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CN107750026A - Head earphone - Google Patents

Head earphone Download PDF

Info

Publication number
CN107750026A
CN107750026A CN201711051270.5A CN201711051270A CN107750026A CN 107750026 A CN107750026 A CN 107750026A CN 201711051270 A CN201711051270 A CN 201711051270A CN 107750026 A CN107750026 A CN 107750026A
Authority
CN
China
Prior art keywords
housing
absorption cotton
sound absorption
sound
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201711051270.5A
Other languages
Chinese (zh)
Inventor
杨都
谢小静
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Jiangxi Lianchuang Electroacoustics Co ltd
Original Assignee
Jiangxi Lianchuang Electroacoustics Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jiangxi Lianchuang Electroacoustics Co ltd filed Critical Jiangxi Lianchuang Electroacoustics Co ltd
Priority to CN201711051270.5A priority Critical patent/CN107750026A/en
Publication of CN107750026A publication Critical patent/CN107750026A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R1/00Details of transducers, loudspeakers or microphones
    • H04R1/10Earpieces; Attachments therefor ; Earphones; Monophonic headphones
    • H04R1/1083Reduction of ambient noise
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2201/00Details of transducers, loudspeakers or microphones covered by H04R1/00 but not provided for in any of its subgroups
    • H04R2201/10Details of earpieces, attachments therefor, earphones or monophonic headphones covered by H04R1/10 but not provided for in any of its subgroups

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  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Headphones And Earphones (AREA)

Abstract

The invention provides a headset, which comprises two ear muffs and a head hoop connected with the two ear muffs, wherein each ear muff comprises a shell, an ear pad, sound absorption cotton and a sound pick-up, the ear pad is arranged on the surface of one outer side of the shell, the sound absorption cotton is arranged in a cavity of the shell, the free area of the cavity is filled with the sound absorption cotton, a layer of rubber pad is coated on the outer side wall of the sound pick-up, and the sound pick-up is fixedly arranged on the shell through the rubber pad. In the headset, the sound absorption cotton is arranged in the cavity of the shell, and the shape and the size of the free space of the cavity of the shell are extracted to be used as the appearance parameters of the sound absorption cotton, so that all the free areas of the cavity of the shell can be filled with the sound absorption cotton, the sound absorption cotton can absorb noise in all directions, the passive noise reduction effect is good, in addition, the vibration transmission among parts is reduced through the rubber pad, the ear pad is arranged to be in close contact with the auricle of a wearer, and the passive noise reduction effect is further improved.

