42 discharge developer solutions, the hydrops of formation dilute development liquid；Rotating holding portion 30 is controlled, wafer W is made to be revolved with the first rotating speed The step of turning, wherein, the first rotating speed is connect so that being retained in the dilute development liquid positioned inside compared with connecing the periphery of liquid level 43 Between liquid level 43 and surface Wa, expand with the dilute development liquid for being located at outside compared with connecing the periphery of liquid level 43 to the peripheral side of wafer W The rotating speed of exhibition；Rotating holding portion 30 is controlled, after wafer W is made to be rotated with the first rotating speed, makes wafer W with smaller than the first rotating speed by the The step of two rotating speeds rotate；With control developer solution supply unit 40 so that in wafer W under the second rotating speed state of rotation, Developer solution is discharged from outlet 42 on one side, makes what nozzle 41 was moved to the peripheral side of wafer W by nozzle transport mechanism 48 on one side Step.
For example, controller 100 as composition (hereinafter referred to as " functional block ") functionally there is hydrops to form control unit 111st, prewet control unit 112, coating control unit 113 and clean, drying control portion 114.
Hydrops forms control unit 111 and performs in the control of the hydrops of the surface Wa of wafer W formation flushing liquors.The control Including controlling flushing liquor supply unit 50 so that the step of supplying flushing liquor to surface Wa, form the hydrops of flushing liquor.
Control unit 112 of prewetting performs mixed liquor for applying flushing liquor and developer solution in the surface Wa of wafer W (hereinafter referred to as For " development dilution ") control.The control includes：Control developer solution supply unit 40 so that make by nozzle transport mechanism 48 Nozzle 41 moves to be contacted so as to connect liquid level 43 with the hydrops of flushing liquor, is discharged developer solution from outlet 42, is formed dilute development liquid Hydrops the step of；With control rotating holding portion 30 so that wafer W is made to be rotated with the first rotating speed the step of, wherein, above-mentioned the One rotating speed be so that be located at compared with connecing the periphery of liquid level 43 the dilute development liquid of inside be retained in connect liquid level 43 and surface Wa it Between, with the rotating speed that the dilute development liquid for being located at outside compared with connecing the periphery of liquid level 43 is extended to the peripheral side of wafer W.
Coating control unit 113 is performed in the control of the surface Wa of wafer W coating developer solutions.The control includes：Control Rotating holding portion 30 so that after wafer W is made to be rotated with the first rotating speed, wafer W is made to be revolved with second rotating speed smaller than the first rotating speed The step of turning；With control developer solution supply unit 40 so that in wafer W under the second rotating speed state of rotation, on one side from row 42 discharge developer solution of outlet makes the step of peripheral side Wb movement of the outlet 42 to wafer W by nozzle transport mechanism 48 on one side.
It cleans, drying control portion 114 performs the surface Wa for wafer W clean after development treatment and the control made it dry System.The control includes：The step of controlling rotating holding portion 30, wafer W made to be rotated with the 4th rotating speed bigger than the second rotating speed；Control The action of flushing liquor supply unit 50 so that in a state that wafer W is rotated with the 4th rotating speed, punching is supplied to the surface Wa of wafer W The step of washing lotion；With control rotating holding portion 30 so that after the supply of flushing liquor, make wafer W with bigger than the 4th rotating speed The 5th rotating speed rotation the step of.
Controller 100 is made of the computer of one or more controls.For example, controller 100 has as shown in Figure 9 Circuit 120.Circuit 120 has one or more processors 121, memory 122, memory 123,124 and of input/output port Timer 125.Input/output port 124 is between rotating holding portion 30, developer solution supply unit 40 and flushing liquor supply unit 50 etc. Into the input and output of horizontal electrical signal.Timer 125 for example measures elapsed time by counting the reference pulse of some cycles.
Memory 123 has the storage medium that can be read by computer such as hard disk.It is storage medium recorded useful In the program that processing unit 5 is made to perform aftermentioned substrate processing step.Storage medium can be non-volatile semiconductor memory, The medium that magneto-optic disk and CD etc. can be read.The program that temporarily record is loaded from the storage medium of memory 123 of memory 122 Or it is resulted in by what processor 121 obtained.Processor 121 by performing above procedure under the assistance of memory 122, Form above-mentioned each function module.
In addition, the hardware composition of controller 100 is not necessarily restricted to be made up of each function module program.Such as it controls Each function module of device 100 processed can also pass through dedicated logic circuit or they integrated ASIC (Application Specific Integrated Circuit) it forms.
[developer solution processing step]
Then, as an example of processing method for substrate, to the control according to controller 100, developing cell 20 performs The phenomenon that processing sequence illustrate.As shown in Figure 10, controller 100 performs step S01, S02, S03, S04 successively.In step In S01, hydrops forms control unit 111 and performs in the control of the hydrops of the surface Wa of wafer W formation flushing liquors.In step In S02, control unit 112 of prewetting is performed in the control of the surface Wa of wafer W coating dilute development liquid.In step S03, apply Control unit 113 is applied to perform in the control of the surface Wa of wafer W coating developer solutions.In step S04, clean, drying control Portion 114 performs the control for cleaning the surface Wa of wafer W after development treatment and making it dry.Hereinafter, in each step Appearance is described in detail.
(forming step of hydrops)
In above-mentioned steps S01, hydrops forms control unit 111 and performs：Control flushing liquor supply unit 50 so as to wafer W Surface Wa supply flushing liquor, on the region of the rotation center RC including wafer W formed flushing liquor hydrops the step of.
As shown in figure 11, hydrops forms control unit 111 and performs step S11, S12, S13, S14, S15 successively.
In step s 11, hydrops forms control unit 111 and controls flushing liquor supply unit 50 so that passes through nozzle transport mechanism 56 make nozzle 51 move and be configured at first position.First position is, for example, the top of the rotation center RC of wafer W.
In step s 12, hydrops forms control unit 111 and controls flushing liquor supply unit 50 so that is initially supplied flushing liquor CF (with reference to (a) of Figure 12).For example, hydrops forming portion 111 controls flushing liquor forming portion 50 so that relief valve 55 start from tank 52 to Nozzle 51 supplies flushing liquor CF, starts to discharge flushing liquor CF from nozzle 51 to surface Wa.
In step s 13, it is standby when by the first processing time to form control unit 111 for hydrops.According to what is be previously set Condition etc. preset for the first processing time so that the hydrops of desired size is formed on the Wa of surface.
