CN108115274A - A kind of laser-processing system and method - Google Patents
A kind of laser-processing system and method Download PDFInfo
- Publication number
- CN108115274A CN108115274A CN201611085477.XA CN201611085477A CN108115274A CN 108115274 A CN108115274 A CN 108115274A CN 201611085477 A CN201611085477 A CN 201611085477A CN 108115274 A CN108115274 A CN 108115274A
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- laser
- point generator
- light beam
- multifocal point
- focus
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- 238000000034 method Methods 0.000 title abstract description 7
- 238000007493 shaping process Methods 0.000 claims abstract description 13
- 239000007788 liquid Substances 0.000 claims description 12
- 238000003672 processing method Methods 0.000 claims description 4
- 239000000571 coke Substances 0.000 claims 1
- 238000003754 machining Methods 0.000 abstract description 13
- 230000008859 change Effects 0.000 abstract description 10
- 239000000463 material Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 210000001367 artery Anatomy 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 210000003462 vein Anatomy 0.000 description 2
- 230000003321 amplification Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 239000003574 free electron Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000006552 photochemical reaction Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/067—Dividing the beam into multiple beams, e.g. multifocusing
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Lasers (AREA)
Abstract
A kind of laser-processing system and method, beam expander, laser mirror, multifocal point generator and the focus lamp which includes laser, set gradually along the direction of propagation of laser emitting light beam；The light beam of laser emitting enters the beam expander, and after beam expander expands shaping, again multifocal point generator is reflected into through laser mirror, line focus mirror focuses on object to be processed the light beam being emitted from multifocal point generator again, and multifocal point generator can change the incidence angle that outgoing beam incides into the focus lamp, therefore laser beam can generate the focus of one section of consecutive variations by multifocal point generator, so that processing is not limited to machining object surface and can reach in machining object, processing efficiency is not only promoted, but also improves processing quality.
Description
Technical field
The present invention relates to technical field of laser processing more particularly to a kind of more laser-processing systems and method.
Background technology
Due to laser machining in accuracy, the flexibility of technique, noncontact processing and heat affecting etc. caused by material
Aspect has excellent specific property, so that material processing is carried out using laser, it is increasingly wider in the application field of entire industry
It is general,
Laser Processing is substantially to form a rhegmalypt in material surface using the high-energy density after laser focusing,
Then machining shape is formed by the kinematic system of auxiliary again, in practical application area, generally require by laser beam focus into
Small focus, to obtain fine Laser Processing effect.Since by laser beam focus, into small focus, depth of focus will become very
Short, Laser Processing is confined to material surface so that needing repeatedly could back and forth realize when laser machining thicker material
Reach material internal, so as to reduce the efficiency of Laser Processing.
In order to avoid when laser machining thicker material reciprocal could realize being needed repeatedly to reach material internal, so as to
Reduce Laser Processing efficiency the phenomenon that, a kind of existing scheme, as Publication No. 104785923A Chinese patent application its
A kind of laser-processing system of multiple-point focusing is disclosed, which makes a row focus edge using diffraction beam splitter
Central axis is distributed.
But the shortcomings that laser-processing system is after diffraction beam splitter determines, the distribution of focus is just determined,
Due to incident light beam and nonideal light beam, cause the focus energy being distributed along central axis different, and then laser is caused to add
Working medium amount is bad, and limited using the focus number that diffraction beam splitter generates, usually only two or three, so as into one
Step limits the promotion of the quality of Laser Processing.
The content of the invention
It is an object of the invention to overcome above-mentioned the deficiencies in the prior art, a kind of more laser-processing systems and method are provided,
Existing laser-processing system is aimed to solve the problem that due to using diffraction beam splitter a row focus being made to be distributed along central axis, it is incident
Light beam and nonideal light beam cause the focus energy being distributed along central axis different, and then cause laser processing quality bad
Technical problem.
The present invention is achieved in that a kind of more laser-processing systems, including laser, along the laser emitting light beam
The direction of propagation beam expander, laser mirror, multifocal point generator and the focus lamp that set gradually；
The light beam of the laser emitting enters the beam expander, and after the beam expander expands shaping, then through described
Laser mirror is reflected into the multifocal point generator, and the light beam being emitted from the multifocal point generator is again through the focusing
Mirror is focused on object to be processed, wherein, the multifocal point generator changes the incidence that outgoing beam incides into the focus lamp
Angle.
Further, the laser pulse width of the laser generator transmitting is less than 10 milliseconds, and pulse recurrence frequency exists
Between 1KHZ to 300KHZ.
Further, the multifocal point generator is focus liquid device, for changing the angle of divergence of outgoing beam.
Correspondingly, the present invention also provides a kind of laser processing, comprise the following steps：
The light beam of the laser emitting enters the beam expander；
The beam expander carries out the light beam to expand shaping；
Light beam after the beam expander expands shaping is reflected into the multifocal through the laser mirror again and occurs
Device, the multifocal point generator change the incidence angle for inciding into the focus lamp of outgoing beam；
The light beam being emitted from the multifocal point generator is focused on through the focus lamp on object to be processed again.
Further, the laser pulse width of the laser generator transmitting is less than 10 milliseconds, and pulse recurrence frequency exists
Between 1KHZ to 300KHZ.
Further, the multifocal point generator is focus liquid device, for changing the angle of divergence of outgoing beam.
Beneficial effects of the present invention:Laser-processing system provided by the invention goes out including laser, along the laser
Beam expander, laser mirror, multifocal point generator and the focus lamp that the direction of propagation of irradiating light beam is set gradually, in this way, laser
The light beam of outgoing enters beam expander, and is reflected into multifocal point generator after beam expander expands shaping, then through laser mirror,
Line focus mirror focuses on object to be processed the light beam being emitted from multifocal point generator again, and multifocal point generator can change
Irradiating light beam incides into the incidence angle of the focus lamp, therefore laser beam can generate one section of consecutive variations by multifocal point generator
Focus so that processing is not limited to machining object surface and can reach in machining object, not only promotes processing efficiency, but also improves
Processing quality efficiently solves and existing solves existing laser-processing system due to making a row using diffraction beam splitter
Focus is in
Mandrel line is distributed, incident light beam and nonideal light beam, causes the focus energy being distributed along central axis different,
And then cause the bad technical problem of laser processing quality.
Description of the drawings
Fig. 1 is the fundamental diagram for the laser-processing system that one embodiment of the invention provides.
Fig. 2 is the work flow diagram for the laser processing that one embodiment of the invention provides.
Specific embodiment
In order to which technical problem solved by the invention, technical solution and advantageous effect is more clearly understood, below in conjunction with
Accompanying drawings and embodiments, the present invention will be described in further detail.It should be appreciated that specific embodiment described herein is only used
To explain the present invention, and it is not applied to limit the present invention.
Referring to Fig. 1, Fig. 1 is the fundamental diagram for the laser-processing system that one embodiment of the invention provides.As shown in Figure 1,
The laser-processing system, the beam expander set gradually including laser 10, along the direction of propagation of 10 outgoing beam of laser
20th, laser mirror 30, multifocal point generator 40 and focus lamp 50；
The light beam that the laser 10 is emitted enters the beam expander 20, and after the beam expander 20 expands shaping, then
The multifocal point generator 40 is reflected into through the laser mirror 30, the light beam being emitted from the multifocal point generator 40
It is focused on again through the focus lamp 50 on object to be processed, wherein, the multifocal point generator 40 changes outgoing beam and incides into
The incidence angle of the focus lamp 50.
Further, the laser pulse width that the laser generator 40 emits is less than 10 milliseconds, and pulse recurrence frequency exists
Between 1KHZ to 300KHZ.
Further, the multifocal point generator 40 is focus liquid device, for changing the angle of divergence of outgoing beam.Institute
It states focus liquid device and the voltage in liquid is added to change laser-beam divergence angle by change, wherein, used in focus liquid
Time only needs several milliseconds, is very suitable for rapid processing application.
It should be noted that the laser 10 in this example makes choice according to the material property and processing request of machining object,
The laser 10 can be a point gas laser, solid state laser, semiconductor laser, optical fiber laser, dye laser
And at least one of free electron laser etc..
It should be noted that the beam expander 20 in this example is a kind of common beam converter.Usually there are two types of structures
Expand structure：The structure of falling Kepler and the structure of falling Galileo.The beam expander for the structure of falling Kepler be a small focal length convex lens with
One big focal length convex lens are coaxially in series, and the rear focus of the object focus of small focal length convex lens and big focal length convex lens
It overlaps.
It should be noted that laser 10 in this example is for emitting laser beam, as an example, can generate YAG laser,
Diode laser, excimer laser etc..Laser beam can be picosecond (picosecond) laser beam or femtosecond (femtosecond)
Laser beam.Picosecond laser beam has several picoseconds or more of impulse amplitude, using the processing of picosecond laser Shu Jinhang, with non-thermal response
Photochemical reaction based on, therefore, the characteristic of high-accuracy processing can be carried out by having.Femtosecond laser beam has arteries and veins more than number femtosecond
Rush amplitude, it is exportable to be equivalent to 1012 terawatt (TW)s during amplification, there is the characteristic that can process any material.In addition, femtosecond laser is sharp
With multiphoton -effect, can obtain not gathering even if laser also makes photon energy gather the effect on any on a bit, so energy
Enough carry out high-accuracy processing.
In this example, the light beam of laser emitting enters beam expander, and after beam expander expands shaping, then through laser mirror
Multifocal point generator is reflected into, line focus mirror focuses on object to be processed the light beam being emitted from multifocal point generator again,
And multifocal point generator can change the incidence angle that outgoing beam incides into the focus lamp, therefore laser beam passes through multifocal
Device can generate the focus of one section of consecutive variations so that processing is not limited to machining object surface and can reach in machining object, no
Only promote processing efficiency, and improve processing quality, efficiently solve it is existing solve existing laser-processing system by
In using diffraction beam splitter a row focus being made to be distributed along central axis, incident light beam and nonideal light beam cause in
The focus energy of mandrel line distribution is different, and then causes the bad technical problem of laser processing quality.
Referring to Fig. 2, Fig. 2 be one embodiment of the invention provide laser processing work flow diagram, the Laser Processing
Method includes the following steps：
S201, the light beam of the laser emitting enter the beam expander；
As an alternative embodiment, the laser pulse width of the laser generator transmitting is less than 10 milliseconds, arteries and veins
Repetition rate is rushed between 1KHZ to 300KHZ.
S202, the beam expander carry out the light beam to expand shaping；
As an alternative embodiment, the beam expander is made of convex lens and concavees lens.
S203, the light beam after the beam expander expands shaping are reflected into the multifocal through the laser mirror again
Generator, the multifocal point generator change the incidence angle for inciding into the focus lamp of outgoing beam；
S204, the light beam being emitted from the multifocal point generator are focused on through the focus lamp on object to be processed again.
Multifocal point generator in this example is focus liquid device, for changing the angle of divergence of outgoing beam.The liquid
Zoom lens control device is added to the voltage in liquid to change laser-beam divergence angle by change, wherein, the time used in focus liquid is only
Several milliseconds are needed, is very suitable for rapid processing application.
In this example, the light beam of laser emitting enters beam expander, and after beam expander expands shaping, then through laser mirror
Multifocal point generator is reflected into, line focus mirror focuses on object to be processed the light beam being emitted from multifocal point generator again,
And multifocal point generator can change the incidence angle that outgoing beam incides into the focus lamp, therefore laser beam passes through multifocal
Device can generate the focus of one section of consecutive variations so that processing is not limited to machining object surface and can reach in machining object, no
Processing efficiency is only promoted, and improves processing quality.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should all be included in the protection scope of the present invention.
Claims (6)
1. a kind of laser-processing system, which is characterized in that including laser, along the direction of propagation of the laser emitting light beam according to
Beam expander, laser mirror, multifocal point generator and the focus lamp of secondary setting；
The light beam of the laser emitting enters the beam expander, and after the beam expander expands shaping, then through the laser
Speculum is reflected into the multifocal point generator, and the light beam being emitted from the multifocal point generator gathers again through the focus lamp
Coke on object to be processed, wherein, the multifocal point generator changes the incidence angle that outgoing beam incides into the focus lamp.
2. laser-processing system according to claim 1, which is characterized in that the laser pulse of the laser generator transmitting
Width is less than 10 milliseconds, and pulse recurrence frequency is between 1KHZ to 300KHZ.
3. laser-processing system according to claim 1, which is characterized in that the multifocal point generator fills for focus liquid
It puts, for changing the angle of divergence of outgoing beam.
4. a kind of processing method of laser-processing system according to any one of claims 1 to 3, which is characterized in that including
Following step：
The light beam of the laser emitting enters the beam expander；
The beam expander carries out the light beam to expand shaping；
Light beam after the beam expander expands shaping is reflected into the multifocal point generator, institute through the laser mirror again
State the incidence angle for inciding into the focus lamp that multifocal point generator changes outgoing beam；
The light beam being emitted from the multifocal point generator is focused on through the focus lamp on object to be processed again.
5. processing method according to claim 4, which is characterized in that the laser pulse width of the laser generator transmitting
Less than 10 milliseconds, pulse recurrence frequency is between 1KHZ to 300KHZ.
6. processing method according to claim 4, which is characterized in that the multifocal point generator is focus liquid device,
For changing the angle of divergence of outgoing beam.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611085477.XA CN108115274A (en) | 2016-11-29 | 2016-11-29 | A kind of laser-processing system and method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611085477.XA CN108115274A (en) | 2016-11-29 | 2016-11-29 | A kind of laser-processing system and method |
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| Publication Number | Publication Date |
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| CN108115274A true CN108115274A (en) | 2018-06-05 |
Family
ID=62226551
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| Application Number | Title | Priority Date | Filing Date |
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| CN201611085477.XA Pending CN108115274A (en) | 2016-11-29 | 2016-11-29 | A kind of laser-processing system and method |
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| CN (1) | CN108115274A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449417A (en) * | 2019-09-12 | 2019-11-15 | 南京先进激光技术研究院 | A kind of multifocal laser cleaner and application method |
| CN111822887A (en) * | 2020-07-14 | 2020-10-27 | 深圳中科光子科技有限公司 | Processing system and method for laser drilling thick glass |
| CN114378453A (en) * | 2022-01-20 | 2022-04-22 | 江苏亚威艾欧斯激光科技有限公司 | Processing method, system, equipment and medium of display panel |
| CN115417586A (en) * | 2022-09-15 | 2022-12-02 | 华中科技大学 | Glass laser welding method and device |
| CN116423048A (en) * | 2023-06-09 | 2023-07-14 | 中国船舶集团有限公司第七〇七研究所 | Photoelectric focus control laser welding device |
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| CN104785923A (en) * | 2014-01-22 | 2015-07-22 | 深圳市韵腾激光科技有限公司 | Multi-point focusing laser processing device |
| CN204975704U (en) * | 2015-05-07 | 2016-01-20 | 北京万恒镭特机电设备有限公司 | Laser seal welded device |
| CN206527430U (en) * | 2016-11-29 | 2017-09-29 | 深圳中科光子科技有限公司 | A kind of laser-processing system |
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- 2016-11-29 CN CN201611085477.XA patent/CN108115274A/en active Pending
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| US20060186098A1 (en) * | 2005-02-23 | 2006-08-24 | Caristan Charles L | Method and apparatus for laser processing |
| CN102458322A (en) * | 2009-06-12 | 2012-05-16 | 威孚莱有限公司 | Device for laser-surgical ophthalmology |
| CN104339084A (en) * | 2013-07-29 | 2015-02-11 | Ap系统股份有限公司 | Device for processing brittle substrate using aspherical lens having multi focuses |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110449417A (en) * | 2019-09-12 | 2019-11-15 | 南京先进激光技术研究院 | A kind of multifocal laser cleaner and application method |
| CN110449417B (en) * | 2019-09-12 | 2024-01-19 | 南京先进激光技术研究院 | Multifocal laser belt cleaning device |
| CN111822887A (en) * | 2020-07-14 | 2020-10-27 | 深圳中科光子科技有限公司 | Processing system and method for laser drilling thick glass |
| CN111822887B (en) * | 2020-07-14 | 2022-04-26 | 深圳中科光子科技有限公司 | Processing system and method for laser drilling thick glass |
| CN114378453A (en) * | 2022-01-20 | 2022-04-22 | 江苏亚威艾欧斯激光科技有限公司 | Processing method, system, equipment and medium of display panel |
| CN115417586A (en) * | 2022-09-15 | 2022-12-02 | 华中科技大学 | Glass laser welding method and device |
| CN116423048A (en) * | 2023-06-09 | 2023-07-14 | 中国船舶集团有限公司第七〇七研究所 | Photoelectric focus control laser welding device |
| CN116423048B (en) * | 2023-06-09 | 2023-08-15 | 中国船舶集团有限公司第七〇七研究所 | Photoelectric focus control laser welding device |
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Application publication date: 20180605 |