CN107818923B - High-efficiency Needle Transfer Technology for Diodes - Google Patents
High-efficiency Needle Transfer Technology for Diodes Download PDFInfo
- Publication number
- CN107818923B CN107818923B CN201710938691.3A CN201710938691A CN107818923B CN 107818923 B CN107818923 B CN 107818923B CN 201710938691 A CN201710938691 A CN 201710938691A CN 107818923 B CN107818923 B CN 107818923B
- Authority
- CN
- China
- Prior art keywords
- needle
- steps
- steel needle
- efficiency
- welding
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005516 engineering process Methods 0.000 title description 2
- 229910000831 Steel Inorganic materials 0.000 claims abstract description 26
- 239000010959 steel Substances 0.000 claims abstract description 26
- 238000000034 method Methods 0.000 claims abstract description 18
- 239000003292 glue Substances 0.000 claims abstract description 13
- 238000003466 welding Methods 0.000 claims abstract description 13
- 238000005476 soldering Methods 0.000 claims abstract description 12
- 239000011159 matrix material Substances 0.000 claims abstract description 7
- 229910000679 solder Inorganic materials 0.000 claims abstract description 7
- 229920000297 Rayon Polymers 0.000 claims abstract description 6
- 238000005452 bending Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 238000007689 inspection Methods 0.000 claims abstract description 4
- 238000007789 sealing Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 11
- 239000013078 crystal Substances 0.000 claims description 8
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 238000012856 packing Methods 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000002994 raw material Substances 0.000 abstract description 5
- 238000009966 trimming Methods 0.000 abstract 1
- 238000004026 adhesive bonding Methods 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000009432 framing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07 e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D8/00—Diodes
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
本发明涉及一种二极管高效针转移装片工艺，包括：(1)制作贴片二极管上、下框架并合模的步骤；(2)焊接的步骤；(3)塑封的步骤；(4)固化和电镀的步骤；(5)切筋折弯成型的步骤；(6)回流焊的步骤；(7)检验并出货的步骤；该二极管高效针转移装片工艺中，采用了矩阵式框架，从而能够提高粘胶的效率，增加了产能，节省人工成本；同时，将针转移针头改为了双层式钢针头，通过弹簧能够对钢针下压的过程中，不让晶粒发生破裂，减少了对二极管的电性的影响，同时，调节钢针尖到下板面的距离，以达到合适的长度，能够有效控制粘胶量，在提高原料使用率，降低损耗，而且，钢针针头的尺寸能够进行调节，来提高对锡膏的粘胶量的控制。
The invention relates to a high-efficiency needle transfer chip mounting process for diodes, comprising: (1) the steps of making the upper and lower frames of the chip diode and clamping the mold; (2) the step of welding; (3) the step of plastic sealing; (4) the step of curing and electroplating steps; (5) the step of trimming and bending forming; (6) the step of reflow soldering; (7) the step of inspection and shipment; in the high-efficiency pin-transfer-loading process of diodes, a matrix frame is adopted, In this way, the efficiency of viscose can be improved, the production capacity can be increased, and labor costs can be saved; at the same time, the needle transfer needle is changed to a double-layer steel needle, and the steel needle can be pressed down by the spring to prevent the grain from breaking and reduce In order to avoid the impact on the electrical properties of the diode, at the same time, adjust the distance from the tip of the steel needle to the lower plate to achieve a suitable length, which can effectively control the amount of glue, improve the utilization rate of raw materials, reduce loss, and the size of the steel needle needle Adjustments can be made to improve control over the amount of solder paste stickiness.
Description
技术领域technical field
本发明属于二极管技术领域，具体涉及一种二极管高效针转移装片工艺。The invention belongs to the technical field of diodes, and in particular relates to a high-efficiency needle transfer loading process for diodes.