In step S14, hydrops forms control unit 111 and controls flushing liquor supply unit 50 so that stops supply flushing liquor.Example Flushing liquor supply unit 50 is controlled as hydrops forms control unit 111 so that valve 55 closes to stop supplying punching from tank 52 to nozzle 51 Washing lotion.
In step S15, hydrops forms control unit 111 and controls flushing liquor supply unit 50 so that passes through nozzle transport mechanism 56 make nozzle 51 move and keep out of the way above wafer W.By the above, form flushing liquor on the region including rotation center RC The hydrops PD1 of CF (with reference to (b) of Figure 12).
In addition, hydrops forms control unit 111, flushing liquor supply unit 50 can also be controlled so that make wafer W on one side to rinse The speed rotation that liquid CF does not extend, on one side to the surface Wa of wafer W supply flushing liquors CF.
(step of prewetting)
In step S02, control unit 112 of prewetting performs：Control developer solution supply unit 40 so that pass through nozzle transport mechanism 48 move nozzle 41 and make to connect liquid level 43 and contacted with the hydrops of flushing liquor, and discharging developer solution from outlet 42 forms dilute development The step of hydrops of liquid；The step of with controlling rotating holding portion 30, wafer W being made to be rotated with the first rotating speed, wherein, above-mentioned first turn Speed is connect between liquid level 43 and surface Wa so that being retained in the dilute development liquid positioned inside compared with connecing the periphery of liquid level 43, with Compare the rotating speed that the dilute development liquid positioned at outside is extended to the peripheral side of wafer W in the periphery for connecing liquid level 43.
Control developer solution supply unit 40 by nozzle transport mechanism 48 so that move nozzle 41 to make to connect liquid level 43 and punching The step of hydrops contact of washing lotion, can also include：Control developer solution supply unit 40 so that be full of by developer solution in outlet 42 In the state of, the step of nozzle 41 is by near surface Wa is made by transport mechanism 48.
Control developer solution supply unit 40 in a state that outlet 42 is full of by developer solution so that make nozzle 41 lean near surface The step of Wa, can also include：Control developer solution supply unit 40 so that discharge developer solution from outlet 42 on one side, pass through spray on one side Mouth transport mechanism 48 makes nozzle 41 depend near surface Wa.
Control unit 112 of prewetting can also be performed：Control rotating holding portion 30 so that developer solution supply unit 40 is removed by nozzle Mechanism 48 is sent to move nozzle 41 and makes to connect the hydrops that liquid level 43 contacts flushing liquor, when discharging developer solution from outlet 42, makes crystalline substance The step of piece W is rotated with the third rotating speed smaller than the first rotating speed.
Control developer solution supply unit 40 by nozzle transport mechanism 48 so that move nozzle 41 to make to connect liquid level 43 and punching The step of hydrops contact of washing lotion, can include：Control developer solution supply unit 40 so that connecing the center of liquid level 43 from rotation The position that heart RC deviates makes to connect the step of liquid level 43 contacts the hydrops of flushing liquor, and control developer solution supply unit 40 is so that from outlet 42 can include the step of discharging developer solutions and form the hydrops of dilute development liquid：Control developer solution supply unit 40 so that on one side The step of discharging developer solution from outlet 42, nozzle 41 made to depend near surface Wa by nozzle transport mechanism 48 on one side.
As illustrated in Figure 13, control unit 112 of prewetting perform successively step S21, S22, S23, S24, S25, S26, S27, S28。
In the step s 21, control unit 112 of prewetting controls rotating holding portion 30 so that with the first rotational speed omega 1 (third rotating speed) Start to rotate wafer W.Rotational speed omega 1 is for example in 100rpm hereinafter, can also be in below 50rpm.
In step S22, control unit 112 of prewetting control developer solution supply unit 40 so that made by nozzle transport mechanism 48 Nozzle 41 moves and is configured at the second position.The second position is in the region of hydrops PD1 for forming flushing liquor, from wafer W The top for the position that rotation center RC deviates (with reference to (a) of Figure 14).The second position can be set as connecing the center of liquid level 43 with The distance D1 of rotation center RC is 10~50mm, can be set as connecing the center of liquid level 43 and the distance D2 of surface Wa for 5~ 12mm。
In step S23, control unit 112 of prewetting control developer solution supply unit 40 so that start aobvious from the discharge of outlet 42 Shadow liquid DF (with reference to (b) of Figure 14).For example, control unit 112 of prewetting controls developer solution supply unit 40 so that opens valve 47 to start Developer solution DF is supplied from tank 44 to nozzle 41.Become the state that developed liquid DF is full of in outlet 42 as a result,.
In step s 24, control unit 112 of prewetting control developer solution supply unit 40 so that made by nozzle transport mechanism 48 Nozzle 41 depends near surface Wa, makes to meet the hydrops PD1 that liquid level 43 contacts flushing liquor CF.For example, control unit 112 of prewetting controls developer solution Supply unit 40 so that nozzle 41 is made to drop to the third place by nozzle transport mechanism 48.The third place is configured to connect liquid level 43 contact with hydrops PD1.The distance D3 that the third place can also be configured to meet liquid level 43 and surface Wa is 0.3~2.5mm.Spray Mouth 41 depends near surface Wa, and the developer solution DF thus discharged from outlet 42 is mixed into hydrops PD1.
In step s 25, control unit 112 of prewetting control developer solution supply unit 40 so that made by nozzle transport mechanism 48 Nozzle 41 moves, and makes to connect the center of liquid level 43 close to rotation center RC (with reference to (c) of Figure 14).Pass through the rotation and spray of wafer W The opposite position of the movement of mouth 41, outlet 42 and hydrops PD1 change, therefore, the developer solution discharged from outlet 42 DF disperses and is mixed into the wide range in hydrops PD1.Thereby, it is possible to improve the uniformity of the concentration of dilute development liquid.When connecing When the center of liquid level 43 reaches rotation center RC, control unit 112 of prewetting control developer solution supply unit 40 so that stop based on conveyance The movement for the nozzle 41 that mechanism 48 carries out.
In step S26, control unit 112 of prewetting control developer solution supply unit 40 so that stop aobvious from the discharge of outlet 42 Shadow liquid DF.For example, control unit 112 of prewetting controls developer solution control unit 40 so that closes valve 47 and stops from tank 44 to nozzle 41 Supply developer solution.By step so far, the hydrops PD2 (references of dilute development liquid MF are formed on the surface Wa of wafer W (c) of Figure 14).
