CN107718425B - Metal insert injection molding method, metal insert injection molding product and electronic equipment - Google Patents
Metal insert injection molding method, metal insert injection molding product and electronic equipment Download PDFInfo
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- CN107718425B CN107718425B CN201710891016.XA CN201710891016A CN107718425B CN 107718425 B CN107718425 B CN 107718425B CN 201710891016 A CN201710891016 A CN 201710891016A CN 107718425 B CN107718425 B CN 107718425B
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- 229910052751 metal Inorganic materials 0.000 title claims abstract description 135
- 239000002184 metal Substances 0.000 title claims abstract description 135
- 238000001746 injection moulding Methods 0.000 title claims abstract description 42
- 239000004033 plastic Substances 0.000 claims abstract description 99
- 229920003023 plastic Polymers 0.000 claims abstract description 99
- 230000004888 barrier function Effects 0.000 claims abstract description 49
- 238000000034 method Methods 0.000 claims abstract description 32
- 239000000463 material Substances 0.000 claims abstract description 16
- 238000002347 injection Methods 0.000 claims description 32
- 239000007924 injection Substances 0.000 claims description 32
- 239000000853 adhesive Substances 0.000 claims description 5
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 238000003801 milling Methods 0.000 claims description 2
- 239000011230 binding agent Substances 0.000 claims 1
- 230000003628 erosive effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 10
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000007769 metal material Substances 0.000 description 3
- 239000000956 alloy Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910000861 Mg alloy Inorganic materials 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000000423 heterosexual effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000006223 plastic coating Substances 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14008—Inserting articles into the mould
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Signal Processing (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
技术领域technical field
本申请涉及电子技术领域,具体涉及一种金属嵌件注塑成型的方法、金属嵌件注塑品及电子设备。The present application relates to the field of electronic technology, and in particular to a metal insert injection molding method, a metal insert injection molded product, and electronic equipment.
背景技术Background technique
金属嵌件注塑工艺主要是将金属嵌件作为注塑嵌件预先放置在模具中,然后在模具中注入塑胶并固化冷却,从而使得金属嵌件与塑胶形成一个整体,得到金属嵌件注塑品。金属嵌件注塑品被广泛使用,例如在电子手持设备壳体的制作中也会应用到金属嵌件注塑工艺,可以节约金属资源,也能够提高塑料件的强度。The metal insert injection molding process is mainly to place the metal insert as an injection insert in the mold in advance, and then inject plastic into the mold and solidify and cool, so that the metal insert and the plastic form a whole, and the metal insert injection product is obtained. Metal insert injection molding products are widely used. For example, the metal insert injection molding process is also used in the production of electronic handheld device housings, which can save metal resources and improve the strength of plastic parts.
现有技术中,金属嵌件上常设置有螺纹孔,螺纹孔的孔壁相较于其他部位较薄,在将金属嵌件放入塑胶模具中注塑时,螺纹孔的孔壁容易在注塑压力的冲击下产生变形,使得后续制程中螺丝无法打入螺纹孔中,导致产品良率低。In the prior art, the metal inserts are often provided with threaded holes, and the hole walls of the threaded holes are thinner than other parts. Deformation occurs under the impact, so that the screw cannot be driven into the threaded hole in the subsequent process, resulting in low product yield.
发明内容SUMMARY OF THE INVENTION
本申请实施例提供一种金属嵌件注塑成型的方法、金属嵌件注塑品及电子设备,能够降低金属嵌件中的螺纹孔变形的几率,有利于提高产品良率。Embodiments of the present application provide a metal insert injection molding method, a metal insert injection product, and an electronic device, which can reduce the probability of deformation of threaded holes in the metal insert, and help improve product yield.
本申请实施例提供一种金属嵌件注塑成型的方法,包括:Embodiments of the present application provide a method for injection molding of metal inserts, including:
提供金属嵌件,所述金属嵌件上设置有螺纹孔;providing a metal insert, the metal insert is provided with a threaded hole;
提供塑胶模具,并将所述金属嵌件放入所述塑胶模具中,其中在所述螺纹孔的至少部分外壁上覆盖有阻挡层;providing a plastic mold, and placing the metal insert into the plastic mold, wherein at least part of the outer wall of the threaded hole is covered with a barrier layer;
将塑胶材料注入所述塑胶模具中,以形成和所述金属嵌件结合的塑料件;injecting plastic material into the plastic mold to form a plastic part combined with the metal insert;
除去所述阻挡层,使得所述螺纹孔的至少部分外壁和所述塑料件之间形成缺口。The barrier layer is removed so that a gap is formed between at least part of the outer wall of the threaded hole and the plastic part.