背景技术Background technique
目前二极管粘胶工艺常用的方法，是在生产过程中使用单条式框架粘胶工艺,对二极管的电性极其不稳定，而且单条式框架粘胶工艺，即浪费原材料的使用率，又加大了该产品的成本；不仅如此，现有的针转移针头都是采用单层式可升缩铜弹簧针头，弹簧易被胶污染，影响弹性和生产效率。At present, the commonly used method of diode gluing process is to use a single frame gluing process in the production process, which is extremely unstable to the electrical properties of the diode, and the single framing gluing process wastes the utilization rate of raw materials and increases The cost of the product; not only that, but the existing needle transfer needles all use a single-layer retractable copper spring needle, and the spring is easily polluted by glue, which affects elasticity and production efficiency.
发明内容Contents of the invention
本发明要解决的技术问题是：为了克服现有技术的不足，提供一种二极管高效针转移装片工艺。The technical problem to be solved by the present invention is: in order to overcome the deficiencies of the prior art, provide a high-efficiency needle transfer chip loading process for diodes.
本发明解决其技术问题所采用的技术方案是：一种二极管高效针转移装片工艺，包括：The technical solution adopted by the present invention to solve the technical problem is: a diode high-efficiency needle transfer loading process, comprising:
(1)制作贴片二极管上、下框架并合模的步骤；(1) The steps of making the upper and lower frames of the patch diode and closing the mold;
(2)焊接的步骤；(2) Welding steps;
(3)塑封的步骤；(3) Steps of plastic sealing;
(4)固化和电镀的步骤；(4) steps of curing and electroplating;
(5)切筋折弯成型的步骤；(5) Steps of cutting ribs, bending and forming;
(6)回流焊的步骤；(6) Steps of reflow soldering;
(7)检验并出货的步骤；(7) Steps of inspection and shipment;
其中，步骤(1)包括：装架→晶粒装填下料片→筛片→料片装填下框架→晶粒装填上料片→筛片→料片装填上框架→上、下框架合模，在装架中，将各矩阵式框架进行装架；Wherein, the step (1) includes: racking → crystal grain loading into the lower tablet → sieve sheet → tablet loading into the lower frame → crystal grain loading into the upper tablet → sieve sheet → tablet loading into the upper frame → upper and lower frame mold clamping, In racking, each matrix frame is racked;
其中，步骤(1)中装填时，采用粘胶的针转移针头包括钢针、上层板、下层板和弹簧，下层板的上端面设有一个台阶，钢针依次穿过上层板、台阶和下层板，弹簧套设在钢针的外周，弹簧位于上层板和台阶之间。Wherein, when loading in step (1), the needle transfer needle head with viscose glue includes a steel needle, an upper plate, a lower plate and a spring, and a step is provided on the upper end of the lower plate, and the steel needle passes through the upper plate, the step and the lower plate plate, the spring is sleeved on the outer periphery of the steel needle, and the spring is located between the upper plate and the steps.
具体的，步骤(1)中装填时采用锡膏作为粘胶。Specifically, solder paste is used as glue when filling in step (1).
具体的，步骤(2)采用隧道焊接炉焊接，炉内填充有氢气或氮气，并在焊接后对焊接好的材料进行清洗和烘干。Specifically, the step (2) uses a tunnel welding furnace for welding, and the furnace is filled with hydrogen or nitrogen, and the welded materials are cleaned and dried after welding.
具体的，步骤(6)采用回流焊炉对切筋好的材料进行回流焊，回流焊包括八个温度区，八区温度依次为150℃、160℃、180℃、190℃、230℃、240℃、280℃、280℃；回流焊炉传送带的链速为97-103cm/min，且切筋好的材料在温度240℃以上区域的时间为10-30s。Specifically, step (6) uses a reflow oven to perform reflow soldering on the trimmed material. The reflow soldering includes eight temperature zones, and the temperatures in the eight zones are 150°C, 160°C, 180°C, 190°C, 230°C, and 240°C. ℃, 280℃, 280℃; the chain speed of the conveyor belt of the reflow oven is 97-103cm/min, and the time for the trimmed material to be above 240℃ is 10-30s.
具体的，回流焊后的材料经自然冷却后装箱。Specifically, the materials after reflow soldering are naturally cooled and then packed into boxes.
本发明的有益效果是，该二极管高效针转移装片工艺中，采用了矩阵式框架，从而能够提高粘胶的效率，增加了产能，节省人工成本；同时，将针转移针头改为了双层式钢针头，通过弹簧能够对钢针下压的过程中，不让晶粒发生破裂，减少了对二极管的电性的影响，同时，调节钢针尖到下板面的距离，以达到合适的长度，能够有效控制粘胶量，在提高原料使用率，降低损耗，而且，钢针针头的尺寸能够进行调节，来提高对锡膏的粘胶量的控制。The beneficial effect of the present invention is that, in the high-efficiency needle transfer loading process of diodes, a matrix frame is adopted, so that the efficiency of viscose can be improved, the production capacity is increased, and labor costs are saved; at the same time, the needle transfer needles are changed to a double-layer type The steel needle head can prevent the crystal grains from breaking during the process of pressing the steel needle through the spring, which reduces the impact on the electrical properties of the diode. At the same time, adjust the distance from the steel needle tip to the lower plate to achieve a suitable length. It can effectively control the amount of glue, improve the utilization rate of raw materials, reduce loss, and the size of the steel needle can be adjusted to improve the control of the amount of glue on the solder paste.
附图说明Description of drawings
下面结合附图和实施例对本发明进一步说明。The present invention will be further described below in conjunction with the accompanying drawings and embodiments.
图1是本发明的二极管高效针转移装片工艺的针转移针头的结构示意图；Fig. 1 is the schematic structural representation of the needle transfer needle head of the diode high-efficiency needle transfer loading process of the present invention;
图中：1.上层板，2.下层板，3.钢针，4.台阶，5.弹簧。In the figure: 1. Upper plate, 2. Lower plate, 3. Steel needle, 4. Step, 5. Spring.
具体实施方式Detailed ways
现在对本发明作进一步详细的说明：The present invention is described in further detail now:
一种二极管高效针转移装片工艺，包括：A high-efficiency needle-transfer mounting process for diodes, comprising:
(1)制作贴片二极管上、下框架并合模的步骤；(1) The steps of making the upper and lower frames of the patch diode and closing the mold;
(2)焊接的步骤；(2) Welding steps;
(3)塑封的步骤；(3) Steps of plastic sealing;
(4)固化和电镀的步骤；(4) steps of curing and electroplating;
(5)切筋折弯成型的步骤；(5) Steps of cutting ribs, bending and forming;
(6)回流焊的步骤；(6) Steps of reflow soldering;
(7)检验并出货的步骤；(7) Steps of inspection and shipment;
其中，步骤(1)包括：装架→晶粒装填下料片→筛片→料片装填下框架→晶粒装填上料片→筛片→料片装填上框架→上、下框架合模，在装架中，将各矩阵式框架进行装架；Wherein, the step (1) includes: racking → crystal grain loading into the lower tablet → sieve sheet → tablet loading into the lower frame → crystal grain loading into the upper tablet → sieve sheet → tablet loading into the upper frame → upper and lower frame mold clamping, In racking, each matrix frame is racked;
其中，步骤(1)中装填时，采用粘胶的针转移针头包括钢针3、上层板1、下层板2和弹簧5，下层板2的上端面设有一个台阶4，钢针3依次穿过上层板1、台阶4和下层板2，弹簧5套设在钢针3的外周，弹簧5位于上层板1和台阶4之间。Wherein, when filling in the step (1), the needle transfer needles using viscose include steel needles 3, upper plate 1, lower plate 2 and spring 5, and the upper end surface of the lower plate 2 is provided with a step 4, and the steel needles 3 are passed through in turn. Through the upper plate 1 , the step 4 and the lower plate 2 , the spring 5 is sheathed on the outer periphery of the steel needle 3 , and the spring 5 is located between the upper plate 1 and the step 4 .
具体的，步骤(1)中装填时采用锡膏作为粘胶。Specifically, solder paste is used as glue when filling in step (1).
具体的，步骤(2)采用隧道焊接炉焊接，炉内填充有氢气或氮气，并在焊接后对焊接好的材料进行清洗和烘干。Specifically, the step (2) uses a tunnel welding furnace for welding, and the furnace is filled with hydrogen or nitrogen, and the welded materials are cleaned and dried after welding.
具体的，步骤(6)采用回流焊炉对切筋好的材料进行回流焊，回流焊包括八个温度区，八区温度依次为150℃、160℃、180℃、190℃、230℃、240℃、280℃、280℃；回流焊炉传送带的链速为97-103cm/min，且切筋好的材料在温度240℃以上区域的时间为10-30s。Specifically, step (6) uses a reflow oven to perform reflow soldering on the trimmed material. The reflow soldering includes eight temperature zones, and the temperatures in the eight zones are 150°C, 160°C, 180°C, 190°C, 230°C, and 240°C. ℃, 280℃, 280℃; the chain speed of the conveyor belt of the reflow oven is 97-103cm/min, and the time for the trimmed material to be above 240℃ is 10-30s.
具体的，回流焊后的材料经自然冷却后装箱。Specifically, the materials after reflow soldering are naturally cooled and then packed into boxes.
其中，把原来的单条式框架更改为矩阵式框架，同时增加了针转移针头的数量，从而能够提高粘胶的效率，增加了产能。Among them, the original single frame is changed to a matrix frame, and the number of needle transfer needles is increased at the same time, so that the efficiency of viscose can be improved and the production capacity can be increased.
如图1所示：针转移针头是双层式钢针头，包括上层板和下层板，通过弹簧缓冲能够在钢针下压的过程中，不让晶粒发生破裂，减少了对二极管电性的影响；同时，下层板和台阶能够有效阻挡胶污染弹簧，保证正常使用，提高了生产效率；同时，调节钢针尖到下板面的距离，以达到合适的长度，能够有效控制粘胶量，在提高原料使用率，降低损耗。而且，钢针针头的尺寸便于进行调节，来提高对锡膏的粘胶量的控制。As shown in Figure 1: the needle transfer needle is a double-layer steel needle head, including the upper plate and the lower plate. The spring buffer can prevent the crystal grain from breaking during the pressing process of the steel needle and reduce the electrical damage to the diode. At the same time, the lower plate and steps can effectively prevent the glue from contaminating the spring, ensuring normal use and improving production efficiency; at the same time, adjusting the distance from the steel needle tip to the lower plate surface to achieve a suitable length can effectively control the amount of glue. Improve raw material utilization rate and reduce loss. Moreover, the size of the steel needle head is easy to adjust, so as to improve the control of the adhesive amount of the solder paste.
与现有技术相比，该二极管高效针转移装片工艺中，采用了矩阵式框架，从而能够提高粘胶的效率，增加了产能，节省人工成本；同时，将针转移针头改为了双层式钢针头，通过弹簧5能够对钢针3下压的过程中，不让晶粒发生破裂，减少了对二极管的电性的影响，同时，调节钢针尖到下板面的距离，以达到合适的长度，能够有效控制粘胶量，在提高原料使用率，降低损耗，而且，钢针针头的尺寸能够进行调节，来提高对锡膏粘胶量的控制。Compared with the existing technology, the diode high-efficiency needle transfer process adopts a matrix frame, which can improve the efficiency of glue, increase production capacity, and save labor costs; at the same time, the needle transfer needle is changed to a double-layer type The steel needle head can press the steel needle 3 through the spring 5, so that the crystal grains are not broken, and the influence on the electrical properties of the diode is reduced. At the same time, the distance from the steel needle tip to the lower plate surface is adjusted to achieve a suitable The length can effectively control the amount of glue, improve the utilization rate of raw materials, reduce loss, and the size of the steel needle can be adjusted to improve the control of the amount of glue in the solder paste.
以上述依据本发明的理想实施例为启示，通过上述的说明内容，相关工作人员完全可以在不偏离本项发明技术思想的范围内，进行多样的变更以及修改。本项发明的技术性范围并不局限于说明书上的内容，必须要根据权利要求范围来确定其技术性范围。Inspired by the above-mentioned ideal embodiment according to the present invention, through the above-mentioned description content, relevant workers can make various changes and modifications within the scope of not departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, but must be determined according to the scope of the claims.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710938691.3A CN107818923B (en) | 2017-09-30 | 2017-09-30 | High-efficiency Needle Transfer Technology for Diodes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710938691.3A CN107818923B (en) | 2017-09-30 | 2017-09-30 | High-efficiency Needle Transfer Technology for Diodes |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107818923A CN107818923A (en) | 2018-03-20 |
| CN107818923B true CN107818923B (en) | 2019-11-08 |
Family
ID=61608013
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710938691.3A Active CN107818923B (en) | 2017-09-30 | 2017-09-30 | High-efficiency Needle Transfer Technology for Diodes |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107818923B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204067374U (en) * | 2014-07-28 | 2014-12-31 | 阳信金鑫电子有限公司 | A kind of high-power high-current diode package structure |
| CN105728260A (en) * | 2014-12-11 | 2016-07-06 | 重庆市合川区华丰包装有限公司 | Paperboard gumming machine |
| CN105762199A (en) * | 2016-05-04 | 2016-07-13 | 滨海治润电子有限公司 | Ultra-thin packaging product of diode and packaging method thereof |
| CN205881879U (en) * | 2016-06-24 | 2017-01-11 | 扬州扬杰电子科技股份有限公司 | SMD semiconductor device production line |
-
2017
- 2017-09-30 CN CN201710938691.3A patent/CN107818923B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204067374U (en) * | 2014-07-28 | 2014-12-31 | 阳信金鑫电子有限公司 | A kind of high-power high-current diode package structure |
| CN105728260A (en) * | 2014-12-11 | 2016-07-06 | 重庆市合川区华丰包装有限公司 | Paperboard gumming machine |
| CN105762199A (en) * | 2016-05-04 | 2016-07-13 | 滨海治润电子有限公司 | Ultra-thin packaging product of diode and packaging method thereof |
| CN205881879U (en) * | 2016-06-24 | 2017-01-11 | 扬州扬杰电子科技股份有限公司 | SMD semiconductor device production line |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107818923A (en) | 2018-03-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204369126U (en) | A kind of novel point support mechanism | |
| CN107818923B (en) | High-efficiency Needle Transfer Technology for Diodes | |
| CN205257497U (en) | A high -speed sign indicating number brick device for on ceramic chip baling line | |
| CN203580228U (en) | Antistatic plastic film heat seal bag making machine | |
| CN104802493A (en) | Bag capsule type pressurized packaging laminating machine | |
| CN204333133U (en) | Lamination device | |
| CN204488221U (en) | A kind of novel printing packaging facilities | |
| CN208470215U (en) | A kind of production packing machine of biological organic fertilizer | |
| CN206691481U (en) | A kind of Novel-sealed machine equipment | |
| CN203076169U (en) | Conveying rail of upper sheet dispenser | |
| CN204237774U (en) | One is fixed takes rice steamer device | |
| CN203245972U (en) | Mica plate forming machine | |
| CN203172122U (en) | Wrapping paper adhesion heating device | |
| CN207736425U (en) | A kind of VHB glue hollow out waste discharge apparatus | |
| CN205602549U (en) | Decorticator conveyer belt | |
| CN107622946B (en) | Automatic anti-stress forming process for surface mount diode | |
| CN208149783U (en) | A kind of Cosmetic Manufacture Plastic packaging apparatus | |
| CN207415171U (en) | A kind of sand paper production waste material recovery device | |
| CN204914561U (en) | Impulse sealer | |
| CN204674926U (en) | A kind of annular conveyor line | |
| CN204848692U (en) | Serialization production controlled release fertilizer diolame equipment | |
| CN105599986A (en) | High-speed tile loading device for ceramic tile packaging line | |
| CN219537406U (en) | A natural cooling conveying device for shredded tobacco at the outlet of a shred dryer | |
| CN207373935U (en) | A kind of efficient print cartridge process units | |
| CN204415871U (en) | A kind of electromagnetic induction capper |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |