CN108070213A - A kind of composition epoxy resin and its application - Google Patents
A kind of composition epoxy resin and its application Download PDFInfo
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- CN108070213A CN108070213A CN201611007056.5A CN201611007056A CN108070213A CN 108070213 A CN108070213 A CN 108070213A CN 201611007056 A CN201611007056 A CN 201611007056A CN 108070213 A CN108070213 A CN 108070213A
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
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Abstract
The present invention relates to Chemical composition that fields, disclose a kind of composition epoxy resin and its application, the composition epoxy resin contains the epoxy resin of 8 12 weight %, the phenolic resin of 37 weight %, 79 86 weight % inorganic fillers, the fire retardant of 1 1.5 weight %, the curing accelerator of 0.05 0.1 weight %, the inorganic ion scavenger of 0.4 0.6 weight %, the silane coupling agent of 0.4 0.6 weight %, low stress modified dose of 0.8 1 weight %；Wherein, the epoxy resin is at least one of bisphenol A type epoxy resin, bisphenol f type epoxy resin, linear phenolic epoxy resin, biphenyl type epoxy resin, open chain aliphatic epoxy resin, cycloaliphatic epoxy resin and heterocyclic-type epoxy resin.The composition epoxy resin has higher glass transition temperature (Tg), and reliability is high, and also has preferable mobility and anti-flammability.
Description
Technical field
The present invention relates to Chemical composition that fields, and in particular, to a kind of composition epoxy resin and its application.
Background technology
In recent years, with the development of field of semiconductor devices, high-voltage semi-conductor product is more and more on the market, in addition high
Integrated level, high-density installation etc. are also quickly developing, and semiconductor devices is on the one hand required to improve reliability, another
Aspect requires semiconductor devices stable operation under conditions of more badly, this is to semiconductor sealing material it is also proposed that higher will
It asks, it is desirable that improve the heat resistance of encapsulating material, and ensure original reliability.Because high-voltage semi-conductor power is bigger, normal work
Make fever under state increases much than common semiconductor devices, and semiconductor devices works at higher temperature (180 DEG C), and
High integration and high-density installation allow semiconductor devices not have an extra heat-dissipating space, and temperature mutually adds between semiconductor devices
It holds, semiconductor devices operating temperature generally can reach 180 DEG C.It requires encapsulating material --- epoxy-plastic packaging material is at such a temperature
Energy steady operation requires (glass transition temperature) Tg of epoxy-plastic packaging material to be higher than 180 DEG C.And the ring of current higher reliability
The Tg of oxygen plastic packaging material is substantially below 150 DEG C, it is difficult to meet the requirement of high-voltage semi-conductor device long-term work, cause reliability,
Stability declines or even damage semiconductor devices.
The content of the invention
The defects of the purpose of the present invention is traditional epoxy-plastic packaging material is overcome to be difficult to meet job requirement, provides a kind of epoxy
Resin combination and its application.
To achieve these goals, the present invention provides a kind of composition epoxy resin, wherein, the composition epoxy resin
Epoxy resin containing 8-12 weight %, the phenolic resin of 3-7 weight %, 79-86 weight % inorganic fillers, 1-1.5 weight %
Fire retardant, the curing accelerator of 0.05-0.1 weight %, the inorganic ion scavenger of 0.4-0.6 weight %, 0.4-0.6 weight
The silane coupling agent of amount %, low stress modified dose of 0.8-1 weight %；Wherein, the epoxy resin is bisphenol type epoxy tree
It is fat, bisphenol f type epoxy resin, linear phenolic epoxy resin, biphenyl type epoxy resin, open chain aliphatic epoxy resin, alicyclic
At least one of epoxy resin and heterocyclic-type epoxy resin.
The present invention also provides the composition epoxy resin as semiconductor packages material application.
Composition epoxy resin of the present invention has higher glass transition temperature (Tg >=180 DEG C), as partly leading
During body (high-voltage semi-conductor that especially voltage is more than 600V) device encapsulating material, reliability is high, and ring of the present invention
Epoxy resin composition also has preferable mobility and anti-flammability.