Description

Headphone
Technical field
The present invention relates to loudspeaker technical field, more particularly to a kind of headphone.
Background technology
With the fast development of high-tech electronics product and the continuous popularization of mobile communication product, earphone is as these products A kind of indispensable accessory, is also widely used therewith.With continuous improvement of the people to life requirement, consumer couple The requirement of earphone also more and more higher, except to there is stable communication quality, it can also isolate not under noisy or even high environment of making an uproar The noise that needs and carry out normal liaison, this requires to need to carry out noise reduction process to earphone.
Earphone in the market can be classified as wear-type and ear type according to wearing mode to divide, headphone Noise reduction mode mainly has:Carry out physics noise reduction (also referred to as passive noise reduction) using acoustic material and had using electronic circuit Two kinds of source noise reduction (also referred to as active noise reduction), but taken for the source of making an uproar of the types such as some pulses, shock wave, active noise reduction less than drop Make an uproar effect, physics noise reduction can only be used, therefore physics noise reduction is particularly important.
Among prior art, the headphone used at present is generally only that simple rubber blanket is set at body clearance To carry out physics noise reduction, passive noise reduction is poor, and at most the noise within 25dB can only be isolated, and can not meet to use and want Ask.
The content of the invention
Based on this, it is an object of the invention to provide a kind of headphone of passive excellent noise reduction effect.
A kind of headphone, including head hoop and two earmuffs, two earmuffs connect through the head hoop, the earmuff Including housing, ear pad, sound absorption cotton and sound pick-up, on an outer surface of the housing, the sound absorption cotton sets the ear pad In in the cavity of the housing, and the clear area of the cavity is by the sound absorption cotton filling, the lateral wall of the sound pick-up On be coated with one layer of rubber blanket, the sound pick-up is fixedly arranged on the housing by the rubber blanket.
Above-mentioned headphone, by setting the sound absorption cotton in the housing hollow, increase the housing hollow Acoustical absorptivity, and the shape and size for extracting the free space of the housing hollow be used as it is described sound absorption cotton outer parameter Number, so that all clear areas of the housing hollow can be filled up by the sound absorption cotton so that the sound absorption cotton can be complete Orientation absorption of noise, noise is prevented to be transmitted to the ear of wearer, passive excellent noise reduction effect.In addition, by the rubber blanket come The sound pick-up is installed, avoids being rigidly connected, reduces the vibration transmission between parts, while by setting on the housing The ear pad, the ear pad will be in close contact with the auricle of wearer, further improve passive noise reduction.
Further, the thickness of the housing is located at 3mm between 4mm, and the housing is made by PC materials.
Further, the earmuff also includes a circuit board, and the housing includes interior side body and outside housing, described interior Side body and the outside housing are fastened and connected, and to form the cavity, the circuit board is connected to the interior side body and institute Between stating sound absorption cotton, the sound pick-up is fixedly arranged on the outer surface of the outside housing, the sound pick-up and circuit board electricity Property connection.
Further, the earmuff also includes a loudspeaker, and the loudspeaker is fixedly arranged on the inner surface of the outside housing On, the loudspeaker is electrically connected with the circuit board.
Further, the circuit board is provided with the first sender, and the sound absorption cotton is provided with the second sender, and described the One sender and second sender are positioned opposite, and the loudspeaker is housed in two sender.
Further, the interior side body is in tabular, and its middle part is provided with a through hole, the through hole and described second Sender connects, and the ear pad is surrounded on the periphery of the through hole on the outer surface of the interior side body, the ear Pad is made by memory foam material.
Further, the sound pick-up is arranged diagonally downward, and angle of inclination is located at 30 ° to 60 °, the suction of the sound absorption cotton Sonic system number is 0.99.
Further, the circuit board and the sound absorption cotton are connected through a screw thread structure and are fixedly arranged on the outside housing, The screw connection structure includes some screws and is fixedly arranged on the inner surface of the outside housing and some convex containing screwed hole Post, each screw sequentially passes through the circuit board and the sound absorption cotton, and spinning is in the screwed hole of a projection On.
Further, the outside housing is provided with a rubber ring with the position that the interior side body is fastened and connected.
Further, the head hoop includes regulation section and two linkage sections located at the regulation section both ends, the connection Section includes the first pivot joint block and connecting rod, and the connecting rod is in " C " shape, one end of the connecting rod and the end of the regulation section Connection, the other end of the connecting rod are installed with the second pivot joint block, and first pivot joint block is fixedly arranged on the end of the regulation section On, the connecting rod is located at the periphery of the housing, and the housing is articulated in first pivot joint block and second pivot joint Between block.
Brief description of the drawings
Fig. 1 is the stereogram of the headphone in first embodiment of the invention;
Fig. 2 is the stereogram of another angle of the headphone in first embodiment of the invention;
Fig. 3 is the three-dimensional exploded view of the earmuff in first embodiment of the invention.
Main element symbol description:
Earmuff 10 Head hoop 20
Housing 11 Ear pad 12
Absorb sound cotton 13 Sound pick-up 14
Circuit board 15 Loudspeaker 16
Interior side body 111 Outside housing 112
Cavity 113 Through hole 1111
Rubber blanket 141 Projection 1
First sender 151 Second sender 131
Adjust section 21 Linkage section 22
First pivot joint block 221 Connecting rod 222
Second pivot joint block 2221
Following embodiment will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
For the ease of understanding the present invention, the present invention is described more fully below with reference to relevant drawings.In accompanying drawing Give some embodiments of the present invention.But the present invention can realize in many different forms, however it is not limited to this paper institutes The embodiment of description.On the contrary, the purpose for providing these embodiments is made to the disclosure more thorough and comprehensive.
It should be noted that when element is referred to as " being fixedly arranged on " another element, it can be directly on another element Or there may also be element placed in the middle.When an element is considered as " connection " another element, it can be directly connected to To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ", " right side " and similar statement are for illustrative purposes only.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention The implication that technical staff is generally understood that is identical.Term used in the description of the invention herein is intended merely to description tool The purpose of the embodiment of body, it is not intended that in the limitation present invention.Term as used herein " and/or " include one or more phases The arbitrary and all combination of the Listed Items of pass.
Refer to Fig. 1 to Fig. 3, the headphone showing in first embodiment of the invention, including two earmuffs 10 and One head hoop 20, two earmuffs 10 connect through the head hoop 20.
The earmuff includes housing 11, ear pad 12, sound absorption cotton 13, sound pick-up 14, circuit board 15 and loudspeaker 16.
Wherein, the housing 11 includes interior side body 111 and outside housing 112, the interior side body 111 and the outside Housing 112 is fastened and connected, and to form a cavity 113, the interior side body 111 is in tabular, and its middle part is provided with a through hole 1111, while the outside housing 112 is provided with a rubber ring with the position that the interior side body 111 is fastened and connected and (schemed not Show), to avoid vibration from transmitting.When wearer wears the headphone, head of the interior side body 111 towards wearer Portion, the outside housing 112 is then outwardly.
Specifically, the thickness of the housing 11 is 4mm, and the housing 11 is made by PC materials.It should be understood that In the case of meeting case weight, shaping and requirement, the density of case material is bigger, thickness of shell is bigger and housing on open Hole area is smaller, then the defening effect of housing is better, therefore among the present embodiment, chooses PC materials as the housing 11 Moulding material, while the thickness of the housing 11 is set as 4mm (thickness of shell of existing earmuff is usually 2mm), with full Under sufficient requirements, the defening effect of the housing 11 is improved as far as possible.In addition, among other embodiments, the housing 11 Thickness can also be 3mm to the arbitrary value between 4mm.
Wherein, in a ring, the ear pad 12 is surround the ear pad 12 on the outer surface of the interior side body 111 In the periphery of the through hole 1111, the ear pad 12 is made by memory foam material, so that the ear pad 12 can be with The sufficiently sealed contact of auricle of wearer, prevents noise from entering human ear.
Wherein, the sound absorption cotton 13 is in the cavity 113, and the clear area of the cavity 113 is by the suction Sound cotton 13 is filled, and the clear area of the cavity 113 is remaining unappropriated space after all components of installation.
In the specific implementation, the shape and size that can extract the clear area of the cavity 113 are used as the sound absorption The formal parameter of cotton 13, the sound absorption cotton 13 then is being made to mold according to the formal parameter, so that the sound absorption energy of cotton 13 Enough fill all clear areas of the cavity 113.
In addition, the acoustic absorptivity of the sound absorption cotton 13 is 0.99, it can be made by nanometer sound-absorbing material.
One layer of rubber blanket 141 is coated with the lateral wall of the sound pick-up 14, the sound pick-up 14 passes through the rubber blanket 141 are fixedly arranged on the outer surface of the outside housing 112.
In the specific implementation, one can be opened up on the outer surface of the outside housing 112 through the outside housing 112 Mounting hole, then the rubber blanket 141 is nested on the lateral wall of the sound pick-up 14, it is then that the rubber blanket 141 is close Envelope is arranged in the mounting hole.
In addition, the sound pick-up 13 is arranged diagonally downward, and angle of inclination (with horizontal sextant angle) is 45 °, in other implementations Among example, the angle of the sound pick-up 13 diagonally downward can also be the arbitrary value between 30 ° to 60 °.
Wherein, the circuit board 15 is connected between the interior side body 111 and the sound absorption cotton 13, the loudspeaker 16 It is fixedly arranged on the inner surface of the outside housing 112.The sound pick-up 13 is electrically connected with the circuit board 15, the loudspeaker 14 are also electrically connected with the circuit board 15, and the voice data that the sound pick-up 13 gathers will be converted into sound by the circuit board 15 Frequency analog signal, then played again through the loudspeaker 14.
Specifically, the circuit board 15 and the sound absorption cotton 13 are connected through a screw thread structure and are fixedly arranged on the outside housing On, the screw connection structure includes some screw (not shown) and is fixedly arranged on the inner surface of the outside housing and contains screw thread Some projections 1 in hole, each screw sequentially passes through the circuit board 15 and the sound absorption cotton 13, and spinning is in an institute On the screwed hole for stating projection 1, the circuit board 15 and the sound absorption cotton 13 are fixed.
In addition, the circuit board 15 is provided with the first sender 151, the sound absorption cotton 13 is provided with the second sender 131, First sender 151 and second sender 131 are positioned opposite, first sender 151 and the through hole 1111 connections, the loudspeaker 16 are housed in two sender 131, so that the sound that the loudspeaker 16 plays passes through successively Human ear is passed to after crossing two sender 131, first sender 151 and the through hole 1111.
The head hoop 20 includes regulation section 21 and two linkage sections 22 located at regulation section 21 both ends, each company Connect in section 22 one earmuff 10 of connection, the regulation section 21 is used for the length for adjusting the head hoop 20, its structure with it is existing Indifference.
Wherein, the linkage section 22 includes the first pivot joint block 221 and connecting rod 222, and the connecting rod 222 is in " C " shape, institute The one end for stating connecting rod 222 is connected with the end of the regulation section 21, and the other end of the connecting rod 222 is installed with the second pivot joint Block 2221, first pivot joint block 221 are fixedly arranged on the end of the regulation section 21, and the connecting rod 222 is located at corresponding institute The periphery of housing 11 is stated, and the housing 11 is articulated between first pivot joint block 221 and second pivot joint block 2221, with Rotate the earmuff 10.
To sum up, the headphone among the present embodiment, by setting the sound absorption cotton 13 in the cavity 113, increase The big acoustical absorptivity of the cavity 113, and the shape and size for extracting the free space of the cavity 113 are used as the suction The formal parameter of sound cotton 13, so that all clear areas of the cavity 113 can be filled up by the sound absorption cotton 13 so that institute State sound absorption cotton 13 can Omnibearing absorbing noise, prevent noise to be transmitted to the ear of wearer, passive excellent noise reduction effect.In addition, The sound pick-up 14 is installed by the rubber blanket 141, avoids being rigidly connected, reduces the vibration transmission between parts, and By setting the ear pad 12 on the housing 11, so that the ear pad 12 can be in close contact with the auricle of wearer, simultaneously The thickness and material of housing 11 described in Rational choice, and the structure of earmuff 10 described in reasonable Arrangement, so that the earmuff 10 is full It is compact-sized in the case that lumping weight amount, shaping and use etc. requires, and reach best defening effect, further increase by Dynamic noise reduction, the headphone can reach isolates to 36dB noise, meets requirement enough.
Embodiment described above only expresses the several embodiments of the present invention, and its description is more specific and detailed, but simultaneously Therefore the limitation to the scope of the claims of the present invention can not be interpreted as.It should be pointed out that for one of ordinary skill in the art For, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the guarantor of the present invention Protect scope.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.

Claims (10)

1. a kind of headphone, including head hoop and two earmuffs, two earmuffs connect through the head hoop, its feature exists In the earmuff includes housing, ear pad, sound absorption cotton and sound pick-up, and the ear pad is on an outer surface of the housing, institute Sound absorption cotton is stated in the cavity of the housing, and the clear area of the cavity is by the sound absorption cotton filling, the pickup One layer of rubber blanket is coated with the lateral wall of device, the sound pick-up is fixedly arranged on the housing by the rubber blanket.
2. headphone according to claim 1, it is characterised in that the thickness of the housing be located at 3mm to 4mm it Between, the housing is made by PC materials.
3. headphone according to claim 1, it is characterised in that the earmuff also includes a circuit board, the shell Body includes interior side body and outside housing, and the interior side body and the outside housing are fastened and connected, to form the cavity, institute State circuit board to be connected between the interior side body and the sound absorption cotton, the sound pick-up is fixedly arranged on the appearance of the outside housing On face, the sound pick-up is electrically connected with the circuit board.
4. headphone according to claim 3, it is characterised in that the earmuff also includes a loudspeaker, described to raise Sound device is fixedly arranged on the inner surface of the outside housing, and the loudspeaker is electrically connected with the circuit board.
5. headphone according to claim 4, it is characterised in that the circuit board is provided with the first sender, institute State sound absorption cotton and be provided with the second sender, first sender and second sender are positioned opposite, and the loudspeaker is received Hold in two sender.
6. headphone according to claim 5, it is characterised in that the interior side body is in tabular, and its middle part is set There is a through hole, the through hole is connected with second sender, and the ear pad is located on the outer surface of the interior side body, And the periphery of the through hole is surrounded on, the ear pad is made by memory foam material.
7. headphone according to claim 1, it is characterised in that the sound pick-up is arranged diagonally downward, and is tilted Angle is located at 30 ° to 60 °, and the acoustic absorptivity of the sound absorption cotton is 0.99.
8. headphone according to claim 3, it is characterised in that the circuit board and the sound absorption cotton pass through screw thread Attachment structure is fixedly arranged on the outside housing, and the screw connection structure includes some screws and is fixedly arranged on the outside housing Inner surface and some projections containing screwed hole, each screw sequentially pass through the circuit board and the sound absorption cotton, And spinning is on the screwed hole of a projection.
9. headphone according to claim 3, it is characterised in that the outside housing fastens with the interior side body The position of connection is provided with a rubber ring.
10. headphone according to claim 1, it is characterised in that the head hoop includes regulation section and located at described Adjust two linkage sections at section both ends, the linkage section includes the first pivot joint block and connecting rod, and the connecting rod is in " C " shape, institute The one end for stating connecting rod is connected with the end of the regulation section, and the other end of the connecting rod is installed with the second pivot joint block, described First pivot joint block is fixedly arranged on the end of the regulation section, and the connecting rod is located at the periphery of the housing, and the housing pivot It is connected between first pivot joint block and second pivot joint block.
CN201711051270.5A 2017-10-31 2017-10-31 Head earphone Pending CN107750026A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201711051270.5A CN107750026A (en) 2017-10-31 2017-10-31 Head earphone

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201711051270.5A CN107750026A (en) 2017-10-31 2017-10-31 Head earphone

Publications (1)

Publication Number Publication Date
CN107750026A true CN107750026A (en) 2018-03-02

Family

ID=61252854

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201711051270.5A Pending CN107750026A (en) 2017-10-31 2017-10-31 Head earphone

Country Status (1)

Country Link
CN (1) CN107750026A (en)

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109089184A (en) * 2018-03-28 2018-12-25 广州市神火科技有限公司 A kind of wear-type pickup noise reduction communication earphone
CN109257679A (en) * 2018-11-30 2019-01-22 歌尔科技有限公司 A kind of headphone
CN111615031A (en) * 2020-05-30 2020-09-01 黄敬 Novel earphone of making an uproar falls in intelligence
CN113475096A (en) * 2021-05-18 2021-10-01 深圳市冠旭电子股份有限公司 Noise reduction ear pad, noise reduction earmuff and head-wearing noise reduction earphone
WO2022226792A1 (en) * 2021-04-27 2022-11-03 深圳市韶音科技有限公司 Acoustic input and output device
US12014715B2 (en) 2019-03-22 2024-06-18 Dyson Technology Limited Noise control
US12062355B2 (en) 2019-03-22 2024-08-13 Dyson Technology Limited Noise control

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201414207Y (en) * 2009-05-22 2010-02-24 张世民 Noise-reduction power amplifier earphone
CN101754066A (en) * 2008-12-19 2010-06-23 郑国书 Headset with function of loudspeaker box
CN201528411U (en) * 2009-06-24 2010-07-14 张旗璨 Structure of earshield type earphone
CN102487469A (en) * 2010-12-03 2012-06-06 深圳市冠旭电子有限公司 Ear shield and head-mounted noise reduction earphone
CN207652635U (en) * 2017-10-31 2018-07-24 江西联创电声有限公司 Head earphone

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101754066A (en) * 2008-12-19 2010-06-23 郑国书 Headset with function of loudspeaker box
CN201414207Y (en) * 2009-05-22 2010-02-24 张世民 Noise-reduction power amplifier earphone
CN201528411U (en) * 2009-06-24 2010-07-14 张旗璨 Structure of earshield type earphone
CN102487469A (en) * 2010-12-03 2012-06-06 深圳市冠旭电子有限公司 Ear shield and head-mounted noise reduction earphone
CN207652635U (en) * 2017-10-31 2018-07-24 江西联创电声有限公司 Head earphone

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109089184A (en) * 2018-03-28 2018-12-25 广州市神火科技有限公司 A kind of wear-type pickup noise reduction communication earphone
CN109257679A (en) * 2018-11-30 2019-01-22 歌尔科技有限公司 A kind of headphone
CN109257679B (en) * 2018-11-30 2024-05-10 歌尔科技有限公司 Headset
US12014715B2 (en) 2019-03-22 2024-06-18 Dyson Technology Limited Noise control
US12062355B2 (en) 2019-03-22 2024-08-13 Dyson Technology Limited Noise control
CN111615031A (en) * 2020-05-30 2020-09-01 黄敬 Novel earphone of making an uproar falls in intelligence
WO2022226792A1 (en) * 2021-04-27 2022-11-03 深圳市韶音科技有限公司 Acoustic input and output device
CN113475096A (en) * 2021-05-18 2021-10-01 深圳市冠旭电子股份有限公司 Noise reduction ear pad, noise reduction earmuff and head-wearing noise reduction earphone
CN113475096B (en) * 2021-05-18 2023-06-09 深圳市冠旭电子股份有限公司 Noise-reducing ear pad, noise-reducing ear cover and head-wearing noise-reducing earphone

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