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CN108017910A - A kind of matt black polyamide thin film preparation method - Google Patents

A kind of matt black polyamide thin film preparation method Download PDF

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Publication number
CN108017910A
CN108017910A CN201711352525.1A CN201711352525A CN108017910A CN 108017910 A CN108017910 A CN 108017910A CN 201711352525 A CN201711352525 A CN 201711352525A CN 108017910 A CN108017910 A CN 108017910A
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black
polyamic acid
resin solution
acid resin
thin film
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任小龙
韩艳霞
汪英
冯羽风
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Guilin Electrical Equipment Scientific Research Institute Co Ltd
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Guilin Electrical Equipment Scientific Research Institute Co Ltd
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    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
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    • C08G73/10Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
    • C08G73/1067Wholly aromatic polyimides, i.e. having both tetracarboxylic and diamino moieties aromatically bound
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    • C08J2379/04Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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    • C08J2405/00Characterised by the use of polysaccharides or of their derivatives not provided for in groups C08J2401/00 or C08J2403/00
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Abstract

The present invention is a kind of matt black polyamide thin film preparation method, key step:Ith, polyamic acid resin solution is prepared according to a conventional method.IIth, black paste, 2~20wt% that the amount of black pigment is the solid content M in above-mentioned polyamic acid resin solution are prepared.IIIth, black polyamic acid resin solution is prepared, above-mentioned polyamic acid resin solution, black paste blending and stirring, defoam spare.IVth, agglomerator is introduced after the filtered system of black polyamic acid resin solution, resin solution completes reunion processing, then matt black polyamide thin film is routinely made.Also the delustring agent dispersing liquid for 2~20wt% that delustring dosage is M can be added in step III.0.01~0.8 μm of the black pigment average grain diameter of the present invention, and agglomerator is added during polyamic acid resin polycondensation synthesis, gained film light transmittance, glossiness and physico mechanical characteristic have clear improvement.

Description

A kind of matt black polyamide thin film preparation method
Technical field
The present invention relates to Kapton manufacturing technology, is specially a kind of matt black polyamide thin film preparation side Method.
Background technology
Flexible printed wiring board (FPC) is widely used in 3C Product, optical lens module, liquid crystal display (LCD) module And the product such as solar cell, and Kapton, also referred to as PI films (Polyimide Film) are commonly used for its base material or cover Epiphragma material, since traditional Kapton is respectively provided with high surface flatness in application process, film surface reflection is most of Incident ray and produce high gloss.The film surface of high gloss causes vision there are dazzle caused by light reflection or astigmatism It is uncomfortable, easily make asthenopia when watching for a long time.The high gloss for especially having the colors such as black, white, blueness, red gathers Acid imide film, influence of the reflected light that its surface produces to vision are more notable.
On the other hand, when the larger and transparent higher Kapton of surface gloss is applied to FPC, the line of FPC Road design distribution is easy to understand and plagiarized by the same trade.
So the existing market demand possesses the Kapton of the characteristics such as low-luster, low light transmission and high insulation resistance. The high insulation resistance and low light transmission of the black matt polyimide film of low-luster can protect internal circuit design, while can Component facade is set to have more texture and beauty.
The production technology of Kapton is using the polyamic acid resin solution by polycondensation reaction synthesis as original at present Material, salivates on slobbering machine and obtains the polyamic acid thick film with self-supporting, then fixed by heating stretching, imidization, cooling Type handles to obtain Kapton.Obtain having concurrently the Kapton of low-luster, low light transmission and high insulation resistance, Must be added in Kapton preparation process in colour additive (such as:Colorant, dyestuff etc.) and delustering agent.General work Skill is the light transmittance for using colour additive to reduce Kapton, or addition delustering agent causes Kapton table Face forms concave-convex micro-structure to reduce the glossiness of Kapton.
The delustering agent of micron-level particle size is generally used in the prior art, because of the filtration system filter core aperture of existing extrusion die Smaller, delustering agent frequently results in filtration system and blocks during extrusion salivates, and can not realize the serialization film of long period. If the foreign matters such as the impurity that increase filtration system filter core aperture is be easy to cause in resin solution, gel are embedded in film again, cause thin Film surface quality declines.
In black polyamide thin film manufacturing process, when inorganic particle (delustering agent) or carbon powder material (being in colour additive) Particle diameter is too big or too small, and or adding too much or it is too low can be caused for the physical property of Kapton it is undesirable Influence.If the particle diameter of inorganic particle or carbon powder material is larger, manufactured film surface is excessively coarse, is not suitable for electronic product In;If the particle diameter of inorganic particle or carbon powder material is smaller, powder clustering phenomena is easily produced, causes additive in film to disperse Non-uniform problem, and the operation of manufacturing process is difficult to control.It is dispersed in Kapton to influence additive, removes The particle diameter of inorganic particle or carbon powder material, also has the content of inorganic particle or carbon powder material.If in film inorganic particle or The content of carbon powder material is very few, and film glossiness and light transmittance can not just reduce and reach requirement.And content it is larger when, can equally produce Raw additive disperses non-uniform problem;A large amount of addition delustering agents also result in Kapton performance degradation, easy embrittlement, And a large amount of additives easily occur sedimentation and reunite in polyamic acid resin, can also increase the production cost of film.
At present, the main production technology of black matt PI films is divided into two classes:One kind is to add black pigment in PI resins With delustering agent filler, then there is the PI films of low-transmittance and low-luster by chemical imidization or hot imidization, synthesis, This method is easy to operate, and positive effect, but due to the addition of mass filler, significantly reduces the mechanical property of PI films Energy;Another kind of is one layer of PI film containing black pigment and photoextinction of coating on the single or double of PI basement membranes.Although this Kind of method can preferably make Kapton that desirable black effect be presented, and can ensure that polyimide film is certain Mechanical performance, but the black resin being additionally coated with would generally increase manufacturing process and cost, and to Kapton property Adversely affect.In addition, it is easy during hot adverse circumstance also to cause polyimide film to be exposed to because resin coated layer heat resistance is poor Generation performance degradation.Early stage also once attempted to directly prepare the PI films of black low gloss using the large-sized pigment of micron order, But bulky grain pigment easily blocks filtration system, lead to not continuously be film-made, have to abandon attempting.Existing many related manufactures are low The patent application of gloss black Kapton, but because manufacturing process is complicated, production control accuracy requirement is higher and manufactures The defects of of high cost, it is difficult to implement.