In step s 27, control unit 112 of prewetting controls rotating holding portion 30 so that the rotating speed of wafer W changes from rotational speed omega 1 Become rotational speed omega 2 (the first rotating speed).Rotational speed omega 2 is configured to：Dilute development with being located inside compared with connecing the periphery of liquid level 43 Liquid MF, which is retained in, to be connect between liquid level 43 and surface Wa, with being located at the dilute development liquid MF in outside compared with connecing the periphery of liquid level 43 to crystalline substance The peripheral side Wb extensions of piece W (with reference to (d) of Figure 14).Rotational speed omega 2 for example can be 300~1500rpm, or 800~ 1200rpm。
In step S28, control unit 112 of prewetting is standby in the process of second processing time.It is previously set according to setting Condition, the second processing time is preset to so that the dilute development liquid with being located inside compared with connecing the periphery of liquid level 43 MF, which is retained in, to be connect between liquid level 43 and surface Wa, and with compared with connecing the periphery of liquid level 43 be located at outside dilute development liquid MF to The peripheral side of wafer W fully applies extension.
More than, by surface Was of the dilute development liquid MF coated in wafer W.In addition, the second position can be rotation center RC Top.At this point it is possible to omit step S25.Control unit 112 of prewetting control developer solution control unit 40 so that performing step S23 Afterwards, once stop supplying developer solution DF from tank 44 to nozzle 41 from the time point that developer solution DF is full of in outlet 42, then exist It connects after liquid level 43 contacts hydrops PD1 and is again turned on supplying developer solution DF from tank 44 to nozzle 41.In addition, control unit 112 of prewetting Step S23 can be performed after connecing liquid level 43 and contacting hydrops PD1.Rotational speed omega 1 or zero.
(developer solution applying step)
In step S03, coating control unit 113 performs：Control rotating holding portion 30 so that in wafer W with the first rotating speed After rotation, make the step of wafer W is with the second rotating speed rotation smaller than the first rotating speed；With control developer solution supply unit 40 so that Wafer W discharges developer solution from outlet 42 on one side, passes through nozzle transport mechanism on one side under the second rotating speed state of rotation 48 make periphery Wb sides from nozzle 41 to wafer W move the step of.
Developer solution supply unit 40 is controlled so that in wafer W under the second rotating speed state of rotation, on one side from outlet 42 discharge developer solutions, on one side by nozzle transport mechanism 48 allow periphery Wb sides from nozzle 41 to wafer W move the step of wrap It includes：Control developer solution control unit 40 so that into the way of periphery Wb sides moving nozzle 41, increase the development from outlet 42 The step of discharge rate of liquid.
Mode as illustrated in Figure 15, coating control unit 113 perform successively step S31, S32, S33, S34, S35, S36, S37、S38、S39。
In step S31, coating control unit 113 controls rotating holding portion 30 so that the rotating speed of wafer W changes from rotational speed omega 2 Become rotational speed omega 3 (the second rotating speed).Rotational speed omega 3 can be small with specific speed ω 2.Rotational speed omega 3 can be more than or equal to rotational speed omega 1.Rotating speed ω 3 is, for example, 30~100rpm.
In step s 32, coating control unit 113 controls developer solution supply unit 40 so that discharges developer solution from outlet 42 DF (with reference to (a) of Figure 16).Such as coating control unit 113 controls developer solution supply unit 40 so that opens valve 47 to start from tank 44 supply developer solution DF to nozzle 41.The developer solution DF discharged from outlet 42, which is mixed into be retained in, to be connect between liquid level 43 and surface Wa Dilute development liquid MF.Due to that, across dilute development liquid MF, rotation center RC can be inhibited attached between developer solution DF and surface Wa The progress of near development treatment.
At this point, coating control unit 113 can control developer solution control unit 40 so that the developer solution DF's of outlet 42 is averaged Flow velocity is 1.2~5.5m/min, can also control developer solution control unit 40 so that the mean flow rate of the developer solution DF of outlet 42 For 1.2~3.5m/min.
In step S33, coating control unit 113 controls developer solution control unit 40 so that is made by nozzle transport mechanism 48 Nozzle 41 starts Wb sides movement outward (with reference to (b) of Figure 16).Later, coating control unit 113 can control developer solution to supply Portion 40 so that the movement speed V [mm/s] of rotational speed omega 3 [rmp] and nozzle 41 meets 3≤ω 3/V≤5.
Coating control unit 113 can control developer solution supply unit 40 so that rotational speed omega 3 [rmp] and the mobile speed of nozzle 41 It spends V [mm/s] and meets 3≤ω 3/V≤4.5.
In step S34, during the center of nozzle 41 reaches flow switching position, coating control unit 113 is standby.According to Prior setting condition etc., flow switching position are configured to the progress for being more suitable for inhibiting the development treatment of the central side of wafer W. Flow switching position is, for example, that the distance for the center and rotation center RC for connecing liquid level 43 is the position of 10~50mm, or is connect The center of liquid level 43 and the position that the distance of rotation center RC is 20~40mm.
In step s 35, coating control unit 113 controls developer solution control unit 40 so that increases aobvious from outlet 42 The discharge rate of shadow liquid.Such as coating control unit 113 controls developer solution control unit 40 so that the aperture of increase valve 47.Step S35 is held The discharge rate of developer solution after row is for example set as 2~7 times of the discharge rate of the developer solution before step S35 is performed, can also set It is set to 2.5~4 times.
In step S36, during discharge end position is reached at the center of nozzle 41, coating control unit 113 is standby.According to Condition being previously set etc., discharge end position are preset to fully supply developer solution from rotation center RC to periphery Wb DF (with reference to (c) of attached drawing 16).
In step S37, coating control unit 113 controls developer solution control unit 40 so that stops aobvious from the discharge of outlet 42 Shadow liquid.For example, coating control unit 113 controls developer solution control unit 40 so that closes valve 47 and stops supplying from tank 44 to nozzle 41 To developer solution.
In step S38, coating control unit 113 controls developer solution control unit 40 so that is made by nozzle transport mechanism 48 Nozzle 41 moves, and keeps out of the way above wafer W.
In step S39, coating control unit 113 controls rotating holding portion 30, stops the rotation of wafer W.
More than, form the liquid film PD3 of developer solution DF in wafer W a (with reference to (d) of Figure 16).Applying control unit 113 can also The change of discharge rate without the developer solution from outlet 42.I.e., it is possible to omit step S34, S35.
