CN108152628B - Method for processing piezoelectric ceramic piece - Google Patents
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- CN108152628B CN108152628B CN201711418417.XA CN201711418417A CN108152628B CN 108152628 B CN108152628 B CN 108152628B CN 201711418417 A CN201711418417 A CN 201711418417A CN 108152628 B CN108152628 B CN 108152628B
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
- C04B41/46—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with organic materials
- C04B41/48—Macromolecular compounds
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/53—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone involving the removal of at least part of the materials of the treated article, e.g. etching, drying of hardened concrete
- C04B41/5315—Cleaning compositions, e.g. for removing hardened cement from ceramic tiles
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
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- C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
- C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
- C04B41/81—Coating or impregnation
- C04B41/82—Coating or impregnation with organic materials
- C04B41/83—Macromolecular compounds
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R27/00—Arrangements for measuring resistance, reactance, impedance, or electric characteristics derived therefrom
- G01R27/02—Measuring real or complex resistance, reactance, impedance, or other two-pole characteristics derived therefrom, e.g. time constant
- G01R27/26—Measuring inductance or capacitance; Measuring quality factor, e.g. by using the resonance method; Measuring loss factor; Measuring dielectric constants ; Measuring impedance or related variables
- G01R27/2605—Measuring capacitance
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Abstract
The application discloses a method for processing a piezoelectric ceramic piece, and belongs to the technical field of production of underwater acoustic transducers. The method comprises the steps of stacking the piezoelectric ceramic plates in the same group according to the polarity orientation requirement; and marking the grouping number on the side surface of each group of stacked piezoelectric ceramic pieces by using an oily mark pen, wherein the grouping number of each group of stacked piezoelectric ceramic pieces covers the side surface of each whole group of piezoelectric ceramic pieces from top to bottom, and the grouping numbers of each group of stacked piezoelectric ceramic pieces are different. According to the method, the side surfaces of each group of stacked piezoelectric ceramic pieces are marked with the grouping numbers by using the oily mark pen, so that the reliability of the polarity identification and the grouping pairing of the piezoelectric ceramic pieces is greatly improved, and the disorder of the polarity identification and the grouping pairing identification caused by subsequent processing steps in a process flow is avoided; the two steps of polarity identification and grouping pairing of the piezoelectric ceramic pieces are combined into one step, so that the efficiency of the piezoelectric ceramic processing process flow is improved.
Description
Technical Field
The invention belongs to the technical field of underwater acoustic transducer production, and relates to a method for processing a piezoelectric ceramic piece.
Background
The underwater acoustic transducer needs to carry out multi-step treatment on the piezoelectric ceramic plate in the production and assembly process, and the specific process flow is as follows: and (3) judging the polarity: judging the polarity of the positive electrode and the negative electrode of the piezoelectric ceramic by using a quasi-static d33 tester; polarity identification: marking red points on the surface of the piezoelectric ceramic or marking red points on the side surface of the piezoelectric ceramic; reference numbers: numbering the surfaces of the piezoelectric ceramic pieces by using pencils; and (3) capacitance measurement: measuring the capacitance of the piezoelectric ceramic piece by using a universal meter; grouping and pairing: grouping and pairing the piezoelectric ceramic pieces according to the capacitance of the piezoelectric ceramic pieces; surface treatment: carrying out surface treatment on the piezoelectric ceramic piece by using alcohol, acetone and a detergent; drying: drying in a forced air drying oven at 100-; gluing: coating an epoxy adhesive on the surface of the piezoelectric ceramic piece; clamping: the piezoelectric ceramic pieces and the electrode plates are arranged at intervals and are arranged in a clamp; and (3) curing: and putting the clamped piezoelectric ceramic piece, the electrode plate and the clamp into a baking oven together to enable the epoxy adhesive to generate a curing reaction.