Other features and advantages of the present invention will be described in detail in subsequent specific embodiment part.
Specific embodiment
The specific embodiment of the present invention is described in detail below.It is it should be appreciated that described herein specific
Embodiment is merely to illustrate and explain the present invention, and is not intended to limit the invention.
The endpoint of disclosed scope and any value are not limited to the accurate scope or value herein, these scopes or
Value should be understood to comprising the value close to these scopes or value.For numberical range, between the endpoint value of each scope, respectively
It between the endpoint value of a scope and individual point value and can be individually combined with each other between point value and obtain one or more
New numberical range, these numberical ranges should be considered as specific open herein.
The present invention provides a kind of composition epoxy resin, wherein, the composition epoxy resin contains 8-12 weight %
Epoxy resin, the phenolic resin of 3-7 weight %, 79-86 weight % inorganic fillers, the fire retardant of 1-1.5 weight %, 0.05-
The curing accelerator of 0.1 weight %, the inorganic ion scavenger of 0.4-0.6 weight %, 0.4-0.6 weight %'s is silane coupled
Agent, low stress modified dose of 0.8-1 weight %；Wherein, the epoxy resin is bisphenol A type epoxy resin, bisphenol F type epoxy tree
Fat, linear phenolic epoxy resin, biphenyl type epoxy resin, open chain aliphatic epoxy resin, cycloaliphatic epoxy resin and heterocyclic type
At least one of epoxy resin.
In the present invention, the epoxy resin can effectively improve the heat resistance of the composition epoxy resin, preferably feelings
Under condition, the epoxy resin is at least one in bisphenol A type epoxy resin, cycloaliphatic epoxy resin and heterocyclic-type epoxy resin
Kind.It is further preferred that the epoxy resin is cycloaliphatic epoxy resin.
In the present invention, the phenolic resin can be phenol linear phenolic resin and its derivative, phenyl methylcarbamate novolac
The condensation of resin and its derivative, monohydroxy or dihydroxy naphthlene phenolic resin and its derivative, paraxylene and phenol or naphthols
At least one of copolymer of object and dicyclopentadiene and phenol.It is further preferred that the phenolic resin can be phenol
Linear phenolic resin and its derivative and/or phenyl methylcarbamate linear phenolic resin and its derivative.
In the present invention, the inorganic filler can be powdered quartz powder, preparing spherical SiO 2 powder, aluminium oxide
At least one of powder and alpha-silicon nitride powders are preferably powdered quartz powder, preparing spherical SiO 2 powder and oxidation
At least one of aluminium powder.It is further preferred that the meso-position radius (D50) of the inorganic filler are 10-40 microns, more preferably
15-30 microns.
In the present invention, in order to improve the anti-flammability of the composition epoxy resin, under preferable case, the fire retardant is bromine
For epoxy resin and the mixture of antimony oxide.
In the present invention, the brominated epoxy resin in above-mentioned fire retardant and the content of antimony oxide are not limited particularly
Fixed, under preferable case, the weight ratio of the content of the brominated epoxy resin and the content of the antimony oxide is 8-15：1.
In the present invention, in order to promote the curing performance of the composition epoxy resin, the curing accelerator can be miaow
At least one of azole compounds, tertiary amine compound and organic phosphine compound.
In the present invention, to the specific choice of the imidazolium compounds, the tertiary amine compound and the organic phosphine compound
There is no particular limitation, and under preferable case, the imidazolium compounds can be 2-methylimidazole, 2,4- methylimidazoles, 2- second
At least one of base -4-methylimidazole, 2- phenylimidazoles, 2- phenyl -4-methylimidazole and 2- (heptadecyl) imidazoles；It is described
Tertiary amine compound can be triethylamine benzyl group dimethylamine, Alpha-Methyl benzyl group dimethylamine, 2- (dimethylamino methyl) phenol, 2,4,6-
At least one of three (dimethylamino methyl) phenol and 1,8- diazabicyclos (5,4,0) endecatylene -7；The organic phosphine
Compound can be triphenylphosphine, trimethyl-phosphine, triethyl phosphine, tributylphosphine, three (p-methylphenyl) phosphines and three (nonyl benzenes
At least one of base) phosphine etc..
In the present invention, the inorganic ion scavenger can be the change of hydrated metal oxide, acid metal salt and magnalium
Close at least one of object.
In the present invention, to the specific of the compound of the hydrated metal oxide, the acid metal salt and the magnalium
Selection is not particularly limited, and in the case of preferred, the hydrated metal oxide is Bi2O3·3H2O, the acid metal salt are
Zr(HPO4)2·H2O, the compound of the magnalium is Mg6Al2(CO3)(OH)16·4H2O。
In the present invention, to the selection of the silane coupling agent, there is no particular limitation, described silane coupled under preferable case
Agent is γ-glycidyl propyl ether trimethoxy silane, γ aminopropyltriethoxy silane, γ-mercaptopropyi trimethoxy
At least one of silane and γ-aminopropyltrimethoxysilane are preferably γ-glycidyl propyl ether trimethoxy silane
And/or γ aminopropyltriethoxy silane.
In the present invention, to described low stress modified dose of selection, there is no particular limitation, under preferable case, the low stress
Modifying agent is liquid silicone oil and/or silicone rubber powder, the further preferably mixture of liquid silicone oil and silicone rubber powder.
When being the mixture of liquid silicone oil and silicone rubber powder for described low stress modified dose, under preferable case, described
In low stress modified dose, the weight ratio of the content of the liquid silicone oil and the content of silicone rubber powder is 0.1-10：1.The silicon
The meso-position radius of rubber powder are preferably 0.5-2 microns.
It, can be with according to the application effect of the composition epoxy resin, in the composition epoxy resin in the present invention
Further comprise：The releasing agent of 0.4-0.6 weight % and the colorant of 0.4-0.6 weight %.
In the present invention, to the selection of the releasing agent and colorant, there is no particular limitation, can be that this field is conventional
It selects, under preferable case, the releasing agent is at least one of Brazil wax, synthetic wax and mineral matter wax；The coloring
Agent is carbon black.
The present invention also provides the composition epoxy resin as semiconductor packages material application.The asphalt mixtures modified by epoxy resin
Oil/fat composition have higher glass transition temperature (Tg >=180 DEG C), disclosure satisfy that semiconductor (especially voltage for 600V with
On high-voltage semi-conductor) to the temperature requirement of encapsulating material, when being used as semiconductor sealing material, reliability is high, also have compared with
Good mobility and anti-flammability.
In the present invention, to the preparation method of the composition epoxy resin, there is no particular limitation, conventional using this field
Method prepared, for example, following methods, which may be employed, prepares the composition epoxy resin：By epoxy resin, phenolic aldehyde tree
Fat, inorganic filler, fire retardant, curing accelerator, inorganic ion scavenger, silane coupling agent, low stress modified dose, releasing agent and
Colorant is uniformly mixed, and then mixture is placed in double roll mills, the melting mixing 5- in the case where temperature is 70-100 DEG C
Material after melting mixing is removed natural cooling from double roll mills, crushed, obtains composition epoxy resin by 20min.
When the composition epoxy resin as semiconductor sealing material in application, by the above method prepare composition epoxy resin into
Type is biscuit, that is, obtains the composition epoxy resin moulding material for semiconductor sealing material.
The present invention will be described in detail by way of examples below.In following embodiment,
Gel time：Electric hot plate is heated to 175 ± 1 DEG C by hot plate method, and the powder of 0.3-0.5g moulding material samples is taken to put
On electric hot plate, powder is terminal when gradually becoming colloidal state by fluid, the time required to reading；
Spiral flow length：It is measured on transfer modling press by EMMI-1-66 helical flows metal die, shaping pressure
Power is 70 ± 2Kgf/cm2, mold temperature is 175 ± 2 DEG C, and 20 ± 5g of powder of moulding material sample is taken to be tested；
Tg：Moulding material sample is made under the conditions of 175 DEG C/25MPa the sample block of diameter 3mm, high 6mm, then 175
DEG C/6h under conditions of cured after, tested using the thermomechanical analyzer TMA of U.S. TA, test condition is：Temperature is 20-
300 DEG C, heating rate is 10 DEG C/min；
Anti-flammability：Moulding material sample is made under the conditions of 175 DEG C/25MPa the sample block of 1/16 inch thickness, Ran Hou
After being cured under conditions of 175 DEG C/6h, flame retardant test is carried out according to GB4609-84 by vertical combustion；
Unfailing performance：The semiconductor devices TO-220F of moulding material plastic packaging carbonization silicon chip, electrically qualified 50 are selected
Normal product, under the conditions of 220 DEG C, when baking 500 is small after test electrical property, unqualified quantity with 50 ratio it is smaller, table
Bright unfailing performance is better.
Embodiment 1
By 10 weight % cycloaliphatic epoxy resins (purchased from Japanese Daicel company, trade mark EHPE-3150), 5 weight %
Phenol linear phenolic resin (purchased from Japanese bright and company, trade mark HF-3M), 81 weight % preparing spherical SiO 2 powder (D50=
20 microns), 1 weight % fire retardants (mixture of brominated epoxy resin and antimony oxide, the content and three of brominated epoxy resin
The weight ratio for aoxidizing the content of two antimony is 10：1), 0.05 weight %2- methylimidazoles, 0.45 weight %Bi2O3·3H2O (is purchased from
Japanese TOAGOSEI Co., Ltd, trade mark IXE500), 0.5 weight % γ-glycidyl propyl ether trimethoxy silane, 0.5
Weight % liquid silicone oil, 0.5 weight % silicone rubber powders (D50=1 microns), 0.5 weight % Brazil waxs and 0.5 weight %
Carbon black is uniformly mixed, and then obtained mixture is placed in double roll mills, the melting mixing in the case where temperature is 90 DEG C
Material after melting mixing is removed natural cooling from double roll mills, crushed, obtains composition epoxy resin by 10min.
Composition epoxy resin is pre-formed as biscuit, that is, obtains composition epoxy resin moulding material.To gained epoxy composite
The performance of object moulding material is measured, and the results are shown in Table 1.
Embodiment 2
By 8 weight % heterocyclic-type epoxy resins (purchased from Nissan Chemical company, trade mark TEPIC-S), 3 weight % phenol alkane
Base phenolic resin (purchased from Japanese bright and company, trade mark MEHC-7800SS), 85 weight % alundum (Al2O3) powder (D50=15
Micron), 1.5 weight % fire retardants (mixture of brominated epoxy resin and antimony oxide, the content and three of brominated epoxy resin
The weight ratio for aoxidizing the content of two antimony is 8：1), 0.1 weight % triethylamine benzyl groups dimethylamine, 0.4 weight %Zr (HPO4)2·
H2O, 0.4 weight % γ-glycidyl propyl ether trimethoxy silane, 0.8 weight % liquid silicone oil, 0.4 weight % cohunes
Palmitic acid wax and 0.4 weight % carbon blacks are uniformly mixed, and then obtained mixture is placed in double roll mills, are 100 in temperature
Material after melting mixing is removed natural cooling from double roll mills, crushed, obtains epoxy by melting mixing 5min at DEG C
Resin combination.Composition epoxy resin is pre-formed as biscuit, that is, obtains composition epoxy resin moulding material.To gained ring
The performance of epoxy resin composition moulding material is measured, and the results are shown in Table 1.
Embodiment 3
By 12 weight % bisphenol A type epoxy resins (Hong Chang chemical companies, the trade mark 127), 6 weight % phenol novolac trees
Fat (purchased from Japanese bright and company, trade mark HF-3M), 79 weight % preparing spherical SiO 2s powder (D50=20 microns), 1 weight
Measure % fire retardants (mixture of brominated epoxy resin and antimony oxide, the content of brominated epoxy resin and antimony oxide
The weight ratio of content is 10：1), 0.05 weight %2- methylimidazoles, 0.6 weight %Bi2O3·3H2O (is purchased from Japan TOAGOSEI
Co., Ltd, trade mark IXE500), 0.45 weight % γ-glycidyl propyl ether trimethoxy silane, 0.8 weight % liquid silicons
Oil, 0.5 weight % Brazil waxs and 0.6 weight % carbon blacks are uniformly mixed, and obtained mixture then is placed in double roller cylinder mixes
In mill, the material after melting mixing is removed nature by the melting mixing 15min in the case where temperature is 70 DEG C from double roll mills
Cooling crushes, and obtains composition epoxy resin.Composition epoxy resin is pre-formed as biscuit, that is, obtains epoxy composite
Object moulding material.The performance of gained composition epoxy resin moulding material is measured, the results are shown in Table 1.
Embodiment 4
Method according to embodiment 1 prepares composition epoxy resin, unlike, by cycloaliphatic epoxy resin with identical heavy
The open chain aliphatic epoxy resin (purchased from Nippon Soda CO., company, the trade mark is by PBB-1000) for measuring part replaces.As a result such as
Shown in table 1.
Embodiment 5
Method according to embodiment 1 prepares composition epoxy resin, unlike, by cycloaliphatic epoxy resin A1 with identical
The linear phenolic epoxy resin (purchased from Araldaite, the trade mark is by EPN-1138) of parts by weight replaces.The results are shown in Table 1.
Embodiment 6
Method according to embodiment 1 prepares composition epoxy resin, unlike, the meso-position radius of preparing spherical SiO 2 powder
D50=5 microns.The results are shown in Table 1.
Embodiment 7
Method according to embodiment 1 prepares composition epoxy resin, unlike, the fire retardant in embodiment 1 is used
The P-N based flame retardants (being purchased from Fushimi PharmaceuticalCo., Ltd., trade mark FP-100) of identical weight part replace.Knot
Fruit is as shown in table 1.
Comparative example 1
Method according to embodiment 1 prepares composition epoxy resin, unlike, by cycloaliphatic epoxy resin with identical heavy
The dicyclopentadiene type epoxy resin (purchased from Japan DIC Corporation, the trade mark is by HP-7200) for measuring part replaces.As a result such as
Shown in table 1.
Comparative example 2
Method according to embodiment 1 prepares composition epoxy resin, unlike, it is not added with the cycloaliphatic epoxy resin tree
Fat.The results are shown in Table 1.
Comparative example 3
Method according to embodiment 1 prepares composition epoxy resin, unlike, the dosage of the cycloaliphatic epoxy resin
For 2 weight %.The results are shown in Table 1.
Comparative example 4
Method according to embodiment 1 prepares composition epoxy resin, unlike, the use of the phenol linear phenolic resin
It measures as 1 weight %.The results are shown in Table 1.
Table 1
| Project | Gel time/s | Spiral flow length/cm | Tg/℃ | Anti-flammability | Reliability |
| Embodiment 1 | 22 | 72 | 210 | V-0 | 0/50 |
| Embodiment 2 | 24 | 93 | 208 | V-0 | 0/50 |
| Embodiment 3 | 23 | 95 | 205 | V-0 | 0/50 |
| Embodiment 4 | 22 | 85 | 200 | V-0 | 0/50 |
| Embodiment 5 | 25 | 93 | 202 | V-0 | 0/50 |
| Embodiment 6 | 23 | 86 | 201 | V-0 | 0/50 |
| Embodiment 7 | 25 | 100 | 200 | V-1 | 0/50 |
| Comparative example 1 | 23 | 110 | 135 | V-0 | 50/50 |
| Comparative example 2 | 25 | 100 | 130 | V-0 | 42/50 |
| Comparative example 3 | 25 | 96 | 150 | V-0 | 40/50 |
| Comparative example 4 | 26 | 90 | 155 | V-0 | 41/50 |
Composition epoxy resin of the present invention has higher glass transition temperature it can be seen from the result of embodiment
It spends (Tg), reliability is high, and also has preferable mobility and anti-flammability；By embodiment 1 and the results contrast of comparative example 1-4
As can be seen that the composition epoxy resin of the present invention has higher glass transition temperature (Tg), reliability is high, can meet
Requirement of the semiconductor (especially high-voltage semi-conductor) to encapsulating material temperature in use.
The preferred embodiment of the present invention has been described above in detail, still, during present invention is not limited to the embodiments described above
Detail, within the scope of the technical concept of the present invention, a variety of simple variants can be carried out to technical scheme, this
A little simple variants all belong to the scope of protection of the present invention.
It is further to note that the specific technical features described in the above specific embodiments, in not lance
In the case of shield, can be combined by any suitable means, in order to avoid unnecessary repetition, the present invention to it is various can
The combination of energy no longer separately illustrates.
In addition, various embodiments of the present invention can be combined randomly, as long as it is without prejudice to originally
The thought of invention, it should also be regarded as the disclosure of the present invention.
Claims (11)
1. a kind of composition epoxy resin, which is characterized in that the composition epoxy resin contains the asphalt mixtures modified by epoxy resin of 8-12 weight %
Fat, the phenolic resin of 3-7 weight %, 79-86 weight % inorganic fillers, the fire retardant of 1-1.5 weight %, 0.05-0.1 weight %
Curing accelerator, the inorganic ion scavenger of 0.4-0.6 weight %, the silane coupling agent of 0.4-0.6 weight %, 0.8-1 weight
Measure % low stress modified dose；Wherein, the epoxy resin is bisphenol A type epoxy resin, bisphenol f type epoxy resin, linear phenol
In formaldehyde epoxy resin, biphenyl type epoxy resin, open chain aliphatic epoxy resin, cycloaliphatic epoxy resin and heterocyclic-type epoxy resin
At least one.
2. composition epoxy resin according to claim 1, wherein, the epoxy resin is bisphenol A type epoxy resin, fat
At least one of ring race epoxy resin and heterocyclic-type epoxy resin.
3. composition epoxy resin according to claim 1 or 2, wherein, the phenolic resin is phenol novolac tree
Fat and its derivative, phenyl methylcarbamate linear phenolic resin and its derivative, monohydroxy or dihydroxy naphthlene phenolic resin and its derivative,
At least one of copolymer of condensation product and dicyclopentadiene and phenol of paraxylene and phenol or naphthols.
4. composition epoxy resin according to claim 1 or 2, wherein, the inorganic filler is powdered quartz
At least one of powder, preparing spherical SiO 2 powder, alumina powder and alpha-silicon nitride powders are preferably powdered quartz
At least one of powder, preparing spherical SiO 2 powder and alumina powder；
It is highly preferred that the meso-position radius of the inorganic filler are 10-40 microns, further preferably 15-30 microns.
5. composition epoxy resin according to claim 1 or 2, wherein, the fire retardant is brominated epoxy resin and three
Aoxidize the mixture of two antimony；
Preferably, the weight ratio of the content of the brominated epoxy resin and the content of the antimony oxide is 8-15：1.
6. composition epoxy resin according to claim 1 or 2, wherein, the curing accelerator is imidazolium compounds, uncle
At least one of amine compounds and organic phosphine compound；
Preferably, the imidazolium compounds is 2-methylimidazole, 2,4- methylimidazoles, 2-ethyl-4-methylimidazole, 2- phenyl
At least one of imidazoles, 2- phenyl -4-methylimidazole and 2- (heptadecyl) imidazoles；The tertiary amine compound is triethylamine Bian
Base dimethylamine, Alpha-Methyl benzyl group dimethylamine, 2- (dimethylamino methyl) phenol, (dimethylamino methyl) phenol of 2,4,6- tri- and 1,
At least one of 8- diazabicyclos (5,4,0) endecatylene -7；The organic phosphine compound is triphenylphosphine, trimethyl
At least one of phosphine, triethyl phosphine, tributylphosphine, three (p-methylphenyl) phosphines and three (nonyl phenyl) phosphines.
7. composition epoxy resin according to claim 1 or 2, wherein, the inorganic ion scavenger is hydrated metal
At least one of compound of oxide, acid metal salt and magnalium；
Preferably, the hydrated metal oxide is Bi2O3·3H2O, the acid metal salt are Zr (HPO4)2·H2O, it is described
The compound of magnalium is Mg6Al2(CO3)(OH)16·4H2O。
8. composition epoxy resin according to claim 1 or 2, wherein, the silane coupling agent is γ-glycidyl third
Base ether trimethoxy silane, γ aminopropyltriethoxy silane, γ mercaptopropyitrimethoxy silane and γ-aminopropyl three
At least one of methoxy silane.
9. composition epoxy resin according to claim 1 or 2, wherein, described low stress modified dose for liquid silicone oil and/
Or silicone rubber powder；
Preferably, described low stress modified dose is liquid silicone oil and the mixture of silicone rubber powder；
It is further preferred that in described low stress modified dose, the content of the liquid silicone oil and the content of silicone rubber powder
Weight ratio is 0.1-10：1.
10. composition epoxy resin according to claim 1 or 2, wherein, it is further included in the composition epoxy resin：
The releasing agent of 0.4-0.6 weight % and the colorant of 0.4-0.6 weight %；
Preferably, the releasing agent is at least one of Brazil wax, synthetic wax and mineral matter wax；The colorant is charcoal
It is black.
11. the composition epoxy resin in claim 1-10 described in any one is as semiconductor packages material application.
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| CN109517336A (en) * | 2018-10-31 | 2019-03-26 | 科化新材料泰州有限公司 | A kind of super heat-resisting, high thermal conductivity epoxy-plastic packaging material preparation method of semiconductor-sealing-purpose |
| CN111153631A (en) * | 2020-02-25 | 2020-05-15 | 长兴电子材料（昆山）有限公司 | High-thermal-conductivity and high-reliability epoxy resin composition and application thereof |
| CN111899954A (en) * | 2020-07-28 | 2020-11-06 | 江苏科化新材料科技有限公司 | Thermosetting epoxy resin composition for packaging inductor and preparation method thereof |
| CN112724603A (en) * | 2020-12-29 | 2021-04-30 | 江苏科化新材料科技有限公司 | High-reliability epoxy plastic package material for semiconductor packaging |
| CN113480834A (en) * | 2021-07-22 | 2021-10-08 | 上海道宜半导体材料有限公司 | High-fluidity low-viscosity epoxy resin composition and preparation method thereof |
| CN114276653A (en) * | 2021-12-30 | 2022-04-05 | 江苏科化新材料科技有限公司 | Epoxy resin composition and application thereof, epoxy resin and preparation method thereof |
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| CN111153631A (en) * | 2020-02-25 | 2020-05-15 | 长兴电子材料（昆山）有限公司 | High-thermal-conductivity and high-reliability epoxy resin composition and application thereof |
| CN111899954A (en) * | 2020-07-28 | 2020-11-06 | 江苏科化新材料科技有限公司 | Thermosetting epoxy resin composition for packaging inductor and preparation method thereof |
| CN112724603A (en) * | 2020-12-29 | 2021-04-30 | 江苏科化新材料科技有限公司 | High-reliability epoxy plastic package material for semiconductor packaging |
| CN113480834A (en) * | 2021-07-22 | 2021-10-08 | 上海道宜半导体材料有限公司 | High-fluidity low-viscosity epoxy resin composition and preparation method thereof |
| CN114276653A (en) * | 2021-12-30 | 2022-04-05 | 江苏科化新材料科技有限公司 | Epoxy resin composition and application thereof, epoxy resin and preparation method thereof |
| CN114276653B (en) * | 2021-12-30 | 2024-01-26 | 江苏中科科化新材料股份有限公司 | Epoxy resin composition and application thereof, epoxy resin and preparation method thereof |
| CN115536981A (en) * | 2022-09-01 | 2022-12-30 | 江苏科化新材料科技有限公司 | Epoxy resin material and preparation method thereof |
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