CN107785301B - Horizontal adjusting device, pressure ring assembly and semiconductor processing equipment - Google Patents
Horizontal adjusting device, pressure ring assembly and semiconductor processing equipment Download PDFInfo
- Publication number
- CN107785301B CN107785301B CN201610711982.4A CN201610711982A CN107785301B CN 107785301 B CN107785301 B CN 107785301B CN 201610711982 A CN201610711982 A CN 201610711982A CN 107785301 B CN107785301 B CN 107785301B
- Authority
- CN
- China
- Prior art keywords
- pressure ring
- piece
- convex part
- ring assembly
- adjusted
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention provides a horizontal adjusting device, a pressure ring assembly and semiconductor processing equipment. The level adjustment device of the present invention includes a first body and a second body; one of the first body and the second body is provided with a convex part, and the other body is provided with a concave part for accommodating the convex part, wherein the depth of the concave part is less than the height of the convex part, so that the concave part accommodates part of the convex part; the first body is connected with a piece to be regulated; the degree of inclination of the first body relative to the horizontal plane can be changed by sliding the surfaces of the concave part and the convex part which are contacted with each other, so as to adjust the levelness of the member to be adjusted. The horizontal adjusting device provided by the invention can enlarge the adjusting range to a great extent, thereby facilitating the realization of horizontal adjustment. The pressure ring assembly comprises the horizontal adjusting device. The semiconductor processing equipment comprises the pressure ring assembly.
Description
Technical Field
The invention belongs to the technical field of semiconductor equipment, and particularly relates to a horizontal adjusting device, a pressure ring assembly and semiconductor processing equipment.
Background
During semiconductor processing, substrates (particularly SOG substrates) are typically mechanically held. The mechanical fixing mode is as follows: the substrate is supported by a mechanical chuck and is pressed on the edge area of the upper surface of the substrate by a pressure ring, so that the substrate is fixed. In practical application, in order to ensure the cooling effect of back helium on the substrate, a certain helium leakage needs to be ensured, and the compression ring needs to be kept horizontal when the substrate is compressed.
At present, for horizontal adjustment of a pressure ring, a horizontal adjustment device shown in fig. 1a and 1b is generally adopted, and fig. 2 is a schematic structural diagram of a conventional pressure ring assembly, please refer to fig. 1a to 1b and fig. 2 together, the pressure ring assembly includes a pressure ring 1, a counterweight ring 2, a support column 3 and a horizontal adjustment device 4, wherein the pressure ring 1 and the counterweight ring 2 are connected through a plurality of support rods, the counterweight ring 2 is connected with one end of the support column 3, the other end of the support column 3 is connected with the horizontal adjustment device 4, the other end of the horizontal adjustment device 4 is connected with a lifting mechanism 5, and the lifting mechanism 5 is used for driving the whole pressure ring assembly to lift so as to realize that the pressure ring 1 is far away from or close to the; as can be seen from fig. 2, the number of the supporting columns 3 is 3, the supporting columns are arranged at intervals in the circumferential direction of the counterweight ring 2 to stably support the counterweight ring 2, correspondingly, the number of the horizontal adjusting devices 4 is also 3, the horizontal adjusting devices 4 correspond to the supporting columns 3 one by one, and the 3 horizontal adjusting devices 4 need to be adjusted respectively to ensure the horizontality of the compression ring 1; in addition, the other ends of the 3 level adjusting devices 4 are connected with the same lifting mechanism 5.
As shown in fig. 1a and 1b, the horizontal adjustment device 4 includes a body 41, a top thread 42, a first screw 43 and a second screw 44, wherein two ends of the body 41 are respectively connected to the support column 3 and the lifting mechanism 5, the thickness of the middle region of the body 41 is smaller than that of the two end regions, the two end regions are made of deformable materials, the first screw 43 is correspondingly arranged near one end of the lifting mechanism 5 and fixed with the lifting mechanism 5, the top thread 42 and the second screw 44 are correspondingly arranged near one end of the support column 3, one end of the top thread 42 penetrates through the thickness of the opposite region of the lifting mechanism 5 and contacts with the body 41, and the second screw 44 is fixed on the lifting mechanism 5; through adjusting the second screw 44 that the jackscrew 42 upwards pushed up and matched with it, the middle area of body 41 receives corresponding deformation to the one end of body 41 at jackscrew 42 place can produce certain inclination and change, also can change support column 3 in vertical direction, consequently, can realize the level (l) ing to clamping ring 1
The following problems are found in practical use with the level adjustment device 4 described above:
first, since the main body 41 supports the compression ring 1, the weight ring 2, the support 3, and the like, the deformation material region of the main body 41 is subjected to a certain load, and the deformation material region cannot be too thin in consideration of the strength of the parts, which results in a small allowable deformation amount of the deformation material region of the main body 41, and thus, an end of the main body 41 where the jack screw 42 is located may be inclined by a small deformation amount, resulting in a small adjustment range of the horizontal adjustment.
Secondly, since the main body 41 is supported above, the jack 42 must be provided below the main body 41, and therefore, when the pressing ring 1 is adjusted to be horizontal, the inverted screwdriver is difficult to operate compared with the upright screwdriver because the jack 42 and the second screw 44 are adjusted by the inverted screwdriver.
Disclosure of Invention
The invention aims to at least solve one technical problem in the prior art, and provides a horizontal adjusting device, a pressure ring assembly and semiconductor processing equipment.
In order to solve one of the above problems, the present invention provides a leveling device, including a first body and a second body; one of the first body and the second body is provided with a convex part, and the other body is provided with a concave part, wherein the depth of the concave part is smaller than the height of the convex part, so that the concave part can accommodate part of the convex part; the first body is connected with a piece to be regulated; the degree of inclination of the first body relative to the horizontal plane can be changed through the surface sliding of the concave part and the convex part, so that the levelness of the to-be-adjusted piece can be adjusted.
Preferably, the adjusting device further comprises a first fixing piece, and the first fixing piece and the to-be-adjusted piece are respectively arranged on two sides of the concave part or the convex part on the first body; the first fixing piece is used for fixing the first body and the second body.
Preferably, the adjusting device further comprises a second fixing piece, wherein the second fixing piece is arranged between the concave part or the convex part on the first body and the position of the piece to be adjusted; the second fixing piece is used for fixing the first body and the second body.
Preferably, the surfaces of the concave part and the convex part which are contacted with each other are all arc surfaces.
Preferably, the arc surface of the concave part and the arc surface of the convex part are completely attached.
Preferably, a direction in which a connecting line of the preset position of the first fixing piece and the preset position of the second fixing piece is located is defined as a length direction, and a direction perpendicular to the length direction on the upper surface of the first body is defined as a width direction; the width of the concave part is equal to the width of the first body or the second body where the concave part is located; the width of the convex part is equal to the width of the first body or the second body where the convex part is located; the width of the concave part and the convex part is equal.
Preferably, at least one of the first fixing member and the second fixing member is a screw.
The invention also provides a pressure ring assembly which comprises a horizontal adjusting device and a pressure ring, wherein the horizontal adjusting device is used for adjusting the levelness of the pressure ring, and the horizontal adjusting device adopts the horizontal adjusting device provided by the invention.
Preferably, the device further comprises a plurality of first supporting columns, and the number of the horizontal adjusting devices is multiple and corresponds to that of the first supporting columns one by one; the first support columns are arranged at intervals along the circumferential direction of the pressure ring and used for supporting the pressure ring; the first body of each horizontal adjusting device is connected with the corresponding first support column.
Preferably, the device further comprises a counterweight ring, and the counterweight ring is coaxially arranged with the pressure ring; each first support column comprises a first sub-support column and a second sub-support column; the first sub-supporting column is fixed on the lower surface of the counterweight ring and is connected with the first body of the horizontal adjusting device corresponding to the first sub-supporting column; the first sub-supporting column is used for supporting the counterweight ring; the second sub-supporting column is fixed between the upper surface of the counterweight ring and the lower surface of the pressure ring; the second sub-supporting columns are used for supporting the compression ring.
The invention also provides semiconductor processing equipment which comprises a pressure ring assembly and a chuck, wherein the chuck is used for bearing the substrate, the pressure ring assembly is used for laminating the edge area of the substrate, and the pressure ring assembly adopts the pressure ring assembly provided by the invention.