本申请实施例还提供一种金属嵌件注塑品,所述金属嵌件注塑品采用上述所述的金属嵌件注塑成型的方法制成。The embodiment of the present application further provides a metal insert injection molded product, and the metal insert injection molded product is manufactured by the above-mentioned metal insert injection molding method.
本申请实施例还提供一种金属嵌件注塑品,包括金属嵌件和塑料件,所述金属嵌件和所述塑料件通过注塑的方式固定连接,所述金属嵌件上设置有螺纹孔,所述螺纹孔的至少部分外壁和所述塑料件之间形成有一缺口。The embodiment of the present application further provides a metal insert injection molding product, including a metal insert and a plastic part, the metal insert and the plastic part are fixedly connected by means of injection molding, and the metal insert is provided with a threaded hole, A gap is formed between at least part of the outer wall of the threaded hole and the plastic part.
本申请实施例还提供一种电子设备,包括壳体,所述壳体包括如上述所述的金属嵌件注塑品。An embodiment of the present application further provides an electronic device, including a casing, and the casing includes the metal insert injection molded product described above.
本申请的金属嵌件注塑成型的方法中,通过在螺纹孔的外壁上覆盖阻挡层,从而在将塑胶材料注入塑胶模具的过程中,利用阻挡层可以降低注塑过程的注塑压力对螺纹孔孔壁的冲击作用,进而可以减小螺纹孔产生变形的几率,提高产品良率。In the metal insert injection molding method of the present application, by covering the outer wall of the threaded hole with a barrier layer, in the process of injecting the plastic material into the plastic mold, the barrier layer can reduce the injection pressure during the injection molding process. The impact effect of the threaded hole can reduce the probability of deformation of the threaded hole and improve the product yield.
附图说明Description of drawings
为了更清楚地说明本申请实施例中的技术方案,下面将对实施例描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本申请的一些实施例,对于本领域技术人员来讲,在不付出创造性劳动的前提下,还可以根据这些附图获得其他的附图。In order to illustrate the technical solutions in the embodiments of the present application more clearly, the following briefly introduces the drawings that are used in the description of the embodiments. Obviously, the drawings in the following description are only some embodiments of the present application. For those skilled in the art, other drawings can also be obtained from these drawings without creative effort.
图1是本申请实施例提供的电子设备的结构示意图。FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application.
图2是本申请实施例提供的电子设备的另一结构示意图。FIG. 2 is another schematic structural diagram of an electronic device provided by an embodiment of the present application.
图3是本申请实施例提供的金属嵌件的结构示意图。FIG. 3 is a schematic structural diagram of a metal insert provided in an embodiment of the present application.
图4是本申请实施例提供的金属嵌件注塑成型的方法的流程示意图。FIG. 4 is a schematic flowchart of a method for injection molding a metal insert provided by an embodiment of the present application.
图5是本申请实施例提供的金属嵌件注塑成型的方法的制程示意图。FIG. 5 is a schematic diagram of a process of a method for injection molding a metal insert provided by an embodiment of the present application.
图6是本申请实施例提供的金属嵌件注塑成型的方法的另一制程示意图。FIG. 6 is a schematic diagram of another process of the method for injection molding a metal insert provided by an embodiment of the present application.
具体实施方式Detailed ways
下面将结合本申请实施例中的附图,对本申请实施例中的技术方案进行清楚、完整地描述。显然,所描述的实施例仅仅是本申请一部分实施例,而不是全部的实施例。基于本申请中的实施例,本领域技术人员在没有作出创造性劳动前提下所获得的所有其他实施例,都属于本申请保护的范围。The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, but not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work fall within the protection scope of the present application.
在本申请的描述中,需要理解的是,术语“中心”、“纵向”、“横向”、“长度”、“宽度”、“厚度”、“上”、“下”、“前”、“后”、“左”、“右”、“竖直”、“水平”、“顶”、“底”、“内”、“外”、“顺时针”、“逆时针”等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本申请和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本申请的限制。此外,术语“第一”、“第二”仅用于描述目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量。由此,限定有“第一”、“第二”的特征可以明示或者隐含地包括一个或者更多个所述特征。在本申请的描述中,“多个”的含义是两个或两个以上,除非另有明确具体的限定。In the description of this application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc., or The positional relationship is based on the orientation or positional relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as a limitation on this application. In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, features defined as "first", "second" may expressly or implicitly include one or more of said features. In the description of the present application, "plurality" means two or more, unless otherwise expressly and specifically defined.
在本申请的描述中,需要说明的是,除非另有明确的规定和限定,术语“安装”、“相连”、“连接”应做广义理解,例如,可以是固定连接,也可以是可拆卸连接,或一体地连接;可以是机械连接,也可以是电连接或可以相互通讯;可以是直接相连,也可以通过中间媒介间接相连,可以是两个元件内部的连通或两个元件的相互作用关系。对于本领域的普通技术人员而言,可以根据具体情况理解上述术语在本申请中的具体含义。In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installed", "connected" and "connected" should be understood in a broad sense, for example, it may be a fixed connection or a detachable connection Connection, or integral connection; it can be mechanical connection, electrical connection or can communicate with each other; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal communication of two elements or the interaction of two elements relation. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific situations.
在本申请中,除非另有明确的规定和限定,第一特征在第二特征之“上”或之“下”可以包括第一和第二特征直接接触,也可以包括第一和第二特征不是直接接触而是通过它们之间的另外的特征接触。而且,第一特征在第二特征“之上”、“上方”和“上面”包括第一特征在第二特征正上方和斜上方,或仅仅表示第一特征水平高度高于第二特征。第一特征在第二特征“之下”、“下方”和“下面”包括第一特征在第二特征正下方和斜下方,或仅仅表示第一特征水平高度小于第二特征。In this application, unless otherwise expressly specified and defined, a first feature "on" or "under" a second feature may include direct contact between the first and second features, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.
下文的公开提供了许多不同的实施方式或例子用来实现本申请的不同结构。为了简化本申请的公开,下文中对特定例子的部件和设置进行描述。当然,它们仅仅为示例,并且目的不在于限制本申请。此外,本申请可以在不同例子中重复参考数字和/或参考字母,这种重复是为了简化和清楚的目的,其本身不指示所讨论各种实施方式和/或设置之间的关系。此外,本申请提供了的各种特定的工艺和材料的例子,但是本领域普通技术人员可以意识到其他工艺的应用和/或其他材料的使用。The following disclosure provides many different embodiments or examples for implementing different structures of the present application. To simplify the disclosure of the present application, the components and arrangements of specific examples are described below. Of course, they are only examples and are not intended to limit the application. Furthermore, this application may repeat reference numerals and/or reference letters in different instances for the purpose of simplicity and clarity, and does not in itself indicate a relationship between the various embodiments and/or arrangements discussed. In addition, this application provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.
本申请实施例提供一种金属嵌件注塑成型的方法、金属嵌件注塑品及电子设备。Embodiments of the present application provide a metal insert injection molding method, a metal insert injection product, and an electronic device.
其中,金属嵌件注塑品具体可以设置在手机、平板电脑、掌上电脑(PersonalDigital Assistant,PDA)等电子设备中,例如,可以应用于电子设备的壳体上,或者应用在电子设备的中框上,等等。Wherein, the metal insert injection molding product can be specifically set in electronic devices such as mobile phones, tablet computers, PDAs (Personal Digital Assistant, PDA), etc., for example, can be applied to the shell of the electronic device, or applied to the middle frame of the electronic device. ,and many more.
参阅图1,图1是本申请实施例提供的电子设备的结构示意图。如图所示,电子设备100包括壳体10、显示屏20、印制电路板30和电池40等。Referring to FIG. 1 , FIG. 1 is a schematic structural diagram of an electronic device provided by an embodiment of the present application. As shown, the electronic device 100 includes a housing 10, a display screen 20, a printed circuit board 30, a battery 40, and the like.
其中,壳体10可以包括盖板11、中框12和后盖13,盖板11、中框12和后盖13相互组合形成该壳体10,该壳体10具有通过盖板11、中框12和后盖13形成的密闭空间,以容纳显示屏20、印制电路板30、电池40等器件。在一些实施例中,盖板11盖设到中框12上,后盖13盖设到中框12上,盖板11和后盖13位于中框12的相对面,盖板11和后盖13相对设置,壳体10的密闭空间位于盖板11和后盖13之间。The casing 10 may include a cover plate 11 , a middle frame 12 and a rear cover 13 . The cover plate 11 , the middle frame 12 and the rear cover 13 are combined with each other to form the casing 10 . 12 and the back cover 13 to form a closed space to accommodate the display screen 20, the printed circuit board 30, the battery 40 and other devices. In some embodiments, the cover 11 is covered on the middle frame 12 , the rear cover 13 is covered on the middle frame 12 , the cover 11 and the rear cover 13 are located on the opposite sides of the middle frame 12 , the cover 11 and the rear cover 13 Relatively arranged, the closed space of the housing 10 is located between the cover plate 11 and the rear cover 13 .
本申请实施例中,壳体10例如可以为金属和塑胶相互配合的壳体结构,例如,印制电路板30等部件需要通过螺钉安装在壳体10的中框12上,因此,中框12可以是金属嵌件注塑品,即可以将设置有螺纹孔的金属壳体作为嵌件,在塑胶模具中注塑成型以形成金属和塑胶相互配合的中框结构,由此用于安装印制电路板30的螺钉可以通过与金属嵌件上的螺纹孔配合,进而将印制电路板30安装在中框12上。又如,壳体10的后盖13也可以根据实际需要采用金属和塑胶相互配合的后盖结构。其中,盖板11可以为透明玻璃盖板。在一些实施方式中,盖板11可以是用诸如蓝宝石等材料制成的玻璃盖板。In the embodiment of the present application, the casing 10 may be, for example, a casing structure in which metal and plastic cooperate with each other. For example, components such as the printed circuit board 30 need to be mounted on the middle frame 12 of the casing 10 by screws. Therefore, the middle frame 12 It can be a metal insert injection molding product, that is, a metal shell with threaded holes can be used as an insert, and it can be injection molded in a plastic mold to form a middle frame structure in which metal and plastic cooperate with each other, which is used to install printed circuit boards. The screws of the 30 can be matched with the threaded holes on the metal insert to install the printed circuit board 30 on the middle frame 12 . For another example, the back cover 13 of the housing 10 may also adopt a back cover structure in which metal and plastic cooperate with each other according to actual needs. The cover plate 11 may be a transparent glass cover plate. In some embodiments, the cover plate 11 may be a glass cover plate made of a material such as sapphire.
需要说明的是,本申请实施例壳体的结构并不限于此,比如:后盖和中框一体成型形成一中框结构。具体的,该壳体10包括盖板11和中框12,盖板11和中框12相互固定形成一密闭空间,用于收纳显示屏20、印制电路板30、电池40等器件。It should be noted that the structure of the housing in the embodiment of the present application is not limited to this. For example, the rear cover and the middle frame are integrally formed to form a middle frame structure. Specifically, the housing 10 includes a cover plate 11 and a middle frame 12, and the cover plate 11 and the middle frame 12 are fixed to each other to form a closed space for accommodating the display screen 20, the printed circuit board 30, the battery 40 and other devices.
其中,该印制电路板30安装在壳体10中,该印制电路板30可以为电子设备1的主板,印制电路板30上可以集成有马达、麦克风、摄像头、光线传感器、受话器以及处理器等功能组件。Wherein, the printed circuit board 30 is installed in the housing 10, the printed circuit board 30 can be the main board of the electronic device 1, and the printed circuit board 30 can be integrated with a motor, a microphone, a camera, a light sensor, a receiver and a processing unit. device and other functional components.
在一些实施例中,该印制电路板30固定在壳体10内。具体的,该印制电路板30可以通过螺钉螺接到中框12上,也可以采用卡扣的方式卡配到中框12上。需要说明的是,本申请实施例印制电路板30具体固定到中框12上的方式并不限于此,还可以其它方式,比如通过卡扣和螺钉共同固定的方式。In some embodiments, the printed circuit board 30 is fixed within the housing 10 . Specifically, the printed circuit board 30 can be screwed to the middle frame 12 by screws, or can be snap-fitted to the middle frame 12 by means of snaps. It should be noted that, the specific way of fixing the printed circuit board 30 to the middle frame 12 in the embodiment of the present application is not limited to this, and other ways, such as a way of co-fixing by a buckle and a screw, is also possible.
其中,该电池40安装在壳体10中,电池40与该印制电路板30进行电连接,以向电子设备100提供电源。壳体10可以作为电池40的电池盖。壳体10覆盖电池40以保护电池40,具体的是后盖覆盖电池40以保护电池40,减少电池40由于电子设备100的碰撞、跌落等而受到的损坏。The battery 40 is installed in the casing 10 , and the battery 40 is electrically connected to the printed circuit board 30 to provide power to the electronic device 100 . The case 10 may serve as a battery cover for the battery 40 . The casing 10 covers the battery 40 to protect the battery 40 , specifically, the back cover covers the battery 40 to protect the battery 40 and reduce damage to the battery 40 due to collision, drop, etc. of the electronic device 100 .
其中,该显示屏20安装在壳体10中,同时,该显示屏20电连接至印制电路板30上,以形成电子设备100的显示面。该显示屏20包括显示区域201和非显示区域202。该显示区域201可以用来显示电子设备100的画面或者供用户进行触摸操控等。该非显示区域202的顶部区域开设供声音、及光线传导的开孔,该非显示区域202底部上可以设置指纹模组、触控按键等功能组件。其中该盖板11安装到显示屏20上,以覆盖显示屏20,形成与显示屏20相同的显示区域和非显示区域,具体可以参阅显示屏20的显示区域和非显示区域。The display screen 20 is installed in the casing 10 , and at the same time, the display screen 20 is electrically connected to the printed circuit board 30 to form a display surface of the electronic device 100 . The display screen 20 includes a display area 201 and a non-display area 202 . The display area 201 may be used to display the screen of the electronic device 100 or for the user to perform touch manipulation or the like. The top area of the non-display area 202 is provided with openings for sound and light transmission. The bottom of the non-display area 202 can be provided with functional components such as fingerprint modules and touch buttons. The cover plate 11 is mounted on the display screen 20 to cover the display screen 20 to form the same display area and non-display area as the display screen 20 . For details, please refer to the display area and non-display area of the display screen 20 .
需要说明的是,该显示屏20的结构并不限于此。比如,该显示屏可以为全面屏或异性屏,具体的,请参阅图2,图2为本申请实施例提供的电子设备的另一结构示意图。图2中的电子设备与图1中的电子设备的区别在于:该非显示区域直接形成在显示屏20上,比如在显示屏20的非显示区域设置成透明结构,以便光信号穿过,或者直接在显示屏20的非显示区域开设供光线传导的开孔或缺口等结构,可以将前置摄像头、光电感应器等设置于非显示区域位置,以便前置摄像头拍照、光电感应器检测。It should be noted that the structure of the display screen 20 is not limited to this. For example, the display screen may be a full screen or a heterosexual screen. Specifically, please refer to FIG. 2 , which is another schematic structural diagram of the electronic device provided by the embodiment of the present application. The difference between the electronic device in FIG. 2 and the electronic device in FIG. 1 is that the non-display area is directly formed on the display screen 20, for example, the non-display area of the display screen 20 is set as a transparent structure, so that the light signal can pass through, or By directly opening structures such as openings or gaps for light transmission in the non-display area of the display screen 20, the front camera and photoelectric sensor can be arranged in the non-display area, so that the front camera can take pictures and detect by the photoelectric sensor.
参阅图3,图3是本申请实施例提供的金属嵌件注塑品的结构示意图。其中,金属嵌件注塑品例如可以是电子设备100的中框12,或者也可以是后盖13,对此不做限制。Referring to FIG. 3 , FIG. 3 is a schematic structural diagram of a metal insert injection molded product provided by an embodiment of the present application. Wherein, the metal insert injection product may be, for example, the middle frame 12 of the electronic device 100, or may also be the back cover 13, which is not limited thereto.
以金属嵌件注塑品为中框12为例,金属嵌件注塑品包括金属嵌件121和与金属嵌件121固定连接的塑料件122。其中金属嵌件121和塑料件122可以通过注塑的方式一体成型。金属嵌件121例如可以镁合金材料制成,或者也可以采用其他金属材料制成。其中,金属嵌件121上设置有螺纹孔1211。螺纹孔1211的至少部分外壁和塑料件122之间形成有一缺口1213,例如可以在螺纹孔1211的厚度小于阈值的孔壁所对应的外壁和塑料件122之间形成缺口1213,阈值可以根据实际需要进行设置,也即在较薄的螺纹孔壁对应的外壁和塑料件122之间形成缺口1213。其中,螺纹孔1211的数量可以根据实际需要进行设置,例如可以如图3所示为两个,也可以是三个或更多个,对此不做限制。Taking the metal insert injection product as the middle frame 12 as an example, the metal insert injection product includes a metal insert 121 and a plastic part 122 fixedly connected with the metal insert 121 . The metal insert 121 and the plastic part 122 can be integrally formed by injection molding. The metal insert 121 can be made of magnesium alloy material, for example, or can also be made of other metal materials. The metal insert 121 is provided with a threaded hole 1211 . A gap 1213 is formed between at least part of the outer wall of the threaded hole 1211 and the plastic part 122. For example, a gap 1213 can be formed between the outer wall corresponding to the hole wall of the threaded hole 1211 whose thickness is less than a threshold value and the plastic part 122. The threshold value can be based on actual needs For setting, that is, a gap 1213 is formed between the outer wall corresponding to the thinner threaded hole wall and the plastic part 122 . The number of threaded holes 1211 can be set according to actual needs, for example, there can be two as shown in FIG. 3 , or three or more, which is not limited.
本申请实施例中,通过在螺纹孔1211的较薄孔壁和塑料件122之间形成有缺口1213,即在该较薄孔壁对应的外壁上没有塑胶包覆,因此在注塑过程中不需要在螺纹孔1211的外壁周缘注入塑胶,由此可以避免注塑过程的注塑压力直接作用在螺纹孔1211的外壁上,从而可以降低螺纹孔变形的几率,有利提高产品良率。In the embodiment of the present application, a gap 1213 is formed between the thin hole wall of the threaded hole 1211 and the plastic part 122, that is, there is no plastic coating on the outer wall corresponding to the thin hole wall, so it is not required during the injection molding process. Plastic is injected into the periphery of the outer wall of the threaded hole 1211 , so that the injection pressure of the injection molding process can be prevented from directly acting on the outer wall of the threaded hole 1211 , thereby reducing the probability of deformation of the threaded hole and improving the product yield.
可选地,在金属嵌件121中与塑料件122连接的表面涂布有粘接剂1212,用以与塑料件122粘接。由此,通过在金属嵌件121上涂布粘接剂1212,可以提高金属嵌件121和塑料件122之间连接的可靠,使得两者之间的连接更牢固。Optionally, the surface of the metal insert 121 connected with the plastic part 122 is coated with an adhesive 1212 for bonding with the plastic part 122 . Therefore, by coating the adhesive 1212 on the metal insert 121, the reliability of the connection between the metal insert 121 and the plastic part 122 can be improved, so that the connection between the two is firmer.
参阅图4和图5,图4是本申请实施例提供的金属嵌件注塑成型的方法的流程示意图,图5是本申请实施例提供的金属嵌件注塑成型的方法的制程示意图。本申请实施例的金属嵌件注塑成型的方法用于形成如图3所示的金属嵌件注塑品,其中图5仅是示意性地示出金属嵌件的部分结构和塑料件的部分结构,并非是作为对本申请实施例金属嵌件和塑料件的结构上的限制。如图所示,包括以下步骤:Referring to FIGS. 4 and 5 , FIG. 4 is a schematic flowchart of a method for injection molding a metal insert provided by an embodiment of the present application, and FIG. 5 is a schematic diagram of a manufacturing process of the method for injection molding a metal insert provided by an embodiment of the present application. The metal insert injection molding method of the embodiment of the present application is used to form a metal insert injection molding product as shown in FIG. 3 , wherein FIG. 5 only schematically shows part of the structure of the metal insert and part of the structure of the plastic part, It is not intended as a structural limitation on the metal inserts and plastic parts of the embodiments of the present application. As shown in the figure, it includes the following steps:
在步骤401中,提供金属嵌件121,金属嵌件121上设置有螺纹孔1211。金属嵌件121例如可以是铝美合金材料制成,或者是其他金属材料制成。In step 401, a metal insert 121 is provided, and the metal insert 121 is provided with a threaded hole 1211. The metal insert 121 can be, for example, made of aluminum alloy material, or made of other metal materials.
在步骤402中,提供塑胶模具B,并将金属嵌件121放入塑胶模具B中,其中在螺纹孔的至少部分外壁上覆盖有阻挡层A。In step 402, a plastic mold B is provided, and the metal insert 121 is put into the plastic mold B, wherein at least part of the outer wall of the threaded hole is covered with the barrier layer A.
比如,可以在金属嵌件121上设置阻挡层A,具体地,提供金属嵌件具体包括:在金属嵌件121的螺纹孔1211的至少部分外壁上设置阻挡层A,以使得阻挡层A覆盖螺纹孔1211的至少部分外壁。其中,阻挡层A可以采用塑胶材料或者金属材料制成,可以是与金属嵌件一体成型,也可以是单独形成。在一种可能的实现方式中,阻挡层A与金属嵌件121一体成型,具体地,在金属嵌件121的螺纹孔的至少部分外壁上设置阻挡层A,可以包括:通过注塑的方式形成一体成型的金属嵌件121和阻挡层A。即在实施例中,阻挡层A为金属嵌件121的螺纹孔1211的外壁向外延伸形成。For example, the barrier layer A may be provided on the metal insert 121. Specifically, providing the metal insert specifically includes: disposing the barrier layer A on at least part of the outer wall of the threaded hole 1211 of the metal insert 121, so that the barrier layer A covers the thread At least part of the outer wall of the hole 1211 . Wherein, the barrier layer A can be made of plastic material or metal material, can be integrally formed with the metal insert, or can be formed separately. In a possible implementation manner, the barrier layer A is integrally formed with the metal insert 121. Specifically, disposing the barrier layer A on at least part of the outer wall of the threaded hole of the metal insert 121 may include: forming an integral body by means of injection molding Formed metal insert 121 and barrier layer A. That is, in the embodiment, the barrier layer A is formed by extending outward from the outer wall of the screw hole 1211 of the metal insert 121 .
在其他实施例中,阻挡层也可以是单独形成,例如可以根据螺纹孔外壁的形状和大小设置阻挡层,使得阻挡层与螺纹孔外壁相吻合。其中,可以通过粘接的方式将阻挡层固定在螺纹孔的至少部分外壁上。In other embodiments, the barrier layer may also be formed separately, for example, the barrier layer may be provided according to the shape and size of the outer wall of the threaded hole, so that the barrier layer conforms to the outer wall of the threaded hole. Wherein, the barrier layer can be fixed on at least part of the outer wall of the threaded hole by means of bonding.
其中,螺纹孔的外壁可以是围绕螺纹孔周围所有的外壁,也可以围绕螺纹孔周围的一部分外壁,可以根据螺纹孔不同部位的孔壁的厚度进行选择,例如较厚的孔壁其硬度较大,不易变形,能够承受住注塑压力,因此可以不设置阻挡层,而较薄的孔壁硬度较小,容易产生变形,因此可以在较薄的螺纹孔壁对应的外壁上设置阻挡层,具体地,可以在厚度小于阈值的螺纹孔壁对应的外壁上覆盖阻挡层,该阈值可以根据实际需要进行设置。Among them, the outer wall of the threaded hole can be all the outer wall around the threaded hole, or can surround a part of the outer wall around the threaded hole, which can be selected according to the thickness of the hole wall in different parts of the threaded hole, for example, a thicker hole wall has a higher hardness , it is not easy to deform and can withstand the injection pressure, so it is not necessary to set a barrier layer, and the thinner hole wall has less hardness and is prone to deformation, so a barrier layer can be set on the outer wall corresponding to the thinner threaded hole wall, specifically , a barrier layer can be covered on the outer wall corresponding to the threaded hole wall with a thickness smaller than a threshold value, and the threshold value can be set according to actual needs.
在步骤403中,将塑胶材料注入塑胶模具B中,以形成和金属嵌件121结合的塑料件122。In step 403 , the plastic material is injected into the plastic mold B to form the plastic part 122 combined with the metal insert 121 .
将塑胶材料注入塑胶模具B中,然后通过固化工艺固化塑胶材料,从而形成塑料件122,并使得该塑料件与金属嵌件结合在一起,从而得到金属嵌件注塑品。The plastic material is injected into the plastic mold B, and then the plastic material is cured through a curing process to form the plastic part 122 , and the plastic part and the metal insert are combined together to obtain a metal insert injection molded product.
在一种可能的实施方式中,在步骤403之前,还可以包括:在螺纹孔中插入适配的螺栓。通过在螺纹孔中插入与螺纹孔相适配的螺栓,从而利用螺栓塞满螺纹孔,由此可以进一步降低注塑过程中螺纹孔发生变形的几率。其中,在将塑胶材料注入塑胶模具B之后,还包括:将螺栓从螺纹孔中拔出。In a possible implementation manner, before step 403, the method may further include: inserting a suitable bolt into the threaded hole. By inserting bolts matching the threaded holes into the threaded holes, the threaded holes are filled with bolts, thereby further reducing the probability of deformation of the threaded holes during the injection molding process. Wherein, after the plastic material is injected into the plastic mold B, the method further includes: pulling out the bolt from the threaded hole.
在步骤404中,除去阻挡层A,使得螺纹孔1211的至少部分外壁和塑料件122之间形成缺口1213。In step 404 , the barrier layer A is removed, so that a gap 1213 is formed between at least part of the outer wall of the threaded hole 1211 and the plastic part 122 .
例如,可以通过铣削或蚀刻方式将阻挡层除去,从而使得螺纹孔1211的外壁和塑料件122之间形成缺口1213。其中,可以将塑胶模具B与金属嵌件121和塑料件脱离后再除去阻挡层A,也可以除去阻挡层A之后再将塑胶模具B脱离金属嵌件121和塑料件122。For example, the blocking layer can be removed by milling or etching, so that a gap 1213 is formed between the outer wall of the threaded hole 1211 and the plastic part 122 . The barrier layer A may be removed after the plastic mold B is separated from the metal insert 121 and the plastic component, or the plastic mold B may be separated from the metal insert 121 and the plastic component 122 after the barrier layer A is removed.
通过本申请实施例,在金属嵌件注塑成型过程中,通过在螺纹孔外壁上设置阻挡层,通过该阻挡层的作用可以减小注塑过程的注塑压力对螺纹孔孔壁的冲击作用,从而能够降低金属嵌件上的螺纹孔变形的几率,提高产品良率。According to the embodiment of the present application, during the injection molding process of the metal insert, a barrier layer is provided on the outer wall of the threaded hole, and the impact of the injection pressure in the injection molding process on the hole wall of the threaded hole can be reduced through the action of the barrier layer, thereby enabling Reduces the chance of deformation of threaded holes on metal inserts and increases product yield.
在一些可能的实施例中,在将塑胶材料注入塑胶模具中之前,还可以包括以下步骤:在金属嵌件的与塑料件连接的表面涂布粘接剂,用以与塑料件进行粘接。由此,通过对金属嵌件的表面进行涂布粘接剂,可以提高塑料件和金属嵌件之间连接的可靠性。In some possible embodiments, before the plastic material is injected into the plastic mold, the following step may be further included: coating an adhesive on the surface of the metal insert connected to the plastic part, so as to bond with the plastic part. Therefore, by coating the surface of the metal insert with an adhesive, the reliability of the connection between the plastic part and the metal insert can be improved.
参阅图6,图6是本申请另一实施例提供的金属嵌件注塑成型的方法的制程示意图。本申请实施例的金属嵌件注塑成型的方法用于形成如图3所示的金属嵌件注塑品,其中图6中仅是示意性地示出金属嵌件的部分结构和塑料件的部分结构,并非是作为对本申请实施例金属嵌件和塑料件的结构上的限制。与图5所示的实施例主要不同在于,本实施例的阻挡层A设置在塑胶模块B上。具体地,如图所示,首先提供金属嵌件121,金属嵌件121上设置有螺纹孔1211。然后,提供塑胶模具B,并将金属嵌件121放入塑胶模块B中,其中,在提供塑胶模具B的步骤中,具体包括:在塑胶模具B中设置阻挡层A,以使得在将金属嵌件121放入塑胶模块B内时,阻挡层A覆盖螺纹孔1211的至少部分外壁。Referring to FIG. 6 , FIG. 6 is a schematic diagram of a manufacturing process of a method for injection molding a metal insert provided by another embodiment of the present application. The metal insert injection molding method of the embodiment of the present application is used to form a metal insert injection product as shown in FIG. 3 , wherein FIG. 6 only schematically shows part of the structure of the metal insert and part of the structure of the plastic part , not as a structural limitation on the metal inserts and plastic parts of the embodiments of the present application. The main difference from the embodiment shown in FIG. 5 is that the barrier layer A of this embodiment is disposed on the plastic module B. As shown in FIG. Specifically, as shown in the figure, a metal insert 121 is provided first, and a threaded hole 1211 is provided on the metal insert 121 . Then, a plastic mold B is provided, and the metal insert 121 is put into the plastic module B, wherein, in the step of providing the plastic mold B, the step of providing the plastic mold B specifically includes: disposing a barrier layer A in the plastic mold B, so that the metal insert 121 is inserted into the plastic mold B. When the component 121 is put into the plastic module B, the barrier layer A covers at least part of the outer wall of the screw hole 1211 .
在一些实施例中,阻挡层A可以是与塑胶模具B一体成型,或者也可以是单独形成,对此不作限定。将金属嵌件121放入塑胶模具B中后,将塑胶材料注入塑胶模具B中,以形成和金属嵌件121结合的塑料件122。之后除去塑胶模具B,阻挡层A也与金属嵌件121脱离,从而使得金属嵌件121的螺纹孔1211的外壁和塑料件122之间形成缺口1213。In some embodiments, the barrier layer A may be integrally formed with the plastic mold B, or may be formed separately, which is not limited. After the metal insert 121 is put into the plastic mold B, the plastic material is injected into the plastic mold B to form the plastic part 122 combined with the metal insert 121 . Then, the plastic mold B is removed, and the barrier layer A is also detached from the metal insert 121 , so that a gap 1213 is formed between the outer wall of the threaded hole 1211 of the metal insert 121 and the plastic part 122 .
通过本实施例,利用阻挡层可以降低注塑过程的注塑压力对螺纹孔孔壁造成的冲击作用,从而减小螺纹孔变形的几率。Through this embodiment, the use of the barrier layer can reduce the impact of the injection pressure in the injection molding process on the wall of the threaded hole, thereby reducing the probability of deformation of the threaded hole.
以上对本申请实施例所提供的一种金属嵌件注塑成型的方法、金属嵌件注塑品及电子设备进行了详细介绍,本文中应用了具体个例对本申请的原理及实施方式进行了阐述,以上实施例的说明只是用于帮助理解本申请的方法及其核心思想;同时,对于本领域的技术人员,依据本申请的思想,在具体实施方式及应用范围上均会有改变之处,综上所述,本说明书内容不应理解为对本申请的限制。A metal insert injection molding method, metal insert injection products and electronic equipment provided by the embodiments of the present application have been described in detail above. The principles and implementations of the present application are described with specific examples in this paper. The description of the embodiment is only used to help understand the method of the present application and its core idea; meanwhile, for those skilled in the art, according to the idea of the present application, there will be changes in the specific embodiments and application scope. As stated, the contents of this specification should not be construed as limiting the application.
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CN201736398U (en) * | 2010-08-05 | 2011-02-09 | 广东欧珀移动通信有限公司 | A metal insert for in-mold injection molding |
CN103302804A (en) * | 2013-06-28 | 2013-09-18 | 慈溪市三佩机械有限公司 | Injection molding method of five-core sensor shell |
JP6184993B2 (en) * | 2014-05-02 | 2017-08-23 | 東芝機械株式会社 | Molded product manufacturing apparatus, molded product manufacturing method, and molded product |
CN104842504A (en) * | 2015-05-12 | 2015-08-19 | 苏州万隆汽车零部件股份有限公司 | Insert injection molding process of automobile running board |
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