Such as Chinese invention patent CN104742461A " the double-deck polyimide films and its system of low-luster of application in 2015 Make method " blending is inserted between levels polyimide film there is black pigment and form recess and hole in the thickness direction of film The polyimide film in hole, obtains having high screening optical activity, the double-deck Kapton of low-luster concurrently.The China of application in 2015 Patent of invention CN 104830058A " polyimide film of low-k and low-luster and preparation method thereof ", film main structure It is monofilm or multilayer for the fluoro containing polymers of polyimides, the carbon black of 0.5wt% to 5wt% and 15wt% to 40wt% Film.Chinese invention patent " delustering agent, the polyimides containing the delustering agent being made of polyimides powder of application in 2012 Film and preparation method thereof " is disclosed the organic matting agent that polyimides powder is formed being uniformly distributed in Kapton and made The Kapton of good film characteristics and low-luster must be had concurrently.The Chinese invention patent CN of application in 2012 103561953A " polyimide film " on the single or double of the polyimide layer (A) containing black organic pigment have comprising Inorganic or organic filler polyimide layer (B), electrical insulating property, the electricity of the film are excellent in reliability.
The content of the invention
The purpose of the present invention is designing a kind of matt black polyamide thin film preparation method, black polyamic acid tree is prepared Lipoprotein solution, without delustering agent, the black polyamic acid resin solution passes through after filtration system in course of conveying, will reunite Agent is introduced in the pipeline of conveying resin, and agglomerator is mixed with black polyamic acid resin solution using pipeline static mixer Uniformly, salivation film forming is finally carried out, preferable Extinction Characteristic is presented in film surface in the black pigment particles of homopolymerization.This law is made Obtaining Kapton product glossiness and light transmittance substantially reduces, and film roll profile pattern increase, appearance substantially improves.
A kind of matt black polyamide thin film preparation method provided by the invention, including following key step:
Ith, the preparation of polyamic acid resin solution
Polyamic acid resin solution is prepared according to a conventional method, and in an inert atmosphere, it is 0 DEG C~50 to control synthetic system temperature Aromatic diamine is added into solvent under conditions of DEG C and be stirred dissolving, after aromatic diamine is completely dissolved, divides 3~8 times and at the uniform velocity add It is (0.9~1.1) to enter with aromatic diamine molar ratio:1 aromatic dianhydride, and stirred with 120r/min~1200r/min, through contracting 3~12h of poly- reaction synthesizes to obtain polyamic acid resin solution.
In view of cost, inert atmosphere is generally realized with nitrogen.
The solvent is aprotic polar solvent low molecular weight Carboxylamide, specially N, N'- dimethylacetylamides (DMAC), N, N'- dimethylformamide (DMF), 1-methyl-2-pyrrolidinone (NMP), dimethyl sulfoxide (DMSO), tetramethyl sulfone, N, N'- dimethyl-N, N'- acrylic urea (DMPU), N, any one in N dialkyl group Carboxylamides or any a variety of combination.
The polyamic acid resin solution that the dosage control of the aromatic diamine, aromatic dianhydride and solvent is formed for this step In the ratio of solid content M be 10wt%~50wt%, be preferably 15wt%~35wt%.
The aromatic diamine is 3,4'- diaminodiphenyl ethers, 1,3- bis--(4- amino-benzene oxygens) benzene, 4,4'- diaminourea two Phenylate (4,4'-ODA), 1,3- diaminobenzenes, 2,2'- bis- (trifluoromethyl) benzidine, 4,4'- benzidines and p-phenylenediamine (p-PDA) any one in or any a variety of combination.
The aromatic dianhydride is Pyromellitic Acid diacid (PMDA), 3,3', and 4,4'- biphenyl four completes acid diacid acid anhydride (BPDA), 2,2', 3,3'- biphenyl four completes acid diacid acid anhydride (BPDA), diphenyl ether tetraformic dicarboxylic anhydride (ODPA), Benzophenone and completes acid two Double (3, the 4- dicarboxylic acids phenyl) hexafluoropropane dianhydrides (6FDA) of acid anhydrides (BTDA), 2,2-, the double phthalic anhydrides of 4,4'- oxygen (ODPA), 3,4,3', 4'- diphenyl thio-ether tetrformate dianhydride (3,4,3', 4'-TDPA), 2,3,2', 3'- diphenyl thio-ether tetrformates It is any one in dianhydride (2,3,2', 3'-TDPA) and 2,3,3', 4'- diphenyl thio-ether tetrformate dianhydride (2,3,3', 4'-TDPA) Kind or any a variety of combination.
IIth, prepared by black paste
Take black pigment to add in solvent to be mixed evenly to obtain black paste;The amount for adding black pigment is step I 2wt%~20wt% of solid content M in the polyamic acid resin solution, 0.01~0.8 μ of black pigment average grain diameter m。
The solvent is aprotic polar solvent low molecular weight Carboxylamide, specially N, N'- dimethylacetylamides (DMAC), N, N'- dimethylformamide (DMF), 1-methyl-2-pyrrolidinone (NMP), dimethyl sulfoxide (DMSO), tetramethyl sulfone, N, N'- dimethyl-N, N'- acrylic urea (DMPU), N, any one in N dialkyl group Carboxylamides or any a variety of combination.
The solvent dosage control of the black paste be black pigment content ratio in black paste be 10wt%~ 30wt%.
The amount for the black pigment that preferred version is added is 6wt%~10wt% of M.
The average grain diameter for the black pigment that preferred version is added for O.02 μm~0.1 μm.If the particle diameter of black pigment compared with It is small, the phenomenon of aggregation is easily produced, causes to disperse non-uniform problem in the film, and is difficult to control in process operations.If The particle diameter of black pigment is larger, and manufactured film surface is excessively coarse, is not suitable in electronic product;If the additive amount mistake of filler Small, then equally suppressing light-proofness effect reduces;If excessive, Kapton physical property is damaged.
The mixing after black pigment is added in the solvent first to mix shear agitation, afterwards high speed dispersion mulser Emulsification pretreatment processing, then handled through high pressure homogenizing, black paste is made.
IIIth, prepared by black polyamic acid resin solution
Black paste blending and stirring obtained by taking polyamic acid resin solution obtained by step I and step II, is made black polyamides Amino acid resin solution, and defoam spare;
IVth, prepared by matt black polyamide thin film
Black polyamic acid resin solution prepared by step III passes through after filtration system in course of conveying, by agglomerator Introduce in the pipeline of conveying resin, pipeline static mixer makes agglomerator be uniformly mixed with black polyamic acid resin solution.
The agglomerator dosage be M 0.2wt%~2wt%, preferred version agglomerator dosage be M 0.3wt%~ 1wt%, is preferably 0.4wt%~0.6wt% that polyimides weight is M.If the additive amount of agglomerator is too small, suppress gloss Spending effect reduces;If excessive, Kapton physical property is damaged.
The agglomerator is inorganic or organic agglomerator, it is mainly realized by charge neutralization, bridging action is added Black pigment is added uniformly to reunite in polyimide matrix.The preferred macromolecule organic flocculating agent carboxymethyl cellulose of agglomerator Sodium (CMC), polyacrylamide (PAM), hydrolysed polyacrylic, Sodium Polyacrylate, calcium polyacrylate (CPA), acrylic acid and methacrylic acid Copolymer, polydimethyl diallyl ammonium chloride, konjak glucomannan (KGM), xanthans (XTG) and sodium alginate (SA) In any one or any a variety of combination.
Self-supporting Polyamic Acid Film is made into slobbering machine in the black polyamic acid resin solution for being mixed into agglomerator, then Through biaxial tension, high temperature imidization and heat treatment, matt black polyamide thin film is obtained.
The step III can also add delustring agent dispersing liquid when preparing black polyamic acid resin solution.The step III is made During standby black polyamic acid resin solution, take polyamic acid resin solution obtained by step I, black paste obtained by step II and disappear Photo etching dispersion liquid blending and stirring, is made black polyamic acid resin solution, and defoams spare.
Preparing for the delustring agent dispersing liquid is as follows:
Cancel after photo etching is added in solvent and be mixed evenly to obtain delustring agent dispersing liquid, the delustring dosage of addition is step 2wt%~20wt% of solid content M in the I polyamic acid resin solution, the delustering agent average grain diameter are 0.01~0.8 μm。
The delustering agent is any one in silica, polyimides, aluminium oxide and titanium dioxide or any a variety of Combination.
The solvent is aprotic polar solvent low molecular weight Carboxylamide, specially N, N'- dimethylacetylamides (DMAC), N, N'- dimethylformamide (DMF), 1-methyl-2-pyrrolidinone (NMP), dimethyl sulfoxide (DMSO), tetramethyl sulfone, N, N'- dimethyl-N, N'- acrylic urea (DMPU), N, any one in N dialkyl group Carboxylamides or any a variety of combination.
The solvent dosage control of the delustring agent dispersing liquid is that the dulling agent content ratio in delustring agent dispersing liquid is 10wt%~30wt%.
Preferred version is 8wt%~12wt% that the amount of the delustering agent added is M.
The delustering agent average grain diameter that preferred version is added for O.05 μm~0.6 μm, the delustering agent preferably added is averaged Particle diameter O.08 μm~0.3 μm.
If the average grain diameter of delustering agent is too small relative to Kapton thickness to be prepared, suppress glossiness effect Reduce;If excessive, can not be sufficiently secured within Kapton.It is same to suppress gloss if the additive amount of filler is too small Spending effect reduces;If excessive, Kapton physical property is damaged.
The mixing added in the solvent after delustering agent is mixing shear agitation to be first, afterwards high speed dispersion mulser Emulsification pretreatment processing, then ground machine milled processed, and further carry out ultrasonic disperse processing and delustring agent dispersing liquid is made.
The step I prepares polyamic acid resin solution, step II prepares black paste and prepares delustring agent dispersing liquid Solvent used is identical.
Compared with prior art, it is the advantages of a kind of matt black polyamide thin film preparation method of the invention:1st, black Polyamic acid resin solution is by after filtration system, with the agglomerator of introducing and being uniformly mixed, by rolling into a ball inside resin solution Poly- agent effect triggers charcoal blacks to be migrated, wriggled and occurred uniformly to assemble, and the homopolymerization black pigment particles formed are thin Preferable Extinction Characteristic is presented in film surface, and the pigment of reunion meets the requirement of film low gloss;Also delustering agent can be added, to improve Extinction effect;At the same time because reunion is carried out after filtration apparatus, therefore traditional filtering precision can be kept, and greatly improve filtering effect Rate, reduces filtration apparatus and replaces number, realize long continuous production;2nd, prepared matt black polyamide thin film can Light light transmittance is seen less than 0.1%, 60 ° of gloss value < 30, elongation > 65%, tensile strength >=230MPa, elasticity modulus > 3GPa, and maintain the insulation characterisitic and mechanical characteristic of Kapton itself;3rd, prepared matt black polyamide Film has shading, photoextinction, and because the introducing of agglomerator enhances the tear resistance of film;4th, this law passes through the group of addition Low gloss performance is realized in poly- agent, and ensures continuous production, and technique is simple, easy to operate.
