CN107914102B - A kind of eutectic welding procedure and the cooler bin for realizing cooling technique in the technique - Google Patents
A kind of eutectic welding procedure and the cooler bin for realizing cooling technique in the technique Download PDFInfo
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- CN107914102B CN107914102B CN201711120396.3A CN201711120396A CN107914102B CN 107914102 B CN107914102 B CN 107914102B CN 201711120396 A CN201711120396 A CN 201711120396A CN 107914102 B CN107914102 B CN 107914102B
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- 238000001816 cooling Methods 0.000 title claims abstract description 113
- 238000000034 method Methods 0.000 title claims abstract description 49
- 230000005496 eutectics Effects 0.000 title claims abstract description 27
- 238000003466 welding Methods 0.000 title claims abstract description 21
- 239000000112 cooling gas Substances 0.000 claims abstract description 26
- 239000000463 material Substances 0.000 claims abstract description 19
- 238000010438 heat treatment Methods 0.000 claims abstract description 9
- 238000010992 reflux Methods 0.000 claims abstract description 9
- 230000003247 decreasing effect Effects 0.000 claims abstract description 6
- 238000005192 partition Methods 0.000 claims description 14
- 239000007789 gas Substances 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 238000005516 engineering process Methods 0.000 abstract description 3
- 238000003754 machining Methods 0.000 abstract description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 230000035939 shock Effects 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 239000000956 alloy Substances 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 239000012634 fragment Substances 0.000 description 1
- 229910000743 fusible alloy Inorganic materials 0.000 description 1
- 239000007791 liquid phase Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 230000003134 recirculating effect Effects 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted for a procedure covered by only one of the other main groups of this subclass
- B23K37/003—Cooling means for welding or cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/27—Manufacturing methods
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/27—Manufacturing methods
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Heat Treatment Of Articles (AREA)
Abstract
A kind of eutectic welding procedure and the cooler bin for realizing cooling technique in the technique.It is related to chip manufacture technology field.A kind of good stability, clear logic and high in machining efficiency are proposed, " winged core " problem is effectively avoided the occurrence of after use, thus the eutectic welding procedure that rejection rate is greatly reduced, promotes product quality.For chip to be welded on frame, chip and frame are unidirectionally walked in track, eutectic welding procedure includes pre-heating technique, heating process, reflux technique and cooling technique, track is divided into preheating section, warming-up section, reflux section and cooling section, cooling technique is that frame and chip is made at the uniform velocity to walk on cooling section, cooling section is equally divided into cooling section one, cooling section two, cooling section three and cooling section four along material direction of travel, cooling section one, cooling section two are passed through the cooling gas that temperature is successively successively decreased below cooling section three, and cooling section four is in room temperature environment.The present invention is greatly reduced rejection rate, promotes product quality.
Description
Technical field
The present invention relates to chip manufacture technology fields, more particularly to the wherein improvement of the technique of eutectic welding.
Background technique
Eutectic weldering is also known as low-melting alloy welding, and fundamental characteristics is: two different metals can be molten far below respectively
Alloy is formed in constant weight ratio at a temperature of point.Currently, golden chip is commonly carried on the back in the eutectic weldering for diode chip for backlight unit
Eutectic welding is carried out between the silver-plated frame of copper, specifically, i.e., under certain temperature, certain pressure, will carry on the back golden chip in copper
Friction is gently rubbed on silver-plated frame, wipes the oxide layer of interfacial instability, makes to melt between contact surface, and there are two solid phase shapes
At a liquid phase, alloy is formed after cooling, chip is welded on frame, forms good low-resistance Ohm contact.
However, people have found in actual processing, since the coefficient of expansion of chip (being made of silicon mostly) is about 6, and frame
The coefficient of expansion of frame (being made of copper mostly) is about 17.Although in eutectic welding by two kinds of metal mistakes of gold, silver between silicon and copper
It crosses, but in larger-size chip load, still there is biggish ratio to make chip due to the coefficient of expansion of silicon, copper has big difference
There is thermal expansion stress problem, i.e. chip ruptures from frame, is detached from (as shown in figure 4, being commonly called as " winged core ").
Summary of the invention
The present invention has in view of the above problems, propose a kind of good stability, clear logic and high in machining efficiency, after use
Effect avoids the occurrence of " winged core " problem, thus the eutectic welding procedure that rejection rate is greatly reduced, promotes product quality.
The technical solution of the present invention is as follows: the chip and frame are unidirectional in track for chip to be welded on frame
Walking, the eutectic welding procedure includes pre-heating technique, heating process, reflux technique and cooling technique, and the track is divided into pre-
Hot arc, warming-up section, reflux section and cooling section,
The cooling technique is that frame and chip is made at the uniform velocity to walk on cooling section, and the cooling section is along material direction of travel
Cooling section one, cooling section two, cooling section three and cooling section four are equally divided into, under the cooling section one, cooling section two, cooling section three
Side is passed through the cooling gas that temperature is successively successively decreased, and the cooling section four is in room temperature environment.
