CN108048714A - A kind of electronic product structural component aluminium alloy and preparation method thereof - Google Patents
A kind of electronic product structural component aluminium alloy and preparation method thereof Download PDFInfo
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- CN108048714A CN108048714A CN201711466762.0A CN201711466762A CN108048714A CN 108048714 A CN108048714 A CN 108048714A CN 201711466762 A CN201711466762 A CN 201711466762A CN 108048714 A CN108048714 A CN 108048714A
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- aluminium alloy
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C21/00—Alloys based on aluminium
- C22C21/10—Alloys based on aluminium with zinc as the next major constituent
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- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C1/00—Making non-ferrous alloys
- C22C1/02—Making non-ferrous alloys by melting
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Abstract
The present invention provides a kind of electronic product structural component aluminium alloys, consist of the following compositions：Zn 3 8wt%, Co 1.2 1.8wt%, W 0.2 0.9wt%, Ti 0.8 1.9wt%, Sr 0.3 0.7wt%, Cu 0.4 0.8wt%, Si 1.3 1.8wt%, Ce 0.02 0.08wt%, In 0.05 0.13wt%, surplus Al.Compared with prior art, using Zn, Co, W, Ti, Sr, Cu, Si, Ce, In, Al as raw material, each ingredient interaction influences each other the present invention, improves the intensity of the aluminium alloy of preparation, is suitable as electronic product structural component use.The experimental results showed that the electronic product structural component of the invention prepared is 817MPa, hardness 326HV with the tensile strength of aluminium alloy.
Description
Technical field
The present invention relates to technical field of aluminum alloy technology more particularly to a kind of electronic product structural component aluminium alloy and its preparation sides
Method.
Background technology
Electronics industry is quickly grown, and volume, structure, the weight of electronic product all develop towards small-sized, frivolous direction, from
And the material to manufacturing electronic product proposes new requirement.The structural member of traditional electronic product is broadly divided into from material angle
Two classes, one kind are plastic cement material, and another kind of is metal material.
In the prior art, aluminium alloy and preparation method thereof has obtained extensive report, for example, Application No.
201180026725.2 Chinese patent literature reports a kind of aluminium alloy and aluminium alloy castings, which includes 4-13 weights
The silicon (Si) of %, the copper (Cu) of 1-5 weight %, 26 weight % or higher and the zinc (Zn) less than 40 weight % are measured, surplus is aluminium
(Al) and inevitable impurity.The Chinese patent literature of Application No. 201310179141.X reports a kind of aluminium alloy, by
Following material composition by mass percentage：The magnesium of 5-7%, the silicon of 2-6%, the iron of 3-3.4%, the spheroidal graphite of 2.6-3.6%
Cast iron, the titanium of 0.5-0.8%, the nichrome of 2-9%, remaining is aluminium, and is provided with the section bar of its preparation.Application No.
201110144630.2 Chinese patent literature report a kind of aluminium alloy, contain following component according to mass percent：Silicon：
0.36-0.50%；Magnesium：0.39-0.45%；Titanium：0.01-0.02%；Copper, zinc, the total amount of manganese three are less than or equal to 0.10%；
The content of iron：Less than or equal to 0.50%；Its surplus is aluminium and inevitable impurity, wherein the content of single impurity is less than
0.05%, inevitable impurity adds up to less than or equal to 0.10%.The Chinese patent text of Application No. 201010273402.0
It offers and reports a kind of aluminium alloy panel.It includes two layers of aluminium alloy sheet, and rubber pad is equipped between two layers of aluminium alloy sheet
With heat-insulating and sealing material, the lower section of the aluminium alloy sheet is equipped with rubber pad, and the lower section of the rubber pad is equipped with heat-insulating and sealing material
Material, the lower section of the heat-insulating and sealing material are equipped with aluminium alloy sheet, and the both ends of the aluminium alloy sheet are respectively equipped with groove and card
Mouthful.
But the intensity of the aluminum alloy materials of above-mentioned report is up for further improving.
The content of the invention
Present invention solves the technical problem that it is to provide a kind of electronic product structural component aluminium alloy and preparation method thereof, by force
Degree is high, is suitable as electronic product structural component use.
In view of this, the present invention provides a kind of electronic product structural component aluminium alloy, consist of the following compositions：Zn 3-
8wt%, Co 1.2-1.8wt%, W 0.2-0.9wt%, Ti 0.8-1.9wt%, Sr 0.3-0.7wt%, Cu 0.4-
0.8wt%, Si 1.3-1.8wt%, Ce 0.02-0.08wt%, In 0.05-0.13wt%, surplus Al.
Preferably, Zn 3-6wt%.
Preferably, Co 1.4-1.8wt%.
Preferably, W 0.2-0.7wt%.
Preferably, Ti 0.8-1.2wt%.
Preferably, Sr 0.3-0.5wt%.
Preferably, Cu 0.6-0.8wt%.
Preferably, Si 1.3-1.6wt%.
Preferably, Ce 0.04-0.08wt%.
Preferably, In 0.05-0.11wt%.
The present invention provides a kind of electronic product structural component aluminium alloy, consists of the following compositions：Zn 3-8wt%, Co
1.2-1.8wt%, W 0.2-0.9wt%, Ti 0.8-1.9wt%, Sr 0.3-0.7wt%, Cu 0.4-0.8wt%, Si
1.3-1.8wt%, Ce 0.02-0.08wt%, In 0.05-0.13wt%, surplus Al.Compared with prior art, it is of the invention
Using Zn, Co, W, Ti, Sr, Cu, Si, Ce, In, Al as raw material, each ingredient interaction influences each other, and improves the aluminium of preparation
The intensity of alloy is suitable as electronic product structural component use.The experimental results showed that electronic product structural component prepared by the present invention
It is 817MPa, hardness 326HV with the tensile strength of aluminium alloy.
Specific embodiment
For a further understanding of the present invention, the preferred embodiment of the invention is described with reference to embodiment, still
It should be appreciated that these descriptions are simply for the feature and advantage that further illustrate the present invention rather than to the claims in the present invention
Limitation.
The embodiment of the invention discloses a kind of electronic product structural component aluminium alloys, consist of the following compositions：Zn 3-
8wt%, Co 1.2-1.8wt%, W 0.2-0.9wt%, Ti 0.8-1.9wt%, Sr 0.3-0.7wt%, Cu 0.4-
0.8wt%, Si 1.3-1.8wt%, Ce 0.02-0.08wt%, In 0.05-0.13wt%, surplus Al.
Preferably, Zn 3-6wt%, Co 1.4-1.8wt%, W 0.2-0.7wt%, Ti 0.8-1.2wt%,
Sr 0.3-0.5wt%, Cu 0.6-0.8wt%, Si 1.3-1.6wt%, Ce 0.04-0.08wt%, In 0.05-
0.11wt%.
The present invention provides a kind of electronic product structural component aluminium alloy, consists of the following compositions：Zn 3-8wt%, Co
1.2-1.8wt%, W 0.2-0.9wt%, Ti 0.8-1.9wt%, Sr 0.3-0.7wt%, Cu 0.4-0.8wt%, Si
1.3-1.8wt%, Ce 0.02-0.08wt%, In 0.05-0.13wt%, surplus Al.Compared with prior art, it is of the invention
Using Zn, Co, W, Ti, Sr, Cu, Si, Ce, In, Al as raw material, each ingredient interaction influences each other, and improves the aluminium of preparation
The intensity of alloy is suitable as electronic product structural component use.The experimental results showed that electronic product structural component prepared by the present invention
It is 817MPa, hardness 326HV with the tensile strength of aluminium alloy.
For a further understanding of the present invention, technical solution provided by the invention is carried out specifically with reference to embodiment
Bright, protection scope of the present invention is not limited by the following examples.
The raw material that the embodiment of the present invention uses is purchased in market.
Embodiment 1
The ingredient of electronic product structural component aluminium alloy is as follows：
Zn 3wt%, Co 1.8wt%, W 0.2wt%, Ti 1.9wt%, Sr 0.3wt%, Cu 0.8wt%, Si
1.3wt%, Ce 0.08wt%, In 0.05wt%, surplus Al.
According to the ingredient of aluminium alloy, using high frequency melting furnace, alloying element is melted, is cast with 25 DEG C/sec of cooling velocity
The alloy, injection molding are made, hot extrusion obtains electronic product structural component aluminium alloy.
Electronic product structural component manufactured in the present embodiment is detected with the performance of aluminium alloy, the tensile strength of copper alloy
For 817MPa, hardness 326HV.
Embodiment 2
The ingredient of electronic product structural component aluminium alloy is as follows：
Zn 8wt%, Co 1.2wt%, W 0.9wt%, Ti 0.8wt%, Sr 0.7wt%, Cu 0.4wt%, Si
1.8wt%, Ce 0.02wt%, In 0.13wt%, surplus Al.
According to the ingredient of aluminium alloy, using high frequency melting furnace, alloying element is melted, is cast with 25 DEG C/sec of cooling velocity
The alloy, injection molding are made, hot extrusion obtains electronic product structural component aluminium alloy.
Electronic product structural component manufactured in the present embodiment is detected with the performance of aluminium alloy, the tensile strength of copper alloy
For 815MPa, hardness 322HV.
Embodiment 3
The ingredient of electronic product structural component aluminium alloy is as follows：
Zn 4wt%, Co 1.5wt%, W 0.7wt%, Ti 1.2wt%, Sr 0.5wt%, Cu 0.6wt%, Si
1.4wt%, Ce 0.03wt%, In 0.08wt%, surplus Al.
According to the ingredient of aluminium alloy, using high frequency melting furnace, alloying element is melted, is cast with 25 DEG C/sec of cooling velocity
The alloy, injection molding are made, hot extrusion obtains electronic product structural component aluminium alloy.
Electronic product structural component manufactured in the present embodiment is detected with the performance of aluminium alloy, the tensile strength of copper alloy
For 819MPa, hardness 324HV.
Embodiment 4
The ingredient of electronic product structural component aluminium alloy is as follows：
Zn 6wt%, Co 1.3wt%, W 0.5wt%, Ti 0.9wt%, Sr 0.5wt%, Cu 0.7wt%, Si
1.4wt%, Ce 0.05wt%, In 0.08wt%, surplus Al.
According to the ingredient of aluminium alloy, using high frequency melting furnace, alloying element is melted, is cast with 25 DEG C/sec of cooling velocity
The alloy, injection molding are made, hot extrusion obtains electronic product structural component aluminium alloy.
Electronic product structural component manufactured in the present embodiment is detected with the performance of aluminium alloy, the tensile strength of copper alloy
For 815MPa, hardness 323HV.
Embodiment 5
The ingredient of electronic product structural component aluminium alloy is as follows：
Zn 7wt%, Co 1.7wt%, W 0.3wt%, Ti 1.8wt%, Sr 0.4wt%, Cu 0.5wt%, Si
1.4wt%, Ce 0.07wt%, In 0.06wt%, surplus Al.
According to the ingredient of aluminium alloy, using high frequency melting furnace, alloying element is melted, is cast with 25 DEG C/sec of cooling velocity
The alloy, injection molding are made, hot extrusion obtains electronic product structural component aluminium alloy.
Electronic product structural component manufactured in the present embodiment is detected with the performance of aluminium alloy, the tensile strength of copper alloy
For 818MPa, hardness 323HV.
Embodiment 6
The ingredient of electronic product structural component aluminium alloy is as follows：
Zn 6wt%, Co 1.5wt%, W 0.3wt%, Ti 1.5wt%, Sr 0.4wt%, Cu 0.5wt%, Si
1.6wt%, Ce 0.03wt%, In 0.11wt%, surplus Al.
According to the ingredient of aluminium alloy, using high frequency melting furnace, alloying element is melted, is cast with 25 DEG C/sec of cooling velocity
The alloy, injection molding are made, hot extrusion obtains electronic product structural component aluminium alloy.
Electronic product structural component manufactured in the present embodiment is detected with the performance of aluminium alloy, the tensile strength of copper alloy
For 818MPa, hardness 325HV.
The explanation of above example is only intended to help to understand method and its core concept of the invention.It should be pointed out that pair
For those skilled in the art, without departing from the principle of the present invention, the present invention can also be carried out
Several improvement and modification, these improvement and modification are also fallen into the protection domain of the claims in the present invention.
The foregoing description of the disclosed embodiments enables professional and technical personnel in the field to realize or use the present invention.
A variety of modifications of these embodiments will be apparent for those skilled in the art, it is as defined herein
General Principle can be realized in other embodiments without departing from the spirit or scope of the present invention.Therefore, it is of the invention
The embodiments shown herein is not intended to be limited to, and is to fit to and the principles and novel features disclosed herein phase one
The most wide scope caused.
Claims (10)
1. a kind of electronic product structural component aluminium alloy, which is characterized in that consist of the following compositions：
Zn 3-8wt%, Co 1.2-1.8wt%, W 0.2-0.9wt%, Ti 0.8-1.9wt%, Sr 0.3-0.7wt%, Cu
0.4-0.8wt%, Si 1.3-1.8wt%, Ce 0.02-0.08wt%, In 0.05-0.13wt%, surplus Al.
2. electronic product structural component aluminium alloy according to claim 1, which is characterized in that Zn 3-6wt%.
3. electronic product structural component aluminium alloy according to claim 1, which is characterized in that Co 1.4-1.8wt%.
4. electronic product structural component aluminium alloy according to claim 1, which is characterized in that W 0.2-0.7wt%.
5. electronic product structural component aluminium alloy according to claim 1, which is characterized in that Ti 0.8-1.2wt%.
6. electronic product structural component aluminium alloy according to claim 1, which is characterized in that Sr 0.3-0.5wt%.
7. electronic product structural component aluminium alloy according to claim 1, which is characterized in that Cu 0.6-0.8wt%.
8. electronic product structural component aluminium alloy according to claim 1, which is characterized in that Si 1.3-1.6wt%.
9. electronic product structural component aluminium alloy according to claim 1, which is characterized in that Ce 0.04-0.08wt%.
10. electronic product structural component aluminium alloy according to claim 1, which is characterized in that In 0.05-0.11wt%.
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| CN201711466762.0A CN108048714A (en) | 2017-12-27 | 2017-12-27 | A kind of electronic product structural component aluminium alloy and preparation method thereof |
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| CN201711466762.0A CN108048714A (en) | 2017-12-27 | 2017-12-27 | A kind of electronic product structural component aluminium alloy and preparation method thereof |
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Citations (7)
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|---|---|---|---|---|
| JPH05179384A (en) * | 1991-12-27 | 1993-07-20 | Honda Motor Co Ltd | High strength and high toughness aluminum alloy manufactured by spray deposition method |
| JP2013189671A (en) * | 2012-03-13 | 2013-09-26 | Jfe Steel Corp | HOT-DIP Al-Zn BASED PLATED STEEL SHEET |
| CN106399776A (en) * | 2016-11-11 | 2017-02-15 | 佛山科学技术学院 | 800MPa-level ultrahigh-strength aluminum alloy and preparing method thereof |
| CN106834834A (en) * | 2017-02-27 | 2017-06-13 | 东莞市铝美铝型材有限公司 | A kind of use for electronic products high-strength aluminum alloy and preparation method thereof |
| CN107201468A (en) * | 2017-04-28 | 2017-09-26 | 浙江大侠铝业有限公司 | High-intensity high-tenacity rods and bars of aluminium alloy and its preparation technology |
| CN107312951A (en) * | 2016-04-26 | 2017-11-03 | 天津碧宇舟机械制造有限公司 | A kind of homogenizer highly stressed rotor and preparation method thereof |
| CN107406925A (en) * | 2015-10-30 | 2017-11-28 | 诺维尔里斯公司 | High intensity 7XXX aluminium alloys and its preparation method |
-
2017
- 2017-12-27 CN CN201711466762.0A patent/CN108048714A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05179384A (en) * | 1991-12-27 | 1993-07-20 | Honda Motor Co Ltd | High strength and high toughness aluminum alloy manufactured by spray deposition method |
| JP2013189671A (en) * | 2012-03-13 | 2013-09-26 | Jfe Steel Corp | HOT-DIP Al-Zn BASED PLATED STEEL SHEET |
| CN107406925A (en) * | 2015-10-30 | 2017-11-28 | 诺维尔里斯公司 | High intensity 7XXX aluminium alloys and its preparation method |
| CN107312951A (en) * | 2016-04-26 | 2017-11-03 | 天津碧宇舟机械制造有限公司 | A kind of homogenizer highly stressed rotor and preparation method thereof |
| CN106399776A (en) * | 2016-11-11 | 2017-02-15 | 佛山科学技术学院 | 800MPa-level ultrahigh-strength aluminum alloy and preparing method thereof |
| CN106834834A (en) * | 2017-02-27 | 2017-06-13 | 东莞市铝美铝型材有限公司 | A kind of use for electronic products high-strength aluminum alloy and preparation method thereof |
| CN107201468A (en) * | 2017-04-28 | 2017-09-26 | 浙江大侠铝业有限公司 | High-intensity high-tenacity rods and bars of aluminium alloy and its preparation technology |
Non-Patent Citations (1)
| Title |
|---|
| 王祝堂等: "《轨道车辆用铝材手册》", 30 November 2013 * |
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Application publication date: 20180518 |