Embodiment
Embodiment 1
Ith, the preparation of polyamic acid resin solution
In nitrogen atmosphere, synthetic system temperature is controlled as 10 DEG C, to 45kg N, N'- dimethylacetylamides (DMAC) solvent Middle addition 2.39kg aromatic diamines 4,4'- diaminodiphenyl ethers (4,4'-ODA) are stirred dissolving, and 4,4'-ODA are completely dissolved Afterwards, it is 1 to divide 8 at the uniform velocity addition and aromatic diamine molar ratios:1 2.61kg aromatic dianhydride Pyromellitic Acid diacid (PMDA), And stirred with 1200r/min, synthesize to obtain solid content M=5kg through polycondensation reaction 12h, i.e. solid content ratio is the poly- of 10wt% Amic acid resin solution;
IIth, prepared by black paste
The 20wt% of the solid content M in polyamic acid resin solution as obtained by step I takes carbon black 1kg to add solvent N, It is mixed evenly to obtain the black paste of content of carbon black 30% in N'- dimethylacetylamides (DMAC) 2.33kg;This example carbon black 0.01 μm of average grain diameter.
The black pigment of this step can also use black titanium, bone black (bone black), Cyanine Black (cyanine black), second Acetylene black, lampblack, graphite, iron oxide black, nigrosine and Hua Jing it is black in any one or any a variety of combination.
The mixing added in this example N, N'- dimethylacetylamide (DMAC) solvent after black pigment carbon black exists to be first Under the conditions of 120r/min mix shear agitation 30min, after through 3600r/min high speed dispersion mulsers emulsification pretreatment handle 240min, then through the high-pressure homogeneous processing 30min of high pressure homogenizer 180MPa, black paste is made.
IIIth, prepared by black polyamic acid resin solution
Black paste blending and stirring obtained by taking polyamic acid resin solution obtained by step I and step II, is made black polyamides Amino acid resin solution, and defoam spare.
IVth, prepared by matt black polyamide thin film
Black polyamic acid resin solution obtained by step III passes through after filtration system in course of conveying, by step I The 0.2wt% of solid content M in the polyamic acid resin solution of gained takes agglomerator polyacrylamide 0.01kg to introduce conveying tree In the pipeline of fat, pipeline static mixer makes agglomerator be uniformly mixed with black polyamic acid resin solution.Resin enters afterwards Self-supporting Polyamic Acid Film is made in slobbering machine, then through biaxial tension, high temperature imidization and heat treatment, obtains matt black polyamides Imines film.
Embodiment 2
Ith, the preparation of polyamic acid resin solution
In nitrogen atmosphere, to control synthetic system temperature be 22 DEG C, to 37.5kg N, in N'- dialkyl group Carboxylamide solvents Add 6.38kg aromatic diamines 2, double (trifluoromethyl) benzidine of 2'- are stirred dissolving, after it is completely dissolved, divide 3 times it is even It is 0.98 that speed, which is added with aromatic diamine molar ratio,:1 5.99kg aromatic dianhydrides 3,3', 4,4'- biphenyl four completes acid diacid acid anhydride (BPDA), and with 1000r/min stir, synthesize to obtain solid content M=12.40kg through polycondensation reaction 8h, i.e. solid content ratio is The polyamic acid resin solution of 25wt%;
IIth, prepared by black paste
The 16wt% of the solid content M in polyamic acid resin solution as obtained by step I takes iron black 2kg to add solvent N, It is mixed evenly to obtain the black paste of iron black content 10% in N'- dimethyl sulfoxides (DMSO) 18kg;The iron black average grain of this example 0.8 μm of footpath.
The mixing added in this example solvent after black pigment is similar to Example 1.
The 2wt% of the solid content M in polyamic acid resin solution as obtained by step I cancels photo etching silica 0.1kg It is mixed evenly to obtain dioxide-containing silica ratio 20% after adding in solvent N, N'- dimethylacetylamide (DMAC) 0.5kg Delustring agent dispersing liquid, this example silica average grain diameter be 0.8 μm.
The delustering agent of this step can also use any one in polyimides, aluminium oxide and titanium dioxide or any a variety of Combination.
The mixing added in this example solvent N, N'- dimethylacetylamide (DMAC) after delustering agent silica exists to be first Under the conditions of 1200r/min mix shear agitation 30min, after through 1200r/min high speed dispersion mulsers emulsification pretreatment handle 30min, then ground machine milled processed 30min, and further carry out obtained delustering agent after ultrasonic disperse handles 240min and disperse Liquid.
IIIth, prepared by black polyamic acid resin solution
Black paste obtained by polyamic acid resin solution obtained by step I and step II and the blending of delustring agent dispersing liquid is taken to stir Mix, black polyamic acid resin solution is made, and defoam spare.
IVth, prepared by matt black polyamide thin film
After filtration system, the 2wt% of the solid content M in polyamic acid resin solution as obtained by step I takes agglomerator Calcium polyacrylate (CPA) 0.25kg is introduced in the pipeline of conveying resin, and pipeline static mixer makes agglomerator and black polyamic acid resin Solution is uniformly mixed.Remaining processing procedure of this step is same as Example 1.
Embodiment 3
Ith, the preparation of polyamic acid resin solution
In nitrogen atmosphere, synthetic system temperature is controlled to add for 50 DEG C into 25kg 1-methyl-2-pyrrolidinones (NMP) solvent Enter 7.92kg aromatic diamines 3,4'- diaminodiphenyl ethers (3,4'-ODA) are stirred dissolving, after it is completely dissolved, divide 5 times It is 1.02 at the uniform velocity to add with aromatic diamine molar ratio:1 17.23kg aromatic dianhydrides 2, double (3, the 4- dicarboxylic acids phenyl) hexafluoros of 2- Propane dianhydride (6FDA), and stirred with 1000r/min, synthesize to obtain solid content M=25.15kg through polycondensation reaction 8h, i.e., contain admittedly Amount ratio is the polyamic acid resin solution of 50wt%;
IIth, prepared by black paste
The 4wt% of the solid content M in polyamic acid resin solution as obtained by step I takes acetylene black 1kg to add solvent N- It is mixed evenly to obtain the black paste of acetylene black content 15% in methyl pyrrolidone (NMP) 5.6kg;This example acetylene black is put down Equal 0.02 μm of particle diameter.
