CN107949150A - The production method of printed circuit board and printed circuit board - Google Patents
The production method of printed circuit board and printed circuit board Download PDFInfo
- Publication number
- CN107949150A CN107949150A CN201711174236.7A CN201711174236A CN107949150A CN 107949150 A CN107949150 A CN 107949150A CN 201711174236 A CN201711174236 A CN 201711174236A CN 107949150 A CN107949150 A CN 107949150A
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- China
- Prior art keywords
- daughter board
- subprime
- printed circuit
- insulating medium
- medium layer
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4614—Manufacturing multilayer circuits by laminating two or more circuit boards the electrical connections between the circuit boards being made during lamination
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses the production method of a kind of printed circuit board and printed circuit board, including the first daughter board and the second daughter board being stacked, first daughter board includes first level daughter board and the first solder mask arranged on first level daughter board side, and second daughter board includes second subprime daughter board and is respectively arranged on the second solder mask and the first insulating medium layer of second subprime daughter board opposite sides；Blind hole is equipped with first insulating medium layer with the pad corresponding position of second subprime daughter board, conductive paste is equipped with the blind hole；First daughter board and the second daughter board the stacking pressing is set, and the stitching surface of first daughter board is second side, and the stitching surface of second daughter board is the first insulating medium layer place face, and the pad locations of the second side are corresponding with the position of conductive paste.Complete printed circuit board is split as the present invention the first daughter board and the second daughter board is made respectively, reduces the manufacture difficulty of printed circuit board, improves the uniformity of plating and etching, improves the precision of printed circuit plate hole device to hole.
Description
Technical field
The present invention relates to electronic field, more particularly, to the production method of a kind of printed circuit board and printed circuit board.
Background technology
As end product efficiency constantly progresses greatly, the intelligent device of high-order progressively uses below 28nm advanced process.In response to
Advanced process is from 28nm evolution to below 10nm, wafer foot column pitch also continuous micro.Uncut wafer detection, need to carry print
Circuit board processed is tested.Since silicon wafer process constantly progresses greatly, the closeness of printed circuit board also continuous micro.Wherein, 10nm
Processing procedure wafer, which corresponds to printed circuit board outer layer pad center distance, to be needed to accomplish 55 μm.Since such printed circuit board possesses height
Layer, high-order, it is highly dense, high thick, outer layer pad centre-to-centre spacing is small the features such as, the number of plies and the super common support plate factory ability of thickness of slab, exponent number and
Outer layer makes ability also super common PCB factories ability, therefore, larger for this type printed circuit board manufacture difficulty, makes essence
Degree is not high.
The content of the invention
Based on this, the invention reside in overcoming, thickness of slab ability is exceeded in prior art printed circuit board production process and the number of plies surpasses
Mark, manufacture difficulty is big, makes the defects of precision is not high, there is provided a kind of production method of printed circuit board and printed circuit board.
Its technical solution is as follows：
A kind of printed circuit board, including the first daughter board and the second daughter board being stacked, first daughter board include first
Secondary daughter board and the first solder mask arranged on first level daughter board side, second daughter board include second subprime daughter board and difference
Arranged on the second solder mask and the first insulating medium layer of second subprime daughter board opposite sides；First level daughter board includes first
Side and the second side opposite with first side, are equipped with multiple pads in the first side and second side；Described
Secondary stage daughter board includes the 3rd side and fourth side opposite with the 3rd side, and the 3rd side and the 4th side are equipped with
Multiple pads；First solder mask is arranged on the first side of first level daughter board, and second solder mask is arranged on second subprime
3rd side of daughter board, first insulating medium layer is arranged on the 4th side of second subprime daughter board, and first insulation is situated between
Blind hole is equipped with matter layer with the pad corresponding position of second subprime daughter board, conductive paste is equipped with the blind hole；First daughter board and
The stacking pressing of second daughter board is set, and the stitching surface of first daughter board is second side, and the stitching surface of second daughter board is
Face where first insulating medium layer, and the pad locations of the second side are corresponding with the position of conductive paste.
Complete printed circuit board is split as the technical program the first daughter board and the second daughter board is made respectively, reduces
The manufacture difficulty of printed circuit board, it is high-rise, high it is thick in the case of improve the uniformity of plating and etching, meanwhile, the first son
Plate and the second daughter board are pressed again after making respectively, improve the precision of printed circuit plate hole device to hole.In addition, the technical program
First on the first insulating medium layer after drilling blind hole, then conductive paste is filled in blind hole, can avoid the first insulating medium layer because harmomegathus,
What off normal, blind hole did not drilled through etc. that factor influences printed circuit board opens short circuit problem, improves the stability of printed circuit board and reliable
Property.
In one of the embodiments, the shape of the blind hole is to include the frustum of bigger diameter end and miner diameter end, described blind
The miner diameter end in hole is connected with the pad of the second subprime daughter board, the weldering of the bigger diameter end of the blind hole and first level daughter board
Disk connects.
In one of the embodiments, first level daughter board and second subprime daughter board are multilayer daughter board.
In one of the embodiments, first level daughter board includes multiple copper-clad plates being stacked；And/or second
Secondary daughter board includes multiple copper-clad plates being stacked.
In one of the embodiments, first level daughter board includes core material and the top layer arranged on core material
And/or the single side core plate of bottom, the quantity of the single side core plate is at least one；The second subprime daughter board includes core material
With the top layer arranged on core material and/or the single side core plate of bottom, the quantity of the single side core plate is at least one.
In one of the embodiments, the single side core plate includes the second insulating medium layer and arranged on the second insulating medium layer
The metal conducting layer of side, the second insulating medium layer of the single side core plate are connected with the core material.
In one of the embodiments, the core material is equipped with multiple first conductive holes, is set on the single side core plate
Have and one-to-one second conductive hole of the first conductive hole, and the first conductive hole at same position and the center of circle of the second conductive hole
Overlap.
In one of the embodiments, first insulating medium layer is low fluidity or the not prepreg of fluidity.
The technical program also provides a kind of production method of printed circuit board, including point make respectively first level daughter board and
Second subprime daughter board, and the first solder mask is covered in the first side of first level daughter board, form the first daughter board；In second subprime
3rd side of daughter board covers the second solder mask, and fourth side opposite with the 3rd side covers the on the second subprime daughter board
One insulating medium layer, and the pad corresponding position with second subprime daughter board on first insulating medium layer makes blind hole, in institute
State and conductive paste is filled in blind hole, form the second daughter board；By second side opposite with first side on first level daughter board and
The first insulating medium layer pressing of two daughter boards.
In one of the embodiments, the production method of first level daughter board and/or second subprime daughter board includes：
Windowing is etched on core material, and is drilled in windowing area, plating filling perforation is carried out to drilling, outer circuit figure is etched after the completion of filling perforation
Shape；After the completion of the outer circuit Etching of core material, it is covered each by the top layer and bottom of core material at least one layer of single
Face core plate, is etched every layer of single side core plate windowing, the drilling of windowing area, electroplates filling perforation, outer circuit is etched after the completion of filling perforation
Figure；The bore position of the single side core plate is corresponding with the bore position of core material.
Brief description of the drawings
Fig. 1 is the structure diagram of the printed circuit board of the present invention；
Fig. 2 is the structure diagram of first level daughter board/second subprime daughter board of the present invention；
Fig. 3 is the structure diagram of the first daughter board of the invention；
Fig. 4 is the structure diagram of the second daughter board of the invention；
Fig. 5 is the production process figure of first level daughter board/second subprime daughter board of the invention；
Fig. 6 is the structure diagram of single side core plate of the present invention.
Description of reference numerals：
100th, the first daughter board；10th, first level daughter board；13rd, pad；14th, core material；141st, the second insulating medium layer；
142nd, metal conducting layer；143rd, the first conductive hole；15th, single side core plate；151st, the second conductive hole；200th, the second daughter board；20th, second
Secondary daughter board；30th, the first solder mask；40th, the second solder mask；50th, the first insulating medium layer；51st, blind hole；511st, bigger diameter end；
512nd, miner diameter end；60th, conductive paste.
Embodiment
For the objects, technical solutions and advantages of the present invention are more clearly understood, below in conjunction with attached drawing and specific embodiment party
Formula, is described in further detail the present invention.It should be appreciated that the specific embodiments described herein are only solving
The present invention is released, does not limit protection scope of the present invention.
A kind of printed circuit board as shown in Figures 1 to 4, including the first daughter board 100 being stacked and the second daughter board
200, first daughter board 100 includes first level daughter board 10 and the first solder mask 30 arranged on first level daughter board side, institute
Stating the second daughter board 200 includes second subprime daughter board 20 and the second solder mask 40 arranged on 20 opposite sides of second subprime daughter board and the
One insulating medium layer 50；First level daughter board 10 includes first side and the second side opposite with first side, described
Multiple pads 13 are equipped with first side and second side；The second subprime daughter board 20 include the 3rd side and with the 3rd side
The 4th opposite side of face, the 3rd side and the 4th side are equipped with multiple pads 13；First solder mask 30 is arranged on
The first side of first level daughter board 10, second solder mask 40 are arranged on the 3rd side of the second subprime daughter board 20
Face, first insulating medium layer 50 are arranged on the 4th side of the second subprime daughter board 20, and first insulating medium layer
Blind hole 51 is equipped with 50 with 13 corresponding position of pad of second subprime daughter board 20, conductive paste 60 is equipped with the blind hole 51；Specifically,
The blind hole 51 does not drill through the hole of the pad 13 of second subprime daughter board 20 to drill through the first insulating medium layer 50, i.e., described blind
The bottom in hole 51 is connected with the pad 13 of second subprime daughter board 20.The first daughter board 100 equipped with the first solder mask 30 and equipped with
The stacking pressing of second daughter board 200 of one insulating medium layer 50 and the second solder mask 40 is set, the stitching surface of first daughter board 100
For second side, the stitching surface of second daughter board 20 is 50 place face of the first insulating medium layer, i.e. the second side and the
4 first insulating medium layers 50 are pressed, and 13 position of pad of the second side is corresponding with the position of conductive paste 60,
Interconnected so as to fulfill the hole of first level daughter board 10 and second subprime daughter board 20, complete the first daughter board 100 and the second daughter board 200
Electrical connection.First solder mask, 30 and second solder mask 40 avoids the pad in exposed first side and the 3rd side
13 occur short circuit.
Complete printed circuit board is split as present embodiment the first daughter board 100 and the second daughter board 200 is made respectively
Make, reduce the manufacture difficulty of printed circuit board, the uniformity of plating and etching is improved in the case of high-rise, high thickness, meanwhile,
First daughter board 100 and the second daughter board 200 are pressed again after making respectively, improve the precision of printed circuit plate hole device to hole.Separately
Outside, present embodiment is first on the first insulating medium layer 50 after drilling blind hole 51, then conductive paste 60 is filled in blind hole 51, rather than
First the first insulating medium layer 50 of hollow out relevant position is laggard again after printing conductive paste on the pad 13 of second subprime daughter board 20
Row pressing, can avoid the first insulating medium layer 50 from influencing opening for printed circuit board because harmomegathus, off normal, blind hole 51 such as do not drill through at the factor
Short circuit problem, improves the stability and reliability of printed circuit board.Also, the conductive paste 60 of present embodiment directly with pad 13
Connection, contact area is big, good reliability, avoids conductive paste 60 and is connected with hole, and contact area is small, and influence printed circuit board can
By property.
As shown in figure 4, the shape of the blind hole 51 is to include the frustum of bigger diameter end 511 and miner diameter end 512, the blind hole
51 miner diameter end 512 is connected with the pad 13 of the second subprime daughter board 20, the bigger diameter end 511 of the blind hole 51 and described first
The pad 13 of secondary daughter board 10 connects.Since the blind hole 51 is arranged to up big and down small frustum, filled in when to blind hole 51
When entering conductive paste 60, the bottom of blind hole 51, i.e., the conductive paste 60 at miner diameter end 512 is more closely knit full, and 51 bottom of blind hole will not
Produce conductive paste 60 fill less than dead angle, improve conductive paste 60 conductive reliability.Conductive paste 60 is described in present embodiment
The metal alloys such as copper and tin bismuth.
Due to present embodiment solve be that the number of plies is exceeded or thickness of slab is exceeded the problem of, first level daughter board 10
It is multilayer daughter board with second subprime daughter board 20, the number of plies and thickness of first level daughter board 10 and second subprime daughter board 20 can bases
It is actually needed customization.
First level daughter board 10 includes multiple copper-clad plates being stacked, and the copper-clad plate can be core material 14,
Or single side core plate 15, or the combination of core material 14 and single side core plate 15；Similarly, the second subprime daughter board 20 includes
Multiple copper-clad plates being stacked.
As shown in Fig. 3 combinations Fig. 5, Fig. 6, first level daughter board 10 includes core material 14 and sets described in present embodiment
In the top layer of core material 14 and/or the single side core plate 15 of bottom, the quantity of the single side core plate 15 is at least one；Specifically
Ground, the quantity of the single side core plate 15 of first level daughter board 10 of present embodiment is two, and two single side core plates 15 are set respectively
In the top layer and bottom of core material 14, i.e., described core material 14 is located between two single side core plates 15, and described
Conductive hole on core material 14 is corresponding with the conductive hole of the single side core plate 15 and interconnects.Similarly, described second
Level daughter board 20 includes core material 14 and top layer and/or the single side core plate 15 of bottom arranged on core material 14, the single side core
The quantity of plate 15 is at least one, and the quantity of the single side core plate 15 of the second subprime daughter board 20 of present embodiment is two, and two
A single side core plate 15 is respectively arranged on the top layer and bottom of core material 14.
The single side core plate 15 of present embodiment is that state is not fully cured when being covered in core material 14 and pushing up bottom；Specifically
The second insulating medium layer 141 not being fully cured, is first covered each by the top bottom of the core material 14, then at every layer by ground
One layer of metal conducting layer 142 of Surface mulch of second insulating medium layer 141 is cured, and the metal conducting layer 142 is
Copper foil layer.
The core material 14 is equipped with multiple first conductive holes 143, and the single side core plate 15 is equipped with and the first conduction
One-to-one second conductive hole 151 in hole 143, and the first conductive hole 143 at same position and the center of circle of the second conductive hole 151
Overlap, ensure that the electric property conducting of core material 14 and single side core plate 15 is good.
Specifically, the core material 14 is two-sided core plate, and the core material 14 includes the second insulating medium layer 141
With the metal conducting layer 142 arranged on the second insulating medium layer two relative side；Drilling formation first is carried out to core material 14 to lead
Electric hole 143, and etched circuit figure, and the core material 14 is equipped with pad 13 at bore position, the pad 13 then fills
The metal conducting layer of core material 14 after etching.The single side core plate 15 includes 141 layers of the second dielectric and arranged on the
The metal conducting layer 142 of two insulating medium layers, 141 side, and drill to single side core plate 15, the second conductive hole 151 is formed,
And etched circuit figure, the single side core plate 15 also is provided with pad 13 at bore position, after the pad 13 then serves as etching
Core material 14 metal conducting layer.Second insulating medium layer 141 of two single side core plates 15 respectively with the internal layer
The side that corresponding two of core plate 14 are equipped with pad 13 connects, and the pad one of the pad of core material 14 and single side core plate 15
One corresponds to.