The invention has the following beneficial effects:
according to the horizontal adjusting device provided by the invention, as the depth of the concave part is smaller than the height of the convex part, a certain distance exists between the first body and the second body when the first body and the second body are horizontally arranged, so that a certain space foundation is provided for the first body connected with the adjusted piece to be inclined, on the basis, the inclination degree of the first body relative to the horizontal plane can be changed through the surface sliding of the contact part of the concave part and the convex part, and thus, the height of the adjusted piece connected with the first body in the vertical direction is also changed, and the levelness of the adjusted piece can be adjusted. The invention has the following advantages: for one, in the present invention, the adjustment range is related to the inclination angle of the first body, and the inclination angle is related to the difference between the depth of the concave portion and the height of the convex portion (for example, if the adjustment range is increased, the difference may be increased, and if the adjustment range is decreased, the difference may be decreased), which can be achieved by setting the difference according to the size of the required adjustment range, which can greatly increase the adjustment range compared to the prior art in which the adjustment range is limited by the deformation range of the deformable material. Secondly, the first fixing piece is used for fixing and does not limit the arrangement position, so that the first fixing piece can be arranged in a mode of operating right above the first fixing piece, inverted operation is not needed, the adjustment process is easy to operate, and horizontal adjustment is convenient to achieve.
According to the pressure ring assembly provided by the embodiment of the invention, the horizontal adjusting device is adopted, so that the pressure ring can be horizontally laminated on the edge of the substrate as far as possible, certain helium leakage can be ensured, and the process quality can be improved.
According to the semiconductor processing equipment provided by the invention, the crystal pressing ring assembly provided by the invention is adopted, so that the process quality can be improved.
Drawings
FIG. 1a is a cross-sectional view of a prior art level adjustment mechanism;
FIG. 1b is a perspective view of a prior art leveling device;
FIG. 2 is a schematic structural view of a prior art press ring assembly;
FIG. 3a is a front view of a leveling device provided by an embodiment of the present invention;
FIG. 3b is a cross-sectional view of the level adjustment mechanism shown in FIG. 3 a;
FIG. 4a is a perspective view of the second body of FIG. 3 a;
FIG. 4b is a front view of the second body of FIG. 3 a;
FIG. 4c is a top view of the second body of FIG. 3 a;
FIG. 5a is a perspective view of the first body of FIG. 3 a;
FIG. 5b is a front view of the first body of FIG. 3 a;
FIG. 5c is a top view of the first body of FIG. 3 a;
FIG. 6a is a front view of another horizontal adjustment device provided by an embodiment of the present invention;
fig. 6b is a cross-sectional view of the level adjustment device shown in fig. 6 a.
The reference numerals include: a pressure ring 1; a counterweight ring 2; a support column 3; a level adjustment device 4; a lifting mechanism 5; a body 41; a top thread 42; a first screw 43; a second screw 44; a first body 10; a second body 11; a first fixing member 12; a second fixing member 13; a recess 100; a convex portion 110; depth H1 of the recess; height H2 of the projection; a connecting member 101; a support column 20; a screw hole 121; a screw hole 131; a length direction X; the width direction Y.
Detailed Description
In order to make those skilled in the art better understand the technical solution of the present invention, the level adjustment device, the pressure ring assembly and the semiconductor processing apparatus provided by the present invention are described in detail below with reference to the accompanying drawings.
Example 1
Referring to fig. 3a to 5b, a horizontal adjustment device according to an embodiment of the present invention includes a first body 10 and a second body 11. Wherein the first body 10 is provided with a recess 100 and the second body 11 is provided with a protrusion 110, the depth H1 of the recess 100 being smaller than the height H2 of the protrusion 110, such that the recess 100 receives part of the protrusion 110, as shown in fig. 3a and 3 b. The first body 10 is connected to a member to be adjusted (not shown in the figures, for example, a pressure ring), and as shown in fig. 3a, the first body 10 is connected to a support column 20, and the support column 20 is used for supporting the pressure ring (i.e., the member to be adjusted). The degree of inclination of the first body 10 with respect to the horizontal plane may be varied by the surface sliding of the contact of the concave portion 100 and the convex portion 110.
It can be understood that, since the depth H1 of the concave portion 100 is smaller than the height H2 of the convex portion 110, there is a certain distance between the first body 10 and the second body 11 when they are horizontally disposed, so that a certain space base is provided for the first body 10 connected with the adjusted member to be tiltable, on which the degree of tilt of the first body 10 with respect to the horizontal plane can be changed by the surface sliding of the concave portion 100 and the convex portion 110 in contact, so that the height of the adjusted member connected with the first body 10 in the vertical direction is also changed, thereby adjusting the levelness of the adjusted member.
The invention has the following advantages: for one, in the present invention, the adjustment range is related to the inclination angle of the first body, and the inclination angle is related to the difference between the depth of the concave portion and the height of the convex portion (for example, if the adjustment range is increased, the difference may be increased, and if the adjustment range is decreased, the difference may be decreased), which can be achieved by setting the difference according to the size of the required adjustment range, which can greatly increase the adjustment range compared to the prior art in which the adjustment range is limited by the deformation range of the deformable material.
Secondly, the first fixing piece is used for fixing and does not limit the arrangement position, so that the first fixing piece can be arranged in a mode of operating right above the first fixing piece, inverted operation is not needed, the adjustment process is easy to operate, and horizontal adjustment is convenient to achieve.
Preferably, as shown in fig. 3a, the horizontal adjusting device provided by the present invention further comprises a first fixing member 12, wherein the first fixing member 12 and the member to be adjusted are respectively disposed at both sides of the recess 100 on the first body 10; the first fixing member 12 is used to fix the first body 10 and the second body 11. With the level adjusting device of this structure, the first body 10 and the second body 11 can be fixed by the first fixing member 12 after the first body 10 maintains a certain inclination, so as to stably maintain the levelness of the pressure ring.
Specifically, in the present embodiment, the first fixing member 12 may be, but is not limited to, a screw member, for example, a screw, and a screw hole 121 for fitting the screw is provided on the first body 10 and the second body 11. In this case, the inclination angle of the first body 10 can be adjusted by tightening and loosening the first fixing member 12 with a screwdriver. Of course, in practical applications, the first body 10 may be inclined to a certain angle by other means, and then the first fixing member 12 may be used to fix the first body 10 and the second body 11.
Further preferably, as shown in fig. 3a, the level adjustment device provided by the present invention further includes a second fixing member 13, the second fixing member 13 is disposed between the concave portion 100 on the first body 10 and the position of the member to be adjusted, the second fixing member 13 is used for fixing the first body 10 and the second body 11, so that, on the basis that the first fixing member 12 fixes the first body 10 at a certain inclination angle, and the second fixing member 13 fixes the first body 10 and the second body 11, the first body 10 can be further fixed to prevent it from being influenced by other external forces, and therefore, the levelness of the press ring can be further stably maintained.
The second fixing member 13 may be, but is not limited to, a screw member, such as a screw, and a screw hole 131 for fitting the screw is provided on the first body 10 and the second body 11.
In the case of the first fixing member 12 and the second fixing member 13, the adjusting process of the present invention may be: a, unscrewing the first fixing piece 12, and then screwing the second fixing piece 13, so that the downward left end of the right end of the first body 10 is upward, and thus, the height of a press ring supported by the support pillar 20 is reduced; and b, loosening the second fixing piece 13, and then screwing the first fixing piece 12, so that the downward right end of the left end of the first body 10 is upward, and the height of the pressing ring supported by the supporting column 20 is increased.
Preferably, in the present embodiment, the surface of the concave portion 100 contacting the convex portion 110 is a circular arc surface, as shown in fig. 4a and 5 a. In this case, during the adjustment of the inclination angle of the first body 10, the arc surface of the concave portion 100 and the arc surface of the convex portion 110 slide relatively, so that the adjustment process is convenient and feasible.
It is further preferred that the arcuate surface of the concave portion 100 and the arcuate surface of the convex portion 110 completely conform, as shown in fig. 3a and 3b, so as to facilitate relative sliding movement of the concave portion 100 and the convex portion 110.
In addition, the convex portion 110 may also be a pyramid, a triangular pyramid, or other irregular shapes, and the technical solution of the present invention is to extend the protection as long as the concave portion 100 can move relative to the convex portion 110.
Specifically, referring to fig. 4a to 5c, a direction of a connection line between a preset position (a position where the screw hole 121 is located) of the first fixing member 12 and a preset position (a position where the screw hole 131 is located) of the second fixing member 13 is defined as a length direction X, and a direction perpendicular to the length direction X on the upper surface of the first body 10 is defined as a width direction Y; the width of the recess 100 is equal to the width of the first body 10 in which it is located; the width of the convex part 110 is equal to that of the second body 11; the widths of the concave portion 100 and the convex portion 110 are equal. The horizontal adjusting device adopting the structure has a simple structure and is convenient to produce.
As shown in fig. 3a to 5c, one end of the first body 10 connected with the member to be adjusted is provided with a connecting member 101; the outer surface of connecting piece 101 is the arc surface for the arc surface is used for supporting treat the regulating part and when first body 10 inclines the arc surface with treat that the regulating part slides each other, for example, in fig. 3a, if the high left end of the right-hand member of first body 10 is low, then can drive support column 20 horizontal migration to the left end, and slide each other with the help of arc surface and support column 20, like this, can avoid making and treat that the regulating part takes place horizontal position and remove, also avoid the additional influence that produces.
Preferably, the number of the connecting members 101 is plural, as shown in fig. 4a and 5a, and the number is 2, and the plural connecting members 101 simultaneously support the member to be adjusted, so that the belt adjusting member can be stably supported.
Example 2
Referring to fig. 6a and 6b, the horizontal adjusting device provided in the embodiment of the present invention is similar to the horizontal adjusting device provided in embodiment 1, and also includes a first body 10, a second body 11, a first fixing member 12 and a second fixing member 13, since the structures, the positional relationships and the connection relationships of the first body 10, the second body 11, the first fixing member 12 and the second fixing member 13 have been described in detail in embodiment 1, they are not described again.
Only the differences between the present embodiment and embodiment 1 described above will be described below. Specifically, the first body 10 is provided with a convex portion 110, and the second body 11 is provided with a concave portion 100.
In the present embodiment, the first fixing member 12 and the member to be adjusted are respectively disposed on both sides of the convex portion 110 on the first body 10; the second fixing piece 13 is arranged between the convex part 110 on the first body 10 and the position of the piece to be adjusted; the width of the recess 100 is equal to the width of the second body 11 in which it is located; the width of the convex part 110 is equal to that of the first body 10 where the convex part is located; the widths of the concave portion 100 and the convex portion 110 are equal.
Example 3
The embodiment of the invention also provides a pressure ring assembly which comprises a horizontal adjusting device and a pressure ring, wherein the horizontal adjusting device is used for adjusting the levelness of the pressure ring, and the horizontal adjusting device adopts the horizontal adjusting devices provided by the embodiments 1 and 2.
According to the pressure ring assembly provided by the embodiment of the invention, because the horizontal adjusting device is provided in the embodiment 1 and the embodiment 2, the pressure ring can be horizontally laminated on the edge of the substrate as far as possible, so that a certain helium leakage can be ensured, and the process quality can be improved.
Specifically, the pressure ring assembly further comprises a plurality of first support columns, and the horizontal adjusting devices are multiple and correspond to the first support columns one by one; the first support columns are arranged at intervals along the circumferential direction of the pressure ring and used for supporting the pressure ring; the first body of each horizontal adjusting device is connected with the corresponding first supporting column.
Preferably, the second bodies of the plurality of level adjusters are of a unitary structure.
Further preferably, the second body is also used for connecting with a lifting mechanism; the lifting mechanism is used for driving the second body to lift so as to drive the pressing ring to lift, and therefore the pressing ring faces towards or is far away from the substrate.
In addition, it is also preferable that the pressure ring assembly further includes a weight ring, and the weight ring is disposed coaxially with the pressure ring; each first support column comprises a first sub-support column and a second sub-support column; the first sub-supporting column is fixed on the lower surface of the counterweight ring and is connected with the first body of the horizontal adjusting device corresponding to the first sub-supporting column; the first sub-supporting column is used for supporting the counterweight ring; the second sub-supporting column is fixed between the upper surface of the counterweight ring and the lower surface of the pressure ring; the second sub-support columns are used for supporting the compression ring. When the compression ring compresses the substrate, the pressure on the substrate can be adjusted by increasing or decreasing the number of the counterweight rings, so that the helium leakage can be adjusted.
In particular, the second support column may be a bellows linear bearing, which is generally fixed to the bottom of the chamber by a flange, thereby enabling the pressure ring to be lifted in a vacuum environment.
Example 4
The embodiment of the invention also provides semiconductor processing equipment which comprises a pressure ring assembly and a chuck, wherein the chuck is used for bearing the substrate, the pressure ring assembly is used for laminating the edge area of the substrate, and the pressure ring assembly adopts the pressure ring assembly provided by the embodiment 3.
According to the pressure ring assembly provided by the embodiment of the invention, the pressure ring assembly provided by the embodiment 2 is adopted, so that the process quality can be improved.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (11)
1. A leveling device, comprising a first body and a second body;
one of the first body and the second body is provided with a convex part, the other one of the first body and the second body is provided with a concave part, the convex part and the concave part are both in a strip shape and extend along the width direction of the first body or the second body, and the depth of the concave part is smaller than the height of the convex part, so that the concave part can accommodate part of the convex part;
the first body is connected with a piece to be regulated; one end of the first body, which is connected with the piece to be adjusted, is provided with a connecting piece; the outer surface of the connecting piece is an arc surface and is used for supporting the piece to be adjusted, and when the first body inclines, the arc surface and the piece to be adjusted slide mutually;
the degree of inclination of the first body relative to the horizontal plane can be changed through the surface sliding of the concave part and the convex part, so that the levelness of the to-be-adjusted piece can be adjusted.
2. The horizontal adjustment device of claim 1, further comprising a first fixing member, wherein the first fixing member and the member to be adjusted are respectively provided on both sides of the concave portion or the convex portion on the first body;
the first fixing piece is used for fixing the first body and the second body.
3. The level adjustment device of claim 2, further comprising a second fixing member,
the second fixing piece is arranged between the concave part or the convex part on the first body and the position of the piece to be regulated;
the second fixing piece is used for fixing the first body and the second body.
4. The leveling device according to claim 1, wherein the surfaces of the concave portion and the convex portion which contact each other are circular arc surfaces.
5. The leveling device of claim 4, wherein the arcuate surface of the concave portion and the arcuate surface of the convex portion fully conform.
6. The horizontal adjusting device of claim 3, wherein a direction defining a connection line between the preset position of the first fixing member and the preset position of the second fixing member is a length direction, and a direction perpendicular to the length direction on the upper surface of the first body is a width direction;
the width of the concave part is equal to the width of the first body or the second body where the concave part is located;
the width of the convex part is equal to the width of the first body or the second body where the convex part is located;
the width of the concave part and the convex part is equal.
7. The leveling device of claim 3, wherein at least one of the first and second fixtures is a threaded member.
8. A compression ring assembly, comprising a level adjustment device and a compression ring, wherein the level adjustment device is used for adjusting the levelness of the compression ring, and the level adjustment device adopts the level adjustment device of any one of claims 1 to 7.
9. The pressure ring assembly according to claim 8, further comprising a plurality of first support columns, wherein the number of the horizontal adjusting devices is multiple and corresponds to one of the first support columns;
the first support columns are arranged at intervals along the circumferential direction of the pressure ring and used for supporting the pressure ring;
the first body of each horizontal adjusting device is connected with the corresponding first support column.
10. A pressure ring assembly according to claim 9, further comprising a counterweight ring disposed coaxially with the pressure ring;
each first support column comprises a first sub-support column and a second sub-support column;
the first sub-supporting column is fixed on the lower surface of the counterweight ring and is connected with the first body of the horizontal adjusting device corresponding to the first sub-supporting column;
the first sub-supporting column is used for supporting the counterweight ring;
the second sub-supporting column is fixed between the upper surface of the counterweight ring and the lower surface of the pressure ring;
the second sub-supporting columns are used for supporting the compression ring.
11. A semiconductor processing apparatus comprising a chuck for carrying a substrate and a pressure ring assembly for laminating an edge region of the substrate, wherein the pressure ring assembly comprises a pressure ring assembly according to any one of claims 8 to 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610711982.4A CN107785301B (en) | 2016-08-24 | 2016-08-24 | Horizontal adjusting device, pressure ring assembly and semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610711982.4A CN107785301B (en) | 2016-08-24 | 2016-08-24 | Horizontal adjusting device, pressure ring assembly and semiconductor processing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN107785301A CN107785301A (en) | 2018-03-09 |
| CN107785301B true CN107785301B (en) | 2020-08-21 |
Family
ID=61387883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610711982.4A Active CN107785301B (en) | 2016-08-24 | 2016-08-24 | Horizontal adjusting device, pressure ring assembly and semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107785301B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108361502A (en) * | 2018-04-20 | 2018-08-03 | 深圳市晶向科技有限公司 | The camera calibration apparatus and method of glass cutting machine |
| CN113291813B (en) | 2020-02-21 | 2022-05-27 | 长鑫存储技术有限公司 | Wafer processing system, semiconductor machine automatic leveling device and leveling method thereof |
| CN112802784A (en) * | 2021-02-01 | 2021-05-14 | 中环领先半导体材料有限公司 | Novel temporary storage table of silicon wafer edge removing machine |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102141741A (en) * | 2011-04-15 | 2011-08-03 | 中国科学院长春光学精密机械与物理研究所 | Micro leveling mechanism of projection objective of lithography machine |
| CN105390430A (en) * | 2014-09-09 | 2016-03-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Press-ring compression mechanism |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0766125A (en) * | 1993-08-30 | 1995-03-10 | Sony Corp | Reduced pressure processing system |
| CN102636890A (en) * | 2012-04-11 | 2012-08-15 | 南京理工大学常熟研究院有限公司 | Structure with adjustable parallelism |
| CN104576469A (en) * | 2013-10-14 | 2015-04-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Levelness adjusting structure, lifting device and cavity |
-
2016
- 2016-08-24 CN CN201610711982.4A patent/CN107785301B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102141741A (en) * | 2011-04-15 | 2011-08-03 | 中国科学院长春光学精密机械与物理研究所 | Micro leveling mechanism of projection objective of lithography machine |
| CN105390430A (en) * | 2014-09-09 | 2016-03-09 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Press-ring compression mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| CN107785301A (en) | 2018-03-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101276650B (en) | Height regulating device and display device using the same | |
| CN107785301B (en) | Horizontal adjusting device, pressure ring assembly and semiconductor processing equipment | |
| US20040035994A1 (en) | Display apparatus | |
| KR101561148B1 (en) | Split type aerostatic bearing | |
| KR20130036154A (en) | Sticking apparatus | |
| CN112048715B (en) | Leveling mechanism, reaction chamber and semiconductor processing equipment | |
| CN210126054U (en) | Mobile station for inspection device | |
| CN111326438B (en) | Leveling device and reaction chamber | |
| US20170221747A1 (en) | Pin structure, method for operating the same, and supporting device containing the same | |
| KR101296104B1 (en) | Base materials for grinding of a large size electrostatic chuck seating display boards | |
| CN105140169B (en) | A kind of support construction and vacuum equipment | |
| KR102512208B1 (en) | laser processing apparatus | |
| CN218333740U (en) | Wafer supporting mechanism and semiconductor processing equipment | |
| KR20160033271A (en) | Pin JIG for preventing drop of welding portion | |
| JP2004138878A (en) | Planar stage apparatus | |
| KR102095991B1 (en) | Substrate processing apparatus | |
| CN116288224A (en) | Sheet supporting device and plasma equipment | |
| JP7329996B2 (en) | Substrate holder | |
| KR20190014262A (en) | Apparatus for Bending Flexible Substrate | |
| KR101212941B1 (en) | Flexible shower head | |
| CN219526778U (en) | Sheet supporting device and plasma equipment | |
| KR101496175B1 (en) | Base materials for grinding of a large size electrostatic chuck seating display boards | |
| KR102500583B1 (en) | Level control device of vibration plate used in substrate treating system | |
| KR101326727B1 (en) | Base materials for grinding of a large size electrostatic chuck seating display boards | |
| KR102102922B1 (en) | Substrate processing apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |