CN107966221A - Gas temperature detection device for gas phase reflow soldering - Google Patents
Gas temperature detection device for gas phase reflow soldering Download PDFInfo
- Publication number
- CN107966221A CN107966221A CN201711157924.2A CN201711157924A CN107966221A CN 107966221 A CN107966221 A CN 107966221A CN 201711157924 A CN201711157924 A CN 201711157924A CN 107966221 A CN107966221 A CN 107966221A
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- CN
- China
- Prior art keywords
- gas phase
- gas
- transfer plate
- air
- reflow soldering
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
- G01K13/02—Thermometers specially adapted for specific purposes for measuring temperature of moving fluids or granular materials capable of flow
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention discloses the gas temperature detection device for gas phase reflow soldering,Including transfer plate,Conveyer belt,Delivery roller,Gas phase flows back air-out apparatus and gas phase returned cold but device,The delivery roller is arranged in transfer plate,The gas phase air-out apparatus is arranged on the side of transfer plate,The gas phase reflux cooling device is arranged in parallel in the same side of transfer plate with gas phase air-out apparatus,The gas phase reflux air-out apparatus includes head rod,The head rod includes connection upper arm and connection underarm,The upper end of the connection upper arm is provided with the first air outlet,Temperature monitoring is provided with first air outlet,The temperature monitoring is arranged on the outer end of the first air outlet,Traditional reflow soldering is solved to be limited be subject to operating position and target,The temperature of soldering fluid is not detected when being welded,Cause to be welded when the temperature of soldering fluid is not reaching to standard,So as to lead to not carry out Reflow soldering problems.
Description
Technical field
The present invention relates to a kind of gas phase reflow soldering system, and in particular to the gas temperature for gas phase reflow soldering detects
Device.
Background technology
Reflow welding is also in Reflow Soldering, is appearance with miniaturized electronic product and the welding technique that grows up, mainly
Welding applied to all kinds of surface-assembled components.Reflow Soldering is the effect by thermal current butt welding point, and gelatinous solder flux is certain
High temperature gas flow under carry out physical reactions and reach the welding of SMD reach because to be gas produce high temperature in welding machine internal circulation flow
Welding purpose, so crying " Reflow Soldering ".Solder reflow techniques are widely used in electronic manufacturing field, the various boards used in computer
On element be all to be welded to by this technique on wiring board.The advantage of this technique is that temperature is easily controllable, is welded
Oxidation is also avoided that in journey, manufacture cost is also easier to control.
Traditional reflow soldering is limited be subject to operating position and target, when being welded not to soldering fluid
Temperature is detected, and causes to be welded when the temperature of soldering fluid is not reaching to standard, so as to lead to not carry out Reflow Soldering
Connect.
The content of the invention
Present invention aims at the gas temperature detection device provided for gas phase reflow soldering, traditional Reflow Soldering is solved
The limitation of operating position and target is received, the temperature of soldering fluid is not detected when being welded, is caused
The temperature of soldering fluid is welded when being not reaching to standard, so as to lead to not carry out Reflow soldering problems.
The present invention is achieved through the following technical solutions：
Returned for the gas temperature detection device of gas phase reflow soldering, including transfer plate, conveyer belt, delivery roller, gas phase
But device, the conveyer belt are wrapped in outside transfer plate for outflow device of air and gas phase returned cold, and the delivery roller is arranged on transmission
In plate, the gas phase air-out apparatus is arranged on the side of transfer plate, and the gas phase reflux cooling device is put down with gas phase air-out apparatus
Row is arranged on the same side of transfer plate, and the gas phase reflux air-out apparatus includes head rod, and the head rod includes
Upper arm and connection underarm are connected, the connection upper arm is sleeved in connection underarm, and the upper end of the connection upper arm is provided with first and goes out
Air port, is provided with temperature monitoring on first air outlet, the temperature monitoring is arranged on the outer end of the first air outlet.
The device for needing to weld is placed on transfer plate by the present invention, is had delivery roller to drive conveyer belt to be rotated, is being passed through
When crossing gas phase reflux air-out apparatus, the reflow soldering of soldering fluid is carried out, it is right when by gas phase reflux cooling device
Soldering fluid is cooled down, and completes welding, for soldering fluid in the first air outlet, temperature detector examines the temperature of soldering fluid
Survey, solve traditional reflow soldering and limited be subject to operating position and target, when being welded not to soldering fluid
Temperature is detected, and causes to be welded when the temperature of soldering fluid is not reaching to standard, so as to lead to not carry out Reflow Soldering
Connect problem.
Further, controller is further included, electronic pulley, the electricity are provided between the connection upper arm and connection underarm
Movable pulley connects controller.Electronic pulley is lived by controller control, the flexible of connecting rod is completed, completes lifting.
Further, the gas phase cooling device is to include the second connecting plate and the second gas outlet, second connecting plate
For L-square, one end of the L-square is connected on transfer plate, and second gas outlet is arranged on the other end of L-square, the
Two gas outlet face transfer plates.Second gas outlet is the mouth of cooling high-temperature soldering liquid, and it is convenient which provides for welding.
Further, supporting rack is further included, support frame as described above is arranged on the bottom of transfer plate.The stent is used to support whole
A device so that device is more stablized.
Compared with prior art, the present invention have the following advantages and advantages：
1st, the present invention is used for the gas temperature detection device of gas phase reflow soldering, solves traditional reflow soldering and is subject to work
Position and the limitation of target, are not detected the temperature of soldering fluid when being welded, and cause the temperature in soldering fluid
Degree is welded when being not reaching to standard, so as to lead to not carry out Reflow soldering problems；
2nd, the present invention is used for the gas temperature detection device of gas phase reflow soldering, convenient welding, from the shape of size of devices
The influence of shape；
3rd, the present invention is used for the gas temperature detection device of gas phase reflow soldering, stable structure.
Brief description of the drawings
Attached drawing described herein is used for providing further understanding the embodiment of the present invention, forms one of the application
Point, do not form the restriction to the embodiment of the present invention.In the accompanying drawings：
Fig. 1 is schematic structural view of the invention.
Mark and corresponding parts title in attached drawing：
1- transfer plates, 2- conveyer belts, 3- delivery rollers, 4- gas phases reflux air-out apparatus, 5- gas phases reflux cooling device, 6-
Head rod, the first gas outlets of 7-, the second connecting plates of 8-, the second gas outlets of 9-, 10- supporting racks, 11- connection upper arm, 12- connect
Connect underarm, 13- temperature monitorings.
Embodiment
For the object, technical solutions and advantages of the present invention are more clearly understood, with reference to embodiment and attached drawing, to this
Invention is described in further detail, and exemplary embodiment of the invention and its explanation are only used for explaining the present invention, do not make
For limitation of the invention.
Embodiment
As shown in Figure 1, the present invention is used for the gas temperature detection device of gas phase reflow soldering, including transfer plate 1, conveyer belt
2nd, but device 5, the conveyer belt 1 are wrapped in outside transfer plate 2 for delivery roller 3, gas phase reflux air-out apparatus 4 and gas phase returned cold,
The delivery roller 3 is arranged in transfer plate 1, and the gas phase air-out apparatus 4 is arranged on the side of transfer plate 1, and the gas phase is returned
Flow cooling device 5 is arranged in parallel in the same side of transfer plate 1 with gas phase air-out apparatus 4, and the gas phase reflux air-out apparatus 4 includes
Head rod 6, the head rod 6 include connection upper arm 11 and connection underarm 12, and the connection upper arm 11 is sleeved on connection
In underarm 12, the upper end of the connection upper arm 11 is provided with the first air outlet 7, and temperature prison is provided with first air outlet 7
Survey device 13, the temperature monitoring 13 is arranged on the outer end of the first air outlet 7, further includes controller, the connection upper arm 11 with
Electronic pulley is provided between connection underarm 12, and the electronic pulley connection controller, the gas phase cooling device 5 is to include the
Two connecting plates 8 and the second gas outlet 9, second connecting plate 8 are L-square, and one end of the L-square is connected to transfer plate 1
On, second gas outlet is arranged on the other end of L-square, and 9 face transfer plate 1 of the second gas outlet, further includes supporting rack 10,
Support frame as described above 10 is arranged on the bottom of transfer plate 1.
The device for needing to weld is placed on transfer plate 1 by the present invention, has delivery roller 3 to drive conveyer belt 2 to be rotated,
By gas phase flow back air-out apparatus 3 when, carry out the reflow soldering of soldering fluid, by gas phase returned cold 5 but device when
Wait, soldering fluid is cooled down, for soldering fluid when leaving the first air outlet 7, temperature monitoring 13 carries out the temperature of soldering fluid
Detection, carries out alignment welding to welding position, solves traditional reflow soldering and limited be subject to operating position and target,
The temperature of soldering fluid is not detected when being welded, causes to be welded when the temperature of soldering fluid is not reaching to standard
Connect, so as to lead to not carry out Reflow soldering problems.
Above-described embodiment, has carried out the purpose of the present invention, technical solution and beneficial effect further
Describe in detail, it should be understood that the foregoing is merely the embodiment of the present invention, be not intended to limit the present invention
Protection domain, within the spirit and principles of the invention, any modification, equivalent substitution, improvement and etc. done, should all include
Within protection scope of the present invention.
Claims (4)
1. for gas phase reflow soldering gas temperature detection device, it is characterised in that including transfer plate (1), conveyer belt (2),
But device (5), the conveyer belt (1) are wrapped in transmission for delivery roller (3), gas phase reflux air-out apparatus (4) and gas phase returned cold
Outside, the delivery roller (3) is arranged in transfer plate (1) plate (2), and the gas phase air-out apparatus (4) is arranged on transfer plate (1)
Side, the gas phase reflux cooling device (5) is arranged in parallel in the same side of transfer plate (1) with gas phase air-out apparatus (4), described
Gas phase reflux air-out apparatus (4) includes head rod (6), and the head rod (6) includes connection upper arm (11) and connection
Underarm (12), the connection upper arm (11) are sleeved in connection underarm (12), and the upper end of the connection upper arm (11) is provided with first
Air outlet (7), is provided with temperature monitoring (13) on first air outlet (7), the temperature monitoring (13) is arranged on
The outer end of one air outlet (7).
2. the gas temperature detection device according to claim 1 for gas phase reflow soldering, it is characterised in that further include
Controller, the connection upper arm (11) are provided with electronic pulley with being connected between underarm (12), the electronic pulley connection control
Device.
3. the gas temperature detection device according to claim 1 for gas phase reflow soldering, it is characterised in that the gas
Phase cooling device (5) is to include the second connecting plate (8) and the second gas outlet (9), and second connecting plate (8) is L-square, institute
The one end for stating L-square is connected on transfer plate (1), and second gas outlet is arranged on the other end of L-square, the second gas outlet
(9) face transfer plate (1).
4. the gas temperature detection device according to claim 1 for gas phase reflow soldering, it is characterised in that further include
Supporting rack (10), support frame as described above (10) are arranged on the bottom of transfer plate (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711157924.2A CN107966221A (en) | 2017-11-20 | 2017-11-20 | Gas temperature detection device for gas phase reflow soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711157924.2A CN107966221A (en) | 2017-11-20 | 2017-11-20 | Gas temperature detection device for gas phase reflow soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107966221A true CN107966221A (en) | 2018-04-27 |
Family
ID=62001180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711157924.2A Withdrawn CN107966221A (en) | 2017-11-20 | 2017-11-20 | Gas temperature detection device for gas phase reflow soldering |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107966221A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108775975A (en) * | 2018-07-06 | 2018-11-09 | 珠海格力电器股份有限公司 | Reflow furnace temperature curve intelligent detection system and detection method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2841221Y (en) * | 2005-11-25 | 2006-11-29 | 超越电机股份有限公司 | Cooling apparatus capable of keeping fixed distance with delivering track of soldering machine |
| CN201279641Y (en) * | 2008-09-10 | 2009-07-29 | 熊猫电子集团有限公司 | Reflow soldering furnace for nitrogen protection |
| CN102049587A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for large temperature difference adjustment of reflow soldering machine and temperature control method |
| CN201950324U (en) * | 2010-12-06 | 2011-08-31 | 西安中科麦特电子技术设备有限公司 | Heat energy cyclic utilization reflow welding machine |
| CN103128399A (en) * | 2011-12-04 | 2013-06-05 | 陕西子竹电子有限公司 | Control system for desk type reflow soldering machine |
| CN103648700A (en) * | 2011-09-15 | 2014-03-19 | 富士通通讯网络株式会社 | Device and method for reflow soldering |
| CN205629588U (en) * | 2016-05-12 | 2016-10-12 | 天地融电子（天津）有限公司 | Hot air heating device |
-
2017
- 2017-11-20 CN CN201711157924.2A patent/CN107966221A/en not_active Withdrawn
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2841221Y (en) * | 2005-11-25 | 2006-11-29 | 超越电机股份有限公司 | Cooling apparatus capable of keeping fixed distance with delivering track of soldering machine |
| CN201279641Y (en) * | 2008-09-10 | 2009-07-29 | 熊猫电子集团有限公司 | Reflow soldering furnace for nitrogen protection |
| CN102049587A (en) * | 2009-11-02 | 2011-05-11 | 西安中科麦特电子技术设备有限公司 | Temperature control system for large temperature difference adjustment of reflow soldering machine and temperature control method |
| CN201950324U (en) * | 2010-12-06 | 2011-08-31 | 西安中科麦特电子技术设备有限公司 | Heat energy cyclic utilization reflow welding machine |
| CN103648700A (en) * | 2011-09-15 | 2014-03-19 | 富士通通讯网络株式会社 | Device and method for reflow soldering |
| CN103128399A (en) * | 2011-12-04 | 2013-06-05 | 陕西子竹电子有限公司 | Control system for desk type reflow soldering machine |
| CN205629588U (en) * | 2016-05-12 | 2016-10-12 | 天地融电子（天津）有限公司 | Hot air heating device |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108775975A (en) * | 2018-07-06 | 2018-11-09 | 珠海格力电器股份有限公司 | Reflow furnace temperature curve intelligent detection system and detection method |
| CN108775975B (en) * | 2018-07-06 | 2020-03-10 | 珠海格力电器股份有限公司 | Reflow furnace temperature curve intelligent detection system and detection method |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180427 |