First insulating medium layer 50 described in present embodiment uses low fluidity or the not prepreg of fluidity.Due to
The original state that first insulating medium layer 50 is covered in second subprime daughter board 20 is the state of not yet completion of cure, when exhausted to first
Blind hole 51 on edge dielectric layer 50 fills conductive paste 60, and with after first pressing of level daughter board 10, being just cured；This embodiment party
In formula, the filling of conductive paste 60 is finished when not pressed also, and 50 curing degree of the first insulating medium layer is 20%；Therefore,
The fluidity of first insulating medium layer 50 cannot be excessive, using low fluidity or the not prepreg of fluidity, avoids institute
The first insulating medium layer 50 is stated to shift when clogging conductive paste 60 or pressing, and the second insulating medium layer 141 is then to flowing
Property has no special requirements.
Present embodiment also provides a kind of production method of printed circuit board, including：First level daughter board 10 is made respectively
With second subprime daughter board 20, and the first solder mask 30 is covered in the first side of first level daughter board 10, form the first daughter board
100；Cover the second solder mask 40 in the 3rd side of second subprime daughter board 20, on the second subprime daughter board 20 with the 3rd side
The 4th opposite side covers the first insulating medium layer 50, and on first insulating medium layer 50 with second subprime daughter board 20
13 corresponding position of pad make blind hole 51, fill in conductive paste 60 in the blind hole 51, form the second daughter board 200；Will be for the first time
First insulating medium layer 50 of the second side opposite with first side and the second daughter board 200 presses on level daughter board 10.This implementation
Mode is first on the first insulating medium layer 50 after drilling blind hole 51, then conductive paste 60 is filled in blind hole 51, rather than first second
Pressed again after the first insulating medium layer 50 of hollow out relevant position after conductive paste is printed on the pad 13 of secondary daughter board 20, can
The first insulating medium layer 50 is avoided because what harmomegathus, off normal, blind hole 51 did not drilled through etc. that factor influences printed circuit board opens short circuit problem,
Improve the stability and reliability of printed circuit board.Also, the conductive paste 60 of present embodiment is directly connected with pad 13, contact
Area is big, good reliability, avoids conductive paste 60 and is connected with hole, and contact area is small, influences the reliability of printed circuit board.
As shown in Figure 5 and Figure 6, the production method of first level daughter board 10 and/or second subprime daughter board 20 includes：
S1, choose core material 14 and outer layer core plate 15 respectively；
S2, etch windowing on core material 14；
S3, core material 14 windowing area drill, formed the first conductive hole 143；
S4, the drilling to core material 14 carry out plating filling perforation, and outer circuit figure is etched after the completion of filling perforation；
S5, core material 14 outer circuit Etching after the completion of, covered respectively in the top layer and bottom of core material 14
At least one layer of single side core plate 15 of lid；First the second insulating medium layer 141 not being fully cured is covered each by the core material
14 top bottom, then cured in one layer of metal conducting layer 142 of Surface mulch of every layer of second insulating medium layer 141,
The metal conducting layer 142 is copper foil layer；Windowing is etched after the completion of curing to every layer of single side core plate 15, windowing area drills,
The second conductive hole 151 is formed, electroplates filling perforation, outer circuit figure is etched after the completion of filling perforation；The drilling position of the single side core plate 15
Put corresponding with the bore position of core material 14.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
Apply all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, the scope that this specification is recorded all is considered to be.
Embodiment described above only expresses the several embodiments of the present invention, its description is more specific and detailed, but simultaneously
Cannot therefore it be construed as limiting the scope of the patent.It should be pointed out that come for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of printed circuit board, it is characterised in that including the first daughter board and the second daughter board being stacked, first daughter board
Including first level daughter board and the first solder mask arranged on first level daughter board side, second daughter board includes second subprime
Plate and the second solder mask and the first insulating medium layer for being respectively arranged on second subprime daughter board opposite sides；First level daughter board
Including first side and the second side opposite with first side, multiple welderings are equipped with the first side and second side
Disk；The second subprime daughter board includes the 3rd side and fourth side opposite with the 3rd side, the 3rd side and the 4th
Side is equipped with multiple pads；First solder mask is arranged on the first side of first level daughter board, and second solder mask is set
In the 3rd side of second subprime daughter board, first insulating medium layer is arranged on the 4th side of second subprime daughter board, and described
Blind hole is equipped with first insulating medium layer with the pad corresponding position of second subprime daughter board, conductive paste is equipped with the blind hole；It is described
First daughter board and the stacking pressing of the second daughter board are set, and the stitching surface of first daughter board is second side, second daughter board
Stitching surface face where the first insulating medium layer, and the pad locations of the second side are corresponding with the position of conductive paste.
2. printed circuit board according to claim 1, it is characterised in that the shape of the blind hole is to include bigger diameter end and small
The frustum at footpath end, the miner diameter end of the blind hole are connected with the pad of the second subprime daughter board, the bigger diameter end of the blind hole with
The pad connection of first level daughter board.
3. printed circuit board according to claim 1, it is characterised in that first level daughter board and second subprime daughter board
It is multilayer daughter board.
4. printed circuit board according to claim 3, it is characterised in that first level daughter board includes multiple stackings and set
The copper-clad plate put；And/or the second subprime daughter board includes multiple copper-clad plates being stacked.
5. printed circuit board according to claim 3, it is characterised in that first level daughter board include core material and
Arranged on the top layer of core material and/or the single side core plate of bottom, the quantity of the single side core plate is at least one；Described second
Level daughter board includes core material and top layer and/or the single side core plate of bottom arranged on core material, the quantity of the single side core plate
To be at least one.
6. printed circuit board according to claim 3, it is characterised in that the single side core plate includes the second insulating medium layer
With the metal conducting layer arranged on the second insulating medium layer side, the second insulating medium layer of the single side core plate and the internal layer core
Plate connects.
7. printed circuit board according to claim 3, it is characterised in that it is conductive that the core material is equipped with multiple first
Hole, the single side core plate be equipped with one-to-one second conductive hole of the first conductive hole, and first at same position is conductive
Hole is overlapped with the center of circle of the second conductive hole.
8. according to right 1-7 any one of them printed circuit boards, it is characterised in that first insulating medium layer is low flowing
Degree or the not prepreg of fluidity.
A kind of 9. production method of printed circuit board, it is characterised in that first level daughter board and second subprime daughter board are made respectively,
And the first solder mask is covered in the first side of first level daughter board, form the first daughter board；In the 3rd side of second subprime daughter board
Face covers the second solder mask, covering the first dielectric in fourth side opposite with the 3rd side on the second subprime daughter board
Layer, and the pad corresponding position with second subprime daughter board on first insulating medium layer makes blind hole, is filled in the blind hole
Enter conductive paste, form the second daughter board；By the of second side and the second daughter board opposite with first side on first level daughter board
One insulating medium layer presses.
10. the production method of printed circuit board according to claim 9, it is characterised in that first level daughter board and/
Or the production method of second subprime daughter board includes：Windowing is etched on core material, and is drilled in windowing area, electricity is carried out to drilling
Filling perforation is plated, outer circuit figure is etched after the completion of filling perforation；After the completion of the outer circuit Etching of core material, in core material
Top layer and bottom be covered each by least one layer of single side core plate, be etched windowing to every layer of single side core plate, the drilling of windowing area, electricity
Filling perforation is plated, outer circuit figure is etched after the completion of filling perforation；The bore position of the single side core plate and the bore position of core material
It is corresponding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201711174236.7A CN107949150A (en) | 2017-11-22 | 2017-11-22 | The production method of printed circuit board and printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711174236.7A CN107949150A (en) | 2017-11-22 | 2017-11-22 | The production method of printed circuit board and printed circuit board |
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| CN107949150A true CN107949150A (en) | 2018-04-20 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112930029A (en) * | 2021-02-03 | 2021-06-08 | 珠海杰赛科技有限公司 | PCB and processing method of PCB pilot hole |
| CN112996234A (en) * | 2021-04-23 | 2021-06-18 | 四川超声印制板有限公司 | Circuit board and circuit board copper foil pasting device |
| CN113194635A (en) * | 2021-03-15 | 2021-07-30 | 江西宇睿电子科技有限公司 | Impedance line manufacturing method, impedance line and circuit board |
| WO2023087495A1 (en) * | 2021-11-19 | 2023-05-25 | 深南电路股份有限公司 | Circuit board preparation method and circuit board |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1926931A (en) * | 2004-03-03 | 2007-03-07 | 三洋电机株式会社 | Multilayer board manufacturing method |
| CN103068186A (en) * | 2012-12-20 | 2013-04-24 | 深圳市中兴新宇软电路有限公司 | Manufacture method of flexible printed circuit board blind hole |
| CN103228103A (en) * | 2012-01-27 | 2013-07-31 | 京瓷Slc技术株式会社 | Wiring board and mounting structure using the same |
| CN203313514U (en) * | 2013-02-20 | 2013-11-27 | 欣兴电子股份有限公司 | multilayer circuit board |
| CN103582295A (en) * | 2012-08-10 | 2014-02-12 | 揖斐电株式会社 | Wiring board and method for manufacturing wiring board |
| CN107155266A (en) * | 2017-06-20 | 2017-09-12 | 广州兴森快捷电路科技有限公司 | Z-direction interconnection line plate and preparation method thereof |
| CN107257603A (en) * | 2017-06-20 | 2017-10-17 | 广州兴森快捷电路科技有限公司 | The preparation method of hole articulamentum, the preparation method of wiring board and wiring board |
| CN207589265U (en) * | 2017-11-22 | 2018-07-06 | 广州兴森快捷电路科技有限公司 | Printed circuit board |
-
2017
- 2017-11-22 CN CN201711174236.7A patent/CN107949150A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1926931A (en) * | 2004-03-03 | 2007-03-07 | 三洋电机株式会社 | Multilayer board manufacturing method |
| CN103228103A (en) * | 2012-01-27 | 2013-07-31 | 京瓷Slc技术株式会社 | Wiring board and mounting structure using the same |
| CN103582295A (en) * | 2012-08-10 | 2014-02-12 | 揖斐电株式会社 | Wiring board and method for manufacturing wiring board |
| CN103068186A (en) * | 2012-12-20 | 2013-04-24 | 深圳市中兴新宇软电路有限公司 | Manufacture method of flexible printed circuit board blind hole |
| CN203313514U (en) * | 2013-02-20 | 2013-11-27 | 欣兴电子股份有限公司 | multilayer circuit board |
| CN107155266A (en) * | 2017-06-20 | 2017-09-12 | 广州兴森快捷电路科技有限公司 | Z-direction interconnection line plate and preparation method thereof |
| CN107257603A (en) * | 2017-06-20 | 2017-10-17 | 广州兴森快捷电路科技有限公司 | The preparation method of hole articulamentum, the preparation method of wiring board and wiring board |
| CN207589265U (en) * | 2017-11-22 | 2018-07-06 | 广州兴森快捷电路科技有限公司 | Printed circuit board |
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| CN112930029A (en) * | 2021-02-03 | 2021-06-08 | 珠海杰赛科技有限公司 | PCB and processing method of PCB pilot hole |
| CN113194635A (en) * | 2021-03-15 | 2021-07-30 | 江西宇睿电子科技有限公司 | Impedance line manufacturing method, impedance line and circuit board |
| CN113194635B (en) * | 2021-03-15 | 2023-05-26 | 江西宇睿电子科技有限公司 | Impedance line manufacturing method, impedance line and circuit board |
| CN112996234A (en) * | 2021-04-23 | 2021-06-18 | 四川超声印制板有限公司 | Circuit board and circuit board copper foil pasting device |
| WO2023087495A1 (en) * | 2021-11-19 | 2023-05-25 | 深南电路股份有限公司 | Circuit board preparation method and circuit board |
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