CN107889388B

CN107889388B - Shell manufacturing method, shell and electronic equipment

Info

Publication number: CN107889388B
Application number: CN201711052910.4A
Authority: CN
Inventors: 杨光明; 张涛; 孙文峰
Original assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Current assignee: Guangdong Oppo Mobile Telecommunications Corp Ltd
Priority date: 2017-10-30
Filing date: 2017-10-30
Publication date: 2020-07-24
Anticipated expiration: 2037-10-30
Also published as: CN107889388A

Abstract

The embodiment of the application discloses casing manufacturing method, casing and electronic equipment, through forming the protective layer on the surface in the substrate towards the electronic equipment outside, the protective layer is a graphite alkene layer, and when the finger touch during the casing, because graphite alkene has hydrophilic oleophobic nature, the grease on the finger is difficult for being attached to the protective layer to make the difficult finger print that glues in surface of casing.

Description

Shell manufacturing method, shell and electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to a shell manufacturing method, a shell and electronic equipment.

Background

At present, fingerprint prints are easily adhered to the outer surface of the shell of electronic equipment, such as mobile phones and tablet computers.

Disclosure of Invention

The embodiment of the application provides a shell manufacturing method, a shell and electronic equipment, which can prevent grease on fingers from being attached to a protective layer easily, so that fingerprint marks are not prone to being adhered to the surface of the shell.

The embodiment of the application provides a shell manufacturing method, wherein the shell is applied to electronic equipment, and the shell manufacturing method comprises the following steps:

providing a substrate, wherein the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic equipment, and the second surface faces the outer side of the electronic equipment; and

and arranging a protective layer on the second surface of the substrate, wherein the protective layer is a graphene layer.

The embodiment of the application further provides a shell, which is applied to electronic equipment, the shell comprises a substrate and a protective layer, the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic equipment, the second surface faces the outer side of the electronic equipment, the protective layer is arranged on the second surface of the substrate, and the protective layer is a graphene layer.

The embodiment of the application further provides an electronic device, which comprises a housing, the housing includes a substrate and a protective layer, the substrate includes first surface and second surface, the first surface is towards the electronic device inboard, and the second surface is towards the electronic device outside, the protective layer set up in the second surface of substrate, the protective layer is a graphite alkene layer.

The utility model provides a casing manufacturing method, through forming the protective layer on the surface in the substrate towards the electronic equipment outside, the protective layer is a graphite alkene layer, and when the finger touch during the casing, because graphite alkene has hydrophilic oleophobic nature, the grease on the finger is difficult for being attached to the protective layer to make the difficult finger print that glues in surface of casing.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a rear cover according to an embodiment of the present application.

Fig. 4 is a cross-sectional view of the first embodiment of fig. 3 in the direction a-a.

Fig. 5 is another schematic structural diagram of the housing according to the embodiment of the present application.

Fig. 6 is another schematic structural diagram of the rear cover according to the embodiment of the present application.

Fig. 7 is another schematic structural diagram of an electronic device according to an embodiment of the present application.

Fig. 8 is a first flowchart illustrating a method for manufacturing a rear cover according to an embodiment of the present disclosure.

Fig. 9 is a second flowchart of a method for manufacturing a rear cover according to an embodiment of the present disclosure.

Fig. 10 is a third flowchart illustrating a method for manufacturing a rear cover according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

In the description of the present application, it is to be understood that the terms "center," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present application and for simplicity in description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated in a particular manner, and are not to be construed as limiting the present application. Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, features defined as "first", "second", may explicitly or implicitly include one or more of the described features. In the description of the present application, "a plurality" means two or more unless specifically limited otherwise.

In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be mechanically connected, may be electrically connected or may be in communication with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.

In this application, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact of the first and second features, or may comprise contact of the first and second features not directly but through another feature in between. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The following disclosure provides many different embodiments or examples for implementing different features of the application. In order to simplify the disclosure of the present application, specific example components and arrangements are described below. Of course, they are merely examples and are not intended to limit the present application. Moreover, the present application may repeat reference numerals and/or letters in the various examples, such repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, examples of various specific processes and materials are provided herein, but one of ordinary skill in the art may recognize applications of other processes and/or use of other materials.