(development is cleaned, drying steps)
In step S04, by using the carry out of the development treatment of the liquid film PD3 of developer solution DF it is standby after, clean, dry control Portion 114 processed performs：Control rotating holding portion 30 so that make the step of wafer W is with the 4th rotating speed rotation bigger than the second rotating speed；Control Flushing liquor supply unit 50 processed so that in a state that wafer W is rotated with the 4th rotating speed, make to the surface Wa supply flushing liquors of wafer W The step of wafer W；With control rotating holding portion 30 so that after the supply of flushing liquor terminates, make wafer W with than the 4th rotating speed The step of the 5th big rotating speed rotates.
Mode as illustrated in Figure 17, clean, drying control portion 114 perform successively step S41, S42, S43, S44, S45, S46、S47、S48、S49、S50。
In step S41, clean, drying control portion 114 is standby when by third processing time.According to what is be previously set Condition, the degree that third processing time is preset to the progress for making development treatment are appropriate.
In step S42, clean, drying control portion 114 controls flushing liquor supply unit 50 so that pass through nozzle transport mechanism 56 make nozzle 51 move and be configured at the 4th position.4th position is for example in the top of the rotation center RC of wafer W.
In step S43, clean, drying control portion 114 controls rotating holding portion 30 so that with (the 4th turn of rotational speed omega 4 Speed) start wafer W rotation.Rotational speed omega 4 is, for example, 500~1500rpm.
In step S44, clean, drying control portion 114 controls flushing liquor supply unit 50 so that be initially supplied flushing liquor CF Mode (with reference to Figure 18 (a) and (b)).For example, clean, drying control portion 114 controls flushing liquor supply unit 50 so that open Valve 55 discharges flushing liquor CF from nozzle 51 to surface Wa to start to supply flushing liquor CF from tank 52 to nozzle 51.
In step S45, clean, drying control portion 114 is standby when by the fourth process time.According to what is be previously set Condition, fourth process time are preset to fully wash away by the dissolved matter of developer solution DF and development treatment.
In step S46, clean, drying control portion 114 controls flushing liquor supply unit 50 so that stop the confession of flushing liquor It gives.For example, clean, drying control portion 114 controls flushing liquor supply unit 50 so that close valve 55 to stop from tank 52 to nozzle 51 Supply flushing liquor (with reference to (c) of Figure 18).
In step S47, clean, drying control portion 114 controls flushing liquor supply unit 50 so that pass through nozzle transport mechanism 56 move nozzle 51, to keep out of the way above wafer W.
It in step S48, cleans, drying control portion 114 controls rotating holding portion 30, makes the rotating speed of wafer W from rotational speed omega 4 Change into rotational speed omega 5 (the 5th rotating speed).Rotational speed omega 5 is, for example, 1500~2500rpm.
In step S49, clean, drying control portion 114 is by standby in the 5th processing time.According to what is be previously set Condition, the 5th processing time are preset to fully remove the raffinate on the Wa of surface.
In step s 50, it cleans, drying control portion 114 controls rotating holding portion 30 so that the stopping of the rotation of wafer W. By above method, terminate development, clean and be dried.
[effect of present embodiment]
Coating, developing apparatus 2 include：The rotating holding portion 30 for keeping wafer W and rotating it；To the surface Wa of wafer W Supply the flushing liquor supply unit 50 of flushing liquor；To the developer solution supply unit 40 of surface Wa supply developer solutions；With controller 100.It is aobvious Shadow liquid supply unit 40 has：Nozzle 41 connects liquid level 43 and is opened in that connect liquid level 43 aobvious to discharge including opposite with surface Wa The outlet 42 of shadow liquid；With the nozzle transport mechanism 48 for adjusting 41 position of nozzle.Controller 100 performs：Control flushing liquor supply Portion 50 so that the step of supplying flushing liquor to surface Wa and forming the hydrops of flushing liquor；The action of developer solution supply unit 40 is controlled, Nozzle 41 is moved by nozzle transport mechanism 48 to contact with the hydrops of flushing liquor so as to connect liquid level 43, it is aobvious from the discharge of outlet 42 Shadow liquid forms the step of hydrops of dilute development liquid；The step of controlling rotating holding portion 30, wafer W made to be rotated with the first rotating speed, Wherein, above-mentioned first rotating speed is to connect liquid level 43 so that being retained in the dilute development liquid positioned inside compared with connecing the periphery of liquid level 43 Between the Wa of surface, turn with the dilute development liquid for being located at outside compared with connecing the periphery of liquid level 43 to what the peripheral side of wafer W extended Speed；Control rotating holding portion 30 so that after wafer W is rotated with the first rotating speed, make wafer W with second rotating speed smaller than the first rotating speed The step of rotation；With control developer solution supply unit 40 so that in wafer W under the second rotating speed state of rotation, on one side from Outlet 42 discharges developer solution, makes the step of the movement of nozzle 41 to the peripheral side of wafer W by nozzle transport mechanism 48 on one side.
In the Wa of surface, the part that developer solution is initially reached has the processing using developer solution compared with other parts The trend become larger.In contrast, it according to coating, developing apparatus 2, performs：It is aobvious that dilution is formed before developer solution is supplied The step of hydrops of shadow liquid；With in the state of connecing liquid level 43 and being contacted with the hydrops of dilute development liquid, make the first rotating speed of wafer W revolve The step of turning.It is located at the dilute development liquid of inside (hereinafter referred to as " inside region ") compared with the periphery with connecing liquid level 43 as a result, It is retained in the state of connecing between liquid level 43 and surface Wa, with being located at outside (hereinafter referred to as " outside compared with connecing the periphery of liquid level 43 Region ") peripheral side from dilute development liquid to wafer W extend.As a result, form the thickness ratio lateral area of inside region The big dilute development liquid layer of thickness.Dilute development liquid layer is changed over time and is deteriorated.For example, using the ingredient of developer solution, surface Thus film dissolving on Wa includes the state of dissolving product (substance of dissolving) as dilute development liquid layer.The dilution of deterioration The liquid layer that develops interferes the progress based on the processing for utilizing the developer solution supplied later.As described above, in inside region, there are ratios In the dilute development liquid layer of outer side region thickness.Therefore, to being formed after dilute development liquid layer in the part for being initially supplied to developer solution The progress of processing in (hereinafter referred to as " initial stage reaches part ") is alleviated.Thereby, it is possible to reduce the place of arrival part in the early stage The degree of the progress of reason and other parts processing progress degree difference.Therefore, inhibit processing progress degree (with It is known as " processing degree of progress " down) generate deviation since position on the wafer W is different.
Control developer solution supply unit 40 contacts so that moving nozzle 41 by nozzle transport mechanism 48 so as to connect liquid level 43 The step of hydrops of flushing liquor, can include：Control developer solution supply unit 40 so that in the shape that outlet 42 is full of by developer solution Under state, the step of nozzle 41 is by near surface Wa is made by nozzle transport mechanism 48.At this point, bubble can be inhibited to be mixed into dilute development The hydrops of liquid can inhibit to handle the deviation of degree of progress as caused by the bubble.