The cooling gas being passed through below the cooling section one is 400 DEG C, the cooling gas being passed through below the cooling section two
It is 350 DEG C, the cooling gas being passed through below the cooling section three is 300 DEG C.
Thickness >=1.2um of the back layer gold of the chip.
Thickness >=2um of the silver coating of the frame.
Cooling section one, cooling section two and cooling section three in the track are in cooler bin, and the cooler bin includes case
Body, a pair of of partition, three intake valves and a relief valve, the track run through the top of the cabinet, the bottom surface of the cabinet
It is gradually become smaller with the spacing of track along material direction of travel, a pair of partition is fixedly connected in tank floor and partition
There are gaps for the bottom surface of apical margin and track, so that the lower part of cabinet is divided into space one, space two and space three by a pair of of partition,
The intake valve is fixedly connected on the bottom of cabinet and for being passed through cooling gas, three intake valve difference into cabinet
Bottom in space one, space two and space three, the relief valve are fixedly connected at the top of the box body and for avoiding cabinet
Interior air pressure is excessive.
The cooler bin further includes gas guide assembly, and the gas guide assembly is connected in cabinet and is located at track
Top, the gas guide assembly includes chain, a pair of sprocket and several directing plates, and a pair of sprocket wheel is respectively hinged at case
The two sides of the inner wall of body, the chain are wound around in a ring on two sprocket wheels, and several directing plates are vertically fixedly connected on chain
On the surface of item and the spacing of adjacent directing plate is equal.
The present invention carries out efficiently cooling section one, cooling section two, cooling section three by the cooling gas that temperature is successively decreased step by step
It is cooling, and cooling section four is steadily cooled down by room temperature hereafter, and then finally material in orbit of walking is carried out
It is efficiently and smoothly cooling, it avoids material and occurs the problem of temperature shock in cooling procedure, and then effectively prevent " flying
The generation of core " phenomenon is greatly reduced rejection rate, promotes product quality.
Detailed description of the invention
Fig. 1 is the temperature time curve figure that eutectic welds under traditional handicraft,
Fig. 2 is the theoretical temperatures time plot of eutectic weldering,
Fig. 3 is the actual temperature time plot that eutectic welds under cooling technique in this case,
Fig. 4 is the schematic diagram for flying core phenomenon,
Fig. 5 is the structural schematic diagram of cooler bin in this case；
1 is track in figure, and 11 be cooling section one, and 12 be cooling section two, and 13 be cooling section three, and 14 be cooling section four, and 2 be case
Body, 3 be partition, and 4 be intake valve, and 5 be relief valve, and 6 be gas guide assembly, and 61 be chain, and 62 be sprocket wheel, and 63 be directing plate.
Specific embodiment
The present invention is as shown in Figs. 1-5, and people have found that the main influencing factors for flying core are temperature in actual processing, and chip
Temperature change in eutectic welding can be divided into: preheating, heating, reflux and cooling meet continuity in actual production
The requirement of processing, the production line of eutectic weldering is also corresponding to be divided into preheating zone, heating zone, recirculating zone and cooling zone, by core
The position that fragment is scattered after piece rupture, disengaging may determine that the generation for flying core phenomenon concentrates in cooling zone, therefore, this
Case is made that following improvement to the processing technology in cooling zone:
For chip to be welded on frame, the chip and frame are unidirectionally walked in track, the eutectic Welder
Skill includes pre-heating technique, heating process, reflux technique and cooling technique, the track be divided into preheating section, warming-up section, reflux section and
Cooling section,
The cooling technique is that frame and chip is made at the uniform velocity to walk on cooling section, and the cooling section is along material direction of travel
Cooling section one, cooling section two, cooling section three and cooling section four are equally divided into, under the cooling section one, cooling section two, cooling section three
Side is passed through the cooling gas that temperature is successively successively decreased, and the cooling section four is in room temperature environment.To be successively decreased step by step by temperature
Cooling gas cooling section one, cooling section two, cooling section three are efficiently cooled down, and hereafter by room temperature to cooling section four
It is steadily cooled down, and then efficient and smoothly cooling finally is carried out to material in orbit of walking, avoid material cold
But there is the problem of temperature shock during, and then effectively prevent the generation of " winged core " phenomenon, rejection rate is greatly reduced, is promoted
Product quality.
It is efficiently and smoothly cooling to track progress to realize in this case, also it is made that following measuring and calculating, traditional handicraft core
The temperature curve of piece and frame when eutectic welds when material temperature shock occurs in temperature-fall period mostly as shown in Figure 1, fly
The core multiple period；Therefore, ideal temperature lowering curve should be as shown in the straight line in Fig. 2 obliquely, at present it is known that material will be
It is at the uniform velocity walked on the cooling section that length is L with speed V, the initial temperature (i.e. welding region peak temperature) of cooling technique is Tm,
The end temperature of cooling technique is T0(i.e. tapping temperature) can obtain K=(Tm-T0)/(L/V), that is, calculate theoretically temperature lowering curve
Slope K, the functional relation of temperature and time in figure can be calculated further according to K, finally combine speed V, can finally calculate track
The theoretical temperatures of upper every bit；Hereafter, it is done if can take in orbit, according to the difference of actually measured temperature and theoretical temperatures
Value, is adjusted the temperature for the cooling gas being passed through below cooling section one, cooling section two, cooling section three, finally obtains following
Conclusion:
The cooling gas being passed through below the cooling section one is 400 DEG C, the cooling gas being passed through below the cooling section two
It is 350 DEG C, the cooling gas being passed through below the cooling section three is 300 DEG C.Finally, carrying out actual measurement and checking, can obtain
Temperature curve shown in Fig. 3 can intuitively find out that material, therefore, will substantially in cooling procedure without temperature shock from figure
The possibility that " winged core " phenomenon occurs is reduced, that is, the purpose for realizing and rejection rate being greatly reduced, promote product quality.
Thickness >=1.2um of the back layer gold of the chip.
Thickness >=2um of the silver coating of the frame.To which gold, silver contain between silicon and copper when eutectic welding is substantially improved
The ability of amount and its buffering swelling stress, further avoids the generation of " winged core " phenomenon.
Cooling section 1, cooling section 2 12 and cooling section 3 13 in the track 1 are in cooler bin, the cooler bin
Including cabinet 2, a pair of of 3, three intake valves 4 of partition and a relief valve 5, the track 1 runs through the top of the cabinet 2, institute
The bottom surface for stating the inner wall of cabinet 2 and the spacing of track 1 gradually become smaller along material direction of travel, and a pair of partition 3 is fixed to be connected
It connects on the bottom surface of the inner wall of cabinet 2 and there are gap for the bottom surface of 3 apical margin of partition and track 1, so that the lower part of cabinet 2 is by one
Space one, space two and space three be divided into partition 3, the intake valve 4 be fixedly connected on the bottom of cabinet 2 and for
Cooling gas is passed through in cabinet 2, three intake valves 4 are respectively at the bottom in space one, space two and space three, described to let out
Pressure valve 5 is fixedly connected on the top of cabinet 2 and for avoiding air pressure in cabinet 2 excessive.Wherein, on the one hand, due to the bottom of cabinet
The spacing of face and track gradually becomes smaller along material direction of travel, therefore the volume in space one will be greater than the volume in space two, and empty
Between two volume will be greater than the volume in space three；On the other hand, due to partition apical margin in the bottom surface of track there are gap,
Cooling gas in space one, space two and space three will have a degree of mobility.
In use, after space one, space two and space three are passed through the cooling gas of different temperatures via intake valve, it is cooling
Gas will efficiently cool down step by step track and material progress.At the same time, although cooling gas and track in space three
Temperature after the heat exchange of middle cooling section three lower than in space two cooling gas with the temperature after the heat exchange of cooling section two in track
Degree, but since the volume in space three is less than the volume in space two, so that the air pressure in space three is still greater than in space two
Air pressure, so that the cooling gas in space three can reenter in space two after heat exchange with cooling section three；Similarly,
Cooling gas in space two can reenter in space one after heat exchange with cooling section two；Thus it is possible, on the one hand, can
So that space one, space two, the temperature between space three are excessively more steady, the generation of " winged core " phenomenon is further avoided；
On the other hand, the gas flowing by the gas flowing in space three-dimensional space two and space two into space one can effectively drop
The air inflow of intake valve in low spatial two and space three, so that the energy consumption of cooler bin entirety is greatly reduced.
The cooler bin further includes gas guide assembly 6, and the gas guide assembly 6 is connected in cabinet 2 and is located at rail
The top in road 1, the gas guide assembly 6 include chain 61, a pair of sprocket 62 and several directing plates 63, a pair of sprocket wheel 62
The two sides of the inner wall of cabinet 2 are respectively hinged at, the chain 61 is wound around in a ring on two sprocket wheels 62, several directing plates 63
It is vertically fixedly connected on the surface of chain 61 and the spacing of adjacent directing plate 63 is equal.To on track and material
Side pushes the hot gas distributed to move along the opposite direction of material walking, and finally it is discharged, so as to further avoid object
There is temperature decrease in cooling procedure to lead to the problem of " winged core " phenomenon in material.
Claims (5)
1. a kind of cooler bin for realizing cooling technique in eutectic welding procedure, which is characterized in that the eutectic welding procedure
For chip to be welded on frame, the chip and frame are unidirectionally walked in track, and the eutectic welding procedure includes pre-
Thermal process, heating process, reflux technique and cooling technique, the track are divided into preheating section, warming-up section, reflux section and cooling section,
It is characterized in that,
The cooling technique is that frame and chip is made at the uniform velocity to walk on cooling section, and the cooling section is average along material direction of travel
It is divided into cooling section one, cooling section two, cooling section three and cooling section four, the cooling section one, cooling section two lead to below cooling section three
Enter the cooling gas that temperature is successively successively decreased, the cooling section four is in room temperature environment；
Cooling section one, cooling section two and cooling section three are in cooler bin, and the cooler bin includes cabinet, a pair of of partition, three
Intake valve and a relief valve, the track run through the top of the cabinet, and the bottom surface of the cabinet and the spacing of track are along object
Material direction of travel gradually becomes smaller, and a pair of partition is fixedly connected in tank floor and the bottom surface of partition apical margin and track
There are gaps, so that the lower part of cabinet is divided into space one, space two and space three by a pair of of partition, the intake valve is fixed to be connected
It connects the bottom in cabinet and is used to be passed through cooling gas into cabinet, three intake valves are respectively at space one, space two
With the bottom in space three, the relief valve is fixedly connected at the top of the box body and for avoiding air pressure in cabinet excessive.
2. the cooler bin according to claim 1 for realizing cooling technique in eutectic welding procedure, which is characterized in that institute
Stating the cooling gas being passed through below cooling section one is 400 DEG C, and the cooling gas being passed through below the cooling section two is 350 DEG C, institute
Stating the cooling gas being passed through below cooling section three is 300 DEG C.
3. the cooler bin according to claim 1 for realizing cooling technique in eutectic welding procedure, which is characterized in that institute
State thickness >=1.2um of the back layer gold of chip.
4. the cooler bin according to claim 1 for realizing cooling technique in eutectic welding procedure, which is characterized in that institute
State thickness >=2um of the silver coating of frame.
5. the cooler bin according to claim 1 for realizing cooling technique in eutectic welding procedure, which is characterized in that institute
Stating cooler bin further includes gas guide assembly, and the gas guide assembly is connected to the top in cabinet and being located at track, described
Gas guide assembly includes chain, a pair of sprocket and several directing plates, and a pair of sprocket wheel is respectively hinged at the inner wall of cabinet
Two sides, the chain are wound around in a ring on two sprocket wheels, several directing plates are vertically fixedly connected on the surface of chain,
And the spacing of adjacent directing plate is equal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711120396.3A CN107914102B (en) | 2017-11-14 | 2017-11-14 | A kind of eutectic welding procedure and the cooler bin for realizing cooling technique in the technique |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711120396.3A CN107914102B (en) | 2017-11-14 | 2017-11-14 | A kind of eutectic welding procedure and the cooler bin for realizing cooling technique in the technique |
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| Publication Number | Publication Date |
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| CN107914102A CN107914102A (en) | 2018-04-17 |
| CN107914102B true CN107914102B (en) | 2019-11-01 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203887355U (en) * | 2014-05-19 | 2014-10-22 | 上海威克迈龙川汽车发动机零件有限公司 | Brazing furnace equipment with protective gas switching function |
| CN104646874A (en) * | 2014-12-31 | 2015-05-27 | 吴华 | Guide rail unit of soft solder loading machine |
| CN204673106U (en) * | 2015-05-09 | 2015-09-30 | 娄斌 | A kind of net belt type gas protection soldering oven |
| CN106816804A (en) * | 2015-11-30 | 2017-06-09 | 中国科学院大连化学物理研究所 | A kind of microchannel metal foam disk like laser crystal cooling device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7296727B2 (en) * | 2001-06-27 | 2007-11-20 | Matsushita Electric Industrial Co., Ltd. | Apparatus and method for mounting electronic components |
-
2017
- 2017-11-14 CN CN201711120396.3A patent/CN107914102B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN203887355U (en) * | 2014-05-19 | 2014-10-22 | 上海威克迈龙川汽车发动机零件有限公司 | Brazing furnace equipment with protective gas switching function |
| CN104646874A (en) * | 2014-12-31 | 2015-05-27 | 吴华 | Guide rail unit of soft solder loading machine |
| CN204673106U (en) * | 2015-05-09 | 2015-09-30 | 娄斌 | A kind of net belt type gas protection soldering oven |
| CN106816804A (en) * | 2015-11-30 | 2017-06-09 | 中国科学院大连化学物理研究所 | A kind of microchannel metal foam disk like laser crystal cooling device |
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