The embodiment of the application provides a shell manufacturing method, a shell and electronic equipment. The details will be described below separately.

In the present embodiment, a description will be made in terms of a method for manufacturing a rear cover, which may form a housing that may be provided in an electronic device, such as a mobile phone, a tablet computer, a Personal Digital Assistant (PDA), and the like.

Referring to fig. 1, fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present disclosure. The electronic device 1 comprises a housing 10, a display 20, a printed circuit board 30, and a battery 40.

Referring to fig. 2, fig. 2 is a schematic structural diagram of a housing according to an embodiment of the present disclosure.

The housing 10 may include a cover plate 11, a middle frame 12, and a rear cover 13. The cover plate 11, the middle frame 12 and the rear cover 13 are combined with each other to form the housing 10. The housing 10 has a closed space formed by the cover plate 11, the middle frame 12 and the rear cover 13 to accommodate the display 20, the printed circuit board 30, the battery 40 and the like.

In some embodiments, the cover plate 11 is covered on the middle frame 12. The rear cover 13 is covered on the middle frame 12. The cover plate 11 and the rear cover 13 are located on opposite sides of the center frame 12. The cover plate 11 and the rear cover 13 are oppositely arranged. The closed space of the housing 10 is located between the cover plate 11 and the rear cover 13.

The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire.

The middle frame 12 may be a metal housing, such as an aluminum alloy middle frame 12. It should be noted that the material of the frame 12 in the embodiment of the present application is not limited to this, and other manners may also be adopted, such as: the middle frame 12 can be a ceramic middle frame or a glass middle frame. For another example: the middle frame 12 may be a plastic middle frame. Also for example: the middle frame 12 may be a structure in which metal and plastic are matched with each other, and the plastic part may be formed by injection molding on a metal plate.

The rear cover 13 may be a metal rear cover, such as an aluminum alloy rear cover, a stainless steel rear cover. The rear cover 13 may also be a glass rear cover or a ceramic rear cover.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a rear cover according to an embodiment of the present disclosure.

The rear cover 13 may include an inner surface 131 and an outer surface 132 disposed opposite one another. The inner surface 131 of the rear cover 13 is adjacent to the center frame 12 and the cover plate 11, and constitutes a part of the inner surface of the housing 10. The outer surface 132 of the rear cover 13 is separated from the center frame 12 and the cover plate 11, and constitutes a part of the outer surface of the housing 10. The rear cover 13 may further include a through hole 133, and the through hole 133 may be used to mount a camera.

Referring to fig. 4, fig. 4 is a cross-sectional view taken along a-a direction of fig. 3.

For convenience of explanation, the case will be described below by taking the rear cover 13 as an example.

The rear cover 13 may include a substrate 134 and a protective layer 135. The protection layer 135 is disposed on a surface of the rear cover 13 away from the cover plate 11.

The base material 134 may be made of aluminum, such as aluminum alloy, stainless steel, glass, ceramic, or the like.

The substrate 134 includes a first surface 1341 and a second surface 1342. The first surface 1341 faces the inside of the electronic device, and the second surface 1342 faces the outside of the electronic device. In one embodiment, the first surface 1341 is disposed toward the cover plate 11 and the center frame 12. The first surface 1341 may be the inner surface 131 of the rear cover 13. The first surface 1341 is an inner surface of the housing 10. The second surface 1342 is disposed facing away from the cover plate 11 and the middle frame 12. The second surface 1342 is an outer surface of the housing 10.

The protection layer 135 is disposed on the second surface 1342 of the substrate 134. The protective layer 135 is a graphene layer.

In one embodiment, graphene oxide may be prepared, then a nanosol is prepared, then a hydrophilic polymer water-sensitive agent and a crosslinking film former are dissolved in water to form a first solution, then the nanosol and the first solution are mixed to form a second solution, and then graphene oxide is added to the second solution to form a graphene precursor.

The graphene precursor is coated on the second surface 1342 of the substrate 134, and then the graphene layer is obtained by drying and baking the graphene precursor on the second surface 1342 of the substrate 134.

In one embodiment, the graphene precursor may be coated on the second surface 1342 of the substrate 134 by spin coating, spray coating or soaking.

In one embodiment, a vacuum oven may be used to bake the graphene precursor on the second surface 1342 of the substrate 134 to obtain the graphene layer.

In one embodiment, the time for baking may be 1 hour. In one embodiment, the baking time may be 20 minutes to 40 minutes. In one embodiment, the temperature of the baking may be less than 300 degrees celsius. In one embodiment, the baking temperature may be 100 to 200 degrees celsius.

In one embodiment, the thickness of the protection layer 135 can be controlled by coating a first graphene precursor on the second surface 1342 of the substrate 134, drying and baking the graphene precursor on the second surface 1342 of the substrate 134 to obtain a first graphene layer, coating a second graphene precursor on the first graphene layer, drying and baking the graphene precursor on the second surface 1342 of the substrate 134 to obtain a second graphene layer, and so on, and adjusting the number of graphene layers by multiple coating and baking steps.

In one embodiment, the protective layer 135 masks the color of the second surface 1342 of the substrate 134. The color of the graphene of the protective layer 135 is adopted as the color of the outer surface of the shell.

In one embodiment, the thickness of the protective layer 135 is greater than 100 microns. When the thickness of the protection layer 135 is less than 100 micrometers, the light transmittance of the protection layer 135 is high due to the small thickness of the protection layer 135, and the color of the second surface 1342 of the substrate 134 is easily exposed. Meanwhile, due to the fact that graphene has high thermal conductivity, the graphene layer with large thickness is beneficial to heat dissipation of electronic products. In one embodiment, the thickness of the protective layer 135 may be greater than 500 microns.

In one embodiment, to enable the protective layer 135 to be more firmly attached to the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 may be polished to increase the flatness of the surface of the second surface 1342 of the substrate 134, so as to increase the adhesion of the protective layer 135 to the second surface 1342 of the substrate 134, and further enable the protective layer 135 to be firmly attached to the second surface 1342 of the substrate 134.

For example, please refer to fig. 5, and fig. 5 is another schematic structural diagram of the housing according to the embodiment of the present application.

The housing 10a includes a cover plate 16 and a rear cover 17. In some embodiments, the cover plate 16 is directly attached to the rear cover 17. The cover plate 16 and the rear cover 17 are combined with each other to form the housing 10 a. The housing 10a has a closed space formed by the cover plate 16 and the rear cover 17 to accommodate the display 20, the printed circuit board 30, the battery 40, and the like.

Compared with the housing 10 shown in fig. 2, the housing 10a of fig. 5 does not include the middle frame, or the middle frame 12 and the rear cover 13 of fig. 2 are integrally formed to form a rear cover 17.

Specifically, please refer to fig. 6, fig. 6 is another schematic structural diagram of the rear cover according to the embodiment of the present application.

In some embodiments, the rear cover 17 includes an inner surface 171 and an outer surface 172, with the inner surface 171 and the outer surface 172 being oppositely disposed to form the entire surface of the rear cover 17. The various layer structures of the back cover 17 can be referred to the back cover 13, and are not described in detail here.

The printed circuit board 30 is installed in the housing 10, the printed circuit board 30 may be a main board of the electronic device 1, and functional components such as an antenna, a motor, a microphone, a camera, a light sensor, a receiver, and a processor may be integrated on the printed circuit board 30. In some embodiments, the printed circuit board 30 is fixed within the housing 10. Specifically, the printed circuit board 30 may be screwed to the middle frame 12 by screws, or may be snapped to the middle frame 12 by a snap-fit manner. It should be noted that the way of fixing the printed circuit board 30 to the middle frame 12 is not limited to this, and other ways, such as a way of fixing by a snap and a screw, may also be used.

The battery 40 is mounted in the housing 10, and the battery 40 is electrically connected to the printed circuit board 30 to supply power to the electronic apparatus 1. The case 10 may serve as a battery cover of the battery 40. The case 10 covers the battery 40 to protect the battery 40, and particularly, the rear cover 13 covers the battery 40 to protect the battery 40, reducing damage to the battery 40 due to a collision, a fall, or the like of the electronic apparatus 1.

The display screen 20 is mounted in the housing 10, and at the same time, the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 1. The display screen 20 includes a display area 14 and a non-display area 15. The display area 14 may be used to display a screen of the electronic device 1 or provide a user with touch control. The top area of the non-display area 15 is provided with an opening for sound and light conduction, and the bottom of the non-display area 15 can be provided with functional components such as a fingerprint module, a touch key and the like. The cover plate 11 is mounted on the display screen 20 to cover the display screen 20, and forms the same display area and non-display area as the display screen 20, which can be referred to specifically as the display area and the non-display area of the display screen 20.

It should be noted that the structure of the display screen 20 is not limited to this. For example, the display screen may be a full-screen or an opposite-type screen, specifically, please refer to fig. 7, and fig. 7 is another schematic structural diagram of the electronic device according to the embodiment of the present application. The electronic device in fig. 7 differs from the electronic device in fig. 1 in that: the non-display area 15a is directly formed on the display screen 20a, for example, the non-display area 15a of the display screen 20a is provided with a transparent structure so that an optical signal can pass through, or the non-display area of the display screen 20a is directly provided with an opening or a notch for light conduction, and the like, and the front camera, the photoelectric sensor, and the like can be arranged at the position of the non-display area so that the front camera can take a picture and the photoelectric sensor can detect. The display area 14a covers the entire surface of the electronic apparatus 1 a. It should be noted that the components of the housing 10, the printed circuit board 30, the battery 40, and the like in the electronic device 1a can refer to the above contents, and are not described herein again.

The invention also provides a manufacturing method of the shell.

The following description will be given taking the rear cover as an example, but the method for manufacturing the case according to the embodiment of the present application is not limited to the rear cover.

Referring to fig. 8, fig. 8 is a schematic flow chart illustrating a method for manufacturing a rear cover according to an embodiment of the present disclosure. The manufacturing method of the shell comprises the following steps:

step S101, providing a substrate 134, wherein the substrate 134 includes a first surface 1341 and a second surface 1342, the first surface 1341 faces the inside of the electronic device, and the second surface 1342 faces the outside of the electronic device.

The substrate 134 may be a metal material, such as aluminum, and further, such as aluminum alloy. The base material 134 may be obtained as it is or by processing a plate material, for example, by forging or aging an aluminum alloy plate material. The substrate 134 may also be glass, ceramic, or the like.

The first surface 1341 is disposed toward the cover plate 11 and the middle frame 12. The first surface 1341 may be the inner surface 131 of the back cover 13. The first surface 1341 is an inner surface of the housing 10. The second surface 1342 is disposed facing away from the cover plate 11 and the middle frame 12. The second surface 1342 is an outer surface of the housing 10.

In step S102, a protective layer 135 is disposed on the second surface 1342 of the substrate 134, where the protective layer 135 is a graphene layer.

In one embodiment, referring to fig. 9, the step S102 may include:

step S1021: polishing a second surface 1342 of the substrate 134; and

step S1022: a protective layer 135 is disposed on the second surface 1342 of the polished substrate 134, and the protective layer 135 is a graphene layer.

In order to make the protection layer 135 more firmly attached to the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 may be polished to increase the flatness of the surface of the second surface 1342 of the substrate 134, so as to increase the adhesion of the protection layer 135 to the second surface 1342 of the substrate 134, and further make the protection layer 135 firmly attached to the second surface 1342 of the substrate 134.

In some embodiments, the second surface 1342 of the substrate 134 can be polished mechanically, chemically, electrochemically, ultrasonically, or the like. Such that the roughness of the second surface 1342 of the substrate 134 is reduced to obtain a bright, flat surface of the second surface 1342 of the substrate 134. The chemical polishing process is to regularly dissolve the second surface 1342 of the substrate 134 to achieve a smooth and flat surface. The electrochemical polishing method is to immerse the second surface 1342 of the substrate 134 as an anode and the insoluble metal as a cathode into an electrolytic bath simultaneously, and generate a selective anode solution by direct current, thereby increasing the brightness of the second surface 1342 of the substrate 134. Wherein the mechanical polishing is performed by cutting the second surface 1342 of the substrate 134 so that the second surface 1342 of the substrate 134 is plastically deformed to remove the polished protrusions and obtain a smooth surface. Wherein the substrate 134 is placed in the abrasive suspension and placed together in the ultrasonic field, and the second surface 1342 of the substrate 134 is polished by the ultrasonic oscillation.

In some embodiments, before polishing the second surface 1342 of the substrate 134, the second surface 1342 of the substrate 134 may be polished, and then the polished second surface 1342 of the substrate 134 may be polished, so that the polishing effect is better, and the second surface 1342 of the substrate 134 is smoother. Here, it should be noted that the grinding process may be understood as a rough process before the polishing process. Namely, the outer surface of the rear cover can be subjected to rough grinding and then fine grinding to finish polishing treatment.

In one embodiment, referring to fig. 10, the method may further include step S103: and preparing a graphene precursor.

The step S103 may be performed before the step S101, or may be performed after the step S101. The steps S101 and S103 may be performed simultaneously. Step S101 and step S103 are both performed before step S102.

In one embodiment, referring to fig. 10, the step S102 may be:

step S102 a: the graphene precursor is applied to the second surface 1342 of the substrate 134.

Step S102 b: the graphene precursor on the second surface 1342 of the substrate 134 is dried and baked to obtain a graphene layer.

To sum up, the casing manufacturing method that this application embodiment provided forms the protective layer through the surface in the substrate towards the electronic equipment outside, the protective layer is a graphite alkene layer, and when the finger touch during the casing, because graphite alkene has hydrophilic oleophobic nature, the grease on the finger is difficult for being attached to the protective layer to make the difficult finger print that glues in surface of casing.

Those skilled in the art will appreciate that the structure of the electronic device 1 shown in fig. 1 does not constitute a limitation of the electronic device 1. The electronic device 1 may comprise more or fewer components than shown, or some components may be combined, or a different arrangement of components. The electronic device 1 may further include a memory, a bluetooth module, etc., which will not be described herein.

The above detailed description is provided for the housing manufacturing method, the housing and the electronic device provided in the embodiments of the present application, and the principle and the implementation of the present application are described in this document by applying specific examples, and the description of the above embodiments is only used to help understanding the present application. Meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A shell manufacturing method is applied to electronic equipment, and is characterized by comprising the following steps:

providing a substrate, wherein the substrate comprises a first surface and a second surface, the first surface faces the inner side of the electronic equipment, and the second surface faces the outer side of the electronic equipment;

preparing a graphene precursor; the configuring of the graphene precursor includes: preparing graphene oxide; preparing nano sol, dissolving a hydrophilic polymer water-sensitive agent and a crosslinking film forming agent in water to form a first solution; mixing the nano-sol and the first solution to form a second solution, and adding the graphene oxide into the second solution to form a graphene precursor;

coating the graphene precursor on the second surface of the substrate in a spin coating, spraying or soaking mode; and

drying and baking the graphene precursor on the second surface of the substrate to obtain a graphene layer for use as a protective layer.

2. The housing fabrication method of claim 1, wherein the disposing step is performed before, after, or simultaneously with providing a substrate comprising a first surface and a second surface, the first surface facing an inside of the electronic device and the second surface facing an outside of the electronic device, and wherein the substrate comprises a first surface facing the inside of the electronic device and a second surface facing the outside of the electronic device.

3. A method of making a housing as claimed in claim 1, wherein: and repeating the step of coating the graphene precursor on the second surface of the substrate and the step of drying and baking the graphene precursor on the second surface of the substrate to obtain the graphene layer for multiple times.

4. A method of making a housing as claimed in claim 1, wherein: the protective layer shields the color of the second surface of the substrate.

5. A method of making a housing as claimed in claim 1, wherein: the protective layer has a thickness greater than 100 microns.

6. A shell is applied to electronic equipment, and is characterized in that: the housing is prepared by the method of any one of claims 1 to 5, wherein the housing comprises a substrate and a protective layer, the substrate comprises a first surface and a second surface, the first surface faces the inside of the electronic device, the second surface faces the outside of the electronic device, the protective layer is disposed on the second surface of the substrate, and the protective layer is a graphene layer.

7. The housing of claim 6, wherein: the protective layer shields the color of the second surface of the substrate.

8. The housing of claim 6, wherein: the protective layer has a thickness greater than 100 microns.

9. An electronic device characterized by comprising a housing as claimed in any one of claims 6 to 8.