The mixing added in this example solvent after black pigment is similar to Example 1.
This example also prepares delustring agent dispersing liquid.
The 20wt% of the solid content M in polyamic acid resin solution as obtained by step I cancels photo etching aluminium oxide 2.5kg and adds It is mixed evenly to obtain the delustering agent of alumina content ratio 10% after entering in solvent N-methyl pyrilidone (NMP) 22.5kg Dispersion liquid, this example aluminium oxide average grain diameter are 0.01 μm.
The mixing added in this example solvent after delustering agent is similar to Example 2.
IIIth, prepared by black polyamic acid resin solution
Black paste obtained by polyamic acid resin solution obtained by step I and step II and the blending of delustring agent dispersing liquid is taken to stir Mix, black polyamic acid resin solution is made, and defoam spare.
IVth, prepared by matt black polyamide thin film
After filtration system, the 0.3wt% of the solid content M in polyamic acid resin solution as obtained by step I takes reunion Agent Sodium Polyacrylate 0.08kg is introduced in the pipeline of conveying resin, and pipeline static mixer makes agglomerator and black polyamic acid tree Lipoprotein solution is uniformly mixed.Remaining processing procedure of this step is same as Example 1.
Embodiment 4
Ith, the preparation of polyamic acid resin solution
In argon gas atmosphere, synthetic system temperature is controlled as 0 DEG C, to 42.5kg N, N'- dimethyl-N, N'- acrylic urea (DMPU) 2.22kg aromatic diamines p-phenylenediamine (p-PDA) is added in solvent and is stirred dissolving, after p-PDA is completely dissolved, divide 8 Secondary at the uniform velocity add with aromatic diamine molar ratio is 1.1:1 5.48kg aromatic dianhydrides biphenyl four completes acid diacid acid anhydride (BPDA), and Stirred with 800r/min, synthesize to obtain solid content M=7.70kg through polycondensation reaction 3h, i.e. solid content ratio is the polyamides of 15wt% Amino acid resin solution;
IIth, prepared by black paste
The 6wt% of the solid content M in polyamic acid resin solution as obtained by step I takes the black 0.47kg of titanium to add solvent N, It is mixed evenly to obtain the black paste of the black content 10% of titanium in N'- dialkyl group Carboxylamides 4.23kg;This example titanium is black average 0.1 μm of particle diameter.
The mixing added in this example solvent after black pigment is similar to Example 1.
This example also prepares delustring agent dispersing liquid.
The 5wt% of the solid content M in polyamic acid resin solution as obtained by step I takes TITANIUM DIOXIDE DELUSTRANT 0.39kg It is mixed evenly to obtain disappearing for content of titanium dioxide ratio 12% after adding in solvent N, N'- dialkyl group Carboxylamide 2.86kg Photo etching dispersion liquid, this example titanium dioxide average grain diameter are 0.08 μm.
The mixing added in this example solvent after delustering agent is similar to Example 2.
IIIth, prepared by black polyamic acid resin solution
Black paste obtained by polyamic acid resin solution obtained by step I and step II and the blending of delustring agent dispersing liquid is taken to stir Mix, black polyamic acid resin solution is made, and defoam spare.
IVth, prepared by matt black polyamide thin film
After filtration system, the 1wt% of the solid content M in polyamic acid resin solution as obtained by step I takes agglomerator Konjak glucomannan (KGM) 0.08kg is introduced in the pipeline of conveying resin, and pipeline static mixer makes agglomerator gather with black Amic acid resin solution is uniformly mixed.Remaining processing procedure of this step is same as Example 1.
Embodiment 5
Ith, the preparation of polyamic acid resin solution
In argon gas atmosphere, control synthetic system temperature to be 15 DEG C, to 40kg N, add in N'- Dimethyl Asian Maple (DMSO) solvent Enter 2.49kg aromatic diamines p-phenylenediamine (p-PDA) and be stirred dissolving, after it is completely dissolved, point 4 at the uniform velocity additions and virtue Race's diamines molar ratio is 1:1 7.51kg 3,4,3', 4'- diphenyl thio-ether tetrformates dianhydride (3,4,3', 4'-TDPA), and with 800r/min is stirred, and synthesizes to obtain solid content M=10kg through polycondensation reaction 8h, i.e. solid content ratio is the polyamic acid of 20wt% Resin solution;
IIth, prepared by black paste
The 2wt% of the solid content M in polyamic acid resin solution as obtained by step I takes nigrosine 0.2kg to add solvent In N, N'- dimethyl-N, N'- acrylic urea (DMPU) 0.64kg, it is mixed evenly to obtain the black of nigrosine content 30% Slurry;0.4 μm of this example nigrosine average grain diameter.
The mixing added in this example solvent after black pigment is similar to Example 1.
This example also prepares delustring agent dispersing liquid.
The 12wt% of the solid content M in polyamic acid resin solution as obtained by step I cancels photo etching polyimides 2kg and adds It is mixed evenly to obtain the delustering agent of polyimide content ratio 25% after entering in solvent N-methyl pyrilidone (NMP) 6kg Dispersion liquid, this example polyimides average grain diameter are 0.6 μm.
The mixing added in this example solvent after delustering agent is similar to Example 2.
IIIth, prepared by black polyamic acid resin solution
Black paste obtained by polyamic acid resin solution obtained by step I and step II and the blending of delustring agent dispersing liquid is taken to stir Mix, black polyamic acid resin solution is made, and defoam spare.