Control developer solution supply unit 40 in a state that outlet 42 is full of by developer solution, by transport mechanism so that make spray Mouth 41 leans on the step of near surface Wa that can include：Control developer solution supply unit 40 so that developer solution is discharged from outlet 42 on one side, The step of nozzle 41 being made to depend near surface Wa by nozzle transport mechanism 48 on one side.At this point, it is contacted with flushing liquor connecing liquid level 43 Afterwards, developer solution is directly mixed with flushing liquor.Thereby, it is possible to form the hydrops of dilute development liquid as early as possible, processing time can be shortened.
Control developer solution supply unit 40 so that on one side from the discharge of outlet 42 developer solution, while make nozzle 41 close to wafer W Surface Wa the step of can include：Control developer solution supply unit 40 so that in the distance for connecing liquid level 43 and the surface Wa of wafer W In the state of 5~7mm, start to discharge developer solution from outlet 42, make nozzle 41 close to the surface Wa of wafer W until connecing later The step of distance of the liquid level 43 and surface Wa of wafer W becomes 0.5~2mm.At this point, start to discharge developer solution from outlet 42 Afterwards, during the hydrops that flushing liquor is contacted until connecing liquid level 43, it can prevent developer solution from falling.Thereby, it is possible to inhibit to be based on falling Developer solution processing progress, can inhibit as caused by the whereabouts handle degree of progress deviation.
Second rotating speed may be 10~100rpm.On one side from outlet 42 discharge developer solution, while move nozzle 41 In dynamic process, sometimes developer solution and dilute development liquid be alternately arranged from the lateral peripheral sides of rotation center RC of wafer W and with Swirl shape is distributed.At this point, at the position that the position of developer solution contact is contacted with dilute development liquid, the deviation of processing degree of progress becomes Greatly.In this regard, by making the second rotating speed that can do sth. in advance the extension of dilute development liquid, gyrate point can be inhibited in more than 10rpm Cloth.In addition, by making the second rotating speed in 100rpm hereinafter, the processing degree of progress in the rotation center RC sides of wafer W can be inhibited Become too much.
Controller 100 can also be performed：Control rotating holding portion 30 so that developer solution supply unit 40 passes through nozzle transporter Structure 48 moves nozzle 41 and makes to connect the hydrops that liquid level 43 contacts flushing liquor, when discharging developer solution from outlet 42, makes wafer W The step of being rotated with the third rotating speed smaller than the first rotating speed.
Control developer solution supply unit 40 contacts so that moving nozzle 41 by nozzle transport mechanism 48 to make to connect liquid level 43 The step of hydrops of flushing liquor, can include：Control developer solution supply unit 40 so that in the center deviation wafer W for connecing liquid level 43 The position of rotation center makes to connect the step of liquid level 43 contacts the hydrops of flushing liquor, and control developer solution supply unit 40 is so that from discharge Mouth 42 discharges developer solutions can be included with being formed the step of the hydrops of the dilute development liquid of flushing liquor and developer solution：Control developer solution Supply unit 40 so that discharge developer solution from outlet 42 on one side, nozzle 41 is made to move to make by nozzle transport mechanism 48 on one side Connect the step of center of liquid level 43 is close to the rotation center of wafer W.At this point, starting after the discharge of outlet 42, developer solution It is extended to the direction of rotation of wafer W.Nozzle 41 is moved to the rotation center RC sides of wafer W, and thus developer solution also (leads to radial direction The direction of rotation center RC) extension.Thereby, it is possible to quickly form the hydrops of the high uniformity of the concentration of developer solution, can inhibit The deviation of degree of progress is handled caused by the concentration deviation of developer solution.
Developer solution supply unit 40 is controlled so that in the case where wafer W is with the second rotating speed state of rotation on one side from outlet 42 Developer solution is discharged, is included on one side by the step that nozzle transport mechanism 48 moves nozzle 41 to the peripheral side of wafer W：Control Developer solution supply unit 40 processed so that the movement speed of the second rotating speed and nozzle 41 meets the step of 3≤ω 3/V≤5, wherein,
V：The movement speed [mm/s] of nozzle 41,
ω3：Second rotating speed [rpm].
By making above-mentioned ω 3/V that can inhibit the formation of above-mentioned gyrate distribution more than 3.By making above-mentioned ω 3/V 5 hereinafter, the processing degree of progress of the rotation center RC sides of wafer W can be inhibited to become too much.Therefore, it is possible to further suppress place Manage the deviation of degree of progress.
Developer solution supply unit 40 is controlled so that in chip under the second rotating speed state of rotation, on one side from outlet 42 Developer solution is discharged, the step for nozzle 41 being allow to be moved to the peripheral side of wafer W by nozzle transport mechanism 48 on one side includes：Control Developer solution supply unit 40 processed so that in the way moved in nozzle 41 to the peripheral side of wafer W, increase the development from outlet 42 The step of discharge rate of liquid.At this point, by the way that the processing degree of progress of the rotation center RC sides of wafer W is made relatively to reduce, Neng Goujin One step inhibition handles the deviation of degree of progress.
[variation of development treatment step]
Then, the variation of development treatment step is represented.This variation is by the step of prewetting of above-mentioned development treatment step The example changed with developer solution applying step.Hereinafter, illustrate prewet step and the developer solution applying step in this variation.
(step of prewetting)
This variation prewet step with it is above-mentioned prewet step the difference lies in：Developer solution supply unit 40 is controlled, After outlet 42 has discharged developer solution, in the state of the discharge for stopping the developer solution from outlet 42, pass through nozzle Transport mechanism 48 makes nozzle 41 move and make to connect the center of liquid level 43 close to rotation center RC.
Such as it is as shown in figure 19, control unit 112 of the prewetting execution step S61 identical with step S21, S22, S23, S24, S62、S63、S64.Step S61 includes control rotating holding portion 30 so that starting the rotation of wafer W with rotational speed omega 1 (third rotating speed) The step of.Rotational speed omega 1 is, for example, 30~60rpm.Step S62 includes control imaging liquid supply unit 40 so that utilizing nozzle carrying implement The step of structure 48 makes nozzle 41 move and be configured at the second position.The second position be arranged to the center that connects liquid level 43 with The distance D1 of rotation center RC is, for example, 10~40mm.Step S63 includes control imaging liquid supply unit 40 so that starting from discharge Mouth 42 discharges the step of imaging liquid.The discharge rate for discharging the imaging liquid after starting is, for example, 30~120ml/min.Step S64 packets Control imaging liquid supply unit 40 is included so that the step of nozzle 41 drops to above-mentioned the third place.