At present, in the above-mentioned piezoelectric ceramic piece processing process flow, the polarity of the piezoelectric ceramic piece and the identification method of grouping and pairing have the defects of poor reliability, low efficiency and the like. In the process step of polar identification, when the thickness of the piezoelectric ceramic piece is larger, an oil mark pen is used for marking a red dot at one end of the side surface of the piezoelectric ceramic piece close to the positive pole to serve as a positive identification pole. However, even if the thickness of the thick piezoelectric ceramic sheet is small, it is difficult to mark a red dot on the side surface and to clearly identify the position of the red dot near a certain end. When the thickness of the piezoelectric ceramic piece is smaller, red dots can be marked on the surface of the positive electrode of the piezoelectric ceramic piece to serve as a mode for marking the positive electrode. This method of marking can result in missing marks due to red spots washed away by the subsequent surface treatment process.
In the process steps of grouping and pairing the piezoelectric ceramic pieces, the piezoelectric ceramic pieces grouped and paired according to the capacitance value are subjected to approaches, stacks, discharges and other methods, and the pairing relationship is displayed through the position relationship. However, due to the subsequent surface treatment and other steps, the piezoelectric ceramic pieces may undergo multiple positional movements, and the positional relationship therebetween is easily disturbed, thereby causing disorder of the mating relationship.
The defects existing in the two process steps seriously affect the efficiency and the reliability of the piezoelectric ceramic treatment process flow, and further seriously affect the reliability of the transducer.
Disclosure of Invention
In order to solve the defects in the process steps, the invention provides a method for processing a piezoelectric ceramic piece, which has the following specific technical scheme:
a method of processing a piezoceramic wafer, the method comprising: stacking the piezoelectric ceramic plates in the same group according to the polarity orientation requirement; and marking the grouping number on the side surface of each group of stacked piezoelectric ceramic pieces by using an oily mark pen, wherein the grouping number of each group of stacked piezoelectric ceramic pieces covers the side surface of each whole group of piezoelectric ceramic pieces from top to bottom, and the grouping numbers of each group of stacked piezoelectric ceramic pieces are different.
Alternatively, the packet number here may be an arabic numeral. Obviously, the grouping number may also be an english alphabet or other characters.
Optionally, after the side of each set of stacked piezoelectric ceramic plates is marked with a number by using an oil marker, the method further includes: carrying out surface treatment and drying treatment on the piezoelectric ceramic plates which are subjected to grouping numbering; coating an epoxy adhesive on the surface of the piezoelectric ceramic sheet subjected to surface treatment and drying treatment; arranging the piezoelectric ceramic plates and the electrode plates at intervals according to a preset mode and loading the piezoelectric ceramic plates and the electrode plates into a clamp; and putting the clamped piezoelectric ceramic piece, the electrode plate and the clamp into a baking oven to enable the epoxy adhesive to generate a curing reaction.
Optionally, before the piezoelectric ceramic plates in the same group are stacked according to the polarity orientation requirement, the method further includes: judging the positive and negative electrodes of the piezoelectric ceramic piece, and marking the positive electrode or the negative electrode on the surface of the piezoelectric ceramic piece; numbering the surfaces of the piezoelectric ceramic pieces; and measuring the capacitance of the piezoelectric ceramic piece, and correspondingly storing the serial number and the capacitance of the piezoelectric ceramic piece.
Optionally, the method further includes: and grouping and pairing the piezoelectric ceramic pieces according to the corresponding relation between the serial numbers of the piezoelectric ceramic pieces and the capacitors.
Through above-mentioned technical scheme, the beneficial effect that this application can realize includes at least:
the side surfaces of each group of piezoelectric ceramic pieces which are stacked in a matched mode are marked with grouping numbers by using an oily mark pen, so that after the position relationship of a plurality of piezoelectric ceramic pieces in the same group is changed in the subsequent processing steps, the matching relationship and the mutual position relationship of the piezoelectric ceramic pieces can be restored in a mode that the missing grouping numbers of the side surfaces of each piezoelectric ceramic piece are spliced into a complete grouping number; and secondly, the grouping number is the group number of the grouped piezoelectric ceramic pieces, and the number of the grouped piezoelectric ceramic pieces can be visually seen.
In addition, the reliability of the polarity identification and the grouping pairing of the piezoelectric ceramic pieces is greatly improved, and the confusion of the polarity identification and the grouping pairing identification caused by subsequent processing steps in the process flow is avoided; the two steps of polarity identification and grouping pairing of the piezoelectric ceramic pieces are combined into one step, so that the efficiency of the piezoelectric ceramic processing process flow is improved.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the invention, as claimed.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and together with the description, serve to explain the principles of the invention.
FIG. 1 is a flow chart of a method of processing a piezoceramic wafer provided in one embodiment of the present invention;
fig. 2 is a schematic diagram of grouping numbers of piezoelectric ceramic pieces paired in a grouping manner according to an embodiment of the present invention;
fig. 3 is a schematic diagram of clamping the piezoelectric ceramic plate and the pole piece according to an embodiment of the present invention.
Detailed Description
Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, like numbers in different drawings represent the same or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present invention. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the invention, as detailed in the appended claims.
Fig. 1 is a flowchart of a method for processing a piezoelectric ceramic plate according to an embodiment of the present invention, where the method for processing a piezoelectric ceramic plate includes the following steps:
step 101, judging the positive and negative electrodes of the piezoelectric ceramic piece, and marking the positive electrode or the negative electrode on the surface of the piezoelectric ceramic piece.
After the piezoelectric ceramic piece is produced, the anode and the cathode of the piezoelectric ceramic piece need to be judged for the convenience of delivery or the convenience of later-stage clamping of the piezoelectric ceramic piece.
In one possible implementation, the polarity of the positive and negative electrodes of the piezoelectric ceramic can be determined by using a quasi-static d33 tester.
When the positive electrode or the negative electrode is marked on the surface of the piezoelectric ceramic piece, in order to simplify the marking, only the positive electrode is usually marked on the surface of each piezoelectric ceramic piece, or only the negative electrode is usually marked on the surface of each piezoelectric ceramic piece, and usually, the positive electrode surface of each piezoelectric ceramic piece is directly marked as a red dot.
And 102, numbering the surfaces of the piezoelectric ceramic pieces.
In addition, because the number of the piezoelectric ceramic pieces is large and the capacitance of each piezoelectric ceramic piece is different, in order to determine the capacitance of a certain piezoelectric ceramic piece in the later period, the piezoelectric ceramic pieces need to be distinguished, and at this time, numbering needs to be carried out on the surfaces of the piezoelectric ceramic pieces. Different piezoceramic wafers have different numbers, that is to say the numbers serve to uniquely identify the piezoceramic wafers.
At present, most manufacturers of piezoelectric ceramic pieces use pencils to number the surfaces of the piezoelectric ceramic pieces.
And 103, measuring the capacitance of the piezoelectric ceramic piece, and correspondingly storing the number and the capacitance of the piezoelectric ceramic piece.
Because the capacitance of different piezoelectric ceramic pieces may be different, in order to facilitate later pairing, the capacitance of each piezoelectric ceramic piece needs to be measured. In one possible implementation, a multimeter may be used to measure the capacitance of the piezoelectric ceramic plates.
In actual production, the numbers of the piezoelectric ceramic pieces and the capacitance values thereof are usually stored correspondingly, so as to determine the capacitance value of a certain piezoelectric ceramic piece conveniently.
In practical application, a manufacturer producing the piezoelectric ceramic piece and a manufacturer producing the underwater acoustic transducer may not be the same, and for the manufacturer producing the underwater acoustic transducer, only the piezoelectric ceramic piece marked with the positive electrode and the negative electrode and written with the serial number may need to be introduced, and the relation between the serial number of the introduced piezoelectric ceramic piece and the capacitance may be obtained. Therefore, in this case, before the manufacturer of the piezoelectric ceramic plate leaves the factory, the manufacturer generally performs steps 101 to 103 to determine the positive and negative electrodes of the piezoelectric ceramic plate and to determine the correspondence between the capacitance and the serial number of the piezoelectric ceramic plate. For manufacturers producing underwater acoustic transducers, when the piezoelectric ceramic plate is used to produce the underwater acoustic transducer, the steps 101 to 103 may not be performed, but the following steps 104 to 110 may be performed.
And 104, grouping and pairing the piezoelectric ceramic pieces according to the corresponding relation between the serial numbers of the piezoelectric ceramic pieces and the capacitors.
The piezoceramic wafers may be paired in groups according to a predetermined pairing strategy. Generally, pairing strategies are often associated with capacitance. For example, the piezoelectric ceramic sheets are paired two by two, and the average value of the capacitances of the paired piezoelectric ceramic sheets is within a predetermined capacitance range. Of course, any even number of piezoceramic wafers may also be paired, that is, the number of piezoceramic wafers paired in groups is typically an even number.
However, it should be noted that when the underwater acoustic transducers of the same model are produced, the number of the piezoelectric ceramic plates in the group pairs is generally the same, that is, the number of the piezoelectric ceramic plates in each group of the group pairs is 2, or 4, and the like.
And 105, stacking the piezoelectric ceramic plates in the same group according to the polarity orientation requirement.
And 106, marking the grouping numbers on the side surfaces of each group of stacked piezoelectric ceramic plates by using an oily mark pen.
Because the piezoelectric ceramic plates in the same group are stacked according to the polarity orientation requirement, and the side surfaces of the stacked piezoelectric ceramic plates are numbered in groups, the stacking mode is the stacking mode required in subsequent clamping, and the grouping numbers of the groups can uniquely identify the stacking mode of the groups.
In order to avoid disorder of the same group of piezoelectric ceramic pieces due to carrying in the subsequent processing process, the group number of each group of stacked piezoelectric ceramic pieces is required to cover the side face of each whole group of piezoelectric ceramic pieces from top to bottom in the application, that is, part of traces of the group number are reserved on the side face of each group of stacked piezoelectric ceramic pieces. In addition, in order to avoid the misalignment, the group numbers of each group of the stacked piezoelectric ceramic sheets are different.
In practical use, in order to eliminate confusion caused by single group numbers, two identical group numbers can be marked with oil-based marker pens at different positions on the side of each group of stacked piezoelectric ceramic plates. Referring to fig. 2, the entire group of sides of the first group of piezoceramic wafers is labeled with grouping number "1", and the entire group of sides of the second group of piezoceramic wafers is labeled with grouping number "2".
And step 107, performing surface treatment and drying treatment on the piezoelectric ceramic pieces subjected to the grouping number.
The surface treatment can be surface treatment of the piezoelectric ceramic plate by alcohol, acetone and detergent, namely the surface treatment can remove other stains on the outer surface of the piezoelectric ceramic plate except the writing of the group number.
After the surface treatment, drying may be performed for 2 to 8 hours using a forced air drying oven at 100-.
And 108, brushing an epoxy adhesive on the surface of the piezoelectric ceramic piece subjected to surface treatment and drying treatment.
And step 109, arranging the piezoelectric ceramic pieces and the electrode plates at intervals in a preset mode and loading the piezoelectric ceramic pieces and the electrode plates into a clamp.
In one implementation, referring to fig. 3, the first group of piezoelectric ceramic pieces 21a and the second group of piezoelectric ceramic pieces 21b may be stacked in the stacking manner of fig. 3 and placed in a jig together with the electrode pieces 22a, 22b, and 22c in the manner of fig. 3.
And step 110, putting the clamped piezoelectric ceramic piece, the electrode slice and the clamp into a baking oven to enable the epoxy adhesive to generate a curing reaction.
In summary, according to the method for processing the piezoelectric ceramic pieces, the piezoelectric ceramic pieces which are paired in groups are stacked according to the polarity orientation requirement, then the oil mark pen is used for marking the grouped numbers on the side surfaces of each group of stacked piezoelectric ceramic pieces, and the numbers marked by the oil mark pen are not easy to be cleared or damaged by the subsequent processing technology, so that even if the piezoelectric ceramic pieces in the same group are disordered in the subsequent process of moving the piezoelectric ceramic pieces, the pairing relation and the mutual position relation of the piezoelectric ceramic pieces can be restored in a mode that the incomplete number on the side surface of each piezoelectric ceramic piece is spliced into the complete number. And secondly, the grouping number is the group number of the grouped piezoelectric ceramic pieces, and the number of the grouped piezoelectric ceramic pieces can be visually seen.
In addition, the reliability of the polarity identification and the grouping pairing of the piezoelectric ceramic pieces is greatly improved, and the confusion of the polarity identification and the grouping pairing identification caused by subsequent processing steps in the process flow is avoided; the two steps of polarity identification and grouping pairing of the piezoelectric ceramic pieces are combined into one step, so that the efficiency of the piezoelectric ceramic processing process flow is improved.
Other embodiments of the invention will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the invention and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the invention being indicated by the following claims.
It will be understood that the invention is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the invention is limited only by the appended claims.
Claims (2)
1. A method of processing a piezoceramic wafer, the method comprising:
stacking the piezoelectric ceramic plates in the same group according to the polarity orientation requirement;
marking the grouping number on the side surface of each group of stacked piezoelectric ceramic pieces by using an oily mark pen, wherein the grouping number of each group of stacked piezoelectric ceramic pieces covers the side surface of each whole group of piezoelectric ceramic pieces from top to bottom, and the grouping numbers of each group of stacked piezoelectric ceramic pieces are different;
wherein after the number numbers are marked on the side surface of each group of the stacked piezoelectric ceramic plates by using an oily marker, the method further comprises the following steps: carrying out surface treatment and drying treatment on the piezoelectric ceramic plates which are subjected to grouping numbering; coating an epoxy adhesive on the surface of the piezoelectric ceramic sheet subjected to surface treatment and drying treatment; arranging the piezoelectric ceramic plates and the electrode plates at intervals according to a preset mode and loading the piezoelectric ceramic plates and the electrode plates into a clamp; putting the clamped piezoelectric ceramic piece, the electrode plate and the clamp into a baking oven to enable the epoxy adhesive to generate a curing reaction;
before the same group of piezoelectric ceramic plates are stacked according to the polarity orientation requirement, the method further comprises the following steps: judging the positive and negative electrodes of the piezoelectric ceramic piece, and marking the positive electrode or the negative electrode on the surface of the piezoelectric ceramic piece; numbering the surfaces of the piezoelectric ceramic pieces; and measuring the capacitance of the piezoelectric ceramic piece, and correspondingly storing the serial number and the capacitance of the piezoelectric ceramic piece.
2. The method of claim 1, further comprising:
and grouping and pairing the piezoelectric ceramic pieces according to the corresponding relation between the serial numbers of the piezoelectric ceramic pieces and the capacitors.
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| US5248137A (en) * | 1992-08-21 | 1993-09-28 | Xerox Corporation | High capacity feeder initialization |
| CN100480894C (en) * | 2006-01-16 | 2009-04-22 | 北京书生国际信息技术有限公司 | Printing method with small margin or no margin |
| CN101159672B (en) * | 2007-11-09 | 2012-04-18 | 中兴通讯股份有限公司 | Method for distributing stacking system equipment number |
| CN105098251B (en) * | 2014-05-09 | 2017-12-19 | 有量科技股份有限公司 | Sticking method and device for electrode slice |
| CN204168182U (en) * | 2014-11-13 | 2015-02-18 | 交通运输部公路科学研究所 | A kind of multi-layer piezoelectric device |
| CN104370556B (en) * | 2014-12-04 | 2016-11-23 | 湖南嘉业达电子有限公司 | Piezoelectric ceramics polarization method in sulfur hexafluoride gas and polarization device thereof |
| CN107023288B (en) * | 2016-02-01 | 2019-08-20 | 中国科学院声学研究所 | A kind of low frequency extensional vibration energy converter and preparation method thereof for oil well sound wave communication |
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