IVth, prepared by matt black polyamide thin film
After filtration system, the 0.4wt% of the solid content M in polyamic acid resin solution as obtained by step I takes reunion Agent sodium alginate 0.07kg is introduced in the pipeline of conveying resin, and pipeline static mixer makes agglomerator and black polyamic acid resin Solution is uniformly mixed.Remaining processing procedure of this step is same as Example 1.
Embodiment 6
Ith, the preparation of polyamic acid resin solution
In argon gas atmosphere, synthetic system temperature is controlled as 15 DEG C, to 40kg N, N'- dimethylacetylamides (DMAC) solvent Middle addition 4.79kg aromatic diamines 4,4'- diaminodiphenyl ethers (4,4'-ODA) are stirred dissolving, and 4,4'-ODA are completely dissolved Afterwards, it is 1 to divide 8 at the uniform velocity addition and aromatic diamine molar ratios:1 5.21kg aromatic dianhydride Pyromellitic Acid diacid (PMDA), And stirred with 800r/min, synthesize to obtain solid content M=10kg through polycondensation reaction 12h, i.e. solid content ratio is the poly- of 20wt% Amic acid resin solution;
IIth, prepared by black paste
The 2wt% of the solid content M in polyamic acid resin solution as obtained by step I takes carbon black 0.2kg to add solvent N, It is mixed evenly to obtain the black paste of content of carbon black 30% in N'- dimethylacetylamides (DMAC) 0.64kg;This example carbon black 0.4 μm of average grain diameter.
The mixing added in this example solvent after black pigment is similar to Example 1.
This example also prepares delustring agent dispersing liquid.
The 8wt% of the solid content M in polyamic acid resin solution as obtained by step I takes TITANIUM DIOXIDE DELUSTRANT 0.8kg It is mixed evenly to obtain content of titanium dioxide ratio 30% after adding in solvent N, N'- dimethylformamide (DMF) 1.86kg Delustring agent dispersing liquid, this example titanium dioxide average grain diameter be 0.3 μm.
The mixing added in this example solvent after delustering agent is similar to Example 2.
IIIth, prepared by black polyamic acid resin solution
Black paste obtained by polyamic acid resin solution obtained by step I and step II and the blending of delustring agent dispersing liquid is taken to stir Mix, black polyamic acid resin solution is made, and defoam spare.
IVth, prepared by matt black polyamide thin film
After filtration system, the 0.6wt% of the solid content M in polyamic acid resin solution as obtained by step I takes reunion Agent polydimethyl diallyl ammonium chloride 0.1kg introduce conveying resin pipeline in, pipeline static mixer make agglomerator with it is black Color polyamic acid resin solution is uniformly mixed.Remaining processing procedure of this step is same as Example 1.
Embodiment 7
Ith, the preparation of polyamic acid resin solution
In argon gas atmosphere, synthetic system temperature is controlled as 15 DEG C, to 40kg N, N'- dimethylacetylamides (DMAC) solvent Middle addition 3.31kg aromatic diamines p-phenylenediamine (p-PDA) is stirred dissolving, after 4,4'-ODA are completely dissolved, divides 4 times at the uniform velocity It is 1 to add with aromatic diamine molar ratio:1 6.69kg aromatic dianhydride Pyromellitic Acid diacid (PMDA), and with 800r/min Stirring, synthesizes to obtain solid content M=10kg, i.e. solid content ratio is that the polyamic acid resin of 20wt% is molten through polycondensation reaction 12h Liquid;
IIth, prepared by black paste
The 10wt% of the solid content M in polyamic acid resin solution as obtained by step I takes carbon black 1.0kg to add solvent N, It is mixed evenly to obtain the black paste of content of carbon black 30% in N'- dimethylformamides (DMF) 2.33kg;This example carbon black is put down Equal 0.015 μm of particle diameter.
The mixing added in this example solvent after black pigment is similar to Example 1.
This example also prepares delustring agent dispersing liquid.
The 16wt% of the solid content M in polyamic acid resin solution as obtained by step I cancels photo etching silica 1 .6kg It is mixed evenly to obtain dioxide-containing silica ratio 30% after adding in solvent N, N'- dimethylformamide (DMF) 3.72kg Delustring agent dispersing liquid, silica average grain diameter used in this example be 0.05 μm.
The mixing added in this example solvent after delustering agent is similar to Example 2.
IIIth, prepared by black polyamic acid resin solution
Black paste obtained by polyamic acid resin solution obtained by step I and step II and the blending of delustring agent dispersing liquid is taken to stir Mix, black polyamic acid resin solution is made, and defoam spare.
IVth, prepared by matt black polyamide thin film
After filtration system, the 0.2wt% of the solid content M in polyamic acid resin solution as obtained by step I takes reunion Agent polyacrylamide 0.01kg is introduced in the pipeline of conveying resin, and pipeline static mixer makes agglomerator and black polyamic acid tree Lipoprotein solution is uniformly mixed.Remaining processing procedure of this step is same as Example 1.
Comparative example is 1.
Step I, II and step IV are same as Example 1,
When prepared by step III black polyamic acid resin solution, without agglomerator, polyamic acid resin obtained by step I is only taken Black paste blending and stirring obtained by solution and step II, is made black polyamic acid resin solution, and defoams spare.
Comparative example is 2.
Step I, III and step IV are same as Example 1,
When prepared by step II black paste, 1.8 μm of carbon black average grain diameter, the black pigment more than application claims is averaged grain 0.8 μm of the footpath upper limit.
Other preparation methods are identical with 1 step II of embodiment.
Comparative example is 3.
Step I, III and step IV are same as Example 1,
When prepared by step II black paste, 0.008 μm of carbon black average grain diameter, the black pigment less than application claims is averaged 0.01 μm of particle diameter limit.
Other preparation methods are identical with 1 step II of embodiment.
It is swollen to detect the light transmittance of black polyamide thin film made from the various embodiments described above and each comparative example, glossiness, heat Swollen coefficient (CTE), tensile strength, elongation, modulus, tearing strength and show the performances such as quality, the results are shown in Table 1:
1 embodiment of the present invention of table and the performance table of comparisons of film obtained by comparative example
As shown in table 1, embodiment 1 to 7 prepare matt black polyamide thin film have relatively low glossiness, thoroughly The excellent optical property such as light rate and mechanical property (tensile strength, elongation and modulus are of a relatively high), while also show height Resistance to tearing (tearing strength) and good thermal property (such as CTE, shrinking percentage is relatively low).
Black polyamide thin film without the 1. middle preparation of the comparative example using agglomerator is without desired optical Energy, thermal property and mechanical property.Comparative example 2. and 3. in, the average grain diameter of used black pigment is excessive or too small, system Standby black polyamide thin film optical property, thermal property and mechanical property are substantially poor.
Above-described embodiment, is only further described the purpose of the present invention, technical solution and beneficial effect specific A example, the present invention are not limited to this.All any modifications made within the scope of disclosure of the invention, equivalent substitution, change Into etc., it is all contained within protection scope of the present invention.

Claims (10)

1. a kind of matt black polyamide thin film preparation method, including following key step:
Ith, the preparation of polyamic acid resin solution
In an inert atmosphere, control synthetic system temperature be 0 DEG C~50 DEG C under conditions of into solvent add aromatic diamine carry out Stirring and dissolving, after aromatic diamine is completely dissolved, point 3~8 at the uniform velocity addition and aromatic diamine molar ratios are (0.9~1.1):1 Aromatic dianhydride, and stirred with 120r/min~1200r/min, synthesize to obtain polyamic acid resin through 3~12h of polycondensation reaction molten Liquid;
The solvent is aprotic polar solvent low molecular weight Carboxylamide, specially N, N'- dimethylacetylamides, N, N'- Dimethylformamide, 1-methyl-2-pyrrolidinone, dimethyl sulfoxide, tetramethyl sulfone, N, N'- dimethyl-N, N'- acrylic urea, N, N bis- Any one in alkyl carboxyl acid amides or any a variety of combination;
The dosage control of the aromatic diamine, aromatic dianhydride and solvent is consolidating in finally formed polyamic acid resin solution The ratio of content M is 10wt%~50wt%;
The aromatic diamine is 3,4'- diaminodiphenyl ethers, 1,3- bis--(4- amino-benzene oxygens) benzene, 4,4'- diaminourea hexichol Any one in ether, 1,3- diaminobenzenes, 2,2'- double (trifluoromethyl) benzidine, 4,4'- benzidines and p-phenylenediamine Or any a variety of combination;
The aromatic dianhydride is Pyromellitic Acid diacid, 3,3', and 4,4'- biphenyl four completes acid diacid acid anhydride, 2,2', 3,3'- biphenyl Four, which complete acid diacid acid anhydride, diphenyl ether tetraformic dicarboxylic anhydride, Benzophenone, completes double (the 3,4- dicarboxylic acids phenyl) hexafluoros third of acid diacid acid anhydride, 2,2- Alkane dianhydride, 4,4'- oxygen double phthalic anhydride, 3,4,3', 4' diphenyl thio-ether tetrformates dianhydride, 2,3,2', 3'- diphenyl sulfides four Formic acid dianhydride, 2,3,3', any one in 4'- diphenyl thio-ether tetrformate dianhydrides or any a variety of combination;
IIth, prepared by black paste
Take black pigment to add in solvent to be mixed evenly to obtain black paste;The amount of black pigment is added as described in step I 2wt%~20wt% of solid content M in polyamic acid resin solution, 0.01~0.8 μm of the black pigment average grain diameter;
The solvent is aprotic polar solvent low molecular weight Carboxylamide, specially N, N'- dimethylacetylamides, N, N'- Dimethylformamide, 1-methyl-2-pyrrolidinone, dimethyl sulfoxide, tetramethyl sulfone, N, N'- dimethyl-N, N'- acrylic urea, N, N bis- Any one in alkyl carboxyl acid amides or any a variety of combination;
The solvent dosage control of the black paste is that the black pigment content ratio in black paste is 10wt%~30wt%;
IIIth, prepared by black polyamic acid resin solution
Black paste blending and stirring obtained by taking polyamic acid resin solution obtained by step I and step II, is made black polyamic acid Resin solution, and defoam spare;
IVth, prepared by matt black polyamide thin film
Black polyamic acid resin solution prepared by step III passes through after filtration system in course of conveying, and agglomerator is introduced In the pipeline for conveying resin, pipeline static mixer makes agglomerator be uniformly mixed with black polyamic acid resin solution, the group Poly- agent dosage is 0.2wt%~2wt% of M;
The agglomerator is macromolecule organic flocculating agent sodium carboxymethylcellulose, polyacrylamide, hydrolysed polyacrylic, polypropylene Sour sodium, calcium polyacrylate (CPA), copolymer, polydimethyl diallyl ammonium chloride, the konjac mannan of acrylic acid and methacrylic acid Any one in glycan, xanthans and sodium alginate or any a variety of combination;
Self-supporting Polyamic Acid Film is made into slobbering machine in the black polyamic acid resin solution for being mixed into agglomerator, then through double To stretching, high temperature imidization and heat treatment, matt black polyamide thin film is obtained.
2. matt black polyamide thin film preparation method according to claim 1, it is characterised in that:
The amount that the black pigment that black paste is added is prepared in the step II is 6wt%~10wt% of M.
3. matt black polyamide thin film preparation method according to claim 1, it is characterised in that:
Prepared in the step II black pigment average grain diameter that black paste added for O.02 μm~0.1 μm.
4. matt black polyamide thin film preparation method according to claim 1, it is characterised in that:
0.3wt%~1wt% that the amount that the step III prepares agglomerator used in black polyamic acid resin solution is M.
5. matt black polyamide thin film preparation method according to claim 1, it is characterised in that:
0.4wt%~0.6wt% that the amount that the step III prepares agglomerator used in black polyamic acid resin solution is M.
6. matt black polyamide thin film preparation method according to any one of claim 1 to 5, it is characterised in that:
The step III is additionally added delustring agent dispersing liquid when preparing black polyamic acid resin solution;The step III prepares black During polyamic acid resin solution, polyamic acid resin solution obtained by step I, black paste obtained by step II and delustering agent point are taken Dispersion liquid blending and stirring, is made black polyamic acid resin solution, and defoams spare;
Preparing for the delustring agent dispersing liquid is as follows:
Cancel after photo etching is added in solvent and be mixed evenly to obtain delustring agent dispersing liquid, the delustring dosage of addition is step I institute 2wt%~20wt% of the solid content M in polyamic acid resin solution is stated, the delustering agent average grain diameter is 0.01~0.8 μm;
The delustering agent is any one or any a variety of group in silica, polyimides, aluminium oxide and titanium dioxide Close;
The solvent is aprotic polar solvent low molecular weight Carboxylamide, specially N, N'- dimethylacetylamides, N, N'- Dimethylformamide, 1-methyl-2-pyrrolidinone, dimethyl sulfoxide, tetramethyl sulfone, N, N'- dimethyl-N, N'- acrylic urea, N, N bis- Any one in alkyl carboxyl acid amides or any a variety of combination;
The solvent dosage control of the delustring agent dispersing liquid be dulling agent content ratio in delustring agent dispersing liquid be 10wt%~ 30wt%.
7. matt black polyamide thin film preparation method according to claim 6, it is characterised in that:
The amount for the delustering agent that the delustring agent dispersing liquid adds when preparing is 8wt%~12wt% of M.
8. matt black polyamide thin film preparation method according to claim 6, it is characterised in that:
The delustering agent average grain diameter that the delustring agent dispersing liquid adds when preparing for O.05 μm~0.6 μm.
9. matt black polyamide thin film preparation method according to claim 6, it is characterised in that:
The delustering agent average grain diameter that the delustring agent dispersing liquid adds when preparing O.08 μm~0.3 μm.
10. matt black polyamide thin film preparation method according to claim 6, it is characterised in that:
The step I prepares polyamic acid resin solution, step II prepares black paste and prepares used in delustring agent dispersing liquid Solvent it is identical.
CN201711352525.1A 2017-12-15 2017-12-15 A kind of matt black polyamide thin film preparation method Pending CN108017910A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108341950A (en) * 2018-01-25 2018-07-31 无锡创彩光学材料有限公司 A kind of preparation method of black polyamide thin film

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008052152A (en) * 2006-08-28 2008-03-06 National Institute Of Advanced Industrial & Technology Alignment method for coloring matter
CN101579904A (en) * 2009-06-15 2009-11-18 上海市合成树脂研究所 Preparation method of black matt polyimide film
CN103958616A (en) * 2011-10-05 2014-07-30 索尔维公司 Precipitated calcium carbonate particles and use thereof
CN104419205A (en) * 2013-09-09 2015-03-18 达迈科技股份有限公司 Black polyimide film and processing method thereof
CN104419013A (en) * 2013-08-27 2015-03-18 达迈科技股份有限公司 Colored polyimide film
CN105385159A (en) * 2015-12-25 2016-03-09 桂林电器科学研究院有限公司 Black matte polyimide thin film and preparation method thereof
CN105733001A (en) * 2014-12-10 2016-07-06 天津市嘉诺缘电子科技有限公司 Preparation method of high-performance black full-matte polyimide film
CN106432724A (en) * 2016-10-11 2017-02-22 无锡高拓新材料股份有限公司 Black matte polyimide film and preparation method thereof
US20170121551A1 (en) * 2015-10-30 2017-05-04 Kronos International, Inc. Matting Agent and Method for Obtaining the Same
CN106957445A (en) * 2016-10-19 2017-07-18 达迈科技股份有限公司 Low-gloss polyimide film and method for producing same

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008052152A (en) * 2006-08-28 2008-03-06 National Institute Of Advanced Industrial & Technology Alignment method for coloring matter
CN101579904A (en) * 2009-06-15 2009-11-18 上海市合成树脂研究所 Preparation method of black matt polyimide film
CN103958616A (en) * 2011-10-05 2014-07-30 索尔维公司 Precipitated calcium carbonate particles and use thereof
CN104419013A (en) * 2013-08-27 2015-03-18 达迈科技股份有限公司 Colored polyimide film
CN104419205A (en) * 2013-09-09 2015-03-18 达迈科技股份有限公司 Black polyimide film and processing method thereof
CN105733001A (en) * 2014-12-10 2016-07-06 天津市嘉诺缘电子科技有限公司 Preparation method of high-performance black full-matte polyimide film
US20170121551A1 (en) * 2015-10-30 2017-05-04 Kronos International, Inc. Matting Agent and Method for Obtaining the Same
CN105385159A (en) * 2015-12-25 2016-03-09 桂林电器科学研究院有限公司 Black matte polyimide thin film and preparation method thereof
CN106432724A (en) * 2016-10-11 2017-02-22 无锡高拓新材料股份有限公司 Black matte polyimide film and preparation method thereof
CN106957445A (en) * 2016-10-19 2017-07-18 达迈科技股份有限公司 Low-gloss polyimide film and method for producing same

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
李蔓: "河北磁县北宋墓葬壁画保护与修复浅谈", 《文物保护与考古科学》 *
蒋朝澜: "《磁选理论及工艺》", 30 September 1994, 冶金工业出版社 *

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108341950A (en) * 2018-01-25 2018-07-31 无锡创彩光学材料有限公司 A kind of preparation method of black polyamide thin film

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