Then, control unit 112 of prewetting performs step S65, S66, S67 successively.Step S65 is included in be mixed by defined It is standby during the time.Be mixed into the time be for example set to wafer W once rotate it is more than the time.Step S66 includes control and images Liquid supply unit 40 is so that stop the discharge of the imaging liquid DF from outlet 42.Such as control unit 112 of prewetting controls imaging liquid to supply Stop supplying imaging liquid from tank 44 to nozzle 41 so that closing valve 47 to portion 40.Step S67 includes control imaging liquid supply unit 40 So that it moves nozzle 41 using nozzle carrying mechanism 48 and makes to connect the step of center of liquid level 43 is close to rotation center RC.When connecing When the center of liquid level 43 reaches rotation center RC, control unit 112 of prewetting control imaging liquid supply unit 40 is so that stop utilizing nozzle The movement for the nozzle 41 that carrying mechanism 48 carries out.
In addition, in step S65, S66, S67, the shifting for starting nozzle 41 after the discharge for stopping imaging liquid DF is instantiated Dynamic step, but control unit 112 of prewetting at least controls imaging liquid supply unit 40 so that reaching rotation at the center for connecing liquid level 43 Stop the discharge of imaging liquid DF before the RC of center.Such as control unit 112 of prewetting controls imaging liquid supply unit 40 so that stopping Only start the movement of nozzle 41 before the discharge of imaging liquid DF, imaging liquid supply unit 40 can also be controlled so that in liquid level 43 is connect The heart stops imaging liquid DF discharges into the way that rotation center RC is moved.
Then, control unit 112 of prewetting performs step S68, S69 identical with step S27, D28.Step S68 includes control Rotating holding portion 30 makes the rotating speed of wafer W change from rotational speed omega 1 to rotational speed omega 2 (the first rotating speed).Step S69 is included in by It is standby during two processing times.According to the above, surface Was of the imaging liquid MF coated in wafer W will be diluted.
(imaging liquid applying step)
The imaging liquid applying step of this variation and above-mentioned imaging liquid applying step the difference lies in：Control imaging Liquid supply unit 40 so that in the way left from rotation center RC at the center of contact surface 43 and moved to the periphery Wb sides of wafer W Start to discharge imaging liquid from outlet 42.
Such as shown in figure 20, the step S81 identical with step S31 is first carried out in coating control unit 113.Step S81 packets Include control rotating holding portion 30 make the rotating speed of wafer W from rotational speed omega 2 change to rotational speed omega 3 (the second rotating speed) the step of.Rotational speed omega 3 For example, 30~60rpm.
Then, coating control unit 113 performs step S82, S83, S84 successively.Step S82 includes identically with step S33 Control imaging liquid supply unit 40 so that start with nozzle carrying mechanism 48 make nozzle 41 to periphery Wb sides move the step of.Step S83 is included in standby in the time that nozzle 41 reaches defined discharge starting position.Discharge starting position is set to connect liquid level 43 center and the distance of rotation center RC are, for example, 10~40mm.Step S84 includes control imaging liquid in the same manner as step S32 Supply unit 40 so that start from outlet 42 discharge imaging liquid DF the step of.For the discharge rate for discharging the imaging liquid DF after starting Such as 70~150ml/min.
Then, coating control unit 113 perform successively the step S85 identical with step S34, S35, S36, S37, S38, S39, S86、S87、S88、S89、S90.Step S85 is included in step standby in the time that nozzle 41 reaches flow switching position.Step Rapid S86 includes the step of control imaging liquid supply unit 40 is so that increase the discharge rate of the imaging liquid from outlet 42.Step S87 It is included in step standby in the time that nozzle 41 reaches discharge end position.Step S88 includes control imaging liquid supply unit 40 So that the step of stopping the discharge of the imaging liquid DF from outlet 42.Step S89 includes control imaging liquid supply unit 40 and causes Nozzle 41 is made to move the step of keeping out of the way above wafer W using nozzle carrying mechanism 48.Step S90 includes control rotation and keeps The step of portion 30 stops the rotation of wafer W.According to the above, the liquid film PD3 of imaging liquid DF is formed on wafer W a.Coating control Portion 113 can not also carry out the change of the discharge rate of the imaging liquid from outlet 42.That is, step S85, S86 can also be omitted.
When the groove interval of Resist patterns is bigger, the condition of dissolving product reduction caused by being handled by phenomenon Under, the deterioration delay of above-mentioned dilution imaging liquid layer.As a result, become the effect of dilution imaging liquid layer that the progress of processing mitigates It is small, therefore there is a situation where that the progress that particularly there is processing near the rotation center RC of wafer W is excessive.In this regard, according to This variation, without the discharge of imaging liquid on rotation center RC, therefore, it is possible to inhibit the processing near rotation center RC Progress.More than, embodiment is illustrated, but the present invention is not required to be defined in the above embodiment, without departing from It can be made various changes in the range of the purport of the present invention.The substrate of process object is not limited to semiconductor wafer, such as also may be used Think glass substrate, photomask substrate, FPD (Flat Panel Display) etc..
Then, the embodiment and comparative example of phenomenon processing step are represented, but the present invention is not limited to represented examples.
[embodiment 1]
Prepare the chip of diameter 300mm, the resist film of eurymeric is formed on the Wa of its surface, in a manner that stepping repeats pair The resist film implements exposure-processed.The exposure condition setting respectively shot is the line that equally spaced formation width is about 150nm Shape pattern.Later, each parameter is set as follows, using the developer solution of eurymeric, is illustrated in the above-described embodiment Development treatment.Flushing liquor uses pure water.
First processing time：10s
Pure water discharge rate：40ml
Rotational speed omega 1：40rpm
The second position：From rotation center RC 15mm, connect with a distance from liquid level 43 and surface Wa as 10mm
The third place：From rotation center RC 15mm, connect with a distance from liquid level 43 and surface Wa as 1mm
Rotational speed omega 2：1000rpm
The second processing time：1s
Second rotating speed：40rpm
The discharge rate of developer solution after step S32, before step S35：30ml/min
The movement speed of nozzle 41 after step S33：10mm/s
Flow switching position：Spinning center RC plays 30mm
The discharge rate of developer solution after step S35：90ml/min
Third processing time：3s
Rotational speed omega 4：1000rpm
The fourth process time：15s
Rotational speed omega 5：2000rpm
5th processing time：15s
[comparative example]
Prepare the chip of diameter 300mm, the resist film of eurymeric formed on the Wa of its surface, using line width as 150nm as Target implements exposure-processed.Later, under conditions of following place is changed to embodiment 1, development treatment is carried out.Make to connect In a state that liquid level 43 leaves the hydrops of dilute development liquid, coating extension process (step S27, S28) is carried out to dilute development liquid, Later, the interval for connecing liquid level 43 and surface Wa is returned into the step of 1mm is performed below.
[embodiment 2]
Except following aspect, development treatment is carried out under the same conditions as example 1.
I) nozzle 41 has along on the same direction of the circumferential array at the center for connecing liquid level 43 and each comfortable circumferential direction Inclined multiple outlets 42.
Ii) in the discharge rate for making developer solution DF under conditions of 90ml/min, by connect liquid level 43 developer solution DF it is flat Equal flow velocity is 21.7m/min.
Iii) after step s 32, the discharge rate of the developer solution before step S35 is 90ml/min.
[embodiment 3]
Except following aspect, development treatment is carried out under the same conditions as in practical example 2.
Ii) in the discharge rate for making developer solution DF under conditions of 90ml/min, by connect liquid level 43 developer solution DF it is flat Equal flow velocity is 3.5m/min.
[embodiment 4]
Except following aspect, development treatment is carried out under the same conditions as in practical example 2.
I) nozzle 41 has one, the center outlet 42 for leading to and connecing liquid level 43.
Ii) in the discharge rate for making developer solution DF under conditions of 90ml/min, by connect liquid level 43 developer solution DF it is flat Equal flow velocity is 2.3m/min.
[evaluation of the deviation of the line width between shooting]
For the Resist patterns according to embodiment and comparative example making, shooting every time all sets 9 measuring points, in each survey Fixed point determines line width.In each of 9 local measuring points, calculate the line width all shot measured value (line width Measurement result) average value.Hereinafter, the average value that 9 local measuring points are each obtained is known as " a reference value ".It is clapping every time In taking the photograph, the difference of 9 local line width measured values and 9 local a reference values is calculated respectively.Hereinafter, measured value and base by line width The difference of quasi- value is known as " deviation value ".Using in shooting calculate 9 local deviation values average value and obtain data acquisition system as It is overall, standard deviation is calculated, using its 3 times value as the first deviation evaluation of estimate.
[evaluation of the deviation of the line width in shooting]
For the Resist patterns made by embodiment and comparative example, shooting every time all sets 9 measuring points, each Measuring point determines line width.In each of 9 local measuring points, said reference value is calculated, it is local to calculate 9 Above-mentioned deviation value.In each shooting, the standard deviation of 9 local deviation values is calculated, is commented using its 3 times value as the second deviation Value.
[comparison result of deviation evaluation of estimate]
The wafer W of embodiment 1 is compared with the wafer W of comparative example, and the first deviation evaluation of estimate is about small by 28%, and the second deviation is commented Value is about small by 22%.It can be confirmed according to the result：It is performed in the state of the hydrops for connecing the contact dilute development liquid of liquid level 43 Before developer solution is supplied the step of coating extension dilute development liquid, thereby, it is possible to reduce the deviation of processing degree of progress.
The wafer W of embodiment 3 is compared with the wafer W of embodiment 2, and the first deviation evaluation of estimate is about small by 30%, the second deviation Evaluation of estimate does not have big deviation.It can be confirmed according to the result：To 41 left change of nozzle so that by the developer solution for connecing liquid level 43 The mean flow rate of DF becomes 3.5m/min from 21.7m/min, as a result, the deviation of reduction processing degree of progress.
For the wafer W of embodiment 4 compared with the wafer W of embodiment 3, the first deviation evaluation of estimate is about small by 10%.According to the knot Fruit can be confirmed：The mean flow rate of the developer solution DF of liquid level 43 is connect by further reducing, becomes 2.3m/min from 3.5m/min, The deviation of line width between shooting further is reduced as a result,.
On the other hand, for the wafer W of embodiment 4 compared with the wafer W of embodiment 3, the second deviation evaluation of estimate is about big by 10%. It can be confirmed according to the result：The mode of the nozzle 41 of embodiment 2 and 3 (has along the circumferential row around the center for connecing liquid level 43 Row, each comfortable circumferential direction the same direction on inclined multiple outlets 42 mode) advantageously reduce the line width in shooting Deviation.

Claims (19)

1. a kind of substrate processing device, it is characterised in that：Including
The rotating holding portion for keeping substrate and rotating it；
To the first supply unit of the surface supply dilution of the substrate；
To the second supply unit of the surface supply treatment fluid of the substrate；With
Control unit,
Second supply unit includes：
Nozzle, including it is opposite with the surface of the substrate connect liquid level and be opened in described connect liquid level and discharge the treatment fluid Outlet；With
The position-regulation portion of the position of the nozzle is adjusted,
The control unit performs：
Control first supply unit so that supply the dilution to the surface of the substrate, form the product of the dilution The step of liquid；
Control second supply unit so that make the nozzle mobile by the position-regulation portion to make described to connect liquid level and institute The hydrops contact of dilution is stated, the mixing of the dilution and the treatment fluid is formed from the outlet discharge treatment fluid The step of hydrops of liquid；
The step of controlling the rotating holding portion, the substrate made to be rotated with the first rotating speed, wherein, first rotating speed be so that Compared with the periphery for connecing liquid level positioned at the mixed liquor of inside be retained in it is described connect between liquid level and the surface of substrate, with Compare the rotating speed that the mixed liquor positioned at outside is extended to the peripheral side of the substrate in the periphery for connecing liquid level；
Control the rotating holding portion so that after the substrate is rotated with first rotating speed, make the substrate with than institute State the step of the second small rotating speed of the first rotating speed rotates；With
Control second supply unit so that in the substrate under the second rotating speed state of rotation, on one side from institute It states outlet and discharges the treatment fluid, the nozzle is made to be moved to the peripheral side of the substrate by the position-regulation portion on one side The step of.
2. substrate processing device as described in claim 1, it is characterised in that：
Control second supply unit so that make the nozzle mobile by the position-regulation portion to make described to connect liquid level and institute The step of hydrops contact for stating dilution, includes：
Control second supply unit so that in a state that the outlet is full of by the treatment fluid, pass through the position Adjustment portion makes the step of nozzle is close to the surface of the substrate.
3. substrate processing device as claimed in claim 2, it is characterised in that：
Control second supply unit so that make the nozzle close in a state that the outlet is full of by the treatment fluid The step of surface of the substrate, includes：
Control second supply unit so that discharge the treatment fluid from the outlet on one side, pass through the position tune on one side Section portion makes the step of nozzle is close to the surface of the substrate.
4. substrate processing device as claimed in claim 3, it is characterised in that：
Control second supply unit so that discharge the treatment fluid from the outlet on one side, make the nozzle close on one side The step of surface of the substrate, includes：
Control second supply unit so that connect liquid level and state of the distance on the surface of the substrate for 5~7mm described Under, start to discharge the treatment fluid from the outlet, the nozzle is made to connect liquid to described close to the surface of the substrate later The step of distance in face and the surface of the substrate becomes 0.5~2mm.
5. such as substrate processing device according to any one of claims 1 to 4, it is characterised in that：
First rotating speed is 300~1500rpm.
6. such as substrate processing device according to any one of claims 1 to 5, it is characterised in that：
Second rotating speed is 10~100rpm.
7. such as substrate processing device according to any one of claims 1 to 6, it is characterised in that：
The control unit also performs：Control the rotating holding portion so that adjusted by the position in second supply unit Portion make the nozzle mobile and make it is described connect liquid level contacted with the hydrops of the dilution and from the outlet discharge it is described from When managing liquid, the substrate is made to be rotated with the third rotating speed smaller than first rotating speed.
8. substrate processing device as claimed in claim 7, it is characterised in that：
Control second supply unit so that make the nozzle mobile by the position-regulation portion to make described to connect liquid level and institute The step of hydrops contact for stating dilution, includes：
Control second supply unit so that at the center for connecing liquid level from the position that the rotation center of the substrate deviates, The step of liquid level is contacted with the hydrops of the dilution is connect described in making,
Control second supply unit so that discharge treatment fluid from the outlet, form the dilution and the treatment fluid Mixed liquor hydrops the step of include：
Control second supply unit so that discharge the treatment fluid from the outlet on one side, pass through the position tune on one side Section portion makes the nozzle mobile and makes described to connect the step of center of liquid level is close to the rotation center of the substrate.
9. substrate processing device as claimed in claim 7 or 8, it is characterised in that：
The third rotating speed is in below 100rpm.
10. such as substrate processing device according to any one of claims 1 to 9, it is characterised in that：
Control second supply unit so that in the substrate under the second rotating speed state of rotation, on one side from institute It states outlet and discharges the treatment fluid, the nozzle is made to be moved to the peripheral side of the substrate by the position-regulation portion on one side The step of include：
Control second supply unit so that the movement speed of second rotating speed and the nozzle meets the step of 3≤RF/V≤5 Suddenly, wherein,
V：The movement speed [mm/s] of nozzle
RF：Second rotating speed [rpm].
11. such as substrate processing device according to any one of claims 1 to 10, it is characterised in that：
Control second supply unit so that in the substrate under the second rotating speed state of rotation, on one side from institute It states outlet and discharges the treatment fluid, the nozzle is made to be moved to the peripheral side of the substrate by the position-regulation portion on one side The step of include：
Control second supply unit so that in the way moved in the nozzle to the peripheral side of the substrate, increase from institute The step of stating the discharge rate of the treatment fluid of outlet.
12. the substrate processing device as described in any one of claim 1~11, it is characterised in that：
The nozzle is configured under conditions of the discharge rate for making the treatment fluid is 90ml/min, passes through the institute for connecing liquid level The mean flow rate for stating treatment fluid is 1.2~5.5m/min.
13. substrate processing device as claimed in claim 12, it is characterised in that：
The nozzle has multiple outlets, the multiple outlet along the circumferential array around the center for connecing liquid level and It is tilted on each leisure circumferential same direction.
14. substrate processing device as described in claim 12 or 13, it is characterised in that：
The opening area of the outlet becomes larger with by proximity liquid level.
15. the substrate processing device as described in any one of claim 12~14, it is characterised in that：
Control second supply unit so that in the substrate under the second rotating speed state of rotation, on one side from institute It states outlet and discharges the treatment fluid, the nozzle is made to be moved to the peripheral side of the substrate by the position-regulation portion on one side The step of include：
Control second supply unit so that start from the outlet discharge the treatment fluid when, pass through the liquid level that connects The step of mean flow rate of the treatment fluid is 1.2~5.5m/min.
16. substrate processing device as claimed in claim 7, it is characterised in that：
Control second supply unit so that discharge the treatment fluid from the outlet, form the dilution and the place The step of hydrops for managing the mixed liquor of liquid, includes：
Second supply unit is controlled, after the treatment fluid is discharged from the outlet, stops discharging from the outlet In the state of the treatment fluid, make the nozzle mobile by the position-regulation portion to make described to connect the center of liquid level close to institute The step of stating the rotation center of substrate.
17. substrate processing device as claimed in claim 16, it is characterised in that：
Control second supply unit so that in the substrate under the second rotating speed state of rotation, on one side from institute It states outlet and discharges the treatment fluid, the nozzle is made to be moved to the peripheral side of the substrate by the position-regulation portion on one side The step of include：
Control second supply unit so that leave to outer peripheral side in the rotation center of the center for connecing liquid level from the substrate In mobile way, start from the outlet discharge treatment fluid the step of.
18. a kind of processing method for substrate, which is characterized in that including：
The step of supplying dilution to the surface of substrate, form the hydrops of the dilution；
Make to include it is opposite with the surface of the substrate connect liquid level and be opened in described connect liquid level to discharge the row of the treatment fluid The nozzle movement of outlet, make it is described connect liquid level and contacted with the hydrops of the dilution, discharging treatment fluid from the outlet forms The step of hydrops of the dilution and the mixed liquor of the treatment fluid；
The step of substrate is made to be rotated with the first rotating speed, wherein first rotating speed is so that with the outer phase for connecing liquid level The mixed liquor than being located inside be retained in it is described connect between liquid level and the surface of substrate, with it is described connect the periphery of liquid level compared with The rotating speed that the mixed liquor positioned at outside is extended to the peripheral side of the substrate；
After the substrate is rotated with first rotating speed, the substrate is made to be revolved with second rotating speed smaller than first rotating speed The step of turning；With
In the substrate under the second rotating speed state of rotation, to discharge the treatment fluid from the outlet on one side, The step that the nozzle is made to be moved to the peripheral side of the substrate on one side.
19. a kind of computer readable storage medium, it is characterised in that：
Record is useful for the program for making the processing method for substrate described in device perform claim requirement 18.
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